CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This specification sheet is applied to all of the LED TV with
UD65S chassis.
2. Designation
(1) Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 °C ± 5 °C of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-240
V~, 50/60 Hz.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment when module is in the circumstance of over
15.
In case of keeping module is in the circumstance of 0 °C, it
should be placed in the circumstance of above 15 °C for 2
hours.
In case of keeping module is in the circumstance of below
-20 °C, it should be placed in the circumstance of above 15
°C for 3 hours.
[Caution]
When still image is displayed for a period of 20 minutes or
longer (Especially where W/B scale is strong. Digital pattern
13ch and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3.2. LAN Inspection
3.2.1. Equipment & Condition
▪ Each other connection to LAN Port of IP Hub and Jig
3.2.2. LAN inspection solution
▪ LAN Port connection with PCB
▪ Network setting at MENU Mode of TV
▪ setting automatic IP
▪ Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC
Address.
3.2.3. WIDEVINE key Inspection
- Confirm key input data at the "IN START" MENU Mode.
▪ Check the test process
: DETECT → MAC → ESN → Widevine → CI → HDCP20
▪ Play: Press Enter key
▪ Result: Ready, Test, OK or NG
▪ Printer Out (MAC Address Label)
Check whether the key was downloaded or not at ‘In Start’
menu. (Refer to below).
3.3.1. Equipment setting
(1) Play the LAN Port Test PROGRAM.
(2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
3.3.2. LAN PORT inspection(PING TEST)
(1) Play the LAN Port Test Program.
(2) Connect each other LAN Port Jack.
(3) Play Test (F9) button and confirm OK Message.
(4) Remove LAN CABLE.
3.4. Model name & Serial number Download
3.4.1. Model name & Serial number D/L
▪ Press "P-ONLY" key of service remote control.
(Baud rate : 115200 bps)
▪ Connect RS-232C Signal to USB Cable to USB.
▪ Write Serial number by use USB port.
▪ Must check the serial number at Instart menu.
3.4.2. Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded by OTA or service man, sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan,
so It need Manual download.
1) Press the "Instart" key of Adjustment remote control.
2) Go to the menu "7.Model Number D/L" like below photo.
3) Input the Factory model name(ex 65UG870V-ZA) or
Serial number like photo.
=> Check the Download to CI+ Key value in LGset.
3.5.1. Check the method of CI+ Key value
(1) Check the method on Instart menu
(2) Check the method of RS232C Command
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1CMD 2Data 0
A00
2) Check the key download for transmitted command
(RS232: ci 00 10)
CMD 1CMD 2Data 0
CI10
3) Result value
- Normally status for download : OKx
- Abnormally status for download : NGx
3.5.2. Check the method of CI+ key value(RS232)
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1CMD 2Data 0
AA00
2) Check the methed of CI+ key by command
(RS232: ci 00 20)
CMD 1CMD 2Data 0
CI20
3) Result value
i 01 OK 1d1852d21c1ed5dcx
CI+ Key Value
3.6. WIFI MAC ADDRESS CHECK
(1) Using RS232 Command
H-freq(kHz)V-freq.(Hz)
Transmission[A][I][][Set ID][][20][Cr][O][K][X] or [NG]
(2) Check the menu on in-start
4) Check the model name Instart menu. → Factory name
displayed. (ex 65UG870V-ZA)
5) Check the Diagnostics.(DTV country only) → Buyer
* ADC adjustment is not needed because of OTP(Auto ADC
adjustment)
4.1. EDID(The Extended Display Identification
Data)/DDC(Display Data Channel) download
4.1.1. Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity
of user input. It is a realization of "Plug and Play".
4.1.2. Equipment
- Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
- Adjustment remote control
4.1.3. Download method
(1) Press "ADJ" key on the Adjustment remote control, then
select "12.EDID D/L", By pressing "Enter" key, enter EDID
D/L menu.
For HDMI EDID
DVI-D to HDMI or HDMI to HDMI
(2) Select "Start" button by pressing "Enter" key, HDMI1/
HDMI2/ HDMI3/ HDMI4 are writing and display OK or NG.
4.1.4. EDID DATA
▪ Reference
- HDMI1 ~ HDMI3
- In the data of EDID, bellows may be different by Input mode.
2) Zero calibrate probe then place it on the center of the
Display.
3) Connect Cable.(RS-232C to USB)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status pre
mode.(Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
▪ W/B Adj. must begin as start command “wb 00 00”, and
finish as end command “wb 00 ff”, and Adj. offset if need.
(2) Manual adjustment method
1) Set TV in Adj. mode using POWER ON.
2) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the surface.
3) Press ADJ key → EZ adjust using adj. R/C → 7. WhiteBalance then press the cursor to the right(key ►).
(When right key(►) is pressed 216 Gray internal pattern
will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
5) Adjustment is performed in COOL, MEDIUM, WARM 3
modes of color temperature.
** G-fix adjustment
Adjust modes (Cool), Fix the G gain to 172 (default data)
and change the others (G/B Gain).
Adjust two modes(Medium / Warm), Fix the one of R/G/B
gain to 192 (default data) and decrease the others.
If internal pattern is not available, use RF input. In EZ Adj.
menu 7.White Balance, you can select one of 2 Testpattern: ON, OFF. Default is inner(ON). By selecting OFF,
you can adjust using RF signal in 216 Gray pattern.
▪ Adjustment condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- PDP: Color Analyzer (CA-100, CA-100+, CA210) probe
should be firmly attached to the Module
- LCD: Color Analyzer (CA-210) probe should be within
10cm and perpendicular of the module surface
(80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using
no signal or Full-white pattern.
4.2.6. Reference(White balance adjusmtment coordinate
and color temperature)
▪ Luminance : 206 Gray
▪ Standard color coordinate and temperature using CS-1000
(over 26 inch)
Mode
Coordinate
xy
Temp∆uv
Cool0.2710.27013000K0.0000
Medium0.2860.2899300K0.0000
Warm0.3130.3296500K0.0000
▪
Standard color coordinate and temperature using CA-210(CH 14)
Mode
Coordinate
xy
Temp∆uv
Cool0.271±0.0020.270±0.00213000K0.0000
Medium0.286±0.0020.289±0.0029300K0.0000
Warm0.313±0.0020.329±0.0026500K0.0000
4.2.7. EDGE & IOL LED White balance table
▪ Apply under the color coordinate table, for compensated
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is
Lower, it didn’t work.
But your downloaded version is Higher, USB data is
automatically detecting (Download Version High & Power
only mode, Set is automatically Download)
(3) Show the message “Copying files from memory”.
(4) Updating is starting.
(5) Updating completed, the TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.