LG KE970 Service Manual
Date: January, 2007 / Issue 1.0
Service Manual
Service Manual
KE970
Model : KE970
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* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KE970.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
G.C. LIM 2006/03/29 0.1
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1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. PERFORMANCE .............................11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................17
3.1 KE970 Component Block diagram.........17
3.2 Baseband Processor (BBP)
Introduction ............................................18
3.3 Power management IC ..........................30
3.4 Power ON/OFF ......................................35
3.5 SIM interface..........................................37
3.6 Memory..................................................38
3.7 LCD Display...........................................39
3.8 Keypad Switching & Scanning...............40
3.9 Keypad back-light illumination ...............42
3.10 LCD back light illumination...................43
3.11 Battery current consumption monitor...45
3.12 JTAG & ETM interface connector ........45
3.13 Audio....................................................46
3.14 Multi port switch ...................................48
3.15 USB charging circuit ............................50
3.16 BLUETOOTH.......................................51
3.17 Micro SD external memory card slot.....55
3.18 18pin Multi Media Interface connector.57
3.19 General Description .............................59
3.20 Receiver part........................................61
3.21 Transmitter part....................................62
3.22 RF synthesizer.....................................63
3.23 TCXO...................................................63
3.24 Front End Module control.....................64
3.25 Power Amplifier Module.......................64
4. PCB layout......................................65
4.1 Main & Sub PCB component
placement ..............................................65
5. Trouble shooting............................72
5.1 Trouble shooting test setup....................72
5.2 Power on Trouble...................................72
5.3 Charging trouble ....................................76
5.4 LCD display trouble................................78
5.5 Camera Trouble.....................................80
5.6 Receiver & Speaker trouble...................82
5.7 Microphone trouble ................................84
5.8 Vibrator trouble ......................................86
5.9 Keypad back light trouble.......................88
5.10 Micro SD and SIM card trouble............90
5.11 RF PART TROUBLESHOOTING ........93
6. Download & S/W upgrade...............108
6.1 S/W download setup............................108
6.2 Download program user guide.............109
7. CIRCUIT DIAGRAM ......................117
8. PCB LAYOUT................................123
9. RF Calibration ..............................129
9.1 Test Equipment Setup .........................129
9.2 Calibration Steps..................................129
10. Stand along ................................135
10.1 Test Program Setting.........................135
10.2 Tx Test...............................................137
10.3 Rx Test...............................................138
11. ENGINEERING MODE ................139
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 141
12.1 Exploded View .................................. 141
12.2 Replacement Parts ............................146
12.3 Accessory ......................................... 159
Table Of Contents
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1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KE970.
1.2. Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KE970 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KE970 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
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E. Notice of Radiated Emissions
The KE970 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KE970 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
1. INTRODUCTION
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1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE LG Electronics
1. INTRODUCTION
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OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
2. PERFORMANCE
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2.1 H/W Feature
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 800mAh
AVG TCVR Current 280mA PL5
Standby Current <2.7mA @PP9
Talk time 3hours (GSM TX Level 7)
Standby time 277 hours (Paging Period:9, RSSI: -85dBm)
Charging time 3 hours
RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm
TX output power
GSM900: 32dBm (Level 5)
DCS/PCS: 29dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display 320 x 240 pixels, 2.2 inch wide, 265K color, TFT
Soft icons
Key Pad
Status Indicator 0 ~ 9, #, *, END/PWR, SEND, CLEAR Key
Side Key
Up/Down, AF/Camera double action key
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack with Remote controller
PC Synchronization Yes
Speech coding EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
2. PERFORMANCE
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2.2 Technical specification
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
1Frequency Band TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
2. PERFORMANCE
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Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM850
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
2. PERFORMANCE
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Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850
8 Bit Error Ratio
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy 3 dB
10 SLR 8 3 dB
11 Sending Response
12 RLR -15 3 dB
13 Receiving Response
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
2. PERFORMANCE
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Item Description Specification
14 STMR > 17 dB
15 Stability Margin > 40 dB
16 Idle Noise Sending < -64dB
17 Idle Noise Receiving < -47dB
18 Side tone Distortion Three stage distortion < 10%
19
<Change> System frequency
2.5ppm
(26 MHz) tolerance
20 <Change>32.768KHz tolerance 30ppm
Standby
21 Power consumption
- Normal 5.2mA(Mix. power)
22 Talk Time
GSM900/Lvl 7(Battery Capacity 800mA) : Min. 2.5 hr
GSM900/Lvl 12(Battery Capacity 800 mA) : Min. 3hr
Under conditions, at least Min. 250 hr
1. Brand new and full 800mAh battery
23 Standby Time
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
24 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
25 Charge Voltage
Fast Charge : < 450 mA
Slow Charge: < 55mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
26 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0~ -105 dBm
2. PERFORMANCE
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Item Description Specification
Battery Bar Number Voltage( 0.05V)
4 3.86V~4.2V
27 Battery Indicator 3 3.75V~3.85V
2 3.75V~3.69V
1 3.69V~3.62V
0 3.62V~
28 Low Voltage Warning
3.62V↓ 0.05V (Call)
3.50V↓ 0.05V (Standby)
29 Forced shut down Voltage 3.35 0.05 V
1 Li-ion Battery
30 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 4.8, 0.9A
3. TECHNICAL BRIEF
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3.1. KE970 Component Block diagram.
KE970 is composed with 3 different PCB part such as main PCB, keypad FPCB and slide FPCB.
3. TECHNICAL BRIEF
Figure 1. KE970 Hardware architecture
3. TECHNICAL BRIEF
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3.2. Baseband Processor (BBP) Introduction
3.2.1 General Description
S-GOLD2TMis a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD2TMProvides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.13um, 1.5V technology. The chip will fully support the FR,
EFR, HR and AMR-NB vocoding. S-GOLD2TMsupport multi-slot operation modes HSCSD (up to class
10), GPRS for high speed data application (up to class 12) and EGPRS (up to class 12) without
additional external hardware.
Figure 2. Top level block diagram of the S-GOLD2TM(PMB8876)
3. TECHNICAL BRIEF
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3.2.2. Block Description
• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD2. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
3. TECHNICAL BRIEF
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- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)
3.2.3. External Devices connected to memory interface
Table 1 Memory interface
3.2.4. RF Interface (T_OUT)
S-Gold2 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.
Table 2 RF Interface Spec.
Device Name Maker Remark
FLASH PF38F5060M0Y0B0 Intel Synchronous / A synchronous
SDRAM PF38F5060M0Y0B0 Intel Synchronous 104MHz
LCD IL220DBN1A LGIT 8bit access 3times transmission
Melody IC Not Used S/W Infineon Software CODEC
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 VIBRATOR_EN VBRATOR ONT_OUT2 PA_BAND TX RF band select
T_OUT3 ANT_SW1 FEM control
T_OUT4 ANT_SW2 FEM control
T_OUT5 ANT_SW3 FEM control
T_OUT6 MODE PAM Mode select
3. TECHNICAL BRIEF
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3.2.5. USART Interface
KE970 have two UART Drivers as follow :
- USART1 : Hardware Flow Control / SW upgrade / Calibration
- USART2 : SW debug trace.
Table 3 USART Interface Spec.
3.2.6. ADC channel
BBP ADC block is composed of 7 external ADC channel . This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4 S-Gold2 ADC channel usage
USART_0(USART1)
Resource Name Remark
USART0_TXD TXD_0 Transmit Data
USART0_RXD RXD_0 Receive Data
USART0_CTS CTS_0 Clear To Send
USART0_RTS RTS_0 Request To Send
DSR N.C.
USART_1(USART2)
USART1_TXD TX_DEBUG Trace data tx
USART1_RXD RX_DEBUG Trace data rx
USART1_CTS N.C. N.C.
USART1_RTS N.C. N.C.
ADC channel
Resource Interconnection Description
M0 BATT_TEMP Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 JACK_TYPE Accessory type detect
M7 H/W VERSION S-Gold2 H/W version detect
M8 VSUPPLY Battery supply voltage measure
M9 I_MONITOR Current consumption measure
M10 REMOTE_ADC Remote control key detect
3. TECHNICAL BRIEF
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3.2.7. GPIO map
Over a hundred allowable resources, KE970 is using as follows except dedicated to SIM and Memory.
KE970 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
Table 5 S-Gold2 GPIO pin Map
Port function KE260 Net Name Description
KEY MATRIX
KP_IN0 KP_IN0 Refer to Key Matrix
KP_IN1 KP_IN1 Refer to Key Matrix
KP_IN2 KP_IN2 Refer to Key Matrix
KP_IN3 KP_IN3 Refer to Key Matrix
KP_IN4 KP_IN4 Refer to Key Matrix
KP_IN5 KP_IN5 Refer to Key Matrix
KP_OUT5 KP_OUT5 Refer to Key Matrix
KP_OUT0 KP_OUT0 Refer to Key Matrix
KP_OUT1 KP_OUT1 Refer to Key Matrix
KP_OUT2 KP_OUT2 Refer to Key Matrix
KP_OUT3 KP_OUT3 Refer to Key Matrix
USART_0
USART0_RXD RXD_0 UARTO, RS232 Data
USART0_TXD TXD_0 UARTO, RS232 Data
USART0_RTS_N CTS_0 UARTO, RS232 RTS
USART0_CTS_N RTS_0 UARTO, RS232 CTS
CC1CC6IO FM_INT For FM Radio Interrupt
USART_1
USART1_RXD TX_DEBUG For debugging
USART1_TXD RX_DEBUG For debugging
USART1_RTS_N Not Use
USART1_CTS_N Not Use
USB
USB_DPLUS USB_DP USB data
USB_DMINUS USB_DM USB data
3. TECHNICAL BRIEF
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MEMORY &CLK
GPIO_20 F_DPD For INTEL Memory
CLK32K CLK32K For FM Radio & BLUETOOTH
GPIO_22 Not Use
CAMERA I/F
CIF_D0 CIF_D(0) Camera DATA[0]
CIF_D1 CIF_D(1) Camera DATA[1]
CIF_D2 CIF_D(2) Camera DATA[2]
CIF_D3 CIF_D(3) Camera DATA[3]
CIF_D4 CIF_D(4) Camera DATA[4]
CIF_D5 CIF_D(5) Camera DATA[5]
CIF_D6 CIF_D(6) Camera DATA[6]
CIF_D7 CIF_D(7) Camera DATA[7]
CIF_PCLK CIF_PCLK Camera pixel clock
CIF_HSYNC CIF_HS Camera H sync
CIF_VSYNC CIF_VS Camera V sync
CLKOUT CIF_MCLK Camera main clock
CIF_PD CIF_PD Camera power down(active high)
CIF_RESET CIF_RESET Camera reset
LCD IF/
DIF_D0 DIF_D(0) LCD data[0]
DIF_D1 DIF_D(1) LCD data[1]
DIF_D2 DIF_D(2) LCD data[2]
DIF_D3 DIF_D(3) LCD data[3]
DIF_D4 DIF_D(4) LCD data[4]
DIF_D5 DIF_D(5) LCD data[5]
DIF_D6 DIF_D(6) LCD data[6]
DIF_D7 DIF_D(7) LCD data[7]
DIF_CS1 DIF_CS LCD chip select
GPIO_96 FM_BBP_SEL
Audio amp inuput select(High:
FM sound, Low: BBP sound)
DIF_CD DIF_CD Command Data switch
DIF_WR MM_WR LCD Write
DIF_RD MM_RD LCD Read
3. TECHNICAL BRIEF
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GPIO_99 _USB_CHG_EN
USB charging (High: charge disable, Low: enable)
DIF_VD (in) _TF_PWR_EN
Trans-Flash card power enable(active low)
DIF_RESET1_GPIO DIF_RESET1 LCD Reset
EINT6 REMOTE_INT For Remote Control Headset
I2c
I2C_SCL SCL For SM-Power, FM Radio, Audio AMP
I2C_SDA SDA "
PM_INT (EINT) PM_INT SM-Power interrupt
SIM CARD
CC_IO SIM_IO SIM CARD I/O
CC_CLK SIM_CLK SIM CARD CLOCK
CC_RST SIM_RST SIM CARD RESET
I2S
I2S2_CLK0 Not Use
GPIO_102 _WP Not Connected
I2S2_RX Not Use
I2S2_TX Not Use
I2S2_WA0 Not Use
I2S2_WA1 Not Use
EXTERNAL MEMORY
MMCI_CMD TF_CMD For T-Flash
MMCI_DAT[0] TF_DAT0 "
MMCI_CLK TF_CLK "
BT I/F
USIF_TXD_MTSR USIF_TXD For Bluetooth
USIF_RXD_MRST USIF_RXD "
GPIO_109 _USB_EOC
USB End of charging detect(High:
EOC, Low: charging)
GPIO_110 RPWRON
Remote power on detect (High:
Remote , Low: Normal
GPIO_111 SPK_RCV_SEL
Audio pass select( high:
Speaker, Low: Receiver)
I2S
I2S1_CLK0 I2S1_CLK For Bluetooth
GPTU0_0 FLASH_EN For Camera Flash LED
3. TECHNICAL BRIEF
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I2S1_RX I2S1_RX For Bluetooth
I2S1_TX I2S1_TX "
I2S1_WA0 I2S1_WA0 "
MMC
MMCI_DAT[1] TF_DAT1 For T-Flash
MMCI_DAT[2] TF_DAT2 "
MMCI_DAT[3] TF_DAT3 "
AUDIO I/F
EPN1 RCV_N For Receiver
EPP1 RCV_P "
EPPA1 BBP_SND_L For Speaker
EPPA2 BBP_SND_R For Speaker
MICN1 MIC1_N For Mic
MICP1 MIC1_P "
MICN2 MIC2_N For Headset Mic
MICP2 MIC2_P "
VMICP VMICP For Mic
VMICN VMICN "
RF I/F
PAOUT1
PAOUT2
BB_I
BB_IX
BB_Q
BB_QX
ADC
M_0 BAT_TEMP Battery temperature detect
M_1 RF_TEMP
RF Power amp reference temperature
detect
M_2 JACK_TYPE For 18Pin Cable Type Detect
M_7 HW revision indication
M_8 Battery voltage measurement
M_9 I_MONITOR Current consumption measurement
M_10 REMOTE_ADC
For Remote Control Headset Key detect
with REMOTE_INT
Reference
VREF
IREF
JTAG
TDO TDO For JTAG & ETM Interface
TDI TDI "
TMS TMS "
TCK TCK "
TRST_n TRSTn "
RTCK RTCK "
3. TECHNICAL BRIEF
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ETM
TRIG_IN TRIG_IN "
MON1 MON1 "
MON2 MON2 "
TRACESYNC TRACESYNC "
TRACECLK TRACECLK "
PIPESTAT[2] PIPESTAT[2] "
PIPESTAT[1] PIPESTAT[1] "
PIPESTAT[0] PIPESTAT[0] "
TRACEPKT[0] TRACEPKT[0] "
TRACEPKT[1] TRACEPKT[1] "
TRACEPKT[2] TRACEPKT[2] "
TRACEPKT[3] TRACEPKT[3] "
TRACEPKT[4] TRACEPKT[4] "
TRACEPKT[5] TRACEPKT[5] "
TRACEPKT[6] TRACEPKT[6] "
TRACEPKT[7] TRACEPKT[7] "
Memory
EBU_AD[0] D(0) Data bus[0]
EBU_AD[1] D(1) Data bus[1]
EBU_AD[2] D(2) Data bus[2]
EBU_AD[3] D(3) Data bus[3]
EBU_AD[4] D(4) Data bus[4]
EBU_AD[5] D(5) Data bus[5]
EBU_AD[6] D(6) Data bus[6]
EBU_AD[7] D(7) Data bus[7]
EBU_AD[8] D(8) Data bus[8]
EBU_AD[9] D(9) Data bus[9]
EBU_AD[10] D(10) Data bus[10]
EBU_AD[11] D(11) Data bus[11]
EBU_AD[12] D(12) Data bus[12]
EBU_AD[13] D(13) Data bus[13]
EBU_AD[14] D(14) Data bus[14]
EBU_AD[15] D(15) Data bus[15]
EBU_WR_n _WR Write strobe
3. TECHNICAL BRIEF
- 27 -
EBU_RD_n _RD Read strobe
EBU_BC0_n _BC0
EBU_BC1_n _BC1
EBU_A[0] A(0) Address bus[0]
EBU_A[1] A(1) Address bus[1]
EBU_A[2] A(2) Address bus[2]
EBU_A[3] A(3) Address bus[3]
EBU_A[4] A(4) Address bus[4]
EBU_A[5] A(5) Address bus[5]
EBU_A[6] A(6) Address bus[6]
EBU_A[7] A(7) Address bus[7]
EBU_A[8] A(8) Address bus[8]
EBU_A[9] A(9) Address bus[9]
EBU_A[10] A(10) Address bus[10]
EBU_A[11] A(11) Address bus[11]
EBU_A[12] A(12) Address bus[12]
EBU_A[13] A(13) Address bus[13]
EBU_A[14] A(14) Address bus[14]
EBU_A[15] A(15) Address bus[15]
EBU_A[16] A(16) Address bus[16]
EBU_A[17] A(17) Address bus[17]
EBU_A[18] A(18) Address bus[18]
EBU_A[19] A(19) Address bus[19]
EBU_A[20] A(20) Address bus[20]
EBU_A[21] A(21) Address bus[21]
EBU_A[22] A(22) Address bus[22]
EBU_A[23] A(23) Address bus[23]
EBU_A[24] A(24) Address bus[24]
EBU_CS0_n _FLASH1_CS Flash ROM chip select
EBU_CS1_n _RAM_CS SDRAM Chip select
EBU_CS2_n _FLASH2_CS Not used
EBU_CS3_n _CS3 Not used
EBU_ADV_n _ADV
EBU_RAS_n _RAS
EBU_CAS_n _CAS
3. TECHNICAL BRIEF
- 28 -
EBU_WAIT_n _WAIT
EBU_SDCLKO SDCLKO
EBU_SDCLKI SDCLKI
EBU_BFCLKO BFCLKO
EBU_BFCLKI BFCLKI
EBU_CKE CKE
Memory
FCDP_RBn F_DPD
TDMA RF I/F
T_OUT0 TXON_PA RF Power amp turn on
GPIO_44 VIBRATOR_EN
Vibrator enable(High: enable, Low:disable)
T_OUT2 PA_BAND RF band select
T_OUT3 ANT_SW1 RF FEM control signal 1
T_OUT4 ANT_SW2 RF FEM control signal 2
EINT3 ANT_SW3 RF FEM control signal 3
T_OUT6 MODE For RF
GPIO_50 KP_OUT(4) Key pad
EINT7 JACK_DETECT
Headset Detect(High: unplugged, Low: plugged)
CC1CC3IO LCD BACKLIGHT LCD Backlight Control
GPIO_53 LCD ID Neodis : L
GPIO_54 _FM_RESET FM Radio chip reset
GPIO_55 AU_PWR_EN Audio amp power enable( active high)
RF I/F
RF_STR0 EN RF Transceiver chip enable
GPIO_57 TF_DETECT
Micro SD card detect (High:
inserted, Low: ejected)
RF_DATA DA RF Transceiver chip data
RF_CLK CLK RF Transceiver chip clock
System port
AFC AFC
Automatic Frequency control DAC
output for 26MHz VCTCXO
CLKOUT0 [<=26MHz] Not Use
F26M 26MHZ_MCLK
Baseband processor PLL
input Main clock
3. TECHNICAL BRIEF
- 29 -
F32K Sleep crystal 32.768KHz
OSC32K Sleep crystal 32.768KHz
RESET_n _RESET Baseband processor reset
CC1CC1IO TRIG_OUT For JTAG & ETM Interface
RTC_OUT RTC_OUT
Wake up signal to alarm (High;
wake up, Low: Power off)
VCXO_EN VCXO_EN 26MHz clock enable
DSP
DSPIN0 _BT_RESET Bluetooth chip reset
GPIO_62 MIC_GAIN_SEL
Microphone gain select (High: 12dB, Low: 0dB)
GPIO_63 _SIM_EN SIM card power enable
3. TECHNICAL BRIEF
- 30 -
3.3. Power management IC
3.3.1. General Description
SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has
been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon SGOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as
well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the
Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD2 it provides all
power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone
minimizing external device count.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Backlight LEDs driver with current selection and PWM dimming function
• Two single LED driver outputs for signaling
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
• System debug mode
• VQFN 48 package with heat sink and non-protruding leads
• Compatible with the Infineon E-GOLD+ V2 and V3
3. TECHNICAL BRIEF
- 31 -
SM-POWER is a further step on the successful E-Power product line with enhanced and optimized
functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter
(SDBB) cascaded by two linear regulators (LBB1/2)
- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone
functions (e.g. organizer functions, games, MP3 decoding) possible.
- SDBB has high efficiency up to 95% and also a power save mode.
- Memory Interface is directly supported by the SDBB
- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.
- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.
Figure 3 Top level block diagram of the SM-Power(PMB6812)
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