LG 49UJ634V, 49UJ635V-ZF Schematic

P/NO : MFL69879814 (1707-REV01)

CHASSIS : UD74P

MODEL : 49UJ634V 49UJ634V-ZD

49UJ635V 49UJ635V-ZF

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TV

SERVICE MANUAL

CONFIDENTIAL

- 2 -

Only training and service purposes.

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

SOFTWARE UPDATE ............................................................................. 11

BLOCK DIAGRAM ..................................................................................12

EXPLODED VIEW .................................................................................. 25

DISASSEMBLY GUIDE .......................................................................... 26

TROUBLE SHOOTING GUIDE ................................................ APPENDIX

- 3 -

Only training and service purposes.

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the

Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of the circuitry that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

- 4 -

Only training and service purposes.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions

on page 3 of this publication, always follow the safety precau-

tions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explo-

sion hazard.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,

FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10 % (by volume) Acetone and 90 %

(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.

Unless specied otherwise in this service manual, lubrication

of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks

are correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas-

ily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques

should be used to help reduce the incidence of component dam-

age caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground. Alter-

natively, obtain and wear a commercially available discharg-

ing wrist strap device, which should be removed to prevent

potential shock reasons prior to applying power to the unit

under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or expo-

sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder

ES devices.

4. Use only an anti-static type solder removal device. Some sol-

der removal devices not classied as “anti-static” can generate

electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads elec-

trically shorted together by conductive foam, aluminum foil or

comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective mate-

rial to the chassis or circuit assembly into which the device will

be installed.

CAUTION: Be sure no power is applied to the chassis or cir-

cuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace-

ment ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf-

cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropri-

ate tip size and shape that will maintain tip temperature within

the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there

only until the solder ows onto and around both the compo-

nent lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

- 5 -

Only training and service purposes.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent at against the cir-

cuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as the

solder melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing

the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close

as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remain-

ing on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos-

sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and

if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed when-

ever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC connec-

tions).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the

good copper pattern. Solder the overlapped area and clip off

any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly con-

nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the

lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

- 6 -

Only training and service purposes.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to the LED TV with UD74P chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

(2) Relative Humidity: 65 % ± 10 %

(3) Power Voltage

: Standard input voltage (AC 100~240 V, 50/60 Hz)

* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in

accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance: LGE TV test method followed

(2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC specification

- Wireless : Wireless HD Specification (Option)

4. Model General Specification

No. Item Specication Remarks

1 Market EU/CIS(PAL Market-37Countries)

DTV & Analog (Total 37 countries)

DTV (MPEG2/4, DVB-T) : 26 countrie

Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,

France, Spain, , Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,

Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,

Bosnia, Slovakia, Belarus

DTV (MPEG2/4, DVB-T2) :11 countries

UK(Ireland), Sweden, Denmark, Finland, Norway, Ukraine, Kazakhstan,

Russia, Italy, Croatia, Serbia

DTV (MPEG2/4, DVB-C) : 37 countries

Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,

France, Spain, Italy, Belgium, Russia, Luxemburg, Greece, Czech, Croa-

tia, Turkey, Morocco, Ireland, Latvia, Estonia, Lithuania, Poland, Portugal,

Romania, Albania, Bosnia, Serbia, Slovakia, Belarus, UK, Sweden, Den-

mark, Finland, Norway, Ukraine, Kazakhstan

DTV (MPEG2/4,DVB-S) : 37 countries

Germany, Netherland, Switzerland, Hungary, Austria, Slovenia, Bulgaria,

France, Spain,Belgium, Luxemburg, Greece, Czech, Turkey, Morocco,

Ireland, Latvia, Estonia, Lithuania, Poland, Portugal, Romania, Albania,

Bosnia, Slovakia, Belarus, UK(Ireland), Sweden, Denmark, Finland, Nor-

way, Ukraine, Kazakhstan,Russia, Italy, Croatia, Serbia

Supported satellite : 35 satellites

ABS1 75.0E , AMOS 4.0W , ASIASAT3S 105.5E , ASTRA 19.2E , ASTRA

23.5E , ASTRA 28.2E , ASTRA 4.8E, ATLANTIC BIRD2 8.0W , ATLANTIC

BIRD3 5.0W , BADR 26.0E , DIRECTV-1R 56.0E , EUROBIRD 9A 9.0E ,

EUROBIRD3 33.0E , EUTELSAT 36 A/B 36.0E ,

EUTELSAT W2A 10.0E , EUTELSAT W3A 7.0E , EUTELSAT7WA 7.3W

- 7 -

Only training and service purposes.

No. Item Specication Remarks

2 Broadcasting system

1)PAL/SECAM B/G/I/D/K

SECAM L/L’

2)DVB-T/T2, C, S/S2

3 Program coverage

1 ) Digital TV

-VHF, UHF

-C-Band, Ku-Band

2) Analogue TV

-VHF : E2 to E12

-UHF : E21 to E69

-CATV : S1 to S20

-HYPER : S21 to S47

4 Receiving system

Analog : Upper Heterodyne

Digital : COFDM, QAM

► DVB-T

- Guard Interval(Bitrate_Mbit/s)

1/4, 1/8, 1/16, 1/32

- Modulation : Code Rate

QPSK : 1/2, 2/3, 3/4, 5/6, 7/8

16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8

► DVB-T2

- Guard Interval(Bitrate_Mbit/s)

1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,

- Modulation : Code Rate

QPSK : 1/2, 2/5, 2/3, 3/4, 5/6

16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6

► DVB-C

- Symbolrate :

4.0Msymbols/s to 7.2Msymbols/s

- Modulation :

16QAM, 64-QAM, 128-QAM and 256-QAM

► DVB-S/S2

- Symbolrate

DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s

DVB-S (QPSK) : 2 ~ 45Msymbol/s

- 9 iterbi

DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8

DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10

5 Input Voltage AC 100 ~ 240V ,50/60Hz

- 8 -

Only training and service purposes.

5. External Input Format

5.1. 2D Mode

5.1.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1 720*480 15.73 59.94 13.50 SDTV ,DVD 480i

2 720*480 15.75 60.00 13.5135 SDTV ,DVD 480i

3 720*576 15.62 50.00 13.50 SDTV 576i

4 720*480 31.47 59.94 27.00 SDTV 480p

5 720*480 31.50 60.00 27.027 SDTV 480p

6 720*576 31.25 50.00 27.00 SDTV 576p

7 1280*720 44.96 59.94 74.175 HDTV 720p

8 1280*720 45.00 60.00 74.250 HDTV 720p

9 1280*720 37.50 50.00 74.250 HDTV 720p

10 1920*1080 28.12 50.00 74.250 HDTV 1080i

11 1920*1080 33.72 59.94 74.175 HDTV 1080i

12 1920*1080 33.75 60.00 74.250 HDTV 1080i

13 1920*1080 56.25 50.00 148.50 HDTV 1080p

14 1920*1080 67.43 59.94 148.350 HDTV 1080p

15 1920*1080 67.50 60.00 148.50 HDTV 1080p

5.1.2. HDMI Input (PC)

No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks

1 640*350 31.46 70.09 25.17 EGA

2 720*400 31.46 70.08 28.32 DOS

3 640*480 31.46 59.94 25.17 VESA(VGA)

4 800*600 37.87 60.31 40.00 VESA(SVGA)

5 1024*768 48.36 60.00 65.00 VESA(XGA)

6 1152*864 54.34 60.05 80.00 VESA

7 1360*768 47.71 60.01 85.00 VESA(WXGA)

8 1280*1024 63.98 60.02 109.00 VESA(SXGA) FHD, UHD only

9 1920*1080 67.50 60.00 158.40 WUXGA(CEA 861D) FHD, UHD only

10 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only

11 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only

12 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only

13 4096*2160 53.95 23.97 296.703 UDTV 2160P UHD only

14 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only

- 9 -

Only training and service purposes.

5.1.3. HDMI Input (DTV)

No Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed Remarks

1 640*480 31.46 59.94 25.13 SDTV 480P

2 640*480 31.50 60.00 25.13 SDTV 480P

3 720*480 15.73 59.94 13.50 SDTV, DVD 480I(525I)

Spec. out but display4 720*480 15.75 60.00 13.51 SDTV, DVD 480I(525I)

5 720*576 15.62 50.00 13.50 SDTV, DVD 576I(625I) 50Hz

6 720*480 31.47 59.94 27.00 SDTV 480P

7 720*480 31.50 60.00 27.03 SDTV 480P

8 720*576 31.25 50.00 27.00 SDTV 576P

9 1280*720 44.96 59.94 74.18 HDTV 720P

10 1280*720 45.00 60.00 74.25 HDTV 720P

11 1280*720 37.50 50.00 74.25 HDTV 720P

12 1920*1080 28.12 50.00 74.25 HDTV 1080I

13 1920*1080 33.72 59.94 74.18 HDTV 1080I

14 1920*1080 33.75 60.00 74.25 HDTV 1080I

15 1920*1080 26.97 23.97 63.30 HDTV 1080P

16 1920*1080 27.00 24.00 63.36 HDTV 1080P

17 1920*1080 33.71 29.97 79.12 HDTV 1080P

18 1920*1080 33.75 30.00 79.20 HDTV 1080P

19 1920*1080 56.25 50.00 148.50 HDTV 1080P

20 1920*1080 67.43 59.94 148.35 HDTV 1080P

21 1920*1080 67.50 60.00 148.50 HDTV 1080P

22 3840*2160 53.95 23.98 297.00 UDTV 2160P UHD only

23 3840*2160 54.00 24.00 297.00 UDTV 2160P UHD only

24 3840*2160 56.25 25.00 297.00 UDTV 2160P UHD only

25 3840*2160 61.43 29.97 297.00 UDTV 2160P UHD only

26 3840*2160 67.50 30.00 297.00 UDTV 2160P UHD only

27 3840*2160 112.50 50.00 594.00 UDTV 2160P(DVB) UHD only

28 3840*2160 134.86 59.94 593.41 UDTV 2160P UHD only

29 3840*2160 135.00 60.00 594.00 UDTV 2160P UHD only

30 4096*2160 53.95 23.98 297.00 UDTV 2160P UHD only

31 4096*2160 54.00 24.00 297.00 UDTV 2160P UHD only

32 4096*2160 56.25 25.00 297.00 UDTV 2160P UHD only

33 4096*2160 61.43 29.97 297.00 UDTV 2160P UHD only

34 4096*2160 67.50 30.00 297.00 UDTV 2160P UHD only

35 4096*2160 112.50 50.00 594.00 UDTV 2160P(DVB) UHD only

36 4096*2160 134.86 59.94 593.41 UDTV 2160P UHD only

37 4096*2160 135.00 60.00 594.00 UDTV 2160P UHD only

- 10 -

Only training and service purposes.

5.2. 3D Mode - DTV/HDMI/USB

5.2.1. RF Input

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed 3D input proposed mode

1 1280*720 37.50 50 74.25 HDTV 720P

2D to 3D, Side by Side,

Top & Bottom

2 1920*1080 28.13 50 74.25 HDTV 1080I

2D to 3D, Side by Side,

Top & Bottom

- 11 -

Only training and service purposes.

1. USB

(1) Insert the USB memory Stick to the USB port.

(2) Automatically detect the SW Version and show the below

message

(3) Click [YES]: initiate the download and install of the update.

(4) Click [Check Now]: move to “About This TV” page for

update.

(5) TV is updating.

(6) After finished the update, below Pop-up appear.

(7) Click [Yes] : TV will be DC OFF -> ON

(8) After TV turned on, Check the updated SW Version and

Tool Option.

2. NSU

(1) Menu -> All Settings -> General -> About This TV

(2) Click [CHEK FOR UPDATES] : system check newest

version

(3) Click [DOWNLOAD AND INSTALL]

(4) TV is updating

(5) After finished the update, below Pop-up appear

(6) Turn OFF the TV and On. Check the updated SW Version

and Tool Option

SOFTWARE UPDATE

- 12 -

Only training and service purposes.

Realtek

K3Lp

DDR3 2133 X 32

(512MB X 2EA)

Hynix 20nm

DDR3 2133 X 32

(512MB X 2EA)

eMMC (4GB)

Toshiba 15nm

CI Slot

B-CAS

(JAPAN)

B-CAS

controller

SMARTCARD_I/F

USB2 (2.0)

OCP

USB3 (2.0)

HDMI3

HDMI2(ARC)

HDMI1

Air/

Cable

DVB-S

LNB

(DT1805)

REAR(H)

P_TS_OUT

P_TS_IN

Sub Micom

(RENESAS

R5F100GEAFB)

X_TAL

32.768KHz

I2C 1

USB_WIFI

X_TAL

27MHz

Sub Assy

LAN

ETHERNET

SPDIF

V/COMP

CVBS/YPbPr

SPDIF OUT

H/P

AMP

RS-232

MAX323

MAIN Audio AMP

(DTA2010M)

I2S Out

I2C 4

Vx1 51P (8 lane) : LGD 60/65/70/75

Vx1 / EPI

I2C 6

EPI PMIC

(SW50B3A)

Level

shifter

M0 M1

B-CAS

I2C 6

NVRAM (256Kb)

I2C 4

I2C 2

EPI block

HDMI4 (EEPROM)

K3L only. (K3Lp 256MB x 2ea SoC )

USB1 (3.0)

OCP

K3L only

IR / KEY(1Key)

LOGO LIGHT(Ready)

WIFI/BT Combo

MTK IC

HDMI 6G 4

EPI 60Px2 (3G, 6 lane) : LGD 43/49/55

CEDS 68Px2 (1.5G, 12 lane) : BOE

T2/C/S2 NIM tuner

RF IC

Demode

(T/C/S/T2/S2)

BLOCK DIAGRAM

1. K3Lp Block Diagram (External)

- 13 -

Only training and service purposes.

2. K3Lp Block Diagram (Internal)

- 14 -

Only training and service purposes.

K3Lp

CEDS/EPI 6Lane 68pin

HTPDAn_IN

[GPIO_5_VBY_LOCK/EPLOCK]

[GPIO_4_VBY_HTPD/TCON_14]

BOE Panel

3840x2160@60p

1.5Gbps

[EPI_TX12~EPI_TX23]

LOCKAn_IN

CEDS/EPI 6Lane 68Pin

LGD Panel

3840x2160@60p

3Gbps

PMIC

Level Shifter

SW50B3A(LGD)

SW5253(BOE)

CLK(x10)

VCOM1

VCOMLFB / VCOMRFB

VCOM2

VGL1

VST

GIP_RST

LS_VGL

VGH_EVEN

VGH_ODD

HVDD

EPI 3Lane 60P

GMA

(1, 5, 6, 9, 10, 13, 24,18)

[GPIO_5_VBY_LOCK/EPLOCK]

PMIC_RESET

[GPIO7_PMIC_RESET]

LOCKOUT12

GST, E/O, MCLK, GLCK

[GPIO019_DAC_OUT]

[GPIO_0_DAC_SCLK]

[GPIO_4_VBY_HTPD/TCON_14]

[GPO_1_TCON_I2C_EN/TCON_2]

Boost/Buck

(RT5043A)

VDD, VCORE

SWG

SWO

SWI

[EPI_TX12~EPI_TX23]

GAMMA

(RT6508)

BOE Only

GMA

(2, 3, 4, 7, 8,

11, 12, 15, 16, 17)

[GPIO_2_TCON_SCL/TCON_9]

[GPIO_1_TCON_SDA/TCON_5]

68pin

60pin

68pin

60pin

3. EPI / CEDS Block Diagram

- 15 -

Only training and service purposes.

17Y Tuner

K3Lp

RTK

[B1_+3.3V_RF] 3

[+3.3V_DEMOD_TU] 11

[B3_+1.2V_DEMOD] 13

[IF_P_TU] 8

[IF_N_TU] 7

[TU_SIF] 6

[TU_CVBS_TU] 4

[IF_AGC_TU] 5

[M_ERROR] 14

[M_MCLK] 15

[M_SYNC] 16

[M_VALID] 17

AB5 / AB2 [GPIO57_TP0_CLK]

AB6 / AA3 [GPIO56_TP0_SYC]

AB4 / AC2 [GPIO58_TP0_VAL]

FE_DEMOD1_TS_ERROR

FE_DEMOD1_TS_CLK

FE_DEMOD1_TS_SYNC

FE_DEMOD1_TS_VAL

FE_DEMOD1_TS_DATA[0-7] 18-25

FE_DEMOD1_TS_DATA [0-7]

[GPIO59~66_TP0_D0~TP0_D7]

[B4_+2.5V_DEMOD] 29

+2.5V_Normal

[/TU_RESET1_TU] 10

/TU_RESET1

AB2 / L1 [VINRP_TUNER0_REST]

[LNB_TX1] 12

[LNB] 26(Full NIM) / [LNB] 26(Half NIM)

[SCL_RF] 1

[SDA_RF] 2

I2C_SCL2

I2C_SDA2

+3.3V_NORMAL

IF_P

IF_N

TUNER_SIF (OPT : TU_EXT_ATV)

TU_CVBS (OPT : TU_EXT_ATV)

IF_AGC

AE1 / U2 [IF_P]

AE2 / U3 [IF_N]

AE3 / V2 [SIF]

Y5 / R5 [VIN10P]

Y4 / W4 [GPIO55_RF_IF_AGC1]

[SCL_DEMOD] 36

[SDA_DEMOD] 35

+ DEMOD_CORE

LNB

IC7001

DT1805

LNB_TX

LNB_OUT

1.8K ȳ

5 [SCL]

6 [SDA]

8 [TONECTRL]

2 [LNB]

33 ȳ

[/TU_RESET2_TU] 34

/TU_RESET2

AA3 / M2 [VINGP_DEMOD_RESET]

33 ȳ

TU_JP

AA5 / Y4 [GPIO52_TUNER0_SCL]

AA6 / AA4 [GPIO51_TUNER0_SDA]

[S_ERROR] 28

[S_MCLK] 33

[S_SYNC]30

[S_VAL] 31

[S_DATA]32

TU_JAPAN

AF4 [GPIO54_TUNER1_SCL]

AF5 [GPIO53_TUNER1_SDA]

Reserved for Dual Tuner_only K3L

AF3 / W2 [IP_1]

AG1 / W3 [IN_1]

AG2 / Y2 [QP_2]

AG3 / Y3 [QN_2]

IF_S_IP

IF_S_IN

IF_S_QP

IF_S_QN

[IF_S_IP_MAIN] 59

[IF_S_IN_MAIN] 60

[IF_S_QP_MAIN] 62

[IF_S_QN_MAIN] 61

JAPAN_OPT

FE_DEMOD1_TS_1_DATA[1]

FE_DEMOD1_TS_1_DATA[4]

FE_DEMOD1_TS_1_DATA[3]

FE_DEMOD1_TS_1_DATA[2]

FE_DEMOD2_TS_ERROR

4. Tuner

- 16 -

Only training and service purposes.

HDMI_ARC

ST_GPIO_23_H0_ARC[AG13]

[V2] SIF

I2C_SDA/SCL_AMP

AUD_SCK

AMP_RESET_N

HP_L/ROUT

H/P Jack

SIDE_HP_MUTE

GPIO021_SCLK[C2]

GPO_0_I2S_WCLK/SPDIF_OUT_1[D13]

GPIO15_D0 [B3]

GPIO_35_HPOL [N5]

GPIO_36_HPOR [N4]

TU_SIF

AI2R_AMP_SDA [G4]

AI3L_AMP_SCL [G5]

H/P AMP

TPA6138A2

(IC6300)

LPF

AI2L_AMP_RESET_N [F5]

SPDIF_OUT

AV1_CVBS_DET

COMP1/AV1/DVI_L_IN

COMP1/AV1/DVI_R_IN

[H5] AIO1L_AV1_CVBS_DET

[M5] AI1L

[M4] AI1R

HP_LOUT_AMP

HP_ROUT_AMP

LPF

Realtek

K3Lp

Tuner

GPIO_6_SPDIF_OUT_0 [E3]

AUD_LRCH

AUD_LRCK

AMP_MUTE

SPK_R+ / R-

SPK_L+ / L-

MAIN AMP

DTA2010M

(IC5800)

MICOM

SPK L

SPK R

[38] CLK_I

[8] WCK

[7] SDATA

[10,11]

[36]

[12]

[30, 33]

[18, 21]

AV/COMP

HDMI2

SPDIF

HP_DET

AIO2L_HP_DET[J5]

COMP1_Pb

COMP1_Pr

COMP1_Y/CVBS

COMP1_DET

[N3] VIN 3P

[P3] VIN 5P

[P2] VIN 4P

[H4] AI3R_COMP1_DET

5. Video & Audio IN/OUT

- 17 -

Only training and service purposes.

REALTEK

K3Lp

HDMI2.0_1_HPD

TMDS1 - D0/D1/D2/CLK

ST_GPIO_19_5V_DET_HDMI_0

ST_GPIO_18_H0_HPD

ST_GPIO_21_H0_SCL

ST_GPIO_20_H0_SDA

P0_CKN/P_RGB_N/P

DDC_SCL1 / DDC_SDA1

MICOM

R5F100GEAFB

(IC3000)

HDMI2.0_1_5V_DET

HDMI2.0_2_HPD

TMDS2 - D0/D1/D2/CLK

ST_GPIO_15_5V_DET_HDMI_1

ST_GPIO_14_H1_HPD

ST_GPIO_17_H1_SCL

ST_GPIO_16_H1_SDA

ST_GPIO_23_H0_ARC

P1_CKN/P_RGB_N/P

DDC_SCL2 / DDC_SDA2

HDMI2.0_2_5V_DET

HDMI2.0_3_HPD

TMDS3 - D0/D1/D2/CLK

ST_GPIO_10_5V_DET_HDMI_2

ST_GPIO_11_H2_HPD

ST_GPIO_13_H2_SCL

ST_GPIO_12_H2_SDA

P2_CKN/P_RGB_N/P

DDC_SCL3 / DDC_SDA3

HDMI2.0_3_5V_DET

HDMI2.0_4_HPD

TMDS4 - D0/D1/D2/CLK

ST_GPIO_07_5V_DET_HDMI_3

ST_GPIO_06_H3_HPD

ST_GPIO_09_H3_SCL

ST_GPIO_08_H3_SDA

P3_CKN/P_RGB_N/P

DDC_SCL4 / DDC_SDA4

HDMI2.0_4_5V_DET

HDMI2 with ARC

HDMI1

HDMI3

HDMI4

HDMI_CEC

HDMI_ARC

HDMI_CEC

6. HDMI 2.0 Block

- 18 -

Only training and service purposes.

RS232C

(IC7200)

WIFI_DM / DP

SOC_RX / TX

USB2.0_2_DM / DP

USB2

DEBUG_RX / TX

Realtek

K3Lp

HSDM1[AM24]

HSDP1[AL24]

HSDM2[AM25]

HSDP2[AL25]

HSDM0 [G1]

HSDP0 [G2]

USB1

USB2.0_3_DM / DP

MICOM

R5F100GEAFB

(IC3000)

[AH5] ST_GPIO_02_VGA_SDA

[AG5] ST_GPIO_01_VGA_SCL

ST_GPIO_25_UART0/1[AH13]

ST_GPIO_24_UART0/1[AG14]

Wafer

(P200)

Wafer

(P4000)

DEBUG UART

Wafer

(P201)

SOC_RX / TX

DCDC OCP

BD2242G

(IC4501)

USB_OCD2 [AJ18]

USB_CTL2 [AG20]

+5V_USB2.0_2

+5V_USB2.0_3

WOL/WIFI_POWER_ON

BT_RESET

BT_WAKEUP_DEVICE

BT_WAKEUP_HOST

LED_R

KEY2

KEY1

DCDC OCP

BD2242G

(IC4700)

USB_OCD3 [AG22]

USB_CTL3 [AH19]

DOUT1

RIN1

PHONE JACK

7. USB / WIFI / M-REMOTE / UART(Debug)

- 19 -

Only training and service purposes.

[GPIO_2_TCON_SCL/TC

ON_9]

I2C_SDA6

SW50B3A(LGD)

SW5253A(BOE)

EPI PMIC

I2C_SCL6

1.8k ȳ

[ST_GPIO_26_MICRO_SDA]

[ST_GPIO_27_MICRO_SCL]

I2C_SDA_1

I2C_SCL_1

K3Lp

[GPIO_1_TCON_SDA/TC

ON_5]

1.8k ȳ

+3.3V_NOR

1.8k ȳ

+3.5V_ST

R5F100GEAFB#30

MICOM

[AI3L_AMP_SCL]

[AI2R_AMP_SDA]

I2C_SDA4

I2C_SCL4

FT24C256A-ESR-T

NVRAM

DTA2010M

AMP

[GPIO_51_TUNER0_SDA]

[GPIO_52_TUNER0_SCL]

I2C_SDA2

I2C_SCL2

DT1805

LNB

TDJN-G501D

TUNER

1.8 k ȳ

+3.3V_NOR

1.8k ȳ

+3.3V_NOR

33 ȳ

100ȳ

33 ȳ

EPI / CEDS only

8. K3Lp I2C Map

- 20 -

Only training and service purposes.

[ST_GPIO_05_IR_RX]

[ST_GPIO_00_WOL_WAKE_UP]

WOL/ETH_POWER_ON

USB_CTL2

K3Lp

MICOM

USB2_2.0 OCP USB2

[RTC_XO_USBOCD0]

[GPIO_79_USB_PWR0_SD_WP]

INSTANT_BOOT

/USB_OCD2

USB_CTL3

USB3_2.0 OCP USB3

[RTC_XI_USBOCD1]

[GPIO_78_USB_PWR1_SD_CD]

/USB_OCD3

[RST]

SOC_RESET

[AH16,AH17,AG16,AG17,AJ16]

BIT0~4

HW option

ADC 1~5

[GPIO_119_PC_RST]

PCM_RESET

CI_SLOT

CI power

enable control

[AIO2R_CMD_VCC_SC]

PCM_5V_CTL

Panel

[GPIO_4_VBY_HTPD/TCON_14]

EPI_MCLK

[GPIO_5_VBY_LOCK/EPLOCK]

LOCKAn

[GPIO7_PMIC_RESET]

PMIC_RESET

PMIC

[GPO011_PWM_DIM_1]

[GPIO010_PWM_DIM_0]

PWM_DIM2

POWER

PWM_DIM

[GPO012_LD_SPI1_SCK]

L/DIM_M0_SCLK

[GPO013_LD_SPI1_SDO]

L/DIM_M0_MOSI

[GPO014_LD_SPI1_SYNC]

L/DIM_M0_VS

EPI_GCLK

[GPO_1_TCON_I2C_EN/TCON_2]

[VINBN_VIDCORE]

VID_CORE

CORE DCDC

[VINRP_TUNER0_REST]

/TU_RESET1

Tuner

/TU_RESET2

[VINGP_DEMOD_RESET]

[AI2L_AMP_RESET_N]

AMP_RESET_N

Audio AMP

[AI3R_COMP1_DET]

COMP1_DET

Component/AV Jack

[AIO1L_AV1_CVBS_DET]

AV1_CVBS_DET

[VDBSOUT_SC_PWR_SEL]

SMARTCARD_PWR_SEL

Japan B-CAS

[AIO2L_HP_DET]

HP_DET

H/P Jack

9. GPIO(K3Lp)

- 21 -

Only training and service purposes.

RTK ˀ K3L

IC100

1 [P60/SCLA0] / 2 [P61/SDAA0]

13 [P50//INTP1/SI11/SDA11]

18 [P14/RXD2/SI20/SDA20]

RS232C

CONTROL I/F

IC7200

SOC_RX/TX

[P24/ANI4] 28

[P23/ANI3] 29

MICOM DEBUG 4P

P3000

12507WS-04L

[P40/TOOL0] 39

MICOM_DEBUG

AMP

IC5800

DTA2010M

AMP_MUTE

MODEL1_OPT_0/1/2/ 3

4 [P63]

5 [P31/TI/03/TO03/INTP4]

GND

+13V TO PANEL_VCC

PANEL_CTL

HDMI 1 / 2 / 3 /4

JK3101/JK3102/JK3103/JK3104

HDMI_CEC

RESET IC

IC1300

14 [P51/INTP2/SO11]

POWER_DET

POWER WAFER

P1001

INV_CTL

MODE_SELECT_PWM1

RL_ON

I2C_SCL_MICOM / I2C_SDA_MICOM

WOL/ETH_POWER_ON

SOC_RESET

INSTANT_BOOT

SYSTEM_DEBUG

HP AMP

IC6300

TPA6138A2

[P25/ANI5] 27

SIDE_HP_MUTE

OPT0 NON LOGO LCD/LOGO LCD

NON LOGO OLED/LOGO OLED

OPT1 TV-NON EPI/BOX/TV EPI/BOX

OTP2 RESERVED/ RESERVED/9_KEY/9_KEY_NON

OPT3 M16/RTK/H15

[RESET] 40

MICOM_RESET

MICOM X-TAL

X3000

32.768KHz

[P124/XT2/EXCLKS] 41

[P123/XT1] 42

17 [P15/PCLBUZ1/SCK20/SCL20]

WOL_CTL

51P VX1 Wafer

1.0V DCDC Eth STDBY

IC2307

TLV62565DBVR

EWBS_TUNER

[P16/TI01/TO01/INTP5] 16

AM_MODE_DET_OLED

[P137/INTP0] 43

HDMI EXT EDID

IC3401

BR24G02FJ

22 [P10/SCK00/SCL00]

7 [P74/KR4/INTP8/SI01/SDA01]

19 [P13/TXD2/SDA20]

36 [P140/PCLBUZ0/INTP6]

IR / KEY/WIFI/BT

P4000

10 [P71/KR1/SI21/SDA21] / 11 [P70/KR0/SIK21/SCL21]

31 [P21/ANI1/AVREFM] / 32 [P20/ANI0/AVREFP]

38 [P41/TI07/TO07]

6 [P75/KR5/INTP9/SCK01/SCL01]

20 [P12/SO00/TXD0/TOOLTXD]

21 [P11/SI00/RXD0/TOOLRXD/SDA00]

EWBS_TU

TUxxxx

EDID_WP

3D&L_DIM_EN

[P146] 23

[P62] 3

1.5V DCDC

IC2303

SYVL83

33 [P130]

3.3V NORMAL DCDC

IC2300

TPS563208

[P72/KR2/SO21] 9

POWER_ON/OFF2_3

0.95V CORE/CPU DCDC

IC2302

TPS51362RVER

1.8V eMMC LDO

IC2301

TJ4320GDP-ADJ

POWER_ON/OFF2_4

[P01/TO00/RXD1] 34

12 [P30/INTP3/RTC1HZ/SCK11/SCL11]]

[P17/TI02/TO02] 15

POWER_ON/OFF1

13V-5V NORMAL DCDC

IC2500

TPS564208

24 [P147/ANI18]

25 [P27/ANI7]

26 [P26/ANI6]

WIFI_EN

[P22/ANI2] 30

35 [P00/TI00/TXD1]

[P122/X2/EXCLK] 44

T_CON_SYS_POWER_OFF_OLED

[P121/X1] 45

EYE_SCL / EYE_SDA

BT_WAKEUP_DEVICE

WOL/WIFI_POWER_ON

COMBO_RESET

BT_WAKEUP_HOST

KEY1 / KEY2

LED_R

1.2V Demod LDO

IC6900

TJ4320GDP-ADJ

GND

+3.5V WIFI

37 [P120/ANI19]

RETENTION_DISABLE

8 [P73/KR3/SO01]

* Depending on Model

10. GPIO(MICOM – RENESAS)

- 22 -

Only training and service purposes.

K3Lp

K3L_DDR_0_ADDR_[0:14]

DC1_A [0:14]

K3L_DDR_0_CON_BA[

0:2]

DC1_BA [0:2]

K3L_DDR_0_CLK_ P/N

K3L_DDR_0_CON_CKE

K3L_DDR_0_CON_ODT

DC1_ODT

K3L_DDR_0_CON_RA

SN /CASN

DC1_RAS / CAS

K3L_DDR_0_CON_WEN

DC1_WE

K3L_DDR_0_DQS_0_P/N

K3L_DDR_0_DQS_1_P/N

DC1_DQS0 / DQS0B

DC1_DQS1 / DQS1B

DC1_DQS2 / DQS2B

DC1_DQS3 / DQS3B

K3L_DDR_0_DQ [0:15]

K3L_DDR_0_DQ [16:31]

DC1_DQ [0:15]

DC1_CLK / CLKB

DC1_CKE

A[0:14]

BA[0:2]

ODT

RAS/CAS

WEN

LDQS/~LDQS

DDR3 IC400

CK / ~CK

CKE

UDQS/~UDQS

DC1_DQ [16:31]

DQ[0:15]

A[0:14]

BA[0:2]

ODT

RAS/CAS

WEN

DDR3 IC401

LDQS/~LDQS

CK / ~CK

CKE

UDQS/~UDQS

DQ[0:15]

K3L_DDR_0_DQS_2_P/N

K3L_DDR_0_DQS_3_P/N

1k ohm

DC1_CSB

K3L_DDR_0_CON_CS 0

~CS

~CS DC1_CSB_1

K3L_DDR_0_CON_CS 1

11. DDR Block

- 23 -

Only training and service purposes.

LDO DCDC

D13.2V

3.5V ST

IC2305

MICOM

IR h˅

RS-232

WiFi Module

FET

FET(Q4101)

SoC(STB3V3_1)

L311

FET(Q203)

SoC(STB3V3_2)

1V WOL

IC2307

SoC(Ethernet)

FET(Q202) L300 SoC(USB1V0)

L302 SoC(LV1V0)

L305 SoC(HDRX1V0)

1.5V DDR

3.5A

IC2303

DDR3(IC401)

DDR3(IC402)

FET(Q201)

SoC(LV1V5_1~2) L303

SoC(CPU1V0)

D1V0

10A

IC2302

SoC(C01V0)

FET(Q1101)

SubPMIC(IC9300)

Panel_VCC

L1100

SoC(DDR)

L400

DDR VTT

0.75V, 1.5A

IC410

Tuner(+3.5V_ST)

L6504

PMIC(IC9200)

12. K3Lp Power Block

- 24 -

Only training and service purposes.

D13.2V

3.3V NORM

IC2300

CI Detect

HP Amp

NVRAM

SPDIF OUT

Pull up

SoC(HDRX3V3)

FET(Q302)

SoC(D3V3,A3V3)

L306

1.8V

IC2301

L2305

SoC(EMMC1V8)

EMMC VCCQ

EMMC VCC

L2304

Demod

Core

IC6900

2.5V

IC6800

Tuner Demod

Tuner 2.5V

Audio Amp

L5801

BCAS

L6401

Tuner (+3.3V_TU)

L6505

Tuner (LNB)

L7001

Tuner (+3.3V_TU) L6503

5V NORM

IC2500

USB1 OCP

USB2 OCP

EDID EEPROM

CI OCP & CI IF

L6400 BCAS(Japan)

A13.2V

Audio Amp

*Japan Only

13. K3Lp Power Block2

- 25 -

Only training and service purposes.

LV1

LV2

700

A10

700

AR1

ARC1

AR2

200

820

530

800

540

521

400

120

121

500

570

571

810

910

900

200A

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

- 26 -

Only training and service purposes.

DISASSEMBLY GUIDE

2. Disassemble Back Cover

- When it is Latch decomposition as shown in the figure below, and then decomposed by grasping the portions.

- caution : Hook can be separated on the top position,

don’t pull it hard for upward

Grip for disassembling B/C

Back Cover Bottom

In case it disassemble hard, you can use tool like a driver.

Insert driver into rectangle hole for disassembling B/C

1. After Screw Disassemble, please remove B/C from Module

- 27 -

Only training and service purposes.

4. Separate connectors (“6”) from Main/Power PCB and module.

Separate Speaker(“7”: 2EA) from module.

3. Detach the Tape(“5” )

- 28 -

Only training and service purposes.

6. Detach the Insulation Sheet.(“10” ).

5. Unlock screw (“8”: 18EA) to separate from module.

* 1 pole Stand Supporter (“9”: 2EA) is applied on 1pole Stand type.

8 8

- 29 -

Only training and service purposes.

8. Separate connectors (“16”) from wifi PCB(“18”).

Separate wifi PCB(“18”) from Wifi Bracket of Latch(“17”).

16 17

7. Separate connectors (“13”) from IR PCB(“12”).

Lift the latch (“14”) to the upside and push the button(15) for separation .

14 14

- 30 -

Only training and service purposes.

10. Separate Stand body top(“27”) from Stand Base(“28”).

9. Detach the foot rubber(“22”: 7EA) from 1pole Stand Assy (“21”).

Unlock screw (“22”: 12EA) from 1pole Stand Assy (“21”). Separate Stand

Pipe(“25”) and Metal Stand Neck(“26”) from 1pole Stand Assy (“21”).

22 22

24 24

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