LG KG290, KG291 Service Manual
Date: October, 2007 / Issue 1.0
Service Manual
Internal Use Only
Service Manual
KG290/KG291
Model : KG290/KG291
- 3 -
1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. PERFORMANCE...............................9
2.1 H/W Features...........................................9
2.2 Technical Specification ..........................10
3. TECHNICAL BRIEF ........................15
3.1 Power Amplifier (SKY77318, U500).......15
3.2 Transceiver (AD6548, U501) .................17
3.3 FEM for Triband(FL500) ........................19
3.4 26 26 MHz Clock (DCXO, X500) ...........20
3.5 Baseband Processor (AD6721 , U103)..21
3.6 Battery Charging Block ..........................26
3.7 Display and Interface .............................28
3.8 Camera IC(AIT813G , U400) .................30
3.9 Keypad Switches and Scanning ............32
3.10 Microphone ..........................................33
3.11 Main Speaker.......................................33
3.12 Headset Interface.................................35
3.13 Key Back-light Illumination...................36
3.14 LCD Back-light Illumination..................37
3.15 VIBRATOR...........................................38
3.16 Bluetooth..............................................39
3.17 Circuit Description................................40
4. TROUBLE SHOOTING ...................56
4.1 RF Component.......................................56
4.2 RX Trouble.............................................57
4.3 TX Trouble .............................................62
4.4 Power On Trouble..................................68
4.5 Charging Trouble ...................................70
4.6 Vibrator Trouble .....................................72
4.7 LCD Trouble...........................................74
4.8 Camera Trouble .....................................77
4.9 Speaker & Receiver Trouble..................80
4.10 SIM Card Interface Trouble..................82
4.11 Earphone Trouble ................................84
4.12 KEY backlight Trouble .........................86
4.13 Microphone Trouble .............................88
4.14 RTC Trouble ........................................90
4.15 Slide on/off Trouble..............................92
5. DOWNLOAD.......................................94
5.1 Download ...............................................94
6. BLOCK DIAGRAM ........................100
7. CIRCUIT DIAGRAM ......................101
8. BGA IC Pin Check ........................109
9. PCB LAYOUT ................................113
10. ENGINEERING MODE ................117
10.1 BB Test [MENU 1]..............................118
10.2 RF Test [MENU 2]..............................120
10.3 MF mode [MENU 3] ...........................120
10.4 Trace option [MENU 4] ......................121
10.5 Call timer [MENU 5] ...........................121
10.6 Fact. Reset [MENU 6] ........................121
10.7 S/W version........................................121
11. STAND ALONE TEST .................122
11.1 Introduction ........................................122
11.2 Setting Method...................................122
11.3 Means of Test ....................................123
12. AUTO CALIBRATION .................125
12.1 Overview ............................................125
12.2 Equipment List ...................................125
12.3 Test Jig Operation..............................126
12.4 Procedure ..........................................127
12.5 AGC ...................................................130
12.6 APC....................................................130
12.7 ADC ...................................................130
13. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 131
13.1 Exploded View .................................. 131
13.2 Replacement Parts ............................133
13.3 Accessory ......................................... 151
Table Of Contents
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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Security
Security
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.There may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common - carrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that are resulted from such unauthorized use.
- 5 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 -
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
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1. INTRODUCTION
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
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2. PERFORMANCE
2.1 H/W Features
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Feature Comment
Standard Battery Li-ion Polymer, 3.7V 830mAh
Stand by TIME Up to 200 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power
GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display LCD : TFT 128 × 160 pixel 262K Color
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Status Indicator Menu Key, Clear Key, Back Key, Confirm Key
Send Key, Soft Key(Left/Right)
Volume Key(Up/Down), PWR Key, Camera Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver One way speaker
Travel Adapter Yes
MIDI 40 Poly (Mono SPK)
Camera 1.3M CMOS
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2. PERFORMANCE
2.2 Technical Specification
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM
TX: 890 + n x 0.2 MHz
RX: 935 + n x 0.2 MHz (n=1~124)
PCS
1Frequency Band TX: 1850.2 + (n-512) x 0.2 MHz
RX: 1930.2+ (n-1512) x 0.2 MHz (n=512~810)
DCS
TX: 1710.2 + (n-512) x 0.2 MHz
RX: 1805.2 + (n-512) x 0.2 MHz (n=512~885)
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS/PCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS/PCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
DCS/PCS
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM, EGSM
8 Bit Error Ratio
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Current
Fast Charge : < 430 mA
Slow Charge : < 160 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0~ -105 dBm
Battery Bar Number Voltage
0 3.48 ~ 3.63 V
23 Battery Indicator 1 3.63 ~ 3.70 V
2 3.70 ~ 3.76 V
3 3.76 ~ 3.89 V
4 3.89 V ~
24 Low Voltage Warning
3.63 0.03V (Call) every 1 minutes
3.48 0.03V (Standby)
- 14 -
2. PERFORMANCE
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
25 Forced shut down Voltage 3.33 0.03 V
1 Li-ion Battery
26 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 830mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 800 mA
- 15 -
3. TECHNICAL BRIEF
3.1 Power Amplifier (SKY77318, U500)
The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The
module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks,
impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control
(PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides
the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die,
one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other
supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to
distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a
multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and
output ports of the SKY77318 are internally matched to a 50 Ω load to reduce the number of external
components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA
module maximizes handset standby time. The SKY77318 also contains band-select switching circuitry
to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In
Figure 1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the
Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an
internal current-sense resistor and interfaces to an integrated power amplifier control (iPACTM) function,
which is insensitive to variations in temperature, power supply, process, and input power. The
ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. Figure 1. Functional
Block Diagram
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure1. Functional Block Diagram
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
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SKY77318 PAM Pin Configuration-20-Pin
Leadless (Top View)
Figure 6. Typical Case Makings
Table 4. SKY77318 Pin Names and Signal Descriptions
Pin Mame Description
1BSBand Select
2 VCC1A VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC)
3 DCS/PCS IN RF input 1710-1910 MHz (DCS1800, PCS1900)
4 GND IN RF input 880-915 MHz (GSM)
5 GND RF and DC Ground
6 VCC1B VCC (to GSM 2nd stage, DCS/PCS 2nd stages)
7 GND RF and DC Ground
8 GND RF and DC Ground
9 GND RF and DC Ground
10 GND RF and DC Ground
11 GSM OUT RF Output 880-915 MHz (GSM)
12 GND RF and DC Ground
13 GND RF and DC Ground
14 GND RF and DC Ground
15 DCS/PCS OUT RF Output 1710-1910 MHz (DCS 1800, PCS1900)
16 GND RF and DC Ground
17 VBATT Battery input to high side of intemal sense resistor
18 ENABLE BiCMOS Enable
19 RSVD(GND) RF and DC Ground
20 VAPC Power Control Bias Voltage
GMD PAD GND Ground Pad, device underside
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3. TECHNICAL BRIEF
3.2 Transceiver (AD6548, U501)
The AD6548/9 provides a highly integrated direct conversion radio solution that combines, on a single chip, all
radio and power management functions necessary to build the most com-pact GSM radio solution possible. The
only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a few
passives enabling an extremely small cost effective GSM Radio solution. The AD6548/9 uses the industry proven
direct conversion re-ceiver architecture of the OthelloTM family. For Quad band appli-cations the front end
features four fully integrated programmable gain differential LNAs. The RF is then downconverted by quad-rature
mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel selection. The
Receiver output pins can be directly connected to the baseband analog processor. The Receive path features
automatic calibration and tracking to remove DC offsets. The transmitter features a translation-loop architecture
for di-rectly modulating baseband signals onto the integrated TX VCO.
The translation-loop modulator and TX VCO are extremely low noise removing the need for external SAW filters
prior to the PA. The AD6548/9 uses a single integrated LO VCO for both the receive and the transmit circuits. The
synthesizer lock times are optimized for GPRS applications up to and including class 12.
AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to be
replaced with a low cost crystal. No other external components are required. The AD6548 uses the traditional
VCTCXO reference source. The AD6548/9 also contains on-chip low dropout voltage regula-tors (LDOs) to deliver
regulated supply voltages to the functions on chip, with a battery input voltage of between 2.9V and 5.5V.
Comprehensive power down options are included to minimize power consumption in normal use. A standard 3
wire serial interface is used to program the IC. The interface features low-voltage digital interface buffers
compatible with logic levels from 1.6V to 2.9V.
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 2 AD6548 Block Diagram
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
- 18 -
Table 1 AD6548/9 Pin Descriptions
No Name Description No Name Description
1 VCC_FE Front end supply (IP) 17 VCC_REF Reference Oscillator Supply (IP)
2I I baseband input/output 18 VAFC/ AD6548 Crystal Freq control (IP)
N/C AD6549: Spare Pin
3IBI baseband input/output 19 REFIN Crystal Connection
4 VCC_BBI Baseband I, TX path supply (IP) 20 REFINB Crystal Connection
5 SDATA Serial port data 21 REF_OP Reference Frequency Output
6 SCLK Serial port clock 22 QB Q baseband input/output
7 SEN Serial port enable 23 Q Q baseband input/output
8 N/C Not connected 24 VCC_BBQ Baseband Q supply (IP)
9 VLDO3 TX LDO Output (1) 25 RX1900B PCS 1900 LNA input
10 TXOP_LO Transmit O/P (850/900MHz) 26 RX1900 PCS 1900 LNA input
11 TXOP_HI Transmit O/P (1800/1900MHz) 27 RX1800B DCS 1800 LNA input
12 VCC_TXVCO TX VCO supply (1) 28 RX1800 DCS 1800 LNA input
13 VDD Serial interface supply 29 RX900B E-GSM LNA input
14 VBAT Battery I/P for LDO reg’s 30 RX900 E-GSM LNA input
15 VLDO1 LDO regulator Output (2) 31 RX850B GSM 850 LNA input
16 VLDO2 LO VCO Supply (3) 32 RX850 GSM 850 LNA input
GOMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
- 19 -
3. TECHNICAL BRIEF
3.3 FEM for Triband(FL500)
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table 3-1 Band SW Logic Table
Figure 3- 2 FEM CIRCUIT DIAGRAM
Mode Tx 1GHz Tx 2GHz Rx GSM Rx EGSM Rx DCS Rx PCS
Vdd On On On On On On
Vctrl1 On On Off Off Off Off
Vctrl2 Off On On On Off Off
Vctrl3 Off Off On Off On Off
NC2
19
PCS_RX+
13
12
PCS_RX-
TX1G
6
TX2G
8
VCTRL1
22
21
VCTRL2
20
VCTRL3
3
VDD
DCS_RX+
15
14
DCS_RX-
EGSM_RX+
17
16
EGSM_RX-
GND1
2
25
GND10
GND11
26
GND2
4
GND3
5
7
GND4
GND5
9
10
GND6
11
GND7
GND8
23
GND9
24
18
NC1
YGHF-S006T
FL500
1
ANT
39p
C545
2V75_VVCXO
C535
0.1u
C544
39p
C546
39p
39p
C534
ANT_SW3
ANT_SW2
ANT_SW1
- 20 -
3. TECHNICAL BRIEF
3.4 26 26 MHz Clock (DCXO, X500)
The 26 MHz clock(X500) consists of a DCXO (Digital Compensated Crystal Oscillator) which oscillates
at a frequency of 26 MHz. It is used within the AD6548, base band processor(AD6721,U103),
CAMERA( U400,AIT813G )
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
0.1u
C519
12
34
26MHz
X500
TSX-3225_26MHZ
VCC_REF
12
VCC_TXVCO
VDD
13
VLDO1
15
16
VLDO2
VLDO3
9
RX1900
RX1900B
25
32
RX850
RX850B
31
30
RX900
RX900B
29
6
SCLK
SDATA5SEN
7
TXOP_HI
11
10
TXOP_LO
VAFC_NC
18
14
VBAT
4
VCC_BBI
VCC_BBQ
24
VCC_FE
1
17
33
GND
2
I
IB
3
8
NC
23
Q
QB
22
REFIN
20
19
REFINB
21
REF_OP
28
RX1800
RX1800B
27
26
U501
AD6548
C531
0.1u
27p
C521
39p
C541
0.15MM
IN
IP
Figure 3-3. DCXO CIRCUIT DIAGRAM
- 21 -
3. TECHNICAL BRIEF
3.5 Baseband Processor (AD6721 , U103)
• AD6721 is an ADI designed processor
• AD6721 consists of
1. Control Processor Subsystem including:
• 32-bit MCU ARM7TDMI® Control Processor
• 39 MHz operation at 1.8V
• 1Mb of on-chip System SRAM Memory
2. DSP Subsystem including:
• 16-bit Fixed Point DSP Processor
• 91 MIPS[1] at 1.8V
• Data and Program SRAM
• Program Instruction Cache
• Full Rate, Enhanced Full Rate and Half Rate
• Speech Encoding/Decoding
• Capable of Supporting AMR & PDC Speech Algorithms
3. Peripheral Functions
• Parallel and Serial Display Interface
• Keypad Interface
• Flash Memory Interface
• Page-Mode Flash Support
• 1.8V and 3.0V, 64 kbps SIM Interface
• Universal System Connector Interface
• Data Services Interface
• Battery Interface (e.g. Dallas)
4. Other
• Supports 13 MHz and 26 MHz Input Clocks
• 1.8V Typical Core Operating Voltages
• 289-Ball Package (12x12mm) , 0.65mm Ball pitch
5. The AD6721 baseband transmit section supports the following mobile station GMSK modulation
power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 22 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3-4-1 SYSTEM INTERCONECTION OF AD6721 EXTERNAL INTERFACE
- 23 -
3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL
The X-TAL oscillates 32.768KHz
B. LCD module interface
The LCD module is controlled by CAMERA IC, AIT813G
If AIT701G is in the state of by-pass mode, the LCD control signals from AD6721 are by-passed
through AIT813G.
In operating mode, the AIT813G controls the LCD module through L_MAIN_LCD_CS,
L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, L_DATA[15-00], 2V85_VCAM,
IF_MODE, LCD_ID[1:3].
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Signals Description
L_MAIN_LCD_CS MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
LCD_ID Select LCD modoule maker(2.4V : HITACHI, 0V : LGIT)
LCD_RESET This pin resets LCD module. This signal comes from AD6721 directly.
LCD_WR Enable writing to LCD Driver.
LCD_RD Enable reading to LCD Driver.
LCD_RS This pin determines whether the data to LCD module are display
data or control data. LCD_RS can select 16 bit parallel bus.
2V8_VLCD 2.8V voltage is supplied to LCD driver IC.
IF_MODE
Select 16bits or 8bits interface mode for MAIN LCD.
For the future
Table 3-2 . LCD CONTRON SIGNALS DISCRIPTION
- 24 -
3. TECHNICAL BRIEF
The backlight of LCD module is controlled by AD6721 via AAT3155 , U603. The control
signals related to Backlight LED are given bellow.
C. RF interface
The AD6721 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON ,
PA_EN, S_EN, S_DATA, S_CLK
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Signals Description
MLED Current source for backlight LED
LCD_DIM_CTL Control LCD backlight level in 16 steps
MLED[1:3] This pins are returned-paths for backlight LED current source (MLED)
Table 3-3. DESCRIPTION OF LCD BACKLIGHT LED CONTROL
Signals Description
PA_BAND (GPO 17) PAM Band Select
ANT_SW1 (GPO 9) Antenna switch Band Select
ANT_SW2 (GPO 10) Antenna switch Band Select
PA_EN (GPO 16) PAM Enable/Disable
S_EN (GPO 19) PLL Enable/Disable
S_DATA (GPO 20) Serial Data to PLL
S_CLK (GPO 21) Clock to PLL
Table 3-4. RF CONTROL SIGNALS DESCRIPTION
- 25 -
3. TECHNICAL BRIEF
D. SIM interface
The AD6721 provides SIM Interface Module. The AD6721 checks status periodically during
established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,
SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-5
in detail.
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Signals Description
SIM_DATA
This pin receives and sends data to SIM card.
This model can support only 3.0 volt interface SIM card.
SIM_CLK Clock 3.25MHz frequency.
SIM_RST
Reset SIM block
(GPIO_23)
Table 3-5. SIM CONTROL SIGNALS DESCRIPTION
Figure 3-5. SIM Interface of AD6721
SIM CONNECTOR
J202
C1
1
C2
2
3
C3
C5
4
5
C6
6
C7
7
GND1
GND2
89
GND3
GND4
10
220n
C236
R236 0
1000p
C239
2V85_VSIM
C238
NA
R235
15K
2V85_VSIM
NA
C237
SIM_RST
SIM_CLKSIM_DATA
- 26 -
3. TECHNICAL BRIEF
E. LDO Block
There are 8 LDOs in the AD6721.
- VCORE : supplies Digital baseband Processor core and AD6721 digital core
- VMEM : supplies external memory and the interface to the external memory on the digital
baseband processor (1,8V or 2.8V, 150mA)
- VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)
- VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (2.85V, 20mA)
- VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)
- VABB : supplies the analog portions of the AD6721
- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)
- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
3.6 Battery Charging Block
1. Charging method : CC-CV
2.Charger detect voltage : 4.0V
3.Charging time : 3h
4.Charging current : 500mA
5.CV voltage : 4.2V
6.Cutoff current : 100mA
7.Full charge indication current (icon stop current) : 100mA
8.Recharge voltage : 4.00V
9.Low battery alarm
a. Idle : 3.50V~3.35V
b. Dedicated : 3.56V~3.35V
Low battery alarm interval
Idle : 3min
Dedicated:1min
Switch-off voltage : 3.35V
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 27 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3-6. CIRCUIT FOR BATTERY CHARGING
CHARGE(TA+USB)
10K
R116
PGND
11
2
USB
USBON
7
4
_CHG
_EN
5
_PPR
3
ISL6299U102
BAT
10
CRDL
1
8
GND
ICDL
9
6
IMIN
33K
R115
USB_VBUS VBATVCHARGE
10K
R113
100K
R114
1u
C137
2V8_VEXT
1u
C139C138
1u
R112
10K
100K
R117
_CHG_EN
_CHG_STAT
3.69V~3.57V4.2V~3.86V 3.85V~3.75V 3.74V~3.70V
- 28 -
3. TECHNICAL BRIEF
3.7 Display and Interface
• Main LCD
Controlled by L_MAIN_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, IFMODE,
L_DATA[00:15] ports
• L_MAIN_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
• LCD_RST : This pin resets LCD module. This signal comes from AD6721 directly.
• LCD_RS: This pin determines whether the data to LCD module are display data or control data.
• L_WR : Write control Signal
• L_RD : Read control Signal. But this pin used only for debugging.
• L_DATA[00:15] : Parallel data lines.
• LCD_ID[1:2] : LCD type selection signals
- LCD_ID1 : LCD maker(2.4V is HITACHI, 0V is LGIT)
- LCD_ID[2:3] : for the future using
• For using 262K color, data buses should be 16 bits.
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Properties Spec. Unit
Active Screen Size 28.032*35.04 mm
Color Depth 262,144 colors
Resolution 128 X RGB X 160 dots
- 29 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
ENQY0013901(ELCO,14-6293-035-000-829)
LCD CONNECTOR 35pin(ZIP)
2V8_VCAM
1u
C700
R700
20K
R704
0
R703
0
VSYCIN
4
5
6
7
8
9
20
21
22
23
24
25
26
27
28
29
3
30
31
32
33
34
35
1
10
11
12
13
14
15
16
17
18
19
2
CN700
MLED
MLED2
LCD_ID1
IM2
L_DATA15
L_DATA13
L_DATA11
L_DATA09
VSYNCOUT
L_DATA06
L_DATA04
L_DATA02
L_DATA00
IM1
IM2
L_DATA07
L_DATA05
L_DATA03
LCD_RD
LCD_WR
LCD_RS
LCD_CS
L_DATA01
L_DATA08
L_DATA10
L_DATA12
L_DATA14
LCD_RESET
MLED1
IM1
Figure 3-7. LCD INTERFACE CIRCUIT
- 30 -
3. TECHNICAL BRIEF
3.8 Camera IC(AIT813G , U400)
This model has a built-in SXGA(1280 x 960) camera module. And the camera produces JPG pictures.
Camera module is controlled by AIT701G. Interface is done by I2C and YCbCr format. I2C is a control
signal and YCbCr is real data interface signal.
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3-8. AIT701G BLOCK DIAGRAM
Figure 3-9. SENSOR CHIP BLOCK DIAGRAM
- 31 -
3. TECHNICAL BRIEF
LGE Internal Use Only
Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 3-10. AIT813G CIRCUIT
MULTIMEDIA IC
C430
39p
C407
1u
TP400
TP403
TP402
R409
100K
C425
R410
NA
C408
1V8_VCAM
39p
R401
0
VGP
NA
R400
R411
75K
2V8_MV
C422
1u
3V3_MUSB
C400
1u
WS
39p
C406
C401
39p
2V8_MV
2V8_MV
C429
1u
1000p
2V8_MV
C420
0.01uC403
SDO
1u
C431
TP401
C413
33p
2V8_MV
2V8_MV
VUSB3V3_MUSB
2V8_AMV
0.1uC410
VDD_IO2
VDD_IO3
A1
A6
VDD_PLL
A4
VSS_PLL
B2
_PHCS
F4
_PHGPIO_CS
_PHLCD2_CS
F3
B4
_PHRD
G2
_PHWAIT
_PHWE
B5
_PLCD1_CS
M9
M8
_PLCD2_CS
_PLCD_RD
M7
L8
_PLCD_WE
_PRST
B1
A9
PUSBDN
A3
A2
PUSBDP
L12
PVIN_N
M12
PVIN_P
K10
PVREF_N
PVREF_P
J11
PVSYNC
G3
SVDD
E7
J8
SVDD_IO
E8
SVSS1
SVSS2
H7
H8
VDD_CORE1E6VDD_CORE2
C6
VDD_IO0
VDD_IO1
H3
G8
J7
K6
PLCD8
PLCD9
K5
PLCD_A0
L9
PMCLK
A5
L10
PMIC_BIAS_N
H12
PMIC_BIAS_P
POUT0_N
L11
M10
POUT0_P
POUT1_N
M11
J12
POUT1_P
M2
PPXL_CLK
A8
PSCAN_EN
PSCKL1PSDAJ5PSEN
J3
PTEST_EN
PI2S_WS
PLCD0
M1
L2
PLCD1
M4
PLCD10
PLCD11L5PLCD12
K7
K8
PLCD13L6PLCD14
PLCD15
M5
PLCD16
L7
M6
PLCD17
PLCD2L3PLCD3M3PLCD4
K3
K4
PLCD5L4PLCD6
PLCD7
F1
F2
PHD17
C2
PHD2
PHD3
C3
PHD4
D1
C4
PHD5
PHD6
C5
D2
PHD7
PHD8
D3
PHD9
E1
PHINT
G1
D6
PHLCD_A0
PHLCD_BY
C7
PHSYNC
F5
PI2S_SCK
H11
J10
PI2S_SDO
G12
D7
PGPIO3
F11
B8
PGPIO30
G10
PGPIO4
PGPIO5
H9
D12
PGPIO6
PGPIO7
E11
PGPIO8
G9
F10
PGPIO9
B6
PHD0
PHD1
C1
PHD10
D5
E2
PHD11
PHD12
A7
PHD14
B7
E4
PHD15
PHD16
PGPIO14
PGPIO15
F9
PGPIO16
E9
PGPIO17
C11
PGPIO18
B11
A12
PGPIO19
H10
PGPIO2
PGPIO20
A11
C10
PGPIO21
PGPIO22
D9
B10
PGPIO23
PGPIO24
C9
D8
PGPIO25
A10
PGPIO26
PGPIO27
B9
C8
PGPIO28
PGPIO29
PD2
PD3
G5
H4
PD4
PD5
J1
J2
PD6J4PD7K2PD8
PD9
K1
J6
PDCLK
PDH13
E3
PGPIO0
J9
E12
PGPIO1
C12
PGPIO10
PGPIO11
D11
E10
PGPIO12
B12
PGPIO13
D10
K12
AVDD
AVSS
K11
H6
GND_CORE1
GND_CORE2
E5
D4
GND_IO0
GND_IO1
H5
F8
GND_IO2
GND_IO3
B3
PCONFIG0
K9
F12
PCONFIG1
PCONFIG2
G11
G4
PD0
PD1
H1
H2
U400
AIT813G
1u
C409
C421
39p
0.1u
C405
C404 0.01u
SCK
I2S_SCK
MULTI_USB-
MULTI_USB+
MULTI_MIC_N
MULTI_MIC_P
_WAIT
MULTI_BYPASS
C_RST
13M_AIT
I2S_SDO
I2S_WS
C_SCK
C_MCLK
C_PCLK
C_SDA
C_HS
TF_CLK
TF_CMD
VSYNCOUT
TF_DATA0
TF_DATA1
TF_DATA2
TF_DATA3
ADD01
_MAIN_CS
_RD
_WR
_MULTI_INT
_MULTI_RST
C_CD00
C_CD01
C_CD02
C_CD03
C_CD04
C_CD05
C_CD06
C_CD07
CAM_PWR_EN
C_VS
L_MAIN_LCD_CS
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
L_DATA03
L_DATA04
L_DATA05
L_DATA06
L_DATA07
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
L_DATA15
LCD_WR
LCD_RS
L_DATA00
L_DATA01
L_DATA02
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