LG MG295, MG296, KG296 Service Manual

Service Manual
Model : MG295/MG296/KG296
Service Manual
MG295/MG296/KG296
Date: October, 2007 / Issue 1.0
Internal Use Only
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1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. PERFORMANCE...............................9
2.1 H/W Features...........................................9
2.2 Technical Specification ..........................10
3. TECHNICAL BRIEF ........................15
3.1 Power Amplifier (SKY77318, U502).......15
3.2 Transceiver (AD6548, U503) .................17
3.3 FEM for Triband(FL501) ........................19
3.4 26 MHz Clock (Crystal, X501)................20
3.5 Baseband Processor (AD6721 , U103)..21
3.6 Display and Interface .............................27
3.7 Camera Interface(AIT813G , U402).......29
3.8 Keypad Switches and Scanning ............31
3.9 Microphone ............................................32
3.10 Main Speaker.......................................33
3.11 Headset Interface.................................34
3.12 Key Back-light Illumination...................35
3.13 LCD Back-light Illumination..................36
3.14 VIBRATOR...........................................36
3.15 BLUETOOTH & FM Radio
(BCM2048, U600) ................................37
3.16 Battery Charging ..................................38
4. TROUBLE SHOOTING ...................39
4.1 RF Component.......................................39
4.2 RX Trouble.............................................40
4.3 TX Trouble .............................................45
4.4 Power On Trouble..................................51
4.5 Charging Trouble ...................................53
4.6 Vibrator Trouble .....................................55
4.7 LCD Trouble...........................................57
4.8 Camera Trouble .....................................60
4.9 Speaker Trouble ....................................63
4.10 SIM Card Interface Trouble..................65
4.11 Earphone Trouble ................................67
4.12 KEY backlight Trouble .........................69
4.13 Receiver Trouble..................................71
4.14 Microphone Trouble .............................73
4.15 RTC Trouble ........................................75
4.16 Folder on/off Trouble............................77
4.17 Micro SD Trouble .................................79
4.18 Bluetooth & FM Radio Trouble.............81
5. DOWNLOAD.......................................84
5.1 Download ...............................................84
6. CIRCUIT DIAGRAM ........................91
7. BGA IC Pin Check ........................101
8. PCB LAYOUT................................105
9. BLOCK DIAGRAM ........................109
10. ENGINEERING MODE ................110
10.1 BB Test [MENU 1]..............................111
10.2 RF Test [MENU 2]..............................113
10.3 MF mode [MENU 3] ...........................113
10.4 Trace option [MENU 4] ......................114
10.5 Call timer [MENU 5] ...........................114
10.6 Fact. Reset [MENU 6] ........................114
10.7 S/W version........................................114
11. STAND ALONE TEST .................115
11.1 Introduction ........................................115
11.2 Setting Method...................................115
11.3 Means of Test ....................................116
12. AUTO CALIBRATION..................118
12.1 Overview ............................................118
12.2 Equipment List ...................................118
12.3 Test Jig Operation..............................119
12.4 Procedure ..........................................120
12.5 AGC ...................................................122
12.6 APC....................................................122
12.7 ADC ...................................................122
13. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 123
13.1 Exploded View .................................. 123
13.2 Replacement Parts ............................125
13.3 Accessory ......................................... 144
Table Of Contents
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
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1. INTRODUCTION
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
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2. PERFORMANCE
2.1 H/W Features
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion, 3.7V 830mAh
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 2.5 hours
RX Sensitivity GSM850: -102dBm, DCS: -102dBm, PCS: -102dBm
TX output power
GSM, EGSM: 32.5dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V,1.8V Small
Display
MAIN : TFT 128 x 160 pixel 262K Color
SUB : CSTN 96*64 pixel 65K Color
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key
Status Indicator
Menu Key, Clear Key, Back Key, Confirm Key
Send Key, Volume Key, PWR Key, Camera Key, Hot Key
ANT Internal
EAR Phone Jack Yes (Stereo)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver One way speaker
Travel Adapter Yes
MIDI SW MIDI (Mono SPK)
Camera 1.3M
Bluetooth / FM Radio Bluetooth version 2.0+EDR / 76~108MHz supported
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2. PERFORMANCE
2.2 Technical Specification
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM
TX: 890 + n x 0.2 MHz RX: 935 + n x 0.2 MHz (n=1~124)
PCS
1Frequency Band TX: 1850 + (n-512) x 0.2 MHz
RX: 1930+ (n-1512) x 0.2 MHz (n=512~810)
DCS
TX: 1710 + (n-512) x 0.2 MHz RX: 1805 + (n-512) x 0.2 MHz (n=512~885)
2 Phase Error
RMS < 5 degrees Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS/PCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS/PCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
PCS
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM, EGSM
8 Bit Error Ratio
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-102 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Current
Fast Charge : < 600 mA Slow Charge : < 120 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0~ -105 dBm
Battery Bar Number Voltage
0 3.56V 0.05 V
23 Battery Indicator 1 3.66V 0.05 V
2 3.74V 0.05 V
3 3.85V 0.05 V
4 3.86V 0.05 V ~
24 Low Voltage Warning
3.56 0.05 V (Call) every 1 minutes
3.50 0.05 V (Standby)
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
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Item Description Specification
25 Forced shut down Voltage 3.35 0.03V
1 Li-ion Battery
26 Battery Type
Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 830mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.1 V, 700 mA
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3. TECHNICAL BRIEF
3.1 Power Amplifier (SKY77318, U502)
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic over mold. RF input and output ports of the SKY77318 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains band-select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In Figure 3.1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC™) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
Figure 3.1 Functional Block Diagram
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SKY77318 PAM Pin Configuration-20-Pin
Leadless (Top View)
Typical Case Makings
Table 4. SKY77318 Pin Names and Signal Descriptions
Pin Mame Description
1BSBand Select
2 VCC1A VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC)
3 DCS/PCS IN RF input 1710-1910 MHz (DCS1800, PCS1900)
4 GND IN RF input 880-915 MHz (GSM)
5 GND RF and DC Ground
6 VCC1B RF and DC Ground
7 GND RF and DC Ground
8 GND RF and DC Ground
9 GND RF and DC Ground
10 GND RF and DC Ground
11 GSM OUT RF Output 880-915 MHz (GSM)
12 GND RF and DC Ground
13 GND RF and DC Ground
14 GND RF and DC Ground
15 DCS/PCS_OUT RF Output 1710-1910 MHz (DCS 1800, PCS1900)
16 GND RF and DC Ground
17 VBATT Battery input to high side of intemal sense resistor
18 ENABLE BiCMOS Enable
19 RSVD(GND) RF and DC Ground
20 VAPC Power Control Bias Voltage
GND PAD GND Ground Pad, device underside
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3. TECHNICAL BRIEF
LGE Internal Use Only
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3.2 Transceiver (AD6548, U503)
The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip, all radio and power management functions necessary to build the most com-pact GSM radio solution possible. The only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family. For Quad band applications the front end features four fully integrated programmable gain differential LNAs. The RF is then down converted by quad-rature mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the baseband analog processor. The Receive path features automatic calibration and tracking to remove DC offsets. The transmitter features a translation-loop architecture for directly modulating baseband signals onto the integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removing the need for external SAW filters prior to the PA. The AD6548 uses a single integrated LO VCO for both the receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and including class 12. AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to be replaced with a low cost crystal. No other external components are required. The AD6548 uses the traditional VCTCXO reference source. The AD6548 also contains on-chip low dropout voltage regulators (LDOs) to deliver regulated supply voltages to the functions on chip, with a battery input voltage of between
2.9V and 5.5V. Comprehensive power down options are included to minimize power consumption in normal use. A standard 3 wire serial interface is used to program the IC. The interface features low-voltage digital interface buffers compatible with logic levels from 1.6V to 2.9V.
Figure 3.2 AD6548 Block Diagram
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3. TECHNICAL BRIEF
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Notes:
1. Supply regulated by internal LDO3 and should not be connected to any other supply
2. Internally connected as Synth supply (Counters + SDM + Charge pump)
3. Supply regulated by internal LDO2 and should not be connected to any other supply
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
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3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.3 FEM for Triband(FL501)
Table 3.3.1 Band SW Logic Table
Figure 3.3.1 FEM CIRCUIT DIAGRAM
2V75_VVCXO
0.1u
C534
9
GND5
GND6
10
GND7
11
23
GND8
24
GND9
19
GSM_RX+
13
PCS_RX+
PCS_RX-
12
6
TX1G
8
TX2G
22
VCTRL1
VCTRL2
21
VCTRL3
20
VDD
3
ANT
1
15
DCS_RX+
DCS_RX-
14 17
EGSM_RX+
EGSM_RX-
16
GMS_RX-
18
2
GND1
GND10
25
26
GND11
4
GND2
5
GND3
7
GND4
FL501
YGHF-S006A
Select Mode ANT_SW1 ANT_SW2 ANT_SW3
GSM Rx L H H
EGSM Rx L H L
DCS Rx L L H
PCS Rx L L L
GSM/EGSM Tx H L L
DCS/PCS Tx H H L
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3. TECHNICAL BRIEF
3.4 26 MHz Clock (Crystal, X501)
The 26 MHz clock (X501) consists of a XO( Crystal Oscillator) which oscillates at a frequency of 26 MHz. The AD6548 requires only an external low cost crystal as the frequency reference. The circuitry to oscillate the crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the crystal to be connected across 2 pins. There is a programmable capacitor array included for coarse tuning of fixed offsets (e.g. crystal manufacturing tolerance), and an integrated varactor for dynamic control. The oscillator is designed for use with a 26MHz crystal. Dedicated control software ensures excellent frequency stability under all circumstances.
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26MHz
X501
FA-23H
12
34
Figure 3.4 CRYSTAL CIRCUIT DIAGRAM
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3. TECHNICAL BRIEF
3.5 Baseband Processor (AD6721 , U103)
• AD6721 is an ADI designed processor
• AD6721 consists of
1. Control Processor Subsystem including:
• 32-bit MCU ARM7TDMI® Control Processor
• 65 MHz operation at 1.8V
• 2Mb of on-chip System SRAM Memory
2. DSP Subsystem including:
• 16-bit Fixed Point DSP Processor
• 91 MIPS[1] at 1.8V
• Data and Program SRAM
• Program Instruction Cache
• Full Rate, Enhanced Full Rate and Half Rate
• Speech Encoding/Decoding
• Capable of Supporting AMR & PDC Speech Algorithms
3. Peripheral Functions
• Parallel and Serial Display Interface
• USB 2.0 Full Speed device Interface
• Keypad Interface
• Flash Memory Interface
• Page-Mode Flash Support
• 1.8V and 3.0V, 64 kbps SIM Interface
• Universal System Connector Interface
• Data Services Interface
• Battery Interface (e.g. Dallas)
4. Other
• Supports 13 MHz and 26 MHz Input Clocks
• 1.8V Typical Core Operating Voltages
• 361-Ball Package (13x13mm) , 0.65mm Ball pitch
5. The AD6721 baseband transmit section supports the following mobile station GMSK modulation power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2
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- 22 -
3. TECHNICAL BRIEF
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Figure 3.5 SYSTEM INTERCONECTION OF AD6721 EXTERNAL INTERFACE
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3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL The X-TAL oscillates 32.768KHz
B. LCD module interface
The LCD module is controlled by Mobile Media Processor AIT813 If AIT813 is in the state of by-pass mode, the LCD control signals from AD6721 are by-passed through AIT813. In operating mode, the AIT813 controls the LCD module through L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, L_DATA[15-00], 2V8_MV, LCD_IF, LCD_ID.
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Signals Description
L_MAIN_LCD_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
L_SUB_LCD_CS SUB LCD driver chip enable. SUB LCD driver IC has own CS pin
LCD_ID Select LCD module maker(2.8V : SHARP, 0V : LGIT)
LCD_RESET This pin resets LCD module. This signal comes from AD6721 directly.
LCD_WR Enable writing to LCD Driver.
LCD_RD Enable reading to LCD Driver.
LCD_RS
This pin determines whether the data to LCD module are display data or
control data. LCD_RS can select 16 bit parallel bus.
2V8_CAM 2.8V voltage is supplied to LCD driver IC.
IF_MODE Select 16bits or 8bits interface mode for MAIN LCD. For the future
Table 3.5.B LCD CONTRON SIGNALS DISCRIPTION
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3. TECHNICAL BRIEF
The backlight of LCD module is controlled by AD6721 via AAT3155. The control signals related to Backlight LED are given bellow.
C. RF interface
The AD6721 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON , PA_EN, S_EN, S_DATA, S_CLK
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Signals Description
MLED Current source for backlight LED
LCD_DIM_CTRL Control LCD backlight level in 16 steps
MLED[1:4] This pins are returned-paths for backlight LED current source (MLED)
Table 3.5.B2 DESCRIPTION OF LCD BACKLIGHT LED CONTROL
Signals Description
PA_BAND (GPO 17) PAM Band Select
ANT_SW1 (GPO 9) Antenna switch Band Select
ANT_SW2 (GPO 10) Antenna switch Band Select
PA_EN (GPO 16) PAM Enable/Disable
S_EN (GPO 19) PLL Enable/Disable
S_DATA (GPO 20) Serial Data to PLL
S_CLK (GPO 21) Clock to PLL
Table 3.5.C RF CONTROL SIGNALS DESCRIPTION
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3. TECHNICAL BRIEF
D. SIM interface
The AD6721 provides SIM Interface Module. The AD6721 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-5 in detail.
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Signals Description
SIM_DATA
This pin receives and sends data to SIM card.
This model can support 3.0 volt and 1.8 volt interface SIM card.
SIM_CLK Clock 3.25MHz frequency.
SIM_RST
Reset SIM block
(GPIO_23)
Table 3.5.D SIM CONTROL SIGNALS DESCRIPTION
Figure 3.5.D2 SIM Interface of AD6721
SIM CONNECTOR
(KDS, 1.6T)
2V85_VSIM2V85_VSIM
C227
NA
15K
R226
NAC228
220nC226
3
CLK
4
GND
I_O
6
2
RST
VCC
1
VPP
5
J202
C229 1000p
SIM_RST SIM_CLKSIM_DATA
- 26 -
3. TECHNICAL BRIEF
E. LDO Block
There are 9 LDOs in the AD6721.
- 1V8_VCORE : supplies Digital baseband Processor core and AD6721 digital core(1.8V, 80mA)
- 2V8_VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (2.8V, 150mA)
- 2V8_VEXT : supplies Radio digital interface and high voltage interface (2.8V, 200mA)
- 2V85_VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (2.85V,1.8V, 20mA)
- 1V8_VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)
- 2V5_VMIC : supplies the microphone interface circuitry (2.5 V, 2 mA)
- 2V75_VVCXO: supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
- VUSB:supplies USB interface circuitry( 3.2V, 20mA)
- VGP: supplies VDD_IO3 of MMP(3.2V, 40mA)
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.6 Display and Interface
• Main LCD
• Sub LCD
Controlled by L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, LCD_IF, L_DATA[00:15] ports
• L_MAIN_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
• LCD_RESET : This pin resets LCD module. This signal comes from AD6721 directly.
• LCD_RS: This pin determines whether the data to LCD module are display data or control data.
• LCD_WR : Write control Signal
• LCD_RD : Read control Signal. But this pin used only for debugging.
• L_DATA[00:15] : Parallel data lines.
• LCD_ID : LCD type selection signals
- LCD_ID : LCD maker(0V for LGIT, 2.8V for Sharp)
• For using 262K color, data buses should be 16 bits.
Properties Spec. Unit
Active Screen Size 33.8mm(W) x 46.24mm(H) mm
Color Depth 262K TFT colors
Resolution 128 X RGB X 160 dots
Properties Spec. Unit
Active Screen Size 18.902mm(W) x 13.43mm(H) mm
Color Depth 65K CSTN colors
Resolution 96 X 64 dots
- 28 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
96x64 SUB CSTN
(60pin, SOCKET, 1T, 0.4mm)
128x160 MAIN TFT LCD
CONNECTOR(60Pin)
1.3M CAMERA
EVLC5S0250
VA701
G2
10
1
INOUT_A1
2
INOUT_A2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
INOUT_B3
7
INOUT_B4
6
2V8_AVDD
FL707
ICVE10184E150R500FR
5
G1
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
2V8_MV
FL708
ICVE10184E150R500FR
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
5
50
51
52
53
54
55
56
57
58
59
6
60
7 8 9
35
36
37
38
39
4
40
41
42
43
44
45
46
47
48
49
20 21 22 23 24 25 26 27 28 29
3
30 31
32
33
34
1
10 11 12 13 14 15 16 17 18 19
2
G15G2
10
INOUT_A1
1
INOUT_A2
2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
CN700
2V8_DOVDD
FL700
ICVE10184E150R101FR
FL706
ICVE10184E150R500FR
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
R701 4.7K
VA702
EVLC5S0250
4.7KR700
5
G110G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
4
INOUT_A4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
ICVE10184E150R101FR
FL703
1uC706
C707 1u
C705 1u
1V8_DVDD2V8_DOVDD
C704 1u
VA700
ICVN0505X150FR
FL705
ICVE10184E150R101FR
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
3
INOUT_A4
4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
2
INOUT_A2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
FL704
ICVE10184E150R500FR
G15G2
10
INOUT_A1
1
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
FL701
ICVE10184E150R101FR
ICVE10184E150R101FR
FL702
5
G110G2
1
100ohm
R703
C_VS
MLED2 MLED3 MLED4
MOTOR
VBACKUP
C_RST
LCD_RESET
VSYNCOUT
LCD_IF
C_MCLK C_PCLK C_HS
L_DATA12 L_DATA13 L_DATA14 L_DATA15
LCD_ID
MLED
MLED1
L_DATA02
L_DATA01
L_DATA00
SPK_RCV_N
C_SCK
SPK_RCV_P
C_SDA
LCD_RS
LCD_WR
L_SUB_LCD_CS
L_MAIN_LCD_CS
L_DATA07
L_DATA06
L_DATA05
L_DATA04
L_DATA03
L_DATA08 L_DATA09 L_DATA10 L_DATA11
C_CD00 C_CD01 C_CD02
C_CD04 C_CD05 C_CD06 C_CD07
C_CD03
Figure 3.6 LCD INTERFACE CIRCUIT
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.7 Camera Interface(AIT813G , U402)
This model has a built-in 1.3M(1280 x 920) camera module. And the camera produces JPG pictures. Camera module is controlled by AIT813G. Interface is done by I2C and YCbCr format. I2C is a control signal and YCbCr is real data interface signal.
Figure 3.7.1 AIT813G BLOCK DIAGRAM
Figure 3.7.2 SENSOR CHIP BLOCK DIAGRAM
- 30 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3.7.3 AIT813G CIRCUIT
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes
3.8 Keypad Switches and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 27 switches (Normal Key 23EA, Volume up down and camera side key, PWR down side key), connected in a matrix of 6 rows by 5 columns, as shown in Figure 3-11, except for the power switch (END), which is connected independently. Functions, the row and column lines of the keypad are connected to ports of AD6721. The columns are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6721 to identify the pressed key.
MENU
1
T
END
VOL_UPUPVOL_DOWN
Side Key
CONF
98
2
LEFT
0
CLR
RIGHT
FAV
*
46
7
5
#
3
SEND
CAMERA
SEL
DOWN
100K
R337
SW307
UP
680R321
3 4 5
680R336
CN300
1 2
R325 680
VA301
ESD9X5.0ST5G
INSTPAR
FAV
680
R338
LEFT
SW304
SW301
INSTPAR
ESD9X5.0ST5G
VA300
680
R302
R342
680
SW309
SW308 RIGHT
SW305 SEL
DOWN
SW302
VA307
ESD9X5.0ST5G
680R333
680
VA303
ICVS0514X350FR
R328
R313
100ohm
SW303
END
680R341
680R343
CLR
*
R312
SW300
100ohm
SEND
CONF
ICVS0514X350FR
VA302
R340 680
R311
100ohm
2V8_VEXT
SW306
T
680R339
MENU
SHARP
KEY_ROW5
KEY_COL4
KEY_COL3
KEY_COL2
KEY_ROW1
KEY_ROW2
KEY_ROW4
KEY_COL0
KEY_ROW0
POWERKEY
KEY_ROW3
KEY_COL1
Figure 3.8 Keypad Switches and Scanning
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