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Service Manual
Internal Use Only
Service Manual
KM380
Model : KM380
Date: May, 2008 / Issue 1.0
Page 2
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KM380
Series.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
C.G.KANG Mar. 5 2007 0.1 - V08d
C.G.KANG Apr. 10 2007 0.2 - V10a
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 4
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. PERFORMANCE .............................11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................19
3.1 KM380 series Component
Block diagram... ........................................19
3.2 Baseband Processor (BBP)
Introduction ............................................20
3.3 Power management IC ..........................30
3.4 Power ON/OFF ......................................34
3.5 SIM interface..........................................35
3.6 Micro SD external memory Interface .....36
3.7 Memory ..................................................37
3.8 LCD Display ...........................................38
3.9 Keypad Switching & Scanning ...............40
3.10 Keypad back-light illumination .............41
3.11 LCD back light illumination...................42
3.12 ISP(Image Signal Processor)...............43
3.13 Battery current consumption monitor ...44
3.14 JTAG & ETM interface connector ........45
3.15 Audio....................................................46
3.16 Charging circuit ....................................49
3.17 BLUETOOTH .......................................50
3.18 FM Radio .............................................52
3.19 18pin Multi Media Interface
connector .............................................53
4. RF circuit technical brief ...............55
4.1 General Description ...............................55
4.2 Receiver part..........................................57
4.3 Transmitter part......................................58
4.4 RF synthesizer .......................................59
4.5 DCXO.....................................................60
4.6 Front End Module control.......................60
4.7 Power Amplifier Module .........................61
5. PCB layout......................................62
5.1 Main PCB component placement ..........62
6. Trouble shooting............................64
6.1 Trouble shooting test setup....................64
6.2 Power on Trouble...................................65
6.3 Charging trouble ....................................68
6.4 LCD display trouble................................70
6.5 Camera Trouble .....................................72
6.6 Receiver & Speaker trouble ...................74
6.7 Microphone trouble ................................76
6.8 Ear-MIc Jack Detection trouble..............77
6.9 Vibrator trouble ......................................78
6.10 Keypad back light trouble.....................79
6.11 SIM & uSD trouble ...............................80
6.12 RF Troubleshooting .............................83
6.13 RF Receiver path Troubleshooting ......85
6.14 RF Transmitter path Troubleshooting ..90
6.15 PAM Circuit ..........................................92
7. Download & S/W upgrade.................95
7.1 Download program user guide...............95
7.2 Multi-Download Program Setting ...........96
8. CIRCUIT DIAGRAM ........................99
9. BGM PIN MAP...............................105
10. PCB LAYOUT ..............................111
11. RF Calibration.............................113
11.1 Test Equipment Setup .......................113
11.2 Calibration Step .................................113
12. Stand-alone Test ........................119
12.1 Test Program Setting .........................119
12.2 Tx Test ...............................................121
12.3 Rx Test...............................................122
13. ENGINEERING MODE ................123
14. EXPLODED VIEW &
REPLACEMENT PART LIST ......125
14.1 Exploded View ...................................125
14.2 Replacement Parts ............................127
14.3 Accessory ..........................................147
Table Of Contents
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KM380 Series.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KM380 Series or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KM380 Series must be performed only at the LGE or its authorized
agents. The user may not make any changes and/or repairs expect asspecifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 7
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1. INTRODUCTION
E. Notice of Radiated Emissions
The KM380 Series complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KM380 Series may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 8
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1. INTRODUCTION
1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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1. INTRODUCTION
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LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
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2. GENERAL PERFORMANCE
2.1 H/W Feature
2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion, 800mAh
AVG TCVR Current tbd @PL5
Standby Current tbd @PP9
Talk time tbd
Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM: -105dBm↓, DCS/PCS: -105dBm↓
TX output power EGSM : 32.5dBm (@PL 5)
DCS/PCS: 30/30dBm (@PL 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display Main 240 x 320 pixels, 2” ± QVGA, 265K color,
Status Indicator Navi, Send, Call End, Back and etc. Key are
implemented by touchpad.
CLEAR, SEND, END/PWR, MP3, AF/Camera double
action, Volume Up, Volume Down, Lock
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack (Call/Music)
3.5pi Stereo Jack. (Music Only)
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
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2. GENERAL PERFORMANCE
2.2 Technical specification
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
1Frequency Band
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
EGSM
8Bit Error Ratio
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. GENERAL PERFORMANCE
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby
20 Power consumption
- Normal 3 mA(@PP9)
21 Talk Time
EGSM/Lvl 7 (Battery Capacity 800mA):180 min
EGSM/Lvl12(Battery Capacity 800 mA):320min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
22 Standby Time
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current
Fast Charge : < 400 mA
Slow Charge: < 120 mA
Antenna Bar Number Power
7>-92 dBm ~
5 -97dBm ~ -93dBm
25 Antenna Display
4 -100dBm ~ -98dBm
2 -103dBm ~ -101dBm
1 -105dBm ~ -104dBm
0< -106 dBm
Off No Service
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2. GENERAL PERFORMANCE
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Item Description Specification
Battery Bar Number Voltage( 0.05V)
3 3.69V ~ 4.2V
26 Battery Indicator 2 3.53V ~ 3.69V
1 3.43V ~ 3.53V
0 3.30V ~ 3.43V
27 Low Voltage Warning
3.53V↓ 0.05V (Call)
3.43V↓ 0.05V (Standby)
28 Forced shut down Voltage 3.3 0.05 V
Li-ion Battery or Li-Polymer Battery
29 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 4.8, 0.9A
Page 16
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2. GENERAL PERFORMANCE
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* EDGE RF Specification (Option: is not serviced for “EDGE mode”)
Item Description Specification
1 RMS EVM 9%
2 Peak EVM 30%
395thPercentile EVM 15%
4Origin Offset Suppression ≥ 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5 Power Level 12 19dBm 3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm 3dB 8 14 dBm 3dB
1 26/25dBm 3dB 9 12 dBm 4dB
2 26/25dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE
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Item Description Specification
6 Output RF Spectrum DCS1800, PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
Page 18
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
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3.1 KM380 series Component Block diagram
3. TECHNICAL BRIEF
Figure 1. KM380 series Functional Block Diagram
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3. TECHNICAL BRIEF
3.2 Baseband Processor (BBP) Introduction
3.2.1 General Description
extensions such as camera, software MIDI, MP3 sound. It is designed as a single chip solution,
integrating the digital and mixed signal portions of the base band in 0.13um, 1.5V technology.
operation modes CSD/GPRS/EGPRS (up to class 12) without additional external hardware.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Æ
A
A
S-GOLDradi o
Baseband
DAC
DAC
AD
USB FS
FCDP
Keyp ad
GPIO
USI
IrDA
MMC/SD
I
I≤S /
and
and
SRAM
DMAC
ARMÆ 926
USIM
Speec h
Deco din
Speech
Encod in
MOVE
I≤
GS
Cipher
TEAKLit
ICU
USARTs
Equal ize
Tim er
SCCU
GEA-1/2/3
CAPCOM
GPT
Camera
IR-Memor y
DigR
GS
RTC
Multimed ia I C
RF
Contr o
EBU
CGU
AUX
AD
I≤C
JTAG
Disp lay
I
I
R
Sigm a-Delta
MASH
Modula to
L
DA
PL
LD
I/
LD
ANA
LD
D
LPF
D
AD
PA/ FE
Contro
GP
LD
SI
LD
USB
LD
VI
LD
AUX
LD
RTC
LD
RF
LD
RF
LD
RF1
LD
FIR
DC
DigR
GMSK
8PSK
Offs et
Comp
FIR
-
+
3-wir e
Ctrl
C
Power
Hands-
free
Am p
Powe
Contro
Ramp
Gen
DCXO
LED
PWMís
Char ger
LDO
S
(BL
SD1
(1.5V)
SD2
(1.8V)
Page 20
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3. TECHNICAL BRIEF
3.2.2 Block Description
• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
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Page 21
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3. TECHNICAL BRIEF
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission
-1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)
3.2.3 External Devices connected to memory interface
Table 1. Memory interface
3.2.4 RF Interface
on/off RF ICs Periodically each TDMA frame.
Table 2. RF Interface Spec
.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Device Name Maker Remark
NAND FLASH K5D1G12ACE-D075 Samsung Synchronous / A synchronous
SDRAM K5D1G12ACE-D075 Samsung Synchronous 133MHz
LCD IM200DBN7A LGIT 8bit access 2times transmission
MP3 Decoder TCC8720 Telechips MP3 Decoder
Resource Interconnection Description
TX2 TXHB Output High band(DCS/PCS) Tx
TX1 TXLB Output Low band(850/900) Tx
RX1, RX1X GSM850_RXP, GSM850_RXN Input of GSM850 LNA
RX2, RX2X GSM900_RXP, GSM900_RXN Input of GSM900 LNA
RX3, RX3X DCS1800_RXP, DCS1800_RXN Input of DCS1800 LNA
RX4, RX4X PCS1900_RXP, PCS1900_RXN Input of PCS1900 LNA
PABS PA_BAND Select PAM operation band.
FE1, FE2 VC1, VC2 Control FEM operation band & mode
PAEN PA_EN PAM Enable
VRAMP TX_RAMP Tx Ramp signal
T_OUT6 PA_MODE_2 Select PAM operation mode (GSM/EDGE)
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3. TECHNICAL BRIEF
3.2.5 USART Interface
KM380 have two UART Drivers as follow :
- USART0 : SW upgrade / Calibration
- USIF : BT Interface.
Table 3. USIF Interface Spec.
3.2.6 ADC channel
BBP ADC block is composed of 7 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4. S-Gold3 ADC channel usage
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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Resource Name Remark
UART0
UART0_TXD UART_TX Transmit Data
UART0_RXD UART_RX Receive Data
USIF
USIF_TXD UART_BT_TX Transmit Data
USIF_RXD UART_BT_RX Receive Data
T_OUT3 UART_BT_RTS Flow Control Signal
T_OUT4 UART_BT_CTS Flow Control Signal
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 N.C
M3 N.C
M4 N.C
M5 N.C
M6 N.C
M7 N.C
M8 VBAT Battery supply voltage measure
M9 LOAD Current consumption measure
M10 N.C
Page 23
3.2.7 GPIO map
Over a hundred allowable resources, KM380 series is using as follows except dedicated to SIM and
Memory. KM380 series GPIO(General Purpose Input/Output) Map, describing application, I/O state,
and enable level, is shown in below table.
- 24 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Port Function Net Name Description
KEY MATRIX
KP_IN2 KP_IN(2)
KP_IN3 KP_IN(3)
KP_IN4 KP_IN(4)
KP_IN5 KP_IN(5)
KP_IN6 KP_IN(6)
KP_OUT0 KP_OUT(0)
KP_OUT1 KP_OUT(1)
KP_OUT2 KP_OUT(2)
KP_OUT3 KP_OUT(3)
DSPIN1 KP_OUT(4)
UART0
UART0_RXD UART_RX UART, RS232 Data
UART0_TXD UART_TX UART, RS232 Data
UART0_RTS_N uSD_DET Micro SD Card Detect
UART0_CTS_N MM_RESET MP3 Decoder Reset
USIF
USIF_TXD_MTSR UART_BT_TX
USIF_RXD_MRST UART_BT_RX
TOUT_3 UART_BT_RTS Bluetooth RTS
TOUT_4 UART_BT_CTS Bluetooth CTS
USB
USB_DPLUS USB_BB_DP USB +
USB_DMINUS USB_BB_DM USB -
CLK
DSPIN0 CLK32K For FM Radio, BT CLK32K
Page 24
- 25 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
CAMERA I/F
CIF_D0 CAM_D(0) Camera DATA[0]
CIF_D1 CAM_D(1) Camera DATA[1]
CIF_D2 CAM_D(2) Camera DATA[2]
CIF_D3 CAM_D(3) Camera DATA[3]
CIF_D4 CAM_D(4) Camera DATA[4]
CIF_D5 CAM_D(5) Camera DATA[5]
CIF_D6 CAM_D(6) Camera DATA[6]
CIF_D7 CAM_D(7) Camera DATA[7]
CIF_PCLK CAM_PCLK Camera pixel clock
CIF_HSYNC CAM_HS Camera H sync
CIF_VSYNC CAM_VS Camera V sync
CLKOUT CAM_MCLK Camera main clock
CIF_PD CAM_PD Camera power down(active high)
CIF_RESET CAM_RESET Camera reset
LCD I/F
DIF_D0 DIF_D(0) LCD data[0]
DIF_D1 DIF_D(1) LCD data[1]
DIF_D2 DIF_D(2) LCD data[2]
DIF_D3 DIF_D(3) LCD data[3]
DIF_D4 DIF_D(4) LCD data[4]
DIF_D5 DIF_D(5) LCD data[5]
DIF_D6 DIF_D(6) LCD data[6]
DIF_D7 DIF_D(7) LCD data[7]
DIF_D8 DIF_D(8) LCD data[8]
DIF_CS1 DIF_CS LCD chip select
DIF_CS2 EHI_INT MP3 Decoder Interrupt
DIF_CD DIF_RS Command Data switch
DIF_WR DIF_WR LCD Write
DIF_HD EOC Indicating End of Charging.
DIF_VD LCD_VSYNC VSYNC
DIF_RESET2 JACK_DET_3.5 Detect plug-in of 3.5pi Ear-Phone
I2C
I2C_SCL I2C_SCL For Sub-PMIC/Audio DAC/Camera
I2C_SDA I2C_SDA For Sub-PMIC/Audio DAC/Camera
Page 25
- 26 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SIM I/F
CC_IO SIM_IO SIM CARD I/O
CC_CLK SIM_CLK SIM CARD CLOCK
CC_RST SIM_RST SIM CARD RESET
I2S1
I2S1_CLK0 Not used
I2S1_RX Not used
I2S1_TX Not used
I2S1_WA0 Not used
External Memory
MMCI_CMD RPWRON Remote Power On
MMCI_DAT[0] uSD_DET_CTRL uSD Card Detect
MMCI_CLK TF_CLK T-flash
MMCI_DAT[1] BT_INT BT Interrupt
MMCI_DAT[2] FLIP_OPEN Flip Open/Close Detect
MMCI_DAT[3] HOLD HOLD Key
Audio I/F
EP_N, EP_P SPK_N, SPK_P For Speaker
HS_N, HS_P RCV_N, RCV_P For Receiver
EPPA1 BBP_SND_L For Speaker
EPREF Reference
EPPA2 BBP_SND_R For Speaker
MICN1 MIC_N For Mic
MICP1 MIC_P For Mic
MICN2 HS_MIC_N For Headset Mic
MICP2 HS_MIC_P For Headset Mic
VMIC MICBIAS Power for MIC
ADC
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2
M3
M8 VSUPPLY Battery supply voltage measure
M9 LOAD Current consumption measure
M10 N.C
Page 26
Reference
VREF
IREF
JTAG I/F
TDO TDO JTAG
TDI TDI JTAG
TMS TMS JTAG
TCK TCK JTAG
TRST_n _TRST JTAG
RTCK RTCK J TAG
Memory
EBU_AD[0] DATA(0)
EBU _AD[1] DATA (1)
EBU _AD[2] DATA (2)
EBU _AD[3] DATA (3)
EBU _AD[4] DATA (4)
EBU _AD[5] DATA (5)
EBU _AD[6] DATA (6)
EBU _AD[7] DATA (7)
EBU _AD[8] DATA (8)
EBU _AD[9] DATA (9)
EBU _AD[10] DATA (10)
EBU _AD[11] DATA (11)
EBU _AD[12] DATA (12)
EBU _AD[13] DATA (13)
EBU _AD[14] DATA (14)
EBU _AD[15] DATA (15)
EBU _WR_N _WR
EBU _RD_N _RD
EBU _BC0_N _BC0
EBU _BC1_N _BC1
EBU _A[0] ADD(0)
EBU _A[1] ADD (1)
EBU _A[2] ADD (2)
EBU _A[3] ADD (3)
EBU _A[4] ADD (4)
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 27
- 28 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
EBU _A[5] ADD (5)
EBU _A[6] ADD (6)
EBU _A[7] ADD (7)
EBU _A[8] ADD (8)
EBU _A[9] ADD (9)
EBU _A[10] ADD (10)
EBU _A[11] ADD (11)
EBU _A[12] ADD (12)
EBU _A[13] ADD (13)
EBU _A[14] ADD (14)
EBU _A[15] ADD (15)
EBU _A[16] ADD (16)
EBU _A[17] ADD (17)
EBU _A[18] ADD (18)
EBU _A[19] ADD (19)
EBU _A[20] ADD (20)
EBU _A[21] ADD (21)
EBU _A[22] ADD (22)
EBU _A[23] ADD (23)
EBU _A[24] ADD (24)
EBU _CS0_n _FLASH1_CS
EBU _CS1_n SDRAM_CS
EBU _CS2_n nCS1
EBU _CS3_n
EBU _ADV_n
EBU _RAS_n _RAS
EBU _CAS_n _CAS
EBU _WAIT_n
EBU _SDCLKO SDCLKO
EBU _SDCLKI SDCLKI
EBU _BFCLKO
EBU _BFCLKI
EBU _CKE CKE
Memory
FCDP_RBn FCDP
Page 28
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
TDMA I/F
T_OUT3 UART_BT_RTS
T_OUT4 UART_BT_CTS
T_OUT5 CHG_EN
T_OUT6 PA_MODE_2 PAM
T_OUT7 HOOK_DETECT
T_OUT8 VBUS_OVP USB DETECT
System Port
CLKOUT0 [<=26MHz] Not used
F26M 26MHZ_MCLK 26M Main Clock
F32K to 32k crystal
OSC32K to 32k crystal
RESET_n _RESET
TRIG_OUT TRIG_OUT
RTC_OUT RTC_OUT
Page 29
- 30 -
3. TECHNICAL BRIEF
3.3 Power management IC
3.3.1 General Description
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 30
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 4. Top level block diagram of the PMU Block of PMB8888
Page 31
Table 6. LDO Output Table of SM-Power
- 32 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LDO Net name Output Voltage Output Current Usage
SD1 VSD1_1V5 1.5V 700mA Core & for LDO
SD2 VSD2_1V8 1.8V 700mA Memory
VAUX VBT_2V9 2.9V 400mA BT Power
VIO VIO_2V62 2.62V 300mA Peripherals
VSIM VSIM_2V9 2.9V 150mA SIM card
VMME - 2.9V 150mA Not used
VAUDIO VAUDIO_2V5 2.5V 620mA
VUSB VUSB_3V1 3.1V 262mA USB Switch
VRF1 VRF1_2V85 2.85V 200mA
VRF2 VRF2_1V5 1.5V 240mA
VRF3 VRF3_2V85 2.85V 470mA
VRTC VRTC_2V0 2.0V 20mA RTC
VVIB VVIB_2V8 2.8V 450mA
Figure 6. LDOs Circuit Diagram of KM380 series
VRF3_2V85
VRF3_2V85
L9
M9
VDD_MAIN_3
L12
VDD_MAIN_4
C111
10n
L10
M10
VSS_MAIN_1
VSS_MAIN_2
0.1u
C112
J8
VSS_MAIN_3
VSS_MAIN_4L8VSS_MAIN_5
VRF1_2V85
V19
VDDP_EBU_1
F3
VSS_MS
VRF3_2V85
L102
L101
47nH
47nH
C108
C109
C110
100p
22p
C119
C120
100p
VRF2_1V5
VSD2_1V8
VSD1_1V5
VBAT
R105
390K
4.7K
R110
R109
100K
TXHB
TXLB
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
0.1u
C126
C127
0.1uF
C128
0.1uF
0.1uF
BAT_ID
RF_TEMP
TP105
LOAD
0.1u
L11
M11
VDD_MAIN_1
VDD_MAIN_2
H3
M0
J3
M1
G4
M2
H4
M7
G3
M8
J4
M9
F4
M10
W3
TX2
V3
TX1
W2
RX1
V1
RX1X
U1
RX2
T1
RX2X
R3
PABIAS
R4
VRF3_2V85
VAUDIO_2V5
VRF3_2V85
C113
10n
W4
W5
H2
T3
T6
P4
K1
K4
VDDTX
VDDDIG
VSS_EP
VDDTRX
VDDVCO
AGND_MS1
AGND_MS2
VBT_2V9
L100
VVIB_2V8
47nH
C100
2.2u
C114
C105
0.1u
2.2u
V7
E1
E3
C10
L1
E2
W6
VLED
VDDRX
VDDXO
VDDMS
VAUDIO
VDDPLL
VSS_AUDIO
VBAT_AUDIO
VUSB_3V1
C102
1u
VIO_2V62
C592
1u
D11
B7
D12
E11
A7
C6
E12
VVIB
VAUX
VUSB
VMMC
VSS_LDO1
VBAT_LDO1
VBAT_BSW_USB_MMC
VBAT
C101
1u
0.47u
C103
VRF1_2V85
VRF3_2V85
C121
C117
1u
2.2u
B3
C7
D6
A3
A2
B4
A8
B8
B2
VIO
VSIM
VPLL
VRF1
VRF2B1VRF3
VSS_LDO2
VBAT_RF13
VBAT_LDO2
VDD_RF2PLL
C104 2.2u
C3
VSS_LDO3
C107
1u
C122
1u
N2
M2
VSSRF2N3VSSRF3P2VSSRF4R2VSSRF5T2VSSRF6
VSSRF1
VPLL_1V5
VBAT
VRF2_1V5
C115
1u
VSIM_2V9
C123
220n
U6
VSSRF7U2VSSRF8U3VSSRF9
V2
VSSRF10V4VSSRF11
V5
VSSRF12
C124
1u
VSSRF13V6VSSRF14
KDR331V
3
D100
C1060.1uF
VRTC_2V0
VRTC_2V0
C118
0.1uF
VBAT
M4
D7
W1
A5
E18
A1
A19
W19
C4
C8
C5
A4
CH_GATE
CH_SOURCE
VDD_REF
SENSE_IN1D5SENSE_IN2
VDDCHARGE
VDD_FUSE_FS
CHARGE_UC_SCAN_IN1
NC1
NC2
NC3
D18
VSS_RTC
2
1
C125
VDD_RTC
VCHG_OVP
VBUS_OVP
0.1u
EBU_AD0
EBU_AD1
EBU_AD2
EBU_AD3
EBU_AD4
EBU_AD5
EBU_AD6
EBU_AD7
EBU_AD8
EBU_AD9
EBU_AD10
EBU_AD11
EBU_AD12
EBU_AD13
R14
W18
V18
W17
T15
U14
V17
T14
R13
W16
V16
U12
W15
W14
V15
DATA(0:15)
TP101
Page 32
- 33 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.3.2 Charging
KM380 charge the battery using an external charging IC of Intersil ISL9221 for Li-Ion or Li-Polymer
battery in 4.2 Volts level.
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 400 mA
5 CV voltage : 4.2 V
6 Cutoff current : 110 mA
7 Full charge indication current (icon stop current) : 110 mA
8 Recharge voltage : 4.16 V
9 Low battery alarm
a. Idle : 3.45 V ~ 3.35 V
b. Dedicated : 3.45 V ~ 3.35 V
10. Low battery alarm interval
a. Idle : 3 min
b. Dedicated : 1 min
11. Switch-off voltage : 3.35 V
12. Charging temperature adc range
a. ~ -5 : low charging voltage operation (3.6 V ~ 3.9 V)
b. -5 ~ 50 : standard charging (up to 4.2 V)
c. 50 ~ : low charging voltage operation (3.6V ~ 3.9V)
4.2V~3.69V 3.69V~3.53V
3.53V~3.43V 3.43V~3.3V
Figure 7. Battery Block Indication
Page 33
- 34 -
3. TECHNICAL BRIEF
3.4 Power ON/OFF
KM380 series Power State : Defined 3cases as follow
] Power -ON-charging : Charger or USB detect.
triggered by a push button. To detect if the push-button is pressed during system operation the logical
level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF
register. If the high level of voltage at pin ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-
mentioned bit won’t be set.
To support Remote power on function for factory mass production, applied an BJT as following figure.
As monitoring the RPWRON and Key matrix KP_OUT(2) & KP_IN(6), KM380 series system recognize
whether remote power on or End-key pushed
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 8. Remote power on and End-key power on circuit
Remote Power On
RPWRON_EN
RPWRON
2K
R535
100K
R534
END_KEY_IN
C410
10u
R431
330K
Q400
EMX18
R434
3.3M
25631
VRTC_2V0
2K
4
R432
PWRON
END
R435
10K
100K
R436
END_KEY_IN
KP_IN(6)
KP_OUT(2)
Page 34
- 35 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.5 SIM interface
KM380 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 10). SIM_IO,
powersupply enabled by BBP (_SIM_EN).
SIM Interface
SIM_CLK: SIM card reference clock
SIM_RST: SIM card Async /sync reset
SIM_IO: SIM card bidirectional reset
Figure 9. SIM Circuit
R325
10K
VSIM_2V9
9
GND3
GND2
10
GND4
GND1
6
C7
5
C6
4
C346
22p
C5
J301
C3
C2
C1
8
7
3
2
1
C347
0.1u
C348
150p
SIM_CLKSIM_IO
SIM_RST
Page 35
- 36 -
3. TECHNICAL BRIEF
3.6 Micro SD external memory Interface
In KM380 series a Micro SD slot for external Memory is connected to MP3 Decoder TCC8720.
Micro SD memory pad assign.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 10. Micro SD Card Circuit
SD mode
Pin No. Name Type Description
1 uSD_DAT2 I/O Data bit [2]
2 uSD_DAT3 I/O Data bit [3]
3 uSD_CMD I/O Command response
4 2V8_VMM Power Power supply
5 uSD_CLK I Clock
6 VSS Ground Power ground
7 uSD_DAT0 I/O Data bit [0]
8 uSD_DAT1 I/O Data bit [1]
R236
56K
R237
2V8_VMM
56K
C247
1u
S1 DM3AT-SF-PEJ
SWA
8
7
6
5
4
3
2
1
GND
uSD_DET
uSD_D1
uSD_D0
uSD_CLK
uSD_CMD
uSD_D3
uSD_D2
VIO_2V62
R231
uSD CARD
56K
100K
R232
1000 pF
R233
56K
R234
47K
47K
R235
C246C245
10p
SWB
Page 36
- 37 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.7 Memory
1Gbit NAND Flash & 512Mbit SDRAM employed on KM380 series with 8 bit bus for NAND and 16bit
bus for SDRAM thru ADD(0) ~ ADD(24). The 1Gbit NAND Flash memory with SDRAM stacked device
family offers multiple high-performance solutions.
Figure 11. Memory Circuit
B2
P2
P1
DNU8
U100
K5
K6
P9
DNU9
NC14
K7
P10
DNU10
NC15
K8
DNU11
NC16
M5
NC1
NC17
B7
M6
NC2
NC18
B9
NC3E8NC4
NC19
M7
F3
F6
NC5
NC6
A10
A11
A12
VDD1
VDD2
VDD3
VDD4
VDDQ1
VDDQ2
VDDQ3
VSS1
VSS2
VSS3
VSS4
VSSQ1
VSSQ2
VSSQ3
VCC1
VCC2
VCCQ
VSS5
VSS6
VSS7
NC20
NC21
NC22
N2
N9
M8
TP100
ADD(10)
ADD(11)
ADD(12)
VSD2_1V8
ADD(0)
ADD(1)
ADD(2)
ADD(3)
ADD(4)
ADD(5)
ADD(6)
ADD(7)
ADD(8)
ADD(9)
VSD2_1V8
C131
470n
C7
A0
C8
A1
C9
A2
B8
A3
M9
A4
L9
A5
K9
A6
J9
A7
H7
A8
H8
A9
D9
H9
G7
B4
G9
H2
M2
D2
F2
K2
C2
F9
G2
N4
E2
J2
L2
B6
N7
N6
B5
N5
N8
C129
470n
ADD(0:12)
VSD2_1V8
C130
220n
M_RESET
VSD2_1V8
3.3K
R112
DATA(0:7)
FCDP
C132
22p
R113
100
3.3K
FLASH1_CS
R111
DATA(0:15)
SDRAM_CS
SDCLKI
SDCLKO
CKE
_WR
ADD(13)
ADD(14)
_RAS
_CAS
_BC0
_BC1
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
ADD(16)
ADD(17)
_RD
_WR
TP514
TP518
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
DATA(8)
DATA(9)
DATA(10)
DATA(11)
DATA(12)
DATA(13)
DATA(14)
DATA(15)
R107 22
R108 22
TP519
TP516
A2
A9
A10
B1
B10
N1
N10
B3
DNU1
DNU2
DNU3
DNU4
DNU5
DNU6
K5D1G12ACE-D075
NC10
NC11
NC7
NC8
NC9
H5
H6
G4
G5
G6
DNU7
NC12J3NC13
DQ0
C4
DQ1
C3
DQ2
D4
DQ3
D3
DQ4
E4
DQ5
E3
DQ6
F4
DQ7
J4
DQ8
K3
DQ9
K4
DQ10
L3
DQ11
L4
DQ12
M3
DQ13
M4
DQ14
N3
DQ15
E9
_CS
H4
CLK
G8
CKE
F8
_WED
D7
BA0
D8
BA1
E7
_RAS
F7
_CAS
G3
LDQM
H3
UDQM
J5
IO0
L5
IO1
J6
IO2
L6
IO3
J7
IO4
L7
IO5
J8
IO6
L8
IO7
C6
_CE
D5
ALE
C5
CLE
E5
_RE
E6
R__B
D6
_WE
F5
_WP
Page 37
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.8 LCD Display
LCD module include:
- Main LCD: 2.0°± 240x320 QVGA, 260K color TFT
- Backlight : 5 piece of white LED
LCD Connector Interface Spec:
Table 7. LCD Connector Interface Spec.
3. TECHNICAL BRIEF
- 38 -
Pin No. Pin Name I/O Description
1 GND Ground
2 MLED_A I Power Supply for LCD Backlight LED
3 MLED_C1 O Current Return for LED1
4 MLED_C2 O Current Return for LED2
5 MLED_C3 O Current Return for LED3
6 MLED_C4 O Current Return for LED4
7 MLED_C5 O Current Return for LED5
8 GND Ground
9 LCD VSYNC O LCD V-Sync
10 DIF_CS LCD Chip Select
11 DIF_RS I LCD Read Select
12 DIF_WR I LCD Write Enable
13 DIF_RD I LCD Read Enable
14 GND Ground
15 GND Ground
16 GND Ground
17 GND Ground
18 GND Ground
19 GND Ground
20 GND Ground
21 GND Ground
22 GND Ground
23 GND Ground
24 DIF_D(0) I LCD Data
Page 38
- 39 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Pin No. Pin Name I/O Description
25 DIF_D(1) I LCD Data
26 DIF_D(2) I LCD Data
27 DIF_D(3) I LCD Data
28 DIF_D(4) I LCD Data
29 DIF_D(5) I LCD Data
30 DIF_D(6) I LCD Data
31 DIF_D(7) I LCD Data
32 LCD_RESET I LCD Reset
33 GND I Interface Mode 1
34 VIO_2V62 I Interface Mode 2
35 LCD_ID O LCD Module Maker ID
36 VIO_2V62 I LCD IO VCC
37 GND Ground
38 VIO_2V62 I LCD VCC
39 VIO_2V62 I LCD VCC
40 GND Ground
Page 39
- 40 -
3. TECHNICAL BRIEF
3.9 Keypad Switching & Scanning
The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs
from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on
settings of the PCL.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 12. Keypad Configuration Circuit
KB400
419
MULTI
OK
403
408
404
MODE
END
VOLUME
UP
415
VOLUME
DOWN
VBAT
100ohm
R403
LD400SSC-TWH104-HL
SSC-TWH104-HL LD401
100ohmR404
200
R405
SSC-TWH104-HL LD402
200
R407
R406 200
LD404SSC-TWH104-HL
LD405SSC-TWH104-HL
LD403SSC-TWH104-HL
KEY LED
200
200
200R410
100ohmR409
R408
R411
LD408SSC-TWH104-HL
LD407
LD406SSC-TWH104-HL
SSC-TWH104-HL
R412 100ohm
LD410SSC-TWH104-HL
SSC-TWH104-HL LD409
200
R413
200
200
R598
R414
LD412
SSC-TWH104-HL
SSC-TWH104-HL LD411
200
240
R600
R599
LD414
LD413
SSC-TWH104-HL
SSC-TWH104-HL
R601 240
LD415
SSC-TWH104-HL
KEY PAD
KP_OUT(0)
KP_OUT(1)
KP_OUT(2)
KP_OUT(3)
R400
150
R401
150
R402
150
R415
150
1
2
3
4
5
R416 150
R593
100K
KP_OUT(4)
KP_IN(2)
KP_IN(3)
KP_IN(4)
KP_IN(5)
KP_IN(6)
R418 150
R420
150R417
150R419
150
150R421
6
400
7
405
8
409
9
412
0
416
AST(*)
401
SHP(#)
406
MENU(F1)
410
BACK(F2)
413
CLR
417
SEND
402
MULTI
LEFT
407
MULTI
RIGHT
411
MULTI
UP
414
MULTI
DOWN
418
SIDE_KEY_MODE/END
SIDE_KEY_VOL
4
3
2
1
VA404
CN400
ICVS0505500FR
VA405
ICVS0505500FR
R427 150
VA406
ICVS0505500FR
150R425
KP_OUT(3)
VOLUME UP
KP_OUT(4)
KP_IN(6)
VOLUME DOWN
150R428
CN401
R424
150
KP_OUT(1)
VA403
ICVS0505500FR
150R426
KP_IN(6)
5
4
3
VBAT
2
1
VA402
END
ICVS0505500FR
Remote Power On
SIDE_KEY_HOLD
L513
3
2
100nH
1
CN403
L512
100nH
PRSB6.8C
10KR429
VIO_2V62
HOLD
resistor
R592
D303
100K
RPWRON_EN
RPWRON
R535
R534
END_KEY_IN
R431
330K
2K
R434
3.3M
C410
10u
100K
Q400
EMX18
VRTC_2V0
2K
R432
25631
PWRON
4
R435
END
10K
100K
END_KEY_IN
KP_IN(6)
KP_OUT(2)
R436
Page 40
- 41 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.10 Keypad back-light illumination
There are 12 snow white color LEDs on PCB for keypad illumination. Keypad Back-light is controlled
Figure 13. Keypad Backlight Circuit
VBAT
KEY LED
200
100ohmR404
200
200
200
100ohmR409
200R410
200R414
200
240
240
KEY_BL_EN
R408
R407
LD406SSC-TWH104-HL
LD404SSC-TWH104-HL
LD405SSC-TWH104-HL
R593
100K
R403 100ohm
LD400SSC-TWH104-HL
SSC-TWH104-HL LD401
R405
SSC-TWH104-HL LD402
R406 200
LD403SSC-TWH104-HL
R411 200
R412 100ohm
LD408SSC-TWH104-HL
LD407SSC-TWH104-HL
SSC-TWH104-HL LD409
R598
R413 200
LD410SSC-TWH104-HL
LD412
SSC-TWH104-HL LD411
SSC-TWH104-HL
R600
R599
LD413
SSC-TWH104-HL
R601
LD415
LD414
SSC-TWH104-HL
SSC-TWH104-HL
Page 41
- 42 -
3. TECHNICAL BRIEF
3.11 LCD back light illumination
MAX8630W is a charge pump designed to support PWM control mode. And MAX8630W supports 5
white LEDs. The MAX8630W is capable of driving up to 5 LEDs at a total of 100mA(MAX8630W
100mA).
The current sinks may be operated individually or in parallel for driving higher current LEDs. To
maximize power efficiency, the charge pump operates in 1X, 1.5X, or 2X mode, where the mode of
operation is automatically selected by comparing the forward voltage of each LED with the input
voltage.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 14. Charge-Pump Circuit
LCD BACKLIGHT LED DRIVER
LCD_BACKLIGHT_EN
C411 1u
VBAT
C415
1u
R536
U401 MAX8630W
3
1
9
815
C416
0.1u
100K
IN
GND
CPWM
PWM
6
C1P
C2P
5
2
4
C1N
P_GND
C2N
1uC417
OUT
LED1
LED2
LED3
LED4
LED5
7
14
13
12
11
10
C414
1u
MLED_A
MLED_C1
MLED_C2
MLED_C3
MLED_C4
MLED_C5
Page 42
- 43 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.12 ISP(Image Signal Processor)
KM380 Series support Camera resolution up to 1.3M pixel. Camera Sensor I/F is integrated in the
Figure 15. ISP & Camera Circuit
2V8_CAM_DVDD
1V8_CAM
C308
1u
2V8_CAM_AVDD
FB300
C309
1u
DIF_D0
E17
DIF_D1
G15
DIF_D2
G17
DIF_D3
C19
DIF_D4
G16
C18
DIF_D5
DIF_D6
H15
DIF_D7
F16
DIF_CS1
K11
DIF_CS2
K8
C17
DIF_WR
DIF_CD
J9
DIF_RD
H10
DIF_HD
F15
DIF_RESET2_GPIO
DIF_VD
F17
H16
CIF_D0
V14
CIF_D1
U13
CIF_D2
T12
CIF_D3
T13
CIF_D4
R11
CIF_D5
R12
CIF_D6
V13
T11
CIF_PCLK
CIF_D7
W12
CIF_VSYNC
CIF_HSYNC
V11
V12
U11
CIF_PD_GPIO
CIF_RESET_GPIO
CLKOUT2
W11
W10
VBT_2V9
R304
C307
1u
100K
VBAT
U300
RT9011-MGPQW
1
VIN8VOUT1
2
EN1
3
EN2
4
PGND
NC1
9
VOUT2
NC2
GND
7
6
5
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(3)
DIF_D(4)
DIF_D(5)
DIF_CS
DIF_D(6)
DIF_D(7)
DIF_RS
DIF_WR
EHI_INT
EOC
DIF_RD
LCD_VSYNC
CAM_D(1)
CAM_D(2)
CAM_D(0)
JACK_DET_3.5
CAM_VS
CAM_HS
CAM_D(7)
CAM_PCLK
CAM_PD
CAM_RST
CAM_CLK
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
2V8_CAM_DVDD
2V8_CAM_AVDD
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
1V8_CAM
C327
C328
0.1u
0.1u
C329
0.1u
TP300
32
31
30
29
28
27
26
25
PGND1
PGND2
PGND3
PGND4
PGND5
PGND6
PGND7
DGND3
21
U302
AGND16AGND2
17
13
DVDD
14
PGND8
VSYNC
HSYNC
STANDBY
RESETB
AVDD
VDDIO
16
PCLK
SCK
SDA
MCLK
22
D0
23
D1
24
D2
1
D3
2
D4
3
D5
4
D6
5
D7
DGND1
DGND2
8
15
FB306
R315 100ohm
20
19
18
12
11
10
9
7
C322
10p
C323
0.1u
R316
100
TP301
TP302
C324
15p
C325
10p
CAM_PCLK
CAM_VS
CAM_HS
CAM_PD
I2C_SCL
I2C_SDA
CAM_RST
CAM_CLK
Page 43
- 44 -
3. TECHNICAL BRIEF
3.13 Battery current consumption monitor
KM380 series use a current monitoring function to calculate the battery capacity and the remaining
time, as monitoring current flow from the battery thru 47mohm resistor.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 16. Battery Current Monitor Circuit
Battery Connector & Current Monitor
R305
VBAT
C574
2.2u
U301
ZXCT1010E5TA
5
LOAD NC
4
VIN
BAT_ID
C576
100p
GND
IOUT
1
2
3
C310
1u
R310
LOAD
2.2K
CN300
VSUPPLY
C577
100p
47mohm
1
2
4
3
R309
1K
C315
100p
Page 44
- 45 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.14 JTAG & ETM interface connector
In case of KM380 series mass production, the JTAG interface connector will not be mount on board.
That is only for developing and software debugging purpose.
Figure 17. JTAG & ETM Interface Circuit
ON BOARD ARM9 JTAG
TRST_N
TDI
TMS
TCK
RTCK
TDO
_EXTRST
VSD2_1V8
CN100
G1 G2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
G3 G4
2V8_VMM
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
MM_TRST_N
MM_TDI
MM_TMS
MM_TCK
MM_RTCK
MM_TDO
MM_RESET
Page 45
- 46 -
3. TECHNICAL BRIEF
3.15 Audio
KM380 series Audio signal flow diagram as following diagram.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 18. Audio Signal Flow Diagram
Page 46
- 47 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.15.1 Audio amplifier
We use WM8959 Audio DAC, which have speaker & headphone amplifiers. An audio signal path
can be selected by internal audio mixer of WM8959 thru I2C command.
Figure 19. Audio DAC Circuit Diagram
VSD2_1V8
C213
1u
CODEC_MCLK
CODEC_BCLK
CODEC_DIN
CODEC_DOUT
CODEC_LRC
SPK_N
FM_SND_L
SPK_N
FM_SND_R
SPK_P
SPK_P
I2C_SCL
I2C_SDA
VBAT
R524
0
C215
0.1u
C221
C224 1u
C225 DNI
2V8_DAC
2V8_DAC
C212
4.7u
DNIC220
1u
1uC222
1uC223
R214
100K
C209
2.2u
A6
AVDD
A5
HPVDD
B2
SPKVDD
F6
DCVDD
G6
DBVDD
F5
MCLK
G5
BCLK
F4
DNC
F3
DACDAT
G4
DACLRC
E4
GPIO1
G2
GPIO3_BCLK2
G3
GPIO4_DACLRC2
G1
GPIO5_DACDAT2
D3
LIN1
C5
LIN2
C6
LIN3_GPI7
B6
LIN4_RXN
D5
RIN3_GPI8
E5
RIN4_RXP
D4
RIN1
D6
RIN2
F2
CSB_ADDR
F1
SCLK
E3
SDIN
E2
MODE
C210
2.2u
C211
0.1u
Stereo DAC & AMPStereo DAC & AMP
WM8959U201
HPGND
AGND
DGND
SPKGND
VMID
MICBIAS
LOP
LON
LOUT
ROUT
OUT3
OUT4
SPKP
SPKN
ROP
RON
B3
A3
E6
B1
C3
A2
D1
C2
B4
B5
A4
C4
A1
C1
E1
D2
C216
2.2u
TP200
L200
100nH
L201
100nH
TP
C226
47p
C217
0.1u
C218 100u
HSO_3.5_VMID
SPK_AMPP
SPK_AMPN
C227
47p
100uC219
R525
HSO_3.5_L
HSO_3.5_R
10K
R526
HSO_R
HSO_L
10K
Page 47
- 48 -
3. TECHNICAL BRIEF
3.15.2 Microphone circuit
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 20. Microphone Circuit Diagram
MICMIC
MIC_N
MIC_P
100nHL401
L402 100nH
27p
C403
MICBIAS
C400
DNI
C401
22n
C402
22n
C404
27p
VA401
VA400
ICVS0505500FR
ICVS0505500FR
C405
100p 10u
C406
L400
100nH
MIC400
1
OUT
2
G1
3
G2
4
G3
5
PWR
6
G4
SPM0204LE5-QB
Page 48
- 49 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.16 Charging circuit
ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other
from a desktop cradle.
The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.
Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used
safely. An over voltage protection functions are integrated in ISL9221 for USB & Charge
Figure 22. Charging Circuit Diagram
OVP CHARGING IC
EOC
CHG_EN
VIO_2V62
R317
TP515
100K
VCHG
VBUS_USB
U303 ISL9221
PGND
VDC_BYP
USB_BYP
5.6K
(1%)
R318
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
BAT
IVDC
GND
IUSB
(1%)
13
12
11
10
9
8
7
R320
33K
R596
DNI
R319
16K
VBAT
VCHG_OVP
C332
0.1uF
C333
0.1u
VBUS_OVP
C334
0.1u
Page 49
- 50 -
3. TECHNICAL BRIEF
3.17 BLUETOOTH
General Features
The BlueCore 5-FM BGA is a single chip radio and baseband IC for Bluetooth 2.4 GHz systems
including enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with stereo
audio output stage and an RDS demodulator.
With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system to
v2.0+EDR of the specification for data and voice communications.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 23. Bluetooth / FM Radio Circuit Diagram
VIO_2V62
OUT500
VBALUN_BT
C500
1p
L500
DNI
FM_SND_R
FM_SND_L
CLK32K
26MHZ_BT
FM_ANT
LFB212G45BA1A220
18nH
L507
C515
C517
C518 820p
FL500
C524
15p
FB500
OUT501
C502
C501
1u
0.1u
1
1R503
1
C509
C510
C508
0.1u
2.2u
C521
33nHL501
15p
5
6
7
220nC514
BT_VCXO_EN
BT_RESET
15p
47n
C513
R594
560
C516
0.01u
470nH
L502
820p
C519
C512
C511
15p
15p
1000p
15pC520
4
G1
B1
UB
3
G2
NC_DC
2
B2
NC
1
G3
8
A3
A4
A5
B3
C9
K3
J2
K2
B1
A1
B5
D1
E1
F1
G1
AU_REF
SPKR_R
SPKR_L
FILT_EXT
CLK_32K
LO_REF
XTAL_OUT
XTAL_IN
FM_P
FM_N
AUX_DAC
RX_N
RX_P
RF_P
RF_N
BT_INT
B10
VDD_PIO
PIO_11
C6
A2
C2
VDD_FM
VDD_RADIO_1
PIO_10
PIO_9
A8
B7
G10
G2
J6
VDD_USB
VDD_PADS
VDD_RADIO_2
PIO_6
PIO_7
PIO_8
F9
C5
F10
TP522
47K
R604 R603
H10
A7
VDD_CORE_2
VDD_CORE_1
PIO_4
PIO_5
E9
E8
R514
H1
K1
A6
VDD_LO
VDD_ANA
VDD_AUDIO
BLUECORE5-FM
PIO_1
PIO_2
PIO_3
B8
B9
A9
A10
0.1uF
TP506
C525
R515
470K
U500
PIO_0
C504
22n
B2
C10
VSS_PIO
AIO_1
J4
K4
VBALUN_BT
C1
B4
VSS_FM2
VSS_FM1_2
VSS_FM1_1
_RST
AIO_0
F8
VIO_2V62
G9
D2
VSS_DIG
VSS_RADIO_1
SPI_CLK
SPI__CS
J9
H8
C506
15p
E2
F2
VSS_ANA_1C3VSS_ANA_2D3VSS_ANA_3
VSS_RADIO_2
VSS_RADIO_3
SPI_MISO
SPI_MOSI
TEST_EN
K9
C4
K10
J3
E3
VSS_ANA_4F3VSS_ANA_5G3VSS_ANA_6
VREGENABLE_H
VREGENABLE_L
VREGIN_LJ1VREGOUT_H
H3
H4
R512
2.2
C529
2.2u
G8
VSS_PADS
VREGIN_H
J5
C528
DNI
B6
H2
VSS_LO
I2C_DATA
VSS_CORE
I2C_CLK
USB_DN
USB_DP
UART_CTS
UART_RTS
UART_RX
UART_TX
PCM2_CLK
PCM2_SYNC
PCM2_IN
PCM2_OUT
PCM_CLK
PCM_SYNC
PCM_IN
PCM_OUT
K5
C8
C7
K6
J7
H6
H5
K7
J8
D9
D10
E10
D8
H9
J10
K8
H7
R505 01000p
R507
R508 0
VBT_2V9
C526
2.2u
FB501
TP500
TP501
0R506
0
TP502
TP503
TP504
TP505
C527
0.1u
UART_BT_RTS
UART_BT_CTS
UART_BT_TX
UART_BT_RX
I2S1_CLK
I2S1_WA0
I2S1_TX
I2S1_RX
Page 50
- 51 -
3. TECHNICAL BRIEF
Bluetooth Radio
- Common TX/RX teminal simplifies external matching, eliminates external antenna switch
- No external trimming is required In production
- Bluetooth v2.0 + EDR Specification compliant
Bluetooth Transmitter
- +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range > 30dB
- Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.
Bluetooth Receiver
- Integrated channel filters
- Digital demodulator for improved sensitivity and co-channel rejection
- Real time digitized RSSI available on HCI interface
- Fast AGC for enhanced dynamic range
- Channel classification for AFH
Synthesiser
- Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter
- Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock
Audio
- Single-ended stereo analogue output
- 16-bit 48 kHz digital audio bit stream output
Baseband and Software
- Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet
operation, including all medium rate packet types
- Logic for forward error correction, header error control, access code correlation. CRC, demodulation,
encryption bit stream generation, whitening and transmit pulse shaping. Supports all Bluetooth
v 2.0 + EDR features incl. ESCO and AFH
- Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air
Physical Interfaces
- Synchronous serial interface up to 4Mbits/s for system debugging
- UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode
- USB v1.1 interface
- I2C slave for FM
- Two audio PCM interfaces (input and output)
- Analogue stereo (output only)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 51
- 52 -
3. TECHNICAL BRIEF
3.18 FM Radio
• Simultaneous operation with Bluetooth
• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band
• Wide dynamic range AGC
• Soft mute and stereo blend
• Adjustment-free stereo decoder and AFC
• Autonomous search tuning function (up/down) with programmability (threshold setting)
• RDS demodulator
• Audio output available over Bluetooth audio interface or dedicated audio output
• Control of FM via Bluetooth HCI or I2C
• Adaptive filter to suppress narrow band interference in the FM channel
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
/
Figure 23. Bluetooth / FM Radio Block Diagram
Bluetoot
Antenn
AUDIO
Driver
I/O
RF
BlueCor -5 F
F
Radi
RA
2.4
RO
R
OU
IN
2.4 GH
Radi
MM
Processo
UAR
PI
I2S(PCM
VBT_2V
Stereo
Analog
u
Main
PM 888
Page 52
- 53 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.19 18pin Multi Media Interface connector
Table 11. Multi media interface pin assign
KM380 series MMI
Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Not used
4 HS_OUT_L Headset left sound
5 HS_OUT_R Headset Right sound
6 USB_DP USB_DP
7 UDB_DM USB_DM
8 JACK_DETECT Headset detect (active low)
9 VBAT Battery voltage
10 VBAT Battery voltage
11 RPWRON_EN Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR Not used
15 VBUS_USB USB VBUS
16 UART_Tx UART Tx
17 UART_Rx UART Rx
18 GND Power GND
Page 53
- 54 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 28. 18 Pin Multi port Circuit Diagram
HOOK_DET
HS_MIC_N
HS_MIC_P
C311
27p
C301
100p
C304
0.1u
C312
27p
VAUDIO_2V5
C305
0.1u
R303
C306
VIO_2V62
C300
24p
2 : Headset MIC
4 : HSO_L
5 : HSO_R
6 : USB+
7 : USB-
8 : JACK_D
9,10 : BATT
11 : R/ON
12,13 : CHG
14 : DSR
15 : VUSB
16 : D/ TX
17 : D/ RX
FM_ANT
R301
100ohm
R306
2.2K
10u
R302
C313
100p
18K
HSO_L
HSO_R
C302
4.7u
USB_DP
USB_DM
JACK_DET
RPWRON_EN
UART_TX
UART_RX
C303
24p
100nHL301
24pC316
C321 24p
L303 100nH
VBUS_USB
R311
47
47R313
47R314
VA300
VA302
VA306
C326
1u
VA301
100nHL302
VA305
VIO_2V621.5K
10K
R307
100K
R308
VA303
VA304
ICVS0505500FR
VA408
VCHG
ICVS0505500FR
C319
1u
VA407
VSUPPLY
FB301
FB302
FB303
FB304
FB305
L300
100nH
CN301
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
20
22
100K
R300
Page 54
- 55 -
4. RF circuit technical brief
4.1 General Description
voice and data transfer applications. The whole transceiver function is integrated in main IC, PMB8888
provides 4 LNA inputs for RF receiving and two outputs for PAM input for High/Low band. A direct
conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA
functionality.
4. RF circuit technical brief
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 29. PMB 6272 Function Block Diagram
Page 55
- 56 -
4. RF circuit technical brief
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 30. SMARTi-PM Circuit Diagram
VBAT
R105
R109
390K
4.7K
R110
100K
PA_BAND
DCS1800_RXP
DCS1800_RXN
PCS1900_RXP
TX_RAMP
PCS1900_RXN
VBUS_OVP
4
GND2
1
HOT1
NX3225SA
VRF2_1V5
VSD2_1V8
VSD1_1V5
TXHB
TXLB
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
VC1
VC2
PA_EN
26MHzX100
3
HOT2
2
GND1
C119
100p
C126
0.1uF
RF_TEMP
UART_BT_RTS
UART_BT_CTS
CHG_EN
PA_MODE_2
HOOK_DET
R115 9.1K
R117 10K
SIM_IO
SIM_CLK
SIM_RST
C120
0.1u
C127
0.1uF
BAT_ID
TP105
LOAD
LCD_ID
C128
0.1uF
TP102
L12
L10
M10
J8
VSS_MAIN_2
VSS_MAIN_3
VSS_MAIN_4L8VSS_MAIN_5
V19
VDDP_EBU_1
L11
M11
L9
M9
VSS_MAIN_1
VDD_MAIN_1
VDD_MAIN_2
VDD_MAIN_3
H3
M0
J3
M1
G4
M2
H4
M7
G3
M8
J4
M9
F4
M10
W3
TX2
V3
TX1
W2
RX1
V1
RX1X
U1
RX2
T1
RX2X
R3
PABIAS
R4
PABS
R1
RX3
T5
VDET
U5
PAMODE
P1
RX3X
N4
FE1
P5
FE2
M3
PAEN
N1
RX4
P3
VRAMP
M1
RX4X
A18
T_OUT3
J10
T_OUT4
H11
T_OUT5
E13
T_OUT6
B19
T_OUT7
K9
T_OUT8
G19
CLKOUT0
U4
REFR
W7
XOX
W8
XO
V10
CC_IO
U9
CC_CLK
V9
CC_RST
U10
VDD_MAIN_4
Page 56
- 57 -
4. RF circuit technical brief
4.2 Receiver part
The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 30). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 29. PMB 6272 Function Block Diagram
Page 57
- 58 -
4. RF circuit technical brief
4.3 Transmitter part
The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information. The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N
modulation loop. The divided output of its associated VCO is fed to a highly linear amplitude
modulator, recombining amplitude and phase information. The output of the amplitude modulator is
connected to a single ended output RF PGA for digitally setting the wanted transmit power. The PA
interface of SMARTi-PM supports direct control of standard dual mode power amplifiers (PA’s) which
usually have a power control input VAPC and an optional bias control pin VBIAS for efficiency
enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its
VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output
power level are set. In 8PSK mode, the ramping functionality is assured by an on-chip ramping
generator, whereas output power is controlled by the PGA’s as described above.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 58
- 59 -
4. RF circuit technical brief
4.4 RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-
Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA©˜). To overcome the statistical spread of the loop filter element
values an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The
fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and
operates at double or four times transmit or receive frequency. To cover the wide frequency range the
VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer
startup.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 32. Transmitter Architecture Block Diagram
Page 59
- 60 -
4. RF circuit technical brief
4.5 DCXO
The transceiver contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with
three outputs for the system clock, one output for the GSM baseband and two additional for other
subsystems (GPS, Bluetooth, etc.). The only external part of the oscillator is the crystal itself. The
overall pulling range of the DCXO consists of eight subranges. The subrange closest to the ‘0ppm’ at
the middle AFC-value is selected during the calibration process in the mobile’s production and is used
for the rest of the lifetime. The frequency tuning is performed along the selected subrange by
programming the frequency control word (XO_TUNE) via the three wire bus (“3Wbus”).
4.6 Front End Module control
Implemented in the Transceiver are two outputs for direct control of front end modules with two logic
input pins to select RX- and TX-mode as well as low- and high band operation.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 33. FEM Circuit Diagram
GND500
VC1
VC2
PIN 13
PIN 14
H
GSM850_EGSM TX
GSM850 RX
EGSM900 RX
DCS1800 RX
PCS1900 RX
GND501
C535
DNI
L519
1nH
C536
DNI
C591
100p
15nH
L518
L
HDCS_PCS TX
L
L
L
L
L
L
L
L
L
R510
0
C553
L503
12nH
GSM850
11
C554
6.8p
4.7p
G2
ANT
RF
G1
SW500
RF-800
C537
DNI
C552
6.8p
R509
0
C522
47p
R590
0
C523
47p
21NC19
20
10
12
16
18
9
VC1
VC2
GND2
GND3
GND413GND514GND6
GND722GND823GND9
GND1
U502
LSHS-C085FB
ANT
GSM850_900_TX3GSM900RX_OUT1
GSM900RX_OUT2
GSM1800RX_OUT1
GSM1800_1900_TX7GSM1900RX_OUT1
GSM850RX_OUT1
GSM850RX_OUT2
4
5
6
1
2
17
15
C546 DNI
DNIC545C544 DNI
L514
L504
12nH
GSM900
C555
4.7p
4.7nH
L505
4.7nH
DCS1800
L515
4.7nH 3.9nH
VC1
VC2
24
GND10
GSM1800RX_OUT2
GSM1900RX_OUT2
8
DNIC547
L516
L506
4.7nH
PCS1900
L517
3.9nH
C538
100p
C541
DNI
C549
18p
C550
DNI
GSM900_RXP
GSM850_RXP
GSM850_RXN
GSM900_RXN
DCS1800_RXP
DCS1800_RXN
PCS1900_RXP
PCS1900_RXN
Page 60
- 61 -
4. RF circuit technical brief
4.7 Power Amplifier Module
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 34. Power Amplifier Circuit Diagram
C541
DNI
C550
DNI
C538
C549
100p
C542
0.5p
18p
GND25
27
GND24
28
GND23
29
GND22
30
GND21
31
GND20
32
GND19
33
GND18
34
GND17
35
GND16
36
GSM_OUT
9
GND5
10
GND4
11
RSVD2
12 5
GND3
13
GND2
14
GND1
15
DCS_PCS_OUT
16
C551
0.5p
U501
SKY77340
DCS_PCS_IN
GND15
GND14
GND13
GND12
GND11
GND10
GND9
GND8
GND7
GND6
GSM_IN
VRAMP
VBATT
RSVD1
MODE
26
25
24
23
22
VSUPPLY
21
20
19
18
17
EN
8
7
6
4
BS
3
2
1
C562
C561
0.1u
1u
C563
C560
33 uF DNI
39p
C564
39p
C565
39p
C539
DNI
C543 100p
39p
C572C566
39p
C540
DNI
47R591
R520 47
C548 100p
C567
DNI
R523 47
C568
PA_EN
TXLB
TX_RAMP
47R522
PA_BAND
TXHB
PA_MODE_2
Page 61
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. PCB layout
- 62 -
5. PCB layout
5.1 Main PCB component placement
Main PCB Top Main PCB Top placement
Page 62
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. PCB layout
- 63 -
Main PCB bottom Main PCB bottom placement
Page 63
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 64 -
6. Trouble shooting
6.1 Trouble shooting test setup
Equipment setup
Power on all of test equipment
- Connect PIF-UNION JIG or dummy battery to the DUT for power up.
- Connect mobile switch cable between Communication test set and DUT when you need to make a
phone call.
- Follow trouble shooting procedure
Page 64
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 65 -
6.2 Power on Trouble
Check Points
-Battery Voltage( Need to over 3.35V)
-Power-On Key detection (PWRON signal)
TP1
TP2
TP3
SIDE_KEY_MODE/END
5
4
3
2
1
CN401
Remote Power On
RPWRON_EN
2K
R535
RPWRON
R534
100K
C410
10u
VBAT
END
R431
330K
R434
3.3M
Q400
EMX18
VA402
ICVS0505500FR
VRTC_2V0
2K
25631
4
VA403
ICVS0505500FR
R432
PWRON
R424 150
150R426
END
R435
10K
KP_OUT(1)
KP_IN(6)
100K
R436
END_KEY_IN
KP_IN(6)
KP_OUT(2)
END_KEY_IN
Page 65
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 66 -
START
Connect power
supply to the DUT
Vbat = over 3.35V
Yes
Check
ìPWRONî sig nal of
R432 2.0V
Yes
Check TP1, TP2 of
CN401 when push the
power key
Yes
Check TP3
ìPWRO Nî sig nal of
R432 0V
Yes
Check the all LDOís
output
Is it correct?
No
No
No
No
Check the
BACKUP Battery
Check solder 1,2 pin
or
Replace CN401
(PWR Side_k
Check solder
Q400, R432
ey)
Check solder whole LDO
parts or replace it
TP1
TP2
CN401
Q400
TP3
(R432)
Is the 26MHz
clock from TP4
X100 of U102 ?
Replace main PCB
No
Check solder
Replace X-TA
TP44
L
X100
Page 66
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 67 -
Page 67
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 68 -
6.3 Charging trouble
Check Points
-Connection of TA (check TA voltage 5.6V)
-Charging Current Path component voltage drop
-Battery voltage
1 Charging method : CC-CV
2 Charger detect voltage : 4.0 V
3 Charging time : 2h 30m
4 Charging current : 400 mA
5 CV voltage : 4.2 V
6 Cutoff current : 100 mA
7 Full charge indication current (icon stop current) : 100 mA
8 Recharge voltage : 4.15 V
4.2V~3.75V 3.75V~3.64V
3.643V~3.45V 3.45V~3.35V
TP1
TP2
ICVS0505500FR
L300
100nH
VSUPPLY
VCHG
CN301
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
20
22
VA304
VA408
ICVS0505500FR
VA407
C319
1u
FB301
FB302
FB303
FB304
FB305
EOC
CHG_EN
VIO_2V62
R317
TP515
OVP CHARGING IC
VCHG
VBUS_USB
100K
5.6K
R318
(1%)
U303 ISL9221
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
PGND
VDC_BYP
BAT
USB_BYP
IVDC
GND
IUSB
(1%)
13
12
11
10
9
8
7
R320
33K
R596
DNI
R319
16K
VBAT
VCHG_OVP
C332
0.1uF
C333
0.1u
VBUS_OVP
C334
0.1u
Page 68
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 69 -
START
Yes
18pin IO(CN301)
Is soldered ?
Yes
Source pin of
VA408 = 5.6V ?
Yes
Output pin (10)
of C333=4.2V?
Yes
Battery voltage
is over 3.35V?
No
No
No
No
Resolder the
CN301
The TA can be
broken
Change other TA
then retest
Check solder
U303 or replace it
charging until
battery
Voltage goes up to
3.35V
18pin
IO(CN302)
TP1
VA(408 )
Yes
Charge is operating properly
Page 69
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 70 -
6.4 LCD display trouble
Check Points
-LCD assembly status ( LCD FPCB, Connector on FPCB)
-EMI filter soldering
-Connector combination
LCD_VSYNC
DIF_CS
DIF_RS
DIF_WR
LCD_Connector
MLED_A
MLED_C1
MLED_C2
MLED_C3
MLED_C4
5G110
G2
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
FL400
ICVE10184E150R101FR
8 BIT
16 BIT
9 BIT
MLED_C5
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
INOUT_A1
1
DIF_RD DIF_D(4)
MODE2
MODE1
H
L
H
VIO_2V62
CN402
G1 G2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
L
L
H
20 21
AXT540124
G3 G4
40
39
38
37
36
35
34
MODE1
33
MODE2
32
31
30
29
28
27
26
25
24
23
22
C407
1u
LCD_ID
VIO_2V62
R423
100K
FL401
INOUT_B4
6
INOUT_B3
7
INOUT_B2
8
INOUT_B1
9
1
INOUT_A1
2
INOUT_A2
3
INOUT_A3
4
INOUT_A4
FL402
R430
100
ICVE10184E150R101FR
10
G15G2
INOUT_A4
4
INOUT_A3
3
INOUT_A2
2
INOUT_A1
1
9
INOUT_B1
8
INOUT_B2
7
INOUT_B3
6
INOUT_B4
G110G2
5
ICVE10184E150R101FR
LCD_RESET
C409
22p
DIF_D(7)
DIF_D(6)
DIF_D(5)
DIF_D(3)
DIF_D(2)
DIF_D(1)
DIF_D(0)
Page 70
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Copyright © 2008 LG Electronics. Inc. All right reserved.
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6. Trouble shooting
- 71 -
START
Check LCD connector
combination then LCD test
with New LCD
Is LCD FPCB
normal?
No
Replace LCD FPCB
Yes
Signal is normal on
2.62V Signal
FL400, FL401,FL402
Yes
Assemble
No
Check solder and
repair
Damaged filter
Page 71
- 72 -
6. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6.5 Camera Trouble
Check Points
-Connectors combination
-FPCB status
VBT_2V9
R304
100K
C307
1u
VBAT
U300
RT9011-MGPQW
1
VIN8VOUT1
2
EN1
3
EN2
4
PGND
NC1
9
VOUT2
GND
NC2
7
6
5
2V8_CAM_DVDD
1V8_CAM
C308
1u
2V8_CAM_AVDD
FB300
C309
1u
1V8_CAM
C327
0.1u
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
2V8_CAM_DVDD
2V8_CAM_AVDD
C328
0.1u
C329
0.1u
TP300
32
31
30
29
28
27
26
25
PGND1
PGND2
PGND3
PGND4
PGND5
PGND6
PGND7
U302
AGND16AGND2
17
13
DVDD
14
PGND8
PCLK
VSYNC
HSYNC
STANDBY
RESETB
MCLK
AVDD
VDDIO
16
SCK
SDA
20
19
18
12
11
10
9
7
22
D0
23
D1
24
D2
1
D3
2
D4
3
D5
4
D6
5
D7
DGND1
DGND2
DGND3
8
15
21
FB306
C322
R315 100ohm
TP301
TP302
R316
100
C323
C324
0.1u
10p
15p
CAM_PCLK
CAM_VS
CAM_HS
CAM_PD
I2C_SCL
I2C_SDA
CAM_RST
CAM_CLK
C325
10p
Page 72
- 73 -
6. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
START
Check camera connector,
34pin main connector
Combination then Camera test
With equipped camera module
Yes
Replace New
Camera module
Working properly?
Yes
Replace Camera module
Yes
Assemble
No
Replace
Main
PCB
Page 73
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6.6 Receiver & Speaker trouble
Check Points
-Speaker pin contact
-Audio amp soldering
-SUB PMIC soldering
6. Trouble shooting
- 74 -
TP2
TP3
TP4
TP1
SPK
C351
47p
L314 56nH
56nHL315
EVLC18S02015
VA310
EVLC18S02015
CN302
VA309
SPK_AMPP
SPK_AMPN
C350
47p
C349
100p
2
1
VSD2_1V8
C213
1u
CODEC_MCLK
CODEC_BCLK
CODEC_DIN
CODEC_DOUT
CODEC_LRC
SPK_N
FM_SND_L
SPK_N
FM_SND_R
SPK_P
SPK_P
I2C_SCL
I2C_SDA
VBAT
R524
0
C215
0.1u
C221
C224 1u
C225 DNI
2V8_DAC
2V8_DAC
C212
4.7u
DNIC220
1u
1uC222
1uC223
R214
100K
C209
2.2u
A6
AVDD
A5
HPVDD
B2
SPKVDD
F6
DCVDD
G6
DBVDD
F5
MCLK
G5
BCLK
F4
DNC
F3
DACDAT
G4
DACLRC
E4
GPIO1
G2
GPIO3_BCLK2
G3
GPIO4_DACLRC2
G1
GPIO5_DACDAT2
D3
LIN1
C5
LIN2
C6
LIN3_GPI7
B6
LIN4_RXN
D5
RIN3_GPI8
E5
RIN4_RXP
D4
RIN1
D6
RIN2
F2
CSB_ADDR
F1
SCLK
E3
SDIN
E2
MODE
C210
2.2u
Stereo DAC & AMPStereo DAC & AMP
C211
0.1u
WM8959U201
HPGND
AGND
DGND
SPKGND
VMID
MICBIAS
LOP
LON
LOUT
ROUT
OUT3
OUT4
SPKP
SPKN
ROP
RON
B3
A3
E6
B1
C3
A2
D1
C2
B4
B5
A4
C4
A1
C1
E1
D2
TP
TP200
L200
100nH
L201
100nH
C226
47p
C216
2.2u
C217
0.1u
C218 100u
HSO_3.5_VMID
SPK_AMPP
SPK_AMPN
C227
47p
100uC219
R525
HSO_3.5_L
HSO_3.5_R
10K
R526
HSO_R
HSO_L
10K
Page 74
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 75 -
START
g
g
Check Speaker tension and
Contacts are clear
.
Output
nal
Si
Input Signal (TP1,
TP2) is Low(0V)?
No
Check the soldering status
Of U201 of main -board
Output Signal (TP3,
TP4) is Low(0V)?
No
Receiver Signal
(TP5, TP6)
High(1.6V)
?
Replace Main PCB
Assemble
Yes
Replace Main Board
Y
es
Replace U201 of
main -boa
rd
TP3 TP4
TP1
TP2
Input
nal
Si
Replace Receiver
TP5 TPP6
Receiver
Signal
Page 75
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 76 -
6.7 Microphone trouble
Check Points
-Microphone hole
-MICBIAS & Signal come from
-Audio signal level of the Microphone
-Soldering of components
1
TP1
TP2
MICMIC
MIC_P
MIC_N
START
Check microphone sound
hole
Mic bias ON
(2.5V)when
call?(TP1, L400)
L402 100nH
Yes
100nHL401
27p
C403
MICBIAS
C404
27p
No
C401
22n
C402
22n
VA400
ICVS0505500FR
Check mic. Bias
VA401
ICVS0505500FR
ne
li
C400
DNI
C405
C406
100p 10u
L400
100nH
1
2
3
4
5
6
TPTP2 2
MIC400
OUT
G1
G2
G3
PWR
G4
SPM0204LE5-QB
MIC Bias
TPTP1
Check the signal
level at (TP2)each
side of MIC400.
Replace Main PCB
Yes
Yes
No
Replace
microphone
(MIC4
MIC Signal
00)
Page 76
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 77 -
6.8 Ear-MIc Jack Detection trouble
FB3
302
START
Check the Ear-Jack detection.
Check the soldering
status of CN301
Is the status of FB301(TP1),
FB302 (TP2) low?
The main board has a
problem
Replace Main PCB
Assemble
Yes
Yes
No
No
Resoldering or
Replace CN30
Resolder FB301,
FB30
1
2
CN301
TPTP1 TPTP2
FB3
01 FB302
Ear-Jack
Signal
Page 77
6.9 Vibrator trouble
Check Points
-Connectors combination
V
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 78 -
VIBRATOR
U304
R329
100K
Yes
SUY98005LT1G
1
VIN
VOUT
2
GND
VIB_CTRL
R327
1K
START
Check Vibrator Connector
Combination
Check the voltage
of CN303 (TP1)
oltage is 2.8?
Replace Vibrator
Assemble
3
R32810L316
100nH
No
VBAT
VB300
1
+
2
C352
0.1u
CN303
-
1u
Resoldering or
Replace U
102
C593
2.2u
TP1
Page 78
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 79 -
6.10 Keypad back light trouble
Check Points
-Signal path is connected well
-Analog SW is working properly
TP1
VBAT
200
100ohmR404
R405
R406 200
R403 100ohm
KEY LED
200
200
100ohmR409
R408
R407
200R410
200
200
R599
240
R600
240
R601
200R414
R598
R413 200
R411 200
R412 100ohm
LD400SSC-TWH104-HL
KEY_BL_EN
R593
100K
START
Check All of LEDs solder
Check VBAT
Yes
SSC-TWH104-HL LD401
LD403SSC-TWH104-HL
SSC-TWH104-HL LD402
LD406SSC-TWH104-HL
LD404SSC-TWH104-HL
LD405SSC-TWH104-HL
No
LD408SSC-TWH104-HL
LD407SSC-TWH104-HL
SSC-TWH104-HL LD409
Check BATTERY
LD410SSC-TWH104-HL
LD412
SSC-TWH104-HL LD411
SSC-TWH104-HL
LD414
LD413
SSC-TWH104-HL
SSC-TWH104-HL
SSC-TWH104-HL
LD415
check GPIO
signal(KEY_BL_EN,
TP1) Voltage of Q402
> 0.7v
Yes
KEY_LED is operating
No
Replace TR(Q402)
Page 79
6.11 SIM & uSD trouble
SIM Check Points
-Power is working
-Socket soldering
-Proper SIM is used
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 80 -
TP3
TP1
TP2
VSIM_2V9
R325
10K
C346
22p
J301
9
GND3
10
GND4
6
C7
5
C6
4
C5
GND2
GND1
8
7
3
C3
2
C2
1
C1
C347
0.1u
C348
150p
SIM_CLKSIM_IO
SIM_RST
TP2 (#5)
2V9_SIM
TP1(#3)
SIM_CLK
TP3 (#6)
SIM_IO
Page 80
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 81 -
uSD Check Points
-Power is working
-Socket soldering
-Card detect is working
Card insert Card eject
TPTP4(D3D3
)
TPTP1(D0D0
)
TPTP2(D1D1
)
TPTP3(D2D2
)
START
TP2
TP1
TP4
TP3
Check All of SIM card voltage
KM380 Series support
1.8V & 2.9V SIM only
VIO_2V62
R231
100K
R232
1000 pF
uSD_D1
uSD_D0
uSD_CLK
uSD_CMD
uSD_D3
uSD_D2
uSD_DET
soldered well?
Check Proper
uSD CARD
56K
47K
56K
R233
R235
R234
C246C245
10p
6 pins are
Ye
SIM Card
Assemble
2V8_VMM
56K
47K
56K
R236
R237
C247
1u
S1 DM3AT-SF-PEJ
SWB
SWA
8
7
6
5
4
3
2
1
GND
N
Yes
Resolder pin
Replace Main
Board
Page 81
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 82 -
TP4 D3
TP1 D0
TP2 D1
TP3 D2
Check Micro SD card voltage
START
(2V8_VMME)
TF socket pins
are well soldered
Yes
Check proper
uSD?
Assemble
No
Yes
Resolder it
(check data line
uSD D0~D3 is 2.9V
)
Signal
Replace Main Board
Page 82
6.12 RF Troubleshooting
6.12.1 General Circuits Troubleshooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 83 -
Fig 1 Troubleshooting flowchart of general circuits
General Circuits
1. Set HP8960 as below
Active Cell(GPRS)
62ch, 5level (TCH)
62ch, -60dBm (BCH)
2. Establish Spectrum Analyzer
& Oscilloscope
Check
Power Circuit
YES
Check
DCXO Circuit
YES
Check
RF Switch Circuit
YES
General function is OK.
Page 83
- 84 -
6. Trouble shooting
6.12.2 Power circuit
√ Output voltage (=LDO output of U102)
- check LDO output voltage of U102
→ I.e. VRF1_2V85 (C122),
VRF2_1V5 (C115),
VRF3_2V85 (C117)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Power Circuit
Check Voltage of C122,
C115 & C117.
Is it co
rrect?
Power is OK.
See next part.
Replace PCB
NO
YES
Fig 2 Debugging flowchart of Power circuit
Fig 3 Power circuit (U102)
C122
C115
C117
VRF3_2V85
VRF3_2V85
VRF1_2V85
C112
M10
J8
VSS_MAIN_3
VSS_MAIN_4L8VSS_MAIN_5
VRF3_2V85
C113
0.1u
10n
W4
W5
F3
H2
V19
T3
K1
K4
VDDTX
VSS_EP
VSS_MS
VDDVCO
AGND_MS1
AGND_MS2
VDDP_EBU_1
VRF3_2V85
L102
L101
47nH
47nH
C108
C109
100p
22p
C119
C120
100p
VRF2_1V5
VSD2_1V8
VSD1_1V5
VBAT
R105
390K
4.7K
R110
R109
100K
TXHB
TXLB
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
0.1u
C126
C127
0.1uF
C128
0.1uF
0.1uF
H3
BAT_ID
RF_TEMP
LOAD
M0
J3
M1
G4
TP105
M2
H4
M7
G3
M8
J4
M9
F4
M10
W3
TX2
V3
TX1
W2
RX1
V1
RX1X
U1
RX2
T1
RX2X
R3
PABIAS
R4
C110
0.1u
L11
M11
VDD_MAIN_1
L9
M9
VDD_MAIN_2
VDD_MAIN_3
VDD_MAIN_4
C111
10n
L12
L10
VSS_MAIN_1
VSS_MAIN_2
VRF3_2V85
VAUDIO_2V5
L100
VVIB_2V8
47nH
C114
0.1u
V7
L1
T6
P4
W6
VDDRX
VDDXO
VDDMS
VDDDIG
VDDPLL
VDDTRX
VUSB_3V1
VBT_2V9
C100
C102
2.2u
1u
C105
2.2u
VIO_2V62
C592
1u
E1
D11
B7
D12
E3
E11
C10
A7
E2
C6
E12
VVIB
VLED
VAUX
VUSB
VMMC
VAUDIO
VSS_LDO1
VSS_AUDIO
VBAT_LDO1
VBAT_AUDIO
VBAT_BSW_USB_MMC
VBAT
C101
1u
0.47u
C103
VRF1_2V85
VRF3_2V85
C121
C117
1u
2.2u
B3
C7
D6
A3
A2
B4
A8
B8
B2
VIO
VSIM
VPLL
VRF1
VRF2B1VRF3
VSS_LDO2
VBAT_RF13
VBAT_LDO2
VDD_RF2PLL
C104 2.2u
C3
M2
VSSRF1
VSS_LDO3
C122
N2
VPLL_1V5
C107
1u
VBAT
1u
VSSRF2N3VSSRF3P2VSSRF4R2VSSRF5T2VSSRF6
VRF2_1V5
C115
1u
VSIM_2V9
C123
220n
U6
VSSRF7U2VSSRF8U3VSSRF9
V2
VSSRF10V4VSSRF11
V5
C124
1u
VSSRF12
VSSRF13V6VSSRF14
KDR331V
3
D100
C1060.1uF
VRTC_2V0
VRTC_2V0
C118
0.1uF
VBAT
M4
D7
A5
C8
VDD_REF
VDDCHARGE
CHARGE_UC_SCAN_IN1
A1
A19
NC1
VDD_FUSE_FS
E18
W19
NC2
NC3
VSS_RTC
W1
C4
C5
A4
CH_GATE
SENSE_IN1D5SENSE_IN2
CH_SOURCE
D18
2
1
C125
VDD_RTC
VCHG_OVP
VBUS_OVP
0.1u
EBU_AD0
EBU_AD1
EBU_AD2
EBU_AD3
EBU_AD4
EBU_AD5
EBU_AD6
EBU_AD7
EBU_AD8
EBU_AD9
EBU_AD10
EBU_AD11
EBU_AD12
EBU_AD13
R14
W18
V18
W17
T15
U14
V17
T14
R13
W16
V16
U12
W15
W14
V15
DATA(0:15)
TP101
Page 84
- 85 -
6. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6.12.3 DCXO circuit
√ The output voltage of X100 is 890mV
p-p.
DCXO Circuit
Replace X100
DCXO is OK.
See next part.
YES
Is the waveform of
TP(X100) similar to Fig6?
NO
Fig 4 Debugging flowchart of DCXO circuit
TP
Fig 5 DCXO circuit (X100)
Fig 6 Waveform of DCXO
4
1
26MHzX100
GND2
HOT1
NX3225SA
HOT2
GND1
3
2
SIM_IO
SIM_CLK
SIM_RST
U4
W7
W8
V10
U9
V9
U10
REFR
XOX
XO
CC_IO
CC_CLK
CC_RST
Page 85
- 86 -
6. Trouble shooting
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6.12.4 RF Switch (Mobile Switch) circuit
√ Part Description of RF Switch
SW500: Mobile Switch (RF S/W) Connector
U102: Baseband Processor including RF transceiver
√ Check point of RF S/W (Mobile S/W)
RF S/W Circuit
Is RF S/W short
between C591 &
R510
?
Replace
SW500
Check the next part
YES
NO
R510
C591
SW50
Fig 7 Debugging flowchart of RF S/W circuit
Fig 8 RF S/W circuit (U502)
C591
R510
C554
4.7p
11
20
VC1
VC2
U502
LSHS-C085FB
ANT
GND500
C536
DNI
15nH
L518
L519
GND501
C535
DNI
1nH
C591
100p
C537
DNI
SW500
RF-800
ANT
G2
RF
G1
C552
R510
0
C553
6.8p
6.8p
21NC19
10
12
9
GND2
GND3
GND1
GSM850_900_TX3GSM900RX_OUT1
GSM1800_1900_TX7GSM1900RX_OUT1
GSM850RX_OUT1
1
2
17
15
C546 DNI
DNIC545C544 DNI
L514
C555
4.7nH
4.7p
16
18
GND413GND514GND6
GND722GND823GND9
GSM900RX_OUT2
GSM1800RX_OUT1
GSM1800RX_OUT2
GSM850RX_OUT2
4
5
6
L515
4.7nH 3.9nH
24
GND10
GSM1900RX_OUT2
8
L516
DNIC547
L517
3.9nH
Page 86
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 87 -
6.13 RF Receiver path Troubleshooting
g
Fig 9 Troubleshooting flowchart of RF Receiver path
START
1. Set HP8960 as below
Active Cell (GPRS)
62ch, 5level (TCH)
62ch, -60dBm (BCH)
2. Establish Spectrum Analyzer
illoscope
& Osc
General Circuits
Trouble shootin
YES
Check
FEM Circuit
S
YE
After download S/W,
Calibrate it.
Page 87
6.13.1 FEM Circuit
√ Part Description of FEM
√ Check point of FEM
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 88 -
Application Mode VC1 VC2
EGSM Tx High Low
Rx Low Low
DCS1800 Tx Low High
PCS1900 Rx Low Low
Fig 10 Debugging flowchart of FEM circuit
Fig 11 FEM circuit (U502)
Control Signal of FEM
FEM Circuit
Check
Control signal of
FEM
YE
S
Check the next part
C522
47p
C523
47p
R509
0
R590
0
VC1
VC2
NO
R509
Replace
PCB
VC1
11
21NC19
20
10
12
9
VC2
GND2
GND3
GND413GND514GND6
GND1
U502
LSHS-C085FB
ANT
GSM850_900_TX3GSM900RX_OUT1
GSM1800_1900_TX7GSM1900RX_OUT1
GSM850RX_OUT1
GSM850RX_OUT2
1
2
17
15
24
16
18
GND722GND823GND9
GSM900RX_OUT2
GSM1800RX_OUT1
GSM1800RX_OUT2
4
5
6
8
GND10
GSM1900RX_OUT2
R590
U502
Page 88
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 89 -
√ When GSM band called, it must seem as below. (yellow is VC1, blue is VC2)
√ When D/PCS band called, it must seem as below. (yellow is VC1, blue is VC2)
Page 89
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 90 -
6.14 RF Transmitter path Troubleshooting
START
Check
Tra nsm itter Circuit
1. Set HP8960 as below
Active Cell (GPRS)
62ch, 5level (TCH)
62ch, -60dBm (BCH)
2. Establish Spectrum Analyzer
& Oscilloscope
Check
PAM Circuit
YES
YE
S
After download S/W,
Calibrate it.
General Circuits
Troubleshootin
g
YES
YES
Check
Control signal of
FE
M
Replace
PCB
Fig 12 Troubleshooting flowchart of RF Transmitter path
Page 90
6.14.1 Transmitter Circuit
√ Check point of PAM
- Transmitter output power (=C548, C543) is approximately 2dBm.
Fig 13 Transmitter circuit (U102)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 91 -
p
Transmitter Circuit
C548
Does Power
(C543 & C548)
seem like
about 2d
Bm?
YES
Check the next
GND25
27
GND24
28
GND23
29
GND22
30
GND21
31
GND20
32
GND19
33
GND18
34
GND17
35
36
9
10
11
12 5
13
14
15
16
U501
GND16
SKY77340
GSM_OUT
GND5
GND4
RSVD2
GND3
GND2
GND1
DCS_PCS_OUT
art
GND15
GND14
GND13
GND12
GND11
GND10
GND9
GND8
GND7
GND6
GSM_IN
VRAMP
VBATT
RSVD1
DCS_PCS_IN
MODE
EN
BS
NO
Check
U102
26
25
24
23
22
VSUPPLY
21
20
19
18
17
8
7
6
4
3
2
1
C539
DNI
C543 100p
C543
C540
DNI
47R591
R520 47
C548 100p
R523 47
47R522
PA_EN
TXLB
TX_RAMP
PA_BAND
TXHB
PA_MODE_2
C561
0.1u
C562
1u
C560
C563
39p
C565
C564
39p33 uF DNI
39p
39p
C572C566
39p
C567
DNI
C568
Page 91
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 92 -
6.15 PAM Circuit
√ PAM circuit contains as below
- Band select switching circuitry (BS) to select GSM (Logic 0) and DCS/PCS (Logic1).
- VRAMP controls the level of output power for GMSK modulation and shape of Tx burst.
- For GMSK operation, set the PA_EN input High, and PA_MODE2 low(0.5v)
X= don’t care
√ When EGSM band called, it must seem as below.
Operational status PA_EN PA_BAND PA_MODE2 TX_RAMP
Standby/PA off 0 X X X
Low Band GMSK Tx 1 0 0 Active
Low Band EDGE Tx 1 0 1 X
High Band GMSK Tx 1 1 0 Active
High band EDGE Tx 1 1 1 X
Fig 14 Debugging flowchart of PAM circuit
PAM Cir c uit
Is PAM
Control Signal
?
OK
YES
Is PAM Output
OK?
YES
Check the next part
NO
NO
Replace
PCB
Replace
PAM
Page 92
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 93 -
√ When D/PCS band called, it must seem as below.
TX_RAMP PA_ BAND PA _MO DE2
TX_RAMP
PA_BAND
PA_ MOD E2
Page 93
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. Trouble shooting
- 94 -
Fig 15 PAM circuit (U501)
C564
39p
C548 100p
1u
C562
0.1u
C561
R523 47
47R591
39p
C572C566
39p
C539
DNI
20
GND9
7
GSM_IN
9
GSM_OUT
1
MODE
4
RSVD1
RSVD2
12 5
VBATT
6
VRAMP
35
GND17
GND18
34
GND19
33
14
GND2
GND20
32
31
GND21
30
GND22
GND23
29
GND24
28
27
GND25
13
GND3
11
GND4
10
GND5
GND6
17
GND7
18
19
GND8
SKY77340
U501
3
BS
DCS_PCS_IN
2
16
DCS_PCS_OUT
8
EN
GND1
15
GND10
21
GND11
22
GND12
23
GND13
24
GND14
25
26
GND15
GND16
36
C567
DNI
DNI
C540
39p
C563
VSUPPLY
47R522
R520 47
C565
39p33 uF DNI
C568
C560
C543 100p
TX_RAMP
PA_BAND
PA_MODE_2
TXHB
TXLB
PA_EN
Page 94
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. Download & S/W upgrade
- 95 -
7. Download & S/W upgrade
7.1 Download program user guide
Reg file
Multi- Download start file
KM380
KM380
1.After “GSMULTI” folder copy, paste C:\
2. “MultiGSM.exe” execution file execute
Page 95
7.2 Multi-Download Program Setting(Model-Base)
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. Download & S/W upgrade
- 96 -
■ Multi-Download Program Execution
→→
Setting : Configuration
■ Setting Completed
■ Download speed :TI Model
→→
115200bps, ADI Model
→→
460800bps
■ Start COM:1, End COM:16
■ Frame:16
Download speed (bps )
Start Com port
Model DLL File (C:\GSMULTI\Model)
Phone Software select (mot,m0 file)
TI RAM Loader ( Only TI Model ,
End Com port
(C:\GSMULTI\Model )
Frame count select
Internal / External boot select (Only TI Model )
(External boot : G7000, G7030 )
After setting completed ìOKî BTN click
ADI Model : Donít care)
16port Setting
Default condition
KM380 KM380
"START " BTN Click
Page 96
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. Download & S/W upgrade
- 97 -
■ Stand-by Condition: “Wait phone connecting” confirm
→→
Phone connection
Page 97
- 98 -
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 98
- 99 -
8. CIRCUIT DIAGRAM
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
KDR331V
3
D100
A1
A19
W19
NC1
NC2
NC3
DSPOUT0
USART0_CTS_N
J5
K10
JACK_DET
MM_RESET
2
1
VRTC_2V0
C125
0.1u
D18
E18
VSS_RTC
VDD_RTC
BL1_PWM_VSENSE1
BL2_PWM
DSPIN0K5DSPIN1
H5
E10
D10
CLK32K
VIB_CTRL
KP_OUT(4)
LCD_BACKLIGHT_EN
9
VSS_FLASH
FLASH_SINK
BL3_PWM
E7
E6
E8
KEY_BL
KEY_BL_EN
VCHG_OVP
VBUS_OVP
EBU_AD10
EBU_AD11
EBU_AD12
EBU_AD13
EBU_AD14
EBU_AD15
EBU_WR_N
EBU_RD_N
EBU_BC0_N
EBU_BC1_N
EBU_CS0_N
EBU_CS1_N
EBU_CS2_N
EBU_CS3_N
EBU_ADV_N
EBU_RAS_N
EBU_CAS_N
EBU_WAIT_N
EBU_SDCLKO
EBU_SDCLKI
EBU_BFCLKO
EBU_BFCLKI
FCDP_RBN
PO_RESET_N_SCAN_OUT2
RESET2_N_VSENSE2
ON_OFF_SCAN_RESET
LPBCK_ECHO
E9
C9
D9
D8
DNI
C144
EBU_AD0
EBU_AD1
EBU_AD2
EBU_AD3
EBU_AD4
EBU_AD5
EBU_AD6
EBU_AD7
EBU_AD8
EBU_AD9
EBU_A0
EBU_A1
EBU_A2
EBU_A3
EBU_A4
EBU_A5
EBU_A6
EBU_A7
EBU_A8
EBU_A9
EBU_A10
EBU_A11
EBU_A12
EBU_A13
EBU_A14
EBU_A15
EBU_A16
EBU_A17
EBU_A18
EBU_A19
EBU_A20
EBU_A21
EBU_A22
EBU_A23
EBU_A24
EBU_CKE
OSC32K
RESET_N
A_GND
VREF1
VREF2
10
12 16
1311
14
15
BACKUP BATTERY
2V 0.5mAh
VRTC_2V0
4.7K
R104
BAT100
R14
TP101
W18
V18
W17
T15
U14
V17
T14
R13
W16
V16
U12
W15
W14
V15
W13
N18
P19
N19
P15
H19
J17
K16
G18
L16
J19
J16
K17
K18
L17
K15
L18
M16
J18
M18
N15
L15
L19
M15
M19
H18
R16
N17
T19
U17
R17
R19
T17
P18
R18
K19
N16
U18
U19
U15
P17
U16
T18
F18
E19
F32K
D19
F19
B5
IREF1
B6
A6
L3
L4
IREF2
C141
R122
22K
220n
DATA(0:15)
DATA(0:7)
_WR
_RD
_BC0
_BC1
ADD(0:24)
FLASH1_CS
SDRAM_CS
nCS1
_RAS
_CAS
SDCLKO
SDCLKI
CKE
FCDP
DNI
C138
C142
R123
1u
100K
PO_RESET
M_RESET
PWRON
M_RESET
nRESET
VSD2_1V8
FCDP
3.3K
R112
X101
12
32.768KHz
C139
18p
C140
18p
DATA(0:15)
TP514
SDRAM_CS
R107 22
SDCLKI
R108 22
TP518
SDCLKO
TP519
CKE
_WR
ADD(13)
ADD(14)
_RAS
_CAS
_BC0
_BC1
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
ADD(16)
ADD(17)
TP516
_RD
_WR
TRST_N
TDI
TMS
TCK
RTCK
TDO
_EXTRST
FLASH1_CS
3.3K
R111
R113
100
C132
22p
A2
A9
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
DATA(8)
DATA(9)
DATA(10)
DATA(11)
DATA(12)
DATA(13)
DATA(14)
DATA(15)
A10
B3
DNU1
DNU2
DQ0
C4
DQ1
C3
DQ2
D4
DQ3
D3
DQ4
E4
DQ5
E3
DQ6
F4
DQ7
J4
DQ8
K3
DQ9
K4
DQ10
L3
DQ11
L4
DQ12
M3
DQ13
M4
DQ14
N3
DQ15
E9
_CS
H4
CLK
G8
CKE
F8
_WED
D7
BA0
D8
BA1
E7
_RAS
F7
_CAS
G3
LDQM
H3
UDQM
J5
IO0
L5
IO1
J6
IO2
L6
IO3
J7
IO4
L7
IO5
J8
IO6
L8
IO7
C6
_CE
D5
ALE
C5
CLE
E5
_RE
E6
R__B
D6
_WE
F5
_WP
NC7
G4
G5
EXT_RESET
VIO_2V62
R118
_EXTRST
PO_RESET
ON BOARD ARM9 JTAG
VSD2_1V8
P2
B1
B10
N1
N10
P1
DNU3
DNU4
DNU5
DNU6
DNU7
DNU8
U100
K5D1G12ACE-D075
NC10
NC11
NC12J3NC13
NC8
NC9
H5
H6
K5
K6
G6
VRTC_2V0
100K
U101
1
3
CN100
G1 G2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
G3 G4
B2
B7
P9
P10
B9
F3
F6
NC1
NC2
NC3E8NC4
NC5
NC6
TP100
DNU11
NC16
NC17
M5
TC7SH08FS
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
C7
A0
C8
A1
C9
A2
B8
A3
M9
A4
L9
A5
K9
A6
J9
A7
H7
A8
H8
A9
D9
A10
H9
A11
G7
A12
B4
VDD1
G9
VDD2
H2
VDD3
M2
VDD4
D2
VDDQ1
F2
VDDQ2
K2
VDDQ3
C2
VSS1
F9
VSS2
G2
VSS3
N4
VSS4
E2
VSSQ1
J2
VSSQ2
VSD2_1V8
L2
VSSQ3
B6
VCC1
N7
VCC2
N6
VCCQ
B5
VSS5
N5
VSS6
N8
VSS7
NC18
NC19
NC20
NC21
NC22
N2
N9
M6
M7
M8
4
nRESET
2V8_VMM
MM_TRST_N
MM_TDI
MM_TMS
MM_TCK
MM_RTCK
MM_TDO
MM_RESET
DNU9
DNU10
NC14
NC15
K7
K8
5
VCC
GND
2
ADD(0)
ADD(1)
ADD(2)
ADD(3)
ADD(4)
ADD(5)
ADD(6)
ADD(7)
ADD(8)
ADD(9)
ADD(10)
ADD(11)
ADD(12)
C131
470n
VSD2_1V8
ADD(0:12)
VSD2_1V8
C129
C130
470n
220n
OJ100
A
B
C
D
E
F
C
D
OJ101
E
T6
VDDDIG
P4
L100
47nH
C114
0.1u
VDDMS
VRF3_2V85
V7
VDDXO
W6
VDDPLL
VVIB_2V8
L1
VDDRX
5
VAUDIO_2V5
C105
2.2u
E1
C100
2.2u
E2
VAUDIO
VBAT_AUDIO
VBT_2V9
E3
C10
VLED
VSS_AUDIO
VUSB_3V1
C101
1u
C121
1u
A8
C7
B4
D6
B8
A3
VIO
VSIM
VRF2B1VRF3
VPLL
VSS_LDO2
VBAT_LDO2
VBAT_BSW_USB_MMC
0.47u
C103
VRF3_2V85
B3
A2
VRF1
VDD_RF2PLL
C102
1u
VIO_2V62
C592
1u
B7
D12
D11
E11
C6
E12
A7
VVIB
VUSB
VAUX
VMMC
VSS_LDO1
VBAT_LDO1
VBAT
C104 2.2u
VRF1_2V85
C117
2.2u
B2
VBAT_RF13
C3
VSS_LDO3
M2
VSSRF1
76
VPLL_1V5
C107
1u
C122
1u
N2
VSSRF2N3VSSRF3P2VSSRF4R2VSSRF5T2VSSRF6
VBAT
VSSRF7U2VSSRF8U3VSSRF9
C115
1u
C123
220n
U6
VRF2_1V5
VSIM_2V9
V2
VSSRF10V4VSSRF11
U102
PMB8888
VSS_MONO
CIF_D3
CIF_D4
CIF_D5
CIF_D6
CIF_D7
CIF_HSYNC
CLKOUT2
KP_IN1
KP_IN2
KP_IN3
KP_IN4
CIF_PD_GPIO
CIF_RESET_GPIO
W11
W10
KP_IN5
A17
B16
B17
D17
B15
CIF_PCLK
CIF_VSYNC
T13
T11
V13
V12
V11
R11
R12
U11
W12
HS_N
EP_P
KP_OUT3
KP_IN6
KP_OUT0
KP_OUT1
KP_OUT2
F2
G2
D13
K12
C14
C15
D14
VBAT_MONO
MIC1_N
MIC1_P
MIC2_N
MIC2_P
HS_P
EP_CMK2EP_N
J1
J2
F1
K3
G1
MONO_INN
MONO_INP
MONO_OUTND3MONO_OUTP
I2S1_CLK0
VMIC
L2
H1
I2S1_RX
E4
D1
C1
C2
D2
J12
E14
D15
C119
100p
C126
0.1uF
UART_BT_RTS
UART_BT_CTS
CHG_EN
PA_MODE_2
HOOK_DET
R115 9.1K
R117 10K
SIM_IO
SIM_CLK
SIM_RST
VSD2_1V8
C137
10u
22u
C135
RF_TEMP
L104
10uH
C120
0.1u
C127
0.1uF
BAT_ID
LOAD
LCD_ID
2
VRF3_2V85
C108
22p
TP105
D102
C128
0.1uF
TP102
R120
KDS160E
3
VRF3_2V85
VRF3_2V85
L102
L101
47nH
47nH
C110
0.1u
L11
M11
VDD_MAIN_1
VDD_MAIN_2
DIF_D0
DIF_D1
E17
G15
L9
M9
VDD_MAIN_3
DIF_D2
C19
G17
C111
10n
L12
VSS_MAIN_1
VDD_MAIN_4
DIF_D3
DIF_D4
DIF_D5
C18
G16
C109
100p
H3
M0
J3
M1
G4
M2
H4
M7
G3
M8
J4
M9
F4
M10
W3
TX2
V3
TX1
W2
RX1
V1
RX1X
U1
RX2
T1
RX2X
R3
PABIAS
R4
PABS
R1
RX3
T5
VDET
U5
PAMODE
P1
RX3X
N4
FE1
P5
FE2
M3
PAEN
N1
RX4
P3
VRAMP
M1
RX4X
A18
T_OUT3
J10
T_OUT4
H11
T_OUT5
E13
T_OUT6
B19
T_OUT7
K9
T_OUT8
G19
CLKOUT0
U4
REFR
W7
XOX
W8
XO
V10
CC_IO
U9
CC_CLK
V9
CC_RST
U10
MMCI_CMD
R8
MMCI_DAT0
R10
MMCI_CLK
T9
MMCI_DAT1
R9
MMCI_DAT2
T10
MMCI_DAT3
T8
TDO
T7
TDI
U8
TMS
V8
TCK
W9
TRST_N
R6
RTCK
10K
N5
TRIG_IN
L5
MON1
M5
MON2
R7
FSYS3
U7
FSYS2
A14
VBAT_SD1
A15
VSD1
A13
SD1_FB
C11
SD2_SD1_SUBST
A12
VSS_SD1
A16
SD1_FBL
A11
VBAT_SD2
A10
VSD2
B9
SD2_FB
B10
SD2_FBL
A9
VSS_SD2
C12
SU_GATE
B14
SU_GND
B11
SU_FB
B13
SU_ISENSE
B12
VBAT_SU
C13
VSS_SU
L10
M10
VSS_MAIN_2
VSS_MAIN_3
DIF_D6
DIF_D7
F16
H15
0.1u
C112
J8
VSS_MAIN_4L8VSS_MAIN_5
DIF_CD
DIF_CS1
DIF_CS2
K8
C17
K11
VRF1_2V85
V19
F3
VDDP_EBU_1
DIF_RD
DIF_WR
J9
F15
H10
4
H2
K1
K4
VSS_EP
VSS_MS
AGND_MS1
DIF_HD
DIF_RESET2_GPIO
DIF_VD
F17
H16
VRF3_2V85
C113
10n
W4
AGND_MS2
V14
VDDTX
CIF_D0
W5
U13
T3
VDDVCO
CIF_D1
T12
VDDTRX
CIF_D2
1
A
B
VRF2_1V5
VSD2_1V8
VSD1_1V5
VBAT
C
R105
390K
4.7K
R110
R109
100K
TXHB
TXLB
GSM850_RXP
GSM850_RXN
GSM900_RXP
GSM900_RXN
PA_BAND
DCS1800_RXP
D
DCS1800_RXN
VC1
VC2
PA_EN
PCS1900_RXP
TX_RAMP
PCS1900_RXN
E
VBUS_OVP
26MHzX100
4
3
GND2
HOT2
2
1
GND1
HOT1
NX3225SA
RPWRON
uSD_DET_CTRL
LCD_RESET
VIO_2V62
BT_INT
FLIP_OPEN
HOLD
TDO
TDI
TMS
TCK
TRST_N
1K
RTCK
R119
VBAT
26MHZ_BT
L103
10uH
D101
KDS160E
C136
10u
F
VSD1_1V5
C
22u
C134
D
V5
I2S1_TX
J11
C124
1u
VSSRF12
VSSRF13V6VSSRF14
I2S1_WA0
W1
F5
I2C_SCL
G5
A4
CH_SOURCE
I2C_SDA
VBAT
C5
C16
8
C1060.1uF
D7
A5
C4
VDD_REF
CH_GATE
SENSE_IN1D5SENSE_IN2
USIF_TXD_MTSR
USB_DPLUS
USIF_RXD_MRST
USIF_SCLK
H9
P16
E16
M17
VRTC_2V0
C118
0.1uF
M4
C8
VDDCHARGE
VDD_FUSE_FS
CHARGE_UC_SCAN_IN1
USART0_RTS_N
USART0_RXD
USART0_TXD
USB_DMINUS
J15
B18
H17
E
UART
UT100
3G 2.5G
1
GND
GND
RX
2
RX
RX
3
TX
TX
TX
4
NC1
VCHAR
5
RPWON
ON_SW
ON_SW
6
VBAT
VBAT
7
NC2
PWR
8
NC3
URXD
9
NC4
UTXD
10
F
DSR
11
RTS
12
CTS
VCHG
UART_RX
UART_TX
RPWRON_EN
VSUPPLY
VBAT
DIF_D(0)
DIF_D(1)
DIF_D(2)
DIF_D(3)
DIF_D(4)
DIF_D(5)
DIF_D(6)
DIF_CS
DIF_D(7)
DIF_RS
EHI_INT
DIF_RD
DIF_WR
EOC
LCD_VSYNC
JACK_DET_3.5
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
CAM_PCLK
CAM_VS
CAM_HS
CAM_PD
CAM_RST
CAM_CLK
KP_IN(2)
KP_IN(3)
BT_RESET
KP_IN(4)
KP_IN(5)
KP_IN(6)
KP_OUT(0)
KP_OUT(1)
KP_OUT(2)
KP_OUT(3)
SPK_N
SPK_P
RCV_N
RCV_P
MIC_N
MIC_P
HS_MIC_P
HS_MIC_N
I2C_SDA
I2C_SCL
MICBIAS
VIO_2V62
2.2K
2.2K
I2S1_TX
R127
R126
I2S1_RX
I2S1_CLK
I2S1_WA0
UART_BT_TX
USB_BB_DP
UART_BT_RX
BT_VCXO_EN
USB_BB_DM
uSD_DET
UART_TX
UART_RX
1
2
3
4 6
5
7
8
9
Page 99
- 100 -
8. CIRCUIT DIAGRAM
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1
2
VSD2_1V8
VBAT
2V8_DAC
2V8_DAC
A
C213
1u
CODEC_MCLK
CODEC_BCLK
CODEC_DIN
CODEC_DOUT
CODEC_LRC
R524
C215
0
0.1u
B
DNI
SPK_N
FM_SND_L
SPK_N
FM_SND_R
SPK_P
SPK_P
I2C_SCL
I2C_SDA
C220
C221
C223
C224 1u
C225
1u
1uC222
1u
DNI
C
C212
4.7u
R214
100K
C209
2.2u
A6
AVDD
A5
HPVDD
B2
SPKVDD
F6
DCVDD
G6
DBVDD
F5
MCLK
G5
BCLK
F4
DNC
F3
DACDAT
G4
DACLRC
E4
GPIO1
G2
GPIO3_BCLK2
G3
GPIO4_DACLRC2
G1
GPIO5_DACDAT2
D3
LIN1
C5
LIN2
C6
LIN3_GPI7
B6
LIN4_RXN
D5
RIN3_GPI8
E5
RIN4_RXP
D4
RIN1
D6
RIN2
F2
CSB_ADDR
F1
SCLK
E3
SDIN
E2
MODE
C210
2.2u
C211
0.1u
SUB PMIC
VBAT
VBAT
VBAT
VBAT
VBAT
C236
C235
C234
1u
1u
1u
D
VBT_2V9
I2C_SCL
I2C_SDA
R229
R230
100K
DNI
B4
A5
B3
EN_LDO1
A3
EN_LDO2
D4
EN_SW1
D2
EN_SW2
C4
EN_T
B2
SCL
C2
SDA
VIN_LDO2
VIN_LDO12_1B5VIN_LDO12_2
LP3907TLX
GND_SW1C5GND_SW2
C1
E
E3
U204
AVDD
A1
VIN_LDO1
GND_C
D3
B1
GND_L
E5
VIN1E1VIN2
SW1
FB1
SW2
FB2
LDO1
LDO2
NPOR
3 6 10
4
Stereo DAC & AMPStereo DAC & AMP
WM8959U201
B3
HPGND
A3
AGND
E6
DGND
SPKGND
VMID
MICBIAS
LOP
LON
LOUT
ROUT
OUT3
OUT4
SPKP
SPKN
ROP
RON
VBAT
1u
1u
C230
C231
L202
2.2uH
D5
E4
2.2uHL203
D1
E2
C241
10u
A2
A4
C3
C243
C244
470n
470n
C216
C238
1u
C226
C217
2.2u
0.1u
C218 100u
HSO_3.5_VMID
SPK_AMPP
SPK_AMPN
C227
47p
47p
100uC219
R525
HSO_3.5_L
HSO_3.5_R
HSO_R
HSO_L
10K
10K
R526
B1
C3
A2
D1
TP200
C2
L200
100nH
B4
B5
L201
100nH
A4
C4
A1
C1
TP
E1
D2
VBAT
C237
1u
1V2_VMM
2V8_DAC
C242
10u
3V3_VMM
2V8_VMM
uSD_DET
uSD_D1
uSD_D0
uSD_CLK
uSD_CMD
uSD_D3
uSD_D2
VIO_2V62
R231
5
VSD2_1V8
150
R201
2V8_VMM
MM_RESET
uSD CARD
56K
100K
R232
C245
1000 pF
2V8_VMM
3V3_VMM
U200
1
B1
2
GND
3
B0
NLAS4157DFT2G
R204
47K
R213 10K
USB_MM_DP
USB_MM_DM
R215 1.5K
1% Resistor
1.5K
R216
56K
R234
R233
C246
10p
VCC
47K
6
S
5
4
A
R203
R211 47K
TP206
R220
100
C232
15p
R235
R200
100K
47KR212
47K
1V2_VMM
R236
47KR202
47K
47KR205
47KR206
3V3_VMM
56K
A13
B13
M14
L14
L11
R237
C214
0.1u
A9
D8
B9
G5
A8
B8
A7
D6
H4
A6
B5
G4
B4
H2
G2
A5
B6
A4
D4
D2
B3
D1
K6
C200
220n
E6
E7
F5
E5
J4
F2
E2
P8
P1
P2
J1
GPIO_C0
GPIO_C1
GPIO_C2
GPIO_C3
GPIO_C4
GPIO_C5
GPIO_C6
GPIO_C7
GPIO_C8
GPIO_C9
GPIO_C10
GPIO_C11
GPIO_C12
GPIO_C13
GPIO_C14
GPIO_C15
GPIO_C16
GPIO_C17
GPIO_C18
GPIO_C19
GPIO_C20
GPIO_C21
GPIO_C22
GPIO_C23
GPIO_C24
GPIO_C25
GPIO_C26
GPIO_C27
GPIO_C28
BPEN
WKUP
NRESET
SDR_CKE
SDR_CKO
SDR_CSI
USB_DP
USB_DM
U_REXT
U_ATEST
C228
1800p
2V8_VMM
56K
C201
220n
C247
1u
C202
0.1u
P7
K10
K14
P5
VDD_RTC
VDDA_ADC
VDDAT_USB
C229
1800p
R224
3.9K
C239
S1 DM3AT-SF-PEJ
SWA
8
7
6
5
4
3
2
1
F13
P14
D10
VDD_GPA
VDD_GPB
VDDAC_USB
ADIN0
L1
N4
8p
SWB
GND
J2
VDD_MEM
VDD_GPCD
XI
ADIN1
J14
789
1V2_VMM
L7
M1
VDD_CO5
C204
2.2u
H5
N10
J10
VDDD_USB
VDDQ_SDR
VDDAD_PLL
C205
22n
M13
N3
VDD_SDR
VSSA_ADC
L13
G11
P13
VSS_GPA
VSSAT_USB
VSSAC_USB
D9
K2
VSS_GPB
VSS_GPCD
C206
2.2u
D5
E4
VSS_CO1
VSS_CO2
VSS_MEM
H1
C203
2.2u 220n
K1
K11
B7
VDD_CO4
VDD_CO1D7VDD_CO2
VDD_CO3
U202
TCC8720
TEST
XON7XTIN
XTOUT
FILTER0
FILTER1
L6
P6
N6
H14
X200
12
DSX321G(12MHz,8PF)
12MHz
A12
R222
GPIO_B0L8GPIO_B1
P9
4.7K
34
GPIO_B2
L5
N8
C240
GPIO_B3N2GPIO_B4P3GPIO_B5
GPIO_B6
P4
8p
GPIO_B7K5GPIO_B8
N1
K7
TP209
GPIO_B9
GPIO_B10
L9
N9
TP207
GPIO_B11
K8
C207
220n
L2
L4
VSS_CO3
VSS_CO4
GPIO_B12
GPIO_B13
L10
P10
USB_BB_DM
USB_BB_DP
C208
M2
N5
VSS_CO5
VSSD_PLL
GPIO_B14
GPIO_B15
P11
USB_DP
USB_DM
VVIB_2V8
N14
G10
F4
VSS_SDR
VSSQ_SDR
GPIO_B18
GPIO_B19
N11
N12
GPIO_B20
N13
GPIO_A0
GPIO_A1
GPIO_A2
GPIO_A3
GPIO_A4
GPIO_A5
GPIO_A6
GPIO_A7
GPIO_A8
GPIO_A9
GPIO_A10
GPIO_A11
GPIO_A12
GPIO_A13
GPIO_A14
GPIO_A15
GPIO_A16
GPIO_A17
GPIO_A18
GPIO_A19
GPIO_A20
GPIO_A21
GPIO_A22
GPIO_A23
GPIO_D0
GPIO_D1
GPIO_D2
GPIO_D3
GPIO_D4
GPIO_D5
GPIO_D6
GPIO_D7
GPIO_D8
GPIO_D9
GPIO_D10
TCK
TMS
TDO
RTCK
NTRST
CODEC_DIN
CODEC_DOUT
CODEC_MCLK
CODEC_LRC
CODEC_BCLK
VSSA_PLL
VSSD_USB
GPIO_B16K9GPIO_B17
P12
USB SWITCH
R227 22
R228 22
J11
DATA(0)
K13
DATA(1)
K4
DATA(2)
J5
DATA(3)
J13
DATA(4)
H11
DATA(5)
H10
DATA(6)
H13
DATA(7)
G14
DATA(8)
G13
DATA(9)
F11
DATA(10)
F14
DATA(11)
E11
DATA(12)
F10
DATA(13)
E14
DATA(14)
E13
DATA(15)
E9
E10
D14
B11
TP203
D13
B12
C13
C14
A3
A1
B2
B1
C1
C2
F1
E1
A14
B14
G1
TP521
B10
TDI
D11
A11
A2
A10
E8
1K
U503
NLAS7222C
1
D+
2
D-
VCC
3
GND
_OE
4
HSD1+
HSD2-
5
HSD1-
HSD2+
EUSY0362701(NLAS7222C)
R217
S
R209
ADD(4)
nCS1
_WR
VUSB_3V1
10
9
8
7
6
C569
0.1u
VSD2_1V8
47K
DATA(0:15)
R210
47K
uSD_D0
uSD_D1
uSD_D2
uSD_D3
uSD_CLK
uSD_CMD
uSD_DET_CTRL
MM_TDI
MM_TCK
MM_TMS
MM_TDO
MM_RTCK
MM_TRST_N
USB_SEL
EHI_INT
_RD
VSD2_1V8
R226
R529
100K
DNI
R219
120K
USB_SEL
USB_MM_DP
USB_MM_DM
A
B
100KR218
VBUS_USB
C
D
1 4
23
5
Page 100
- 101 -
8. CIRCUIT DIAGRAM
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
VSUPPLY
FB301
FB302
FB303
FB304
FB305
L300
100nH
CN301
15
C300
24p
21
19
1
2
3
2 : Headset MIC
4
4 : HSO_L
5
5 : HSO_R
6
6 : USB+
7
7 : USB-
8
8 : JACK_D
9
10
9,10 : BATT
11
11 : R/ON
12
13
12,13 : CHG
14
14 : DSR
15
15 : VUSB
16
16 : D/ TX
17
17 : D/ RX
18
20
22
A
FM_ANT
B
C
D
E
F
A
1
B
VBT_2V9
2
2V8_CAM_DVDD
VBAT
U300
100K
R304
C307
1u
RT9011-MGPQW
1
VIN8VOUT1
2
EN1
3
EN2
4
NC1
1V8_CAM
7
VOUT2
6
NC2
C308
5
PGND
GND
9
1u
C
32
31
30
29
28
27
26
D
2V8_CAM_DVDD
E
1V8_CAM
C327
0.1u
CAM_D(0)
CAM_D(1)
CAM_D(2)
CAM_D(3)
CAM_D(4)
CAM_D(5)
CAM_D(6)
CAM_D(7)
2V8_CAM_AVDD
C328
0.1u
TP300
22
D0
23
D1
24
D2
1
D3
2
D4
3
D5
4
D6
5
D7
FB306
C329
0.1u
25
PGND1
PGND2
PGND3
PGND4
PGND5
PGND6
PGND7
PGND8
20
PCLK
19
VSYNC
18
HSYNC
AGND16AGND2
17
12
STANDBY
11
SCK
10
SDA
9
RESETB
7
MCLK
C322
DVDD
VDDIO
AVDD
10p
13
14
16
U302
DGND1
DGND2
DGND3
8
15
21
2V8_CAM_AVDD
FB300
C309
1u
R315 100ohm
C323
0.1u
4
5
6
1
234
CN300
7
Battery Connector & Current Monitor
VSUPPLY
C577
100p
R305
47mohm
R309
1K
VBAT
BAT_ID
C315
100p
C574
C576
2.2u
100p
U301
ZXCT1010E5TA
5
LOAD NC
4
VIN
83
1
2
GND
3
IOUT
C310
1u
LOAD
2.2K
R310
10
HOOK_DET
HS_MIC_N
HS_MIC_P
C311
27p
OVP CHARGING IC
CAM_PCLK
TP301
CAM_VS
TP302
CAM_HS
CAM_PD
I2C_SCL
I2C_SDA
R316
CAM_RST
CAM_CLK
100
C325
C324
15p
10p
CHG_EN
VIO_2V62
EOC
VCHG
VBUS_USB
100K
R317
TP515
5.6K
R318
(1%)
U303 ISL9221
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
VDC_BYP
USB_BYP
13
PGND
12
11
BAT
10
9
IVDC
8
GND
7
IUSB
R320
(1%)
VBAT
VBUS_OVP
VCHG_OVP
R319
33K
C332
0.1uF
16K
R596
DNI
C334
C333
0.1u
0.1u
119
VAUDIO_2V5
C301
100p
C304
0.1u
C305
0.1u
C312
27p
VIO_2V62
R301
100ohm
R303
R306
2.2K
C306
10u
12
100K
R300
C302
18K
4.7u
R302
C303
24p
100nHL301
C313
100p
USB_DP
USB_DM
JACK_DET
RPWRON_EN
UART_TX
UART_RX
24pC316
HSO_L
HSO_R
C321 24p
L303 100nH
100nHL302
VA305
47R313
47R314
VA306
VBUS_USB
13
10K
R311
47
VA300
VA302
VA301
C326
1u
14
R308
ICVS0505500FR
VCHG
VA304
VA408
ICVS0505500FR
C319
1u
VA407
VIO_2V621.5K
R307
100K
VA303
F
3.5phi HEADSET
VIO_2V62
R321
100K
C343
47p
L308 100nH
L511
100nHL508
100nH
R528
C345
100nH
100nH
C
MAIN RECEIVER
RCV_P
RCV_N
C570
C571
47p 47p
47p
C338
C339
47p
Close to U102
D
VA307
ICVN0505X150FR
L309 100nH
VA308
ICVN0505X150FR
100nHL306
OUT300
OUT301
VSIM_2V9
R325
10K
J301
8
9
GND3
GND2
7
10
GND1
GND4
3
6
C3
C7
2
5
C2
C6
1
4
C1
C5
C346
22p
SIM_CLKSIM_IO
SIM_RST
C347
C348
0.1u
150p
JACK_DET_3.5
HSO_3.5_L
HSO_3.5_R
HSO_3.5_VMID
C342
47p
3.5phi
C
J302
7620-3_5G-DB1-A
L510
100nH
L312
100nH
C344 1000p
L509
100nH
24p
L313
C594
47p
FM_ANT
D
SPK
E
SPK_AMPP
SPK_AMPN
F
1
L314 56nH
C349
100p
C350
47p
56nHL315
C351
EVLC18S02015
47p
3
VA310
EVLC18S02015
VA309
CN302
2
1
VIBRATOR
U304
R327
VIB_CTRL
4
5
67
SUY98005LT1G
1
VIN
1K
VOUT
R329
2
GND
100K
L316
R328
3
100nH
10
82
VBAT
VB300
1
+
2
C593
CN303
C352
0.1u
2.2u
-
1u
9
E
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