LG KG290, KG291 Service Manual

Manual Service

KG290/KG291 : Model

Internal Use Only

Service Manual

KG290/KG291

Date: October, 2007 / Issue 1.0

Table Of Contents

1. INTRODUCTION ...............................		5
1.1	Purpose ..................................................	5
1.2	Regulatory Information............................	5
1.3	Abbreviations ..........................................	7

2. PERFORMANCE...............................			9
2.1	H/W Features...........................................		9
2.2	Technical Specification ..........................		10
3. TECHNICAL BRIEF ........................			15
3.1	Power Amplifier (SKY77318, U500).......		15
3.2	Transceiver (AD6548, U501) .................		17
3.3	FEM for Triband(FL500) ........................		19
3.4	26 26 MHz Clock (DCXO, X500) ...........		20
3.5	Baseband Processor (AD6721 , U103)..21
3.6	Battery Charging Block ..........................		26
3.7	Display and Interface .............................		28
3.8	Camera IC(AIT813G , U400) .................		30
3.9	Keypad Switches and Scanning ............		32
3.10		Microphone ..........................................	33
3.11		Main Speaker.......................................	33
3.12		Headset Interface.................................	35
3.13		Key Back-light Illumination...................	36
3.14		LCD Back-light Illumination..................	37
3.15 VIBRATOR...........................................			38
3.16		Bluetooth..............................................	39
3.17		Circuit Description................................	40
4. TROUBLE SHOOTING ...................			56
4.1 RF Component.......................................			56
4.2	RX Trouble.............................................		57
4.3	TX Trouble .............................................		62
4.4	Power On Trouble..................................		68
4.5	Charging Trouble ...................................		70
4.6	Vibrator Trouble .....................................		72
4.7	LCD Trouble...........................................		74
4.8	Camera Trouble.....................................		77
4.9	Speaker & Receiver Trouble..................		80
4.10		SIM Card Interface Trouble..................	82
4.11		Earphone Trouble ................................	84
4.12		KEY backlight Trouble .........................	86
4.13		Microphone Trouble.............................	88
4.14		RTC Trouble ........................................	90
4.15		Slide on/off Trouble..............................	92

5. DOWNLOAD.......................................		94
5.1 Download...............................................		94
6. BLOCK DIAGRAM ........................		100
7. CIRCUIT DIAGRAM ......................		101
8. BGA IC Pin Check........................		109
9. PCB LAYOUT ................................		113
10. ENGINEERING MODE ................		117
10.1	BB Test [MENU 1]..............................	118
10.2	RF Test [MENU 2]..............................	120
10.3 MF mode [MENU 3] ...........................		120
10.4	Trace option [MENU 4] ......................	121
10.5	Call timer [MENU 5] ...........................	121
10.6	Fact. Reset [MENU 6]........................	121
10.7	S/W version........................................	121
11. STAND ALONE TEST .................		122
11.1	Introduction ........................................	122
11.2	Setting Method...................................	122
11.3	Means of Test ....................................	123
12. AUTO CALIBRATION .................		125
12.1	Overview............................................	125
12.2	Equipment List ...................................	125
12.3	Test Jig Operation..............................	126
12.4	Procedure ..........................................	127
12.5 AGC ...................................................		130
12.6 APC....................................................		130
12.7 ADC ...................................................		130
13. EXPLODED VIEW &
REPLACEMENT PART LIST .....		131
13.1	Exploded View ..................................	131
13.2	Replacement Parts ............................	133
13.3	Accessory .........................................	151

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 3 -	LGE Internal Use Only
Only for training and service purposes

Security

Security

Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system.There may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common - carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that are resulted from such unauthorized use.

LGE Internal Use Only	- 4 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

1. INTRODUCTION

1.INTRODUCTION

1.1Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 5 -	LGE Internal Use Only
Only for training and service purposes

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

•Service personnel should ground themselves by using a wrist strap when exchange system boards.

•When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

•Use a suitable, grounded soldering iron.

•Keep sensitive parts in these protective packages until these are used.

•When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only	- 6 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
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1. INTRODUCTION

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

APC	Automatic Power Control
BB	Baseband
BER	Bit Error Ratio
CC-CV	Constant Current - Constant Voltage
DAC	Digital to Analog Converter
DCS	Digital Communication System
dBm	dB relative to 1 milli watt
DSP	Digital Signal Processing
EEPROM	Electrical Erasable Programmable Read-Only Memory
ESD	Electrostatic Discharge
FPCB	Flexible Printed Circuit Board
GMSK	Gaussian Minimum Shift Keying
GPIB	General Purpose Interface Bus
GSM	Global System for Mobile Communications
IPUI	International Portable User Identity
IF	Intermediate Frequency
LCD	Liquid Crystal Display
LDO	Low Drop Output
LED	Light Emitting Diode
OPLL	Offset Phase Locked Loop

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 7 -	LGE Internal Use Only
Only for training and service purposes

1. INTRODUCTION

PAM	Power Amplifier Module
PCB	Printed Circuit Board
PGA	Programmable Gain Amplifier
PLL	Phase Locked Loop
PSTN	Public Switched Telephone Network
RF	Radio Frequency
RLR	Receiving Loudness Rating
RMS	Root Mean Square
RTC	Real Time Clock
SAW	Surface Acoustic Wave
SIM	Subscriber Identity Module
SLR	Sending Loudness Rating
SRAM	Static Random Access Memory
PSRAM	Pseudo SRAM
STMR	Side Tone Masking Rating
TA	Travel Adapter
TDD	Time Division Duplex
TDMA	Time Division Multiple Access
UART	Universal Asynchronous Receiver/Transmitter
VCO	Voltage Controlled Oscillator
VCTCXO	Voltage Control Temperature Compensated Crystal Oscillator
WAP	Wireless Application Protocol

LGE Internal Use Only	- 8 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE

2.PERFORMANCE

2.1H/W Features

Item	Feature	Comment
Standard Battery	Li-ion Polymer, 3.7V 830mAh
Stand by TIME	Up to 200 hrs : Paging Period 5, RSSI 85dBm
Talk time	Up to 200min : GSM Tx Level 7
Stand by time	Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time	Approx. 3 hours
RX Sensitivity	GSM, EGSM: -109dBm, DCS: -109dBm
TX output power	GSM, EGSM: 32.3dBm(Level 5),
	DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility	Class 10
SIM card type	3V Small
Display	LCD : TFT 128 × 160 pixel 262K Color
	Hard icons. Key Pad
	0 ~ 9, #, *, Up/Down Navigation Key
Status Indicator	Menu Key, Clear Key, Back Key, Confirm Key
	Send Key, Soft Key(Left/Right)
	Volume Key(Up/Down), PWR Key, Camera Key
ANT	Internal
EAR Phone Jack	Yes
PC Synchronization	Yes
Speech coding	EFR/FR/HR
Data and Fax	Yes
Vibrator	Yes
Loud Speaker	Yes
Voice Recoding	Yes
Microphone	Yes
Speaker/Receiver	One way speaker
Travel Adapter	Yes
MIDI	40 Poly (Mono SPK)
Camera	1.3M CMOS

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 9 -	LGE Internal Use Only
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2. PERFORMANCE

2.2 Technical Specification

Item	Description				Specification
		GSM
		TX: 890 + n x 0.2 MHz
		RX: 935 + n x 0.2 MHz (n=1~124)
		PCS
1	Frequency Band	TX: 1850.2 + (n-512) x 0.2 MHz
		RX: 1930.2+ (n-1512) x 0.2 MHz (n=512~810)
		DCS
		TX: 1710.2 + (n-512) x 0.2 MHz
		RX: 1805.2 + (n-512) x 0.2 MHz (n=512~885)
2	Phase Error	RMS < 5 degrees
		Peak < 20 degrees
3	Frequency Error	< 0.1 ppm
		GSM
		Level	Power		Toler.	Level	Power	Toler.
		5	33 dBm		2dB	13	17 dBm	3dB
		6	31 dBm		3dB	14	15 dBm	3dB
		7	29 dBm		3dB	15	13 dBm	3dB
		8	27 dBm		3dB	16	11 dBm	5dB
		9	25 dBm		3dB	17	9 dBm	5dB
		10	23 dBm		3dB	18	7 dBm	5dB
		11	21 dBm		3dB	19	5 dBm	5dB
4	Power Level	12	19 dBm		3dB
		DCS/PCS
		Level	Power		Toler.	Level	Power	Toler.
		0	30 dBm		2dB	8	14 dBm	3dB
		1	28 dBm		3dB	9	12 dBm	4dB
		2	26 dBm		3dB	10	10 dBm	4dB
		3	24 dBm		3dB	11	8 dBm	4dB
		4	22 dBm		3dB	12	6 dBm	4dB
		5	20 dBm		3dB	13	4 dBm	4dB
		6	18 dBm		3dB	14	2 dBm	5dB
		7	16 dBm		3dB	15	0 dBm	5dB

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2. PERFORMANCE

	Item	Description	Specification
			GSM, EGSM
			Offset from Carrier (kHz).	Max. dBc
			100	+0.5
			200	-30
			250	-33
			400	-60
			600~ <1,200	-60
			1,200~ <1,800	-60
			1,800~ <3,000	-63
			3,000~ <6,000	-65
	5	Output RF Spectrum	6,000	-71
		(due to modulation)	DCS/PCS
			Offset from Carrier (kHz).	Max. dBc
			100	+0.5
			200	-30
			250	-33
			400	-60
			600~ <1,200	-60
			1,200~ <1,800	-60
			1,800~ <3,000	-65
			3,000~ <6,000	-65
			6,000	-73
			GSM, EGSM
			Offset from Carrier (kHz)	Max. (dBm)
	6	Output RF Spectrum	400	-19
		(due to switching transient)	600	-21
			1,200	-21
			1,800	-24

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2. PERFORMANCE

Item	Description		Specification
		DCS/PCS
			Offset from Carrier (kHz).				Max. (dBm)
6	Output RF Spectrum		400				-22
	(due to switching transient)		600				-24
			1,200				-24
			1,800				-27
7	Spurious Emissions	Conduction, Emission Status
		GSM, EGSM
8	Bit Error Ratio	BER (Class II) < 2.439% @-102 dBm
		DCS,PCS
		BER (Class II) < 2.439% @-100 dBm
9	RX Level Report Accuracy		3 dB
10	SLR	8	3 dB
			Frequency (Hz)		Max.(dB)			Min.(dB)
			100		-12			-
			200		0			-
			300		0			-12
11	Sending Response		1,000		0			-6
			2,000		4			-6
			3,000		4			-6
			3,400		4			-9
			4,000		0			-
12	RLR	2	3 dB
			Frequency (Hz)		Max.(dB)			Min.(dB)
			100		-12			-
			200		0			-
			300		2			-7
			500		*			-5
13	Receiving Response		1,000		0			-5
			3,000		2			-5
			3,400		2			-10
			4,000		2
		* Mean that Adopt a straight line in between 300 Hz
			and 1,000 Hz to be Max. level in the range.

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2. PERFORMANCE

Item	Description		Specification
14	STMR	13	5 dB
15	Stability Margin	> 6 dB
			dB to ARL (dB)		Level Ratio (dB)
			-35		17.5
			-30		22.5
16	Distortion		-20		30.7
			-10		33.3
			0		33.7
			7		31.7
			10		25.5
17	Side Tone Distortion	Three stage distortion < 10%
18	System frequency	2.5ppm
	(13 MHz) tolerance
19	32.768KHz tolerance	30ppm
		At least 65 dBspl under below conditions:
20	Ringer Volume	1. Ringer set as ringer.
		2. Test distance set as 50 cm
21	Charge Current	Fast Charge : < 430 mA
		Slow Charge : < 160 mA
		Antenna Bar Number			Power
			5		-85 dBm ~
			4		-90 dBm ~ -86 dBm
22	Antenna Display		3		-95 dBm ~ -91 dBm
			2		-100 dBm ~ -96 dBm
			1		-105 dBm ~ -101 dBm
			0		~ -105 dBm
		Battery Bar Number			Voltage
			0		3.48 ~ 3.63 V
23	Battery Indicator		1		3.63 ~ 3.70 V
			2		3.70 ~ 3.76 V
			3		3.76 ~ 3.89 V
			4		3.89 V ~
24	Low Voltage Warning	3.63 0.03V (Call) every 1 minutes
		3.48	0.03V (Standby)

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2. PERFORMANCE

	Item	Description	Specification
	25	Forced shut down Voltage	3.33 0.03 V
			1 Li-ion Battery
	26	Battery Type	Standard Voltage = 3.7 V
			Battery full charge voltage = 4.2 V
			Capacity: 830mAh
			Switching-mode charger
	27	Travel Charger	Input: 100 ~ 240 V, 50/60 Hz
			Output: 5.2 V, 800 mA

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3. TECHNICAL BRIEF

3.TECHNICAL BRIEF

3.1Power Amplifier (SKY77318, U500)

The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and output ports of the SKY77318 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77318 also contains band-select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In Figure 1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control (iPACTM) function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. Figure 1. Functional Block Diagram

Figure1. Functional Block Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 15 -	LGE Internal Use Only
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3. TECHNICAL BRIEF

SKY77318 PAM Pin Configuration-20-Pin				Figure 6. Typical Case Makings
	Leadless (Top View)
Pin		Mame		Description
1		BS	Band Select
2		VCC1A	VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC)
3		DCS/PCS IN	RF input 1710-1910 MHz (DCS1800, PCS1900)
4		GND IN	RF input 880-915 MHz (GSM)
5		GND	RF and DC Ground
6		VCC1B	VCC (to GSM 2nd stage, DCS/PCS 2nd stages)
7		GND	RF and DC Ground
8		GND	RF and DC Ground
9		GND	RF and DC Ground
10		GND	RF and DC Ground
11		GSM OUT	RF Output 880-915 MHz (GSM)
12		GND	RF and DC Ground
13		GND	RF and DC Ground
14		GND	RF and DC Ground
15		DCS/PCS OUT	RF Output 1710-1910 MHz (DCS 1800, PCS1900)
16		GND	RF and DC Ground
17		VBATT	Battery input to high side of intemal sense resistor
18		ENABLE	BiCMOS Enable
19		RSVD(GND)	RF and DC Ground
20		VAPC	Power Control Bias Voltage
GMD PAD		GND	Ground Pad, device underside

Table 4. SKY77318 Pin Names and Signal Descriptions

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3. TECHNICAL BRIEF

3.2 Transceiver (AD6548, U501)

The AD6548/9 provides a highly integrated direct conversion radio solution that combines, on a single chip, all radio and power management functions necessary to build the most com-pact GSM radio solution possible. The only external components required for a complete radio design are the Rx SAWs, PA, Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The AD6548/9 uses the industry proven direct conversion re-ceiver architecture of the OthelloTM family. For Quad band appli-cations the front end features four fully integrated programmable gain differential LNAs. The RF is then downconverted by quad-rature mixers and then fed to the baseband programmable-gain amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the baseband analog processor. The Receive path features automatic calibration and tracking to remove DC offsets. The transmitter features a translation-loop architecture for di-rectly modulating baseband signals onto the integrated TX VCO.

The translation-loop modulator and TX VCO are extremely low noise removing the need for external SAW filters prior to the PA. The AD6548/9 uses a single integrated LO VCO for both the receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and including class 12.

AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to be replaced with a low cost crystal. No other external components are required. The AD6548 uses the traditional VCTCXO reference source. The AD6548/9 also contains on-chip low dropout voltage regula-tors (LDOs) to deliver regulated supply voltages to the functions on chip, with a battery input voltage of between 2.9V and 5.5V. Comprehensive power down options are included to minimize power consumption in normal use. A standard 3 wire serial interface is used to program the IC. The interface features low-voltage digital interface buffers compatible with logic levels from 1.6V to 2.9V.

Figure 2 AD6548 Block Diagram

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LGE Internal Use Only

3. TECHNICAL BRIEF

GOMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

No	Name	Description	No	Name	Description
1	VCC_FE	Front end supply (IP)	17	VCC_REF	Reference Oscillator Supply (IP)
2	I	I baseband input/output	18	VAFC/	AD6548 Crystal Freq control (IP)
				N/C	AD6549: Spare Pin
3	IB	I baseband input/output	19	REFIN	Crystal Connection
4	VCC_BBI	Baseband I, TX path supply (IP)	20	REFINB	Crystal Connection
5	SDATA	Serial port data	21	REF_OP	Reference Frequency Output
6	SCLK	Serial port clock	22	QB	Q baseband input/output
7	SEN	Serial port enable	23	Q	Q baseband input/output
8	N/C	Not connected	24	VCC_BBQ	Baseband Q supply (IP)
9	VLDO3	TX LDO Output (1)	25	RX1900B	PCS 1900 LNA input
10	TXOP_LO	Transmit O/P (850/900MHz)	26	RX1900	PCS 1900 LNA input
11	TXOP_HI	Transmit O/P (1800/1900MHz)	27	RX1800B	DCS 1800 LNA input
12	VCC_TXVCO	TX VCO supply (1)	28	RX1800	DCS 1800 LNA input
13	VDD	Serial interface supply	29	RX900B	E-GSM LNA input
14	VBAT	Battery I/P for LDO reg’s	30	RX900	E-GSM LNA input
15	VLDO1	LDO regulator Output (2)	31	RX850B	GSM 850 LNA input
16	VLDO2	LO VCO Supply (3)	32	RX850	GSM 850 LNA input

Table 1 AD6548/9 Pin Descriptions

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3. TECHNICAL BRIEF

3.3 FEM for Triband(FL500)

Mode	Tx 1GHz	Tx 2GHz	Rx GSM	Rx EGSM	Rx DCS	Rx PCS
Vdd	On	On	On	On	On	On
Vctrl1	On	On	Off	Off	Off	Off
Vctrl2	Off	On	On	On	Off	Off
Vctrl3	Off	Off	On	Off	On	Off

Table 3-1 Band SW Logic Table

FL500

YGHF-S006T

10 GND6

9 GND5

7 GND4GND3

5 GND2

42 GND1

20 VCTRL3

2V75_VVCXO 21 VCTRL2 VCTRL1

223 VDD

26	25	24	23	11
GND11 GND10 GND9 GND8				GND7	TX2G	8
					TX1G	6
					PCS_RX+	13
					PCS_RX-
					DCS_RX+	12
					DCS_RX-	15
						14
				EGSM_RX+		17
					EGSM_RX-	16
	ANT				NC2
					NC1	19
		1				18

C534 C535

39p 0.1u

ANT_SW1

ANT_SW2

ANT_SW3

C544	C545	C546
39p	39p	39p

Figure 3- 2 FEM CIRCUIT DIAGRAM

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3. TECHNICAL BRIEF

3.4 26 26 MHz Clock (DCXO, X500)

The 26 MHz clock(X500) consists of a DCXO (Digital Compensated Crystal Oscillator) which oscillates at a frequency of 26 MHz. It is used within the AD6548, base band processor(AD6721,U103), CAMERA( U400,AIT813G )

		C519
		0.1u
										0.15MM
											18
	24			23		22	21		20	19			17
26	RX1900		VCC		Q QB REFOP REFIN REFINB							VAFCNC		VCCREF		VLDO2	16
25			BBQ
	RX1900B
27	RX1800B															VLDO1	15
28																	14
	RX1800						U501									VBAT
29																	13
30	RX900B					AD6548										VDD	12
31	RX900											VCC_TXVCO					11
32	RX850B														TXOP_HI		10
	RX850		VCCFE		I IB VCCBBI SDATA SCLK							SEN		TXOP_LO			9							0.1u
33	GND													NC		VLDO3
																								C531
	1 2 3 4 5 6 7 8

IP C541

39p

IN

26MHz

X500 TSX-3225_26MHZ

4 3

1 2

C521

27p

Figure 3-3. DCXO CIRCUIT DIAGRAM

LGE Internal Use Only	- 20 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

3. TECHNICAL BRIEF

3.5 Baseband Processor (AD6721 , U103)

•AD6721 is an ADI designed processor

•AD6721 consists of

1.Control Processor Subsystem including:

•32-bit MCU ARM7TDMI® Control Processor

•39 MHz operation at 1.8V

•1Mb of on-chip System SRAM Memory

2.DSP Subsystem including:

•16-bit Fixed Point DSP Processor

•91 MIPS[1] at 1.8V

•Data and Program SRAM

•Program Instruction Cache

•Full Rate, Enhanced Full Rate and Half Rate

•Speech Encoding/Decoding

•Capable of Supporting AMR & PDC Speech Algorithms

3.Peripheral Functions

•Parallel and Serial Display Interface

•Keypad Interface

•Flash Memory Interface

•Page-Mode Flash Support

•1.8V and 3.0V, 64 kbps SIM Interface

•Universal System Connector Interface

•Data Services Interface

•Battery Interface (e.g. Dallas)

4.Other

•Supports 13 MHz and 26 MHz Input Clocks

•1.8V Typical Core Operating Voltages

•289-Ball Package (12x12mm) , 0.65mm Ball pitch

5.The AD6721 baseband transmit section supports the following mobile station GMSK modulation power classes:

•GSM 900/850 power classes 4 and 5,

•DCS 1800 power classes 1 and 2, and

•PCS 1900 power classes 1 and 2

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 21 -	LGE Internal Use Only
Only for training and service purposes

3. TECHNICAL BRIEF

Figure 3-4-1 SYSTEM INTERCONECTION OF AD6721 EXTERNAL INTERFACE

LGE Internal Use Only	- 22 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

3. TECHNICAL BRIEF

3.5.1 Interconnection with external devices

A. RTC block interface

Countered by external X-TAL

The X-TAL oscillates 32.768KHz

B. LCD module interface

The LCD module is controlled by CAMERA IC, AIT813G

If AIT701G is in the state of by-pass mode, the LCD control signals from AD6721 are by-passed through AIT813G.

In operating mode, the AIT813G controls the LCD module through L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, L_DATA[15-00], 2V85_VCAM, IF_MODE, LCD_ID[1:3].

Signals		Description
L_MAIN_LCD_CS		MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
LCD_ID		Select LCD modoule maker(2.4V : HITACHI, 0V : LGIT)
LCD_RESET		This pin resets LCD module. This signal comes from AD6721 directly.
LCD_WR		Enable writing to LCD Driver.
LCD_RD		Enable reading to LCD Driver.
LCD_RS		This pin determines whether the data to LCD module are display
		data or control data. LCD_RS can select 16 bit parallel bus.
2V8_VLCD		2.8V voltage is supplied to LCD driver IC.
		Select 16bits or 8bits interface mode for MAIN LCD.
IF_MODE		For the future
	Table 3-2 . LCD CONTRON SIGNALS DISCRIPTION

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 23 -	LGE Internal Use Only
Only for training and service purposes

3. TECHNICAL BRIEF

The backlight of LCD module is controlled by AD6721 via AAT3155 , U603. The control signals related to Backlight LED are given bellow.

Signals	Description
MLED	Current source for backlight LED
LCD_DIM_CTL	Control LCD backlight level in 16 steps
MLED[1:3]	This pins are returned-paths for backlight LED current source (MLED)

Table 3-3. DESCRIPTION OF LCD BACKLIGHT LED CONTROL

C. RF interface

The AD6721 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON , PA_EN, S_EN, S_DATA, S_CLK

Signals		Description
PA_BAND (GPO 17)		PAM Band Select
ANT_SW1 (GPO 9)		Antenna switch Band Select
ANT_SW2 (GPO 10)		Antenna switch Band Select
PA_EN (GPO 16)		PAM Enable/Disable
S_EN (GPO 19)		PLL Enable/Disable
S_DATA (GPO 20)		Serial Data to PLL
S_CLK (GPO 21)		Clock to PLL
	Table 3-4. RF CONTROL SIGNALS DESCRIPTION

LGE Internal Use Only	- 24 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

3. TECHNICAL BRIEF

D. SIM interface

The AD6721 provides SIM Interface Module. The AD6721 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-5 in detail.

Signals

Description

This pin receives and sends data to SIM card.

SIM_DATA

This model can support only 3.0 volt interface SIM card.

SIM_CLK

Clock 3.25MHz frequency.

SIM_RST

Reset SIM block

(GPIO_23)

Table 3-5. SIM CONTROL SIGNALS DESCRIPTION

SIM CONNECTOR

2V85_VSIM

2V85_VSIM

R235

J202

15K

4

1

C5

C1

5

2

R236

0

C6

C2

SIM_RST

6

3

SIM_DATA

C7

C3

SIM_CLK

10

7

GND4 GND1

9

8

GND3 GND2

C237

C236

C238

C239

NA

220n

NA

1000p

Figure 3-5. SIM Interface of AD6721

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 25 -	LGE Internal Use Only
Only for training and service purposes

3. TECHNICAL BRIEF

E. LDO Block

There are 8 LDOs in the AD6721.

-VCORE : supplies Digital baseband Processor core and AD6721 digital core

-VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA)

-VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)

-VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (2.85V, 20mA)

-VRTC : supplies the Real-Time Clock module (1.8 V, 20 µA)

-VABB : supplies the analog portions of the AD6721

-VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)

-VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)

3.6 Battery Charging Block

1. Charging method : CC-CV 2.Charger detect voltage : 4.0V 3.Charging time : 3h 4.Charging current : 500mA 5.CV voltage : 4.2V

6.Cutoff current : 100mA

7.Full charge indication current (icon stop current) : 100mA 8.Recharge voltage : 4.00V

9.Low battery alarm

a.Idle : 3.50V~3.35V

b.Dedicated : 3.56V~3.35V Low battery alarm interval Idle : 3min

Dedicated:1min Switch-off voltage : 3.35V

LGE Internal Use Only	- 26 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

3. TECHNICAL BRIEF

CHARGE(TA+USB)

USB_VBUS

R113

10K

_CHG_EN

R114

100K

R115

33K

R116

10K

VCHARGE

1

U102

ISL6299

10

CRDL

BAT

2

USB

6

3

IMIN

_PPR

4

9

_CHG

ICDL

7

USBON

GND

8

5

_EN

PGND

11

C137

C138

R117

1u

1u

100K

VBAT 2V8_VEXT

R112

10K

_CHG_STAT

C139

1u

4.2V~3.86V

3.85V~3.75V

3.74V~3.70V

3.69V~3.57V

Figure 3-6. CIRCUIT FOR BATTERY CHARGING

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 27 -	LGE Internal Use Only
Only for training and service purposes

3. TECHNICAL BRIEF

3.7 Display and Interface

• Main LCD

Properties	Spec.	Unit
Active Screen Size	28.032*35.04	mm
Color Depth	262,144	colors
Resolution	128 X RGB X 160	dots

Controlled by L_MAIN_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, IFMODE, L_DATA[00:15] ports

•L_MAIN_LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin

•LCD_RST : This pin resets LCD module. This signal comes from AD6721 directly.

•LCD_RS: This pin determines whether the data to LCD module are display data or control data.

•L_WR : Write control Signal

•L_RD : Read control Signal. But this pin used only for debugging.

•L_DATA[00:15] : Parallel data lines.

•LCD_ID[1:2] : LCD type selection signals

-LCD_ID1 : LCD maker(2.4V is HITACHI, 0V is LGIT)

-LCD_ID[2:3] : for the future using

•For using 262K color, data buses should be 16 bits.

LGE Internal Use Only	- 28 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

3. TECHNICAL BRIEF

LCD CONNECTOR 35pin(ZIP)

ENQY0013901(ELCO,14-6293-035-000-829)

2V8_VCAM

		35
	MLED	34
	MLED1	33
	MLED2	32
	IM1	31
	IM2	30
	LCD_RESET	29
	L_DATA15	28
	L_DATA14	27
	L_DATA13	26
	L_DATA12	25
	L_DATA11	24
	L_DATA10	23
	L_DATA09	22
	L_DATA08	21
	VSYNCOUT	20
	L_DATA07	19	IM1
	L_DATA06	18
			IM2
	L_DATA05	17
	L_DATA04	16
	L_DATA03	15
	L_DATA02	14
	L_DATA01	13
	L_DATA00	12
	VSYCIN	11
	LCD_RD	10
	LCD_WR	9
	LCD_RS	8
	LCD_CS	7
		6
		5
	LCD_ID1	4
		3
	R700	2
	20K	1
		CN700
		C700
		1u

R703 R704

00

Figure 3-7. LCD INTERFACE CIRCUIT

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 29 -	LGE Internal Use Only
Only for training and service purposes

3. TECHNICAL BRIEF

3.8 Camera IC(AIT813G , U400)

This model has a built-in SXGA(1280 x 960) camera module. And the camera produces JPG pictures. Camera module is controlled by AIT701G. Interface is done by I2C and YCbCr format. I2C is a control signal and YCbCr is real data interface signal.

Figure 3-8. AIT701G BLOCK DIAGRAM

Figure 3-9. SENSOR CHIP BLOCK DIAGRAM

LGE Internal Use Only	- 30 -	Copyright © 2007 LG Electronics. Inc. All right reserved.
		Only for training and service purposes

3. TECHNICAL BRIEF

2V8_MV

MULTIMEDIA IC

								C400 C401
3V3_MUSB VUSB VGP								1u	39p
R400	R401			2V8_MV		1V8_VCAM				MIC P	MIC N
	0	SCKI2S						SDOI2S WSI2S		MULTI	MULTI
NA
C405			C406 C407		C408 C409		SDO	WS	0.1uC410	0.01uC403 0.01uC404
0.1u
		SCK	39p	1u	39p	1u

3V3_MUSB

G11

F12

K11

K12

J10

G12

H11

J12

M11

M10

L11

H12

L10

J11

K10

M12

L12

A10

K9

A8

A9

A4

A6

H7

J8

E8

E7

H6

E5

H8

E6

B8

D7

C8

B9

MULTI_USB-

A2

PUSBDN

PCONFIG2

PCONFIG1

PCONFIG0

PSCAN EN

PTEST EN

VSS PLL

VDD PLL

SVSS2

SVDD IO

SVSS1

SVDD

GNDCORE1 GNDCORE2

VDD CORE1

VDD CORE2

AVSS AVDD

PI2S SDO PI2S WS PI2S SCK

POUT1 P

POUT1 N

POUT0 P

POUT0 N

PMICBIAS P

PMICBIAS N

PVREF P

PVREF N

PVIN P

PVIN N

PGPIO30

PGPIO29

PGPIO28

PGPIO27

PGPIO26

D8

A3

MULTI_USB+

A1

PUSBDP

PGPIO25

C9

VDD_IO3

PGPIO24

B3

GND_IO3

PGPIO23

B10

_MAIN_CS

B2

D9

B4

_PHCS

PGPIO22

C10

C413

_RD

_PHRD

PGPIO21

33p

_WR

B5

_PHWE

PGPIO20

A11

B1

_PRST

PGPIO19

A12

PGPIO18

B11

DATA00

B6

PHD0

C11

2V8_MV

C1

PGPIO17

E9

DATA01

C2

PHD1

PGPIO16

F9

DATA02

PHD2

PGPIO15

C3

D10

DATA03

D1

PHD3

PGPIO14

B12

VSYNCOUT

R409

100K

DATA04

C5

PHD4

PGPIO13

D11

C_RST

DATA06

PHD6

PGPIO11

DATA05

C4

PHD5

PGPIO12

E10

DATA07

D2

PHD7

PGPIO10

C12

_MULTI_RST

DATA08

D3

PHD8

U400

PGPIO9

F10

R410

E1

G9

DATA09

PHD9

PGPIO8

NA

DATA10

D5

PHD10

AIT813G

PGPIO7

E11

E2

D12

DATA11

PHD11

PGPIO6

2V8_MV

A7

H9

TF_DATA3

DATA12

E3

PHD12

PGPIO5

G10

DATA13

PDH13

PGPIO4

TF_DATA2

TP400B7

F11

DATA14

E4

PHD14

PGPIO3

H10

TF_DATA1

DATA15

PHD15

PGPIO2

TF_DATA0

R411

F1

E12

2V8_MV

F2

PHD16

PGPIO1

J9

TF_CMD

75K

PHD17

PGPIO0

TF_CLK

MULTI_BYPASS

TP401

C7

PHLCD_BY

GND_IO2

F8

ADD01

D6

PHLCD_A0

VDD_IO2

G8

F3

_PHLCD2_CS

_PLCD2_CS

M8

_MULTI_INT

G1

M9

L_MAIN_LCD_CS

TP402

F4

PHINT

_PLCD1_CS

M7

_PHGPIO_CS

_PLCD_RD

C421 C422

_WAIT

C420

1000p

G2

_PHWAIT

PLCD_A0

L9

LCD_RS

39p 1u

13M_AIT

A5

PMCLK

_PLCD_WE

L8

LCD_WR

C6

M6

C425

VDD_IO0

PLCD17

D4

GND_IO0

PDCLK PPXLCLK

PLCD16

L7

2V8_MV

PHSYNC

PVSYNC

PD0

PD1

PD2

PD3

PD4

PD5

PD6

PD7

PD8

PD9

PSEN

PSDA

PSCK

VDDIO1 GNDIO1

PLCD0

PLCD1

PLCD2

PLCD3

PLCD4

PLCD5

PLCD6

PLCD7

PLCD8

PLCD9

PLCD10

PLCD11

PLCD12

PLCD13

PLCD14

PLCD15

F5

G3

G4

H1

H2

G5

H4

J1

J2

J4

K2

K1

J3

J5

L1

J6

M2

H3

H5

M1

L2

L3

M3

K3

K4

L4

J7

K6

K5

M4

L5

K7

K8

L6

M5

TP403

C429

1u

C HS

C VS

C CD00

C CD01

C CD02

C CD03

C CD04

C CD05

C CD06

C CD07

CAM PWR EN

C SDA

C SCK

C MCLK C PCLK

L DATA00

L DATA01

L DATA02

L DATA03

L DATA04

L DATA05

L DATA06

L DATA07

L DATA08

L DATA09

L DATA10

L DATA11

L DATA12

L DATA13

L DATA14

L DATA15

2V8_AMV

C430

C431

39p

1u

Figure 3-10. AIT813G CIRCUIT

Copyright © 2007 LG Electronics. Inc. All right reserved.	- 31 -	LGE Internal Use Only
Only for training and service purposes