LG GSA-4167B, GSA-4168B, GSA-4165B User Manual

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Supe r Mult i DVD D riv e

S E RVICE MANUAL

MODEL: GSA-4165B/

G S A - 4 1 6 7 B / G S A - 4 1 6 8 B

P/NO : 3828HS1047G

August 2005

Printed in Korea

MODEL : GSA-4165B/GSA-4167B/GSA-4168B

TABLE OF CONTENTS

INTRODUCTION .......................................................................................................................................................................3

FEATURES............................................................................................................................................................................3~5

SPECIFICATIONS.................................................................................................................................................................6~9

LOCATION OF CUSTOMER CONTROLS .......................................................................................................................10~11

DISASSEMBLY.................................................................................................................................................................12~13

1. CABINET and CIRCUIT BOARD DISASSEMBLY..........................................................................................................12

1-1. Bottom Chassis..........................................................................................................................................................12

1-2. Front Bezel Assy........................................................................................................................................................12

1-3. Cabinet and Main Circuit Board.................................................................................................................................12

2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................12

2-1. Pick-up Unit................................................................................................................................................................12

2-2. Pick-up ......................................................................................................................................................................13

EXPLODED VIEW.............................................................................................................................................................14~15

MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................16~18

GLOSSARY.............................................................................................................................................................................19

THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................20~26

1. Recording Layer..............................................................................................................................................................20

2. Disc Specification............................................................................................................................................................20

3. Disc Materials..................................................................................................................................................................21

4. Reading Process of Optical Disc.....................................................................................................................................22

5. Writing Process of CD-R Disc .........................................................................................................................................23

6. Writing Process of CD-RW Disc......................................................................................................................................23

7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................24

8. Function of PCA and PMA area ......................................................................................................................................25

9. OPC and ROPC ..............................................................................................................................................................25

10. Writing Process of DISC................................................................................................................................................26

THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVD-ROM....................................................................27~35

1. Recording Layer..............................................................................................................................................................27

2. Disc Specification............................................................................................................................................................28

3. Disc Materials..................................................................................................................................................................28

4. Writing Pulse Waveform of DVD+R.................................................................................................................................31

5. Writing Pulse Waveform DVD+RW.................................................................................................................................33

6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................34

LightScribe MEDIA...........................................................................................................................................................36~39

1. LightScribe Media............................................................................................................................................................36

2. Hardware Block Diagram of LightScribe Label Printing...................................................................................................37

3. MD Assy For LightScribe.................................................................................................................................................38

4. Optical Encoder Assy......................................................................................................................................................39

DVD & CD DATA PROCESSING......................................................................................................................................40~43

1. Data Processing Flow......................................................................................................................................................40

2. Copy Protection and Regional Code Management Block ...............................................................................................41

3. About Prevention the DVD-ROM from to be copy...........................................................................................................42

4. About the DVD-ROM Regional Code..............................................................................................................................43

INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................44~46

1. Block Diagram of the Pick-up(HOP-7632TS)..................................................................................................................44

2. Pick up Pin Assignment...................................................................................................................................................45

3. Signal detection of the P/U..............................................................................................................................................46

DESCRIPTION OF CIRCUIT.............................................................................................................................................47~53

1. ALPC Circuit....................................................................................................................................................................47

2. Focus Circuit....................................................................................................................................................................49

3. Tracking & Sled Circuit....................................................................................................................................................50

4. Spindle Circuit .................................................................................................................................................................53

MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................55~72

TROUBLESHOOTING GUIDE..........................................................................................................................................73~90

BLOCK DIAGRAM..................................................................................................................................................................91

PRINTED CIRCUIT BOARD DIAGRAM...........................................................................................................................92~96

ELECTRICAL REPLACEMENT PARTS LIST........................................................................................................................97

CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.

This service manual provides a variety of service information. It contains the mechanical structure of the Super Multi DVD Drive and the electronic circuits in schematic form. This Super Multi DVD Drive was manufactured and assembled under our strict quality control standards and meets or exceeds industry specifications and standards. This Super Multi DVD drive is an internal drive unit designed for use with IBM PC, HP Vectra, or compatible computer. It can write as much as 700 Mbytes of digital data into CD-R/RW disc, and can read as much as 700 Mbytes of digital data stored in a CD-ROM/R/RW disc.

It can write as much as 4.7Gbytes of digital data into DVD-R/RW/RAM/+R/+RW disc, and can read as much as 4.7Gbytes of digital data stored in a DVD-ROM/R/RW/RAM/+R/+RW disc. It can write as much as 8.5Gbytes of digital data into DVD+R DL/DVD-R DL disc, and can read as much as 8.5Gbytes of digital data stored in a DVD-ROM DL/+R DL/-R DL disc. This Super Multi DVD Drive can easily meet the upcoming MPC level 3 specification, and its Enhanced Intelligent Device Electronics (E-IDE) and ATAPI interface allows Plug and play integration in the majority of today’s PCs without the need of an additional interface card.

INTRODUCTION

1. Support feature and writable disc

*) Indicated write-in speed is a value at the time of the fastest operation.

G*A-4165B

GSA GMA GWA GRA GCA GDA Light Scribe x x x x x x CD-R 48x write 48x write 48x write 48x write 48x write read only CD-RW 32x write 32x write 32x write 32x write 32x write read only DVD-R 16x write 16x write 16x write read only 16x write 16x write DVD-RW 4x or 6x write 4x or 6x write 4x or 6x write read only 4x or 6x write 4x or 6x write DVD-R DL 4x write 4x write 4x write read only 4x write 4x write DVD+R 16x write read only 16x write 16x write read only read only DVD+RW 8x write read only 8x write 8x write read only read only DVD+R DL 4x or 6x write read only 4x or 6x write 4x or 6x write read only read only DVD-RAM 5x write 5x write read only read only read only 5x write

G*A-4167B

GSA GMA GWA GRA GCA GDA Light Scribe xxx xxx CD-R 48x write 48x write 48x write 48x write 48x write read only CD-RW 32x write 32x write 32x write 32x write 32x write read only DVD-R 16x write 16x write 16x write read only 16x write 16x write DVD-RW 6x write 6x write 6x write read only 6x write 6x write DVD-R DL 4x write 4x write 4x write read only 4x write 4x write DVD+R 16x write read only 16x write 16x write read only read only DVD+RW 8x write read only 8x write 8x write read only read only DVD+R DL 6x write read only 6x write 6x write read only read only DVD-RAM 5x write 5x write read only read only read only 5x write

G*A-4168B

GSA GMA GWA GRA GCA GDA Light Scribe O O O O O O CD-R 48x write 48x write 48x write 48x write 48x write read only CD-RW 32x write 32x write 32x write 32x write 32x write read only DVD-R 16x write 16x write 16x write read only 16x write 16x write DVD-RW 6x write 6x write 6x write read only 6x write 6x write DVD-R DL 4x write 4x write 4x write read only 4x write 4x write DVD+R 16x write read only 16x write 16x write read only read only DVD+RW 8x write read only 8x write 8x write read only read only DVD+R DL 6x write read only 6x write 6x write read only read only DVD-RAM 5x write 5x write read only read only read only 5x write

FEATURES

1 General

1) Enhanced IDE (ATAPI) interface.

2) Internal Half-height Drive.

3) CD-R/RW, DVD-R/-R DL(Dual Layer)/-RW/RAM/+R/+R DL(Double Layer)/+RW read and write compatible CD Family and DVD-ROM read compatible.

4) Buffer Under-run prevention function embedded.

5) 2MB buffer memory.

6) Power loading and power eject of a disc. Bare media loading.

7) MTBF : 100,000 POH

8) Vertical and Horizontal installable.

2. Supported disc formats

1) Reads data in each DVD-ROM, DVD-R(Ver. 2.0 for Authoring) and DVD-RAM(Ver.1.0)

2) Reads and writes in each DVD-R(Ver. 2.0 for General), DVD-R DL(Dual Layer), DVD-RW, DVDRAM(Ver.2.2), DVD+R, DVD+R DL(Double Layer) and DVD+RW

3) Reads data in each CD-ROM, CD-ROM XA, CD-I, Video CD, CD-Extra and CD-Text

4) Reads data in Photo CD (Single and Multi session)

5) Reads standard CD-DA

6) Support to read Super Audio CD(Compatible layer in Hybrid type)

7) Reads and writes CD-R discs conforming to “Orange Book Part 2”

8) Reads and writes CD-RW discs conforming to “Orange Book Part 3”

9) Reads DVD-RAM with CPRM and DVD-RW with CPRM

3. Supported write method

1) DVD-R:..................Disc at Once and Incremental Recording

2) DVD-R DL .............Disc at Once, incremental Recording and Layer jump recording

3) DVD-RW:...............Disc at Once, Incremental Recording and Restricted Overwrite

4) DVD-RAM:.............Random Write

5) DVD+R:.................Sequential Recording

6) DVD+R DL: ...........Sequential Recording

7) DVD+RW:..............Random Write

8) CD-R/RW: .............Disc at Once, Session at Once, Track at Once and Packet Write

4. Performance

1) Average access time: DVD-ROM 145 ms

(1/3 stroke) CD-ROM 125 ms

2) Write speed: DVD-R 2x, 4x CLV, 8x ZCLV, 16x PCAV

DVD-R DL 2x, 4x CLV

DVD-RW 1x, 2x, 4x, 6x CLV

DVD-RAM 2x, 3x ZCLV (Ver.2.2), 3x-5x PCAV(Ver.2.2)

DVD+R 2.4x, 4x CLV, 8x ZCLV, 12x, 16x PCAV

DVD+R DL 2.4x, 4x, 6x CLV

DVD+RW 2.4x, 4x CLV, 8x ZCLV

CD-R 4x, 8x, 16x CLV, 24x, 32x, 40x, 48x ZCLV

CD-RW 4x, 10x, 16x CLV, 24x, 32x ZCLV

(High Speed: 10x, Ultra Speed: 16x, 24x, 32x)

3) Read speed: DVD-R/RW/ROM/ROM-Dual layer 10x / 8x / 16x / 12x max.

DVD-R DL 8x max.

DVD-RAM (Ver.1.0/2.2) 2x / 2x, 3x ZCLV, 3x-5x PCAV

DVD-Video(CSS Compliant Disc) 8x max. (Single/Dual layer)

DVD+R/+RW 10x / 8x max.

DVD+R DL 8x max.

CD-R/RW/ROM 48x/40x/48x max.

CD-DA (DAE) 40x max.

80mm CD 16x max.

4) Sustained Transfer rate: DVD-ROM 22.16 Mbytes/s (16x) max.

CD-ROM 7,200 kB/s (48x) max.

5) Burst Transfer rate: Ultra DMA Mode2

Multi word DMA Mode2, PIO Mode 4

6) Multimedia MPC-3 compliant

5. Audio

1) 16 bit digital data output through ATA interface

2) Software Volume Control

3) Equipped with audio line output for audio CD playback

*Definition

Transfer Rate:.........1x (DVD) = 1.385 Mbytes/s..........1x (CD) = 150 kB/s

Mbytes/s = 106bytes/s, ................kB/s = 210bytes/s

Capacity:.................MB = 220bytes,.............................kB = 210bytes

SPECIFICATIONS

1. SYSTEM REQUIREMENTS

-CPU: IBM Compatible Pentium 4 2.4GHz (or faster) (For High speed, 2.4GHz or faster recommended.)

-128MB Memory or greater

2. SUPPORTING OPERATING SYSTEM

2.1 Applicable disc formats

DVD............................DVD-ROM: 4.7GB (Single Layer)

8.5GB (Dual Layer) DVD-R DL: 8.5GB DVD-R: 4.7GB (Ver.2.0 for Authoring : read only)

4.7GB (Ver.2.0 for General: read & write) DVD-RW: 4.7GB (Ver.1.2) DVD-RAM: 2.6GB/side (Ver.1.0)

1.46GB/side, 4.7GB/side (Ver.2.2) DVD+R: 4.7GB DVD+R DL: 8.5GB DVD+RW: 4.7GB

CD...............................CD-ROM Mode-1 data disc

CD-ROM Mode-2 data disc CD-ROM XA, CD-I, Photo-CD Multi-Session, Video CD CD-Audio Disc Mixed mode CD-ROM disc (data and audio) CD-Extra CD-Text CD-R (Conforming to “Orange Book Part2”: read & write) CD-RW (Conforming to “Orange Book Part3”: read & write)

2.2 Writing method

(1) DVD-R/RW...........................Disc at Once

Incremental Recording Restricted Overwrite (DVD-RW only)

(2) DVD-R DL ............................Disc at Once

Incremental Recording

Layer jump Recording

(3) DVD-RAM/+RW ...................Random Write

(4) DVD+R.................................Sequential Recording

(5) DVD+R DL ...........................Sequential Recording

(6) CD-R/RW .............................Disc at Once (DAO)

Session at Once (SAO)

Track at Once (TAO)

Packet Write

2.3 Disc diameter..............................................120mm

80mm (Horizontal only)

* Operating System

Windows Millennium Edition (Me) Window 2000 Professional Window XP Home Edition, Professional

* Recording tool

(1) Nero(Ahead) (2) In CD(Ahead) (3) Power Producer Gold (Cyber Link)

2.4 Data capacity

• User Data/Block DVD-ROM/R/RW/RAM/+R/+RW ......2,048 bytes/block

CD (Yellow Book)..........................................2,048 bytes/block(Mode 1 & Mode 2 Form 1)

2,336 bytes/block (Mode 2) 2,328 bytes/block (Mode 2 Form 2) 2,352 bytes/block (CD-DA)

2.5 RPC (Regional Playback Control) Phase2, No Region

3. DRIVE PERFORMANCE

3.1 Host interface ..................................................................X3T13 ATA/ATAPI5/1321D

INF-8090i Rev.5.3

3.2 Read/Write & Rotational speed

<Write> DVD-R...............................................................2x, 4x(CLV), 8x(ZCLV), 16x(PCAV)

DVD-R DL .........................................................2x, 4x(CLV)

DVD-RW............................................................1x, 2x, 4x, 6x(CLV)

DVD-RAM ...............................Ver. 2.2.............2x, 3x(ZCLV), 3x-5x(PCAV)

DVD+R..............................................................2.4x, 4x(CLV), 8x, 12x, 16x(PCAV)

DVD+R DL ........................................................2.4x, 4x, 6x(CLV)

DVD+RW...........................................................2.4x, 4x(CLV), 8x(ZCLV)

CD-R .................................................................4x, 8x, 16x(CLV), 24x, 32x, 40x, 48x(ZCLV)

CD-RW..............................................................4x, 10x,16x(CLV), 24x, 32x (ZCLV)

(High Speed: 10x, Ultra Speed: 16x, 24x, 32x)

<Read> DVD-ROM...............................Single layer.......6.7x - 16x (CAV), Approx. 9,420 r/min

................................................Dual layer .........5.0x - 12x (CAV), Approx. 7,770 r/min

DVD-R DL...............................8.5GB ...............3.3x - 8x (CAV), Approx 5,180r/min

DVD-Video (CSS) .............................................3.3x - 8x (CAV), Approx. 5,180 r/min

DVD-R.....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min

DVD-RW.................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min

DVD-RAM...............................Ver. 1.0/ 2.2......2x/ 2x, 3x (ZCLV)* 3x-5x (PCAV)*

DVD+R....................................4.7GB ...............4.2x - 10x (CAV), Approx. 5,890 r/min

DVD+R DL..............................8.5GB ...............3.3x - 8x (CAV), Approx. 5,180 r/min

DVD+RW ................................4.7GB ...............3.3x - 8x (CAV), Approx. 4,720 r/min

CD-R/ROM, CD-I / Video........(1.2m/s) ............20x - 48x (CAV), Approx. 9,540 r/min

CD-RW ...................................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min

CD-DA (DAE)..........................(1.2m/s) ...........16.7x - 40x (CAV), Approx. 8,100 r/min

CD-DA (Audio out)..................(1.2m/s) ...........4.0x - 10x (CAV), Approx. 2,030 r/min

* Rotational speed (CLV, ZCLV)

DVD-R/RW/ROM, +R/RW...............................1x: Approx. 1,390(Inside) - 580 r/min(Outside)

DVD-RAM................................Ver. 1.0 ...........1x: Approx. 2,390(Inside) - 1,010 r/min(Outside)

Ver. 2.2...........2x: Approx. 3,250(Inside) - 1,380 r/min(Outside)

CD-R/RW/ROM ...............................................1x: Approx. 500(Inside) - 210 r/min(Outside)

3.3 Data transfer rate

3.3.1 Sustained transfer rate

<Write> DVD-R.........................2.77, 5.54, 5.44-11.08 Mbytes/s..................................2x, 4xCLV, 8x ZCLV

9.14-22.16 Mbytes/s....................................................................16x PCAV

DVD-R DL...................2.77, 5.54 Mbytes/s....................................................................2x, 4x CLV

DVD-RW ...............1.385, 2.77, 5.54, 8.31 Mbytes/s ...................................1x, 2x, 4x, 6x CLV

DVD-RAM (Ver.2.2): ...2.77, 4.15, 4.15-6.925 Mbytes/s (w/o Verify) .......2x, 3x ZCLV, 3-5x PCAV

DVD+R........................3.32, 5.54, 8.31-11.08 Mbytes/s..............................2.4x, 4x CLV, 8x ZCLV

8.31-16.62, 9.14-22.16 Mbytes/s ..............................12x ZCLV, 16x PCAV

DVD+R DL ..................3.32, 5.54, 8.31 Mbytes/s..................................................2.4x, 4x, 6x CLV

DVD+RW.....................3.32, 5.54, 8.31-11.08 Mbytes/s.............................2.4x, 4x CLV, 8x ZCAV

CD-R...........................

600, 1,200, 2,400, 2,400-3,600, 2,400-4,800, 2,400-6,000, 2,400-7,200 kB/s (Mode-1)

..........................................4x, 8x, 16x CLV 24x, 32x, 40x, 48x ZCLV

CD-RW........................600, 1500, 2,400, 2,400- 3,600, 2,400-4,800 kB/s (Mode-1)

..........................................4x, 10x, 16x CLV, 24x, 32x ZCLV

<Read> DVD-ROM...................Single layer....9.28 - 22.16 Mbytes/s ...........................................16x max.

....................................Dual layer.......6.86 - 16.62 Mbytes/s ...........................................12x max.

DVD-R ................................................5.73 - 13.85 Mbytes/s ............................................10x max.

DVD-R DL...........................................4.58 - 11.08 Mbytes/s ..............................................8x max.

DVD-RW.............................................4.58 - 11.08 Mbytes/s .............................................8x max.

DVD-RAM ...................Ver. 1.0 ..........2.77 Mbytes/s.........................................................2x ZCLV

....................................Ver. 2.2 ..........2.77, 4.155,4.155-6.93 Mbytes/s..2x, 3x ZCLV, 3-5x PCAV

DVD+R ...............................................5.73 - 13.85 Mbytes/s............................................10x max.

DVD+R DL..........................................4.58 - 11.08 Mbytes/s..............................................8x max.

DVD+RW............................................4.58 - 11.08 Mbytes/s .............................................8x max.

CD-R/ROM .........................................3,000 - 7,200 kB/s..................................................48x max.

CD-RW........................ ......................2,500 - 6,000 kB/s..................................................40x max.

CD-DA (DAE)......................................2,500 - 6,000 kB/s..................................................40x max.

3.3.2 Burst transfer rate

Ultra DMA Mode 2..............................33.3 Mbytes/s max.

Multiword DMA Mode 2 ......................16.6 Mbytes/s max.

PIO Mode 4 ........................................16.6 Mbytes/s max.

3.4 Access time (1/3 stroke)

DVD-ROM...........................................145 ms Typ.*

(Note 1)

DVD-RAM (Ver.2.2)............................165 ms Typ.

CD-ROM.............................................125ms Typ.

(Note 1)

Note :

1) Average random access time is the typcal value of more than 50 times including latency and error correction time. Test Disc : DVD : ALMEDIO TDV-520 / TDR-820

CD : ALMEDIO TCDR-701 / HITACHI HCD-1

*) Typical value defines a measured value in normal temperature (20 deg.C.) and horizontal position.

3.5 Data error rate (Measured with 5 retries maximum)

DVD-R/RW/ROM/RAM ..................................<10

-12

DVD+R/+RW..................................................<10

-12

CD-R/RW/ROM..............................................<10

-12

(Mode-1)

<10-9(Mode-2)

Condition : It is assumed that the worst case raw error rate of the disc is 10

-3

3.6 Data buffer capacity .......................................................2 Mbytes

4. Quality and Reliability

4.1 MTBF..................................................100,000 Power On Hours(Consecutive/Cumulative POH)

Assumption : ..........................Used in a normall office environment at room temperature.

-POH per year.........................3,000

-ON/OFF cycles per year........600

-Operating duty cycle..............20% of power on time (Seek: 5% of operating time)

4.2 Tray cycle test...................................30,000 times

No degeneration in the mechanical part after test

4.3 Actuator mechanism........................1,000,000 full stroke seek

4.4 MTTR (Mean Time To Repair) ...........0.5 h

4.5 Component life .................................5 years or 2,000 h of Laser radiating time

Assumption : ..........................Used in a normall office environment.

5. POWER REQUIREMENTS

5.1 Source voltage

+5V +5% tolerance, less than 100 mVp-p Ripple voltage +12V +10% tolerance, less than 100 mVp-p Ripple voltage

5.2 Current

Idle (Hold track state)..............+5V DC .................0.9A typ. .........< 1.0 A max.

+12V DC ...............0.5A typ...........< 1.0 A max.

Write (Active)..........................+5V DC .................1.3A typ. .........< 1.5 A max.

+12V DC................0.9A typ. .........< 1.5 A max.

Read (Active)..........................+5V DC .................1.0A typ. .........< 1.5 A max.

+12V DC................0.9A typ. .........< 1.5 A max.

Seek (Acess) ..........................+5V DC .................1.0A typ. .........< 1.5 A max.

+12V DC ...............1.2A typ. .........< 2.0 A max.

5.3 Standby

Sleep mode (No disc).............1.1 W typ. 1.3 W max.

6. AUDIO PERFORMANCE

Output Level (1kHz, 0dB)........................................................0.7 Vrms typical

Frequency Response..............................................................+/-3dB (20 to 20,000Hz)

Signal to Noise Ratio...............................................................80 dB min. with IHF A and LPF 20 kHz

THD (1kHz, 0dB).....................................................................0.10% max. with LPF 20 kHz

Channel separation(10kHz).....................................................65 dB min.

Condition:................................................................................Load inpedance : 10 kohms

7. Acoustic noise

Less than 50dB, A scale, at 0.5 m away from the drive Note : 1. Disc : Less than imbalance 0.3 x 10-4Nm

2. Installation : Horizontal

3. Ambient temperature : Normal temperature

4. Except loading, unloading and seek

8. Dimensions

External dimensions (W x H xD) 146 x 41.3 x 165mm(without Bezel) Front bezel (WxHxD) 148 x 42 x 5 mm

9. Mass .................................................Approx. 0.77+/-0.03 kg

* Which is not provided with Circuit Diagram of this model. Please Contact the friendly staff of LG

Service Care at: Website http: //www.LGEservice.com

LOCA TION OF CUSTOMER CONTROLS

1. Disc tray

This is the tray for the disc. Place the disc on the ejected disc tray, then lightly push the tray (or push the eject button) and the CD will be loaded.

NOTE: Don’t pull out or push in the disc tray forcibly. This might cause damage to the loading section of the drive.

2. Stop/Eject button

This button is pressed to open the CD tray. This button works only when power is supplied to the drive.

3. Emergency Eject Hole

Insert a paper clip here to eject the Disc tray manually or when there is no power.

4. Drive activity indicator

Two colored LED is used to indicate the operation of the Drive.

Drive Activity Indicators

Stop/Eject Button

Disc Tray

Emergency Eject Hole

Front Panel

1. Power Connector

Connects to the power supply (5-and 12-V DC) of the host computer.

NOTE : Be careful to connect with the proper polarity. Connecting the wrong way may damage the system (and is not guaranteed). Usually this connector can only be attached one-way.

2. IDE Interface Connector

Connect to the IDE (Integrated Device Electronics) Interface using a 40-pin flat IDE cable.

NOTE : Do not connect or disconnect the cable when the power is on, as this could cause a short circuit and damage the system. Always turn the power OFF when connecting or disconnecting the cable.

3. Jumper Connector

This jumper determines whether the drive is configured as a master or slave. Changing the master-slave configuration takes effect after power-on reset.

4. Analog Audio Output Connector

Provides output to a sound card (analog signal). Generally you need this to play a regular audio CD.

5. Digital Audio Output Connector

This connector is not supported.

Digital Audio Output Connector

Jumper Connector

Analog Audio Output Connector

IDE Interface Connector

Power Connector

Rear Panel

NOTE: The actual drive may be different from this design.

1. CABINET and CIRCUIT BOARD DISASSEMBL Y

1-1. Bottom Chassis

A. Release 4 screws (A) and remove the Bottom Chassis

in the direction of arrow (1). (See Fig.1-1)

1-2. Front Bezel Assy

A. Insert and press a rod in the Emergency Eject

Hole and then the CD Tray will open in the direction of arrow (2).

B. Remove the Tray Door in the direction of arrow

(3) by pushing the stoppers forward.

C. Release 3 stoppers and remove the Front Bezel Assy.

1-3. Cabinet and Main Circuit Board

A. Remove the Cabinet in the direction of arrow (4).

(See Fig. 1-3)

B. When the CD tray has been opened completely, lift

2 points (a) and remove the CD tray while drawing out simultaneously.

C. Remove the Soldering of the LD- and LD+ (b) for

the Loading Motor, and then remove the Main Circuit Board.

D. At this time, be careful not to damage the 4

connectors of the Main Circuit Board.

2. MECHANISM ASSY DISASSEMBL Y

2-1. Pick-up Unit

A. Release screws (B). B. Separate the Pick-up Unit in the direction of arrow (6).

Main Circuit Board

Cabinet

(4)

(5)

(a)

(b)

(A)

(1)

Bottom Chassis

Fig. 1-1

Fig. 1-2

DISASSEMBLY

Fig. 1-3

Mechanism Assy

Pick-up Unit

(6)

(B)

Fig. 2-1

(3)

Stoppers

Emergency Eject Hole

(2)

Tray Door

CD Tray

Front Bezel Assy

2-2. Pick-up

A. Release 1 screw (C) and remove the Pick-up.

Pick-up Unit

Pick-up

(C)

Fig. 2-2

030

014

007

A02

A01

A03

021

028

452

032

452

020

021

050

430

005

035

004

006

A B C D E F GH

452

024

481

034

027

026

033

025

430

445

020

453

031

036

453

010

011

009

008

012

016

015

013

PBM00 (MAIN C.B.A)

PBF00 (FRONT C.B.A)

482

001

482

003

002

(LightScribe only)

14 15

EXPLODED VIEW

ATIP Absolute Time in Pre-groove. With an additional modulation of the “Wobble”, the “Groove” contains a time

code information.

Wobble The pre-groove in the Disc is not a perfect spiral but is wobbled.

With : – A typical amplitude of 30 nm

– A spatial peried of 54~64 µm CW Continuous Wave. The laser light output is at a constant level. DOW Direct Over-Write. The action in which new information is recored over previously recorded information in

CD-RW disc.

Overwrite

The action in which new information is recorded over previously recorded information.

(Pre-)Groove

The guidance track in which clocking and time code information is stored by means of an FM modulated wobble.

Land Land is characterized in the following way:

When radial signals are concerned,land is defined as the area between the grooves. When HF signal are concerned,land is defined as the area between the marks(pits) in tangential direction.

Hybrid Disc A Multisession disc of which the first Session is mastered. On a hybrid disc, recorded and

mastered information may co-exist.

Mastered Information,stored as pits on the disc during the manufacturing process of the disc. Information (when making the master)

OPC Optimum Power Control. Procedure is determined optimum recording power according to CD-

R/RW Media in recording start step.

ROPC Running OPC. The purpose is to continuously adjust the writing power to the optimum power

that is required. When the optimum power may change because of changed conditions of disc and change in operating temperature.

Jitter The 16 value of the time variation between leading and trailing edges of a specific (I3 … I11) pit

or land as measured by Time Interval Analysis. Deviation The difference between a fixed value of Pit length and Land length. TOC Table Of Contents : in the Lead-in Area the subcode Q-channel contains information about the

Tracks on the disc. Packet A method of writing data on a CD in small increments.

Writing Two kinds of packets can be written : Fixed-length and Variable-length. Write The shape of the HF write signal used to modulate the power of the laser.

Strategy The Write Strategy must be used for recordings necessary for disc measurements. Information Wobble, ATIP, Disc Identification, Write Power, Speed Range OPC Parameters, etc are

Area recorded in the Information area of CD-RW Disc Finalization The action in which (partially) unrecorded or logically erased tracks are finished and the Lead-in

and/or Lead-out areas are recorded or overwritten with the appropriate TOC subcode. Logical Erase

A method to remove information from a disc area by overwriting it with an EFM signal containing

mode 0 subcode

A logically erased area is equivalent to an unrecorded Physical Erase

The action in which previously recorded information is erased by overwriting with a CW laser

output.

After a Physical Erase action, the erased area on the CD-RW disc is in the unrecorded state

again. Session

An area on the disc consisting of a Lead-in area, a Program area, a lead-out area. Multi session

A session that contains or can contain more than one session composed Lead-in and Lead-out

GLOSSARY

The differences of CD-R/CD-RW discs and General CD-ROM

1.Recording Layer

Recordable CD has a wobbled pre-groove on the surface of disc for laser beam to follow track.

2.Disc Specification

Read-only Disc

CD-R and CD-RW Disc

3~1 1T

1.6um

0.4~0.5 um

(Pit)Groove

Land

Track pitch(p)

Radial Direction

Groove

Land

Radial Error Signal

The Groove wobble

Average center

Actual center

CD-ROM (READ-ONLY DISC)

a=30nm

ITEM CD-ROM CD-R CD-RW

Standard Yellow Book Orange Book II Orange Book III

Record Not available Write once Re-Writeable

Tracking Signal I11/Itop > 0.6 > 0.6 0.55 > M11> 0.70

(HF Modulation)

Read Laser Power(mW) < 0.5 mW < 0.7 mW < 1.0 mW

Jitter < 35 nsec < 35 nsec < 35 nsec

Reflectivity (R

top) 70 % 65 % 15 % ~ 25 %

Remark)

Write Laser Power(mW) 14-65 mW 6-45 mW

3.Disc Materials

1) CD-ROM disc

Laser Beam

Groove

Substrate (Polycarbonate)

Organic Dye Layer

Reflective Layer

Protective Layer

Label Printing

2) CD-R disc

Pigment Reflective Layer Color

Phtalocyanine Gold/Silver Yellow/White

Cyanine Gold/Silver Dark Green/Bright Green

Azo Gold/Silver Dark Blue

• It is composed of Silver _ colored aluminum plate and Reflective layer.

• Groove (Pit) of aluminum plate make a track.

• Laser wavelength : 780 nm, Laser Power (Read): 0.5mW

• Signal is detected by the

difference of reflective beam intensity between “pit” and

“Land” on the disc.

• It is so-called WORM (Write Once Read Many) CD.

• It is composed of polycarbonate layer, Organic dye layer, Reflective layer, and Protective

layer.Gold/Silver Reflective layer is used to enhance the reflectivity

• According to the kinds of Organic dye layer, it is divided by Green CD, Gold CD, Blue CD.

• Laser Wavelength : 780 nm, Laser Power (read) : 0.7 mW

• Recording Power : 8x(14~20mW), 16x(25~35mW)

• When some part of dye layer is exposed to laser heat, it’s color changs black.Therefore, writing and

reading is enabled by the difference of reflectivity between changed part and unchanged part.

• Polycarbonate layer has Pre_Groove which make a Track.

Laser Beam

Pit

Substrate (Polycarbonate)

Reflective Layer

Protective Layer

Label Printing

3) CD-RW Disc

Reading process of Optical Disc

Laser Beam

Groove

Substrate (Polycarbonate)

Recording Layer

Dielectric Layer(TL)

Dielectric Layer(UL)

Protective Layer

Label Printing

• It is composed of polycarbonate layer, alloy(silver, arsenic) layer, aluminum reflectivity layer, protective layer.

• An crystalized alloy layer is transformed into noncrystalized by the laser heat. Therefore, writing and reading

is enabled by the difference of reflectivity.

• It is possible to overwrite about 1000 times.

• Laser Wavelength : 780 nm, Laser Power (Read) : 1.0mW

• Recording Power : Erase (4~18mW), Write (6~45mW)

• When disc rewriting, new data is overwritten previously recorded data.

• Polycarbonate layer has a Pre-Groove which make a track.

Lens

Beam Spot

Focusing Lens

Laser Spot at Constant Read Intensity

Reflected Light Signal

Laser Spot Position (Time)

Previously Recorded Marks

Groove Land Mirror

top

Numerical aperture: NA=nsinθ,

n: Refractive index Focus depth : H = λ/NA laser spot diameter : D =

/NA

5.Writing Process of CD-R Disc

a b c d e f g

Incident Laser Power

(Read)

(Write)

Laser Spot Position (Time)

a b c d e f g

Laser Spot Position (Time)

Laser Spot

Recorded Mark

Reflected Light Signal

Below "ORP"– Mark Too Short

At Optimum Record Power ("ORP")

Above "ORP" – Mark Too Long

Time

6.Writing process of CD-RW Disc

Write Power

Erase Power

Read Power

Groove

Crystal

Amorphous

Recorded state

(lower reflectivity)

Melting/

quenching

Heating/

gradual cooling

Crystal phase

Erased state

(higher reflectivity)

7.Organization of the PCA, PMA and Lead-in Area

1) Layout of CD-ROM disc

Center hole Clamping and Label Area Information Area

Lead-in Area

Diameter 15 mm

Diameter 46 mm

Diameter 120 mm

Program Area

Read Only Disc

Lead-out Area

Program Area Lead-out Area

Center hole

Clamping and Label Area

Information Area

PCA PMA

Test Area Count Area

Diameter 15 mm

Diameter 45 mm

Diameter 120 mm

Unrecorded Disc

Tsl-00:35:65 Tsl-00:15:05

Tsl-00:13:25

Tsl

99:59:74 00:00:00

in out

Test Area : for performing OPC procedures. Count Area : to find the usable area immediately in T.A Tsl : start time of the Lead-in Area, as encoded in ATIP PMA : Program Memory Area

Disc Center

2) Layout of CD-R/RW disc

8. Function of PCA and PMA area

1) PCA (Power Calibration Area)

• PCA area is used to determine the correct Laser Power for a disc. – Method 1 : PCA area is divided by a track. – Method 2 : The previous Calibration value is referred. – Method 3 : ROPC is used to determine Laser Power value automatically in data writing.

• CD-R Disc can write maximum 99 Tracks but CD-RW Disc can write unlimited tracks because it has a rewritable

function.

2) PMA (Program Memory Area)

• It has a track information (track No, track Start/End time) of every track before writing completed. – PMA area has the last written point and the next writable point of a disc. – In case of CD to CD copy, some writer may not write PMA area.

* When Disc is Finalized,

PMA information is transferred to the Lead_In area so that general Driver can read it.

* Because PCA and PMA area exist before Lead-In area, General CD Player or CD-ROM Drive can’t read

these areas.

9. OPC and ROPC

1) OPC (Optimum Power Control)

• This is the first step of writing process, because CD writer has its own laser power value and media have different writing characteristics,

– This is determined by the Writing characteristic, speed, temperature, and humidity. – Laser wavelength is determined by the environmental temperature (775~795nm) and Optical Laser Power is

determined by the test and retry.

• Asymmetry and optimum writing Power

– EFM signal Asymmetry is determined by the writing power.

Therefore, Optical Power which has the same value to the preset power value can be estimated by measuring HF signal Asymmetry on the PCA area.

• Measurement of Asymmetry

* Parameter setting (Beta) : Using AC coupled HF signal before equalization

Beta = (A1+A2)/(A1-A2)

Time

P << Po

Time

P = Po

HF Signal

Time

P >> Po

2) ROPC (Running Optimum Power Control)

• Variable primary factor of Optimum Power

– Change of Power sensitivity on the Disc. (limited to 0.05 *Po) – Wavelength shift of the laser diode due to the operating temperature change. – Change of the Spot aberration due to the Disc skew,

Substrate thickness, Defocus.

– Change of Disc or Optics conditions due to the long term OPC

==> It is necessary to adjust continuously to obtain the Optimum Power.

• Principle of Running OPC

– To meet the factors mentioned above,

a horizontal _ direction movement of a curve is uesd.

– Beta = f(B-level) = constant on the Recorded Disc – Procedure of ROPC

a. Reference B-level is determined during OPC Procedure. b. During Recording, B-level value is controlled to have a close

Reference B-level value.

c. Normalization of B-level is used to eliminate the effect of reflectivity fluctuation.

==> The reflected B-level value is normalized by the disc reflectivity itself.

CD-R/RW Media

Write Strategy Determination

PCA Test Area

Program Area

PMA Area

Lead-In Area

Lead-out Area

OPC

PCA Count Area

ROPC

* Recording Capacity of CD-R/RW (74Minute Recording media)

• (2048 Byte/Sector) X (75 Sector/Second) X (60 Second/Minute) X 74 Minute = 681,984,000 Bytes = 682 Mbytes

• But the actual recording capacity is about 650 Mbytes. (according to the ISO 9660 standard, approximately 30 Mbytes are used to make directory structure and volume names.)

Incident recording pulse

Reflected recording pulse

Sampled timing B

11T

Sample B-level (Write Power)

Level B

Sampled at timing B

Pwo decided by OPC

Recording Power

Level B with Pwo

normalized to recording power

Sample Disc Reflectivity (Read power)

10. Writing Process of DISC

The differences of DVD-R/RW , DVD+R/R W discs and DVD-ROM

1.Recording Layer

LPP (Land Pre-Pit)

DVD+R/RW Disc

DVD-R/RW Disc

0.74

0.4 um

DVD-ROM (Read Only Disc)

2.Disc Specification

3.Disc Materials

1) DVD-ROM

DVD-ROM

Media T ype

User data capacity

Single-Layer

Read Only

4.7GB

Dual-Layer

Read Only

8.54GB

DVD-R DVD-RW DVD+R DVD+RW

Dye Phase change Dye Phase change

4.7GB 4.7GB 4.7GB 4.7GB

Wavelength

650nm 650nm 650nm 650nm 650nm 650nm

Reflectivity

45~85% 18~30nm 45~85% 18~30% 45~85% 18~30nm

Track pitch

0.74 0.74 0.74 0.74 0.74 0.74

Minimum pit length

0.4 0.44 0.4 0.4 0.4 0.4

Modulation

>0.6 >0.6 >0.6 >0.6 >0.6 >0.6

Channel bit-rate

26.16MHz 26.16MHz 26.16MHz 26.16MHz 26.16MHz 26.16MHz

Wobble Frequency

- - 140KHz 140KHz 817.4KHz 817.4KHz

Addressing

26.16MHz 26.16MHz Wobble & LPP Wobble & LPP Wobble(ADIP) Wobble(ADIP)

Read Power (mW)

0.7 0.1 0.7 0.1

Write Power ( mW)

- -

JItter

<8% <8% <8% <8% <9% <9%

Bonding layer

Polycarbonate

Semi-reflective Polycarbonate

Reflective layer

Label Polycarbonate

Label

Bonding layer Reflective layer

Polycarbonate

2) Recording format using organic dye material (DVD-R/DVD+R)

* The format that records data through the creation of recorded marks by changing the organic dye material

with a laser beam.

DVD-R

Adhesive layer

Protective layer Reflective layer

Recording layer(dye) Disc substrate

DVD+R

Adhesive layer Protective layer

Reflective layer Recording layer(dye)

Disc substrate

Adhesive layer

Protective layer

Reflective layer

Dye layer

Substrate

Laser beam

> Disc structure

[Recording] Recording is done by changing the organic dye layer and the substrate with a laser when a strong is applied to a disc, the temperature of the ortanic dye material goes up, the dye is decomposed and the substrate changes at the same time. At this time, a durable bit is created as is the case with a CD-ROM.

[Playback]

Signals are read with the differences of the reflection of a laser from pits.

3) Recording format using phase-change recording material (DVD-RW/DVD+RW)

* Data is recorded by changing the recording layer from the amorphous status to the crystalline status, and

played back by reading the difference of the reflection coefficient.

[ Amorphous : Non-crystalline ]

Substrate

Laser beam

Recording data

(Melting/Quick cooling)

Erasing data

(Heating/Gradual cooling)

Data erased state

(High reflection coefficient)

Recorded state

(Low reflection coefficient)

Crystalline status

Amorphous status

DVD-RW

Adhesive layer Protective layer Reflective layer

Dielectric layer Recording layer

(Phase change material)

Dielectric layer Disc substrate

DVD+RW

Adhesive layer Protective layer Reflective layer

Dielectric layer Recording layer

(Phase change material) Dielectric layer

Disc substrate

> Disc structure

> Recording principles

[Recording]

When a high-power laser is applied to the recording material, it melts and then becomes amorphous with a low reflection coefficient when it quickly cools off. When a mid-power laser is applied to heat gradually the recording material and then gradually cools it off, it becomes crystal with a high reflection coefficient.

[Playback]

A low-power laser is used for playback. The amount of reflected light depends on the status (amorphous or crystalline) of the recording material. This is detected by an optical sensor.

4. Writing Pulse Wave Form of DVD+R

For different speed ranges, different write strategies can be used. This document specifies 2 options:

- a pulsed write strategy, where each single mark is created by a number of subsequent separated short pulses.

- a blocked write strategy, where each single mark is created by one continuous pulse.

1) 1stMethod : Using Pulsed Write Strategy

* 3T :

NRZI

T = 3

2Tw

Ttop

dTtop

dTle

top

top le

Channel bits

N = 3 : only the top pulse(T ), first pulse lead-time dT , dT

NRZI

T > 4

2Tw Tw

Ttop Tmp

Tmp

Tlp

dTtop

dTle

top

Channel bits

N > 4 : the top pulse (T ), multi-pulse (T ) and last pulse (T ), first pulse lead-time dT , dT

Pp : Actual write power Pb : Bias Power

* > 4T :

2) 2stMethod : Using Blocked Write Strategy

NRZI

Channel bits

2Tw

top

0mW

1.25T

3T mark

4T mark

5T mark

Etc.

top,3

1.25T

top,4

lpT

N = 3 : T (cm = 3) can be optimized individually. N > 4 : T (cm 4) + x (N-3) T + T , T = T P shall be < 0.1mW

top

Pp : Actual write power Pb : Bias Power dPp : Additional power ( Only be applied for the 3T and 4T marks) Pc : Cooling power (Especially at higher recording speeds, optimum cooling down of the recording layer after writing a mark may be

needed.)

5. Writing Pulse Wave Form of DVD+RW

NRZI

Channel bits

2Tw

Ttop

dTtop

dTera

Pp : Actual write power Pe : E r as e Powe r Pb : Bias

Power

0mW

6. Organization of the Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone

1) Layout of DVD-ROM disc

Center hole

1st transition area

2nd transition area

Clamping Zone

3rd transtion

area

Information Zone

Lead-in Zone

Lead -out Zone

Diameter 15 mm

Diameter 16 mm

Diameter 22 mm

Diameter 33 mm

Diameter 44 mm

Diameter 120 mm

Data Zone

Read Only Disc

Lead-out Zone

Data Zone

Outer Drive Area

Inner Drive Area

Inner Disc Test Zone

Outer Disc Test Zone

Unrecorded Disc

PSN: 23080H 27080H 27480H 28480H 2A480H 30000H 260540H 261940H 262940H

263940H

267940H

in OUT

Disc Center

Rim area

Center hole

1st transition area

2nd transition area

Clamping Zone

3rd transtion

area

Information Zone

Diameter 15 mm

Diameter 16 mm

Diameter 22 mm

Diameter 33 mm

Diameter 44 mm

Diameter 120 mm

Disc Center

Rim area

Inner Disc Count Zone

Outer Disc Count Zone

2) Layout of DVD+R disc

> Inner Disc Test Zone : for performing OPC procedures. > Inner Disc Count Zone : for counting the number of OPC algorithm performed in IDT Zone. > Outer Disc Test Zone : for performing OPC procedures. > Outer Disc Count Zone : for counting the mumger of OPC algorithm performed in IDT Zone.

3) Layout of DVD+RW disc

Lead-in Zone

Lead -out Zone

Data Zone

Inner Disc Test Zone

Outer Disc Test Zone

Unrecorded Disc

PSN: 2A480H 2A7C80H 2DC80H 30000H 260540H 262940H

265940H

266140H

in OUT

Center hole

1st transition area

2nd transition area

Clamping Zone

3rd transtion

area

Information Zone

Diameter 15 mm

Diameter 16 mm

Diameter 22 mm

Diameter 33 mm

Diameter 44 mm

Diameter 120 mm

Disc Center

Rim area

Inner Disc Count Zone

Outer Disc Count Zone

LightScribe Media

1. LightScribe Media

Center Hole

Screen Printed Imaging Layer Clear Protective Coating

Reflective/Thermal Layer Dye Data Layer

Polycarbonate Substrate

DiscOD

Label Zone

Control Feature Zone

Clamping/Logo Zone

2. Hardware Block Diagram of LightScribe Label Printing

Host

(Spindle)

(DSP)

Power

Drive

Analog

Signal

Processor

MECHANISM

Optical

Pick-up

Optical

Encoder

(Sled)

(Track)

(Tilt)

(Focus)

RFOUT

Spindle Motor

Step Motor

Track Actuator

Tilt Actuator

Focus Actuator

Laser Power Reference

Write Strategy Control

Buffer

Memory

SERVO Signals

RF Cell Signals

Laser Power Monitor Signal

Optical FG

CIrcuit

3. MD Assy For LightScribe

Optical Encoder Unit

OPU ID Movement Range : L=21um

4. Optical Encoder Assy

Codewheel

Direction of radial play

CODEWHEEL OR CODESTRIP

FFC 3PIN

SIGNAL PROCESSING CIRCUITRY

LED

CH A CH B

CH B

GND

GND Vcc

OFG

Encoder PCB

PIN 6 VCC

PIN 5 CH A

PIN 4 GND

PIN 3

VLED

PIN 2

GND

PIN 1 CH B

PIN 6 VCC

PIN 5 CH A

PIN 4 GND

PIN 3

VLED

PIN 2

GND

PIN 1 CH B

Optical Encoder IC

Schematic of Enc PCB

DVD & CD DATA PROCESSING

1.Data Processing Flow

Command

Data

Status

RF EQ & AGC

SERVO

DSP

Encoder & Decoder & CSS

RF data slice EFM demodulator

CiRC error correction

Audio DAC

Buffer/Memory controller

CSS controller

Atapi interface control

Data PLL

Servo ADC

Focus/tracking

control output

Sled control output

CAV Spindle control

P-up

Unit

(HOP-7632TS)

IC101

RF AMP

(R2S35002)

DVD

IC301

(R8J32007)

TE/CSO GEN

FE GEN

DRAM

U-COM

SRAM

IC302

Flash ROM

R8J32007

HOST DVD

PLAYER

(EMPEG2 B/D)

Scrambled MPEG Data

Change the "KEY"

KEY Management Control

2. Copy Protection and Regional Code Management Block

Block Diagram

Brief Process

1. Regional Code for DVD Disc

– DVD-ROM drive transfers the regional code of the control data to host by the command of host, the DVD

player of host reads the regional code, and plays title in the case of allowed regional code only.

2. Management of DVD Disc for the scrambled of data

(1) DVD-ROM and DVD player of host generate the “KEY 1” respectively, transfer to opposite part, the

“KEY 2” is received, recognizes the data transfer or not with this value, and generates the bus key

encoded the data. (2) Encoded “Disc Key” and “Title Key” host is transfer with the bus Key. (3) DVD player of host reads the key value, and uses the value to restore the scrambled data.

* Refer to the next page for the details.

3. About Prevention the DVD-ROM from to be copy

A data is able to encode and record in the disc, if a copyright holder wants to prevent the disc from copying.

In case of a disc enhanced movie of 3 titles......

DISC KEY (2048 Bytes) is used to encode the whole contents in the disc and TITLE KEY (5 Bytes) is used to encode the title respectively. So, the data is encoded and stored in a disc through the unknown algorithms with a disc key and title key. (At this time, the disc key and title key are stored in a disc.) …As above, the disc is able to copy when the disc key and title key are opened. Then, ROM-DRIVE encodes the disc key and title key and transfers to MPEG2 board.

If you want to play the disc prevented from the copy......

First of all, ROM-DRIVE and MPEG-2 board identify with each other through the procedure as described below.

1. Drive and host gives and takes the ID of 2bit. This ID is AGID (Authentication Grant ID). The various decoder boards are attached to the host, in these, AGID sets the MPEG-2 board and drive.

2. After the AGID is set, MPEG-2 board generates the challenge key (10 Byte) and transfers to drive. The board and drive generate key 1 (5Byte) with the challenge key respectively. (Of course, the Algorithm generating the key 1 is not known.)

3. Compare with the generated key 1, if it corresponds each other, the first step of authentication is completed. This is a course to identify the MPEG-2 board with a drive.

4. The second step of authentication is a course to identify a drive with the MPEG-2 board. The dirve generates a challenge key and transfers it to the MPEG-2 board. The dirve and MPEG-2 board generate the key 2 (5Byte) with the challenge key, compare with each other, and if it corresponds and the secondary step of authentication is completed.

5. As above, the identification is completed.

6. The dirve and MPEG-2 board generate the Bus key with the key 1 and key 2 and own it.

7. Dirve encodes the disc key and title key with this Bus key and transfers to the MPEG-2 board.

8. The MPEG-2 board reads the encoded disc key and title key with the Bus key only.

9. MPEG-2 board lets data read from the drive to decode with the read disc key and title key and makes into the video signal by decoding.

ROM-DRIVE

AGID

HOST

MPEG-2 BOARD

Challenge key

encoded disc key, title key

4.About the DVD-ROM Regional Code

DISC ROM - DRIVE MPEG-2 BOARD VGA CARD

MONITOR

CAN

U.S.A

MIX

CUB

BHS

PRI. VIR

BMG

GRL

ZAF ISO SWZ

FIN

POI

FST

LTU

BIR

UKR

TUR

FGY

JRN

TKM

AFG

PAK

CHN

MMR

MNG

RUS

KOR

JPN

HKG

MAC

TWN

PHL

MDI

MNP

GUM

PLW

PNG

NZL

AUS

The disc has the regional code of 8 bit.

Example)

The disc manufactured in the U.S.A, has the number one.

Transfer to MPEG-2 board reading the regional code.

Receiving data from the MPEG-2 board and output through the monitor

If the board is setting to the regional

code 1 for the U.S.A. ...

Check the received regional code to number 1, all or not, transfer the data to VGA card in accordance with only a case among the three case.

Regional code

INTERNAL STRUCTURE OF THE PICK-UP

1.Block Diagram of the PICK-UP(HOP-7632TS)

16 15 14 13 12 11 10

26 27 28 29 30 31 32

917

Tilt-

CD-LD

DVD-LD

FB2

FB1

CD-VR

DVD-VR

GND

EF4

EF1

VEF2

VREP

VRFN

VCC

VC2

VEF3

C15

C14

C10

Rth

R14

C12

C13

FB3

IC2(LDD)

IC2(FM)

IC3(OEIC)

VSO

OUT2

VSO

GND

OUT1

VSO

NCNCBUSY

SEN

SDIO

SCLK

MON1

VSL CLK

CLKB

GND GND

NRZB

NRZ

RWB

VSA

RSETENAGND

ISLOP

IAPC

Rfreq

SLG

Tilt+

TR-

TR+

AF-

AF+

GND(FM)

VREF

SEL

VCC(FM)

ENA

IAPC

SLG

VSA5

VSL25

CLK

CLKB

GND(LDD)

NRZB

NRZ

GND(LDD)

MONITOR

RWB

SDIO

SCLK

BUSY

SEN

VSO

Vcc(FM)

GND(OEIC,TEMP)

RF-

RF+

E2+F2

E1+F1

E4+F4

E3+F3

GAINSW

Vc(OEIC)

Vcc(OEIC)

GND(OEIC,TEMP)

E4 E1

Behind View

DVD-LD : 1st Vendor : Rd = 82k DVD-LD : 2nd Vendor : Rd = 5.6k

2.Pick up Pin Assignment

No. Signal Name I/O Signal Description

1 GND(OEIC,TEMP) Ground for OEIC 2 Vcc(OEIC) I Power supply for OEIC 3 Vc(OEIC) I Reference voltage input for OEIC 4 GAINSW I OEIC output gain control (High:Low gain, Middle:Middle gain, Low:High gain) 5 E3+F3 O Single OEIC output EF3 6 B O Single OEIC output B 7 D O Single OEIC output D 8 E4+F4 O Single OEIC output EF4

9 E1+F1 O Single OEIC output EF1 10 A O Single OEIC output A 11 C O Single OEIC output C 12 E2+F2 O Single OEIC output EF2 13 RF+ O Single OEIC RF positive differential output 14 RF- O Single OEIC RF negative differential output 15 GND(OEIC.TEMP) O Ground for OEIC and TEMP 16 TEMP O Output voltage for controlling temperature 17 VSO I Supply voltage for the output drivers only 18 SEN I Serial control enable (H=enable, L=disable) 19 BUSY O Goes high when serial transfer to timing menory is active 20 SCLK I Serial control clock 21 SDIO I/O Serial data for parameters and control ; in/out 22 RWB I Write enable for NRZ laser data (L=write, H=read) 23 MONITOR O Monitor output 24 GND(LDD) Ground connection for LD Driver-IC 25 NRZ I NRZ laser data (H=mark, L=space) (LVDS+) 26 NRZB I NRZ laser data (H=mark, L=space) (LVDS-) 27 GND(LDD) Ground connection for LD Driver-IC 28 CLKB I CLOCK for NRZ code input (LVDS-) 29 CLK I CLOCK for NRZ code input(LVDS+) 30 VSL25 I Supply voltage for 2.5V logic 31 VSA5 I Supply voltage for PLL only 32 SLG I Land/groove input serects the power register set (H=land, L=groove) 33 IAPC I A low inpedance current input ; 100xIAPC frow to the output 34 ENA I Fast chip enable input 35 VCC(FM) I Power supply for FM 36 SEL I Low: selects DVDFMOUT

High: selects CDFMOUT 37 VREF I APC amplifier reference voltage input 38 FM O APC amplifier output 39 GND(FM) Ground connection for FM 40 AF+ I Focusing Actuator drive signal+ 41 AF- I Focusing Actuator drive signal42 TR+ I Tracking Actuator drive signal+ 43 TR- I Tracking Actuator drive signal44 Tilt+ I Tilting Actuator drive signal+ 45 Tilt- I Tilting Actuator drive signal-

3.Signal detection of the P/U

1) Focus Error Signal ==> (A+C)-(B+D)

This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s up and down to focus on Disc.

2) Tracking Error Signal (DPP Method) ==> {(A+D)-(B+C)}- k x {(EF1+EF4)-(EF2+EF3)}

This signal is generated in RF IC (IC101 : R2S35002) and controls the pick-up’s left and right shift to find to track on Disc.

3) RF Signal ==> (A+B+C+D)

This signal is converted to DATA signal in DSP IC (IC301 : R8J32007).

Pick-Up module

Photo Diode

Tracking

Focusing

Infrared Iaser

k[(F+H) - (E+G)]

(A+D) - (B+C)

(A+D) - (B+C) - k[(F+H) - (E+G)]

Offset

Sub2

Main

Tp/2

Sub1

T rac k Center

F,E

D,C A,B

H,G

WGATE

RFPDSH

Optical

Pick-up

Driver

Write

Strategy

FsDAC

WDAC

IAPC

R160

LPF

Gain

WFPDSH

FMON

RWAPC

buffe

2.5VREF

Buffer

S/H

B/H

S/H MU

APCDAC

(REDA/WRDA)

SCLK, SDATA, WDEN

126

127

CN101

IC101 (R2S35002))

IC301 (R8J32007)

BCNT

TCPH

134

175

R106

R105

C106

25,26,28

120,121,123

108

C105

DESCRIPTION OF CIRCUIT

1. ALPC (Automatic Laser Power Control) Circuit

1-1. Block Diagram

1-2. ALPC (Automatic Laser Power Control) Circuit

ALPC function DVD/CD anlaog front-end IC(IC101 R2S35002) is for constant power control purpose. Based on the accurate power sensor(FMON) in P/U, ALPC feedback loop maintains constant power level against laser diode’s temperature variation.

The ALPC loop amplifies(10x) the FMON signal to enhance the accuracy of read power level control. Swithching of amplification is made by combination of a logical WGATE signal and a logical RWAPC signal.

There are two set of APCDAC, which are used at different term to monitor different power level. Generally, the one is used at reading and the other one is used at writing. The logical WGATE signal which is switched between reading and writing changes the two APCDAC.

The ALPC loop supplies same currency (IAPC) to Laser Diode Driver(LDD) during reading and writing. There is another ALPC which controls Full-Scale-DAC (FsDAC). FsDAC determines scale of WDAC of Laser Diode Driver.

MPU monitors write-power level of FMON signal and changes FsDAC directly to maintain constant write-power level. There are two write power signal. The one is based on S/H signal and the other one is based on B/H(Bottom-Hold) signal. The write power levels are monitored as digital levlels which are converted by built-in Anlog-Digital Converter in DSP. The MPU monitors each write power level and calculates proper setting of FsDAC, and changes value through serial interface between LDD and DSP.

2.Focus Circuit

2-1. Block Diagram

Disc Motor unit

Optical

Pick-up

HOP-7632TS

A,B,C,D

(EF1~EF4)

(A+C)-(B+D) (A+C)-(B+D)+K[(EF1+EF3)-(EF2+EF4)]

HAVC LS to V14

FE R102

C405

R103

C406

GND

ADC

Focusing Compensator

DAC

FOD

R329

R2S30202FP

IC601

FACT+

FACT-

FACT+

FACT-

IC101

R2S35002

IC301

R8J32007

EN1

EN2

CTL1

CTL2

C335

REF

1.65V

FOIN

A+B+C+D

LPF G

HAVC

0.8V

LPF G

169

170

180

2-2. Focus Servo

The aim of Focus Servo is to maintain the distance between object lens of P/U and disc surface, so that the detected RF signal(A, B, C, D, EF1, EF2, EF3, EF4) can be maximized.

Focus Error Signal(FE) generates from focus error detection block in RF IC(R2S35002) using Conventional Astigmatism Detection method, Differential Astigmatism Detection method. Focus Gain and path can be changed at the RF IC(R2S35002) according to the disc, and the resulting output FE(R2S35002 2pin) is input to DSP IC(R2S35002 169pin). The Focus Search operation is using FE, PE Signal, therefore check FE, PE signals when Focusing is failed.

The role of DSP IC(R8J32007) is Focus Digital Controller. The operation path is as follows; FE Signal is input to DSP IC(R8J32007 169pin), and after A/D Conversion, Digital Equalizer Block and D/A Conversion in R8J32006FP, the output signal FOD(R8J32007 180pin) is input to Drive IC(R2S30202FP 40pin). The drive output signal FACT+/FACT- generated according FOIN(R2S30202FP 40pin), and drives focus actuator in the P/U unit.

3. Tracking & Sled Circuit

3-1-1. Block Diagram (T racking Following)

Disc Motor unit

Optical

Pick-up

HOP-7632TS

A,B,C,D

(EF1~EF4)

R101

C101

GND

ADC

Tracking Compensator

DAC

TRD

TACT+

TACT-

IC101

R2S35002

IC301

R8J32007

MPPO

(A+D)-(B+C)

HAVC

V14

173

181

L P F

SPPO

(A+D)-(B+C)-K[(EF1+EF4)-(EF2+EF3)]

Sled

Compensator

DAC

SL2

183

SL1

182

A+ AB+ B-

SLED MOTOR

Unit

(CN601)

TRD

R330

IC601

R2S30202FP

TACT+

TACT-

EN1

EN2

CTL1

CTL2

REF

C604

1.65V

TOIN

SL2

SL13

SL1IN

SL2IN

A-

B-

A+

B+

SL2N

SL1N

SL2P

SL1P

C336

1.65V

C338

C337

R372

1.65V

R374

R373

R332

R331

3-1-2. Block Diagram (Seek)

Disc Motor unit

Optical

Pick-up

HOP-7632TS

SUMF

RFIP RFIN

(EF1~EF4)

A,B,C,D

TACT+

TACT-

IC101

R2S35002

MPPO

(A+D)-(B+C)

HAVC

LS to

V14

L P F

SPPO

[(EF1+EF4)-(EF2+EF3)]

A+ A-

B+

B-

SLED MOTOR

Unit

A+B+C+D

HAVC

LS to

V14

L P F

80 81

MIRR

DET

AGC

TOP

HOLD

63 62

BOTTOM

HOLD

TE1

MIRRTOPH MIRRBOTH

C128 GND

MIRR

VREF1

SL2

D A C

Tracking Compensator

IC301

R8J32007

173

Sled

Compensator

A D C

149

M U X

Short

Seek

Algorithm

Loog Seek

Algorithm

D A C

182

181

183

TRD

SL1

Track Counter and Timer

R101

C101

GND

MIRR

TE1

IP2MIRR

C127

GND

3-2-1. Tracking Servo

The aim of tracking servo is to make laser beam trace the data track on disc.

Tracking Error(TE) Signal is generated from tracking error detected block in R2S35002 using DPP(Differential Push-Pull) Method and DPD (Differential Phase Detection) Method. DPP Method uses not only main beam(A, B, C, D) but also side beam(EF1~EF4) for correcting DC offset generated in Push-Pull Method.

The remaining procedure of TE signal processing in R8J32007 is similar to Focus Servo. The role of DSP IC(R8J32007) is Tracking Digital Controller. TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Equalizer Block and D/A Conversion in R8J32007, the output signal TRD(R8J32007 181pin) is input to Drive IC(39pin).

The drive output signal TACT+/TACT- generated according TOIN(R2S30202FP 39pin), and drives tracking actuator in the P/U unit.

3-2-2. Sled Servo

The working distance of tracking actuator is too short to cover whole disc radius. Sled Servo make P/U move by little and little so that the laser beam keep tracing the data track on disc continuously when tracking actuator reaches the working limit.

TE Signal is input to DSP IC(R8J32007 173pin), and after A/D Conversion, Digital Tracking Equalizer Block, Digital Sled Compensator Block and D/A Conversion in R8J32007, the output signal SL1, SL2(R8J32007 182, 183pin) is input to Drive IC (R2S30202FP SL1:3 pin, SL2:2pin) after Low-Pass filtering.

4. Spindle Circuit

4-1-1. Block Diagram(FGCA V Servo)

Disc Motor unit

Optical

Pick-up

HOP-7632TS

XCO

Control Clock

Generator

IC301

R8J32007

107

M U

P W M

SPD

211

Motor Kick

REG

CAV FD

CAV PD

SFG

VCK4M

106

R349

C349

R375

1.65V

SPD

IC601

R2S30202FP

CTL1

CTL2

DAVC

1.65

SPD

SFG

CTL2

CTL1

SPIN

XCI

213

R361

3.3V

X301

33.8688MHz

4-1-2. FG CAV Servo

1) CD 48x CAV : CD-ROM, CD-R

2) CD 40x CAV : CD-RW

3) DVD 8x CAV : DVD+RW

4) DVD 10x CAV : DVD+R

5) DVD 12x CAV : DVD-ROM DL

6) DVD 16x CAV : DVD-ROM

7) DVD 16x PCAV : DVD+R

When drive read PRESS CD, Closed Session CD-R/RW, the spindle motor is controlled using FG CAV Spindle Servo. FG signal(R2S30202FP 19pin) input to SFG in DSP IC(R8J32007 213pin). The spindle controller in DSP IC uses SFG as spindle rotation frequency feedback, therefore the FG CAV Spindle Servo doesn't work well if FG generation is abnormal.

The spindle controller PWM output signal SPD(R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin) after Low-Pass Filtering. The PWM output signal U, V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a sensor, and FG pulse output is generated as 18 pulses/rotation.

4-2-1. Block Diagram (Wobble CL V Servo)

Disc Motor uni

Optical

Pick-up

HOP-7632TS

IC101

R2S35002

HPF

C174

C173

C171

C172

WBLSH

C116

87 88

89 90 92

HPF AGC2

HPFBPF AGC3

HPF

WBLS

GND

18 19

AGC1

VREF

WAG1 WAG2 WAG3

SA SB

SC SD

MA MB

C117 C118

ADO

BCO

IC301

R8J32007

M U

P W M

SPD

211

Motor Kick

REG

154

R349

R375

C349

1.65V

SPD

WOBSIG

4-2-2. Wobble CLV Servo

CD-R : 4x, 8x, 16x, 24x, 32x, 40x, 48x /CD-RW : 4x, 10x, 16x, 24x, 32x /DVD-R : 2x, 4x, 8x, 16x(PCAV) /DVD-R DL : 2x, 4x /DVD-RW : 1x, 2x, 4x, 6x /DVD+R : 2.4x, 4x, 8x, 12x, 16x(PCAV) /DVD+R DL : 2.4x, 4x, 6x /DVD-RAM : 2x, 3x, 3-5x(PCAV) /DVD+RW : 2.4x, 4x, 8x

When drive write DVD-RAM/R/RW/+R/+RW/CD-R/CD-RW, the spindle motor is controlled using Wobble CLV Spindle Servo. The WOBSIG signal(R2S35002 37pin) input to DSP IC(R8J32007 154pin). The DSP Controller in R8J32007 uses WOBSIG as linear velocity feed back, therefore the Wobble CLV Spindle Servo doesn’t work well when WOBSIG signal is abnormal. The spindle controller PWM output signal SPD (R8J32007 211pin) input to SPIN in Drive IC(R2S30202FP 1pin) after Low-Pass Filtering. The PWM output signal U,V, W signal(R2S30202FP 12, 13, 14pin) drives Spindle Motor without using a sensor.

MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION

IC101 (R2S35002) : RF AMP Analog Signal Processor

Pin Assignment

PORT1374PORT12

PORT11

PORT10

AGHPF172AGHPF2

VDD1(3.3V)70EQOP

EQON68GND1

IREFE66EQFCF

65 64

SUBO/LPPMON

SUBI/LPPSIG

TOPH61BOTH

MIRRHPF

MIRRTOPH

MIRRBOTH

VDD4(3.3V)56MRSTB55SDEN54SD ATA

SCLK

52 51

MCLK

DFT

IP1/LPPOUT

IP2/MIRR

WGATE

PORT07

PORT06

PORT05

PORT04

PORT03

PORT02

PORT01

PORT00

LO_ZB/SPDSH

BLANK

GND4

MPDSH/SPDSH

RFPDSH

WFPDSH

IDGATE

SPBLVL/TISH2

LNDTRK

WBLSH

WOBSIG

RFHLD/TISH1

SUMF/SUMF2

(5V)VCC1

AGFR

AGFU

RFIN

SRVREF

FVREFO

IREFT

VREF1

HAVC

(3.3V)VDD2

GND2

AIN1

AIN2

AIN3

SIGM

100

AWOBSIG

GND5

BCENT

PHBETA/TCE

BHBETA/TIE

(3.3V)VDD3

(3.3V)VDD5

FVREF

FMD

GND3

(EQOS/RRF/WRF/LPPMON/)ATEST

(5V)VCC2

LDOUT

VRDC3N

VRDC

VRDC2N/PWRMON

VRDCN

WAG1

WAG2

WAG3

WOBFCF

R2S35002

(TOP VIEW)

BHC

RFIP

Block Diagram

RFIP RFIN

Pick I/F

0.068u

IDGATE

TISH1

AGFU

AGFR

EQAUTO

LPP

Wobble

F0-CNT

AGC3BPFSUB

AGC1

DPD

BALANCE

RECD

SAV

MIRR DEFECT

TIE

R-OPC OPC

APC

Serial Cont. Reg.

VREF

Power Cont.

Programm able I/O port

SIGM

HFSUM

BALANCE

AGC2

COMP

HP3

RF AGC

HP2

ID DET

S/H

WRF

MUX

RF SLIM/SUB (RGA)

M U X

AGHPF2

RFHLD/

SPDSH

LO_ZB/

IREFE

EQFCF

EQOP EQON

MA MB MC MD

SA SB SC SD

HAVC

MPDSH/

WOB

main

sub

SUBO/LPPMON SUBI/LPPSIG

BHC

IP1/LPPOUT

WOBSIG

WAG3 WAG1

WAG2

WBLSH

MCLK

HFPE

mclk

IREFT

RRF

WRF

BLANK

TOPH BOTH

DFT

RECD

SPBLVL/TISH2

PHBETA/TCE BHBETA/TIE

MRSTB SDEN SCLK

SDATA

BCENT

SPBLVL

SIGM

each blocks

WGATE

WGATE RFPDSH

FMD

FVREF

PWRMON

VRDCN

VRDC

LDOUT

BHOUT

0.068u

0.033u

0.12U

0.1U

12k (*2)

3300p

0.1u

0.47u

LO_ZB/SPDSH

D D D D

D D

D/A

SUBP.N

IP2/MIRR

SUBW

BPO

to MIRR.DEFECT

EQOP/N

BPO

2200p

SPDSH

RFHLD/TISH1 pin

VRDC2N/

RFHLD/TISH1 pin

GND2

VDD1

GND3

VDD2

GND4

VDD3

GND5

VDD4

VDD5

GND1

vCC2

DDD

VREF1

...Combined pin ...digital pin

...digital/analog pin

D/A

power 5V

power 3.3V(VDD)

4700p

15,000p

VREF1

GCAOUT

MIRRTOPH MIRRBOTH

MIRRHPF

pick-up I/F

reference level

AWOBSIG

WOBFCF

VREF1

LO_ZB/SPDSH

PWWMON

LNDTRK

mclk

SHPE

ATEST

SUMF/

SUMF2

8200p

680k

3.3u

*3300P/0.068u

0.47u

0.1u

0.033u

(*1), (*2)...1% Resistor

toLPF,A/D toLPF,A/D

toLPF,A/D

to LPF,A/D

*HPF fc=1kHz

to A/D

*3300p

Lo-Z function by IDGATE. fast mode 3.3us Lo-Z function by IDGATE.

0.1u

20k(*1)

LPPMON/EQOS/RRF/WRF

EQOS

VFREFO

10u

VREF1

SRVREF

power 3.3V

VHALH(=VDD/2) VREF1(=2.1V) FVREFO(=2.5V)

MPP SPP

to LE

MPP

SPP

SUMF2

to WRF

SUMF2

In the case of analog APC

vCC1

toLPF,A/D

IP2/MIRR pin

MIRR

AGHPF1

0.1u

0.01u

PORT00~07.10~13

AIN1~3

VRDC3N

• Pin Functions

pin Name pin No. Type max. voltage Function

TE 1 Analog-Output Tracking error output terminal FE 2 Analog-Output Focus error output terimnal PE 3 Analog-Output PE output terminal LE 4 Analog-Output Lens error output terminal BCENT 5 Analog-Output OPC center signal output terminal PHBETA/TCE 6 Analog-Output OPC top hold level signal and APC write sampleing

signal output terminal/tilt servo detecting output terminal

BHBETA/TIE 7 Analog-Output OPC bottom hold level signal and R-OPC sampleing

signal output terminal/tilt servo detecting output terminal VCC2 8 Power Power supply connected terminal(5V) FVREF 9 Analog-Input VDD Reference voltage for APC input terminal FMD 10 Analog-Input VDD APC monitor diode input terminal VDD3 11 Power Power supply connected terminal(3.3V) LDOUT 12 Analog-Output Terminal to control laser drivers for APC read system VRDC3N 13 External-components required Terminal to connect laser driver control filters for APC

read VRDC2N/PWRMON 14 External-components required Terminal to connect laser driver control filters for APC

read/ SH monitor output terminal VRDCN 15 External-components required Terminal to connect laser driver control filters for APC

read VRDC 16 External-components required Terminal to connect laser driver control filters for APC

read GND3 17 Ground Ground connected terminal WAG1 18 External-capacitor required Terminal to connect WOBBLE AGC detector capacitor WAG2 19 External-capacitor required WAG3 20 External-capacitor required WOBFCF 21 External-capacitor required WOB-BPF f0 auto-adjustment external capacitor

connected terminal VDD5 22 Power Power supply connected terminal(3.3V) ATEST 23 Analog-Output Renesas analog test signal output terminal AWOBSIG 24 Analog-Output Analog-level WOBBLE signal output terminal GND5 25 Ground Ground connected terminal LNDTRK 26 Digital-Inputpull-up VDD Balans adjustment mode selection SPBLVL/TISH2 27 Digital-Inputpull-up VDD R-OPC WRF signal sampling pulse input terminal

/Tilt servo detecting sampling pulse input terminal RFPDSH 28 Digital-Input putpull-up VDD APC read system sampling pulse input terminal WFPDSH 29 Digital-Input putpull-up VDD APC write system sampling pulse input terminal MPDSH/SPDSH 30 Digital-Input putpull-up VDD Pickup input sampling pulse input terminal WBLSH 31 Digital-Input putpull-up VDD WOBBLE sampling pulse input terminal WGATE 32 Digital-Input putpull-up VDD Read/write control input terminal RFHLD/TISH1 33 Digital-Input putpull-up VDD RF hold control signal input terminal /Tilt servo detecting

sampling pulse input terminal IDGATE 34 Digital-Input putpull-up VDD ID select pulse input terminal LO_ZB/SPDSH 35 Digital-Input putpull-up VDD Low-z (reversal) pulse input terminal

/Pickup input sampling pulse input terminal

pin Name pin No. Type max. voltage Function

BLANK 36 Digital-Output Record/non-record detecting/BD detecting output

terminal WOBSIG 37 Digital-Output WOBBLE signal output terminal IP2/MIRR 38 Digital-Output ID detection/Mirror detection output terminal IP1/LPPOUT 39 Digital-Output ID detection/LPP detection output terminal DFT 40 Digital-Output Defect detection output terminal GND4 41 Ground Ground connected terminal (Digital) PORT00 42 Digital-Input/Output VDD I/O Port PORT01 43 default input mode PORT02 44 No pull-up PORT03 45 PORT04 46 PORT05 47 PORT06 48 PORT07 49 MCLK 50 Digital/Analog-Input VDD Main clock input terminal

No pull-up Equalizer fc auto-adjustment control clock input terminal.

LPP output pulse width control clock input terminal.

WOB-BPF f0 auto-tracking clock input terminal. PORT10 51 Digital-Input/Output VDD I/O Port PORT11 52 default input mode PORT12 53 No pull-up PORT13 54 SCLK 55 Digital-Input pull-up VDD Serial I/F clock input terminal SDATA 56 Digital-Input/Output pull-up VDD Serial I/F data input/output terminal SDEN 57 Digital-Input pull-up VDD Serial I/F enable input terminal MRSTB 58 Digital-Input pull-up VDD Master reset (reversal) input terminal VDD4 59 Power Power supply connected terminal(3.3V)(digital) BHC 60 External-capacitor required External capacitor for LPP bottom hold terminal

MIRRHPF 61 External-capacitor required Terminal to connect Mirror envelope detector HPF

capacitor MIRRBOTH 62 External-capacitor required Terminal to connect Mirror envelope detector bottom

hold capacitor MIRRTOPH 63 External-capacitor required Terminal to connect Mirror envelope detector top hold

capacitor BOTH 64 External-capacitor required Terminal to connect envelope bottom hold capacitor TOPH 65 External-capacitor required Terminal to connect envelope top hold capacitor GND1 66 Ground Ground connected terminal EQOP 67 Differential-Output RF equalizer differential output terminal EQON 68 VDD1 69 Power Power supply connected terminal(3.3V) SUBI/LPPSIG 70 Analog-Input VDD ID detecting HPF input terminal/LPP detecting HPF input

terminal

pin Name pin No. Type max. voltage Function

SUBO/LPPMON 71 Analog-Output ID detecting HPF output terminal/LPP detecting HPF

output terminal

EQFCF 72 External-capacitor required Terminal to connect RF-equalizer fc auto-adjustment

external capacitor

IREFE 73 External-resistor required Terminal to connect RF-equalizer fc setting external

resistor AGHPF2 74 External-capacitor required Terminal to connect AGC high pass filter capacitor AGHPF1 75 AGFU 76 External-capacitor required AGC filter connecting terminal AGFR 77 External-capacitor required VCC1 78 Power Power supply connected terminal(5V) SUMF/SUMF2 79 Analog-Input/ /External-capacitor required VDD SUM RF input/SUM differential amp. DC filter

connected terminal RFIP 80 Differential-Input VDD RF differential input terminal RFIN 81 SRVREF 82 Analog-Input VDD DSP supply voltage (3.3V) input terminal FVREFO 83 Analog-Output 2.5V reference bias voltage output terminal IREFT 84 External-resistor required Terminal to connect reference current setting external

resistor VREF1 85 Analog-Output 2.1V reference bias voltage output terminal HAVC 86 Analog-Input VCC Pickup reference voltage input terminal SA 87 Analog-Input VCC Sub beam 4D input terminal SB 88 Analog-Input SC 89 Analog-Input SD 90 Analog-Input VDD2 91 Power Power supply connected terminal(3.3V) MA 92 Analog-Input VCC Main beam 4D input terminal MB 93 Analog-Input MC 94 Analog-Input MD 95 Analog-Input GND2 96 Ground Ground connected terminal AIN1 97 Analog-Input VDD Analog input terminal AIN2 98 Analog-Input AIN3 99 Analog-Input SIGM 100 Analog-Output Analog signal monitoring output terminal

IC301 (R8J32007FPV) : Encoder, Decoder & DSP Singal Processor

1.1 Pin Layout

CPU15

A17

EFG

SFG

TLD

SPD

LDD

LED

GPIO04

ICUIN8

ICUIN6

ICUIN7

TESTB1

TESTB2

MRSTB

VSSIO

VCCIO

VCC

PTEST3

VDDAA

PTEST2

VSSA

REXT

VDDAA

PTEST1

VSSA

VINP

VDDAA

VINN

VSSA

VCCA

DAVC

TVDN

TVDP

TRD

FOD

GAD1

GAD0

BCENT

TIB H

TCPH

LPSATEATZC

SIGMPEFE

VSSA

VCCA

W1LPF0

W1LPF1

W1LPF2

216

215

214

213

212

211

210

209

208

207

206

205

204

203

202

201

200

199

198

197

196

195

194

193

192

191

190

189

188

187

186

185

184

183

182

181

180

179

178

177

176

175

174

173

172

171

170

169

168

167

166

165

164

163

SSR 1 162 W2LPF0

CCR 2 161 W2LPF1 CPU14 3 160 W2LPF2 CPU13 4 159

DDA

CPU12 5 158VSSA

SSIO 6 157 DEFECT

CCIO 7 156 BLA N

CCR

8 155 LNDTR CPU11 9 154 WOBSIG CPU10 10 153 LOWZB

SSR

11 152 ID GATE CPU9 12 151 RFH LD CPU8 13 150 IP1LP PIN

CPRDB 14 149 IP2MIRR

UCS0B 15 148

CCIO

A1 16 147

SSIO

CPU0 17 146

CPU1 18 145

SS CPU2 19 144 CPU3 20 143 NRZI CPU4 21 142 NRZIB SSR

22 141 DCLKB CPU5 23 140 DCL CPU6 24 139VCC CPU7 25 138 WRGATEB

CCR

26 137 SRFH

SS 27 136 SRFL

DD 28 135 WRSTOP A16 29 134 WRGATE2 A15 30 133

CCIO

SSIO 31 132VSSIO

CCIO 32 131VSS

A14 33 130

DD A13 34 129 WBLSH A12 35 128 MPDSH A11 36 127 WFPDSH A10 37 126 RFPDSH

A9 38 125 TCSHSPB LV

A20 39 124 LDB USY

CPWRB 40 123 WDEN

DD 41 122 RFDEN

SS 42 121 SDAT A19 43 120 SCL A18 44 119 FEMC

A8 45 118 TRST

A7 46 117 TDO

A6 47 116 TDI

A5 48 115 TC

A4 49 114 TMS

A3 50 113 TEST3

SSIO 51 112 TEST2

CCIO 52 111 TE ST1

CCR 53 110 TE ST0

SSR 54 109 DOU T

555657585960616263646566676869707172737475767778798081828384858687888990919293949596979899

100

101

102

103

104

105

106

107

108

GPIO05

VSSIO

VCCIO

HRSTB

DATA7

DATA8

DATA6

DATA9

DATA5

DATA10

DATA4

DATA11

DATA3

DATA12

DATA2

DATA13

VDD

VSS

VSSIO

VCCIO

DATA1

DATA14

DATA0

DATA15

DREQ

ZIOWB

ZIORB

IORDY

DACKB

HIN TRQ

IOCS16B

VSSIO

VCCIO

DA1

PDIA GB

DA0

DA2

CS1FXB

CS3FXB

DASPB

GPIO07

GPIO06

ROUT

VCCA

LOUT

ADIP VR1

ADIP VRT

ADIPINP

VSSA

XCO

XCI

VCCA

R8J32007

Top View

V V

V V V V VSSA

K A

1.2 Block Diagram

Data

WPLL

ADIP

Detector

Counter

PRML

PLL

Generator

Demodulate

Servo

CD-ROM Decoder

DVD

PI-ECU

DVD

PO-ECU

DRAM

MCIF

ATAPI

AUDIO

DRAM

Interface

Clock

Generator

Test

Control

VINP VINN

REXT

PTEST[2:0]

IP1LPPIN

IP2MIRR

LOWZB

IDGATE

RFHLD

W1LPF[2:0]

ADC

ADIPVRT

LPP

Wobble

WOBSIG

Jitter

CD-DSP

CAV

AUDIO

NRZI,NRZIB

LVDS

DCLK,DCLKB

WGATEB

WRGATE2

SRFH

WRSTOP

Sample

Hold

WBLSH

MPDSH

WFPDSH

RFPDSH

CD-ROM

Encoder

Modulator

DAC

ADC

FE PE

LPS

FOD

DAVC

TRD

XCI

TRST(NMI) TCK(SCK) TDI(SCI) TDO(SCO)

TMS

XCO

Serial I/F

SDATA RFDEN

SCL

WDEN LDBUSY

FEMCK

TEST[3:0]

MRSTB TESTB[1:2]

ROUT DOUT

LOUT

DVD

Descramble

DVD

Scramble

Auth

BCA

SSEQ

MSEQ

RA[12.10:0]

DWE

RD[15:0]

DRAS DCAS

RAMCL

DQMU DQML

DACKB

CS3FXB

DREQ

CS1FXB PDIAGB

DASPB

DA2

IOCS16B

IORDY

ZIOWB

HINTRQ

HRSTB

ZIORB

DATA[15:0]

DA1 DA0

SFG

ATZC

DERECT

BLAN

EFG

LED

LNDTRK

LDD

TLD

TCSHSPBLV

DCKE

W2LPF[2:0]

H8S

CPU

ADC

GAD1

ADGATEB

INT0B

CPWRB CPRDB

UCS2B

A[20:0]

CPU[15:0]

INT1B INT2B

UCS0B GPIO05(UCS1B)

CPRDB CPWRB

A[20:1]

CPU

[15:0] GPIO06(CSEL) GPIO07(HEATRUN)

ICUIN6(EJECTSW) ICUIN7(ACTFLG)

GPIO04(A[0])

SDRAM 16Mbit

ZCS

UCS3B

INT3B

SRFL

TCPH

TIBH

BCENT

FAD0(VRDC2N)

TVDP TVDN

ADC

WAI T

ICUIN8(LOADIN)

DAC

SIGM

SPD

ADIPINP

ADIPVR1

Cmp

1.3 Pin Table

Pin no Pin Name

1 VSSR 2 VCCR 3 CPU14 4 CPU13 5 CPU12 6 VSSIO 7 VCCIO 8 VCCRQ

9 CPU11 10 CPU10 11 VSSRQ 12 CPU9 13 CPU8 14 CPRDB 15 USC0B 16 A1 17 CPU0 18 CPU1 19 CPU2 20 CPU3 21 CPU4 22 VSSRQ 23 CPU5 24 CPU6 25 CPU7 26 VCCRQ 27 VSS 28 VDD 29 A16 30 A15 31 VSSIO 32 VCCIO 33 A14 34 A13 35 A12 36 A11 37 A10 38 A9 39 A20 40 CPWRB 41 VDD 42 VSS 43 A19 44 A18 45 A8 46 A7 47 A6 48 A5 49 A4 50 A3 51 VSSIO 52 VCCIO 53 VCCR 54 VSSR

Pin no Pin Name

55 A2 56 GPIO05 57 VSSIO 58 VCCIO 59 HRSTB 60 DATA7 61 DATA8 62 DATA6 63 DATA9 64 DATA5 65 DATA10 66 DATA4 67 DATA11 68 DATA3 69 DATA12 70 DATA2 71 DATA13 72 VDD 73 VSS 74 VSSIO 75 VCCIO 76 DATA1 77 DATA14 78 DATA0 79 DATA15 80 DREQ 81 ZIOWB 82 ZIORB 83 IORDY 84 DACKB 85 HINTRQ 86 IOCS16B 87 VSSIO 88 VCCIO 89 DA1 90 PDIAGB 91 DA0 92 DA2 93 CS1FXB 94 CS3FXB 95 DASPB 96 CPIO07 97 CPIO06 98 ROUT

99 VCCA 100 LOUT 101 ADIPVR1 102 ADIPVRT 103 ADIPINP 104 VSSA 105 VSSA 106 XCO 107 XCI 108 VCCA

Pin no Pin Name

109 DOUT 110 TEST0 111 TEST1 112 TEST2 113 TEST3 114 TMS 115 TCK 116 TDI 117 TDO 118 TRST 119 FEMCK 120 SCLK 121 SDATA 122 RFDEN 123 WDEN 124 LDBUSY 125 TCSHSPBLV 126 RFPDSH 127 WFPDSH 128 MPDSH 129 WBLSH 130 VDD 131 VSS 132 VSSIO 133 VCCIO 134 WRGATE2 135 WRSTOP 136 SRFL 137 SRFH 138 WRGATEB 139 VCCA 140 DCLK 141 DCLKB 142 NRZIB 143 NRZI 144 VSSA 145 VSS 146 VDD 147 VSSIO 148 VCCIO 149 IP2MIRR 150 IP1LPPIN 151 RFHLD 152 IDGATE 153 LOWZB 154 WOBSIG 155 LNDTRK 156 BLANK 157 DEFECT 158 VSSAA 159 VDDAA 160 W2LPF2 161 W2LPF1 162 W2LPF0

Pin no Pin Name

163 W1LPF2 164 W1LPF1 165 W1LPF0 166 VCCA 167 VSSA 168 VSSA 169 FE 170 PE 171 SIGM 172 ATZC 173 TE 174 LPSA 175 TCPH 176 TIBH 177 BCENT 178 GAD0 179 GAD1 180 FOD 181 TRD 182 TVDP 183 TVDN 184 DAVC 185 VCCA 186 VCCA 187 VSSA 188 VINN 189 VDDAA 190 VINP 191 VSSA 192 PTEST1 193 VDDAA 194 REXT 195 VSSA 196 PTEST2 197 VDDAA 198 PTEST3 199 VCC 200 VCCIO 201 VSSIO 202 MRSTB 203 TESTB2 204 TESTB1 205 ICUIN7 206 ICUIN6 207 ICUIN8 208 GPIO04 209 LED 210 LDD 211 SPD 212 TLD 213 SFG 214 EFG 215 A17 216 CPU15

1.4 Pin Functions

It corresponds to the following signs as a pin I/O specification.

AI : Analog Input AO : Analog Output AIO : Analog Input/Output I : Standard Input IU : Standard Input with Pull Up O : Standard Output TO : Standard Three State Output IO : Standard Input/Output

IOU : Standard Input/Output with Pull Up 5I : 5V Tolerant Input 5O : 5V Tolerant Output 5TO : 5V Tolerant Three State Output 5IO : 5V Tolerant Input/Output PW : Power Supply Pin GND : Earth Pin

Data PLL/PRML Pin List

Pin Name Pin No. I/O destination Function

VINP 190 AI AFE RF signal normal phase input pin

VINN 188 RF signal counter phase input pin

REXT 194 AO External Resistance Resistor connect pin for reference current generation

PTEST1 192 AO External Resistance PRML/Data PLL moniter D/A output pin PTEST2 196 PRML/Data PLL moniter D/A output pin PTEST3 198 Data PLL VCO control voltage monitor pin

Wpll Pin List

Pin Name Pin No. I/O destination Function

W1LPF0 165 AO External Components Write PLL1 filter connect pin (0) W1LPF1 164 Write PLL1 filter connect pin (1) W1LPF2 163 Write PLL1 filter connect pin (2)

W2LPF0 162 AO External Components Write PLL2 filter connect pin (0) W2LPF1 161 Write PLL2 filter connect pin (1) W2LPF2 160 Write PLL2 filter connect pin (2)

Servo Pin List

Pin Name Pin No. I/O destination Function

BLANK 156 I AFE Blank signal input

(also connected to the H8S interrupt port INT5)

DEFECT 157 I AFE Defect (scratch detect) signal

SFG 213 IU DRVR Spindle FG pulse

(also input to the H8S interrupt port INT4)

EFG 214 I PU Spindle FG pulse for Light Scribe

(also input to the H8S interrupt port INT4)

TLD 212 TO DRVR Tilt drive signal (PWM output) SPD 211 TO DRVR Spindle drive signal (PWM output) LDD 210 TO DRVR Loading drive signal (PWM output) LED 209 TO PU LPS_LED control signal (PWM output)

ATZC 172 AI AFE Tracking Zero Cross input signal

FE 169 AI AFE Focus error: sampled at 352.8 kHz

PE 170 AI AFE Laser power error: sampled at 352.8 kHz

SIGM 171 AI AFE Signal monitor: sampled at 88.2/176.4 kHz

TE 173 AI AFE Tracking error: sampled at 352.8 kHz

LPSA 174 AI AFE Lens positioning/lens error: sampled at 88.2 kHz

TCPH 175 AI AFE Tracking center/BETA top hold: sampled at 44.1/176.4 kHz

TIBH 176 AI AFE Tilt error/BETA bottom hold: sampled at 44.1/176.4 kHz

BCENT 177 AI AFE BETA center: sampled at 176.4 kHz

GAD1 179 AI General AD input: sampled at 88.2 kHz

GAD0(VRDC2N) 178 AI General AD input: sampled at 176.4 kHz

FOD 180 AO DRVR Focus control signal

TRD 181 AO DRVR Tracking control signal

TVDP 182 AO DRVR Sled drive signal (normal phase) TVDN 183 Sled drive signal (counter phase)

DAVC 184 AO DRVR Servo system Vcc/2 voltage output pin

ATAPI Interface Pin List

Pin Name Pin No. I/O destination Function

HRSTB 59 5I ATAPI ATAPI-IF control signal (host reset signal)

DA2 92 5I ATAPI ATAPI-IF register address signal DA1 89 DA0 91

DATA[15:0] 79,77,71, 5IO ATAPI ATAPI- IF data bus

69,67,65, 63,61,60, 62,64,66, 68,70,76,

DREQ 80 5TO ATAPI ATAPI-IF DMA request signal

ZIOWB 81 5I ATAPI ATAPI-IF write strobe pulse

ZIORB 82 5I ATAPI ATAPI-IF read strobe pulse IORDY 83 5TO ATAPI ATAPI-IF control signal (drive Ready)

DACKB 84 5I ATAPI ATAPI-IF DMA acknowledge

HINTRQ 85 5TO ATAPI ATAPI-IF drive interrupt signal

IOCS16B 86 5TO ATAPI ATAPI-IF control signal (16-bit transfer)

PDIAGB 90 5IO ATAPI ATAPI-IF control signal CS1FXB 93 5I ATAPI ATAPI-IF register chip select signal

CS3FXB 94

DASPB 95 5IO ATAPI ATAPI-IF control signal

Encoder Interface Pin List

Serial Communication Interface Pin List

Pin Name Pin No. I/O destination Function

IP1LPPIN 150 I AFE PID area identification signal/LPP input signal

IP2MIRR 149 I AFE PID area identification signal/MIRR signal WOBSIG 154 I AFE Wobble signal input

LOWZB 153 O AFE Input impedance switch control signal/SPDSH; running

OPC sampling pulse (Pit top)

IDGATE 152 O AFE ID/data switch signal

RFHLD 151 O AFE VFO3 holding signal and track center signal sample &

hold signal

WRGATE2 134 O AFE Write gate signal output

WBLSH 129 O AFE Wobble signal sampling pulse

MPDSH 128 O AFE Main beam sampling pulse

WFPDSH 127 O AFE Laser control sampling pulse

(Front monitor write/erase block)

RFPDSH 126 O AFE Laser control sampling pulse

(Front monitor read block)

TCSHSPBLV 125 O AFE VFO1 track center signal sample & hold pulse;

/SPBLVL running OPC sampling pulse (Pit end)

WRGATEB 138 O PU Write gate signal

SRFH 137 O PU I- V amplifier gain switch (HI side)

/I- V amplifier gain switch (for binary)

SRFL 136 I- V amplifier gain switch (Low side)

WRSTOP 135 I PU Write stop gate signal

LNDTRK 155 O AFE/PU Land/groove switch

NRZI 143 AO PU NRZI output after modulation (normal phase)

NRZIB 142 NRZI output after modulation (counter phase)

DCLK 140 AO PU NRZI sync clock (counter phase)

DCLKB 141 NRZI sync clock (normal phase)

ADIPVR1 101 AO External Cpmponents AD related pin for ADIP detection

ADIPVRT 102 AO External Cpmponents AD related pin for ADIP detection

ADIPINP 103 AI AFE ADIP detect input pin

Pin Name Pin No. I/O destination Function

LDBUSY 124 IO LDD LDD serial IF busy also functions as the CPU general port 1-0

WDEN 123 O LDD LDD microcomputer I/F (transfer enable signal)

RFDEN 122 O AFE AFE microcomputer I/F (transfer enablesignal)

SDATA 121 IO AFE/LDD AFE/LDD microcomputer I/F (transfer data signal 3Vsystem)

SCLK 120 O AFE/LDD AFE/LDD microcomputer I/F (transfer clock signal)

Audio Interface Pin List

Pin Name Pin No. I/O destination Function

DOUT 109 IO ATAPI Digital output pin,also functions as the CPU general port 1-2 ROUT 98 AO ATAPI Audio Lch & Rch output LOUT 100

Clock Generator Pin List

Pin Name Pin No. I/O destination Function

FEMCK 119 O AFE Front End LSI clock

XCO 106 O X’tal Crystal oscillation 33.8688MHz

XCI 107 I X’tal Crystal oscillation 33.8688MHz

Flash/SRAM Pin List

Pin Name Pin No. I/O destination Function

UCS0B 15 O Flash H8S / CS0

CPWRB 40 O Flash / SRAM H8S / WRB

CPRDB 14 O Flash / SRAM H8S / RDB

A[20:1] 39,43,44, O Flash / SRAM H8S / A[20:1]

215,29,30,

33,34,35, 36,37,38, 45,46,47, 48,49,50,

55,16

CPU[15:1] 216,3,4, IO Flash / SRAM H8S / D[15:0]

5,9,10, CPU[0] can also function as the CPU general port 0-4

(multiplexed). 12,13,25, 24,23,21,

20,19,18

H8S Micro-Processor Pin List CPU

Pin Name Pin No. I/O destination Function

ICUIN7(ACTFLG) 205 IU DRVR CPU interrupt port INT7: Pick up protect flag

ICUIN6(EJECTSW) 206 I Eject Switch CPU interrupt port INT6: EJECTSW interrupt request

ICUIN8(LOADIN) 207 IO Load Switch CPU general port1-1 also connected to the CPU interrupt

port INT8: Loader in sensor

GPIO07(HEATRUN) 96 5IO ATAPI CPU general port 0-7 :Off heat run test input

GPIO06(CSEL) 97 5IO ATAPI CPU general port 0-6 ATAPI CSEL

GPIO04(A0) 208 IO SRAM CPU general port 0-4, also functions as H8S / A0

GPIO05(UCS1B) 56 IO SRAM CPU general port 0-5, also functions as H8S / CS1

LSI/TEST Control Pin List

Pin Name Pin No. I/O destination Function

MRSTB 202 I RESET IC Master reset input

TESTB2 203 I Test select TESTB1 204

TMS 114 IU E10emulator Test data switch for E10emulator TCK 115 IOU E10emulator Test clock for E10 emulator

It can function as a SCI serial clock output port when E10

emulator is not used (multiplexed).

TDI 116 IU E10emulator Test data input for E10 emulator

It can function as a SCI serial data input port when E10

emulator is not used (multiplexed).

TDO 117 O E10emulator Test data output for E10 emulator

It can function as a SCI serial data output port when E10

emulator is not used (multiplexed).

TRST 118 I E10emulator Test reset for E10 emulator

/Non-mask CPU interrupt port(falling edge sense)

TEST0 110 IO User test/CPU general port2 TEST1 111 Test monitor can be set as the following table by a register TEST2 112 TEST3 113

T*SEL[3:0] TEST0 TEST1 TEST2 TEST3

0 Servo monitor 0 Servo monitor 1 Servo monitor 2 Servo monitor 3 1 WPLL monitor 0 WPLL monitor 1 WPLL monitor 2 WPLL monitor 3 2 Audio 0 Audio 1 Audio 2 Audio 3 3 DVD modulation 0 DVD modulation 1 DVD modulation 2 DVD modulation 0 4 DVD-R/CD-R DVD-R/CD-R DVD-R/CD-R DVD-R/CD-R

monitor 0 monitor1 monitor 2 monitor 3 5 DVD+RW monitor 0 DVD+RW monitor1 DVD+RW monitor 2 DVD+RW monitor 3 6 PI/C1 PI/C1 PI/C1 PI/C1 7 PO/C2 PO/C2 PO/C2 PO/C2 8 DEMO 0 DEMO 1 DEMO 2 DEMO 3 9- - - -

10 CLVCK CLVCK CLVCK CLVCK 11 BLEND BLEND BLEND BLEND 12 PRML monitor 0 PRML monitor 1 PRML monitor 2 PRML monitor 3 13 Data PLL monitor 0 Data PLL monitor 1 Data PLL monitor 2 Data PLL monitor 3 14 RAMCON monitor 0 RAMCON monitor 1 RAMCOM monitor 2 RAMCON monitor 3 15 MIF monitor 0 MIF monitor 1 MIF monitor 2 MIF monitor 3 16 WOBREF monitor 0 WOBREF monitor 1 WOBREF monitor 2 WOBREF monitor 3

T*SEL can be set for each of pins TEST3, TEST2, TEST1, and TEST0, respectively.

Power Supply/GND Pin List

Pin Name Pin No. I/O Function

VDD 28,41,72, PW DSP core power supply (1.5V)

130,146

VCCR 2,53 PW SDRAM power supply (3.3V)

VCCRQ 8,26 SDRAM I/O power supply (3.3V)

VDDAA 159 PW 1.5V system analog power supply (1.5V) WPLL1,2

189,193,197 1.5V system analog power supply (1.5V) PRML A/D Data PLL

VCCA 99 PW Analog power supply (3.3V):AUDIO / ADIP

108 Analog power supply (3.3V):PLL multiplication 139 Analog power supply (3.3V):LVDS 166 Analog power supply (3.3V):WPLL1,2 185 Analog power supply (3.3V):Servo A/D D/A 186 Analog power supply (3.3V):PRML A/D Data PLL

VCC 199 PW Digital power supply (3.3V):PRML A/D Data PLL

VCCIO 7,32,52, PW DSP I/O power supply (3.3V)

58,75,88,

133,148,200

VSS 27,42,73, GND DSP core GND

131,145

VSSR 1,54 GND SDRAM GND

VSSRQ 11,22 GND SDRAM I/O GND

VSSA 104 GND Analog GND:AUDIO / ADIP

105 Analog GND:PLL multiplication 144 Analog GND:LVDS 167 Analog GND:WPLL1,2 168 Analog GND:Servo A/D D/A

187,191,195 Analog GND:PRML A/D Data PLL

VSSAA 158 GND 1.5V system analog GND:WPLL1,2

VSSIO 6,31,51, GND DSP I/O GND

57,74,87, Connected SDRAM I/O GND through 6,31pin

132,147,201

No Pin name Function

1 SPIN Spindle control voltage input 2 SL1IN Slide control voltage input1 3 SL2IN Slide control voltage input2 4 SPLIM Input terminal for spindle current limit 5 VM2 Motor Power Supply 2(for Slide) 6 SL2+ Slide non-inverted output2 7 GND GND 8 SL2- Slide inverted output2

9 SL1+ Slide non-inverted output1 10 SL1- Slide inverted outptut1 11 GND GND 12 U Motor drive output U 13 V Motor drive output V 14 W Motor drive output W 15 ACTFLG Pickup protect flag output 16 COMMON Motor common 17 TEST Test terminal (*

18 SLLIM Input terminal for slide current limit 19 FG Frequency generator output 20 EN1 Input terminal for enable 1 21 EN2 Input terminal for enable 2

No Pin name Function

42 REF Reference voltage input 41 LOIN Loading control input 40 FOIN Focus control voltage input 39 TOIN Tracking control voltage input 38 TLIN Tilt control voltage input 37 TL- Tilt inverted output 36 TL+ Tilt non-inverted output 35 FO- Focus inverted output 34 FO+ Focus non-inverted output 33 GND GND 32 5VCC 5V Power Supply (for FS,TS,TL) 31 TO+ Tracking non-inverted output 30 TO- Tracking inverted output 29 GND GND 28 LO- Loading inverted outptut 27 LO+ Loading non-inverted output 26 VM3 Power Supply3(for Loading) 25 ACTRST Pickup protect Reset (*

24 STTH Reference voltage for spindle start up 23 SPGS Input terminal for gain select SPM 22 VM1 Motor Power Supply 1(for Spindle)

Pin Function

*1) Please connect 17terninal (TEST) to GND or open, for TEST. *2) Please connect 25terminal(ACTRST) to 5VCC, When the Pick-up protection circuit is not used.

IC601 (R2S30202FP) : SPINDLE MOTOR AND 6CH ACTUATOR DRIVER

Pin Layout

1 42SPIN REF

2 41SL1IN LOIN

3 40SL2IN FOIN

4 39SPLIM TOIN

5 38VM2 TLIN

6 37SL2+ TL-

7 36GND TL+

8 35SL2- FO-

9 34SL1+ FO+

10 33SL1- GND

11 32GND

R2S3 0202FP

5VCC

12 31U TO+

13 30V TO-

14 29W GND

15 28ACTFLG LO-

16 27COMMON LO+

17 26TEST VM3

18 25SLLIM ACTRST

19 24FG STTH

20 23EN1 SPGS

21 22EN2 VM1

Package outline : 42 PIN POWER SSOP (42P9R-K)

Block Diagram

STM

SWICHING

Commutation

PWM

CIRCUIT

SPM

V/V converter

CTL

SLIDE2

V/V converter

CTL

SL1+

SL1-

SL1IN

SL2+

SL2-

SL2IN

REF

SPIN

FOIN

FO+

FO-

TRIN

TR+

TR-

VM2

SLIDE1

V/V converter

PWM

CIRCUIT

PWM

CIRCUIT

Current

sense

Current

sense

Current

sense

GND

DSP

SPLIM

DSP

5VCC

SLLIM

commutation

STARTER

CLK

TLIN

TL+

TL-

STTH

Current gain

0.88 A/V

OUTPUT Ron

1ohm

OUTPUT Ron

1.5ohm

OUTPUT Ron

1.5ohm

OUTPUT Ron

1.5ohm

OUTPUT Ron

1.8 ohm

6.4MHz

Frequenc y

75KHz

Frequenc y

75KHz

Frequenc y

150KHz

Current gain

0.88 A/V

Current gain

3A/V

0.6A/V

OUTPUT Ron

1.8 ohm

For /FO/TR/TILT

VM1

GND

BACK EMF

DETECTER

TSD

For SPINDLE

For SLIDE

7-13.2V

4.5-5.5V

FG(x3)

Reverse detect

Voltage gain

x 12

Voltage gain

x 12

Voltage gain

x 12

LO+

LO-

VM3

DSP

OUTPUT Ron

1.5ohm

GND

H Bridge

+ -

EN 1

DSP

EN 2

DSP

For LOADING

4.5-5.5V

7-13.2V

TEST

SPGS

Gain Select

(SPM)

ENABLE

COMMON

ACTRST

ACTFLG

DSP

Pickup Protect

TEST mode

Input/Output circuit diagram

SPIN, SL1IN, SL2IN

LOIN

FOIN, TOIN,TLIN

TEST

REF EN1, EN2

SPGS ACTFLG,FG ACTRST

VM1, U, V, W VM2, SL1+, SL1-, SL2+, SL2-

5VCC, FO+, FO-, TO+, TO-, TL+, TL- VM3, LO+, LO-

5VCC 5VCC 5VCC

5VCC

5VCC 5VCC

5VCC

VM1

VM2

VM3

5VCC

U V W SL1+ SL1- SL2-SL2+

LO-LO+

FO-FO+ TO-TO+ TL-TL+

(Temperature monitor)

5VCC

10k

25k

100

100 100

100

17k

35k

COMMON

VM1

COMMON

100

TROUBLESHOOTING GUIDE

MPU & DSP

IC301

MPU & DSP

IC301

MPU & DSP

IC301

AFE

IC101

AFE

IC101

Pickup

Driver

Front

Monitor

IC102

AFE

IC101

Pin#79

Pin#110

Pin#203

Pin#

87-90

C137

Pin#21

#10

#12

FFC

17,18,20,21

FFC

Pickup

FFC

Setting

FE:R102,C405

Pin#175

pin#98

Driver

TE:R101,C101

PE:R103,C406

(01) Laser Power Adjust (using RD Power/WR Power/Erase Power)

(02) High Frequency/NRZI skew Adjust

(03) Data Slice/Equalizer Boost/Raw Slice/ Equalizer Frequency Adjust

(04) Circuit Offset Adjust

(05) Focus Amp. Adjust for DVD-Dual

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90

#40

FFC

Slider FPC

Slider, #6,8-10

Focus:#34-35

DVD-Dual Disc

Setting

FE:R102,C405

R329,C335

MPU & DSP

IC301

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

All Disc

Pin#

87-90

FFC

Setting

FE:R102,C405

Focus:#34-35

R329,

C335

#40

All Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

All Disc

Pin#

87-90

Setting

FE:R102,C405

Tracking:#30-31

Focus:#34-35

TE:R101,C101

R329,C335

#40

R330,C336

#39

MPU & DSP

IC301

AFE

IC101

Driver IC601

Pickup

Pin#

87-90

PE:R103,C406

FFC

Setting

TE:R101,C101

Tracking

#30-31 Slider FPC

Slider:#6,8-10

Slider FPC

Slider:#6,8-10

R330 C336

#39

(06) Focus Amp. and Total Amp. Adjust

(07) Tracking Amp. Adjust

(08) Servo Loop Gain Adjust

FFC

DVD-RAM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

80-81

#171

#100

FFC

Setting

SIGM:R148, C151

Slider FPC

Slider:#6, 8-10

DVD-RAM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90,80-81

#67,68

FFC

Setting

C341,343

Slider FPC

Slider:#6, 8-10

DVD-RAM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90,80-81

#100

FFC

Setting

SIGM:R148,C151

Slider FPC

Slider:#6, 8-10

(09) Unwritten Slice Level Adjust for DVD-RAM

(12) Focus Offset Adjust for DVD-RAM (Data Error pulse)

(11) Focus Offset Adjust for DVD-RAM (PID Amp)

DVD-ROM Disc

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

Pin#

87-90,80-81

FFC

Setting

FE:R102,C405

Slider FPC

Slider:#6, 8-10

(10) Focus Offset Adjust for DVD-ROM, CD-R/RW

Slider FPC

Slider:#6,8-10

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

Pin#

87-90, 80-81

Pin#

87-90,80-81

FFC

Setting

TE:R101, C101

TRD:R330,C336

TILT: #36-37

#39

#181

Tracking: #30-31

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

FFC

Setting

FE:R102, C405

FE:#34-35

R329, C335

#40

(14) Tilt Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW

(15) Focus Deviation Adjust

Pin#

87-90,80-81

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

FFC

Setting

TE:R101, C101

Tracking:#30-31

Slider FPC

Slider:#6, 8-10

R330, C336

TRD:

#39

#181

(16) Focus Offset Adjust for DVD-R/RW, DVD+R/RW, CD-R/RW

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-RAM Disc

Pin#

87-90,80-81

FFC

Setting

TCE:R106, C106

Slider FPC

Slider:#6, 8-10

TIE:R107,C107

(13) Tilt Adjust for DVD-RAM

MPU & DSP

IC301

MPU & DSP

IC301

Driver IC601

Pickup

FFC

(Temp.Information)

putemp

#178

Spindle

SPD:R349, C349

#211 #1

Pin#

12-14

#19

#213

Pin#

87-90,80-81

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD+R Disc

FFC

Setting

WobSIG

Slider FPC

Slider:#6, 8-10

#154

#37

Pin#

87-90,80-81

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

DVD-R/RW Disc

FFC

Setting

C341, 343

Slider FPC

Slider:#6,8-10

#67,68 #39

(17) Lens Sensitivity Adjust

(18) Spindle Offset Adjust

(19) ADIP BPF/Read Timing Adjust for DVD+R/RW

(20) Focus Offset Adjust for DVD-R/RW, DVD+R/RW(DID)

AFE

IC101

Driver

IC601

Slider/

Spindle

Spindle FFC

Slider FPC

Slider:#6,8-10

Pin#

87-90

MPU & DSP

IC301

AFE

IC101

Driver

IC601

Pickup

All Disc

FFC

Setting

FE:R102,C405

Focus:#34-35

Tracking:#30-31

Slider FPC

Slider:#6,8-10

TE:R101,C101

PE:R103,C406

R329,C335

FOD

TRD

R330, C336

#40

#43

#39

(21) RTZ TimeOut Fail

(22) Focus Servo/Tracking Servo Fail

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte8,9

1 28xx LP Adjust NG. 1) Check Pickup FFC Connection. No.01

2) Check solder of IC101circumference. (pin#6, 10, 12, L150, L151)

3) Check solder of IC102.

4) Exchange Pickup(LDD, Front Monitor).

5) Exchange IC101(AFE).

6) Exchange IC301(MPU & DSP).

2 48xx High Frequency Adjust NG. 1) Check Pickup FFC Connection. No.02

2) Exchange Pickup (LDD part).

3) Exchange IC301(DSP).

3 5Exx NRZi Skew Adjust NG. 1) Check Pickup FFC Connection No.02

2) Exchange Pickup (LDD part).

3) Exchange IC301(MPU & DSP).

4 4C0x to 4C4x Data Slice Adjust NG. 1) Check solder of IC101circumference. No.03

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

5 4C5x to 4C7x EQ Boost Adjust NG. 1) Check solder of IC101circumference.

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

6 4C80 RAW Slice Level Adjust NG. 1) Check solder of IC101circumference.

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

7 4CAx EQ Auto Frequency Adjust NG. 1) Check solder of IC101circumference.

(pin# 79, L150, L151)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

Detail Error Code & Fail Analysis

1. Laser Power Initial Adjust

(Exchange low/high byte)

Byte8: xxh Byte9: 28h

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

1 42xx Circuit Offset Adjust NG. 1) Check Pickup FFC Connection. No.04

2) Check solder of IC101circumference . (pin#,1,2,3 pin#87-90, FE_Servo: R102, C405 TE_Servo: R101, C101 PE_Servo: R103, C406)

3) Exchange IC101(AFE).

4) Exchange Pickup.

5) Exchange IC301(MPU & DSP).

2 452x Focus Amp Adjust NG. 1) Check DVD-Dual Disc. No.05

(DVD-DL Only) 2) Check Pickup FCC Connection.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90, FE_Servo: R102, C405)

4) Check Slider FPC Connection.

5) Exchange IC101(AFE).

6) Exchange IC601(Driver).

7) Exchange IC301(MPU & DSP).

3 450x Focus Amp Adjust NG. 1) Check Pickup FFC Connection. No.06

451x Total Amp Adjust NG. 2) Check solder of IC101circumference. 454x (pin#1,2,3 pin#87-90,

FE_Servo: R102, C405

PE_Servo: R103, C406)

3) Exchange Pickup.

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP)

4 458x Tracking Amp Adjust NG. 1) Check Pickup FFC Connection. No.07

2) Exchange Pickup.

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90, TE_Servo: R101, C101)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

5 47xx Servo Loop Gain Adjust NG. 47XA: Disc Unmatch(Exchange Disc). No.08

1) Check Pickup FFC Connection.

2) Exchange Pickup (Signal Noisy).

3) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90, FE_Servo: R102, C405 TE_Servo: R101, C101)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

6 49xx Unwritten Slice Level Adjust NG. 4906: RAM Disc NG (Exchange Disc). N0.09

(RAM Only) 1) Check solder of IC101circumference.

(pin#1,2,3 pin#87-90)

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

2. Adjusting Error during Disc Load Sequence (Lead in Error)

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

7 4Axx Focus Offset Adjust NG. 4A08: Disc Unmatch(Exchange Disc). No.10

(DVD-ROM,CD-R/RW) 1) Check Pickup FFC Connection.

2) Exchange Pickup.

3) Exchange IC301(MPU & DSP).

8 4A5x Focus Offset Adjust NG. 1) RAM Disc NG (Exchange RAM Disc) No.11

4A6x (RAM Only for PID) 2) Exchange Pickup

3) Exchange IC101(AFE)

4) Exchange IC301(MPU & DSP)

9 4A8x Focus Offset Adjust NG. 4A88: RAM Disc NG (Exchange RAM Disc). No.12

(RAM Only for Data) 1) Exchange Pickup.

2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP)

10 4B0x Tilt Adjust NG(RAM Only). 1) Check Pickup FFC Connection. No.13

2) Exchange Pickup.

3) Check solder of IC101circumference. (pin#6,7 R106, C106, R107, C107)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

11 4B8x Tilt Adjust NG(DVD-/+ R/RW). 1) Check Pickup FFC Connection. No.14

2) Exchange Pickup.

3) Check solder of IC601 circumference.

4) Exchange IC601.

5) Check solder of IC301 circumference.

6) Exchange IC301

7) Exchange Slider Motor.

12 4CCx Data Slice Adjust NG. 1) Exchange Pickup. No.12

(RAM Only) 2) Exchange IC101(AFE).

3) Exchange IC301(MPU & DSP).

13 4Dxx Focus Deviation Adjust NG. 1) Check Pickup FFC Connection. No.15

2) Exchange Pickup.

3) Check solder of IC301circumference.

4) Exchange IC301(MPU & DSP).

14 182x Home Position Adjust NG. 1) Check FFC Connection. No.21

01xx (DVD-SL Only) 2) Check Slider FPC Connection.

3) Exchange Slider Motor.

4) Check solder of IC101circumference.

5) Exchange IC101(AFE).

15 52xx Focus Offset Adjust NG. 1) Check Pickup FFC Connection. No.16

(DVD-R/RW, +R/RW) 2) Exchange Pickup.

3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90,

TE_Servo: R101, C101)

4) Exchange IC101(AFE).

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

16 54xx DPP Amp Adjust NG. 1) Check Pickup FFC Connection. No.07

(CD Disc Only) 2) Exchange Pickup.

3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, TE_Servo: R101, C101)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

17 55xx Lens Shift/ Tilt Adjust NG. 1) Check Pickup FFC Connection. No.14

(CD Disc Only) 2) Exchange Pickup.

3) Check solder of IC601 circumference.

4) Exchange IC601.

5) Check solder of IC301 circumference.

6) Exchange IC301

7) Excahange Slider Motor

18 56xx Focus Level Adjust NG. 1) Check Pickup FFC Connection. No.06

2) Exchange Pickup.

3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, PE_Servo: R103, C406)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

19 57xx HFPE Amp/Gain Adjust NG. 1) Check Pickup FFC Connection. No.13

2) Exchange Pickup.

3) Check solder of IC101circumference. (pin#6,7 R106, C106, R107, C107)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

20 58xx Lens Sensitivity Adjust NG. 1) Check Pickup FFC Connection. No.17

2) Exchange Pickup.

3) Check solder of IC301circumference.

4) Exchange IC301(MPU & DSP).

21 59xx Spindle Offset Adjust NG. 1) Check Spindle FFC Connection. No.18

2) Check solder of IC601circumference. (pin#12-14)

3) Exchange IC601(Driver).

4) Exchange Spindle Motor.

5) Check solder of IC301circumference.

6) Exchange IC301(MPU & DSP).

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

22 5Axx ADIP read timing Adjust NG. 5A01: Check DVD+R Disc (Exchange Disc) . No.19

1) Check Pickup FFC Connection.

2) Exchange Pickup.

3) Exchange IC101(AFE).

4) Exchange IC301(MPU & DSP).

5) Exchange IC601(Driver)

23 5Cxx Signal Amp Error. 1) Check Pickup FFC Connection. No.06

2) Exchange Pickup.

3) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, PE_Servo: R103, C406)

4) Exchange IC101(AFE).

5) Exchange IC301(MPU & DSP).

24 5Dxx Focus Offset Adjust NG. 1) Check Pickup FFC Connection. No.20

(DVD-R/RW,+R/RW in Data) 2) Exchange Pickup.

3) Check solder of IC101circumference.

4) Exchange IC101.

5) Check solder of IC701circumference.

6) Exchange IC301(MPU & DSP).

7) Exchange Slider Motor.

No. Error Code Contents of fail Fail Analysis Block Diagram

SSB Byte21,22

1 2503,2504 RTZ Timeout(Sled Timeout). 1) Check Slider FPC Connection. No.21

2) Check solder of IC601 circumference . (pin#2-3, 6, 8-10)

3) Exchange IC601.

4) Exchange Slider Motor.

2 2020,2021 Focus Fail. 1) Check Pickup FFC Connection. No.22

2) Exchange Pickup.

3) Check solder of IC601circumference.

4) Exchange IC601(Driver)

5) Check solder of IC101circumference. (pin#1,2,3pin#87-90, FE_Servo: R102, C405)

6) Exchange IC101(AFE).

3 2101,2102 Tracking Fail. 1) Check Pickup FFC Connection. No.22

2) Exchange Pickup.

3) Check solder of IC601circumference.

4) Exchange IC601(Driver).

5) Check solder of IC101circumference. (pin#1,2,3 pin#87-90, TE_Servo: R101, C101).

6) Exchange IC101(AFE).

4 2000~2010 Spindle Fail. 1) Check Spindle FFC Connection. No.18

2) Check solder of IC601circumference.

(pin#12-14)

3) Exchange IC601(Driver).

4) Exchange Spindle Motor.

5) Check solder of IC301circumference.

6) Exchange IC301(MPU & DSP).

3. Loading Sequence Error (Lead in Error)

IC701

1.5V REG

IC701

2.8V REG

12V

DRV IC601 R2S30202FP

VM1 #22 Motor power supply 1(Spindle)

VM2 #05 Motor power supply 2(Slide)

IC301 DSP (R8J32007)

#028 VCC Core Power] #041 VDD [Core Power] #072 VDD [Core Power] #130 VDD [Core Power] #146 VDD [Core Power]

CN101 P/U (LDD) Vso5V #29

IC101 AFE(R2S35002) VCC1 #08 Power (5.0V) VCC2 #78 Power (5.0V)

IC102 LM258-D VCC #08

(ON SEMIconductor) OP-amp

Audio Output

Q901 Tr(UMC5N)/Q902 Tr(UMG4N)

CN101 P/U

OEIC(Vcc) #44 & FM(Vcc) #11

CN101 P/U Vsa5(Vcc) #15

Light Scribe Encoder Module Vcc 5V

Front PWB Led Control Vcc 5V

IC601 DRV 5VCC(#32)/VM3(#26)

CN101 P/U LDD Vsl2.8(Vcc) #16

IC101 AFE (R2S35002)

VDD1 #69 Power VDD2 #91 Power VDD3 #11 Power VDD4 #59 Power VDD5 #22 Power

SRVREF #82 Power

IC301 DSP (R8J32007)

VCCA #186 3.3V VCCA #166 3.3V

IC301 DSP (R8J32007)

Audio VCCA #99 3.3V

IC302 Flash Memory Fujitsu/Mcronics

IC301 DSP (R8J32007)

#58 VCCIO [DSP I/O] #75 VCCIO [DSP I/O] #88 VCCIO [DSP I/O]

#108 VCCA [Analog]

#133 VCCIO [DSP I/O]

#139 VCCA [Analog]

#148 VCCIO [DSP I/O]

#185 VCCA [Analog]

#200 VCCIO [DSP I/O]

#53 VCCR [SDRAM] #52 VCCIO [DSP I/O] #32 VCCIO [DSP I/O]

#26 VCCRQ [SDRAM I/O] #08 VCCRQ [SDRAM I/O]

#07 VCCIO [DSP I/O]

#02 VCCR [SDRAM]

12V

Vso

S705 OPEN

2.5(2.8)

3.3A

3.3A-2

3.3D

S713 OPEN

5VR

L151

L150

L602

L601

R354

UMC5N

Vin=5.00 V V0=3.30 V

Pc= W

Vin=5.00 V V0=2.80 V

Torex Regurator

IC703 XCM403AA03SR

miniSMDC150F/24 (Raychem)

L305

L710

1.5D

1.5A

IC703

2.8V REG

IC703

3.3V REG

SW701

Poly SW

5V in

miniSMDC150F/24 (Raychem)

SW702

Poly SW

S707 OPEN

S706 OPEN

S704 OPEN

5VP

S714 OPEN

S708 OPEN

S709 OPEN

L304

L301

Q631

UMC5N

Q651

Vin=5.00 V V0=2.80 V

Pc= W

Vin=2.80 V V0=1.50 V

Torex Regurator

IC701 XCM403AA02SR

S715 OPEN

IC301 DSP (R8J32007)

#189 VDDAA [Analog Power] #193 VDDAA [Analog Power] #197 VDDAA [Analog Power]

IC301 DSP (R8J32007)

#159 VDDAA [Analog Power]

85 86

JR6 Power Supply System Diagram

* Ver1.0 It created based on the PLT circuit diagram.

No Circuit/IC Signal Signal/Level mesurement-point (IC-pin or Device)

1 Power supply Line-12V 12V CN801-41 2 Line-5V 5V CN801-44 3 (IC701) reg-1.5V 1.5V IC701-2 4 reg-2.8V 2.8V IC703-5 5 (IC703) reg-3.3V 3.3V IC703-2 6 Flash-ROM VDD : 3.3V 3.3V 37 7 (IC302) CS Active-Low 26 8 XRD read-CK 28 9 DSP VDD : 1.5V 1.5V 41, 28, 72, 130, 146, 159, 189, 193, 197

10 (IC301) VCC(D) : 3.3V 3.3V 7, 32, 52, 58, 75, 88, 133, 148, 200, 199, 2, 53, 185,

139, 108, 8, 26 11 VCC(A) : 3.3V 3.3V 186, 166, 99 12 Clock-34MHz 33.8688MHz 106, 107 13 MRSTB (3.3V)High 202 14 AFE VCC : 5.0V 5.0V 8, 78 15 (IC101) VDD : 3.3V 3.3V 22, 11, 91, 59, 69, 82 16 OP-amp VCC : 5.0V 5.0V 8

(IC102) 17 7ch-DRV 5VCC : 5V 5V 32 18 (IC601) VM3 : 5V 5V 26 19 VM1, 2 : 12V 12V 5, 22 20 REF : 1.65V 1.65V 42 21 Pick-up VCC(FM) : 5.0V 5.0V 11 22 VCC(OEIC) : 5.0V 5.0V 44 23 VC(OEIC) : 2.1V 2.1V 43 24 VREF : 2.5V 2.5V 9 25 VSL25 : 2.8V 2.8V 16 26 VSA5 : 5.0V 5.0V 15 27 VSO : 5.0V 5.0V 29

* When there are twe or more power supply pins of LSI, it checks by one ramdom pin first.

PCB Poor Analysis - Check list

1. Self-Diagnostic Function by LED Blink.

• Basic operation: At JR6, MPU is included in DSP, MPU accesses each peripheral (inside, exterior) device,

and discover a defect by the ability of a read/write of data to be performed correctly. Since MPU operates by the program with a built-in Flash-ROM, when abnormalities are in MPU, Flash-ROM, and these Data-Bus & control signals, this self-diagnostic function cannot be used. In such a case, the case where LED does not light up at all at the time of a power supply injection is almost the case.

• MPU: In DSP Flash-ROM (16Mb) is connected to the exterior Bus of MPU. Even if the MPU-Bus terminal of Flash-ROM short-circuits, it becomes impossible for MPU to read the right program data from Flash-ROM, and stops for this reason, turning on LED at all. On the other hand, the own poor device of DSP, and the open state of IC-pin, when a defect does not influencing Bas of MPU, it can detect correctly and becomes blink of LED according to those defects.

• DSP: DSP has ATAPI-IF, LDD-serial-IF, AFE-serial-IF, and an AFE control signal as Digital-IF. As AnalogIF, it has the slice circuit of RF signal from AFE, PLL, the objects ADC and DAC for SERVO, and ADC for ADIP detection. Among these, own poor Digital of DSP, and AFE-serial-IF can detect by this self-diagnostic function.

• AFE: Poor detection of AFE is restricted to detection of a limitation-item. Since the greater part of the function is analog signal processing, AFE serves as a register in AFE, and a check, which accepts it, serial IF in the logical digital examination from MPU. In addition, serial-IF for AFE control is performed via DSP. This is writing in the Write command and setting data, and is automatically transmitted to the predetermined register of DSP. Conversely, when it leads the register information on AFE, the read command can be written in the predetermined register of DSP, and the value of an AFE register can be read by reading the read register of DSP after that. Therefore, serial [between the poor register of AFE, and AFE and DSP], when there is LED blink with poor AFE — the defect of IF or the defect of the register for AFE of DSP is considered.

• Refer to the contrast table of the number of times of blink of LED, and a poor part.

• The self-diagnostic function by this LED blink is carried out in the state of a set without a PCB independent

or loading Disc.

HW Self- Diagnostic function

2. LED does not blink at all at the time of a power supply injection. Eject-SW does not react. (1) Is it normal to the exterior Bus (Data-Bus, Address-Bus, control signal system) of MPU?

Viewing — check: -- a short circuit, opening, etc.

• The device connected to the exterior Bus of MPU in DSP, and its signal list

=> It repairs, when abnormalities are discovered.

(2) Does the power supply circuit operate normally?

External input 12V, external input 5V, regulator 3.3V, regulator 2.8V, and regulator 1.5V =>When the abnormalities are discovered, an external power supply, a power supply cable, and Regulator

IC are exchanged.

=> Since a problem is in a load side when not improving, even if it exchanges the above, and attached sheet

JR6 power-supply system figure is made reference, and poor portions, such as a short circuit of a power supply part, are found out and fixed.

(3) Is the clock of MPU in DSP oscillated correctly?

Checked the ceramic oscillation element’s X301 both-ends and DSP(106)(107) 33.87MHz oscillating. => When 3.3V power supply is correctly supplied to DSP and the clock is not oscillating correctly, it is the

defect of MPU, or an oscillation element defect, and part exchange is performed in order of DSP and X301.

(4) The defect of Flash-ROM

Although the clock of DSP is oscillating correctly and the power supply circuit is also outputting normal voltage, when LED does not blink at all at the time of a power supply injection and Eject-SW does not react, either, poor Flash-ROM is the most doubtful. => Flash-ROM (IC302) are exchanged.

Note: Before Flash-ROM exchange, the CS signals of the external device of MPU in DSP connection, an

Address signal, and a Data signal are observed on a waveform level, and since the but most amount of work and the special knowledge which can raise the discovery accuracy of a poor part are necessities, recommendation is impossible.

(5)Even if it performs the above-mentioned repair, when not improving, the disconnection and the short circuit

which cannot be discovered, can be considered in viewing of PCB. Moreover, partial breakage (although a clock is oscillated, somewhere in insides do not operate.) of DSP can be considered. => When not improving above, the possibility that a PCB pattern is faulty is high, and judges repair to be

difficult.

Peripheral device Flash -ROM

[Bus/Signal] (IC302)

Address A1~A20

Data D0~D15

CS* CS0B

WCK WR

RCK RD

3. Motor, Abnormalities in Actuator System

The drive circuit of a motor & actuator consists of the three ICs IC601(R2S30202FP). The work of each IC is as follows.

(1)IC601(R2S30202FP) : 7ch driver

Spindle motor driver: 180° audio drive Type, an analog input, a PWM drive, a Vm=12V. Stepping motor driver X2: analog input, a PWM drive (differential), a Vm=12V Loading motor driver: Input/Output PWM drive, Vm=5V. Focus actuator driver: analog input / output (differential), a Vm=5V Tracking actuator driver: analog input / output (differential), Vm=5V Tilt actuator driver : analog input/output (differential), Vm=5V.

A motor & actuator and its correspondence pin

A control mode setup by the control terminal

Signal/CH SPDL-MT STEP-MT Load-MT Focus-ACT Track-ACT Tilt-ACT

Input (1)SPIN (2)SL1IN (41)LOIN (40)FOIN (39)TOIN (38)TLIN

(3)SL2IN

Reference (42)REF 1.65V

Output (12)U (6)SL2+ (27)LO+ (34)FO+ (31)TO+ (36)TL+

(13)V (8)SL2- (28)LO- (35)FO- (30)TO- (37)TL-

(14)W (9)SL1+

(10)SL1-

EN1(20) EN2(21) SPDL SLED Load Focus/Track/Tilt

Low Low off off off off

Low High off on on off High Low on on off on High High on on off on

12V

GND

Device

configuration

jumper

MASTER

SLAVE

CSEL

Host IDE

Analog audio

LED

3.3V

2.8V

1.5V

Flash-ROM

(2MByte)

MBM29LV160BE

or Equivalent

(FUJITSU)

Disc

motor

Slide

motor

Disc

motor

Unit mechanism

Tray Detect

Eject

Limit

Analog Front End

R2S35002

100pin-TQTF

(RENESAS)

3.3V/2.8V Reg.IC XCM403AA03SR

RST

(TOREX)

2.8V/1.5V Reg.IC XCM403AA02SR

RST

(TOREX)

OPU:HOP-7632TS (HITACHI ME)

Interface

connector

DVD/CD DSP

(DVD/CD/Servo/ATAPI)

R8J32007FP

256pin LQFP

(RENESAS)

DVD-codec

CD-codec

LPP/ADIP

decorder

Servo DSP

ATAPI-IF

Microprocessor

7ch-Driver

R2S30202FP

SPDL/SLED/Fo/Tr/Ti/LD

(RENESAS)

BLOCK DIAGRAM

LG GSA-4167B, GSA-4168B, GSA-4165B User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual