Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied to all of the LED LCD TV
with LD23E chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15
°C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (Especially where W/B scale is strong. Digital pattern
13ch and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. Automatic Adjustment
3.1. ADC Adjustment
3.1.1. Overview
ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
3.1.3. Adjustment
(1) Adjustment method
- Using RS- 232, ad just items in the other shown in
"3.1.3.3)"
(2) Adj. protocol
ProtocolCommandSet ACK
Enter adj. modeaa 00 00a 00 OK00x
Source change
Begin adj.ad 00 10
Return adj. result
Read adj. data
Conrm adj.ad 00 99
End adj.aa 00 90a 00 OK90x
xb 00 04
xb 00 06
(main)
ad 00 20
(sub )
ad 00 21
b 00 OK04x (Adjust 480i, 1080p Comp1 )
b 00 OK06x (Adjust 1920*1080 RGB)
OKx (Case of Success)
NGx (Case of Fail)
(main)
000000000000000000000000007c007b006dx
(Sub)
000000070000000000000000007c00830077x
NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
If the TV set is downloaded by OTA or service man, sometimes
model name or serial number is initialized.(Not always)
It is impossible to download by bar code scan, so It need
Manual download.
1) Press the "Instart" key of Adjustment remote control.
2) Go to the menu "7.Model Number D/L" like below photo.
3) Input the Factory model name(ex 47LM960V-ZB) or Serial
number like photo.
4) Check the model name Instart menu. → Factory name
displayed. (ex 47LM960V-ZB)
5) Check the Diagnost ics.(DTV country only) → Buyer
model displayed. (ex 47LM960V-ZB)
3.6. CI+ Key checking method
- Check the Section 4.2
Check whether the key was downloaded or not at ‘In Start’
menu. (Refer to below).
3.6.2. Check the method of CI+ key value(RS232)
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1CMD 2Data 0
AA00
2) Check the mothed of CI+ key by command
(RS232: ci 00 20)
CMD 1CMD 2Data 0
CI20
3) Result value
i 01 OK 1d1852d21c1ed5dcx
CI+ Key Value
3.7. WIFI MAC ADDRESS CHECK
(1) Using RS232 Command
H-freq(kHz)V-freq.(Hz)
Transmission[A][I][][Set ID][][20][Cr][O][K][X] or [NG]
(2) Check the menu on in-start
=> Check the Download to CI+ Key value in LGset.
3.6.1. Check the method of CI+ Key value
(1) Check the method on Instart menu
(2) Check the method of RS232C Command
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1CMD 2Data 0
* ADC adjustment is not needed because of OTP(Auto ADC
adjustment)
▪ Reference
- HDMI1 ~ HDMI4 / RGB
- In the data of EDID, bellows may be different by S/W or
Input mode.
4.1 EDID(The Extended Display Identification
Data)/DDC(Display Data Channel) download
4.1.1. Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity
of user input. It is a realization of "Plug and Play".
4.1.2. Equipment
- Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
- Adjustment remote control
4.1.3. Download method
(1) Press "ADJ" key on the Adjustment remote control then
select "10.EDID D/L", By pressing "Enter" key, enter EDID
D/L menu.
(2) Select "Start" button by pressing "Enter" key, HDMI1/
HDMI2/ HDMI3/ HDMI4/ RGB are writing and display OK
or NG.
(1) Objective: To reduce each Panel's W/B deviation
(2) How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one
of R/G/B is fixed at 192, and the other two is lowered to
find the desired value.
(3) Adjustment condition : normal temperature
1) Surrounding Temperature : 25 °C ± 5 °C
2) Warm-up time: About 5 Min
3) Surrounding Humidity : 20 % ~ 80 %
4.2.2. Equipment
(1) Color Analyzer: CA-210 (LED Module : CH 14)
(2) Adjustment Computer(During auto adj., RS-232C protocol
is needed)
(3) Adjustment Remote control
(4) Video Signal Generator MSPG-925F 720p/216-Gray
(Model: 217, Pattern: 78)
→ Only when internal pattern is not available
▪ Color Analyzer Matrix should be calibrated using CS-1000.
4.2.3. Equipment connection MAP
Co lor Anal yze r
Pro be
RS -232 C
Pattern Gen era to r
Sig nal Sou rce
* If TV internal pattern is used, not needed
RS- 232 C
Co mp ute r
RS- 232 C
EDID Block 1, Bytes 128-255 [80H-FFH]
0123456789A BC DEF
00 02 03 3A F1 4E 10 9F 04 13 05 14 03 02 12 20 21
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f → Gain adj. completed
*(wb 00 20(Start), wb 00 2f(end)) → Off-set adj.
wb 00 ff → End white balance auto-adj.
▪ Adj. Map
Cool
Medium
Warm
Adj. item
R Gainjg00C0
G Gainjh00C0
B Gainji00C0
R Cut
G Cut
B Cut
R Gainja00C0
G Gainjb00C0
B Gainjc00C0
R Cut
G Cut
B Cut
R Gainjd00C0
G Gainje00C0
B Gainjf00C0
R Cut
G Cut
Command
(lower caseASCII)
CMD1CMD2MINMAX
Data Range
(Hex.)
4.2.5. Adj. method
(1) Auto adj. method
1) Set TV in adj. mode using POWER ON key.
2) Zero calibrate probe then place it on the center of the
Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre
mode. (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need.
(2) Manual adjustment. method
1) Set TV in Adj. mode using POWER ON.
2) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the
surface.
3) Press ADJ key → EZ adjust using adj. R/C → 7. WhiteBalance then press the cursor to the right(key ►).
(When right key(►) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
5) Adjustment is performed in COOL, MEDIUM, WARM 3
modes of color temperature.
▪ If internal pattern is not available, use RF input. In EZ
Adj. menu 7.White Balance, you can select one of 2
Test-pattern: ON, OFF. Default is inner(ON). By selecting
OFF, you can adjust using RF signal in 216 Gray pattern.
Default
(Decimal)
▪ Adjustment condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
: Color Analyzer(CA-210) probe should be within 10 cm
and perpendicular of the module surface (80° ~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked
using no signal or Full-white pattern.
4.2.6. Reference (White balance Adj. coordinate and
color temperature)
▪ Luminance : 2066 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Cool0.2690.27313000 K0.0000
Medium0.2850.2939300 K0.0000
Warm0.3130.3296500 K0.0000
Coordinate
xy
Temp∆uv
▪ Standard color coordinate and temperature using CA-210(CH 18)
Mode
Cool0.269 ± 0.0020.273 ± 0.00213000 K0.0000
Medium0.285 ± 0.0020.293 ± 0.0029300 K0.0000
Warm0.313 ± 0.0020.329 ± 0.0026500K0.0000
Coordinate
xy
Temp∆uv
4.2.7. ALELF & EDGE LED White balance table
- EDGE LED module change color coordinate because of
aging time.
- Apply under the color coordinate table, for compensated
aging time.
Step 1) Turn on TV
Step 2) Select Network Connection option in Network Menu.
Step 3) Select Start Connection button in Network Connection.
Step 4) If the system finds any AP like blow PIC, it is working
well.
4.9. Inspection of light scattering
▪ Test Method
(1) Push “Power only” key.
(2) Push “HDMI” hot key.
(3) Inspect whether light scattering is occurred in internal
black pattern or not.
(4) Push “Power only” key.
4.10. Option selection per country
4.10.1. Overview
- Option selection is only done for models in Non-EU
4.10.2. Method
(1) Press ADJ key on the Adj. R/C, then select Country Group
Meun
(2) Depending on destination, select Country Group Code 04
or Country Group EU then on the lower Country option,
select US, CA, MX. Selection is done using +, - or ►◄
key.
4.8. LNB voltage and 22KHz tone check
(only for DVB-S/S2 model)
▪ Test method
(1) Set TV in Adj. mode using POWER ON.
(2) Connect cable between satellite ANT and test JIG.
(3) Press Yellow key(ETC+SWAP) in Adj Remote control to
make LNB on.
(4) Check LED light ‘ON’ at 18 V menu.
(5) Check LED light ‘ON’ at 22 KHz tone menu.
(6) Press Blue key(ETC+PIP INPUT) in Adj Remote control
to make LNB off.
(7) Check LED light ‘OFF’ at 18 V menu.
(8) Check LED light ‘OFF’ at 22 KHz tone menu.
▪ Test result
(1) After press LNB On key, ‘18 V LED’ and ‘22 KHz tone
LED’ should be ON.
(2) After press LNB OFF key, ‘18 V LED’ and ‘22 KHz tone
LED’ should be OFF.
Only for training and service purposes
4.11. MHL Test
(1) Turn on TV
(2) Select HDMI4 mode using input Menu.
(3) Set MHL Zig(M1S0D3617) using MHL input, output and
power cord.
(4) Connect HDMI cable between MHL Zig and HDMI4 port.
(5) Check LED light of Zig and Module of Set.
Result) If, The LED light is green and The Module shows
- Check that Power cord is fully inserted to the SET.
(If loose, re-insert)
(2) Perform GND & Internal Pressure auto-check
- Unit fully inserted Power cord, Antenna cable and A/V
arrive to the auto-check process.
- Connect D-terminal to AV JACK TESTER
- Auto CONTROLLER(GWS103-4) ON
- Perform GND TEST
- If NG, Buzzer will sound to inform the operator.
- If OK, changeover to I/P check automatically.
(Remove CORD, A/V form AV JACK BOX.)
- Perform I/P test
- If NG, Buzzer will sound to inform the operator.
- If OK, Good lamp will lit up and the stopper will allow the
pallet to move on to next process.
7.2. Checkpoint
▪ TEST voltage
- GND: 1.5 KV / min at 100 mA
- SIGNAL: 3 KV / min at 100 mA
▪ TEST time: 1 second
▪ TEST POINT
- GND TEST = POWER CORD GND & SIGNAL CABLE
METAL GND
- Internal Pressure TEST = POWER CORD GND & LIVE &
NEUTRAL
▪ LEAKAGE CURRENT: At 0.5 mArms
9. USB S/W Download(Service only)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting.(Download Version High &
Power only mode, Set is automatically Download)
(3) Show the message "Copying files from memory".
(4) Updating is starting.
(5) Updating Completed, The TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
8. Audio
No.ItemMin Typ Max UnitRemark
Audio practical
max Output, L/R
1.
(Distortion=10%
max Output)
Speaker (8Ω
2.
Impedance)
Measurement condition:
(1) RF input: Mono, 1 KHz sine wave signal, 100 % Modulation
(2) CVBS, Component: 1 KHz sine wave signal 0.5 Vrms
(3) RGB PC: 1 KHz sine wave signal 0.7 Vrms
Only for training and service purposes
9.0 10.0 12.0W
8.58.99.8Vrms
10.0 15.0W
Measurement condition
Auto Volume :Off
Audio EQ : Off
Clear Voice : Off
Virtual Surround:Off
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
PLL SET[1:0] ==> Internal Pull-UP. N.C is high
00 : CPU clock(1056Mhz), Main0,1/2 DDR (792/792 Mhz)
01 : CPU clock(792Mhz), Main0,1/2 DDR (672/792 Mhz)
10 : CPU clock(1152Mhz), Main0,1/2 DDR (792/672 Mhz)
11 : CPU clock(984Mhz), Main0,1/2 DDR (792/792 Mhz)
BOOT MODE
"11" or "01" : NOR
"10" : eMMC
"00" : NAND
OPT
R102 22
R103 22
OPT
PLLSET1
PLLSET0
R112
XIN_MAIN
1M
XO_MAIN
JTAG I/F FOR MAIN
+3.3V_NORMAL
+3.3V_NORMAL
4.7K
R187
R185
OPT
BOOT_MODE1
+3.3V_NORMAL
R188
OPT
R186
4.7K
4.7K
4.7K
BOOT_MODE1
BOOT_MODE0
TRST_N0
TDI0
TDO0
TMS0
TCK0
SOC_RESET
OPT
OPT
R13110K
R13210K
OPT
OPT
R13310K
R13410K
BOOT_MODE0
+3.3V_NORMAL
HW_OPT_0
HW_OPT_1
HW_OPT_2
HW_OPT_3
HW_OPT_4
HW_OPT_5
HW_OPT_6
HW_OPT_7
HW_OPT_8
HW_OPT_9
HW_OPT_10
HP_AMP_MUTE
BackEnd 1
BackEnd 2
Pannel Resol
OPTIC I/F
3D Depth IC
DDR Size
CP BOX
FrontEnd 1
FrontEnd 2
OPT
22
R117
10K
URSA5
R110
FRC_EXTERNAL
R100 10K
10K
FRC3
FRC_INTERNAL
R107 10K
R111
FHD
R124 10K
UD
R125 10K
OPTIC
R138 10K
NON_OPTIC
R139 10K
OPT
3D_DEPTH
R140 10K
R145 10K
1GByte
R141 10K
R146 10K
NON_3D DEPTH
CP_BOX
R152 10K
R147 10K
DVB_T2_TUNER
NON_CP_BOX
R153 10K
R148 10K
NON_DVB_T2_TUNER
DVB_S_TUNER
R156 10K
R154 10K
DVB_C2_TUNER
R158 10K
R155 10K
NON_DVB_S_TUNER
NON_DVB_C2_TUNER
UD_FRC
R121 10K
NON_UD_FRC
R126 10K
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
MODEL_OPT_5
MODEL_OPT_6
MODEL_OPT_7
MODEL_OPT_8
MODEL_OPT_9
MODEL_OPT_10
MODEL OPTION 8 is just for CP Box
It should not be appiled at MP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C2302
4.7uF
16V
RT/CLK
GND_1
GND_2
PVIN_1
PVIN_2
VIN
VSENSE
IC2305
EAN62348501
1
15
2
THERMAL
3
4
5
6
7
[EP]GND
PWRGD
14
C2349
BOOT
13
0.1uF
16V
PH_2
12
PH_1
11
EN
10
SS/TR
9
COMP
8
1.3K
R2307
C2348
4700pF 50V
47pF 50V
22000pF 50V
C2373
R2381 0
Max 5926 mA
L2317
1uH
R2357 1K
C2374
1/16W
5%
Switching freq: 400 ~ 580 Khz
+0.9V_VDD
C2363
C2350
22uF
22uF
10V
10V
POWER_ON/OFF2_3
OPT
C2370
10uF
10V
Vout=0.8*(1+R1/R2)
4
+3.5V_ST
DDR MAIN 1.5V
L2308
C2320
10uF
10V
VIN_1
VIN_2
GND_1
GND_2
EP[GND]
1
2
3
4
10K
R2339
C2325
0.1uF
THERMAL
17
IC2302
TPS54319TRE
3A
7
5
6
COMP
AGND
VSENSE
3A
16V
BOOT14PWRGD15EN16VIN_3
13
12
11
10
9
8
RT/CLK
1/16W 5%
$ 0.145
PH_3
PH_2
PH_1
SS/TR
R2340
15K
C2327
0.1uF
16V
R2342
C2329
0.01uF
50V
330K1/16W5%
C2330
4700pF
50V
NR8040T3R6N
POWER_ON/OFF2_3
L2312
3.6uH
C2333
22uF
10V
C2337
22uF
10V
1074 mA
+1.5V_DDR
C2341
0.1uF
16V
C2338
100pF
50V
R2349
R1
47K 1%
R2
R2350
56K
1/16W
1%
C2375
180pF
50V
R2378-*1
8.2K
1/16W
R2379-*1
15K
+0.9V_VDD
R2378
6.8K
R2379
12K
URSA5
1%
URSA5
1/16W
1%
Vout=0.6*(1+R1/R2)
1/16W
1/16W
+12V
R2377
100K
C2347
10uF
16V
1/16W
5%
L2315
R1
1%
FRC3
R2
1%
FRC3
Vout=0.827*(1+R1/R2)=1.521V
LG1152
POWER
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