LG KE850 Service Manual
Date: March, 2007 / Issue 1.0
Service Manual
Model : KE850
Service Manual
KE850
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* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KE850.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
Y.W.YUN 10/23 0.1
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1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. PERFORMANCE .............................11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................19
3.1 KE850 Component Block diagram.........19
3.2 Baseband Processor (BBP)
Introduction ............................................18
3.3 Power management IC ..........................31
3.4 Power ON/OFF ......................................37
3.5 SIM interface..........................................39
3.6 Memory..................................................40
3.7 LCD Display...........................................41
3.8 Keypad Switching & Scanning...............42
3.9 Keypad back-light illumination ...............44
3.10 LCD back-light illumination ..................45
3.11 Battery current consumption monitor...47
3.12 JTAG & ETM interface connector ........47
3.13 Audio....................................................48
3.14 Multi port switch ...................................50
3.15 USB charging circuit ............................52
3.16 FM radio ...............................................53
3.17 BLUETOOTH.......................................54
3.18 Micro SD external memory card slot....58
3.19 18pin Multi Media Interface connector.60
3.20 Touchpad Interface..............................62
3.21 General Description .............................63
3.22 Receiver part........................................65
3.23 Transmitter part....................................66
3.24 RF synthesizer.....................................67
3.25 VCTCXO..............................................67
3.26 Front End Module control.....................68
3.27 Power Amplifier Module.......................69
3.28 Mode Selection ....................................70
3.29 PAM Schematic ...................................70
4. PCB layout......................................71
4.1 Main & Sub PCB component
placement ..............................................71
5. Trouble shooting............................75
5.1 Trouble shooting test setup....................75
5.2 Power on Trouble...................................75
5.3 Charging trouble ....................................79
5.4 LCD display trouble................................81
5.5 Camera Trouble.....................................83
5.6 Receiver & Speaker trouble...................85
5.7 Microphone trouble ................................87
5.8 Vibrator trouble ......................................89
5.9 Keypad back light trouble.......................91
5.10 SIM card trouble...................................93
5.11 MicroSD trouble ...................................95
5.12 Touch pad trouble................................97
5.13 RF part Trouble Shooting.....................98
6. Download & S/W upgrade...............114
6.1 S/W download setup............................114
6.2 Download program user guide.............115
7. CIRCUIT DIAGRAM ......................119
8. PCB LAYOUT................................125
9. RF Calibration ..............................139
9.1 Test Equipment Setup .........................139
9.2 Calibration Steps..................................139
10. Stand along ................................145
10.1 Test Program Setting.........................145
10.2 Tx Test...............................................147
10.3 Rx Test...............................................148
11. ENGINEERING MODE ................149
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 151
12.1 Exploded View .................................. 151
12.2 Replacement Parts ............................153
12.3 Accessory ......................................... 172
Table Of Contents
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1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KE850.
1.2. Regulatory Information
A. Security
example, persons other than your company’s employees, agents, subcontractors, or person working
on your company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KE850 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KE850 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
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E. Notice of Radiated Emissions
The KE850 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KE850 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.
1. INTRODUCTION
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1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EGPRS Enhanced General Packet Radio Service
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
1. INTRODUCTION
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LGE LG Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
8PSK 8 Phase Shift Keying
2. PERFORMANCE
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2.1 H/W Feature
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 800mAh
AVG TCVR Current 270mA typ @PL5
Standby Current 2.3 mA typ @PP9
Talk time 3 hours (GSM TX Level 7)
Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM : -105dBm↓, DCS/PCS : -105dBm↓
TX output power
EGSM : 33dBm (@PL 5)
DCS/PCS: 30/29dBm (@PL 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display 240 × 400 pixels, 3 inch WQVGA, 265K color, TFT
Soft icons, 0 ~ 9, #, *, Scroll, Send, End,
Clear Key are implemented by touchpad.
Status Indicator CLEAR, SEND, END/PWR, MP3, AF/Camera
double action, Volume Up, Volume Down,
Lock
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack with Remote controller
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
2. PERFORMANCE
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2.2 Technical specification
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
1Frequency Band TX: 1710 + ( n-511 ) × 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) × 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
2. PERFORMANCE
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Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
2. PERFORMANCE
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Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
EGSM
8Bit Error Ratio
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 200 0 300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 200 0 300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
2. PERFORMANCE
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Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby
20 Power consumption
- Normal 3 mA(@PP9)
21 Talk Time
EGSM/Lvl 7 (Battery Capacity 800mA):180 min
EGSM/Lvl12(Battery Capacity 800 mA):320min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
22 Standby Time
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current
Fast Charge : < 550 mA
Slow Charge: < 120 mA
Antenna Bar Number Power
5-85 dBm ~
4-90 dBm ~ -86 dBm
25 Antenna Display 3 -95 dBm ~ -91 dBm
2-100 dBm ~ -96 dBm
1-105 dBm ~ -101 dBm
0~ -105 dBm
2. PERFORMANCE
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Item Description Specification
Battery Bar Number Voltage( 0.05V)
4 3.86V~4.2V
26 Battery Indicator 3 3.75V~3.85V
2 3.75V~3.69V
1 3.69V~3.62V
0 3.62V~
27 Low Voltage Warning
3.62V↓ 0.05V (Call)
3.50V↓ 0.05V (Standby)
28 Forced shut down Voltage 3.35 0.05 V
Li-ion Battery
29 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 4.8, 0.9A
2. PERFORMANCE
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* EDGE RF Specification (Option: is not serviced for “EDGE mode”)
Item Description Specification
1 RMS EVM
9%
2 Peak EVM 30%
395thPercentile EVM 15%
4Origin Offset Suppression ≥ 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5 Power Level 12 19dBm 3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm 3dB 8 14 dBm 3dB
1 26dBm 3dB 9 12 dBm 4dB
2 26dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
2. PERFORMANCE
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Item Description Specification
6 Output RF Spectrum DCS1800, PCS1900
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
3. TECHNICAL BRIEF
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Baseband circuit
3.1. KE850 Component Block diagram.
KE850 is composed with 2 different PCB part such as main PCB, sub PCB
The functional component arrangement is mentioned below diagram.
3. TECHNICAL BRIEF
Figure 1 KE850 Hardware architecture
Figure 2 KE850 Functional block diagram
3. TECHNICAL BRIEF
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3.2. Baseband Processor (BBP) Introduction
3.2.1. General Description
S-GOLD2TMis a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD2TMProvides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.13um, 1.5V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding. S-GOLD2TMsupport multi-slot
operation modes HSCSD (up to class 10), GPRS for high speed data application (up to class 12) and
EGPRS (up to class 12) without additional external hardware.
Figure 3 Top level block diagram of the S-GOLD2TM(PMB8876)
3. TECHNICAL BRIEF
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3.2.2. Block Description
• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD2. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-
4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
3. TECHNICAL BRIEF
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- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)
3.2.3. External Devices connected to memory interface
Table 1 Memory interface
3.2.4. RF Interface (T_OUT)
S-Gold2 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.
Table 2 RF Interface Spec.
Device Name Maker Remark
FLASH PF38F5570MMY0B0 Intel Synchronous / A synchronous
SDRAM PF38F5570MMY0B0 Intel Synchronous 104MHz
LCD TX08D13VM0AAA Hitachi 16bit access 2times transmission
Multimedia IC 215W2282EKB13NG ATI Multimedia processing
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 Other function T_OUT2 VC1 TX RF band select
T_OUT3 VC2 FEM control
T_OUT4 VC3 FEM control
T_OUT5 VC4 FEM control
T_OUT6 MODE PAM Mode select
3. TECHNICAL BRIEF
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3.2.5. USART Interface
KE850 have two UART Drivers as follow :
- USART1 : Hardware Flow Control / SW upgrade / Calibration
- USART2 : SW debug trace.
Table 3 USART Interface Spec.
3.2.6. ADC channel
BBP ADC block is composed of 7 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4 S-Gold2 ADC channel usage
USART_0(USART1)
Resource Name Remark
USART0_TXD TXD_0 Transmit Data
USART0_RXD RXD_0 Receive Data
USART0_CTS CTS_0 Clear To Send
USART0_RTS RTS_0 Request To Send
DSR N.C.
USART_1(USART2)
USART1_TXD TX_DEBUG Trace data tx
USART1_RXD RX_DEBUG Trace data rx
USART1_CTS KEYBACKLIGHT KEYBACKLIGHT
USART1_RTS TF_PWR_EN TF_PWR_EN
ADC channel
Resource Interconnection Description
M0 BATT_TEMP Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 JACK_TYPE Accessory type detect
M7 H/W VERSION S-Gold2 H/W version detect
M8 VSUPPLY Battery supply voltage measure
M9 I_MONITOR Current consumption measure
M10 REMOTE_ADC Remote control key detect
3. TECHNICAL BRIEF
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3.2.7. GPIO map
Over a hundred allowable resources, KE850 is using as follows except dedicated to SIM and Memory.
KE850 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table.
Table 5 S-Gold2 GPIO pin Map
Port function KE850 Description
Signal Name
KP_IN0 KP_IN0 Refer to Key Matrix Sheet
KP_IN1 KP_IN1 "
KP_IN2 KP_IN2 "
KP_IN3 KP_IN3 "
KP_IN4 KP_IN4 "
KP_IN5 KP_IN5 "
GPIO_06 FM_SND_SEL Output, Analog S/W Control FM Radio and Sound
KP_OUT0 KP_OUT0 "
KP_OUT1 KP_OUT1 "
USART0_RXD RXD_0 UARTO, RS232 Data
USART0_TXD TXD_0 UARTO, RS232 Data
USART0_RTS_N CTS_0 UARTO, RS232 RTS
USART0_CTS_N RTS_0 UARTO, RS232 CTS
CC1CC6IO FM_INT For FM Radio Interrupt
USART1_RXD RX_DEBUG For debugging RX
USART1_TXD TX_DEBUG For debugging TX
GPIO_18 TF_PWR_EN For Current Consumption on insulting T-Flash.
GPIO_19 KEYBACKLIGHT Using GPIO like CE500, Instead of KEYLED
of SM-Power,
USB_DPLUS USBDP USB data
USB_DMINUS USBDM USB data
3. TECHNICAL BRIEF
- 25 -
GPIO_20 F_DPD For INTEL Memory
CLK32K CLK32K For FM Radio
GPIO_22 Not Used
CIF_D0 MM_AD0 ATI Chip Address
CIF_D1 MM_AD1 "
CIF_D2 MM_AD2 "
CIF_D3 MM_AD3 "
CIF_D4 MM_AD4 "
CIF_D5 MM_AD5 "
CIF_D6 MM_AD6 "
CIF_D7 MM_AD7 "
MM_WAIT MM_WAIT For ATI, But Not used in Rev.B
CIF_HSYNC Not Use
CC0CC5IO HOOK_DETECT Headset Hook Detection, Input, High Detect(Pressed)
GPIO_89 DIF_BYPASS Output, Low in LCD Bypass Mode, High in Active Mode
GPIO_113 DSR Not Used
CIF_RESET MM_RESET0 ATI Reset
DIF_D0 MM_AD8 ATI Chip Address
DIF_D1 MM_AD9 "
DIF_D2 MM_AD10 "
DIF_D3 MM_AD11 "
DIF_D4 MM_AD12 "
DIF_D5 MM_AD13 "
DIF_D6 MM_AD14 "
DIF_D7 MM_AD15 "
MM_CS0 MM_CS0 ATI Chip Select
GPIO_96 VMM_SHDN For ATI Shutdown
MM_A16 MM_A16 ATI Interface
MM_WR MM_WR For ATI Shutdown
DIF_RD MM_RD "
EINT7 MM_INT "
3. TECHNICAL BRIEF
- 26 -
GPIO_100 USB_EOC Input, Low in USB Charging, High in End of Charge
DIF_RESET1_GPIO DIF_RESET1 LCD Reset
EINT6 REMOTE_INT For Remote Control Headset
I2C_SCL SCL For FM Radio, Audio AMP & Touch Panel
I2C_SDA SDA "
PM_INT (EINT) PM_INT "
CC_IO SIM_IO SIM CARD I/O
CC_CLK SIM_CLK SIM CARD CLOCK
CC_RST SIM_RST SIM CARD RESET
I2S2_CLK0 I2S2_CLK0 For ATI, MP3 Encoding
GPIO_102 Not Use
I2S2_RX Not Use
I2S2_TX I2S2_TX For ATI, MP3 Encoding
I2S2_WA0 I2S2_WA0 "
I2S2_WA1 Not Use
MMCI_CMD TF_CMD For T-Flash
MMCI_DAT[0] TF_DAT0 "
MMCI_CLK TF_CLK "
USIF_TXD_MTSR USIF_TXD For Bluetooth
USIF_RXD_MRST USIF_RXD "
GPIO_109 _USB_EOC For Remote Power On, Output, High Enable
GPIO_110 USB_CHG_EN For USB Charging, Output, High:Stop Charging
GPIO_111 SPK_RCV_EN For RCV/SPK Select, Output, Low:Speaker,
High:Receiver
I2S1_CLK0 I2S1_CLK For Bluetooth
GPTU0_0 FLASH_EN For Camera Flash LED
I2S1_RX I2S1_RX For Bluetooth
I2S1_TX I2S1_TX "
I2S1_WA0 I2S1_WA0 "
3. TECHNICAL BRIEF
- 27 -
MMCI_DAT[1] TF_DAT1 For T-Flash
MMCI_DAT[2] TF_DAT2 "
MMCI_DAT[3] TF_DAT3 "
EPN1 RCV_N For Receiver
EPP1 RCV_P "
EPPA1 SNDOUT_L For Speaker
EPPA2 SNDOUT_R For Speaker
MICN1 MICN For Mic
MICP1 MICP "
MICN2 HSMICN For Headset Mic
MICP2 HSMICP "
VMICP VMICP For Mic
VMICN VMICN "
M_0 BAT_ID
M_1 RF_TEMP
M_2 JACK_TYPE For 18Pin CableType Detect
M_7 HW revision indication
M_8 Battery voltage measurement
M_9 LOAD
M_10 REMOTE_ADC For Remote Control Headset
TDO TDO For JTAG & ETM Interface
TDI TDI "
TMS TMS "
TCK TCK "
TRST_n TRSTn "
RTCK RTCK "
3. TECHNICAL BRIEF
- 28 -
TRIG_IN TRIG_IN "
MON1 MON1 "
MON2 MON2 "
TRACESYNC TRACESYNC "
TRACECLK TRACECLK "
PIPESTAT[2] PIPESTAT[2] "
PIPESTAT[1] PIPESTAT[1] "
PIPESTAT[0] PIPESTAT[0] "
TRACEPKT[0] TRACEPKT[0] "
TRACEPKT[1] TRACEPKT[1] "
TRACEPKT[2] TRACEPKT[2] "
TRACEPKT[3] TRACEPKT[3] "
TRACEPKT[4] TRACEPKT[4] "
TRACEPKT[5] TRACEPKT[5] "
TRACEPKT[6] TRACEPKT[6] "
TRACEPKT[7] TRACEPKT[7] "
EBU_AD[0]
EBU_AD[1]
EBU_AD[2]
EBU_AD[3]
EBU_AD[4]
EBU_AD[5]
EBU_AD[6]
EBU_AD[7]
EBU_AD[8]
EBU_AD[9]
EBU_AD[10]
EBU_AD[11]
EBU_AD[12]
EBU_AD[13]
EBU_AD[14]
EBU_AD[15]
EBU_WR_n
3. TECHNICAL BRIEF
- 29 -
EBU_RD_n
EBU_BC0_n
EBU_BC1_n
EBU_A[0]
EBU_A[1]
EBU_A[2]
EBU_A[3]
EBU_A[4]
EBU_A[5]
EBU_A[6]
EBU_A[7]
EBU_A[8]
EBU_A[9]
EBU_A[10]
EBU_A[11]
EBU_A[12]
EBU_A[13]
EBU_A[14]
EBU_A[15]
EBU_A[16]
EBU_A[17]
EBU_A[18]
EBU_A[19]
EBU_A[20]
EBU_A[21]
EBU_A[22]
EBU_A[23]
EBU_A[24]
EBU_CS0_n CS_Flash1n For INTEL 1st 512Mbit NOR Die
EBU_CS1_n CS_RAM1n For INTEL 256 SDRAM
EBU_CS2_n CS_Flash2n For INTEL 2nd 512Mbit NOR Die
EBU_CS3_n CS3n Not used
EBU_ADV_n
EBU_RAS_n
EBU_CAS_n
3. TECHNICAL BRIEF
- 30 -
EBU_WAIT_n
EBU_SDCLKO
EBU_SDCLKI
EBU_BFCLKO
EBU_BFCLKI
EBU_CKE
T_OUT0 TXON_PA For RF
GPIO_44 VIBRATOR_EN Output, High Enable
T_OUT2 VC1 For RF
T_OUT3 VC2 "
T_OUT4 VC3 "
EINT3 VC4 "
T_OUT6 MODE For RF
GPIO_50 TP_ATTN For Touch Panel
GPIO_51 LCD_ID
Hitachi : L
CC1CC3IO LCD BACKLIGHT LCD Backlight Control
CC1CC7IO JACK_DETECT For Headset Detect
GPIO_54 RST_FM For FM Radio
GPIO_55 Not used
RF_STR0 EN For RF
GPIO_57 TFLASH_DETECT Input, Low Detect
RF_DATA DA For RF
RF_CLK CLK "
AFC AFC For RF
CLKOUT0 [<=26MHz] Not Use
3. TECHNICAL BRIEF
- 31 -
3.3. Power management IC
3.3.1. General Description
SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has
been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon SGOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as
well. It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the
Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD2 it provides all
power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone
minimizing external device count.
Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Backlight LEDs driver with current selection and PWM dimming function
F32K to 32k crystal
OSC32K to 32k crystal
RESET_n RESETn
CC1CC1IO TRIG_OUT For JTAG & ETM Interface
RTC_OUT RTC_OUT
VCXO_EN XO_ENE
CLKOUT0 26M_DAC For Audio AMP
GPIO_62 BT_RST For Bluetooth
GPIO_63 SIM_EN_n
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