LG KE990c, KE990 Service Manual

Date: April, 2008 / Issue 1.0

Service Manual

Model : KE990/KE990c

Service Manual

KE990/KE990c

Internal Use Only

- 3 -

1. INTRODUCTION .............................. 5

1.1 Purpose................................................... 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE...............................7

2.1 Supporting Standard................................7

2.2 Main Parts : Solution................................7

2.3 HW Features............................................8

2.4 HW SPEC. .............................................10

3. TECHNICAL BRIEF ........................15

3.1 General Description ...............................15

3.2 GSM Mode.............................................17

3.3 LO generation and distribution circuits...20

3.4 Off-chip RF Components .......................21

3.5 Digital Baseband (DBB/ESM6270) ........28

3.6 Subsystem(ESM6270)...........................31

3.7 Power Block...........................................38

3.8 External memory interface.....................43

3.9 H/W Sub System....................................45

3.10 Feature List..........................................61

3.11 Multimedia Chip Interface ....................67

3.12 Touch Screen Interface........................73

3.13 Main Features......................................74

3.14 Main Component..................................75

4. TROUBLE SHOOTING ...................81

4.1 RF Component.......................................81

4.2 Main Component....................................82

4.3 Checking VCTCXO Block ......................83

4.4 Checking Front-End Module Block ........85

4.5 Checking GSM Block.............................88

4.6 Power on trouble....................................94

4.7 SIM detect trouble..................................99

4.8 Key sense trouble (KEYPAD) ..............100

4.9 Keypad backlight trouble......................102

4.10 Micro SD trouble ................................104

4.11 Audio trouble......................................105

4.12 Camera trouble ..................................118

4.13 Main LCD trouble...............................121

4.14 Bluetooth trouble................................124

4.15 Touch Screen trouble.........................126

5. DOWNLOAD .................................127

5.1 Introduction ..........................................127

5.2 Downloading Procedure.......................127

5.3 Troubleshooting Download Errors .......142

5.4 Caution.................................................147

6. BLOCK DIAGRAM ........................148

6.1 GSM RF Block .....................................148

6.2 Interface Diagram ................................150

7. Circuit Diagram ............................153

8. BGM Pin Map................................163

9. PCB LAYOUT................................169

10. Calibration & RF Auto Test

Program (Hot Kimchi)................173

10.1 Usage of Hot-Kimchi..........................173

11. EXPLODED VIEW &

REPLACEMENT PART LIST ......177

11.1 EXPLODED VIEW .............................177

11.2 Replacement Parts

<Mechanic component>.....................179

<Main component> ............................183

11.3 Accessory ..........................................203

Table Of Contents

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

Only for training and service purposes

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION

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LGE Internal Use Only

2. PERFORMANCE

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2.1 Supporting Standard

2.2 Main Parts : GSM Solution

2. PERFORMANCE

Item Feature Comment

Supporting Standard GSM900/DCS1800/PCS1900

with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, A-E

Frequency Range GSM900 TX : 880 - 915 MHz

GSM900 RX : 925 - 960 MHz DCS1800 TX : 1710 - 1785 MHz DCS1800 RX : 1805 - 1880 MHz PCS1900 TX : 1850 - 1910 MHz PCS1900 RX : 1930 - 1990 MHz

Application Standard WAP 2.0, JAVA 2.0

Item Part Name Comment

Digital Baseband Neptune (D761811BZVL): TI

Analog Baseband Triton (TWL3029): TI

RF Chip RTR6235 : Qualcomm

LGE Internal Use Only

Only for training and service purposes

2.3 HW Features

2. PERFORMANCE

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Item Feature Comment

Form Factor Slide

Battery 1) Capacity

Standard : Li-Ion, 800mAh

2) Packing Type : Soft Pack

Size Standard : 100.4 X 48.0 X 14.5 mm

Weight TBD With Battery

Volume 70cc

PCB Staggered 8Layers , 0.8t

Stand by time 250 hrs @ Paging Period 9

Charging time 3 hrs @ Power Off / 800mAh

Talk time Min : 3.0 hrs @ Power Level 7 @ GSM850 / 800mAh

RX sensitivity GSM900 : -105 dBm

DCS 1800 : -105 dBm PCS 1900 : -105 dBm

GSM900 : 33 dBm Class4 (GSM900) DCS 1800 : 30 dBm Class1 (PCS) PCS 1900 : 30 dBm Class1 (DCS)

GSM900 : 27 dBm E2 (GSM900)

DCS 1800 : 26 dBm E2 (PCS)

PCS 1900 : 26 dBm E2 (DCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

SIM card type Plug-In SIM

3V /1.8V

Display Main LCD

262K Color TFT (320 x 240) Backlight : White LED

Built-in Camera 2M CMOS Camera (VGA) One button access

Status Indicator None

TX output

power

GSM/

GPRS

EDGE

LGE Internal Use Only

2. PERFORMANCE

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Item Feature Comment

Keypad Alphanumeric Key : 12 Function Key:

Function Key : 14 4 Key Navigation, OK, F1,

Side Key : 4 F2, CLR, SND, MOD

Total No of Keys :30 Side Key : Volume up/down,

CAM, PWR/END

ANT Main : Internal Fixed Type

System connector 18 Pin

Ear Phone Jack 18pin, 4 Pole, Stereo

PC synchronization Yes

Memory NAND Flash : 1Gbit

SDRAM : 512Mbit

Speech coding FR, EFR, HR,AMR

Data & Fax Built in Data & Fax support

Vibrator Built in Vibrator

Blue Tooth V1.2, A2DP,

MIDI(for Buzzer Function) SW Decoded 40Poly

Music Player MP3/ WMA/AAC/HE-AAC/EAAC+ With Graphic EQ

Video Player MPEG4, H.263, WMV9

Camcorder MPEG4, H.263,

Voice Recording Yes

Speaker Phone mode Yes

Support

Travel Adapter Yes

CDROM Yes

Stereo Headset Yes Optional

Data Cable Yes Optional

T-Flash Yes Optional

(External Memory)

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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2.4 HW SPEC.

Item Description Specification

1Frequency Band GSM

TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )

DCS1800

TX: 1710.2 + 0.2 x (n-512) MHz RX: 1805.2 + 0.2 x (n-512) MHz (n = 512 ~ 885)

PCS1900

TX: 1850 + ( n-511 ) x 0.2 MHz RX: 1930 + ( n-511 ) x 0.2 MHz (n = 512 ~ 810)

2 Phase Error RMS < 5 degrees

Peak < 20 degrees 3 Frequency Error < 0.1ppm 4 Power Level GSM, EGSM

Level Power Toler. Level Power Toler.

5 33 dBm 2dB 13 17 dBm 3dB 6 31 dBm 3dB 14 15 dBm 3dB 7 29 dBm 3dB 15 13 dBm 3dB 8 27 dBm 3dB 16 11 dBm 5dB

9 25 dBm 3dB 17 9 dBm 5dB 10 23 dBm 3dB 18 7 dBm 5dB 11 21 dBm 3dB 19 5 dBm 5dB 12 19 dBm 3dB

DCS / PCS

Level Power Toler. Level Power Toler.

0 30 dBm 2dB 8 14 dBm 3dB

1 28 dBm 3dB 9 12 dBm 4dB

2 26 dBm 3dB 10 10 dBm 4dB

3 24 dBm 3dB 11 8 dBm 4dB

4 22 dBm 3dB 12 6 dBm 4dB

5 20 dBm 3dB 13 4 dBm 4dB

6 18 dBm 3dB 14 2 dBm 5dB

7 16 dBm 3dB 15 0 dBm 5dB

LGE Internal Use Only

2. PERFORMANCE

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Item Description Specification

5 Output RF Spectrum GSM, EGSM

(due to modulation) Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

6,000 -71

DCS / PCS

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

6 Output RF Spectrum GSM, EGSM

(due to switching transient) Offset from Carrier (kHz) Max. (dBm)

400 -19

600 -21

1,200 -21

1,800 -24

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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Item Description Specification

6 Output RF Spectrum DCS / PCS

(due to switching transient) Offset from Carrier (kHz). Max. (dBm)

400 -22

600 -24 1,200 -24 1,800 -27

7 Spurious Emissions Conduction, Emission Status

GSM, EGSM

8Bit Error Ratio

BER (Class II) < 2.439% @-102dBm

DCS / PCS

BER (Class II) < 2.439% @-102dBm

9 Rx Level Report accuracy

10 SLR 8 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 200 0 300 0 -12

11 Sending Response 1,000 0 -6

2,000 4 -6 3,000 4 -6 3,400 4 -9 4,000 0 -

12 RLR 2 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 200 0 300 2 -7 500

*

-5

13 Receiving Response 1,000 0 -5

3,000 2 -5 3,400 2 -10 4,000 2

*

Mean that Adopt a straight line in between 300 Hz

and 1,000 Hz to be Max. level in the range.

LGE Internal Use Only

2. PERFORMANCE

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Item Description Specification

14 STMR 13 5 dB

15 Stability Margin > 6 dB

16 Distortion dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30 22.5

-20 30.7

-10 33.3

0 33.7

7 31.7

10 25.5

17 Side Tone Distortion Three stage distortion < 10%

18

<Change> System frequency 2.5ppm (13 MHz) tolerance

19 <Change>32.768KHz tolerance 30ppm 20 Power consumption Full power : < 340mA (GSM850) ; < 260mA (DCS / PCS)

Standby : - Normal Mode 4.0mA(Max. power)

- Using Test mode on DSP Sleep function 6mA

21 Talk Time GSM850/Level7 (Battery 800mA):210 Min

GSM850/Level12(Battery 800mA):350 Min PCS1900/Level5 (Battery 800mA):310 Min PCS1900/Level10(Battery 800mA):390 Min

22 Standby Time Under conditions, at least 200 hours: Brand new and full

800mAh battery Full charge, no receive/send and keep GSM in idle mode. Broadcast set off. Signal strength display labove. Backlight of phone set off.

23 Ringer Volume At least 80 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 50 cm

24 Charge Voltage Fast Charge : < 600 mA

Slow Charge: < 60 mA

25 Antenna Display Antenna Bar Number Power

4-90 dBm ~ -86 dBm

3-95 dBm ~ -91 dBm

2-100 dBm ~ -96 dBm

1-105 dBm ~ -101 dBm

0~ -105 dBm

Item Description Specification

26 Battery Indicator Battery Bar Number Voltage

0(included Blinking) 3.65V ~ 3.35V

1 3.71V ~ 3.66V

2 3.78V ~ 3.72V

3 3.91V ~ 3.79V

4 4.20V ~ 3.92V

27 Low Voltage Warning 3.5 0.03 V (Call)

3.6 0.03 V (Standby)

28 Forced shut down Voltage 3.35 0.03 V

29 Battery Type 1 Li-Ion Battery

Standard Voltage = 3.7 V

Battery full charge voltage = 4.2 V

Capacity: Min 930mAh

30 Travel Charger Switching-mode charger

Input: 100 ~ 240 V, 50/60Hz

Out put: 5.1V, 700mA

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

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LGE Internal Use Only

3. TECHNICAL BRIEF

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3.1 General Description

The KE990/KE990c supports EGSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/EDGE. All receivers and transmitter use the radioOne 1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSKmodulated or 8-PSK-modulated signal to RF.

A generic, high-level functional block diagram of KE990/KE990c is shown in Figure 3-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module).

3. TECHNICAL BRIEF

[Fig 3.1] Block diagram of RF part

1

QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

GESM/ DCS1800/ PCS1900

1. RTR6235 for GSM/EDGE Tx

2. RTR6235 for GSM/EDGE Rx

3. PM6635-3P for Power Management

4. FM radio Module

5. Bluetooth RF Module

1

H-BPF

L-BPF

SW

GSM850

F

Rx BP

GSM1800

Rx BPF

GSM1900

Rx BPF

GSM/EDGE PA

Tx BPF

G900

pad

Power

Detector

BPF

LO generation

Quadrature

Downconverter

Quadrature Upconverter

& Distr ibution

Quadrature

Downconverter

Quadrature Upconverte

2

Quadrature

Downconverter

LPF & DC Correction

3

Phone

VCTCX

O

RTR6275_TCXO

PM6635-3P

Input Power

Management

Voltage

Regulators

General

Housekeeping

User

InterfacesICInterfaces

5

Bluetooth

e

Modul

LPF

DAC_REF

r

LPF

f

F re

PLL #1

VCO

LPF & DC Correction

Ctls

F ref

PLL #2

VCO

RTR6275_TCXO

F ref

LPF

VDDM

s

& cont rol

Dugital IO s

LPF

MSM_TCXO

ESM6270

4

FM Radio

Module

LGE Internal Use Only

Only for training and service purposes

In the GSM receive path, the received RF signals are applied through their bandpass filters and downconverted directly to baseband in the RTR6235 transceiver IC.

These baseband outputs are routed to the ESM IC for further signal processing. The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency,

is divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8- PSK modulated signal, to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the ESM

KE990/KE990c power supply voltages are managed and regulated by the PM6635 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

3. TECHNICAL BRIEF

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3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode KE990/KE990c’s receiver functions are split between the three RFICs as follows:

■ EGSM-900, DCS-1800 and PCS-1900 modes both use the RTR6235 IC only.Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters.

RF Front end consists of antenna, antenna switch module (LMSP43QA-538) which includes four RX saw filters (EGSM-900, DCS-1800 and PCS-1900). The antenna switch module allows multiple operating bands and modes to share the same antenna. In KE990/KE990c, a common antenna connects to one of six paths: 1) GSM 900 Tx (Low Band Tx’s share the same path), 2) GSM1800/1900 Tx (High Band Tx’s share the same path), 3) EGSM900 Rx, 4) GSM1800 Rx, 5) GSM1900 Rx. EGSM900, DCS1800, and PCS1900 operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

The EGSM900, DCS1800, and PCS1900 receiver inputs of RTR6235 are connected directly to the transceiver front-end circuits(filters and antenna switch module).

EGSM900, DCS1800, and PCS1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins.

Since EGSM900, DCS1800, and PCS1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module.

2

The RFIC operating modes and circuit parameters are ESM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details.

LGE Internal Use Only

3. TECHNICAL BRIEF

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[Table 3.2.1] Antenna Switch Module Control logic

LGE Internal Use Only

Only for training and service purposes

The EGSM900, DCS1800, and PCS1900 receive signals are routed to the RTR6235 through band selection filters and matching networks that transform single-ended 50-Ω•sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6235 input stages include ESMcontrolled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the ESM6270 IC for further processing

3. TECHNICAL BRIEF

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[Fig 3.2.2] RTR6235 RX feature

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

3.2.2 GSM Transmitter

The RTR6235 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure3.2.3.

The RTR6235 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design guideline shows a Quad-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band

[Fig 1.3] GSM Transmitter matching

6pF

DA_HB2_OUT

68

HB_IN

91 91

HB_OUT

RTR6235 GSM PA

5pF

DA_LB1_OUT

51

Tx

SAW

120 120

LB_IN

LB_OUT

LGE Internal Use Only

Only for training and service purposes

3.3 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE band upconverters and downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6235 IC. The synthesizer (PLL1) creates the transceiver LOs that support four GSM band receivers and transmitters including: GSM850, EGSM900, DCS1800, and PCS1900. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6235 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6235 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error

3. TECHNICAL BRIEF

- 20 -

LGE Internal Use Only

3. TECHNICAL BRIEF

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3.4 Off-chip RF Components

3.4.1 VCTCXO (X100 : TG-5010LH(19.2M))

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the ESM6270 IC. The oscillator frequency is controlled by the ESM6270 IC.s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.

The PM6635 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the ESM TCXO_EN line . The PM6635 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs.

Any GSM mode power control circuits within the ESM6270 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6635 IC REF_OUT directly to the ESM6270 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 •ÏF low frequency filter near to ESM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.4.2 Front-End Module (FL100 : LMSP43QA-538)

This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. The active connection is ESM-selected by three control lines (GPIO[9] and GPIO[10]). These GPIOs are programmed to be ANT_SEL0 and ANT_SEL1 respectively.

[Table 3.4.2] Front End Module control logic

LGE Internal Use Only

Only for training and service purposes

3.4.3 PMIC Functional Block Diagram (U501 : PM6635-3P)

■ Input power management

- Valid external supply attachment and removal detection

- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources

- Supports lithium-ion main batteries

- Trickle, constant current, constant voltage, and pulsed charging of the main battery

- Supports coin cell backup battery (including charging)

- Battery voltage detectors with programmable thresholds

- VDD collapse protection

- Charger current regulation and real-time monitoring for over-current protection

- Charger transistor protection by power limit control

- Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is optional

- Voltage, current, and power control loops

- Automated recovery from sudden momentary power loss

■ Output voltage regulation

- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG

- Three buck (step-down) switched-mode power supplies that efficiently generate ESMC, ESME, and PA (or second ESMC) supply voltages

- Supports dynamic voltage scaling (DVS) for ESMC and PA

- Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power ESMA, ESMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits.

- All regulators can be individually enabled/disabled for power savings

- Low power mode available on ESMA and ESMP regulators

- All regulated outputs are derived from a common bandgap reference - close tracking

3. TECHNICAL BRIEF

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LGE Internal Use Only

■ Integrated handset-level housekeeping functions reduces external parts count, size, cost

- Analog multiplexer selects from 8 internal and up to 18 external inputs

- Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution

- Adjusted multiplexer output is buffered and routed to an ESM device ADC

- Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures ESM device sleep clock

- Crystal oscillator detector and automated switch-over upon lost oscillation

- Real time clock for tracking time and generating associated alarms

- On-chip adjustments minimize crystal oscillator frequency errors

- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal

- TCXO buffer control for optimal QPH/catnap timing

- Three-stage over-temperature protection (smart thermal control)

■ Integrated handset-level user interfaces

- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers

- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments

- Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 Ω speakers with volume controlled 500 mW)

■ IC-level interfaces

- ESM device-compatible 3-line SBI for efficient initialization, status, and control

- Supports the ESM device’s interrupt processing with an internal interrupt manager

- Many functions monitored and reported through real-time and interrupt status signals

- Dedicated circuits for controlled power-on sequencing, including the ESM device’s reset signal

- Several events continuously monitored for triggering power-on/power-off sequences

- Supports and orchestrates soft resets

- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the ESM device to computers as a USB peripheral, or connecting the ESM device to other peripherals

- RUIM level translators enable ESM device interfacing with external modules

■ Twelve multi-purpose pins that can be configured as digital or analog I/Os, bidirectional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an LED driver, and a reference voltage buffer.

■ Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief

3. TECHNICAL BRIEF

- 23 -

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 24 -

[Figure 3.4.3] PM6635 Block Diagram

LGE Internal Use Only

3. TECHNICAL BRIEF

- 25 -

3.4.4 GSM PAM (U101:TQM7M5003)

The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency and Pout in a Polar Loop environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.

The small size and high performance is achieved with high-reliability 3 rdgeneration InGaP HBT technology. With 50Ω and output, no external matching or bias components are required. The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the AM/AM path in EDGE operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a low-profile overmolded landgrid array on laminate.

[Figure 3.4.4] GSM PAM Schematic

L112

15nH

C146 2.7p

C142

5.6nH

14

GND6

13

GND5

12

VCC

GND4

GND3

GSM_OUT

GND2

U101

TQM7M5003

GND7

GND8

17

16

6.8pC136

C138

NA

L113

5.6nH

11

10

9

8

DCS_PCS_IN

TX_EN

VBATT

GND1

VRAMP

DCS_PCS_OUT

GSM_IN

15

1

2

BS

3

4

5

6

7

R117 2.2K

C143 68p

GSM_PA_BAND MODE

LOW

HIGH

C137 1u

GSM850/900

DCS/PCS

GSM_PA_BAND

GSM_PA_EN

C135 33u

GSM_PA_RAMP

+VPWR

EFCH836MTDB1

FL101

3

G12G2

IN

1

G3

O1

5

4

R112

R111

68

10 dB

100

R114

68

R118 100

10dB

R113

R119 100

DCS_PCS_TX

100

GSM_TX

- 26 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

3.4.5 Bluetooth (M800 : LBRQ-2B43A)

The ESM6270 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are bluetooth RF module and Antenna.

Figure3.4.5 shows the bluetooth system architecture in the KE990/KE990c.

A

[Figure 3.4.5] Bluetooth system architecture

ESM 6270

Bluetooth Baseband

rt

BT_TX _RX_N

SBST

BT_DA TA

SBC K

SBD T

BT_CLK

NT

LB RQ-2B43A

SY N C_ D E T / TX _E N

RX_BB/TX _BB

BPF

16

BCM2004

CLK_REF

SBST

SBC K

SBD T

BlueQ I nterface Pa

5

4

13

11

12

Clo ck Part

9

7

LDO Part

GND Part

GND

1 2 3

678

15

VDD_I NT

VCC_OUT

XTAL_IN

VD D_M SM

VD D_BAT

Supply Part

10

14

TCXO

VR EG_M SM P

A

VD D_

- 27 -

3. TECHNICAL BRIEF

LGE Internal Use Only

3.4.6 FM Radio (U103 : TEA5766UK)

This FM Module is a single chip, electronically tuned, FM stereo radio with RDS/RBDS demodulator and decoder for low voltage applications, with fully integrated IF selectivity and demodulation. This equipment tunes the European, US, and Japanese FM bands. Figure3.4.6 shows the FM Radio system architecture in the KE990.

[Figure 3.4.6]

To MM I

From MM I

Headphon e

MAX9722B ET

To SPEAK ER

AMP

FM_AN

T

RFIN1 RFIN

HP_EAR_R/LMIDI_EAR_R/L

E

SPK_OUT+/-

2

FM Radio

TEA5766 UK

Philip

s

Audio Codec

32. 768KH z

N

FREQI

BUSE

N

INT

X

CLOCK

DATA

VAF R VAF L

WM8983

From PMIC

FM_AUDIO_R/L

HP_SPK_R/L

GRFC 3_GPIO 6

GRFC 4_AU X_SBC K_GPIO 7

I2C_SC L_GPIO27 I2C_SD A_GPIO26

ESM6270

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 28 -

3.5 Digital Baseband (DBB/ESM6270)

3.5.1 General Description

A. Features (ESM6270)

■ Support for multimode operation - GSM/GPRS/EDGE, and GPS

■ High-performance ARM926EJ-S¢‚ running at up 270 MHz

■ ARM Jazelle Java hardware acceleration for faster Java-based games and other applets

■ QDSP4000 high-performance DSP cores

■ Integrated gpsOne position location technology functionality

■ Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals

■ Qcamera¢‚ with 30 fps QVGA viewfinder resolution, and support for 4 MP camera sensors

■ Direct interface to digital camera module with video front-end (VFE) image processing

■ True 3D graphics for advanced wireless gaming

■ SecureMSM v2.0 includes support for SIM-lock and IMEI integrity, and Qfuse

■ Audio on par with portable music players

■ Vocoder support (AMR, FR, EFR, HR)

■ Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP technology

■ SD/SDIO hardware support

LGE Internal Use Only

3. TECHNICAL BRIEF

- 29 -

From CAM_MIC

Figure. Simplified Block Diagram of Baseband

CAM_MIC+

EAR_MIC_P

From MMI

From PMIC

From TOUCH WINDOW

From PMIC

MIDI_EAR_L

Headphone

MIDI_EAR_RTo MMI

MAX9722BETE

MIDI_3.3VFrom LDO

VREG_MSMP_2.7V / VREG_ MMC_3.0V

X+/-

Y+/-

LCD_ VDD_2.8VFrom LDO

Anal og

S/W

NC7SB 3157

EAR_SENSE_NVREG_MSMP_2.7V

AMP

HP_ AMP_EN From ESM

SLEEP_CLK

From PMIC

VREG_MSMP_2.7V

TOSHIBA 2G/1G

TYA000BC00HOG

Touch D river

TSC2007IYZGR

MIDI_MICP

From ESM

HP_ EAR_L

HP_EAR_ R

AUDIO CODEC

SPK_ OUT+

SPK_ OUT-To MODULE SPEAKER

From LDO

MIDI_3.3V

MOTOR+

MOTOR-To M OTOR

VREG_MMC_3.0VFrom PMIC LIN_ MOTOR_EN From ESM

FM_ANTFrom MMI

From PMIC

VREG_ MSME_1.8V

MCP

From FM RADIO

WM8983

VREG_WM_2.7V

VREG_MSME_1.8V

Linear M otor Dri ver

To RECEIVER

FM RADIO

TEA57 66UK

VREG_5V

MIC

EBI2_DA TA[0:15]

NAND_CS_N

EBI2_WE_N

NAND_ READY

SDRAM_DATA[ 0:31]

SDRAM_ADDR[0:12]

SDRAM_DQM[0:3 ]

G

SDRAM_CLK

SDRAM_CS_N

SDRAM_RAS_N

SDRAM_CAS_N

SDRAM_WE_N

SDRAM_CLK_ EN

SDRAM_ADDR[ 13:14]

TOUCH_ PENIRQ_N

TOUCH_I2C_SDA/ SCL

FM_ AUDIO_R/

CODEC_I2C_SCL

CODEC_I2C_SDA

MMP_A_BCLK

MMP_A_LRCL K

MMP_ADI_ DACDAT

MMP_A_MCLK

MMP_ADI_ ADCDAT

From PMIC

LIN_PWM_MAG

LIN_ INVETER

LIN_PWM_ FREQ

I2C_SCL/ SDA

FM_ BUSEN

FM_INTX

NAND_AL E

NAND_CLE

EBI2_OE_N

RESOUT_N

SPK_R/L

HP_R/L

MIC2P

MIC1P/1N

RCV+/-

5M

Micr oSD

Connector

SCHA1B 0102

From PMIC

Anal og

S/W

FSUSB30UMX

From 5 M CAMERA

From PMIC

From ESM

LCD_BL _CTRL

AAT31 69IFO

From PMIC

CAM_VDD_ CORE_1.2V

CAM_VDD_AF _2.7V

CAM_VDD_SA_2 .7V

CAM_VDD_SD_1.8 V

CAM_VDD_IO_2.7V

Charge

Pump

RMT_INT-USB_D +

RMT_ADC- USB_D-

EBI2_ DATA[0:15]

EBI2_ADDR [11:13]

MMP_INT_N

MMP_HPCM_CLK

MMP_HPCM_FSYNC

MMP_HPCM_DO

MMP_HPCM_DI

CAM_ MODE3_N

CAM_ MODE2_N

CAM_ MODE1_N

MMP_CS_N

NAND_AL E

EBI2_OE_N

EBI2_WE_N

NA

VREG_MSMP_2.7V

From PMIC

HD

HA

HCS0N

HCS1N

HRDN

HWRN

N

HGINT

HPCMCLK

HPCMFS

DO

HPCM

HPCMDI

MODE

W

S/

MMP_LCD_CS/ RD/WE/ADS

ZORAN

ZR3453

L

ESM

6270

MMP_XTA L_IN

27M

Crys

tal

MMP_XTAL_OUT

48M

USB_XTAL _IN

tal

Crys

USB_ XTAL_ OUT

VREG_MSMC_1.2V

VREG_MSME_1.8V

VREG_MSMP_2.7V

VREG_MSMA_2.6V

USIM_DATA /CLK/ RST_N

SSBDT_ PM

RESET_IN_N

PS_HOL D +5 V_ PWR

PM_INT_N

SLEEP_CLK

USB_OE_EN/ DAT/ SEO

PMIC

PM6635

MSM_ MICROSD_DA TA[0:3 ]

MMP_STROBE _ CHARGE

USIM_P_D ATA/CL K/RST_ N

MMP_CAM_ MCLK

MMP_CAM_ DATA[0:7]

MMP_CAM_ VSYNC/ HSYNC

MMP_CAM_ PCLK

MMP_CAM_ RESET_N

MMP_I2C_SDA/ SCL

MMP_CAM_INT

MMP_LCD_ DATA[0:15]

LCD_IF_ MODE

LCD_ MAKER_ID

LCD_RESET_N

MMP_LCD_ VSYNC I/O

MMP_ MICROSD_CLK

MMP_ MICROSD_CMD

MMP_ MICROSD_DATA[ 0:3]

MSM_ MICROSD_CL K

MSM_ MICROSD_ CMD

MMP_USB_D+/-

MSM_USB_D+/-

MMP_STROBE_ READY

MMP_VDD_ CORE_1.0V/CAM_VDD_IO_ 2.7V

LCD_ VDD_2.8V/MMP_ VDD_1.9V

VREG_MSMP_2.7V/ VREG_ MMC_3.0V/ VREG_USB_3.0V /VREG_5V From PMIC

USB_ VBUS

NA

TV_ OUT

VPWR

MICROSD_DET_

OVP

NUS3065 MUTAG

OVP

NUS3065 MUTAG

Anal og

S/W

MAX4701ETE (DATA LINE)

SLAS4717EP

(CLK/CMD

N

Anal og

S/W

FSUSB30UMX

Strobe F lash

Connector

To MMI

SIM

Connector

+5V_PWR

MMC_SELECT_NVPWR

MICROSD_DATA[ 0:3]

)

USB_ SELECT_NVPWR

From LDO

USB_VB US

LCD_VDD_2 .8V

From LDO

WLED[1:5]

WLED_PWR

From ESM

MICROSD_CLK

MICROSD_CMD

RMT_INT/ RMT_ADC

To ESM

USB_D+/-

STROBE_ TRIGGER

FLSH_DRV_N

VREG_MSMP_2.7V/ VREG_5V/ VPWR

From LDO

VREG_USIM_3.0V

From MMI

Camera

VREG_MMC_3.0V

VPWR

From PMIC

From DCDC

From LDO (SUB)

From LDO

From LDO (SUB)

From LDO

To MMI

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 30 -

Figure. Simplified Block Diagram of RF

DCS_PCS _OUT

[FEM]

LSHS-M085FH

Hitachi

5.4x4x1.

2

Blue tooth

LBRQ-2 B43A

LGIT

CLK _RE

F

BT_CL K

To MSM 6280

FM_ANTFrom MMI

RFIN1 RFIN

2

FM Radio

TEA5766UK

Philips

3.35X3.3X0.6

GSM_OUT

ANT_SEL[1:0]

From MSM 6280

SYNC_DET _TX_EN

RX_BB _TX_B

4

BT_TX_RX_N

BT_D ATA MSM6280

B

BT_S BST/ CK/DT SBST SBCK SBDT

XTAL _IN

FM_B USEN

BUSEN From MSM 6280

FM_INTX

INTX To MSM6280

I2C_SCL/DATA

CLOCK

DATA

FM_AUD IO_R /L VAFR VAFL

4BAND GSM RX (850 /900/DCS/PCS -- Balan ce)

[GSM P AM]

TQM7M5003

Triquint 7x7x1.

MSM6280

OUT

MSM6280

To WM 8983

2

4

VCTCXO

TG-5010 LH

Epson

3.3X3.5X1

[GSM Dual SAW ]

GSM_PA _RAMP

GSM_PA _EN

GSM_PA _BAND

RTR6275_TCXO

VCONT

TCXO_PM

DCS_PCS _TX

GSM_TX

GSM_SAW _SW_MODE

From MSM 6280

32.768 KHz

[RF Trance iver ]

PWR_DET _IN

WLNA _IN

T

WLNA _OU

WMIX_ INP

WMIX_INN

TCXO

TRK_ LO_ADJ

TCXO_IN

XTAL _OUT

XTAL _IN

SLEEP _CLKFREQIN

To FEM

TX_ON

GSM_PA _RAMP

GSM_SAW _SW_M

TX_IP//IM, TX_QP//QM

RX_IP//IM, RX_QP//QM

SSBDT _RTR

FM Radio &

VGA CAMERA

FM Radio

I/F

GSM_PA _BANDTo G-P AM

RTR6275

QCT

8x 8x 0.9

RF_ON

DAC_RE

FDAC_REF

SBDT SB ST

VCONTROL

BT I/F

GSM_PA _PWR_CTL _REF

)

SBDT

TCXO

TCXO_EN TCXO_EN _GPIO9

SSBDT_ PM

PMIC

PM6650 -2M

QCT

7X7X0.8

REF_OUT(MPP 8

ANT _SEL[1:0]

GSM_PA _EN

I2C_SCL/DATA

FM_INTX

FM_BU SEN

BT_CL K

BT_S BST/ CK/DT

BT_TX_RX_N

BT_D ATA

GRFX6_GPIO 9

GRFC7_GPIO 1

TX_ON_GRFC 1

PA_POWER _CTL

GRFC1_A UX_SBDT _GPIP

GRFC2_GPIO

ODE

GRFC5_ AUX_SBST _GPIO8

VDDA

1

I_OUT I_OUT_N Q_OUT Q_OUT_N

I_IP_CH0 I_IM_CH0 Q_IP_CH0

Q_IM_CH0

I2C_SCL_GPIO 27 I2C_SDA_GPIO26

GRFC4_A UX_SBCK _GPIO

GRFC3_GPIO 6

BT_CLK_GPIO2

BT_S BST_ GPIO24 BT_S BCK _GPIO 23 BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_D ATA _GPIO 20

PA_ON0

TRK_LO _AD

GSM_PA _DAC_ REF

SBCK

TCXOBUFF_

SLEEP _XTAL _I

0

4

5

MSM6280

7

5

J

4

N

LGE Internal Use Only

3. TECHNICAL BRIEF

- 31 -

3.6 Subsystem(ESM6270)

3.6.1 ARM Microprocessor Subsystem

The ESM6270 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the ESM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6235, RFR6275 and PM6635 devices.

3.6.2 GSM features

The following GSM modes and data rates are supported by the ESM6270 device hardware. Support modes conform to release '99 specifications of the sub-feature.

■ Voice features ❏ FR ❏ EFR ❏ AMR ❏ HR ❏ A5/1, A5/2, and A5/3 ciphering

■ Circuit-switched data features ❏ 9.6k ❏ 14.4k ❏ Fax ❏ Transparent and non-transparent modes for CS data and fax ❏ No sub-rates are supported.

3.6.3 GPRS features

■ Packet switched data (GPRS) ❏ DTM (Simple Class A) operation ❏ Multi-slot class 12 data services ❏ CS schemes: CS1, CS2, CS3, and CS4 ❏ GEA1, GEA2, and GEA3 ciphering

■ Maximum of four Rx timeslots per frame