LG GR500 Service Manual

Service Manual Model : GR500

Internal Use Only

Service Manual

GR500

Date: March, 2009 / Issue 1.0

Table Of Contents

1. INTRODUCTION ...............................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

2. SYSTEM SPECIFICATION.................................7

2.1 General function ..........................................................7

2.2 Usable Environment .....................................................8

2.3 Radio Performance ......................................................8

2.4 Current Consumption .................................................16

2.5 RSSI .........................................................................16

2.6 Battery Bar ................................................................16

2.7 Sound Pressure Level ................................................17

2.8 Charging ...................................................................18

3. TECHNICAL BRIEF .........................................19

3.1 Digital Baseband(DBB) & Multimedia Processor ...........19

3.2 GAM Hardware Subsystem .........................................39

3.3. Audio Part ................................................................50

3.4 GPADC(General Purpose ADC) and AUTOADC2 ............57

3.5 Charger control .........................................................58

3.6 Voltage Regulation .....................................................64

3.7 RF Technical Description ............................................65

4. TROUBLE SHOOTING ..................................... 75

4.1 Power ON Trouble ......................................................75

4.2 USB Trouble ..............................................................76

4.3 SIM Detect Trouble ....................................................77

4.4 MicroSD card Trouble ................................................78

4.5 Keypad Trouble ..........................................................79

4.6 Touch Screen ............................................................80

4.7 Camera Trouble .........................................................82

4.8 Main LCD Trouble ......................................................88

4.9 Keypad Backlight Trouble ...........................................90

4.10 Folder ON/OFF Trouble .............................................91

4.11 Audio Trouble Shooting ............................................93

4.12 Charger Trouble Shooting .......................................112

4.13 Checking Bluetooth Block ......................................114

4.14 Checking AGPS Block ............................................118

4.15 RF Component ......................................................121

4.16 Procedure to check ...............................................122

4.17 Checking Common Power Source Block ..................123

4.18 Checking VCXO Block ............................................128

4.19 Checking Front End Module Block ..........................132

4.20 Checking Front End Module Block input logic ..........133

4.21 Checking WCDMA Block ........................................135

4.22 Checking GSM Block .............................................145

5. Download ...................................................158

6. Block Diagram ........................................... 161

7. CIRCUIT DIAGRAM ...................................... 163

8. BGA Pin Map .............................................. 171

9. PCB LAYOUT ...............................................175

10. CALIBRATION ............................................183

10.1 General Description ...............................................183

10.2 Environment ..........................................................183

10.3 Calibration Environment .........................................184

10.4 Program Operation ................................................185

11. Stand-alone Test ...................................... 190

11.1 General Description ...............................................190

11.2 USB Communication Setting ...................................191

11.3 Program Operation ................................................192

11.4 Stand-alone Test ...................................................195

12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................. 197

12.1 EXPLODED VIEW ...................................................197

12.2 Replacement Parts ................................................205

12.3 Accessory .............................................................230

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 3 -

LGE Internal Use Only

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 4 -

Only for training and service purposes

1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system. There are may be risks of toll fraud associated with your
telecommunications system. System users are responsible for programming and configuring the equipment
to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the
above case but will prevent unauthorized use of common-carrier telecommunication service of facilities
accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 5 -

LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system

boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 6 -

Only for training and service purposes

2. PERFORMANCE

2. PERFORMANCE

2.1 General function

Item Specifications Remark

Band GSM Q uad B and(850/ 9 00/ 1800/1900), UM TS(1900/ 850), Bl uet ooth
Type Side Slide ty pe
Dimensi on 105.5 × 53. 5 × 15. 8 m m
W ei ght 110g (wit h s tandard batt ery)
Power 950mAh Li -ion
Talk Time Over 180 M i n : 950m Ah Li -i on 2G
Stand-by Time Over 250 hours : 950m Ah Li -i on
Antenna Intenna Type
LCD(Main) 2.8" (240x400), TFT Color LCD
Back Ligh t Yes
Back Ligh t col or W hi te
Vibrator Yes
Speaker Yes
MIC SM T type
Receiv er Yes
Earphone Jac k Yes
SIM S o c ket Yes(S IM Bl oc k Type) : 3. 0V & 1.8V
Vol um e K e y Push Type(+, -)
Camera K ey Push Type
I/O Connec t 5Pi n M i c ro US B

Ear-M i c (St ereo Earphone) Travel A dapt o r 950mAh Li -

Standard A ccessory

Opti onal Ac cessory

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

Ion Bat t ery US B c abl e Bundl e S / W and Set up Wi zard
CD Hand s trap

Second 950m Ah Li -i on B att ery
Bl uet o ot h S tereo Headset

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LGE Internal Use Only

2. PERFORMANCE

2.2 Usable Environment

1) Environment

Item Spec. Unit

Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.25) V

Operating Temp. -20 ~ + 60 °C

Storage Temp. -30 ~ + 85 °C

Humidity max. 85 %

2) Environment(Accessory)

Item Spec. Min Typ. Max Unit

Power Available power 100 220 240 Vac

* CLA : 12~24V (DC)

2.3 Radio Performance

1) Transmitter – GSM Mode

No

1

Conducted

Spurious
Emission

Item

MS allocated

Channel

Idle Mode

DCS/PCSGSM

100k ~ 1GHz

1G ~ 12.75GHz

100k ~ 880MHz -60dBm 100k ~ 880MHz -60dBm

880M ~ 915MHz -62dBm 880M ~ 915MHz -62dBm

915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm

1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm

-39dBm

-33dBm

9k ~ 1GHz -39dBm

1G ~ 1710MHz -33dBm

1710M ~ 1785MHz -39dBm

1785M ~ 12.75GHz -33dBm

1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm

1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

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Only for training and service purposes

2. PERFORMANCE

No

Radiated 1785M ~ 4GHz -30dB m
Spurious 30M ~ 880M Hz -57dBm 30M ~ 880M Hz -57dBm

1

Em ission 880M ~ 915MHz -59dBm 880M ~ 915M Hz -59dBm

2

3Phase Error

Frequency E rror Under RA 250: ±200Hz RA250: ±250Hz

Multipat h and Int erference HT100: ±100Hz HT100: ±250Hz

Item

MS all ocat ed 1G ~ 1710M Hz -30dB m

30M ~ 1GHz

Channel 1710M ~ 1785M Hz -36dBm

1G ~ 4GHz

Idle Mode 915M ~ 1000M z -57dBm 915M ~ 1000MHz -57dB m

1G ~ 1.71GHz -47dBm 1G ~ 1.71G Hz -47dBm

1.71G ~ 1. 785GHz -53dBm 1.71G ~ 1.785GHz -53dB m

1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm

Frequency Error ±0.1ppm ±0.1ppm

±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
3dB below reference sens i tivity 3dB below reference s ensitivity

-36dBm

-30dBm

30M ~ 1GHz -36dBm

DCS/PCSGSM

Conditi on TU50: ±100Hz TU50: ±150Hz

4

Due to 400kHz -60dB 400kHz -60dB

Output RF m odul ation 600 ~ 1800k Hz -66dB 600 ~ 1800kHz -60dB

Spec trum 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB

5

Due to

Switching

transient

TU3: ±150Hz TU1.5: ±200Hz
0 ~ 100kHz +0. 5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -31dB

3000 ~ 6000kHz -71dB ≥6000kHz -73dB

6000kHz -77dB

≥

400kHz -19dB 400kHz -22dB
600kHz -21dB 600kHz -24dB
1200kHz -21dB 1200k Hz -24dB
1800kHz -24dB 1800k Hz -27dB

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 9 -

LGE Internal Use Only

2. PERFORMANCE

No Item

Intermodulatio n

attenuation

8

Transmitter

Output Power

GSM DCS/PCS

Frequency offset

–7

Power

control

Level

533±3030±3

631±3128±3

729±3226±3

827±3324±3

925±3422±3

10 23 ±3 5 20 ±3

11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

Power

(dBm)

Tolerance

(dB)

Intermodulation product should
be Less than 55dB below the
level of Wanted signal

Power

control

Level

Power

(dBm)

800kHz

Tolerance

(dB)

9Burst timing

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4

19 5 ±5 14 2 ±5

15 0 ±5

Mask IN

Mask IN

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 10 -

Only for training and service purposes

2) Transmitter – WCDMA Mode

N o Item Specification

2. PERFORMANCE

1 Maximum Output Power

2 Frequency Error ±0.1ppm

3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme

4 Inner Loop Power control in uplink

5 Minimum Output Power -50dBm(3.84MHz)

6 Out-of-synchronization handling of output power

7 Transmit OFF Power -56dBm(3.84M)

8 Transmit ON/OFF Time Mask

Class3: +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)

Adjust output (TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5
group(10equal command group)
+1 +8/+12 +

Qin/Qout:DPCCH quality levels
Toff@DPCCH/lor:-22->-28dB
Ton@DPCCH/lor:-24->-18dB

±25 u s
PRACH, CPCH, uplink compressed mode

±25 u s

9 Change of TFC

10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

12 Spectrum emission Mask

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -

power varies according to the data rate
DTX: DPCH off
(minimize interference between UE)

-35-15*(?f-2.5)dBc@?f=2.5~3.5MHz, 30k

-35-1*(?f-3.5)dBc@?f=3.5~7.5MHz, 1M

-39-10*(?f-7.5)dBc@?f=7.5~8.5MHz, 1M

-49 dBc@?f=8.5~12.5MHz, 1M

LGE Internal Use Only

2. PERFORMANCE

No Item Specification

13 Adjacent Channel Leak age Rat i o(A CLR)

Spuri ous E m i ss i on s

14

*: additional requirement

15 Transmit Intermodulation

16 Error Vector Ma gni tude(E VM )

17 Transm it OFF P ower

33dB@5M Hz, ACP>-50dB m
43dB@10M Hz, ACP>-50dB m

-36dBm@f=9~ 150K Hz , 1k B W

-36dBm @f= 150 K Hz~ 30M Hz, 1 0k

-36dBm@f=30~ 1000MHz, 100k

-30dBm@f=1~ 12. 75GHz , 1M

-41dBm*@1893. 5~ 1919. 6M Hz , 300k

-67dBm*@925~ 935M Hz , 100k

-79dBm*@935~ 960M Hz , 100k

-71dBm*@1805~ 1880MHz, 100k

-31dBc@5M Hz, Interferer -40dBc

-41dBc@10M Hz , Interferer -40dBc

17.5% (> -2 0dB m)
(@12. 2k, 1DP DCH+1DP CCH)

-15dB@SF = 4, 768kbps ,
multi-code transmission

3) Receiver - GSM Mode

No GSM DCS/PCS

Sensitivit y (TCH/FS Class II)

1 -105dBm -105dBm

Co-Chan nel Rej e cti on

(TCH/FS Class II, RBER,

2 C/Ic=7dB C/Ic=7dB

3 Adj acent Channel 200kHz C/Ia1= -12dB C/ Ia1= -12d B

Intermod ul ation Rej ection

4

5

(TCH/FS Class II, RBER)

Item

TUhigh/FH)

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

Bl ock i ng Response

W anted S i gnal : -98dB m

1’st interferer: -44dBm
2’st interferer: -45dBm

Wanted Si gnal: -101dBm

Unwanted Signal: Depend on freq.

Wanted Si gnal: -96dBm

1’s t i nt erferer: -44dBm
2’s t i nt erferer: -44dBm

W ant ed S i gnal: -101dB m

Unwanted S i gnal: Depend on freq.

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 12 -

Only for training and service purposes

4) Receiver – WCDMA Mode

No Item Specification

1 Reference S ensivitivity Level -106.7dBm(3. 84M )

-25dBm (3.84M Hz)

2 Maximum Input Level

-44dBm/3.84MHz(DPCH_Ec)
UE@+20dB m o utput power(cl ass3)

2. PERFORMANCE

3 Adjacent Channel Select ivit y (ACS)

4 In-band Bl ock i ng

5 Out-band Bloc k i ng

6 Spurious Response

33dB
UE@+20dBm output power(class3)

-56dBm/3.84MHz@10MHz
UE@+20dBm output power(class3)

-44dBm/3.84MHz@15MHz
UE@+20dBm output power(class3)

-44dBm /3. 84MHz @f= 2050~2095 &
2185~223 0M Hz, band a)
UE@+20dBm output power(class3)

-30dBm/3.84MHz@f=2025~2050 &
2230~225 5M Hz, band a)
UE@+20dBm output power(class3)

-15dBm /3. 84MHz @f= 1~2025 &
2255~12500MHz , band a)
UE@+20dBm output power(class3)

-44dBm CW
UE@+20dBm output power(class3)

7 In t ermodul at i on Charact eri stic

8 Spurious Emis s ions

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

-46dBm CW@10MHz &

-46dBm/3.84MHz@20MHz
UE@+20dBm output power(class3)

-57dBm @f= 9KHz ~1GHz, 100k B W

-47dBm@f=1~12.75GHz, 1M

-60dBm @f= 1920 ~ 19 80M Hz , 3.84MHz

-60dBm @f= 2110 ~ 21 70M Hz , 3.84MHz

- 13 -

LGE Internal Use Only

2. PERFORMANCE

5) Bluetooth Mode

5.1) Transmitter

No Item

1 Out Power
2 Power De nsi ty

3 Power Co ntrol

4 TX Output Spect rum -F requ ency range

5 TX Out p ut S pect rum -20dB B andwidt h

6 Tx O utput Spec trum -A djac ent channel P o

7 Modulation Characteristics

8 Init. Carrier Freq. Tolerance

9 Carrier Frequenc y Drift

Specification

Clas s 2 : -6~4dB m
Power densi t y < 20dB m pe r 100kHz EIRP
Option

2dB ≤ step size ≤ 8dB

fmax & fmi n @ bel ow t h e l evel of -30dBm
(100k hz B W) wi thi n 2.4GHz~ 2.4835G Hz

1MHz

≤

-20dBm @ C/I = 2M Hz

≤

-40dBm @ C/ I ≥ 3MHz

≤

140kHz ≤ delt a f1 avg ≤175kHz
delta f2max ≥115kHz at l east 99. 9% of all del taf2max
delt a f2avg/deata f1avg≥0.8

±75KHz

≤

1 slot : ≤ ± 25kHz
3 slot : ≤ ± 40kHz
5 slot : ≤ ± 40kHz
Maximum drift rate ≤ 20KHz /50usec

Freq.Range Operating Standby

30MHz~1GHz -36dBm -57dBm

10

Out of Band S purious Emiss i ons

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

Above 1G Hz ~ 12.75GHz -30dBm -47dBm

1.8~1.9GHz -47dBm -47dBm

5.15~5.3GHz -47dBm -47dBm

- 14 -

Only for training and service purposes

5.2) Receiver

2. PERFORMANCE

No Item

1 Sensitivity single slot packets

2 Sensitivity multi slot packets

3

4

C/I performance

Block i ng Characterist ic

Specification

BER≤0.1%@-70dBm

BER0.1%@-70dBm
BER ≤ 0.1% @ (Low,M i d, Hi gh Frequenc y)

2405MHz, 2441M Hz , 2477MHz
Interferenc e Ratio
Co-Channel interference, C/ I c o-c hannel 11dB
Adjacent(1MHz)interference, C/I 1MHz 0dB
Adjacent(2MHz)interference, C/I 2MHz -30dB
Adjacent(≥3MHz)i nt erference, C/ I ≥3MHz -40dB
Adjacent(≥3MHz)interferenc e to i n ba nd -9dB
mirror frequency, C/I im age ± 1M Hz -20 dB
BER ≤ 0.1% @want ed s i gnal -67dB m
interfering Si gnal F requenc y Power Level
30MHz~2000MHz -10dBm
2000MHz~ 2400M Hz -27dBm

5 Intermodluat i on P erformanc e

6 Max i mum Input L evel

2500MHz~ 3000M Hz -27dBm
3000MHz~12.75GHz -10dBm

BER ≤ 0.1% @want ed s i gnal -64dB m
st atic s i nwave signal at f1= -39dBm
a BT modulated signal f2=-39dB m (pay load PRBS 15)

BER ≤ 0.1%@-20dB m

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 15 -

LGE Internal Use Only

2. PERFORMANCE

2.4 Current Consumption

(VT test : Speaker off, LCD backlight On)

Stan d by Vo ice Call VT

WCDMA

GSM

2.5 RSSI

250 Hours = 3. 4 m A 180 Min = 300 m A
(DRX=2.56) (Tx=12dBm)
250 Hours = 3. 4 m A 180 Min = 300 m A
(paging=5peri od) (Tx= M ax)



-77



-86

-95





-100

-105 2 dBm-107 2 dBmBAR 1  BAR 0

125 Min= 380 mA

(Tx=12dBm)

WCDMAGSMCell Power [dBm]

2 dBm-79 2 dBmBAR 5  BAR 4

2 dBm-87 2 dBmBAR 4  BAR 3

2 dBm-97 2 dBmBAR 3  BAR 2

2 dBm-104 2 dBmBAR 2  BAR 1

2.6 Battery Bar

StandbyIndication

Over 3.84

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 16 -

3.83

3.73

3.64

3.2

󰆚

󰆚

󰆚

󰆚

󰆚

0.05V Bar3

0.05V Bar 3  2

0.05V Bar 2  1

0.05V Bar 1  Blink

0.05VPower Off

Only for training and service purposes

2.7 Sound Pressure Level

2. PERFORMANCE

No

1 Sending Loudness Rati ng (S LR) 8±3dB

2 Recei ving Loudnes s Rat ing (RLR)

3 Sid e Tone Maskin g Rat i ng (S TMR)

4 Ec ho Loss (E L) 40dB over

5
6

7 Idle Noise-S endi ng (INS)

8 Idle Noise-Rec eiving (INR)

A NOM

9 Sending Loudness Rati ng (S LR)

C MAX
O NOM -1±3dB

10 Recei ving Loudnes s Rat i ng (RLR)

U MAX -12±3dB
S NOM

11

T MA X

I NOM

12 Ec ho Lo ss (EL)

C MAX

13
14

15 Idle Noise-S ending (INS) -55dBm0p under

16 Idle Noise-Receiving (INR)

GSM: P ower Level: 5

DCS: P ower Level: 0

17

(Cell P ower: -90 ~ -105dBm )

MS/HEADSET SLR: 8±3dB

MS/HEADSET RLR: -13±1dB/-15dB

(SLR/RLR: mid-Value Setting)

Sending Distortion (SD) refer to TABLE 30.3

Recei ving Dist orti on (RD) refer to TABLE 30.4

Sendi ng Distort i on (S D) refer to TABLE 30.3

Rec e i ving Di storti o n ( RD)

TDMA NOI SE

Acoust ic(Max Vol.)

Test Ite m

MS

Headset

GSM

DCS

GSM

DCS

MS

HEAD

SET

SEND

REV.

SEND

REV.

SEND

REV.

SEND

REV.

Specification

NOM

MAX

NOM -1±3dB

MAX - 15±3dB

NOM

MAX

NOM

MAX

NOM

MAX

NOM -47dBPA under

MA X -36dBPA unde r

refer to TABLE 30.4

NOM

MAX

NOM -45dBPA under

MA X -40dBPA unde r

17dB over

-64dBm 0p un der

8±3dB

25dB overSi de Tone Ma sk i n g Rat i ng (S TMR)

40dB over

-62dBm under

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 17 -

LGE Internal Use Only

2. PERFORMANCE

2.8 Charging

· Normal mode: Complete Voltage: 4.2V

Charging Current: 500mA

· Await mode: In case of During a Call, should be kept 3.9V

(GSM: It should be kept 3.9V in all power level

WCDMA: It will not be kept 3.9V in some power level)

· Extend await mode: At Charging prohibited temperature(0C under or 45C over)

(GSM: It should be kept 3.7V in all power level

WCDMA: It will not be kept 3.7V in some power level)

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 18 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1 Digital Baseband(DBB) & Multimedia Processor

3.1.1 General Description

• Access subsystem

- Access Central Processing Unit (CPU) subsystem – ARM926, Joint Test Action Group (JTAG),
Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM

- Access peripheral subsystems – Subscriber Identity Module (SIM) interface, IrDA®, Universal Serial
Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on

- Digital Signal Processor (DSP) subsystem – CEVA-X1620, JTAG, Static Random Access Memory
(SRAM), and Program Data Read Only Memory (PDROM)

- EDGE/GSM/GPRS (EGG) subsystem – EGG hardware accelerators

- WCDMA subsystem – WCDMA hardware accelerators

• Application subsystem

- Application CPU subsystem – containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM

- Application peripheral subsystems – I2C™, keypad, UART, and so on

- Graphics subsystem – XGAM subsystem

- Audio Processing Execution (APEX) and video encoder subsystems

In addition to the two subsystems above, there is also a test block, chip control block, and
a pad multiplexing block residing at the top level

y DSP

- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which
contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X
1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug
logic and interfaces. In addition to the megacell, the DSPSUB includes external memories,
peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz.

- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master
provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core
through the AHB. The AHB slave interface allows the CPU and the DMA to access in the
program and data RAM residing in the DSPSUB.

y WCDMA subsystem

- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem

- An interface to the WCMDA together with memory control and an internal single port

RAM. The WCDMA subsystem has three AHB slave interfaces.

- The Ericsson DB 3150 also includes HSDPA class 6 functionality.

- The WCDMA subsystem is handled and provided by Ericsson.

y XGAM subsystem

- The XGAM subsystem is a graphics acceleration module that provides hardware

support in the creation of visual imagery and the transfer of this data to a display.
The XGAM also provides support for connecting a Camera module. The visual data
could be graphics, still images, or video.

- The XGAM subsystem is handled and provided by Ericsson.

y Operation and Services

- IC™ Interface

-SIM Interfaces

- General Purpose I/O (GPIO) Interface

- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM,

- JTAG

-RTC

- ETM (in Prototype Package)

3. TECHNICAL BRIEF

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 19 -

LGE Internal Use Only

3. TECHNICAL BRIEF

SPDT

FEM (SWPlexer + GSM_RX_SAW)

26MHz

X-Tal

A-GPS

Bluetooth

850

RX_SAW

1900

LNA

W-VCO

RX_SAW

LNA

I/Q

HDET

Duplexer

1900

Duplexer

Coupler

WCDMA

PAM

TX_SAW

RF3300

W-VCO

850

Coupler

TX_SAW

SSB

I

SSB

I

DB3200

GSM 1900 Rx

GSM 1800 Rx

GSM 900 Rx

GSM-VCO

SSB

I

GSM 850 Rx

PAM

TX_SAW

900

1800/1900

GSM

GSM Tx/Rx

WCDMA Tx/Rx

AB3100

Power

850/90

0

Stereo Headset

05

TPA62

USIM

MIC

+5V

Receiver

r

Transceive

USB

Shifter

SD

SDRAM 1G

Level

Micro

(2.8” WQVGA)

NAND 2G

LCD

2M

VGA

Figure 3-1-1 GR500R Block Diagram

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 20 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.2 External memory interface

RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory
area.

A. GR500R’s memory

y 2Gb NAND flash memory +1G SDRAM

Dev ic e Part Na me Mak e r Item Time Size Speed

Program speed 220μs 1Page=(2K + 64)Bytes 10.32MByte/s

NAND flash KA100J00BA-AJYY Samsung

Erase speed 1.5ms 1Block=(128K+4K)Bytes 88MBy te/s

Table 3- 1- 1. External Memory Interface Spec. of GR500

Figure 3- 1- 2. External Memory Configuration of GR500

y Package

- 10.5 by 13 mm 107 balls, 0.8mm pitch FBGA Production Package

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 21 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.3 Hardware Architecture

A. Block Diagram

26

26

MHz

MHz

ARB

Figure 1 Access Architecture

Figure 3-1-3. Access system of Ericsson DB3200

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 22 -

Only for training and service purposes

3.1.3 Hardware Architecture

A. Block Diagram

ETM

JTAG

32

Periferals

ISP

2

32

AHB Periph

INTCON

8

32

MS PRO

32

Boot ROM

52 MHz

32

EMIF

AHB2AHB

AHB

Slave

ARB

AHB

EMIF

AHB

AHB

Slave

Slave

SDRAM IF

Acc-App link

From Access system

SDRAM/NOR

55

SDRAM/NOR

55

55

PSRAM/NOR/NAND

AHB

Slave

AHB

Slave

EMIF Arbiter

SDRAM IF

AAIF

AAIF
RAM

Intel
MSL

AHB

Slave

ARB

ARB ARB

SEMIF

AHB

Slave

AHB

Slave

NOR/
PSRAM/
NAND IF

3. TECHNICAL BRIEF

APP CPU SUBSYS

ARM926 SM

DTCM

ITCM

ETM9

EICE

I Mem

Control

AHB

Cache
32 kB

I

AHB

Slave

AHB2APB

13 MHz

16

32

32

32

32

16

16

16

32

32

(Slow)

32

ETM IF

ARM9EJ-S

MMU

TLB

AHB BUS IF

AHB
Slave

ARB

APB SLOW

SYSCON

WDOG

TIMER0

TIMER1

UART0

KEYPAD

GPIO

RTC

BUS TR

Event H

DMUC

JTAG DEBUG

Master

ARB

52 MHz

4

11

24

8 kB

Cache
32 kB

Master

TCM IF

D

AHB

8 kB

ARM926CM

D Mem
Control

AHB

Slave

26 MHz

ARB

AHB2APB

(Fast)

32

16

16

2

3

32

16

MMC/SD

I2S/PCM0

I2S/PCM1

I2C0

I2C1

SPI

AHB

Master

APB FAST

8

4

4

2

2

6

APP DMAC

AAIF
RAM

DMA CORE

40 Channels

& Requests

AHB
Slave

AHB

Master

GRAM

64k byte

GAMEACC

MCiDCT

(Video)

APEX+

APEX

APEX

RAM

ROM

APEX

AHB

Slave

ARB

ARB

AHB

Slave

GAMCON

DATA

(3D)

CPU

MM HW

AA Interface HW

PDI

PDICON

CDI

CDICON

V ENC

RAM0

Video Encoder

AHB

Master

XGAM

PAR/ SSI

Data Com HW

Video Encoder

V ENC
RAM0

AHB

Slave

ARB

PDI

AHB

Slave

CamISP

Basic HW

APP BUS

AHB0 (Inst)

AHB1 (Data)

AHB2 (DMA0)

AHB3 (DMA1)

AHB4 (GAM)

AHB5 (V Enc)

AHB

Periferals

CDS

ISP

CDS

CDI

Figure 2 Application Architecture

Figure 3-1-4. Application system of Ericsson DB3200

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 23 -

LGE Internal Use Only

3. TECHNICAL BRIEF

B. CPU Subsystem

- Access CPU subsystem

The digital baseband controller includes an access CPU subsystem, which includes the submodules
described below.

• 32 KiB I-cache

• 16 KiB D-cache

• Page table

• Memory Management Unit (MMU)

•JTAG

•ETM9

• 26 KiB I-TCM

•8 KiBD-TCM

- Application CPU subsystem

The digital baseband controller includes an Application CPU subsystem, which includes the
submodules described below.

• 32 KiB I-cache

• 16 KiB D-cache

• Page table

• MMU

•JTAG

•ETM9

•8 KiBI-TCM

•8 KiBD-TCM

C. Peripheral Hardware Subsystem

The digital baseband controller includes hardware that supports mobile terminal peripherals
such as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware
comprises the Peripheral subsystem.
The functional blocks of the Peripheral subsystem connect to the peripheral bus through four
separate bridges, which provide a simple interface to support different timing and memory
access arrangements.

D. DSP Hardware Subsystem

The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP
CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB
instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the
megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP
megacell is clocked at 208 MHz.

The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct
access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB
slave interface allows the CPU and the DMA to access in the program and data RAM residing in the
DSPSUB.

E. XGAM Subsystem

The XGAM subsystem is a graphics acceleration module that provides hardware support in the
creation of visual imagery and the transfer of this data to a display. The XGAM also provides support
for connecting a Camera module. The visual data could be graphics, still images, or video.

The XGAM subsystem is handled and provided by Ericsson.

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 24 -

Only for training and service purposes

3. TECHNICAL BRIEF

F. System Control Subsystem
The SYSCON resides at the top level of the circuit architecture and is responsible for clock

generation and clock and reset distribution within the digital baseband controller, as well as to
external devices.

The block is a slave peripheral under control of the ARM processor. The programming of the
SYSCON controls the fundamental modes of operation within the digital baseband controller.
Individual blocks can also be reset and their clocks held inactive by accessing the appropriate
control registers.

3.1.4 RF Interface

A. DB3200 Interface

DB3200 controls GSM RF part using these signals through GSM RF chip-RF3300.

y RF_DATA_A
y RF_DATA_B

y RF_DATA_C

y TX_ADC_STRB

TX_ADC_STRB

RF_DATA_STRB

Figure 3-1- 5. Schematic of DB3200 RF Interface

B. WCDMA Radio Link Interface

y RF_WCDMA_PA_0_EN
y RF_WCDMA_PA_1_EN
y RF_WCDMA_DCDC_EN
y RF_WCDMA_PWRDET_E

RF_WCDMA_PA_0_EN
RF_WCDMA_PA_1_EN

RF_WCDMA_DCDC_EN

RF_WCDMA_PWRDET_E

Figure 3-1-6. Schematic of WCDMA RF Interface

RF_DATA_A
RF_DATA_B
RF_DATA_C

B15
B16
C15
D15
A16

B14
D14
B13
C13

QDATA_AMP_MSB

IDATA_FREQ_MSB
AMP_FREQ_LSB
TX_ADC_STRB
DATA_STR

WTX_BAND_2_EN
WTX_BAND_5_EN
WPOW_DET_EN

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 25 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.1.5 SIM Interface

SIM interface scheme is shown in Figure3-1-6.
SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DB3200 with

AB3100 and filter.

SIM (Interface between DBB and ABB)

SIM card bidirectional data lineSIMDAT0

SIM card reference clockSIMCLK0

SIM card async/sync resetSIMRST0

Table 3-1-2. SIM Interface

DB3200

SIMDAT0

SIMCLK0

SIMRST0

VDDE

AB3100

10K

SDAT SIMDAT

SCLK SIMCLK

SRST SIMRST

Figure 3-1-7. SIM Interface

SIMVCC

3.1.6 UART Interface

UART signals are connected to DB3200 GPIO through IO connector

UART0

NoteNameResource

ACC Receive DataACC_UART0_RXACC_GPIO_2

ACC Transmit DataACC_UART0_TXACC_GPIO_3

10K

VDD

DAT

CLK CARD
RST

UART1

APP Receive DataAPP_UART_RXAPP_GPIO_0

APP Transmit DataAPP_UART_TXAPP_GPIO_1

Table 3-1-3. UART Interface

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 26 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.7 GPIO (General Purpose Input/Output) map

Total GPIO is composed of ACCESS part and APPLICATION part. ACCESS part has 39 allowable

resources and APPLICATION part has 31. GPIO Map, describing application, I/O state, and enable
level are shown in below table.

Initial StateI/ONameGPIO

LowOutputACC_USB_HS_STP00

LowOutputACC_USB_HS_DIR01

LowInputACC_UART0_RX02

LowOutputACC_UART0_TX03

LowInputACC_USB_HS_IN_CLK04

LowInputACC_USB_HS_NXT05

LowInputACC_USB_HS_DATA406

LowInputACC_USB_HS_DATA507

InputACC_USB_HS_DATA608

Low

LowInputACC_USB_HS_DATA709

LowInputACC_UART3_RX10

LowOutputACC_UART3_TX11

LowInputACC_UART3_CTS12

LowOutputACC_UART3_RTS13

LowInputN.C.14

LowOutputACC_GP_SUBLED_ON15

LowOutputACC_GP_USB_CS16

LowOutputACC_GPS_START17

LowInputACC_USB_HS_DATA318

LowInputACC_GP_FLIPSENSE19

LowInputACC_SPI_DI20

LowOutputACC_SPI_DO21

LowOutputACC_SPI_OUT_CLK22

LowInputN.C.23

LowInputACC_GP_LCD_ID24

LowInputN.C25

HighOutputACC_GP_SPI_BT_CSn26

LowInputACC_GP_SPI_BT_IRQ27

LowInputN.C28

LowInputN.C29

LowInputN.C30

LowInputN.C.31

LowInputN.C.32

LowInputN.C.33

Table 3-1-4. DB3200 ACC GPIO Map Table

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 27 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Initial StateI/ONameGPIO

InputAPP_UART_RX00

Low

LowOutputAPP_UART_TX01

LowOutputAPP_GP_CAMLDO_EN02

LowInput/OutputAPP_GP_USW_SDA03

LowOutputAPP_GP_2M_SDN04

LowOutputAPP_GP_USW_SCL05

LowInput/OutputAPP_GP_TOUCH_SDA06

LowOutputAPP_GP_TOUCH_SCL07

HighInputAPP_GP_TOUCH_PENIRQn08

LowOutputAPP_GP_FLASHLED_EN09

LowOutputAPP_GP_FLASHLED_TORCH10

LowInputAPP_MMC_FB_CLK11

LowInputAPP_GP_MMC_DET12

LowInputAPP_GP_USW_INT13

LowInput/OutputAPP_GP_3AXIS_SDA14

LowOutputDCON (Dedicated)15

LowOutputAPP_GP_3AXIS_SCL16

LowInputAPP_GP_3AXIS_INT17

HighOutputAPP_GP_KEYENCODE_RST18

LowInput/OutputAPP_GP_KEYENCODE_SDA19

LowOutputAPP_GP_KEYENCODE_SCL20

LowInputAPP_GP_KEYENCODE_INT21

LowOutputAPP_GP_GPS_PON22

LowOutputAPP_GP_VGA_SDN23

LowOutputAPP_GP_MOTORLDO_EN24

LowOutputAPP_GP_LCDBL_CTRL25

Table 3-1-5. DB3200 APP GPIO Map Table

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 28 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.8 USB

The USB block supports the implementation of a “High-speed" device fully compliant to USB 2.0
standard. It provides an interface between the CPU (embedded local host) and the USB wire, and
handles USB transactions with minimal CPU intervention.

The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in
RAM within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO
register access. High-speed (high throughput) endpoints can use DMA while slower endpoints can
use FIFO register access.

The USB block can request up to six DMA channels, three for IN endpoints and three for OUT
endpoints.

NoteUSB Function

ULPI stop signalUSB_STP

ULPI direction signalUSB_DIR

USB clockUSB_CLK

ULPI next signalUSB_NXT

USB data0USB_DAT0

USB data1USB_DAT1

USB data2USB_DAT2

USB data3USB_DAT3

USB data4USB_DAT4

USB data5USB_DAT5

USB data6USB_DAT6

USB data7USB_DAT7

USB chip selectUSB_CS_PD

Power supply for DB3200 USB blockVBUS

Table 3-1-6. USB Signal Interface of DB3200

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

A

CA

C

C

A

2

J

S

U

0ATAD_B
1ATAD_BSU

_

U

S

C

A

C

A

C

CA

2ATAD

B

S_S

PT

_BSU_

H

R

ID_SH_BSU_CC

0TRAU_CCA

XR_

CA

C

_BSU_CCA

T_0

X

TRAU_

K

S

LC_NI_

H

TXN_SH_BSU_

A

4AT

_SH_BSU_CCA

D

5ATAD_SH_BSU_CC

AT

S

SU_C

B

H_

CA

P

_

G

CA

6

_

AD
A

7AT

_SH_BSU_CCA

D

R_3TR

X

AU_C

3T

XT_

AU_CCA

R

A

_CCA

U

_CCA

U

_

US

G

_CCA

TC_3TR

A

S

T

R

R

S

_3T

LB

O_DE

N
S

SU_P

_B

C

ATS_SPG_C

TR

U

K

2
3L

U

J

3

A

K

3

L

8

A

CC

1G

A

C

K

8

C

A

F

1

A

8J

C

A

3G

CA

H

3

G

2

CA

H

9

A

1

E

1

0

H

D

1

A

F

3

A

C

C

4D

CCA

3C

A

C

C

5

G
E

4

MV_0ES_BS

PV_TAD_BSU

EO_BS

P

_OI

0

G_CC

_OIPG_CCA

1

_

2_OIPG

IP

3_O

_C

G

P

_OI

4

G_C

5_OIPG_CC
6

_OIPG_C

7_OIPG_C

P

8_OI

_CCA

G

9

_OIPG_C

01_OIPG_CC

IP

1_O

_CCA

1

G

P

_CCA

_OI

G

21
3

1

G_CC

_OIP

41_OIPG

_

51_OIPG_

PBSU_

61_OIPG

R

_

B

71_OIPG_CCA

Table 3-1-8. Schematic of DB3200 USB block

V

0.1uC607

8V1_EDD

M

D_BSU

U

PD_BS

12K

1%

R604

0.1uC608

106R

K1

C609 4.7u

C610 2.2u

SUBV

1

ATX_BSU

L

A

BV

T

006

C

6C

0

F3

F2

3

C

C

U_PG_C

CA

C

BSU_C

A

U

BS

S

B

U

_CCA

C

A

A
A

SH_BSU_

C

U_CCA
C
C

A

U_CC

A

SC_BS
KL

C_N

I_SH_

0ATA

D_BSU

ATAD

1

_

AT

2

D_

A

3

TAD_SH_BSU

A

D_

4AT

A

TAD_SH_BS

5A
6

TAD_SH_BSU_C

A

D_SH_BSU_C

7ATA

T

SU_CCA

XN_SH_B

PTS_SH_BSU_CC

D

R

_SH_B

I

S

306R

K15

5

C

06

06C

6

.0

u1

7.4

u

S_PIH

4

A

KCOLC

B

1

ATAD

0

1

A

A

1

D

TA

2

A

2ATAD

A

3

3ATAD

5A

4

D

ATA

6A

A

TA

5

D

6B

A

D

6AT

6

C

7

D

ATA

D

5

T

XN

D

6

PT

S

5E

R

ID

1

E

F

G

0

C

E

6

R

V1FE

NC1

NC2

LE

VCC

U

6

10

8

GND1

GND2

GND3

E4

D2

10

.

u1

u7

.4

V

01

F1

4C

T

E

TS

5B

1OI_C

CV

2

B

2OI_CCV

2

C

FERR

1C

M

D

1

D

D

P

E

TEA8051PSI

C5

2

L

T

F

UA

3

D

D

I

3B

C

2GF

4B

1GF

C

4

D

P

N_WS

4

F

SUB

V

3E

R

V3GE

3

5F

1LATX

6

F

2

X

LAT

Table 3-1-9. Schematic of USB Transceiver

LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.

- 30 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1.9 Slider ON/OFF Detection

There is a magnet to detect the slide module status, up or down.
If a magnet is close to the hall-effect switch U604, the voltage at Pin 1 of U604 goes to 0V. Otherwise

1.8V.
This SLIDE_DET signal is delivered to DB3200 ACC_GP_FLIPSENSE.

8V1_EDDV

4

U

6

0

025U

B

13

XVN

4

DV

D

C

N

6C

02

u

1.0

DI

LS

E

PGND

D

1

TUO

23

DNG

5

E

T

Figure 3-1-9. Slider On/Off Detector

_PG_CC

A

126

C

0

u1.

ES

NESPILF

TCE

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 31 -

LGE Internal Use Only