LG 47SL90QD-SA Schematic

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LJ91L
MODEL : 47SL90QD
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL61862417 (0911-REV01)
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Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................10
EXPLODED VIEW .................................................................................. 17
SVC. SHEET ...............................................................................................
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1Mand 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical specification
4.1 General Specification
1. Application range
This specification is applied to the LCD TV used LJ91L chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3)
Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC: CE, IEC specification
No Item Specification Remark
1.
Receiving System
1) SBTVD / NTSC / PAL-M / PAL-N
2.
Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz
4. Market Cent 42 inch Wide(1920x1080)
47 inch Wide(1920x1080)
LC420WUL-SBT1 LC470WUL-SBT1
42SL90QD-SA 47SL90QD-SA
42SL90QD-SA 47SL90QD-SA
ral and South AMERICA
5.
Screen Size
6. Aspect Ratio 16:9
7. Tuning System FS
8.
Module
9.
Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10.
Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
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5. Chromiance & Luminance spec.
No Item Min Typ Max Unit Remark
Module cd/m
2
White brightness
294 368
2.
1.
3.
Luminance uniformity 77 % Full white
0.640
0.331
4.
5.
RED
0.282
0.634
6.
7.
GREEN
0.151
8.
9.
BLUE
0.279
10.
Color coordinate
WHITE
Y
X
Y
X
Y
X
Y
X
Typ.
-0.03
0.292
Typ.
+0.03
11.
12.
Color coordinate uniformity N/A
900 1300 Contrast ratio
Cool
-0.015
Typ.
0.269
0.273
Typ. +0.015
Standard
-0.015
Typ.
Typ.
0.285
0.293
Typ. +0.015
13. Color Temperature
Warm
-0.015
0.313
0.329
Typ. +0.015
<Test Condition> 85% Full white pattern
** The W/B Tolerance is –0.015 for Adjustment
Dynamic contrast : off Dynamic color : off OPC : off
14. Color Distortion, DG 10.0 %
15. Color Distortion, DP 10.0 deg
16. Color S/N, AM/FM 43.0 dB
17. Color Killer Sensitivity -80 dBm
6. Component Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.47 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.500 60 148.50 HDTV 1080P
10. 1920*1080 67.432 59.939 148.352 HDTV 1080P
11. 1920*1080 27.000 24.000 74.25 HDTV 1080P
12. 1920*1080 26.97 23.94 74.176 HDTV 1080P
13. 1920*1080 33.75 30.000 74.25 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P
15. 1920*1080 56.25 50.000 148.5 HDTV 1080P
16. 1920*1080 28.125 25.000 74.25 HDTV 1080P
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7. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X O O O O O O O O O O
2. 720*400 31.469 70.08 28.32 DOS
3. 640*480 31.469 59.94 25.17 VESA(VGA)
4. 800*600 35.156 56.25 36.00 VESA(SVGA)
5. 800*600 37.879 60.31 40.00 VESA(SVGA)
6. 1024*768 48.363 60.00 65.00 VESA(XGA)
7. 1280*768 47.776 59.870 79.5 CVT(WXGA)
8. 1360*768 47.712 60.015 85.50 VESA (WXGA)
9. 1280*1024 63.981 60.020 108.00 VESA
10. 1600*1200 75.00 60.00 162 VESA (UXGA)
11 1920*1080 67.5 60 148.5 HDTV 1080P
** RGB PC Monitor Range Limits
- Min Vertical Freq - 56 Hz
- Max Vertical Freq - 62 Hz
- Min Horiz. Freq - 30 kHz
- Max Horiz. Freq - 80 kHz
- Pixel Clock - 170 MHz
8. HDMI Input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
PC DDC
1 640*350 31.468 70.09 25.17 EGA X
O O O O O O O O O O
2 720*400 31.469 70.08 28.32 DOS 3 640*480 31.469 59.94 25.17 VESA(VGA) 4 800*600 35.156 56.25 36.00 VESA(SVGA) 5 800*600 37.879 60.31 40.00 VESA(SVGA) 6 1024*768 48.363 60.00 65.00 VESA(XGA) 7 1280*768 47.776 59.870 79.5 CVT(WXGA) 8 1360*768 47.712 60.015 85.50 VESA (WXGA) 9 1280*1024 63.981 60.020 108.00 VESA (SXGA) 10 1600*1200 75.00 60.00 162 VESA (UXGA) 11 1920*1080 66.587 59.934 138.5 HDTV 1080P DTV 1 720*480 31.47 60 27.027 SDTV 480P 2 720*480 31.47 59.94 27.00 SDTV 480P 3 1280*720 45.00 60.00 74.25 HDTV 720P 4 1280*720 44.96 59.94 74.176 HDTV 720P 5 1920*1080 33.75 60.00 74.25 HDTV 1080I 6 1920*1080 33.72 59.94 74.176 HDTV 1080I 7 1920*1080 67.500 60 148.50 HDTV 1080P 8 1920*1080 67.432 59.939 148.352 HDTV 1080P 9 1920*1080 27.000 24.000 74.25 HDTV 1080P 10 1920*1080 26.97 23.94 74.176 HDTV 1080P 11 1920*1080 33.75 30.000 74.25 HDTV 1080P 12 1920*1080 33.71 29.97 74.176 HDTV 1080P
17. 1920*1080 56.25 50.000 148.5 HDTV 1080P
18. 1920*1080 28.125 25.000 74.25 HDTV 1080P
** HDMI Monitor Range Limits
- Min Vertical Freq - 56 Hz
- Max Vertical Freq - 62 Hz
- Min Horiz. Freq - 30 kHz
- Max Horiz. Freq - 80 kHz
- Pixel Clock - 170 MHz
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9. Consignment Setting (OUTGOING CONDITION)
No Item Condition
1. Input Mode TV02CH
2. Volume Level 10
3. Mute Off
4. Aspect Ratio 16:9
5. System Color PAL-M
6 Booster On
Picture Mode Vivid
Backlight Contrast Brightness Sharpness Color 70
70
0
0
100 100 50
Tint
Color Temperature Cool
7. Picture
Picture Reset Sound Mode Standard Auto Volume Off Clear Voice Off SRS TruSurround XT Off Balance
8. Audio
TV Speaker On
On
Clock Auto9. Time Off Timer / On Timer Sleep Timer / Auto Sleep
Off
Language (Menu/Audio) Portugues SimpLink Key Lock Off
Off
Caption
10. Option
Set ID 1
11. Channel Memory RF : 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13,
14, 30, 51, 63 CATV : 15, 16, 17
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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied all of the LJ91T LCD TV models, which produced in manufacture department or similar LG TV factory.
2. Notice
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.
2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs. .
3) The adjustment must be performed in the circumstance of 25 ±5°C of temperature and 65±10% of relative humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100~220V, 50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes.
• After Receive 100% Full white pattern (06CH) then process Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
• How to make set white pattern
1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select “8. Test pattern” and, after select “White” using navigation button, and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any
pattern generator
* Notice: if you maintain one picture over 20 minutes
(Especially sharp distinction black with white pattern – 13Ch, or Cross hatch pattern – 09Ch) then it can appear image stick near black level.
3. Adjustment Items
3.1 PCB Assembly adjustment
• CPLD DOWNLOAD
• Adjust 480i Comp1
• Adjust 1080p Comp1/RGB
- If it is necessary, it can adjustment at Manufacture Line
- You can see set adjustment status at “1. ADJUST
CHECK” of the “In-start menu”
3.2 Set Assembly Adjustment
• EDID (The Extended Display Identification Data ) / DDC (Display Data Channel) download
• Color Temperature (White Balance) Adjustment
• Make sure RS-232C control
• Selection Factory output option
4. PCB Assembly Adjustment
4.1. CPLD DOWNLOAD : JTAG MODE
4.2. << PRINT PORT >> PIN MAP
Pin JTAG Mode Signal Name
2 TCK 3 TMS
8 TDI 11 TDO 13 ­15 VCC
18 TO 25 GND
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4.3. << 10P WAFER >> PIN MAP
- 12 -
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4.4. Using RS-232C
Adjust 3 items at 3.1 PCB assembly adjustments “4.1.3
sequence” one after the order.
O Adjustment protocol
See ADC Adjustment RS232C Protocol_Ver1.0
O Adjustment protocol
- Pattern Generator : (MSPG-925FA)
- Adjust 480i Comp1 (MSPG-925FA : model :209 , pattern : 65)
- Adjust 1080p Comp1/RGB(MSPG-925FA:model : 225 , pattern : 65)
- Adjust RGB (MSPG-925FA:model :225 , Pattern :65) – RGB-PC Mode
* If you want more information then see the below Adjustment method (Factory Adjustment)
O Adjustment sequence
- ad 00 00 : Enter the ADC Adjustment mode.
- xb 00 40: Change the mode to Component1 (No actions)
- ad 00 10: Adjust 480i Comp
- ad 00 10: Adjust 1080p Comp
- xb 00 60: Change to RGB-PC mode(No action)
- ad 00 10: Adjust 1080p RGB
- ad 00 90: End of the adjustment
Order
Command
Set response
1. Inter the ad 00 00 d 00 OK00x Adjustment mode
2. Change the kb 00 40
b 00 OK40x (Adjust 480i Comp1/1080p Comp1)
Source kb 00 60
b 00 OK60x (Adjust 1080p RGB)
3.
Start Adjustment
ad 00 10
4.Return the OKx ( Success condition ) Response NGx ( Failed condition )
5.Read (main)
(main : component1 480i, RGB 1080p)
Adjustment data
ad 00 20
000000000000000000000000007c007b006dx (main) (main : component1 1080p) ad 00 30
000000070000000000000000007c00830077x
6.Confirm ad 00 99 NG 03 00x (Failed condition) Adjustment NG 03 01x (Failed condition)
NG 03 02x (Failed condition) OK 03 03x (Success condition)
7.
End of Adjustment
ad 00 90 d 00 OK90x
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5. Factory Adjustment
5.1 Manual Adjust Component 480i/1080p RGB 1080p
O Summary : Adjustment component 480i/1080i and RGB
1080p is Gain and Black levelsetting at Analog to Digital converter, and compensate the RGB deviation
O Using instrument
- Adjustment remocon, 801GF(802B, 802F, 802R) or MSPG925FA pattern generator (It can output 480i/1080i horizontal 100% color bar pattern signal, and its output level must setting 0.7V±0.1V p-p correctly)
<Pic.4 Adjustment pattern : 480i / 1080p 60Hz Pattern >
* You must make it sure its resolution and pattern cause every
instrument can have different setting
O Adjustment method 480i Comp1, Adjust 1080p
Comp1/RGB (Factory adjustment)
• ADC 480i Component1 adjustment
- Check connection of Component1
- MSPG-925FA Ë Model: 209, Pattern 65
• Set Component 480i mode and 100% Horizontal Color Bar Pattern(HozTV31Bar), then set TV set to Component1 mode and its screen to “NORMAL”
• ADC 1080p Component1 / RGB adjustment
- Check connection both of Component1 and RGB
- MSPG-925FA Model: 225, Pattern 65
• Set Component 1080p mode and 100% Horizontal Color Bar Pattern(HozTV31Bar), then set TV set to Component1 mode and its screen to “NORMAL”
• After get each the signal, wait more a second and enter the “IN-START” with press IN-START key of Service remocon. After then select “7. External ADC” with navigator button and press “Enter”.
• After Then Press key of Service remocon “Right Arrow(VOL+)”
• You can see “ADC Component1 Success”
• Component1 1080p, RGB 1080p Adjust is same method.
• Component 1080p Adjustment in Component1 input mode
• RGB 1080p adjustment in RGB input mode
• If you success RGB 1080p Adjust. You can see “ADC RGB-DTV Success”
5.2 EDID (The Extended Display Identification Data) / DDC (Display Data Channel) Download.
O Summary
• It is established in VESA, for communication between PC and Monitor without order from user for building user condition. It helps to make easily use realize “Plug and Play” function.
• For EDID data write, we use DDC2B protocol.
O Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
Caution: - Never connect HDMI & D-sub Cable when the user
downloading .
- Use the proper cables below for EDID Writing.
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O Manual Download
• Write HDMI EDID data
- Using instruments => Jig. (PC Serial to D-Sub connection) for PC, DDC
adjustment.
=> S/W for DDC recording (EDID data write and
read) => D-sub jack => Additional HDMI cable connection Jig.
- Preparing and setting. => Set instruments and Jig. Like pic.5), then turn on
PC and Jig. => Operate DDC write S/W (EDID write & read) => It will operate in the DOS mode.
Pic.3) For write EDID data, setting Jig and another instruments.
• EDID data for LJ91D Chassis (Model name = LG TV)
- HDMI-1 EDID table (0x3D, 0x2C)
- HDM2 EDID table (0x3D, 0x1C)
- HDMI-3 EDID table (0x3D, 0x0C)
- Analog (RGB) EDID table (0x9B, 0x25)
See Workig Guide of you want more information about EDID communication.
PC
VSC
B/D
Edid data and Model option download (RS232)
NO Item CMD 1 CMD 2 Data 0
Enter
download MODE
Download
Mode In
A E 0 0
When transfer the ’Mode In’ ,
Carry the command.
Edid data and Model option
download
Download
A E *Note1 *Note2
Automatically download
(The use of a internal Data)
Adjust Mode Out
A E 9 0
Adjustment
Confirmation
A E 9 9
To check Download
on Assembly line.
5.3 Adjustment Color Temperature (White balance)
O Using Instruments
• Color Analyzer: CA-210 (CH 9)
- Using LCD color temperature, Color Analyzer (CA-210) must use CH 9, which Matrix compensated (White, Red, Green, Blue compensation) with CS-2100. See the Coordination bellowed one.
• Auto-adjustment Equipment (It needs when Auto­adjustment – It is availed communicate with RS-232C : Baud rate: 115200)
• Video Signal Generator MSPG-925F 720p, 216Gray (Model: 217, Pattern 78)
O Connection Diagram (Auto Adjustment)
• Using Inner Pattern
• Using HDMI input
<Pic.5 Connection Diagram for Adjustment White balance> .
O White Balance Adjustment
If you can’t adjust with inner pattern, then you can adjust it using HDMI pattern. You can select option at "Ez-Adjust Menu – 7. White Balance" there items "NONE, INNER, HDMI". It is normally setting at inner basically. If you can’t adjust using inner pattern you can select HDMI item, and you can adjust.
In manual Adjust case, if you press ADJ button of service remocon, and enter "Ez-Adjust Menu – 7. White Balance", then automatically inner pattern operates. (In case of "Inner" originally "Inner" will be selected.
• Connect all cables and equipments like Pic.5)
• Set Baud Rate of RS-232C to 115200. It may set 115200 orignally.
• Connect RS-232C cable to set
• Connect HDMI cable to set
¢ RS-232C Command (Commonly apply)
wb 00 00 White Balance adjustment start. wb 00 10 Start of adjust gain (Inner white
pattern) wb 00 1f End of gain adjust wb 00 20 Start of offset adjust(Inner white
pattern) wb 00 2f End of offset adjust wb 00 ff End of White Balance adjust(Inner
pattern disappeared)
• "wb 00 00": Start Auto-adjustment of white balance.
• "wb 00 10": Start Gain Adjustment (Inner pattern)
• "jb 00 c0" :
• …
• "wb 00 1f": End of Adjustment * If it needs, offset adjustment (wb 00 20-start, wb 00
2f-end)
• "wb 00 ff": End of white balance adjustment (inner
pattern disappear)
- 15 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
CA-100+
COL OR ANALYZER TYPE; CA-100+
Full W hite Pattern
RS-232C
- 16 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
O White Balance Adjustment (Manual adjustment)
• Test Equipment: CA-210
- Using LCD color temperature, Color Analyzer (CA-
210) must use CH 9, which Matrix compensated (White, Red, Green, Blue compensation) with CS-
2100. See the Coordination bellowed one.
• Manual adjustment sequence is like bellowed one.
- Turn to "Ez-Adjust" mode with press ADJ button of service remocon.
- Select "10.Test Pattern" with CH+/- button and press enter. Then set will go on Heat-run mode. Over 30 minutes set let on Heat-run mode.
- Let CA-210 to zero calibration and must has gap more 10cm from center of LCD module when adjustment.
- Press "ADJ" button of service remocon and select "7.White-Balance" in "Ez-Adjust" then press "▶"
button of navigation key.
(When press "" button then set will go to full white
mode)
- Adjust at three mode (Cool, Medium, Warm)
- If "cool" mode Let B-Gain to 192 and R, G, B-Cut to 64 and then control R, G gain adjustment High Light adjustment.
- If "Medium" and "Warm" mode Let R-Gain to 192 and R, G, B-Cut to 64 and then control G, B gain adjustment High Light adjustment.
- All of the three mode Let R-Gain to 192 and R, G, B-Cut to 64 and then control G, B gain adjustment High Light adjustment.
- With volume button (+/-) you can adjust.
- After all adjustment finished, with Enter (key) turn to Ez-Adjust mode. Then with ADJ button, exit from
adjustment mode
Attachment: White Balance adjustment coordination and color temperature.
O Using CS-1000 Equipment.
- COOL : T=11000K, uv=0.000, x=0.276 y=0.283
- MEDIUM : T=9300K, uv=0.000, x=0.285 y=0.293
- WARM : T=6500K, uv=0.000, x=0.313 y=0.329
5.4 EYE-Q Function check.
1) Turn on TV
2) Press EYE Key of Adj R/C
3) Cover the Eye Q II sensor on the front of the using your hand and wait for 6 seconds
4) Confirm that R/G/B va;ie os ;pwer tjam 10 of the ‘Raw Data (Sensor data, Back light)”. If after 6 seconds, R/G/B value is not lower than 10, re[;ace EYE Q II sensor.
5) Remove your hand from the EYE Q II sensor and wait for 6 sencond
6) Confirm that “OK” pop up.
If change is not seen, replace EYE Q II sensor
5.5 Test of RS-232C control
Press IN-Start button of service remocon then set the “4.Baud rate” to 15200, Then check RS-232C control and
5.6 Selection of Country option.
Selection of country option is allowed only North American model (Not allowed Korean model). It is selection of Country about Rating and Time Zone.
• Models: All models which use LA75A Chassis (See the first page.)
• Press “In-Start” button of Service Remocon, then enter the “Option” Menu with “PIP CH-“ Button
• Select one of these three (USA, CANADA, MEXICO)
defends on its market using “Vol. +/-“button.
* Caution : Don’t push The Instop Key ater completing the
function inspection.
5.7 Check the Ginga(Data Broadcasting)
1) Turn on TV
2) Press the OK Button on the ADJ R/C
3) Check the Ginga icon
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
-17 -
300
200
801
521
540
530
803
802
550
910
920
900
810
560
310
500
510
120
122
400
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A2
LV1
A10
LV2
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
COMPONENT1
FIX-TER
11
10
9
8
7
6
5
4
JK1101
13
COMPONENT2
FIX-TER
11
10
9
8
7
6
5
4
JK1102
13
AV1
6
8
7
5
4
JK1103
R1151 0
[RD]MONO
R1152 0
[RD]MONO
5.1V
ZD1101
5.1V
ZD1103
5.1V
ZD1105
5.1V
ZD1107
5.1V
ZD1109
5.1V
ZD1111
5.1V
ZD1122
5.1V
ZD1124
5.1V
ZD1126
5.1V
ZD1128
5.1V
ZD1130
5.1V
ZD1132
5.1V
ZD1113
5.1V
ZD1115
5.1V
ZD1117
5.1V
ZD1119
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
C1101 100pF
50V
ZD1102
ZD1104
ZD1106
ZD1108
ZD1110
ZD1112
ZD1121
ZD1123
ZD1125
ZD1127
ZD1129
ZD1131
ZD1114
ZD1116
ZD1118
ZD1120
50V 27pF C1103
R1105
D3.3V
50V 27pF C1104
50V 27pF C1105
D3.3V
10K
10K
10K
C1102 100pF 50V
R1101
CM2012FR27KT
CM2012FR27KT
CM2012FR27KT
470 K
R11 03
470 K
R11 04
R1102
BCM RECOMMAND
CM2012FR27KT
50V 27pF C1107
CM2012FR27KT
50V 27pF C1108
CM2012FR27KT
50V 27pF C1109
470 K
R11 08
470 K
R11 09
D3.3V
C1106
0.1uF 16V
R1171 75
R11 06
470 K
25V
R11 07
470 K
L1101
C1112
C1113
C1110
25V
C1111
L1102
L1103
1uF
25V
1uF
25V
L1106
L1104
L1105
C1114
1uF
25V
C1115
1uF
25V
1uF
1uF
R1110 15
0 R11 14
0 R11 15
0 R11 16
0 R11 17
R11 12
R11 13
R1111
R1118 1K
50V 27pF C1116
1K
0
0
50V 27pF C1117
50V 27pF C1118
R1119 1K
27pF C1119
27pF C1120
27pF C1121
R1123
C1122 100pF
C1123 100pF
50V
50V
50V
C1126 100pF
15
R1124
R1125
50V
50V
R1120 15
R1121 15
R1122 15
SIDE AV
COMP1_DET
3:T21
D3.3V
R1134
5.1V
5.1V
5.1V
5.1V
ZD1133
ZD1135
ZD1137
ZD1139
R1172
75
R11 27
470 K
R11 28
470 K
2.7K
C1132
C1131
1uF 25V
1uF 25V
R1130 15
C1130
0.1uF 16V
R11 35
R11 36
R1137
0
0
1K
C1137 47pF 50V
C1135
100pF
C1136
100pF
SIDE_CVBS_DET 3:T19
SIDE_CVBS_IN 3:T19
SIDE_L_IN 3:T20
SIDE_R_IN 3:T20
3:T21
COMP1_Y_IN
P1101
12507WS-08L
15
15
COMP1_Pb_IN
3:T21
COMP1_Pr_IN
3:T20
COMP1_L_IN
3:T22
COMP1_R_IN
3:T21
COMP2_DET
3:T23
COMP2_Y_IN
3:T23
COMP2_Pb_IN
3:T22
9
R1129 0
1
2
3
4
5
R1131 0
6
7
R1150 0
8
5.1V
ZD1134
5.1V
ZD1136
5.1V
ZD1138
5.1V
ZD1140
PC AUDIO
JK1104
PEJ027-01
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
SHIELD_PLATE
8
5.1V
ZD1142
5.1V
ZD1144
5.1V
5.1V
ZD1141
ZD1143
R1132
470K
R1133
470K
C1133
1uF
25V
C1134
1uF
25V
R11 38
0
R11 39
0
3:T13
PC_R_IN 3:T13
PC_L_IN
C1127 100pF 50V
C1128 100pF 50V
COMP2_Pr_IN
3:T22
COMP2_L_IN
3:T23
COMP2_R_IN
3:T23
AV1_CVBS_DET
3:T18
SPDIF OPTIC JACK
C1124 47pF 50V
C1125
100pF
AV1_CVBS_IN
3:T18
AV1_L_IN
3:T18
AV1_R_IN
3:T18
SPDIF_OUT
G4;3:T12
ZD1145
OPT
5.6B
D3.3V
R1126
1K
+5V
C1129
0.1uF 50V
VINPUT
JK1105
JST1223-001
GND
VCC
1
2
3
Fib er O ptic
4
FIX_POLE
R,G,B PC&DDC
RGB_VSYNC
3:T14
D2A10D2B11Q312D3A13D3B14VCC
8Q29
6Q15
7
GND
RGB_HSYNC
3:T14
DSUB_B
3:T15
DSUB_G
3:T15
DSUB_R
3:T16
RS-232C
C1140
0.47uF 25V
C1138
0.1uF 50V
C1141
0.47uF 25V
C1139
0.47uF 25V
4
D1A
D1B
BCM Reference
IC1101
MAX3232CDR
C1+
1
V+
2
C1-
3
C2+
4
C2-
5
V-
6
DOUT2
7
RIN2
8
C1142
0.1uF
3Q02
R1140 100
R1141 100
+5V_ST
D1103
ENKMC2838-T112
A1
C
A2
E0
E1
E2
VSS
5.1V
5.1V
5.1V
5.1V
5.1V
5.1V
M24C02-RMN6T
D1101
30V
ZD1146
ZD1148
ZD1150
IC1103
1
2
3
4
8
7
6
5
D1102 ADUC30S03010L 30V
L1108 0
L1108-*1
BG1608B121F RGB_BEAD
L1109 0
L1109-*1
BG1608B121F RGB_BEAD
L1110
0
L1110-*1
BG1608B121F RGB-BEAD
JK1106
L1107
BLM18PG121SN1D
C1146
0.1uF 50V
R1146 0
R1147 0
R1148
100 OPT
R1149
100 OPT
VCC
WC
SCL
SDA
+5V_ST
RS232C_RxD
RS232C_TxD
50V
C1147
220pF
IR
3:T11
R1156
4.7K
4.7 K
R11 53
D1104
ADMC5M03200L
5.6V
RED2GREEN3BLUE4GND_15DDC_GND
RED_GND7GREEN_GND8BLUE_GND9NC10SYNC_GND
GND_212DDC_DATA13H_SYNC14V_SYNC15DDC_CLOCK
11
6
1
3:T12
3:T12
5.1V
R1154 0
R1155 10K
OPT
5.1V
ZD1153
OPT R1158
3.3K
B
ZD1152
+5V_ST
OPT
50V
C1148
220pF
R1159
10K OPT
R1157 22
5.1V
5.1V
ZD1155
US_Commercial
R1160 100K
C
Q1101 2SC3052
E
ZD1154
+5V
R1142
22
IC1102
74F08D
1
D0B
D0A
R1143
22
ADUC30S03010L
C1143 47pF 50V
ZD1147
C1144 47pF 50V
ZD1149
C1145 47pF 50V
ZD1151
SPG09-DB-010
4.7K
R1145
4.7K
R1144
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
R1163
22
R1173
0
OPT
0
OPT
R1162
50V 47pF C1149
US_Commercial
R1165
3.3K
B
R1161 100K
US_Commercial
C1151
0.1uF 50V
50V 47pF C1150
+5V_ST
0
R1164
R1166
0
D1105 ADMC5M03200L
5.6V
C1152 100pF 50V
SHILED
16
R1167
220
R1168
220
C
Q1102 2SC3052
US_Commercial
E
C1153
R1169
10K
4700pF
50V
+5V
EDID_WP 3:T16
DDC_SCL
3:T17
DDC_SDA
3:T17
1K
R1170
D1106 ADMC5M03200L
5.6V
JK1107
SPG09-DB-009
6
7
8
9
10
DSUB_DET
3:T16
1
2
3
4
5
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LEE GI YOUNG
BCM (BRAZIL VENUS)
IN - OUT
2009. 03. 23
1
15
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP
* HDMI CEC
+3.3V_HDMI
L602
BLM18PG121SN1D
C629
0.1uF
20
20
YKF45-7058V
JK501
20
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
D2+_HDMI2 D2-_HDMI2
D1+_HDMI2 D1-_HDMI2
D0+_HDMI2
D0-_HDMI2
CK+_HDMI2 CK-_HDMI2
DDC_SCL_2
DDC_SDA_2
HPD2
CEC_REMOTE
D3.3V
+3.3V_ST
6
5
4
R664
0
HDMI_SDA
C608
0.1uF
HDMI_SCL
68K
R666
Q601
SSM6N15FU
OPT
+3.3V_HDMI
R665
0
11:W17
11:W17
HDMI0_RXC-_BCM
HDMI0_RXC+_BCM
SOURCE1
1
GATE1
2
DRAIN2
3
C609
0.1uF
11:W16
11:W17
11:W17
11:W16
HDMI0_RX0-_BCM
HDMI0_RX1+_BCM
HDMI0_RX0+_BCM
HDMI0_RX1-_BCM
VSS_1 OUT_C+ OUT_C-
VDDO[3V3] OUT_DDC_CLK OUT_DDC_DAT
VSS_2
VDDC[1V8]_1
RXA_HPD
RXA_5V RXA_DDC_DAT RXA_DDC_CLK
RXA_C-
RXA_C+ VDDH[3V3]_1
RXA_D0­RXA_D0+
VSS_3 RXA_D1­RXA_D1+
VDDH[3V3]_2
RXA_D2­RXA_D2+
VDDH[1V8]_1
NC
C612
0.1uF
0.1uF
C610
0.1uF
11:W16
11:W16
HDMI0_RX2-_BCM
HDMI0_RX2+_BCM
OUT_D0-
100
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
26
27
TEST
VSS_4
R667
GND
C611
0.1uF
OUT_D1-
VSS_1299OUT_D0+
97
98
28
29
RXB_5V
RXB_HPD
9.1K
C613
VDDO[1V8]
OUT_D1+
96
30
RXB_DDC_DAT
RXB_DDC_CLK
12:F6
HDMI_CEC
C614
0.1uF
C615
0.1uF
D2-_HDMI4
D2+_HDMI4
RXD_D2-
RXD_D2+
VDDC[1V8]_3
VSS_1193OUT_D2+
OUT_D2-
89
90
91
92
94
95
IC601
TDA9996HL
31
32
34
35
37
VSS_5
RXB_C-33RXB_C+
RXB_D0-36RXB_D0+
VDDH[3V3]_3
D1-_HDMI4
D1+_HDMI4
VSS_1086RXD_D1-
RXD_D1+
VDDH[3V3]_8
85
87
88
38
40
41
RXB_D1-39RXB_D1+
RXB_D2-42RXB_D2+
VDDH[3V3]_4
D0-_HDMI4
D0+_HDMI4
RXD_D0-
RXD_D0+
83
84
43
VSS_6
CK+_HDMI4
CK-_HDMI4
RXD_DDC_CLK
RXD_DC-
RXD_DC+
VDDH[3V3]_7
79
80
81
82
44
45
46
47
MODE
CDEC_DDC
VDDC[3V3]
VDDC[1V8]_2
R668 0
R669
0
DDC_SCL_4
DDC_SDA_4
RXD_HPD
RXD_5V78RXD_DDC_DAT
76
77
48PD49
SDA/SEL150SCL/SEL0
R670 0
R671 0
5:G5;16:G14
SDA1_3.3V
HPD4
5V_HDMI_4
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
R672
R673
4.7K
R674
4.7K
SCL1_3.3V
5:G5;16:G14
Q16;AH18
JACK_GND
20
19
HPD
18
+5V_POWER
17
DDC/CEC_GND
16
SDA
15
SCL
14
NC
13
CEC
12
CLK-
11
CLK_SHIELD
10
CLK+
9
DATA0-
8
DATA0_SHIELD
7
DATA0+
6
DATA1-
5
DATA1_SHIELD
4
DATA1+
3
DATA2-
2
DATA2_SHIELD
1
DATA2+
KJA-ET-0-0032
JK503
P19;AJ15 5V_HDMI_2
R628
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
GND
L19;Z14 5V_HDMI_1
R618
R605 0
R606
R607
0
R616 0
0
R617
0
UI_HW_PORT2
R627 0
0
0
H17;R26;W27;AL11
AL11
HPD2
R18;AL12
DDC_SDA_2
R17;AL12
DDC_SCL_2
H8;R26;W27;AL11
CEC_REMOTE
AL12
CK-_HDMI2
AL12
CK+_HDMI2
AL13
D0-_HDMI2
AL13
D0+_HDMI2
AL13
D1-_HDMI2
AL13
D1+_HDMI2
AL14
D2-_HDMI2
AL14
D2+_HDMI2
Y13
HPD1
M18;X13
DDC_SDA_1
M17;X12
DDC_SCL_1
CEC_REMOTE
Y12
CK-_HDMI1
Y12
CK+_HDMI1
Y12
D0-_HDMI1
Y11
D0+_HDMI1
Y11
D1-_HDMI1
Y11
D1+_HDMI1
Y10
D2-_HDMI1
Y10
D2+_HDMI1
5V_HDMI_1
R634
47K
R635 47K
GND
DDC_SDA_1
DDC_SCL_1
5V_HDMI_4
R641 0
0
R642
R639 0
R643
0
SIDE_HDMI_PORT4
5V_HDMI_2
R656
R653
47K
47K
5V_HDMI_4
R657
R655
47K
47K
EDID Pull-up
AH19
R14;AG19
DDC_SDA_4
R13;AG19
DDC_SCL_4
H8;H17;W27;AL11
CEC_REMOTE
AG19
AG19
AF19
AF19
AF19
AF19
AE19
AE19
DDC_SDA_2
DDC_SCL_2
DDC_SDA_4
DDC_SCL_4
HPD4
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
CEC_REMOTE H8;H17;R26;AL11
DDC_SDA_1 DDC_SCL_1
0
R658
AVRL161A1R1NT
GND
CK-_HDMI1 CK+_HDMI1
D0-_HDMI1 D0+_HDMI1
D1-_HDMI1 D1+_HDMI1
D2-_HDMI1 D2+_HDMI1
+1.8V_HDMI
VR607
HPD1
D601
MMBD301LT1G
+5.0V
R662
1.8K
R661
1.8K
C607
0.1uF
+5.0V
C605
C604
0.1uF
5V_HDMI_1
0.1uF
DRAIN1
GATE2
SOURCE2
R663
C606
0.1uF
0
C616
0.1uF
VDDH[1V8]_2 R12K VSS_9 RXC_D2+ RXC_D2­VDDH[3V3]_6 RXC_D1+ RXC_D1­VSS_8 RXC_D0+ RXC_D0­VDDH[3V3]_5 RXC_C+ RXC_C­RXC_DDC_CLK RXC_DDCC_DAT RXC_5V RXC_HPD CEC VSS_7 VDDS[3V3] CDEC_STBY INT/HP_CTRL XTAL_OUT XTAL_IN
R675
C617
0.1uF
+3.3V_HDMI
OPT4.7K
OPT
OPT
0
OPT
+1.8V_AMP
R676 12K
+1.8V_HDMI
L601
BLM18PG121SN1D
C620
0.1uF
5V_HDMI_2
R677
0
R678 0
OPT
C619
0.1uF
C618
5.6nF
C623
0.1uF
C624
0.1uF
C625
0.1uF
C626
0.1uF
C627
0.1uF
+1.8V_HDMI
C628
C622
0.1uF
0.1uF
C621
0.1uF
Net Labels changed for HDMI2
3
2
1
YKF45-7058V
JK500
GND
UI_HW_PORT1
VARISTORS(VR500/501/502/503/504/505/506/507) on lines-HPD1/2/3/4 are all options in case HDMI Switch doesn’t support ’ESD protection’
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LEE GI YOUNG
HDMI S/W For MSTAR Platform
BCM (BRAZIL VENUS)
HDMI
2009.03.23
2
15
A B C D E F G H I J
IC503
D3.3V
AZ1117H-1.8TRE1(EH13A)
+1.8V_AMP
7
INPUT
3
2
C549
C548 10uF 10V
6
0.1uF 16V
OUTPUT
+24V
L511
MLB-201209-0120P-N2
5
4
3
ADJ/GND
1
+24V_AMP
GND
C551
C552
0.1uF
10uF 10V
16V
SPK_L+
SPK_L-
SPK_R+
SPK_R-
WAFER-ANGLE
5
4
3
2
1
P501
H3
SPEAKER_L
H3
H3
SPEAKER_R
H3
9:G7;9:I3;12:I4
+1.8V_AMP
+1.8V_AMP
L501
MLB-201209-0120P-N2
C501
10uF
10V
AMP_RST
9:G6
AUDIO_M_CLK
L502
R501
0
MLB-201209-0120P-N2
C502
C503
0.1uF 10uF
16V
6.3V
R502 100
C506
1000pF
50V
C504 100pF
50V
C505
0.1uF 16V
R504 0
0.1uF
C507 1000pF
50V
R503
3.3K
11:F7 11:F6 11:F7
9:I4;2:AH5 9:I4;2:AH5
D3.3V
L503
MLB-201209-0120P-N2
C508
BCM_I2S_DATA_OUT BCM_I2S_WORD_CLK
BCM_I2S_BIT_CLK
SDA1_3.3V SCL1_3.3V
C51 1
1uF 10V
+1.8V_AMP
C510 10uF
10V
C514
22000pF
50V
BST1A VDR1A RESET
AD DVSS_1 VSS_IO
CLK_I
VDD_IO
DGND_PLL AGND_PLL
LFM AVDD_PLL DVDD_PLL
TEST0
C513
0.1uF 16V
R505 100 R506 100 R507 100 R508 100 R509 100
OUT1A_2
PGND1A_1
PGND1A_2
54
55
56 1 2 3 4 5 6 7
NTP-3100L
8 9 10 11 12 13 14
15
16
17
DVDD
SDATA
DVSS_2
C512 33pF 50V
+24V_AMP
C515
0.01uF 50V
OUT1B_2
PVDD1B_1
PVDD1B_2
PVDD1A_1
PVDD1A_2
OUT1A_1
49
50
51
52
53
IC501
EAN60664001
18
22
WCK19BCK20SDA21SCL
MONITOR_023MONITOR_124MONITOR_2
C517 33pF 50V
OPT
C509 33pF 50V
48
C51 8 1uF 10V
OUT1B_1
C520
0.1uF 50V
PGND1B_2
46
47
25
FAULT26VDR2B27BST2B
T_330uF_Capacitor
C522
0.1uF 50V
C519 22000pF
50V
C521 1uF 16V
VDR1B44BST1B45PGND1B_1
43
NC
42
VDR2A
41
BST2A
40
PGND2A_2
39
PGND2A_1
38
OUT2A_2
37
OUT2A_1
36
PVDD2A_2
35
PVDD2A_1
34
PVDD2B_2
33
PVDD2B_1
32
OUT2B_2
31
OUT2B_1
30
PGND2B_2
29
28
PGND2B_1
C553 330uF 35V
C52 3
1uF1 6V
R513
100
R511
3.3
C524 22000pF
50V
C525
22000pF
50V
C526
0.01uF 50V
AMP_MUTE
+24V_AMP
C527
0.01uF 50V
D501
1N4148W
100V
1N4148W
D502 100V
OPT
OPT
R518
5.6 C531
1000pF
50V
C532 1000pF
50V
R519
5.6
L504 DA-8580 EAP38319001
2S
1S 1F
22uH
2F
Change 22uH(L504,L505) TO 15uH/6.3mm After DV1
R520
5.6
C533 1000pF
50V
C534 1000pF
50V
R521
OPT
5.6
C529 330uF
T_330uF_Capacitor
R522
3.3
C535
0.01uF 50V
L505 DA-8580 EAP38319001
2S
1S 1F
22uH
2F
C528
0.1uF 50V
12:F3
D503
1N4148W
100V
D504
1N4148W
100V
C530
0.1uF 50V
OPT
C538
0.47uF 50V
C539
0.47uF 50V
C540
0.1uF 50V
C541
0.1uF 50V
C542
0.1uF 50V
C543
0.1uF
50V
SPK_L+
H5
SPK_L-
H5
SPK_R+
H4
SPK_R-
H4
R527
4.7K
3.3
R528
3.3
R524
C545
4.7K
0.01uF 50V
C546
0.01uF
R525
50V
4.7K R529
3.3
R530
3.3
R526
C547
4.7K
0.01uF 50V
L507
120-ohm
L508
120-ohm
L510
120-ohm
L509
120-ohm
C544
0.01uF 50V
R523
2A => 5A
MCLK SDATA WCK BCK TP is necessory
2
Monitor0_1_2 TP is necessory
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
KIM JONG HYUN
BCM (BRAZIL VENUS)
AUDIO
2009.03.23
3 15
A B C D E F G H I J
* FROM LIPS & POWER B/D -->Apply changed Pin Map
10uF 6.3V
14
13
12
11
10
9
8
A1.2V
DH
PN
GND_2
DL
DRV
NC
VCC
C1806
C1807
+12V
1uF
25V
0.1uF
L822
MLB-201209-0120P-N2
1N4148W
OPT C1819
0.1uF 50V
C1815 10uF
6.3V
C873 1uF
25V
D803
100V
Q812
SI4804BDY
S1
1
G1
2
S2
3
G2
C872
1uF
25V
4
* D1.8V
D3.3V
AZ1085S-ADJTR/E1
INPUT
3
C811
C876
100uF
0.1uF
16V
R819 56 1%
1.8V_BCM3556
D3.3V
L82 4
NC_2
4
VIN
MLB -201 209- 012 0P-N 2
0
R835
C858 33uF 10V
EN
NC_1
3
2
1
SC4215ISTRT
* +5v_ST to +3.3V_ST
+5V_ST
INPUT
C801 10uF
C803
0.1uF
16V
16V
+12V
R875
0
D1_2
8
D1_1
7
D2_2
6
D2_1
5
IC802
OUTPUT
2
1
ADJ/GND
1% R857
56
R2
Vout = (1+R2/R1)*1.25
5
6
7
8
IC803
IC801
AZ1117D-3.3TRE1
2
3
1
ADJ/GND
We’ll change SI4804 to KEC’s Product
L828
2.2uH
R861
C8780.1uF
3.3
C1809
10uF
25V
750 mA
1% R825
66.5
R1
330uF C818 4V
D1.8V
C879 470pF
C822
0.1uF
VOUT : 2.533V
D2.5V
NC_3
VO
L827
MLB-201209-0120P-N2
ADJ
GND
R840 39K
10uF 6.3V
C1803 33uF 10V
C1812
C1813 10uF 6.3V
16V
OUTPUT
C810
+3.3V_ST
22uF 16V
R841 18K
0.1uF
C814
R864
R862
5.6K
620
470pF
C1816 10uF
6.3V
C880
1K
R863
+5.0V
L812
MLB-201209-0120P-N2
C841
C840
1000pF
50V
10uF
0.1uF C836
* +1.8V_MEMC for FRC DDR
* +1.26V Core for FRC
A2.5V
+1.8V_MEMC
1K
R84 6
33uF 10V
A2[ GN]
A1[ RD]
C888
C
D805
SAM2333
* +12v -> PANEL_POWER
12:I5
PANEL_CTL
D3.3V
MLB-201209-0120P-N2
MLB-201209-0120P-N2
C1814
10uF
C88110uF
6.3V
C883
C882
16V
6.3V
6.3V
100uF
10uF
415 mA @85% efficiency
IC805
AOZ1073AIL
PGND
1
VIN
2
AGND
3
FB
4
R852 10K
R806
10K
R805 10K
C868 10uF
OPT
2SC3052
C870
0.1uF
10V
16V
R812
47K R810 22K
B
C
B
Q802
R811 22K
E
8
7
6
5
LX_2
LX_1
EN
COMP
NC_1
VIN
NC_2
+12V
47K R813
C
Q803 2SC3052
E
L829
L830
C885
C884
33uF
0.01uF
R843
R844
C846
330pF
IC807
SC4215ISTRT
1
EN
2
3
4
L801
CB3216PA501E
OPT C817
4.7uF 25V
A3.3V
C8860.1uF
SAM2333
400 mA + 600 mA
10K
L815
3.6uH
11K
50V
8
7
6
5
1S1
2G1
3S2
4G2
1uF 25V
C1811
+3.3V_MEMC
R876
1K
A2[GN]CA1[RD]
LD1
600 mA
GND
ADJ
VO
NC_3
Q804
SI4925BDY
C1817 10uF
R845
15K
R856
22K
C8870.1uF
C855
10uF
6.3V
R855
8 D1_2
7 D1_1
6 D2_2
5 D2_1
+1.8V_MEMC
R871
20K
+1.26V_MEMC
1%
12.4K
C875
10uF 6.3V
1uF 25V
C859
0.1uF
C1810
C877
10uF 6.3V
7:I5;7:I7
12V_TCON
C833 22uF 25V
C898
16V
0.1uF
+3.3V_ST
L806
MLB-201209-0120P-N2
C820
R817
15pF
OPT
33K
C838 1uF
25V
D802
1N4148W
100V
C837 1uF 25V
50V
CB4532UK121E
L807
100
S1
G1
S2
G2
R815
OPT
P801
N.C GND GND
GND 12V GND 24V N.C
N.C
L826
FM20020-24
1 3 5 7 9 11 13 15 17 19 21 23
25
DH
14
PN
13
GND_2
12
DL
11
DRV
10
NC
9
VCC
8
C832
25V
2 4 6
8 10 12 14 16 18 20 22 24
GND
+12V
1uF
POWER_ON GND GND
5.2V
5.2V GND 12V GND 24V Inverter_On Error_Out PWM_Dim
MLB-201209-0120P-N2
OPT C1818
0.1uF 50V
12:A3;A6;C4;F7;G7;I2;14:B2
L813
7
5.2V
5.2V
C824
C896 22uF
+12V
MLB-201209-0120P-N2
C828
0.1uF 50V
16V
C826
47uF
L808
0.1uF
25V
50V
OPT
A.Dim
6
L804
4.7K BG2012B080TF
R801
A_DIM
9:G6;9:I3
9:G7;9:I3;7:I5
5
PWM_DIM
OPC_OUT1
7:I5
C805
1uF 25V
OPT
R869
R822
OPT
C808
16V
0.1uF
OPT
0
C829
1uF 25V
0
OPT
R832
3.3K
4
C821
0.068uF
C830
R821
1.8K
2200pF
JP810
C895
0.1uF 50V
TruMotion_240Hz
BG2012B080TF
R834
150K 1/10W
IC806
SC2621ASTRT
BST
1
OCS
2
COMP
3
FB
4
LDOG
5
LDFB
6
GND_1
7
must be placed with pin#8,#10 as close as possible.
+5V_ST
E
C
Q805
B
R820
33K
RT1P141C-T112
Q807
2SC3875S(ALY)
+5V_ST
220uF ==> 100uF*2 + 22uF for Depth
C899
C827
100uF
100uF
16V
L805
CB4532UK121E
C812
0.1uF 50V
+5.0V
R818
3.3K
C
E
B
2SC3875S(ALY)
R816
6.8K
Q806 2SC3052
+12V
Q810
SI4804BDY
D1_2
8
1
D1_1
7
2
D2_2
6
3
D2_1
5
4
R823 1K
OPT
R829
R877
0
R828
B
10K OPT
OPT
C819
22uF
16V
+24V
C804 1uF 50V
+3.3V_ST
OPT R826 10K
R830 0
C
R870
Q813
OPT
0
10K
B
OPT
E
R802
C806
0.1uF 16V
OPT
C
E
C807 68uF 35V
R824 10K
R807
OPT
12:A3;A6;B5;F7;G7;I2;14:B2
0
C8450.1uF
C1802
10uF
25V
50V
0
C842 22uF
C802
16V
68uF 35V
R827 10K OPT
R837
3.3
2.2uH
C848 470pF
RL_ON
12:I5;14:E5
ERROR_OUT
12:F6
L819
INV_ON/OFF
12:I5
10K
R874
R849
1.1K
C856
6800pF
R854
10K
* +12V to +5.0V
R853
300
470pF
C851
C853
10uF 16V
C860
10uF 16V
R873
3.3K
C862
470pF
C863
C1808
100uF
+5.0V
16V
12:A3;2:Y20;2:Z10;B3;C6;H5;7:A3;14:I7;14:J1
10uF 16V
R859
330K 1/10W
IC809
SC2621ASTRT
BST
1
OCS
2
COMP
3
FB
4
LDOG
5
LDFB
6
GND_1
7
must be placed with pin#8,#10 as close as possible.
C1801
0.01uF
3
+5.0V
25V
1uF
L811
C835 1uF
MLB-201209-0120P-N2
25V
D801 1N4148W 100V
25V
1uF
C1800
S1
G1
S2
G2
Q809
SI4804BDY
1
2
3
4
8
7
6
5
+5V_ST
D1_2
D1_1
D2_2
D2_1
* +5.0V to 1.2V
D1.2V
0
R878
22uF
16V
C839
C8440.1uF
R836
C847
2.2uH
3.3
470pF
L817
R842
R847
R848
2K
200
1.5K
R872
C1804
1.2K
470pF
C852
C854
10uF 6.3V
330uF 4V
L821
MLB-201209-0120P-N2
0.01uF
C861
C865
R831
6.8K
2
C815
2200pF
C825
R814
15K 1%
220pF
BST
OCS
COMP
FB
LDOG
LDFB
GND_1
R833
390K 1/8W
IC804
SC2621ASTRT
1
2
3
4
5
6
7
DH
14
PN
13
GND_2
12
DL
11
DRV
10
NC
9
VCC
8
C1805
1
FLASH, A1.2, +1.8_DDR_BCM3556, VTT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AN SO YOUNG
BCM (BRAZIL VENUS) 2009.03.23
POWER
154
A B C D E F G H I J
D1.8V
D1.8V
C329
C324
7
C305
100uF
C306
10uF
C307
0.1uF
C308
0.01uF
C309
0.047uF
C310
2700pF
C311
470pF
C312
10uF
C313
0.1uF
C314
0.01uF
C315
0.047uF
C316
2700pF
C317
470pF
C349
0.1uF
C350
0.1uF
C351
0.1uF
C323
100uF
10uF
C325
0.1uF
C326
0.01uF
C327
0.047uF
C328
2700pF
470pF
C330
10uF
C331
0.1uF
A1.2V
IC100
BCM3556
A6
DDR_BVDD0
A24
DDR_BVDD1
B7
DDR_BVSS0
B24
DDR_BVSS1
DDR01_CKE
DDR_COMP
DDR01_ODT
DDR0_CLK
DDR0_CLKB
DDR1_CLK DDR1_CLKB DDR01_A00 DDR01_A01 DDR01_A02 DDR01_A03
DDR0_A04
DDR0_A05
DDR0_A06 DDR01_A07 DDR01_A08 DDR01_A09 DDR01_A10 DDR01_A11 DDR01_A12 DDR01_A13
DDR1_A04
DDR1_A05
DDR1_A06 DDR01_BA0 DDR01_BA1 DDR01_BA2
DDR01_CASB
DDR0_DQ00 DDR0_DQ01 DDR0_DQ02 DDR0_DQ03 DDR0_DQ04 DDR0_DQ05 DDR0_DQ06 DDR0_DQ07 DDR0_DQ08 DDR0_DQ09 DDR0_DQ10 DDR0_DQ11 DDR0_DQ12 DDR0_DQ13 DDR0_DQ14 DDR0_DQ15 DDR1_DQ00 DDR1_DQ01 DDR1_DQ02 DDR1_DQ03 DDR1_DQ04 DDR1_DQ05 DDR1_DQ06 DDR1_DQ07 DDR1_DQ08 DDR1_DQ09 DDR1_DQ10 DDR1_DQ11 DDR1_DQ12 DDR1_DQ13 DDR1_DQ14 DDR1_DQ15
DDR0_DM0
DDR0_DM1
DDR1_DM0
DDR1_DM1 DDR0_DQS0
DDR0_DQS0B
DDR0_DQS1
DDR0_DQS1B
DDR1_DQS0
DDR1_DQS0B
DDR1_DQS1
DDR1_DQS1B DDR01_RASB
DDR_VREF0 DDR_VREF1 DDR01_WEB
F20 B23
R312 0 B17 C22 E16 C23 B12 C12 A13 A12 B15 E14 A15 D15 E13 E12 F13 C14 F14 B14 D14 C13 D13 B13 F15 C15 D16 F16 B16 E15 A17 A8 B11 B8 D11 E11 C8 C11 C9 D8 E10 E9 F11 F12 E8 D10 F8 C18 C20 A18 B21 C21 B18 B20 D18 E18 D21 F18 E20 A22 F17 B22 E17 A10 C10 A20 F19 B10 B9 F10 F9 B19 C19 E19 D19 C16 A7 A23
D1.8V
C17 C7 D22
C355
0.1uF
DDR_PLL_TEST
DDR_PLL_LDO
6
DDR_EXT_CLK
5
4
3
DDR_VDDP1P8_1 DDR_VDDP1P8_2
2
OPT
R313
240
DDR01_A[0] DDR01_A[1] DDR01_A[2] DDR01_A[3]
DDR0_A[4] DDR0_A[5]
DDR0_A[6] DDR01_A[7] DDR01_A[8] DDR01_A[9]
DDR01_A[10] DDR01_A[11] DDR01_A[12] DDR01_A[13]
DDR1_A[4]
DDR1_A[5]
DDR1_A[6]
DDR0_DQ[0] DDR0_DQ[1] DDR0_DQ[2] DDR0_DQ[3] DDR0_DQ[4] DDR0_DQ[5] DDR0_DQ[6] DDR0_DQ[7] DDR0_DQ[8] DDR0_DQ[9]
DDR0_DQ[10] DDR0_DQ[11] DDR0_DQ[12] DDR0_DQ[13] DDR0_DQ[14] DDR0_DQ[15]
DDR1_DQ[0] DDR1_DQ[1] DDR1_DQ[2] DDR1_DQ[3] DDR1_DQ[4] DDR1_DQ[5] DDR1_DQ[6] DDR1_DQ[7] DDR1_DQ[8] DDR1_DQ[9]
DDR1_DQ[10] DDR1_DQ[11] DDR1_DQ[12] DDR1_DQ[13] DDR1_DQ[14] DDR1_DQ[15]
C347
1uF
470pF
R301 22
C344
470pF
C3450.1uF C3460.1uF
DDR01_CKE
DDR01_ODT
DDR0_CLKb
DDR1_CLKb
DDR01_BA0 DDR01_BA1 DDR01_BA2
DDR01_CASb
DDR0_DQS0b
DDR0_DQS1b
DDR1_DQS0b
DDR1_DQS1b
DDR01_RASb
DDR0_CLK
DDR1_CLK
DDR0_DM0 DDR0_DM1 DDR1_DM0 DDR1_DM1
DDR0_DQS0
DDR0_DQS1
DDR1_DQS0
DDR1_DQS1
E5;H5;I1
E5;H5;I2
E5;H5;I1
E5 E5 H5 H5
E4 E4 H4 H4 E4 E4 E4 E4 H4 H4 H4 H4
DDR0_VREF0
DDR01_A[0-3]
DDR0_A[4-6]
DDR01_A[7-13]
DDR1_A[4-6]
DDR0_DQ[0-15]
DDR1_DQ[0-15]
DDR1_VREF0
E6;H6;H2
D6;H2
E6;H6;H2
H6;H1
G6
J6
NC_4/BA2
NC_5/A14 NC_6/A15
NC_3/A13
VREF
A10/AP
A11 A12
BA0 BA1
CKE
ODT
RAS CAS
LDQS UDQS
LDM UDM
LDQS UDQS
NC_1 NC_2
VSSDL
VDDL
HYNIX
IC300-*2
H5PS1G63EFR-20L
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3 M2 P7 R2
L2 L3 L1
CK
J8
CK
K8 K2
K9
CS
L8 K7 L7
WE
K3
F7 B7
F3 B3
E8 A8
R3 R7
A2 E2 R8
J7
J1
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
DQ5
H9
DQ6
F1
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
DQ12
D1
DQ13
D9
DQ14
B1
DQ15
B9
VDD_5
A1
VDD_4
E1
VDD_3
J9
VDD_2
M9
VDD_1
R1
VDDQ_10
A9
VDDQ_9
C1
VDDQ_8
C3
VDDQ_7
C7
VDDQ_6
C9
VDDQ_5
E9
VDDQ_4
G1
VDDQ_3
G3
VDDQ_2
G7
VDDQ_1
G9
VSS_5
A3
VSS_4
E3
VSS_3
J3
VSS_2
N1
VSS_1
P9
VSSQ_10
B2
VSSQ_9
B8
VSSQ_8
A7
VSSQ_7
D2
VSSQ_6
D8
VSSQ_5
E7
VSSQ_4
F2
VSSQ_3
F8
VSSQ_2
H2
VSSQ_1
H8
* DDR_VTT
B6;H6;H2;B5
ELPIDA
EDE1116ACBG-1J-E
VREF
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3
A10
M2
A11
P7
A12
R2
BA0
L2
BA1
L3
BA2
L1
CK
J8
CK
K8
CKE
K2
ODT
K9
CS
L8
RAS
K7
CAS
L7
WE
K3
LDQS
F7
UDQS
B7
LDM
F3
UDM
B3
LDQS
E8
UDQS
A8
NC_5
R3
NC_6
R7
NC_1
A2
NC_2
E2
NC_3
R8
VSSDL
J7
VDDL
J1
IC300-*1
B6;H2
DDR01_A[0-3,7-13]
DDR0_A[4-6]
B5;H5;I1 B5;H5;I1 B5;H5;I1
B6
B6
B6;H5;I2
B6;H5;I1
B2;H5;I1 B5;H5;I1 B2;H5;I1
B3 B3
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
B3
DQ5
H9
DQ6
F1
B3
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
B3
DQ12
D1
DQ13
D9
B3
DQ14
B1
DQ15
B9
VDD_5
A1
VDD_4
E1
VDD_3
J9
VDD_2
M9
VDD_1
R1
VDDQ_10
A9
VDDQ_9
C1
VDDQ_8
C3
VDDQ_7
C7
VDDQ_6
C9
VDDQ_5
E9
VDDQ_4
G1
VDDQ_3
G3
VDDQ_2
G7
VDDQ_1
G9
VSS_5
A3
VSS_4
E3
VSS_3
J3
VSS_2
N1
VSS_1
P9
VSSQ_10
B2
VSSQ_9
B8
VSSQ_8
A7
VSSQ_7
D2
VSSQ_6
D8
VSSQ_5
E7
VSSQ_4
F2
VSSQ_3
F8
VSSQ_2
H2
VSSQ_1
H8
DDR_VTT
DDR01_BA0 DDR01_BA1 DDR01_BA2 DDR0_CLK
DDR0_CLKb DDR01_CKE
DDR01_ODT
DDR01_RASb DDR01_CASb DDR01_WEb
DDR0_DQS0 DDR0_DQS1
DDR0_DM0 DDR0_DM1
DDR0_DQS0b DDR0_DQS1b
DDR0_VREF0
C300
470pF
R300
C301
0.1uF
DDR01_A[0] DDR01_A[1] DDR01_A[2] DDR01_A[3] DDR0_A[4] DDR0_A[5] DDR0_A[6] DDR01_A[7] DDR01_A[8] DDR01_A[9] DDR01_A[10] DDR01_A[11] DDR01_A[12]
100
Qimonda
HYB18TC1G160C2F-1.9
VREF
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3
A10/AP
M2
A11
P7
A12
R2
BA0
L2
BA1
L3
BA2
L1
CK
J8
CK
K8
CKE
K2
ODT
K9
CS
L8
RAS
K7
CAS
L7
WE
K3
LDQS
F7
UDQS
B7
LDM
F3
UDM
B3
LDQS
E8
UDQS
A8
NC4
R3
NC5
R7
NC1
A2
NC2
E2
NC3
R8
VSSDL
J7
VDDL
J1
D3.3V
IC300
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
DDR0_DQ[0] DDR0_DQ[1] DDR0_DQ[2] DDR0_DQ[3] DDR0_DQ[4] DDR0_DQ[5] DDR0_DQ[6] DDR0_DQ[7] DDR0_DQ[8]
DDR0_DQ[9] DDR0_DQ[10] DDR0_DQ[11] DDR0_DQ[12] DDR0_DQ[13] DDR0_DQ[14] DDR0_DQ[15]
G8 G2 H7 H3 H1 H9 F1 F9 C8 C2 D7 D3 D1 D9 B1 B9
D1.8V
VDD5
A1
VDD4
E1
VDD3
J9
VDD2
M9
VDD1
R1
VDDQ10
A9
VDDQ9
C1
VDDQ8
C3
VDDQ7
C7
VDDQ6
C9
VDDQ5
E9
VDDQ4
G1
VDDQ3
G3
VDDQ2
G7
VDDQ1
G9
VSS5
A3
VSS4
E3
VSS3
J3
VSS2
N1
VSS1
P9
VSSQ10
B2
VSSQ9
B8
VSSQ8
A7
VSSQ7
D2
VSSQ6
D8
VSSQ5
E7
VSSQ4
F2
VSSQ3
F8
VSSQ2
H2
VSSQ1
H8
DDR01_WEb
C359
C361
C360
C343
C358
1uF
C342
470pF
1uF
470pF
1uF
C869 100uF
16V
C874 10uF 10V
C864
0.1uF 16V
DDR1_VREF0
DDR0_VREF0
R850 0
R851 0
C834
C831
0.1uF 16V
0.1uF 16V
1M
R858
C866
0.1uF 16V
BD35331F-E2
GND
1
EN
2
VTTS
3
VREF
4
IC808
D1.8V
VTT
8
VTT_IN
7
VCC
6
VDDQ
5
C897
0.1uF 16V
C871 1uF
6.3V
C867 100uF 16V
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HONG YEON HYUK
C332
0.01uF
C333
0.047uF
C334
C335
2700pF
DDR0_DQ[0-15]
470pF
A10/AP
NC_4/BA2
NC_5/A14 NC_6/A15
NC_3/A13
VSSDL
VREF
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9
A11 A12
BA0 BA1
CK CK
CKE
ODT
CS RAS CAS
WE
LDQS UDQS
LDM UDM
LDQS UDQS
NC_1 NC_2
VDDL
C352
C353
0.1uF
B4
B6;E6;H2;B5
B5;H1
HYNIX
IC301-*2
H5PS1G63EFR-20L
J2
M8 M3 M7 N2 N8 N3 N7 P2 P8 P3 M2 P7 R2
L2 L3 L1
J8 K8 K2
K9 L8 K7 L7 K3
F7 B7
F3 B3
E8 A8
R3 R7
A2 E2 R8
J7
J1
0.1uF
C354
0.1uF
DDR01_A[0-3,7-13]
DDR1_A[4-6]
B5;E5;I1 B5;E5;I1 B5;E5;I1
B6;E5;I2
B6;E5;I1
B2;E5;I1
B5;E5;I1 B2;E5;I1
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
DQ5
H9
DQ6
F1
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
DQ12
D1
DQ13
D9
DQ14
B1
DQ15
B9
VDD_5
A1
VDD_4
E1
VDD_3
J9
VDD_2
M9
VDD_1
R1
VDDQ_10
A9
VDDQ_9
C1
VDDQ_8
C3
VDDQ_7
C7
VDDQ_6
C9
VDDQ_5
E9
VDDQ_4
G1
VDDQ_3
G3
VDDQ_2
G7
VDDQ_1
G9
VSS_5
A3
VSS_4
E3
VSS_3
J3
VSS_2
N1
VSS_1
P9
VSSQ_10
B2
VSSQ_9
B8
VSSQ_8
A7
VSSQ_7
D2
VSSQ_6
D8
VSSQ_5
E7
VSSQ_4
F2
VSSQ_3
F8
VSSQ_2
H2
VSSQ_1
H8
DDR1_VREF0
C321
470pF
DDR01_BA0 DDR01_BA1 DDR01_BA2
B6
DDR1_CLK
B6
DDR1_CLKb DDR01_CKE
R303
100
DDR01_ODT
DDR01_RASb DDR01_CASb DDR01_WEb
B3
DDR1_DQS0
B3
DDR1_DQS1
B3
DDR1_DM0
B3
DDR1_DM1
B3
DDR1_DQS0b
B3
DDR1_DQS1b
ELPIDA
IC301-*1
EDE1116ACBG-1J-E
VREF
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3
A10
M2
A11
P7
A12
R2
BA0
L2
BA1
L3
BA2
L1
CK
J8
CK
K8
CKE
K2
ODT
K9
CS
L8
RAS
K7
CAS
L7
WE
K3
LDQS
F7
UDQS
B7
LDM
F3
UDM
B3
LDQS
E8
UDQS
A8
NC_5
R3
NC_6
R7
NC_1
A2
NC_2
E2
NC_3
R8
VSSDL
J7
VDDL
J1
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
DQ5
H9
DQ6
F1
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
DQ12
D1
DQ13
D9
DQ14
B1
DQ15
B9
VDD_5
A1
VDD_4
E1
VDD_3
J9
VDD_2
M9
VDD_1
R1
VDDQ_10
A9
VDDQ_9
C1
VDDQ_8
C3
VDDQ_7
C7
VDDQ_6
C9
VDDQ_5
E9
VDDQ_4
G1
VDDQ_3
G3
VDDQ_2
G7
VDDQ_1
G9
VSS_5
A3
VSS_4
E3
VSS_3
J3
VSS_2
N1
VSS_1
P9
VSSQ_10
B2
VSSQ_9
B8
VSSQ_8
A7
VSSQ_7
D2
VSSQ_6
D8
VSSQ_5
E7
VSSQ_4
F2
VSSQ_3
F8
VSSQ_2
H2
VSSQ_1
H8
BCM recommends to remove this R
B5;E5;H5 B5;E5;H5 B2;E5;H5 B5;E5;H5 B5;E5;H5 B2;E5;H5 B6;E5;H5
Qimonda
IC301
C322
0.1uF
DDR01_A[0] DDR01_A[1] DDR01_A[2] DDR01_A[3] DDR1_A[4] DDR1_A[5] DDR1_A[6] DDR01_A[7] DDR01_A[8] DDR01_A[9] DDR01_A[10] DDR01_A[11] DDR01_A[12]
HYB18TC1G160C2F-1.9
VREF
J2
A0
M8
A1
M3
A2
M7
A3
N2
A4
N8
A5
N3
A6
N7
A7
P2
A8
P8
A9
P3
A10/AP
M2
A11
P7
A12
R2
BA0
L2
BA1
L3
BA2
L1
CK
J8
CK
K8
CKE
K2
ODT
K9
CS
L8
RAS
K7
CAS
L7
WE
K3
LDQS
F7
UDQS
B7
LDM
F3
UDM
B3
LDQS
E8
UDQS
A8
NC4
R3
NC5
R7
NC1
A2
NC2
E2
NC3
R8
VSSDL
J7
VDDL
J1
DDR01_A[0-3,7-13]
DDR0_A[4-6]
B6;E5;H5
DDR1_A[4-6]
DDR01_CKE
DDR01_BA1 DDR01_BA2 DDR01_RASb DDR01_BA0 DDR01_CASb DDR01_WEb DDR01_ODT
DQ0
G8
DQ1
G2
DQ2
H7
DQ3
H3
DQ4
H1
DQ5
H9
DQ6
F1
DQ7
F9
DQ8
C8
DQ9
C2
DQ10
D7
DQ11
D3
DQ12
D1
DQ13
D9
DQ14
B1
DQ15
B9
VDD5
A1
VDD4
E1
VDD3
J9
VDD2
M9
VDD1
R1
VDDQ10
A9
VDDQ9
C1
VDDQ8
C3
VDDQ7
C7
VDDQ6
C9
VDDQ5
E9
VDDQ4
G1
VDDQ3
G3
VDDQ2
G7
VDDQ1
G9
VSS5
A3
VSS4
E3
VSS3
J3
VSS2
N1
VSS1
P9
VSSQ10
B2
VSSQ9
B8
VSSQ8
A7
VSSQ7
D2
VSSQ6
D8
VSSQ5
E7
VSSQ4
F2
VSSQ3
F8
VSSQ2
H2
VSSQ1
H8
DDR1_A[4] DDR01_A[0] DDR01_A[1] DDR01_A[2]
DDR0_A[4] DDR0_A[5] DDR0_A[6] DDR01_A[3] DDR01_A[7] DDR01_A[8] DDR01_A[9] DDR01_A[10] DDR01_A[11] DDR01_A[12] DDR01_A[13]
DDR1_A[5] DDR1_A[6]
OPT
DDR1_DQ[0] DDR1_DQ[1] DDR1_DQ[2] DDR1_DQ[3] DDR1_DQ[4] DDR1_DQ[5] DDR1_DQ[6] DDR1_DQ[7] DDR1_DQ[8]
DDR1_DQ[9] DDR1_DQ[10] DDR1_DQ[11] DDR1_DQ[12] DDR1_DQ[13] DDR1_DQ[14] DDR1_DQ[15]
D1.8V
R304
R305
R306
R307
R31075 R308
R309
R31175
75
75
75
75
75
75
BCM (BRAZIL VENUS) 2009.03.23
DDR Memory
6 15
DDR_VTT
DDR1_DQ[0-15]
C336
0.01uF
C337
0.01uF
C338
0.01uF
C339
0.01uF
C340
0.01uF
C341
0.01uF
C362
0.1uF
B4
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