LG 55EG9100 Schematic

Internal Use Only

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OLED TV

SERVICE MANUAL

CHASSIS : EA51E

MODEL : 55EG9100 55EG9100-UB

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL69311201 (1507-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS ................................................................... 4

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................. 11

BLOCK DIAGRAM ................................................................................. 20

EXPLODED VIEW .................................................................................. 29

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLE SHOOTING GUIDE ................................................. APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

Always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to the LED TV used EA51E chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1 Receiving System ATSC / NTSC-M / 64 QAM / 256 QAM North America

1) VHF : 02~13

2) UHF : 14~69

2 Available Channel

3 Input Voltage North America AC 100 ~ 240V@ 50/60Hz AC 120V, 50/60Hz on the label (USA)

4 Market North America

3) DTV : 02-69

4) CATV : 01~135

5) CADTV : 01~135

5 Screen Size 55 inch Wide(1920 × 1080)

Aspect Ratio 16:9

7 Tuning System FS

8 Module LC550LUD-LGPD LGD 55EG9100-UA

9 Operating Environment

10 Storage Environment

1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

1) Temp. : -20 ~ 60 deg

2) Humidity : ~ 85%

- 6 -

Only for training and service purposes

5. Video resolutions

5.1. Component 2D Input (Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

720*480 15.73 60 13.5135 SDTV ,DVD 480I

720*480 15.73 59.94 13.5 SDTV ,DVD 480I

3 720*480 31.50 60 27.027 SDTV 480P

4 720*480 31.47 59.94 27.0 SDTV 480P

5 1280*720 45.00 60.00 74.25 HDTV 720P

6 1280*720 44.96 59.94 74.176 HDTV 720P

7 1920*1080 33.75 60.00 74.25 HDTV 1080I

8 1920*1080 33.72 59.94 74.176 HDTV 1080I

9 1920*1080 67.50 60.00 148.50 HDTV 1080P

10 1920*1080 67.432 59.94 148.352 HDTV 1080P

5.2. Component 3D Input (Y, CB/PB, CR/PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1280*720 45.00 60.00 74.25 2D to 3D,Side by Side, Top and Bottom HDTV 720P

1280*720 44.96 59.94 74.176 2D to 3D,Side by Side, Top and Bottom HDTV 720P

3 1920*1080 33.75 60.00 74.25 2D to 3D,Side by Side, Top and Bottom HDTV 1080I

4 1920*1080 33.72 59.94 74.176 2D to 3D,Side by Side, Top and Bottom HDTV 1080I

5 1920*1080 67.5 60 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

6 1920*1080 67.432 59.94 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

7 1920*1080 27 24 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

8 1920*1080 28.12 25 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

9 1920*1080 26.97 23.976 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

10 1920*1080 33.75 30 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

11 1920*1080 33.71 29.97 2D to 3D,Side by Side, Top and Bottom HDTV 1080p

Only for training and service purposes

- 7 -

5.3. HDMI Input(PC/DTV)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

PC DDC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 80.002 VESA O

7 1360*768 47.712 60.015 85.50 VESA (WXGA) X

8 1280*1024 63.981 60.020 108.00 VESA (SXGA) O

9 1920*1080 67.5 60 148.5 HDTV 1080P O

DTV

1 640*480 31.469 59.94 25.175 SDTV 480P

2 640*480 31.5 60 25.200 SDTV 480P

3 720*480 31.50 60 27.027 SDTV 480P

4 720*480 31.47 59.94 27.00 SDTV 480P

5 1280*720 45.00 60.00 74.25 HDTV 720P

6 1280*720 44.96 59.94 74.176 HDTV 720P

7 1920*1080 33.75 60.00 74.25 HDTV 1080I

8 1920*1080 33.72 59.94 74.176 HDTV 1080I

9 1920*1080 67.50 60.00 148.50 HDTV 1080P

10 1920*1080 67.432 59.94 148.352 HDTV 1080P

11 1920*1080 27.00 24.00 74.25 HDTV 1080P

12 1920*1080 26.97 23.976 74.176 HDTV 1080P

13 1920*1080 33.75 30.000 74.25 HDTV 1080P

14 1920*1080 33.71 29.97 74.176 HDTV 1080P

5.4. 3D HDMI Input(1.4b)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

720*480p 62.938/63 59.94 / 60 54.00 F/P,L/A

1280*720p 89.91/90.00 59.94 / 60 148.5 F/P, L/A

1920*1080i 67.432 / 67.5 59.94 / 60 148.35/148.5 F/P, F/A

1920*1080p 26.97 / 27 23.97 / 24 74.175/74.25 S/S, T&B, S/S Full

31.469/31.5 27.00 T/B,S/S,S/S Full

44.96 / 45 74.17/74.25 S/S, T&B, S/S Full

33.72/33.75 74.25 S/S, T&B, S/S Full

28.125 25 148.5

33.716/33.75 29.976/30 74.18/74.25

43.94/54 23.97/24 148.35/148.5 F/P, L/A

67.432/67.5 29.976/30 148.35/148.5

67.432/67.5 59.94/60 148.35/148.5 T/B,S/S

Only for training and service purposes

- 8 -

5.5. 3D HDMI-PC Input

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1024*768 48.36 60.00 65.00 2D to 3D, S/S, T&B

1360*768 47.71 60.00 85.50

1920*1080 67.50 60.00 148.50 2D to 3D, S/S, T&B, C/B, R/I, C/I

(60Hz : F/S )

6. USB/DLNA Input

6.1. 3D Auto detection

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode Proposed

1 1920*1080 33.75 30.000 74.25 Side-by-side ,

Top-and-Bottom

Checkerboard,

Row Interleaving,

Column Interleaving,

Frame Sequential

(Photo Side-by-side ,

Top-and-Bottom)

6.2. Manual(Movie)

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode

1 Under 704*480 - - - 2D to 3D

2 Over 704*480i - - - 2D to 3D, Side by Side(Half), Top & Bottom

3 Over 704*480p - 50/60 - 2D to 3D, Side by Side(Half), Top & Bottom,

Checker Board, Row Interleaving, Column Interleaving, Frame Sequential

4 Over 704*480p - others - 2D to 3D, Side by Side(Half), Top & Bottom,

Checker Board, Row Interleaving, Column Interleaving

HDTV 1080P

6.2. Manual(Movie)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode

1 Under 320x240 - - - 2D to 3D

2 Over 320x240 - - - 2D to 3D, Side by Side(Half), Top & Bottom

- 9 -

Only for training and service purposes

7. Miracast/Widi Input

7.1. 3D Manual

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) 3D input proposed mode

1 1024*768p - 30/60 - 2D to 3D,Side-by-side, Top-and-Bottom

2 1280*720p - -

3 1920*1080p - -

4 Others - - - 2D to 3D

8. RF 3D Input(DTV)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 45.000 60 74.25 HDTV 720P 2D to 3D, Side by Side, Top & Bottom

2 1920*1080 33.75 60 74.25 HDTV 1080I 2D to 3D, Side by Side, Top & Bottom

9. 2D to 3D Conversion

: All Input

No INPUT Freq Resolution

1 Digital TV / Analog TV 2D Support freq 2D Support resolution

2 HDMI 2D Support freq 2D Support resolution

3 Component 2D Support freq 2D Support resolution

4 Composite 2D Support freq 2D Support resolution

5 USB 2D Support freq 2D Support resolution

* Remark: 3D Input mode

No. Side by Side Top & Bottom Checkerboard Frame Packing Line

Interleaving

Column

Interleaving

Column

Interleaving

Only for training and service purposes

- 10 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with EA51E chassis.

2. Specification

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 ±5 ºC of temperature and 65±10% of relative humidity if

there is no specific designation (4) The input voltage of the receiver must keep 100~240V,

50/60Hz (5) At first Worker must turn on the SET by using Power Only

key. (6) The receiver must be operated for about 5 minutes prior to

the adjustment when module is in the circumstance of over

ºC

In case of keeping module is in the circumstance of 0°C, it

should be placed in the circumstance of above 15°C for 2

hours In case of keeping module is in the circumstance of below

-20°C, it should be placed in the circumstance of above

15°C for 3 hours.

※ Caution When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area

4. MAIN PCBA Adjustments

4.1. ADC Calibration

- An ADC calibration is not necessary because MAIN SoC (LGExxxx) is already calibrated from IC Maker

- If it needs to adjust manually, refer to appendix.

4.2. MAC Address, ESN Key and Widevine Key, DTCP Key, HDCP1.4, HDCP2.0 download.

4.2.1. Equipment & Condition

(1) Play file: keydownload.exe

4.2.2. Communication Port connection

(1) Key Write: Com 1,2,3,4 and 115200 (Baudrate) (2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

4.2.3. Download process

(1) Select the download items. (2) Mode check: Online Only (3) Check the test process

- US, Canada models: DETECT -> MAC_WRITE -> WIDEVINE_WRITE

- Mexico models: DETECT -> MAC_WRITE -> WIDEVINE_WRITE

(4) Play: START (5) Check of result: Ready, Test, OK or NG

4.2.4. Communication Port connection

(1) Connect : PCBA Jig -> RS-232C Port == PC -> RS-232C

Port

3. Adjustment items

3.1. Main PCBA Adjustments

(1) ADC adjustment: Component 480i, 1080p (2) EDID downloads for HDMI

* Remark

- Above adjustment items can be also performed in Final Assembly if needed. Adjustment items in both PCBA and final assembly stages can be checked by using the INSTART Menu -> 1.ADJUST CHECK.

3.2. Final assembly adjustment

(1) White Balance adjustment (2) RS-232C functionality check (3) Factory Option setting per destination (4) Shipment mode setting (In-Stop) (5) GND and HI-POT test

3.3. Appendix

(1) Tool option menu, USB Download (S/W Update, Option

and Service only) (2) Manual adjustment for ADC calibration and White balance. (3) Shipment conditions, Channel pre-set

4.2.5. Download

(1) US, Canada models (15Y LCD TV + MAC + Widevine +

ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)

Only for training and service purposes

- 11 -

(2) Mexico, Guatemala models (145 LCD TV + MAC +

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Widevine + ESN Key + HDCP1.4 and HDCP2.0)

4.2.6. Inspection

- In INSTART menu, check these keys.

4.3. LAN PORT INSPECTION(PING TEST)

4.3.1. Equipment setting

(1) Play the LAN Port Test PROGRAM. (2) Input IP set up for an inspection to Test Program.

* IP Number : 12.12.2.2 Connect SET -> LAN port == PC -> LAN Port

SET PC

4.3.2. LAN PORT inspection (PING TEST)

(1) Play the LAN Port Test Program.(Fig.4-3-2-1) (2) Connect each other LAN Port Jack. (3) Play Test (F9) button and confirm OK Message. (Fig.4-3-2-2) (4) Remove LAN cable.

4.4. EDID Download

4.4.1. Overview

- It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

4.4.2. Equipment

(1) Since EDID data is embedded, EDID download JIG, HDMI

cable and D-sub cable are not need.

(2) Adjust by using remote controller.

4.4.3. Download method

(1) Press Adj. key on the Adj. R/C, (2) Select EDID D/L menu. (3) By pressing Enter key, EDID download will begin (4) If Download is successful, OK is display, but If Download is

failure, NG is displayed.

(5) If Download is failure, Re-try downloads.

* Caution : When EDID Download, must remove HDMI Cable.

4.4.4. EDID DATA

4.4.4.1. 3D_10bit_PCM(US) _ xvYCC : off

- HDMI EDID 3D_10bit_PCM(US)_xvYCC : off

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(Fig.4-3-2-1) (Fig.4-3-2-2) Check ‘OK’ Signal

Only for training and service purposes

▪ Reference

- HDMI1 ~ HDMI3

- In the data of EDID, bellows may be different by S/W or Input mode.

a. Product ID

HEX EDID Table DDC Function

0001 0100 Analog

0001 0100 Digital

b. Serial No: Controlled on production line. c. Month, Year: Controlled on production line:

ex) Week : '01' -> '01'

Year : '2015' -> '19'

d. Model Name(Hex): LGTV

Chassis MODEL NAME(HEX)

EA51E 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

- 12 -

e. Checksum(LG TV): Changeable by total EDID data.

e1 e2 e3

HDMI1 E6 B5 X

HDMI2 E6 A5 X

HDMI3 E6 95 X

f. Vendor Specific(HDMI)

INPUT Model name(HEX)_

HDMI1 78 03 0C 00 10 00 B8 2D 20 C0 0E 01 4F 00 FE 08 10 06 10 18 10 28 10 38 10

HDMI2 78 03 0C 00 20 00 B8 2D 20 C0 0E 01 4F 00 FE 08 10 06 10 18 10 28 10 38 10

HDMI3 78 03 0C 00 30 00 B8 2D 20 C0 0E 01 4F 00 FE 08 10 06 10 18 10 28 10 38 10

5. Final Assembly Adjustment

5.1. White Balance Adjustment

5.1.1. Overview

5.1.1.1. W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

(3) Adj. condition: normal temperature

- Surrounding Temperature: 25±5 ºC

- Warm-up time: About 5 Min

- Surrounding Humidity: 20% ~ 80%

- Before White balance adjustment, Keep power on status, don’t power off

5.1.1.2. Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface (80°~ 100°)

(3) Aging time

- After Aging Start, Keep the Power ON status during 5 Minutes.

- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

5.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer(During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-Gray

(Model:217, Pattern:49)

→ Only when internal pattern is not available

※ Color Analyzer Matrix should be calibrated using

CS-1000

5.1.3. Equipment connection

Color Analyzer

Probe

RS- 232C

Pattern Generator

Signal Source

* If TV internal pattern is used, not needed

RS-232C

Computer

RS-232C

5.1.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj

RS-232C

COMMAND

CMD DATA ID

Wb 00 00 Begin White Balance adj.

Wb 00 ff End White Balance adj. (internal pattern disappears )

Explanation

(2) Adjustment Map

Adj.

item

(lower caseASCII)

Command

Data

Range

(Hex.)

Default

(Decimal)

CMD1 CMD2 MIN MAX R Gain j g 00 C0 TBD G Gain j h 00 C0 TBD

Cool

B Gain j i 00 C0 TBD

R Cut TBD G Cut TBD

B Cut TBD R Gain j a 00 C0 TBD G Gain j b 00 C0 TBD

Medium

B Gain j c 00 C0 TBD

R Cut TBD

G Cut TBD

B Cut TBD R Gain j d 00 C0 TBD G Gain j e 00 C0 TBD

Warm

B Gain j f 00 C0 TBD

R Cut TBD

G Cut TBD

5.1.5. Adjustment method

5.1.5.1. Auto WB calibration (1) Set TV in ADJ mode using P-ONLY key (or POWER ON

key)

(2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration before

adjustment. (3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode (Cool, Medium,

Warm) (6) Remove probe and RS-232C cable. * W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need.

Only for training and service purposes

- 13 -

5.1.5.2. OLED White balance table (1) Cool Mode

1) Purpose : Especially B-gain fix adjust leads to the luminance enhancement. Adjust the color temperature to reduce the deviation of the module color temperature.

2) Principle : To adjust the white balance without the

saturation, Adjust the B gain more than 192 ( If R gain or G gain is more than 255 , G gain can adjust less than 192 ) and change the others ( R/G Gain ).

3) Adjustment mode : mode – Cool

(2) Medium

1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

2) Principle : To adjust the white balance without the

saturation, Fix the B gain to 192 (default data) and decrease the others.

3) Adjustment mode : mode – Medium

(3) Warm

1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

2) Principle : To adjust the white balance without the

saturation, Fix the W gain to 192 (default data) and decrease the others.

3) Adjustment mode : mode – Warm

(4) THX(Warm)

1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

2) Principle : To adjust the white balance without the

saturation, Fix the W gain to 192 (default data) and decrease the others.

3) Adjustment mode : mode – Warm

4) Auto White balance 4 point

5) Adjust 100 IRE White Balance

6) Adjust Gamam 2.2 each IRE (60, 40, 20). Using max

luminance

7) Complete 4 point gamma, W/B.

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Picture is H 1/3, V 1/3 fixed Center Window size Outer Black Picture do not need change Contrast / Brightness Center Level can change Contrast / Bright Window pattern of Center 0~255 level

5.1.6. Reference (White Balance Adj. coordinate and color

temperature)

▪ Luminance: 204 Gray, 80IRE ▪ Standard color coordinate and temperature using

5.1.7. Reference (White Balance Adj. coordinate and color

temperature)

▪ Luminance: 204 Gray, ▪ Standard color coordinate and temperature using CS-1000 (over

26 inch)

Mode

Coordinate

x y

Temp ∆uv

Cool 0.277 0.278 11,000K -0.0030

Medium 0.286 0.289 9300K 0.0000

Warm 0.313 0.329 6500K +0.0030

▪ Standard color coordinate and temperature using

CA-210(CH-17)

Mode

Coordinate

x y

Temp ∆uv

Cool 0.277±0.002 0.278±0.002 11000K -0.0030

Medium 0.286±0.002 0.289±0.002 9300K 0.0000

Warm 0.313±0.002 0.329±0.002 6500K +0.0030

5.2. Tool Option setting & Inspection per countries

5.2.1. Overview

(1) Tool option selection is only done for models in Non-USA

North America due to rating

(2) Applied model: LA4BX Chassis applied to CANADA and

MEXICO

5.2.2. Country Group selection

(1) Press ADJ key on the Adj. R/C, and then select Country

Group Menu

(2) Depending on destination, select KR or US, then on the

lower Country option, select US, CA, MX. Selection is done using +, - KEY

5.2.3. Tool Option Inspection

(1) Press Adj. key on the Adj. R/C, and then check Tool option.

* Tool option can be reconstructed by Software

Only for training and service purposes

- 14 -

5.3. Magic Motion remote controller Check



5.3.1. Test equipment

- RF-remote controller for check, IR-KEY-CODE remote controller.

- Check AA battery before test. A recommendation is that a tester change battery every lots.

5.3.2. Test

(1) Make pairing with TV set by pressing “Start key(Wheel

key)” on RCU. (2) Check a cursor on screen by pressing ‘Wheel key” of RCU (3) Stop paring with TV set by pressing “Back+ Home” key of

RCU.

5.3.3. Applied models

Chassis Model Name Magic RF receiver

EA51E 55EG9100-UB Built-in

5.4. Wi-Fi MAC Address Check

5.4.1. Using RS232 Command

Command Set ACK

Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]

5.5. 3D Module inspection

5.5.1. Test equipment

(1) Pattern Generator MSHG-600 or MSPG-6100 (HDMI 1.4

support)

(2) Pattern: HDMI mode (model No. 872, pattern No. 83)

5.5.2. Test method

(1) Input 3D test signal as (Fig.1).

(Fig.1) HDMI Mode 872, Pattern No.83

(2) Press ‘OK” key as a 3D input OSD is shown. (3) Check pattern as Fig2 without 3D glasses. (3D mode

without 3D glasses)

5.4.2. Check the menu on in-start

(Fig.2) OK in 3D mode without 3D glasses (LEFT)

(Fig.3) NG in 3D mode without 3D glasses(RIGHT)

5.6. HDMI ARC Function Inspection

5.6.1. Test equipment

- Optic Receiver Speaker

- MSHG-600 (SW: 1220 ↑)

- HDMI Cable (for 1.4 version)

5.6.2. Test method

(1) Insert the HDMI Cable to the HDMI ARC port from the

master equipment (HDMI1)



(2) Check the sound from the TV Set

Only for training and service purposes

- 15 -

(3) Check the Sound from the Speaker or using AV & Optic

TEST program (It’s connected to MSHG-600)

7. Joystick check

- Before you start a test, you must run a ‘Power Only Mode’. (1) Channel Up Test : Press UP KEY OF SET

* Remark : Inspect in Power Only Mode and check SW

version in a master equipment

5.7. Ship-out mode check (In-stop)

▪ after final inspection, press In-Stop key of the Adj. R/C and

check that the unit goes to Stand-by mode.

6. AUDIO output check

6.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)

6.2. Specification

Item Audio practical max Output, L/R

Min

Typ

Max

Unit

Remark

(1) Measurement condition

- EQ/AVL/Clear Voice: Off

(2) Speaker (8Ω Impedance)

9.0

8.5

10.0

8.9

12.0

9.9

Vrms

(2) Channel Down Test : Press DOWN KEY OF SET

(3) Volume Up Test : Press Left KEY OF SET

(4) Volume Down Test : Press Right KEY OF SET

(5) Enter Test : Press Enter KEY OF SET

6.3. Audio Output Inspection

(1) INPUT CHECK –S KEY OF ADJUST REMOTE

CONTROLLER TO INSPECT SPEAKER (2) When you click the first, the output volume of left & right

main speakers must be 50. (3) When you click the second, the output volume of left &

right main speakers must be 80. (4) When you click the third, the output volume of left & right

main speakers must be 100. (5) When you click the fourth, the output volume of left main

speaker must be 50. (6) When you click the fifth, the output volume of right main

speaker must be 50. ( Applied to 55EA88/9700 until here)

Only for training and service purposes

- 16 -

- Don’t need to run a test with this sequence. For example,

the sequence such as ‘Right → Up → Down → Left → Enter’

is allowed.

8. EYE-Q Green Function Inspection

(Step 1) Turn on the TV.. (Step 2) Press 'EYE button' on the adjustment remote-

controller.

(Step 3) Cover 'Eye Q sensor' on the front of set with your

hands, hold it for 6 seconds.

(Step 4) Check "the Sensor Data" on the screen, make certain

that Data is below 10.

If Data isn’t below 10 in 6 seconds, Eye Q sensor

would be bad. You should change Eye Q sensor.

(Step 5) Uncover your hands from Eye Q sensor, hold it for 6

seconds.

(Step 6) Check "Back Light(xxx)" on the screen, check data

increase .

You should change Eye Q sensor.

10. USB S/W Download(Service only)

(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick

- If your downloaded program version in USB Stick is Lower, it didn’t work. But your downloaded version is Higher, USB data is automatically detecting (Download Version High & Power only mode, Set is automatically Download)

(3) Show the message “Copying files from memory” (4) Updating is starting. (5) Updating Completed, the TV will restart automatically. (6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number)

9. GND and HI-POT Test

9.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

9.2 GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

9.3. Checkpoint

▪ TEST voltage

- GND: 1.5 KV / min at 100 mA

- SIGNAL: 3 KV / min at 100 mA

▪ TEST time: 1 second ▪ TEST POINT

- GND TEST = POWER CORD GND & SIGNAL CABLE METAL GND

- Hi-pot TEST = POWER CORD GND & LIVE & NEUTRAL

▪ LEAKAGE CURRENT: At 0.5 mArms

Only for training and service purposes

- 17 -

7. AUDIO output check

7.1. Audio input condition

(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation (2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)

7.2. Specification

Item Audio practical max Output, L/R

Min

Typ

Max

Unit

Remark

(1) Measurement condition

- EQ/AVL/Clear Voice: Off

(2) Speaker (8Ω Impedance)

9.0

8.5

10.0

8.9

12.0

9.9

Vrms

8. GND and HI-POT Test

8.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

8. USB S/W Download(Service only)

(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick

(3) Show the message “Copying files from memory”

(4) Updating is starting.

8.2 GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted) (2) Connect the AV JACK Tester. (3) Controller (GWS103-4) on. (4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next process automatically.

8.2.2. Checkpoint

▪ TEST voltage

- GND: 1.5 KV / min at 100 mA

- SIGNAL: 3 KV / min at 100 mA

▪ TEST time: 1 second ▪ TEST POINT

- GND TEST = POWER CORD GND & SIGNAL CABLE METAL GND

- Hi-pot TEST = POWER CORD GND & LIVE & NEUTRAL

▪ LEAKAGE CURRENT: At 0.5 mArms

(5) Updating Completed, the TV will restart automatically.

(6) If your TV is turned on, check your updated version and

Tool option. (explain the Tool option, next stage)

* If downloading version is more high than your TV have,

TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote control. (2) Select "Tool Option 1" and push "OK" key. (3) Punch in the number. (Each model has their number)

Only for training and service purposes

- 18 -

9. Optional adjustments

9.1. Manual White balance Adjustment

9.1.1. Adj. condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding. (2) Probe location: Color Analyzer (CA-210) probe should be

within 10cm and perpendicular of the module surface

(80°~ 100°) (3) Aging time

1) After Aging Start, Keep the Power ON status during 5 Minutes.

2) In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

9.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14/ OLED : CH17)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/216-Gray

(Model: 217, Pattern: 78)

9.1.3. Adjustment

(1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface.

(3) Press ADJ key ► EZ adjust using adj. R/C -> 6. White-

Balance then press the cursor to the right (KEY►). When KEY(►) is pressed 216 Gray internal pattern will be

displayed.

(4) One of R Gain / G Gain / B Gain should be fixed at 192,

and the rest will be lowered to meet the desired value. (5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of

color temperature.

▪ If internal pattern is not available, use RF input. In EZ Adj.

menu 6.White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can adjust using RF signal in 216 Gray pattern.

Only for training and service purposes

- 19 -

1. M14+ Block Diagram

BLOCK DIAGRAM

Only for training and service purposes

- 20 -

2. M14+ I2C Block Diagram

Only for training and service purposes

- 21 -

3. M14+ Block Diagram

Only for training and service purposes

- 22 -

4. Tuner Block Diagram

Only for training and service purposes

- 23 -

5. Video/Audio In Block Diagram

Only for training and service purposes

- 24 -

6. Audio Out Block Diagram

Only for training and service purposes

- 25 -

7. HDMI

Only for training and service purposes

- 26 -

8. Panel Interface Block Diagram

Only for training and service purposes

- 27 -

9. USB 2.0 / WIFI-BT / IR-KEY-EYE

Only for training and service purposes

- 28 -

200

820

810

500

502

501

540

521

522

571

570

121

530

531

LV1

120

A10

A22

Stand screw

AG1

410

710

400

900

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

Only for training and service purposes

- 29 -

System Configuration

LGE Internal Use Only

Clock for M14+

MAIN Clock(24Mhz)

10pF

C101

10pF

C102

System Clock for Analog block(24Mhz)

PLL SET[1:0] : internal pull up "00" : CPU(1200Mhz),M0 / M1 DDR(792,792 Mhz) "01" : CPU(1056Mhz),M0 / M1 DDR(672,672 Mhz) "10" : CPU(1056Mhz),M0 / M1 DDR(792,792 Mhz) "11" : CPU( 960Mhz),M0 / M1 DDR(792,792 Mhz)

Extenal test only

R103 3.3K

R104 3.3K

OP MODE[1:0] "00" : Normal Mode "01/10/11" : Internal Test mode

+3.3V_NORMAL

OPT

R101 3.3K

R102 3.3K

OPT

Extenal test only

+3.3V_NORMAL

R148

3.3K

R146

3.3K

KR/JP_PIP_NOT

1.5K

R146-*1

R148-*1

KR/JP_PIP

X-T AL_12GND _1

X10 1

24M Hz

GND _2

X-T AL_2

OPT

PLLSET1

PLLSET0

OPM1

OPM0

+3.3V_NORMAL

3.3K

AR104

R155

1.2K

KR/JP_PIP_NOT

3.3K

R155-*1

KR/JP_PIP

R118

R180 560

+3.3V_NORMAL

3.3K

R121

OPT

INSTANT_MODE0

+3.3V_NORMAL

R156

1.2K

KR/JP_PIP_NOT

3.3K

R156-*1

KR/JP_PIP

XTAL_IN

XTAL_OUT

INSTANT boot MODE "1 : Instant boot "0 : normal

(internal pull down)

INSTANT_BOOT

I2C PULL UP

3.3K

R159

3.3K

R160

3.3K

AR103

+3.3V_NORMAL

BOOT MODE "0 : EMMC "1 : TEST MODE

3.3K

R127

OPT



BOOT_MODE

3.3K

R128

BOOT_MODE0

I2C

I2C_1 : AMP I2C_2 : T-CON,L/DIMING I2C_3 : MICOM I2C_4 : S/Demod,T2/Demod, LNB I2C_5 : NVRAM I2C_6 : TUNER_MOPLL(T/C,ATV)

3.3K

AR102

I2C_SDA1 I2C_SCL1 I2C_SDA_MICOM_SOC I2C_SCL_MICOM_SOC I2C_SDA2 I2C_SCL2

I2C_SDA4 I2C_SCL4

I2C_SDA5 I2C_SCL5

I2C_SDA6 I2C_SCL6

NVRAM

IC103

AT24C256C-SSHL-T

GND

NVRAM_ATMEL

PAGE 1

+5V_NORMAL

R11034

10K

NON_CI

CAM_CD1_N CAM_CD2_N

TP104 TP105

TP106 TP107

NON_CI

TP108 TP109

TP110 TP111 TP112 TP113 TP114 TP115 TP116 TP117

EB_ADDR[0-14]

EB_WE_N EB_OE_N

EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N

/PCM_CE1 /PCM_CE2 CAM_IREQ_N PCM_RESET CAM_INPACK_N PCM_5V_CTL CAM_WAIT_N CAM_REG_N

VCC

SCL

SDA

VSS

NVRAM_ST

I2C_SCL5 I2C_SDA5

IC103-*1

M24256-BRMN6TP

VCC

SCL

SDA

SOC_RESET

I2C_SCL_MICOM_SOC I2C_SDA_MICOM_SOC

+3.3V_NORMAL

FORCED_JTAG_0

PWM_DIM2

PWM_DIM

R163 10K

OPT

C104

0.1uF 16V

L/DIM0_VS

L/DIM0_SCLK

L/DIM0_MOSI

M_REMOTE_RX M_REMOTE_TX

1/16W

AR100

I2C_SCL4 I2C_SDA4

I2C_SCL6 I2C_SDA6

EMMC_CLK EMMC_CMD EMMC_RST

TCK0 TDI0

XTAL_IN

XTAL_OUT

BOOT_MODE

PLLSET0 PLLSET1

I2C_SCL1 I2C_SDA1

I2C_SCL2 I2C_SDA2

I2C_SCL5 I2C_SDA5

R107 R108

OPM0 OPM1

R182 10K

R183 10K R184 10K

R185 10K

SOC_RX

SOC_TX

33 33

EMMC_DATA[7] EMMC_DATA[6] EMMC_DATA[5] EMMC_DATA[4] EMMC_DATA[3] EMMC_DATA[2] EMMC_DATA[1] EMMC_DATA[0]

R169

AR101

R178 33

OPT

R179 10K

1/16W 5%

B23

XIN_MAIN

A23

XO_MAIN

AG21

PORES_N

AJ18

BOOT_MODE

AB8

PLLSET0

AC8

PLLSET1

AD8

OPM0

AE8

OPM1

L_VSOUT_LD/TRST0_N

DIM0_SCLK/TMS0

DIM1_SCLK/TCK0

DIM1_MOSI/TDI0

DIM0_MOSI/TDO0

AG30

SPI_CS0

AG28

SPI_SCLK0

AG29

SPI_DO0

AH29

SPI_DI0/TRST1_N

AJ27

SPI_CS1/TMS1

AH27

SPI_SCLK1/TCK1

AG26

SPI_DO1/TDO1

AH26

SPI_DI1/TDI1

AJ12

EXT_INTR0

AJ13

EXT_INTR1

AH12

EXT_INTR2

AG12

EXT_INTR3

AH23

UART0_RXD

AG22

UART0_TXD

AH7

UART1_RXD

AJ7

UART1_TXD

AG8

UART1_RTS_N

AH8

UART1_CTS_N

AH11

SCL0

AG11

SDA0

AH9

SCL1

AG9

SDA1

AG10

SCL2

AJ9

SDA2

AH22

SCL3

AJ22

SDA3

AH10

SCL4

AJ10

SDA4

AG23

SCL5

AH24

SDA5

AC6

PWM0

AC7

PWM1

AD7

PWM2

AB7

PWM_IN

G32

EMMC_CLK

G33

EMMC_CMD

G31

EMMC_RESETN

D31

EMMC_DATA7

F33

EMMC_DATA6

F32

EMMC_DATA5

E32

EMMC_DATA4

F31

EMMC_DATA3

D33

EMMC_DATA2

D32

EMMC_DATA1

E31

EMMC_DATA0

EMMC_DATA[0-7]

IC101

LG1311V-C1

USB2_0_DP0 USB2_0_DM0

USB2_0_TXRTUNE

USB2_1_DP0 USB2_1_DM0

USB2_1_TXRTUNE

USB3_DP0

USB3_DM0 USB3_TXP0 USB3_TXM0 USB3_RXP0 USB3_RXM0

USB3_RESREF0

USB3_DP1

USB3_DM1 USB3_TXP1 USB3_TXM1 USB3_RXP1 USB3_RXM1

USB3_RESREF1

HUB_PORT_OVER0 HUB_VBUS_CTRL0

EB_CS3 EB_CS2 EB_CS1 EB_CS0

EB_WE_N EB_OE_N

EB_WAIT EB_BE_N1 EB_BE_N0

CAM_CD1_N CAM_CD2_N CAM_CE1_N CAM_CE2_N

CAM_IREQ_N

CAM_RESET

CAM_INPACK_N

CAM_VCCEN_N

CAM_WAIT_N

CAM_REG_N

EB_ADDR0 EB_ADDR1 EB_ADDR2 EB_ADDR3 EB_ADDR4 EB_ADDR5 EB_ADDR6 EB_ADDR7 EB_ADDR8 EB_ADDR9

EB_ADDR10 EB_ADDR11 EB_ADDR12 EB_ADDR13 EB_ADDR14 EB_ADDR15

EB_DATA0 EB_DATA1 EB_DATA2 EB_DATA3 EB_DATA4 EB_DATA5 EB_DATA6 EB_DATA7

AN9 AM9 AN8

H32 J31 H33

N31 N32 P33 P32 M32 M33 P31

K33 K32 L32 L31 K31 J32 M31

W28 W29

H28 J30 J28 J29

G30 F30 H29 G29 G28

P28 P27 U28 R29 V27 T28 T29 R28 U27 N29

K30 E30 M30 N28 M28 M29 L29 K29 K28 L28 D30 F29 C32 C33 C31 B33

B32 A32 B31 A31 A30 B30 C30 C29

R1712001%

R1722001%

R1732001%

R1742001%

/USB_OCD1

/USB_OCD2 /USB_OCD3

EB_BE_N1 EB_BE_N0

CAM_IREQ_N CAM_INPACK_N CAM_WAIT_N

EB_ADDR[0] EB_ADDR[1] EB_ADDR[2] EB_ADDR[3] EB_ADDR[4] EB_ADDR[5] EB_ADDR[6] EB_ADDR[7] EB_ADDR[8]

EB_ADDR[9] EB_ADDR[10] EB_ADDR[11] EB_ADDR[12] EB_ADDR[13] EB_ADDR[14]

EB_DATA[0]

EB_DATA[1]

EB_DATA[2]

EB_DATA[3]

EB_DATA[4]

EB_DATA[5]

EB_DATA[6]

EB_DATA[7]

WIFI_DP WIFI_DM

USB_DP3 USB_DM3

USB_DP1 USB_DM1

USB_DP2 USB_DM2

USB_CTL1

USB_CTL2 USB_CTL3 EB_WE_N

EB_OE_N

R11033

10K

/PCM_CE1 /PCM_CE2

PCM_RESET PCM_5V_CTL CAM_REG_N

TP102

IC103-*2

BR24G256FJ-3

+3.3V_NORMAL

C107

0.1uF 16V

VCC

SCL

SDA

GND

NVRAM_ROHM

Write Protection

- Low : Normal Operation

- High : Write Protection AR105

EB_DATA[0-7]

TP103

EB_DATA[0-7]

Jtag-0 I/F

LOCAL DIMMING I2C CONTROL

+3.3V_NORMAL

P102

R106

OPT

3.3K

12507WS-04L

LED_SCL LED_SDA

R105

OPT

3.3K

12505WS-10A00

OPT

P103

JTAG_CPU

+3.3V_NORMAL

L/DIM0_VS

(TRST0_N)

TDI0

L/DIM0_MOSI

L/DIM0_SCLK

TCK0

SOC_RESET

FORCED_JTAG_0

(TDO0)

(TMS0)

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

M14-Peripheral

MID_LG1311

M14 Symbol A

2013.04.04 1

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