LG G4015 Service Manual
Service Manual
Model : G4015
Service Manual
G4015
P/N : MMBD0033301 Date : June, 2004 / Issue 1.0
- 1 -
1. INTRODUCTION
..................................
3
1.1 Purpose
...............................................
3
1.2 Regulatory Information
........................
3
1.3 Abbreviations
.......................................
5
2. PERFORMANCE
.................................
6
2.1 H/W Features
......................................
6
2.2 Technical Specification
........................
7
3. Technical brief
..................................
11
3.1 The Block Diagram of the Baseband
Part
....................................................
11
3.2 BaseBand Components
....................
12
3.3 Digital Baseband (DBB) Processor
...
13
3.4 Analog Main Processor (ABB)
...........
14
3.5 Memory
.............................................
15
3.6 Voltage Regulation (LDO)
.................
16
3.7 MIDI
...................................................
17
3.8 Charging
............................................
18
3.9 KEY Back-light Illumination
...............
18
3.10 SIM
....................................................
19
3.11 Keyboard connection
.........................
19
3.12 The Block Diagram of the RF Part
....
20
3.13 RF Part Components
.........................
20
3.14 Tx/Rx Part Description
......................
21
3.15 Receiver Part Description
..................
22
3.16 Transmitter Part Description
..............
27
4. Trouble Shooting
.............................
31
4.1 Power On Sequence
.........................
31
4.2 Charging Trouble
...............................
32
4.3 LCD Display Trouble
.........................
34
4.4 Speaker/Receiver Trouble
.................
36
4.5 Microphone Trouble
..........................
39
4.6 Vibrator Trouble
.................................
42
4.7 Keypad Backlight Trouble
.................
44
4.8 Folder ON/OFF Trouble
....................
46
4.9 SIM Detect Trouble
...........................
48
4.10 Earphone Trouble
..............................
50
4.11 RX Part Trouble Shooting
.................
53
4.12 TX Part Trouble Shooting
..................
59
5. DISASSEMBLY INSTRUCTION
....
62
6. DOWNLOAD AND
CALIBRATION
...................................
68
6.1 The Purpose of Downloading
Software
............................................
68
6.2 The Environment of Downloading
Software
............................................
68
6.3 The Procedure of Downloading
Software
............................................
70
7. CIRCUIT DIAGRAM
.........................
75
8. PCB LAYOUT
.....................................
80
9. ENGINEERING MODE
....................
83
9.1 Test Menu
.........................................
83
9.2 RF Test
..............................................
84
9.3 MF Mode
...........................................
84
9.4 Trace option
......................................
85
9.5 Call Timer
..........................................
85
9.6 Fact. Reset
........................................
85
9.7 S/W version
.......................................
85
10. STAND ALONE TEST
...................
86
10.1 What is Standalone Test?
.............
86
10.2 Standalone Test Equipment
Setup
............................................
87
10.3 Rx Standalone Test
......................
87
10.4 Tx Standalone Test
.......................
88
11. AUTO CALIBRATION
...................
89
11.1 What’s the Rx Calibration
.............
89
11.2 Calibration program
......................
90
11.3 Calibration Equipment Setup
........
91
12. EXPLODED VIEW &
REPLACEMENT PART LIST
......
97
12.2 Replacement Parts
<Mechanic component>
................
99
<Main component>...................... 101
12.3 Accessory
....................................
111
Table Of Contents
- 2 -
REVISED HISTORY
The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the
G4015.
DATE ISSUE CONTENTS OF CHANGES S/W VERSION
JUNE/2004 ISSUE1 Initial Release
- 3 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download
the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges you’re your
telecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System
users are responsible for programming and configuring the equipment to prevent unauthorized
use. LGE does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or
connected to it. LGE will not be responsible for any charges that result from such unauthorized
use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and
possibly causing harm or interruption in service to the telephone network, it should disconnect
telephone service until repair can be done. A telephone company may temporarily disconnect
service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure.
If these changes could reasonably be expected to affect the use of the G4015 or compatibility
with the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the G4015 must be performed only by the LGE or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Theref ore, note that unauthorized alternations or repair may affect the regulatory status
of the system and may void any remaining warranty.
E. Notice of Radiated Emissions
The G4015 complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
1. INTRODUCTION
1. INTRODUCTION
- 4 -
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look
slightly different.
G. Interference and Attenuation
An G4015 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems .
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
⍥
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
⍥
When repairs are made to a system board,they should spread the floor with anti-static mat
which is also grounded.
⍥
Use a suitable,grounded soldering iron.
⍥
Keep sensitive parts in these protective packages until these are used.
⍥
When returning system boards or parts like EEPROM to the factory,use the protective
package as described.
1. INTRODUCTION
- 5 -
1.3 Abbreviations
For the purposes of this manual,following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
DBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDO Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
- 6 -
2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Li-ion, 760 mAh
Standard Battery Size: 50 x 34 x 4.4mm
Weight: 23.4g
AVG TCVR Current GSM850: 250mA, PCS: 200mA
Standby Current < 4.0mA
Talk time 4hours (GSM TX Level 7)
Standby time 200 hours (Paging Period: 9, RSSI: -85dBm)
Charging time About 2 hours
RX Sensitivity GSM850 : -106dBm, PCS : -106dBm
TX output power
GSM850: 33dBm (Level 5)
PCS: 30dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Small only
Display 128 x 128 pixel 65K color
Soft icons
Key Pad
Status Indicator 0 ~ 9, #, *, Up/Down Navigation Key,
Side Key, Confirm Key, Clear Key,
Send Key, END/PWR Key
ANT External
EAR Phone Jack 3 pole earphone jack
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
C-Mike Yes
Speaker & Receiver Yes
Travel Adapter Yes
Options Ear-Mic, CLA, Data Kit
2. PERFORMANCE
- 7 -
2. PERFORMANCE
2.2 Technical Specification
Item Description Specification
GSM 850
TX: 824 + (n-127) x 0.2 MHz
1 Frequency Band
RX: 869 + (n-127) x 0.2 MHz (n=128~251)
PCS
TX: 1850 + (n-511) x 0.2 MHz
RX: 1930 + (n-511) x 0.2 MHz (n=512~810)
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM850
Level Power Toler. Level Power Toler.
5 33 dBm ᴦ2dB 13 17 dBm ᴦ3dB
6 31 dBm ᴦ3dB 14 15 dBm ᴦ3dB
7 29 dBm ᴦ3dB 15 13 dBm ᴦ3dB
8 27 dBm ᴦ3dB 16 11 dBm ᴦ5dB
9 25 dBm ᴦ3dB 17 9 dBm ᴦ5dB
10 23 dBm ᴦ3dB 18 7 dBm ᴦ5dB
11 21 dBm ᴦ3dB 19 5 dBm ᴦ5dB
12 19 dBm ᴦ3dB
4 Power Level DCS
Level Power Toler. Level Power Toler.
0 30 dBm ᴦ2dB 8 14 dBm ᴦ3dB
1 28 dBm ᴦ3dB 9 12 dBm ᴦ4dB
2 26 dBm ᴦ3dB 10 10 dBm ᴦ4dB
3 24 dBm ᴦ3dB 11 8 dBm ᴦ4dB
4 22 dBm ᴦ3dB 12 6 dBm ᴦ4dB
5 20 dBm ᴦ3dB 13 4 dBm ᴦ4dB
6 18 dBm ᴦ3dB 14 2 dBm ᴦ5dB
7 16 dBm ᴦ3dB 15 0 dBm ᴦ5dB
- 8 -
Item Description Specification
GSM850
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 –30
250 –33
400 –60
600~ <1,200 –60
1,200~ <1,800 –60
1,800~ <3,000 –63
3,000~ <6,000 –65
5 Output RF Spectrum 6,000 –71
(due to modulation)
PCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 –30
250 –33
400 –60
600~ <1,200 –60
1,200~ <1,800 –60
1,800~ <3,000 –65
3,000~ <6,000 –65
6,000 –73
GSM850
Offset from Carrier (kHz). Max. dBm
400 –19
600 –21
1,200 –21
6 Output RF Spectrum 1,800 –24
(due to switching
PCS
transient)
Offset from Carrier (kHz). Max. dBm
400 –22
600 –24
1,200 –24
1,800 –27
7 Spurious Emissions Conduction, Emission Status
2. PERFORMANCE
- 9 -
2. PERFORMANCE
Item Description Specification
GSM850
8Bit Error Rate
BER (Class II) < 2.439% @–102 dBm
DCS
BER (Class II) < 2.439% @–102 dBm
9
RX Level Report accuracy
ᴦ3 dB
10 SLR 8ᴦ3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 –12 –
200 0 –
300 0 –12
11 Sending Response 1,000 0 –6
2,000 4 –6
3,000 4 –6
3,400 4 –9
4,000 0 –
12 RLR 2ᴦ3 dB
13 STMR 13ᴦ5 dB
14 Stability Margin > 6 dB
Frequency (Hz) Max. (dB) Min. (dB)
100 –12 –
200 0 –
300 2 –7
1,000
❈
–5
15 Receiving Response 2,000 0 –5
3,000 2 –5
3,400 2 –10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
dB to ARL (dB) Level Ratio (dB)
–35 17.5
–30 22.5
16 Distortion
–20 30.7
–10 33.3
0 33.7
7 31.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18
<Change> System frequency
≤ 2.5 ppm
(26 MHz) tolerance
- 10 -
Item Description Specification
19
<Change> 32.768 KHz
≤ 30 ppm
tolerance
Full power
<240mA (GSM850); < 180mA (PCS)
20 Power consumption Standby
• Normal Mode ≤ 4.0mA(Mix. Power)
• Using Test mode on DSP Sleep function ≤ 6mA
21 Talk time
GSM850/Level 7 (Battery Capacity 740mA) : 230 Min
GSM850/Level 12 (Battery Capacity 740mA) : 380 Min
Under conditions, at least 200 hours:
1. Brand new and full 740mAh battery
22 Standby Time
2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 80 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Voltage
Fast Charge : < 500mA
Slow Charge : < 60mA
Antenna Bar Number Power
5 –85 dBm ~
4 –90 dBm ~ –86 dBm
25 Antenna Display 3 –95 dBm ~ –91 dBm
2 –100 dBm ~ –96 dBm
1 –105 dBm ~ –101 dBm
0~ –105 dBm
Battery Bar Number Voltage
0 3.65V~ 3.35V
26 Battery Indicator
1 3.71V ~ 3.66V
2 3.78V ~ 3.72V
3 3.91V ~ 3.79V
4 4.20V ~ 3.92V
27 Low Voltage Warning
3.5 ᴦ 0.03V (Call)
3.62 ᴦ 0.03V (Standby)
28
Forced shut down Voltage
3.35 ᴦ 0.03V
1 Li-ion Battery
29 Battery Type
Standard Voltage = 3.7V
Battery full charge voltage = 4.2V
Capacity : 760mAh
Switching-mode charger
30 Travel Charger Input : 100 ~ 240V, 50/60 Hz
Output : 5.2V, 800 mA
2. PERFORMANCE
- 11 -
3. Technical brief
3.1 The Block Diagram of the Baseband Part
Figure 3-1.
Speaker / Receiver
Vibrator
Backup Battery
LCD
LCD MODULEPBA
DBB
(Calypso)
ABB
(IOTA)
Memory
(AM50DL128CH)
MIDI
(YMU762)
MIC
I/O Connector
SIM
Battery
R
F
LCD
Connector
Ear_Mic
F
P
C
B
Charging
Block
TA
Analog
S/W
Ear
jack
: SIGNAL
: Current
Data Cable,…
3. Technical brief
3.2 BaseBand Components
(1) Component Side
Figure 3-2.
(2) Keypad Side
Figure 3-3.
- 12 -
3. Technical brief
U102
U101
U402
J401
CN401
U201
J201
CN301
U101 Digital Baseband Chipset (Calypso)
U102 Analog Baseband Chipset (IOTA)
X101 Crystal (32.768KHz Oscillator)
U201 Melody IC (40 Poly)
U202 Analog Switch (Dual)
U203 Analog Switch (Single)
U402 Memory (128M Flash x 64M SRAM)
J201 EAR Jack
J401 SIM Connector
CN301 LCD Connector
CN401 IO Connector
MIC201 Microphone
U202
SIDE KEY
X101
MIC201
U203
U303: Charge
Pump
U302: Hall
effect switch
Keypad LED
- 13 -
3. Technical brief
3.3 Digital Baseband (DBB) Processor
Figure 3-4. The Internal Architecture of the Calypso G2(HERCROM400G2)
- 14 -
3.4 Analog Main Processor (ABB)
Figure 3-5. TWL3014 Functional Block Diagram
• Applications include GSM 850, 900, DCS 1800, PCS 1900 Cellular Telephones
• Voice Coder/Decoder (CODEC)
• Baseband CODEC single and multislot with I/Q RF Interface
• Auxiliary RF Converters
3. Technical brief
- 15 -
3. Technical brief
• SIM Card Interface
• Li-Ion or Ni-MH Battery Charging Control
• Six Low-DropOut, Low-Noise, Linear Voltage Regulators
• Dedicated Low Quiescent Current Mode on Regulators
• Voltage Detectors (with Power-Off Delays)
• Four Channel Analog-to-Digital Converters (ADC)
• Dedicated very low quiescent current domain supply
3.5 Memory
Figure 3-6.
• Memory used G4015 is designed by AMD
• Mixed Multi-Chip Package containing a 64M pSRAM and 128M Flash Memory
• MCP(Multi-Chip Package) Features
- Power Supply Voltage of 2.7 to 3.3 V
- Operating Temperature of -40°… to 85°…
• pSRAM Features
- Organization : 4 M x 16 bits
- Power Dissipation : 50mA max.(Operating) , 100µA max.(Standby)
• Flash Memory Features
- Organization : 2 x 4M x 16 bits
- Power Consumption
2 mA active read current at 1 MHz
20 mA active read current at 5 MHz
200nA in standby or automatic sleep mode
3.6 Voltage Regulation (LDO)
Figure 3-7.
• VRDBB
- Provides the power to the DBB(Calypso) Core
- 1.5V / 120mA max.
• VRRAM
- Provides the power to the Analog S/W, IC, etc.external memory
- 2.8V / 50mA
• VRMEM
- Provides the power to the Flash Memory
- 2.8V / 60mA max.
- 16 -
3. Technical brief
- 17 -
3. Technical brief
• VRABB
- Provides the power to the ABB(IOTA) Core
- 2.8V / 50mA max.
• VRIO
- Provides the power to the Digital core and Ios, etc
- 2.8V / 100mA max.
• VRRTC
- Provides the power to the oscillator
- 1.5V / 30uA max.
• VRSIM
- Provides the power to the SIM card
- 2.85V / 10mA max.
3.7 MIDI
Figure 3-8.
• The ringing source of G4015 is the MIDI.
• The MIDI chip which is used in G4015 is YMU762 from YAMAHA.
• YMU762 generates 40-poly MIDI sound.
- 18 -
3.8 Charging
Figure 3-9.
3.9 KEY Back-light Illumination
A. KEYPAD Back-light Scheme.
• There are 10 Deep Blue LEDs in Main Board for Keypad Backlight.
• Keypad Back-light is driven by ‘LEDB’ line from IOTA .
Figure 3-10. Key backlight
3. Technical brief
4.2V ~ 3.92V 3.91V ~ 3.79V 3.78V ~ 3.72V 3.71V ~ 3.66V 3.65V ~ 3.35V
300
R308
300
R304
LD306
SP3
LD303
R307
300
300
R305
LD308
R537
300
300
R536
LD304
300
R302
R303
300
LD307
LD310
LD309
R306
300
LD302
LD305
LD301
300
R309
LEDB
• Charging method : CC-CV
• Charger detect voltage : 4.0V
• Charging time : about 2h
• Icon stop current : 100mA
• Charging current : 420mA
• CV voltage : 4.2V
• Cutoff current : 45mA
• Low battery alarm
- Idle : 3.62V
- Dedicated : 3.50V
• Switch-off voltage : 3.35V
• Charging temperature adc range
- ~ -5°C : Charging range
(3.6V ~ 3.8V)
- -5°C ~ 50°C : Charging range
(normal operation)
- 50°c : Charging range
(3.6V ~ 3.8V)
- 19 -
3. Technical brief
3.10 SIM
A. SIM Interface
The Sim Card digital interface in ABB insures the translation of logic levels between DBB and
Sim Card, for the transmission of 3 different signals:
• A clock derived from a clock elaborated in DBB, to the Sim-Card (DBBSCK -> SIM_CK)
• A reset signal from DBB to the Sim Card (DBBSRST -> SIM_RST),
• A serial data from DBB to the Sim Card (DBBSIO -> SIM_IO) and vice-versa.
The SIM card interface can be programmed to drive a 1.8V or 3V Sim Card.
Figure 3-11. SIM Card connection scheme
3.11 Keyboard connection
A. Keyboard Scheme
The keyboard is connected to the chip using:
• KBR (4:0) input pins for row lines
• KBC (4:0) output pins for column lines
Figure 3-12. Keyboard Scanning Scheme
- 20 -
3. Technical brief
3.12 The Block Diagram of the RF Part
Figure 3-13.
3.13 RF Part Components
Figure 3-14.
Baseband
Si4205
Antenna Switch
RF SAW
PAM
PGA100kHz
ADC
ADC
100kHz
Divider
Divider
DET
Divider
Channel Filter
PGA
DAC
DAC
RXIN
RXIP
RXQN
RXQP
TXIN
TXIP
TXQN
TXQP
AMP
AFC
26MHz
RF PLL
IF PLL
RF1 RF2 IF
Dual
AndGate
ANT_SW
ANTSW_TXTX
ANTSW_BAND
AMP
TXVCO
SW501
U504
FL501
U502
U501
X501
U505
FL503FL502
• SW501 : Mobile
Switch
• U504 : Dual And
Gate
• U502
- Si-4205
- RF Main Chip
• U501
- SKY77324
- Power Amp
Module
• X501
-VCTCXO
- 26MHz Clock
• U505 : 2.85V
Regulator
• FL501
- SHS-C090DR-A
- Antenna Switch
• FL502
- B9001
- GSM850 SAW
Filter
• FL503
- B7825
- PCS1900 SAW
Filter
- 21 -
3. Technical brief
3.14 Tx/Rx Part Description
A. Tx/Rx Part component Description
1. Regulator
• Regulator
- Produce 2.85V DC Power
- Support DC Power to every RF component except PAM
Figure 3-15.
2. VCTCXO
• VCTCXO
- Produce RF reference clock - 26MHz frequency
Figure 3-16.
2.85V Output
X501
26MHz frequency Output
- 22 -
3. RF Main Chip (Si4205)
• PDNB, S_EN, S_CLK, S_DATA
- From DBB Main Chip Set
- Contains information all about ARFCN, voice data, user information etc.
- RF Chips operate according to these signals
Figure 3-17.
3.15 Receiver Part Description
A. Rx Block Diagram
Figure 3-18.
3. Technical brief
U502
S_DATA
S_CLK
S_EN
PDNB
ADC
ADC
DAC
DAC
I
Q
PGA
PGA
RF1
MOBILE
SWITCH
KMS-507
PCS1900
B7825
RX SAW
B9001
869 ~ 894MHz
1930
~
1990MHz
GSM 850
Si4205
LNA
100MHz
100MHz
26MHz
AFC
100MHz
RF PLL
GSM850
RF1 : 1737.8 ~ 1787.8MHz
PCS1900
RF1 : 1929.9 ~ 1989.9MHz
ANTENNA SWITCH
SHS-C090DR-A
CHANNEL FILTER
BASE BAND
GSM850 : 869~894MHz
PCS1900 : 1930~1990MHz
RX
- 23 -
3. Technical brief
B. Rx Part component Description
1. Mobile Switch & Ant Switch
• Antenna Switch
- Select the Path – GSM / PCS Tx, GSM / PCS Rx
- From DBB, three control signals (ANT_SW, ANTSW_TXRX, ANTSW_BAND) are fed
into the Dual AND Gate
- Dual AND Gate Controls the Ant SW with VC1 & VC2
Figure 3-19.
• Antenna SW control Signals
- VC1, VC2 control Antenna SW
Figure 3-20.
GSM / PCS Rx Path
GSM Rx Path
PCS Rx Path
VC2
VC1
GSMTx PCSTx GSM/PCS Rx
VC1 Low High Low
VC2 High Low Low
• Control Signal Logic
- 24 -
2. Band Selection Filter
Figure 3-21.
• Band Selection Filter
- Cuts the out of band frequency
Figure 3-22.
- Insertion Loss
- For GSM : ~-2.5dB
- For DCS : ~-3dB
3. Technical brief
PCS BSF
GSM BSF
LNA
RF
BSF
f
For GSM : 869MHz 894MHz
For PCS : 1930MHz 1990MHz
- 25 -
3. Technical brief
3. RF Transceiver Chip (LNA Input)
Figure 3-23.
• LNA input port of RF Main Chip(Si4205)
- Balanced-type LNA Input
Figure 3-24.
Si-4205
ῡ
GSM LNA Input
ῢ
PCS LNA Input
RF
LNA
BSF
Matching
Circuit
Si4205
ῡῢ
- 26 -
4. RX Local signal (Si4205)
Figure 3-25.
• RF1 Frequency
- GSM850 : 1737.8 ~ 1787.8MHz
- PCS1900 : 1929.9 ~ 1989.9MHz
• GSM Rx Frequency
- GSM850 : 869 ~ 894MHz
- PCS1900 : 1930 ~ 1990MHz
• GSM Rx Freq. – (GSM850 RF1) / 2 = 0.1 MHz
• PCS Rx Freq. – PCS RF1 = 0.1 MHz
• Near zero IF (100kHz) system
5. Rx I/Q signal (Si4205)
Figure 3-26.
3. Technical brief
RF1
RF PLL
TXVCO
GSM850
RF1 :
1737.8~1787.8MHz
PCS1900
RF1 :
1929.9~1989.9MHz
U502
RXIN
RXIP
RXQN
RXQP
3.16 Transmitter Part Description
A. Tx Block Diagram
Figure 3-27.
B. Tx Part component Description
1. Tx I/Q signal from ABB signal
Figure 3-28.
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3. Technical brief
Antenna Switch
Baseband
PAM
RF2
IF
RF PLL IF PLL
26MHz
TxVco
DET
Dual
Andgate
GSM RF2 : 1272 ~ 1297MHz GSM IF : 896MHz
PCS RF2 : 1423 ~ 1483MHz PCS IF : 854MHz
GSM RX : 824 ~ 849MHz
PCS RX : 1850 ~ 1910MHz
GSM TxVCO : 1648 ~ 1698MHz
PCS TxVCO : 1850 ~ 1910MHz
U502
TXIP
TXIN
TXQP
TXQN
2. Tx Local and IF signal (Si4205 RF2 and IF)
Figure 3-29.
• RF2 Frequency : GSM : 1272 ~ 1297MHz
PCS : 1423 ~ 1483MHz
• IF Frequency : GSM : 896MHz
PCS : 854MHz
• GSM Tx Frequency = RF2 – (IF / 2)
PCS Tx Frequency = RF2 + (IF / 2)
3. PAM – input and output signals
Figure 3-30.
• Power Amp Module
- Amplifies Tx Signal from Si4205
• Tx Carrier Frequency
- GSM : 824 ~ 849MHz
- PCS : 1850 ~ 1910MHz
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IF PLL
AMP
RF2RF1
IF
+
DET
GSM850 : 448MHz
PCS1900 : 427MHz
TXVCO
RF PLL
PAM
U501
3. Technical brief
GSM IN
GSM OUT
PCS OUT
PCS IN
VBAT
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3. Technical brief
4. PAM – control signals
Figure 3-31.
• PA_ON
- From DBB Chip Set
- Enables Tx Path
• PA_Band
- From DBB Chip Set
- Select PAM operating band
- Low : GSM selected
- High : PCS selected
• APC
- From ABB Chip Set
- Controls Tx rising and falling shape
- APC voltage Controls Tx Output Power
PAM
U501
PA BAND
PA ON
APC
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