LG 55LW540S Schematic

LED TV
SERVICE MANUAL
CHASSIS : LA6ES
MODEL : 55LW540S 55LW540S-UA
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL69569607 (1605-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
TROUBLE SHOOTING GUIDE ............................................................... 15
BLOCK DIAGRAM .................................................................................. 23
EXPLODED VIEW .................................................................................. 24
DISASSEMBLY ....................................................................................... 25
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo­sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam­age caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the compo­nent lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as pos­sible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec­tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con­nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This spec sheet is applied LED TV with LA6ES chassis
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
(1) Performance: LGE TV test method followed (2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC specification
4. General Specification
No Item Specication Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel 1) VHF : 02~13
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 60/65 inch Wide (1920 × 1080) FHD + 120Hz All models without HD models
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module LC320DXE-FJM1
9. Operating Environment 1) Temp : 0 ~ 40 deg
10. Storage Environment 1) Temp : -20 ~ 60 deg
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
42/43/49/55 inch Wide (1920 × 1080) FHD + 60Hz All models without HD models
28/32 inch Wide (1366 × 768) HD + 60Hz
79 inch Wide(3840 × 2160) UHD +240Hz
65 inch Wide(3840 × 2160) UHD +120Hz
43/49/55 inch Wide(3840 × 2160) UHD +60Hz
LGD 32LW340C/H-UA
LC430DUE-FJM1 LGD 43LW340C/H-UA, 43LW540S-UA
LC490DUE-FJM1 LGD 49LW340C/H-UA, 49LW540S-UA
LC550EUE-FJM1 LGD 55LW340C/H-UA, 55LW540S-UA
HC320DXN-SLVS5 LGD 32LW300C-UA
2) Humidity : ~ 80 %
2) Humidity : ~ 85 %
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Supported video resolutions
5.1. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed DDC
1 640*350 31.46 70.09 25.17 EGA X
2 720*400 31.46 70.08 28.32 DOS O
3 640*480 31.46 59.94 25.17 VESA(VGA) O
4 800*600 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 54.34 60.05 81.62 VESA O
7 1360*768 47.71 60.01 85.50 VESA (WXGA) O
8 1280*1024 63.98 60.02 108.0 VESA (SXGA) O
9 1920*1080 67.50 60.00 148.5 HDTV 1080P O
5.2. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 720*480 15.73 60.00 13.513 SDTV ,DVD 480I
2 720*480 15.73 59.94 13.500 SDTV ,DVD 480I
3 720*480 31.50 60.00 27.027 SDTV 480P
4 720*480 31.47 59.94 27.000 SDTV 480P
5 1280*720 45.00 60.00 74.250 HDTV 720P
6 1280*720 44.96 59.94 74.176 HDTV 720P
7 1920*1080 33.75 60.00 74.250 HDTV 1080I
8 1920*1080 33.72 59.94 74.176 HDTV 1080I
9 1920*1080 67.50 60.00 148.500 HDTV 1080P
10 1920*1080 67.432 59.94 148.352 HDTV 1080P
11 1920*1080 27.00 24.00 74.250 HDTV 1080P
12 1920*1080 26.97 23.976 74.176 HDTV 1080P
13 1920*1080 33.75 30.00 74.250 HDTV 1080P
14 1920*1080 33.71 29.97 74.176 HDTV 1080P
Only for training and service purposes
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LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5.3. HDMI Input 1 (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
PC (DVI) DDC
1 640*350 31.46 70.09 25.17 EGA X
2 720*400 31.46 70.08 28.32 DOS O
3 640*480 31.46 59.94 25.17 VESA(VGA) O
4 800*600 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 54.34 60.05 81.62 VESA O
7 1360*768 47.71 60.01 85.50 VESA (WXGA) O
8 1280*1024 63.98 60.02 108.0 VESA (SXGA) O
9 1920*1080 67.50 60.00 148.5 HDTV 1080P O
10 3840*2160 54 24.00 297.00 UDTV 2160P O Only UHD Model
11 3840*2160 56.25 25.00 297.00 UDTV 2160P O Only UHD Model
12 3840*2160 67.5 30.00 297.00 UDTV 2160P O Only UHD Model
13 4096*2160 53.95 23.97 296.703 UDTV 2160P O Only UHD Model
14 4096*2160 54.00 24.00 297.00 UDTV 2160P O Only UHD Model
DTV
1 640*480 31.46 59.94 27.00 SDTV 480P
2 640*480 31.50 60.00 27.027 SDTV 480P
3 720*480 31.50 60.00 27.027 SDTV 480P
4 720*480 31.47 59.94 27.00 SDTV 480P
5 1280*720 45.00 60.00 74.25 HDTV 720P
6 1280*720 44.96 59.94 74.176 HDTV 720P
7 1920*1080 33.75 60.00 74.25 HDTV 1080I
8 1920*1080 33.72 59.94 74.176 HDTV 1080I
9 1920*1080 67.50 60.00 148.50 HDTV 1080P
10 1920*1080 67.43 59.94 148.352 HDTV 1080P
11 1920*1080 27.00 24.00 74.25 HDTV 1080P
12 1920*1080 26.97 23.97 74.176 HDTV 1080P
13 1920*1080 33.75 30.00 74.25 HDTV 1080P
14 1920*1080 33.71 29.97 74.176 HDTV 1080P
15 3840*2160 53.95 23.98 297.00 UDTV 2160P UHD only
16 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only
17 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only
18 3840*2160 61.43 29.97 297.00 UDTV 2160P UHD only
19 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only
20 3840*2160 135.00 59.94 593.41 UDTV 2160P UHD only
21 3840*2160 135.00 60.00 594.00 UDTV 2160P UHD only
22 4096*2160 53.95 23.98 297.00 UDTV 2160P UHD only
23 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only
24 4096*2160 56.25 25.00 297.00 UDTV 2160P UHD only
25 4096*2160 61.43 29.97 297.00 UDTV 2160P UHD only
26 4096*2160 67.50 30.00 297.00 UDTV 2160P UHD only
27 4096*2160 135.00 59.94 593.41 UDTV 2160P UHD only
28 4096*2160 135.00 60.00 594.00 UDTV 2160P UHD only
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA6ES Chassis applied LED TV all models manufactured in TV factory.
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if
there is no specific designation (4) The input voltage of the receiver must keep 100~240V,
50/60Hz (5) At first Worker must turn on the SET by using Power Only
key. (6) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15
ºC
In case of keeping module is in the circumstance of 0°C, it
should be placed in the circumstance of above 15°C for 2
hours In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment : ADC adjustment is OTP (Auto ADC) (2) EDID download : HDMI
■ Above adjustment items can be also performed in Final
Assembly if needed.
Both Board-level and Final assembly adjustment items can
be check using In-Start Menu (1.Adjust Check).
Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value
4. MAIN PCBA Adjustments
4.1. ADC Adjustment
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB deviationI
4.1.2. Equipment & Condition
(1) Protocol: RS-232C (2) Inner Pattern
- Resolution : 1024*768(RGB)
- Pattern : Horizontal 100% Color Bar Pattern
- Pattern level : 0.7±0.1 Vp-p
4.1.3. Adjustment
4.1.3.1. Adjustment method
- Connect to Jig by using RS-232(USB), adjust RGB
* Manual adj (If needed in Final Assembly)
- Required equipment : Adjustment R/C
- Enter Service Mode by pushing “ADJ” key,
- Start ‘OTP’ ADC Type by pushing ‘►’ key at [7. ADC
Calibration]
4.1.3.2. Adj. protocol (only Internal patten)
Protocol CMD 1 CMD 2 Data 1 Data 2 Remark
Enter adj mode
Start ADC adj
4.1.3.3. ADC RGB (1) Press the In-start Key on the ADJ remote after at least 1
min of signal reception. Then, select ADC Calibration. And Press OK Button on the menu “Start”. The adjustment will start automatically.
(2) If ADC RGB is successful, “ADC RGB Success” is
displayed and ADC RGB is completed. If ADC calibration is failure, “ADC RGB Fail” is displayed.
(3) If ADC calibration is failure, after rechecking ADC pattern
or condition, retry calibration
a a 00 00 When transfer the
‘Mode In’,Carry the command.
a d 00 10 Automatically
adjustment (Use internal pattern)
3.2. Final assembly adjustment
(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test
3.3. Appendix
(1) Shipment conditions (2) Tool option menu (3) USB Download (S/W Update, Option and Service only) (4) Preset CH Information
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
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