LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Page 4
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Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
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Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Electrical specification
4.1 General Specification
1. Application range
This specification is applied to the LCD TV used LJ91L
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3)
Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC: CE, IEC specification
No Item Specification Remark
1.
Receiving System
1) SBTVD / NTSC / PAL-M / PAL-N
2.
Available Channel 1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz
4. Market Cent
42 inch Wide(1920x1080)
47 inch Wide(1920x1080)
LC420WUL-SBT1
LC470WUL-SBT1
42SL90QD-SA
47SL90QD-SA
42SL90QD-SA
47SL90QD-SA
ral and South AMERICA
5.
Screen Size
6. Aspect Ratio 16:9
7. Tuning System FS
8.
Module
9.
Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
10.
Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
Page 7
- 7 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Chromiance & Luminance spec.
No Item Min Typ Max Unit Remark
Modulecd/m
2
White brightness
294368
2.
1.
3.
Luminance uniformity 77 % Full white
0.640
0.331
4.
5.
RED
0.282
0.634
6.
7.
GREEN
0.151
8.
9.
BLUE
0.279
10.
Color
coordinate
WHITE
Y
X
Y
X
Y
X
Y
X
Typ.
-0.03
0.292
Typ.
+0.03
11.
12.
Color coordinate uniformity N/A
9001300 Contrast ratio
Cool
-0.015
Typ.
0.269
0.273
Typ.
+0.015
Standard
-0.015
Typ.
Typ.
0.285
0.293
Typ.
+0.015
13. Color
Temperature
Warm
-0.015
0.313
0.329
Typ.
+0.015
<Test Condition>
85% Full white pattern
** The W/B Tolerance is
–0.015 for Adjustment
Dynamic contrast : off
Dynamic color : off
OPC : off
14. Color Distortion, DG 10.0 %
15. Color Distortion, DP 10.0 deg
16. Color S/N, AM/FM 43.0 dB
17. Color Killer Sensitivity -80 dBm
6. Component Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.47 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.0 SDTV 480P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1920*1080 33.75 60.00 74.25 HDTV 1080I
8. 1920*1080 33.72 59.94 74.176 HDTV 1080I
9. 1920*1080 67.500 60 148.50 HDTV 1080P
10. 1920*1080 67.432 59.939 148.352 HDTV 1080P
11. 1920*1080 27.000 24.000 74.25 HDTV 1080P
12. 1920*1080 26.97 23.94 74.176 HDTV 1080P
13. 1920*1080 33.75 30.000 74.25 HDTV 1080P
14. 1920*1080 33.71 29.97 74.176 HDTV 1080P
15. 1920*1080 56.25 50.000 148.5 HDTV 1080P
16. 1920*1080 28.125 25.000 74.25 HDTV 1080P
Page 8
- 8 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. RGB Input (PC)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
O
O
O
O
O
O
O
O
O
O
2. 720*400 31.469 70.08 28.32 DOS
3. 640*480 31.469 59.94 25.17 VESA(VGA)
4. 800*600 35.156 56.25 36.00 VESA(SVGA)
5. 800*600 37.879 60.31 40.00 VESA(SVGA)
6. 1024*768 48.363 60.00 65.00 VESA(XGA)
7. 1280*768 47.776 59.870 79.5 CVT(WXGA)
8. 1360*768 47.712 60.015 85.50 VESA (WXGA)
9. 1280*1024 63.981 60.020 108.00 VESA
10. 1600*1200 75.00 60.00 162 VESA (UXGA)
11 1920*1080 67.5 60 148.5 HDTV 1080P
** RGB PC Monitor Range Limits
- Min Vertical Freq - 56 Hz
- Max Vertical Freq - 62 Hz
- Min Horiz. Freq - 30 kHz
- Max Horiz. Freq - 80 kHz
- Pixel Clock - 170 MHz
8. HDMI Input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz)Proposed
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 10 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied all of the LJ91T LCD TV
models, which produced in manufacture department or similar
LG TV factory.
2. Notice
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order. But it is
flexible when its factory local problem occurs. .
3) The adjustment must be performed in the circumstance of
25 ±5°C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes.
• After Receive 100% Full white pattern (06CH) then process
Heat-run
(or “8. Test pattern” condition of Ez-Adjust status)
• How to make set white pattern
1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select “8. Test
pattern” and, after select “White” using navigation button,
and then you can see 100% Full White pattern.
* In this status you can maintain Heat-Run useless any
pattern generator
* Notice: if you maintain one picture over 20 minutes
(Especially sharp distinction black with white pattern –
13Ch, or Cross hatch pattern – 09Ch) then it can appear
image stick near black level.
3. Adjustment Items
3.1 PCB Assembly adjustment
• CPLD DOWNLOAD
• Adjust 480i Comp1
• Adjust 1080p Comp1/RGB
- If it is necessary, it can adjustment at Manufacture Line
- You can see set adjustment status at “1. ADJUST
CHECK” of the “In-start menu”
3.2 Set Assembly Adjustment
• EDID (The Extended Display Identification Data ) / DDC
(Display Data Channel) download
• Color Temperature (White Balance) Adjustment
• Make sure RS-232C control
• Selection Factory output option
4. PCB Assembly Adjustment
4.1. CPLD DOWNLOAD : JTAG MODE
4.2. << PRINT PORT >> PIN MAP
PinJTAG Mode Signal Name
2TCK
3TMS
8TDI
11TDO
1315VCC
18 TO 25GND
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.3. << 10P WAFER >> PIN MAP
Page 12
- 12 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.4. Using RS-232C
Adjust 3 items at 3.1 PCB assembly adjustments “4.1.3
000000000000000000000000007c007b006dx
(main)(main : component1 1080p)
ad 00 30
000000070000000000000000007c00830077x
6.Confirm ad 00 99 NG 03 00x (Failed condition)
AdjustmentNG 03 01x (Failed condition)
NG 03 02x (Failed condition)
OK 03 03x (Success condition)
7.
End of Adjustment
ad 00 90 d 00 OK90x
Page 13
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
5. Factory Adjustment
5.1 Manual Adjust Component 480i/1080p
RGB 1080p
O Summary : Adjustment component 480i/1080i and RGB
1080p is Gain and Black levelsetting at Analog
to Digital converter, and compensate the RGB
deviation
O Using instrument
- Adjustment remocon, 801GF(802B, 802F, 802R) or
MSPG925FA pattern generator (It can output 480i/1080i
horizontal 100% color bar pattern signal, and its output
level must setting 0.7V±0.1V p-p correctly)
* You must make it sure its resolution and pattern cause every
instrument can have different setting
O Adjustment method 480i Comp1, Adjust 1080p
Comp1/RGB (Factory adjustment)
• ADC 480i Component1 adjustment
- Check connection of Component1
- MSPG-925FA Ë Model: 209, Pattern 65
• Set Component 480i mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• ADC 1080p Component1 / RGB adjustment
- Check connection both of Component1 and RGB
- MSPG-925FA Model: 225, Pattern 65
• Set Component 1080p mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• After get each the signal, wait more a second and enter
the “IN-START” with press IN-START key of Service
remocon. After then select “7. External ADC” with
navigator button and press “Enter”.
• After Then Press key of Service remocon “Right
Arrow(VOL+)”
• You can see “ADC Component1 Success”
• Component1 1080p, RGB 1080p Adjust is same
method.
• Component 1080p Adjustment in Component1 input
mode
• RGB 1080p adjustment in RGB input mode
• If you success RGB 1080p Adjust. You can see “ADC
RGB-DTV Success”
5.2 EDID (The Extended Display
Identification Data) / DDC (Display Data
Channel) Download.
O Summary
• It is established in VESA, for communication between
PC and Monitor without order from user for building user
condition. It helps to make easily use realize “Plug and
Play” function.
• For EDID data write, we use DDC2B protocol.
O Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
Caution: - Never connect HDMI & D-sub Cable when the user
downloading .
- Use the proper cables below for EDID Writing.
Page 14
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
O Manual Download
• Write HDMI EDID data
- Using instruments
=> Jig. (PC Serial to D-Sub connection) for PC, DDC
adjustment.
=> S/W for DDC recording (EDID data write and
read)
=> D-sub jack
=> Additional HDMI cable connection Jig.
- Preparing and setting.
=> Set instruments and Jig. Like pic.5), then turn on
PC and Jig.
=> Operate DDC write S/W (EDID write & read)
=> It will operate in the DOS mode.
Pic.3) For write EDID data, setting Jig and another instruments.
• EDID data for LJ91D Chassis (Model name = LG TV)
- HDMI-1 EDID table (0x3D, 0x2C)
- HDM2 EDID table (0x3D, 0x1C)
- HDMI-3 EDID table (0x3D, 0x0C)
- Analog (RGB) EDID table (0x9B, 0x25)
See Workig Guide of you want more information about EDID
communication.
PC
VSC
B/D
Edid data and Model option download (RS232)
NO Item CMD 1 CMD 2Data 0
Enter
download MODE
Download
Mode In
A E 0 0
When transfer the ’Mode In’ ,
Carry the command.
Edid data and
Model option
download
Download
A E *Note1 *Note2
Automatically download
(The use of a internal Data)
Adjust Mode Out
A E 9 0
Adjustment
Confirmation
A E 9 9
To check Download
on Assembly line.
Page 15
5.3 Adjustment Color Temperature
(White balance)
O Using Instruments
• Color Analyzer: CA-210 (CH 9)
- Using LCD color temperature, Color Analyzer (CA-210)
must use CH 9, which Matrix compensated (White, Red,
Green, Blue compensation) with CS-2100. See the
Coordination bellowed one.
• Auto-adjustment Equipment (It needs when Autoadjustment – It is availed communicate with RS-232C :
Baud rate: 115200)
• Video Signal Generator MSPG-925F 720p, 216Gray
(Model: 217, Pattern 78)
O Connection Diagram (Auto Adjustment)
• Using Inner Pattern
• Using HDMI input
<Pic.5 Connection Diagram for Adjustment White balance> .
O White Balance Adjustment
If you can’t adjust with inner pattern, then you can adjust
it using HDMI pattern. You can select option at "Ez-Adjust
Menu – 7. White Balance" there items "NONE, INNER,
HDMI". It is normally setting at inner basically. If you can’t
adjust using inner pattern you can select HDMI item, and
you can adjust.
In manual Adjust case, if you press ADJ button of service
remocon, and enter "Ez-Adjust Menu – 7. White
Balance", then automatically inner pattern operates. (In
case of "Inner" originally "Inner" will be selected.
• Connect all cables and equipments like Pic.5)
• Set Baud Rate of RS-232C to 115200. It may set
115200 orignally.
• Connect RS-232C cable to set
• Connect HDMI cable to set
¢ RS-232C Command (Commonly apply)
wb0000White Balance adjustment start.
wb 0010Start of adjust gain (Inner white
pattern)
wb001fEnd of gain adjust
wb0020Start of offset adjust(Inner white
pattern)
wb002fEnd of offset adjust
wb00ffEnd of White Balance adjust(Inner
pattern disappeared)
• "wb 00 00": Start Auto-adjustment of white balance.
• "wb 00 10": Start Gain Adjustment (Inner pattern)
• "jb 00 c0" :
• …
• "wb 00 1f": End of Adjustment
* If it needs, offset adjustment (wb 00 20-start, wb 00
2f-end)
• "wb 00 ff": End of white balance adjustment (inner
pattern disappear)
- 15 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
CA-100+
COL OR
ANALYZER
TYPE; CA-100+
Full W hite Pattern
RS-232C
Page 16
- 16 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
O White Balance Adjustment (Manual adjustment)
• Test Equipment: CA-210
- Using LCD color temperature, Color Analyzer (CA-
210) must use CH 9, which Matrix compensated
(White, Red, Green, Blue compensation) with CS-
2100. See the Coordination bellowed one.
• Manual adjustment sequence is like bellowed one.
- Turn to "Ez-Adjust" mode with press ADJ button of
service remocon.
- Select "10.Test Pattern" with CH+/- button and press
enter. Then set will go on Heat-run mode. Over 30
minutes set let on Heat-run mode.
- Let CA-210 to zero calibration and must has gap more
10cm from center of LCD module when adjustment.
- Press "ADJ" button of service remocon and select
"7.White-Balance" in "Ez-Adjust" then press "▶"
button of navigation key.
(When press "▶" button then set will go to full white
mode)
- Adjust at three mode (Cool, Medium, Warm)
- If "cool" mode
Let B-Gain to 192 and R, G, B-Cut to 64 and then
control R, G gain adjustment High Light adjustment.
- If "Medium" and "Warm" mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- All of the three mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- With volume button (+/-) you can adjust.
- After all adjustment finished, with Enter (■ key) turn
to Ez-Adjust mode. Then with ADJ button, exit from
adjustment mode
Attachment: White Balance adjustment coordination and color
temperature.
O Using CS-1000 Equipment.
- COOL : T=11000K, △uv=0.000, x=0.276 y=0.283
- MEDIUM : T=9300K, △uv=0.000, x=0.285 y=0.293
- WARM : T=6500K, △uv=0.000, x=0.313 y=0.329
5.4 EYE-Q Function check.
1) Turn on TV
2) Press EYE Key of Adj R/C
3) Cover the Eye Q II sensor on the front of the using your
hand and wait for 6 seconds
4) Confirm that R/G/B va;ie os ;pwer tjam 10 of the ‘Raw
Data (Sensor data, Back light)”. If after 6 seconds, R/G/B
value is not lower than 10, re[;ace EYE Q II sensor.
5) Remove your hand from the EYE Q II sensor and wait for
6 sencond
6) Confirm that “OK” pop up.
If change is not seen, replace EYE Q II sensor
5.5 Test of RS-232C control
Press IN-Start button of service remocon then set the “4.Baud
rate” to 15200, Then check RS-232C control and
5.6 Selection of Country option.
Selection of country option is allowed only North American model
(Not allowed Korean model). It is selection of Country about
Rating and Time Zone.
• Models: All models which use LA75A Chassis (See the first
page.)
• Press “In-Start” button of Service Remocon, then enter the
“Option” Menu with “PIP CH-“ Button
• Select one of these three (USA, CANADA, MEXICO)
defends on its market using “Vol. +/-“button.
* Caution : Don’t push The Instop Key ater completing the
function inspection.
5.7 Check the Ginga(Data Broadcasting)
1) Turn on TV
2) Press the OK Button on the ADJ R/C
3) Check the Ginga icon
Page 17
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
-17 -
300
200
801
521
540
530
803
802
550
910
920
900
810
560
310
500
510
120
122
400
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
VARISTORS(VR500/501/502/503/504/505/506/507) on lines-HPD1/2/3/4 are all options
in case HDMI Switch doesn’t support ’ESD protection’
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LEE GI YOUNG
HDMI S/W For MSTAR Platform
BCM (BRAZIL VENUS)
HDMI
2009.03.23
2
15
Page 20
ABCDEFGHIJ
IC503
D3.3V
AZ1117H-1.8TRE1(EH13A)
+1.8V_AMP
7
INPUT
3
2
C549
C548
10uF
10V
6
0.1uF
16V
OUTPUT
+24V
L511
MLB-201209-0120P-N2
5
4
3
ADJ/GND
1
+24V_AMP
GND
C551
C552
0.1uF
10uF
10V
16V
SPK_L+
SPK_L-
SPK_R+
SPK_R-
WAFER-ANGLE
5
4
3
2
1
P501
H3
SPEAKER_L
H3
H3
SPEAKER_R
H3
9:G7;9:I3;12:I4
+1.8V_AMP
+1.8V_AMP
L501
MLB-201209-0120P-N2
C501
10uF
10V
AMP_RST
9:G6
AUDIO_M_CLK
L502
R501
0
MLB-201209-0120P-N2
C502
C503
0.1uF
10uF
16V
6.3V
R502
100
C506
1000pF
50V
C504
100pF
50V
C505
0.1uF
16V
R504
0
0.1uF
C507
1000pF
50V
R503
3.3K
11:F7
11:F6
11:F7
9:I4;2:AH5
9:I4;2:AH5
D3.3V
L503
MLB-201209-0120P-N2
C508
BCM_I2S_DATA_OUT
BCM_I2S_WORD_CLK
BCM_I2S_BIT_CLK
SDA1_3.3V
SCL1_3.3V
C51 1
1uF 10V
+1.8V_AMP
C510
10uF
10V
C514
22000pF
50V
BST1A
VDR1A
RESET
AD
DVSS_1
VSS_IO
CLK_I
VDD_IO
DGND_PLL
AGND_PLL
LFM
AVDD_PLL
DVDD_PLL
TEST0
C513
0.1uF
16V
R505100
R506100
R507100
R508100
R509100
OUT1A_2
PGND1A_1
PGND1A_2
54
55
56
1
2
3
4
5
6
7
NTP-3100L
8
9
10
11
12
13
14
15
16
17
DVDD
SDATA
DVSS_2
C512
33pF
50V
+24V_AMP
C515
0.01uF
50V
OUT1B_2
PVDD1B_1
PVDD1B_2
PVDD1A_1
PVDD1A_2
OUT1A_1
49
50
51
52
53
IC501
EAN60664001
18
22
WCK19BCK20SDA21SCL
MONITOR_023MONITOR_124MONITOR_2
C517
33pF
50V
OPT
C509
33pF
50V
48
C51 8
1uF
10V
OUT1B_1
C520
0.1uF
50V
PGND1B_2
46
47
25
FAULT26VDR2B27BST2B
T_330uF_Capacitor
C522
0.1uF
50V
C519
22000pF
50V
C521
1uF
16V
VDR1B44BST1B45PGND1B_1
43
NC
42
VDR2A
41
BST2A
40
PGND2A_2
39
PGND2A_1
38
OUT2A_2
37
OUT2A_1
36
PVDD2A_2
35
PVDD2A_1
34
PVDD2B_2
33
PVDD2B_1
32
OUT2B_2
31
OUT2B_1
30
PGND2B_2
29
28
PGND2B_1
C553
330uF
35V
C52 3
1uF1 6V
R513
100
R511
3.3
C524
22000pF
50V
C525
22000pF
50V
C526
0.01uF
50V
AMP_MUTE
+24V_AMP
C527
0.01uF
50V
D501
1N4148W
100V
1N4148W
D502
100V
OPT
OPT
R518
5.6
C531
1000pF
50V
C532
1000pF
50V
R519
5.6
L504
DA-8580
EAP38319001
2S
1S1F
22uH
2F
Change 22uH(L504,L505) TO 15uH/6.3mm After DV1
R520
5.6
C533
1000pF
50V
C534
1000pF
50V
R521
OPT
5.6
C529
330uF
T_330uF_Capacitor
R522
3.3
C535
0.01uF
50V
L505
DA-8580
EAP38319001
2S
1S1F
22uH
2F
C528
0.1uF
50V
12:F3
D503
1N4148W
100V
D504
1N4148W
100V
C530
0.1uF
50V
OPT
C538
0.47uF
50V
C539
0.47uF
50V
C540
0.1uF
50V
C541
0.1uF
50V
C542
0.1uF
50V
C543
0.1uF
50V
SPK_L+
H5
SPK_L-
H5
SPK_R+
H4
SPK_R-
H4
R527
4.7K
3.3
R528
3.3
R524
C545
4.7K
0.01uF
50V
C546
0.01uF
R525
50V
4.7KR529
3.3
R530
3.3
R526
C547
4.7K
0.01uF
50V
L507
120-ohm
L508
120-ohm
L510
120-ohm
L509
120-ohm
C544
0.01uF
50V
R523
2A => 5A
MCLK SDATA WCK BCK TP is necessory
2
Monitor0_1_2 TP is necessory
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
must be placed with pin#8,#10 as close as possible.
+5V_ST
E
C
Q805
B
R820
33K
RT1P141C-T112
Q807
2SC3875S(ALY)
+5V_ST
220uF ==> 100uF*2 + 22uF for Depth
C899
C827
100uF
100uF
16V
L805
CB4532UK121E
C812
0.1uF
50V
+5.0V
R818
3.3K
C
E
B
2SC3875S(ALY)
R816
6.8K
Q806
2SC3052
+12V
Q810
SI4804BDY
D1_2
8
1
D1_1
7
2
D2_2
6
3
D2_1
5
4
R823
1K
OPT
R829
R877
0
R828
B
10K
OPT
OPT
C819
22uF
16V
+24V
C804
1uF
50V
+3.3V_ST
OPT
R826
10K
R830
0
C
R870
Q813
OPT
0
10K
B
OPT
E
R802
C806
0.1uF
16V
OPT
C
E
C807
68uF
35V
R824
10K
R807
OPT
12:A3;A6;B5;F7;G7;I2;14:B2
0
C8450.1uF
C1802
10uF
25V
50V
0
C842
22uF
C802
16V
68uF
35V
R827
10K
OPT
R837
3.3
2.2uH
C848
470pF
RL_ON
12:I5;14:E5
ERROR_OUT
12:F6
L819
INV_ON/OFF
12:I5
10K
R874
R849
1.1K
C856
6800pF
R854
10K
* +12V to +5.0V
R853
300
470pF
C851
C853
10uF
16V
C860
10uF
16V
R873
3.3K
C862
470pF
C863
C1808
100uF
+5.0V
16V
12:A3;2:Y20;2:Z10;B3;C6;H5;7:A3;14:I7;14:J1
10uF
16V
R859
330K
1/10W
IC809
SC2621ASTRT
BST
1
OCS
2
COMP
3
FB
4
LDOG
5
LDFB
6
GND_1
7
must be placed with pin#8,#10 as close as possible.
C1801
0.01uF
3
+5.0V
25V
1uF
L811
C835
1uF
MLB-201209-0120P-N2
25V
D801
1N4148W
100V
25V
1uF
C1800
S1
G1
S2
G2
Q809
SI4804BDY
1
2
3
4
8
7
6
5
+5V_ST
D1_2
D1_1
D2_2
D2_1
* +5.0V to 1.2V
D1.2V
0
R878
22uF
16V
C839
C8440.1uF
R836
C847
2.2uH
3.3
470pF
L817
R842
R847
R848
2K
200
1.5K
R872
C1804
1.2K
470pF
C852
C854
10uF 6.3V
330uF 4V
L821
MLB-201209-0120P-N2
0.01uF
C861
C865
R831
6.8K
2
C815
2200pF
C825
R814
15K
1%
220pF
BST
OCS
COMP
FB
LDOG
LDFB
GND_1
R833
390K
1/8W
IC804
SC2621ASTRT
1
2
3
4
5
6
7
DH
14
PN
13
GND_2
12
DL
11
DRV
10
NC
9
VCC
8
C1805
1
FLASH, A1.2, +1.8_DDR_BCM3556, VTT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HONG.Y.H
BCM (BRAZIL VENUS)
M-STAR FRC DDR
2009.03.23
8
15
Page 25
ABCDEFGHIJ
RESET
D3.3V
R2003
R2025
POWER_DET
7
12:B3;12:I4
RESET
10:I2;12:I5
0
R408
330
R409
910
0
OPT
IC400
KIA7029AF
I
1
2
G
6
NVRAM
IC403
AT24C512BW-SH-T
4.7K
4.7K
R422
R419
5
R3016
4.7K
A0
1
A1
2
A2
3
GND
4
D3.3V
VCC
8
7
6
5
C416
0.1uF
WP
R411
SCL
22
R412
SDA
22
4
D3.3V
R410
10K
O
3
C400
10uF
SYS_RESETb
10:E4
SMD Gasket Option
I4;12:F3
SCL2_3.3V
I4;12:F3
SDA2_3.3V
* NAND FLASH MEMORY 1Gbit (128M)
Hot Plug input pin should be feeded over 5mA.
BCM Recommend
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JANG.J.H
BCM (BRAZIL VENUS)
BCM3556 & NAND FLASH
2009.03.23
9
15
Page 26
ABCDEFGHIJK
1
2
3
4
Route INCM between associated
left and right signals of same channel
The INCM trace ends at the
same point where the connector
ground connects to the board ground
(thru-hole connector pin).
Place test points, resistors
near audio connector.
Connect the other side of
the resistor to GND as close
as possible to the ground
connection of the associated
audio connector.
When usding FUNDMENTAl then series R = 0 ohm and CL = 8 pF
When usding Dip-type X-tal then series R = 22 ohm and CL = 12 pF
C230
12pF
3
12pF
C229
33pF
C3012
L8014
1008LS-272XJLC
R3027
604
R212
R211
22
21
X903
54MHz
22
CONNECT NEAR BCM CHIP
R226
R227
4.7K
4.7K
INCM
R4004
R4000
34
R4001
34
R4005
R400234R4003
34
C4001 0.1uF
C4002 0.1uF
C4003 0.1uF
R4006
34
C4004 0.1uF
C4005 0.1uF
34
C4000 0.1uF
C4006 0.1uF
C4007 0.1uF
R4007
TU_CVBS_INCM
3:T25
SIDE_CVBS_INCM
3:T19
AV1_CVBS_INCM
3:T19
34
COMP1_VID_INCM
COMP2_VID_INCM
3:T21
R_VID_INCM
3:T15
G_VID_INCM
3:T15
B_VID_INCM
34
3:T15
3:T23
5.1
R4009
R4011
R4012
5.1
R4010
5.1
R4008
SIDE_INCM
0.15uF
C4010
5.1
0.15uF
C4011
5.1
0.15uF
C4008
0.15uF
C4009
0.15uF
C4012
0.47uF
C4014
0.47uF
C4015
C4016
0.47uF
0.47uF
C4013
0.47uF
C4017
3:T18
AV1_INCM
COMP1_INCM
3:T24
COMP2_INCM
3:T22
PC_INCM
3:T14
3:T20
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JANG.J.H.
BRAZIL VENUS
BCM3556 VIDEO IN
2009.03.23
11
15
Page 28
ABCDEFGHIJ
7
+3.3V_ST
R454
2K
R451
2:AD26
2K
6
O
R494
R415
4.7K
OPT
4.7K
R407
+3.3V_ST
R414
10K
47K
GND
C
C407
Q401
2SC3875S(ALY)
E
R4160
R41 7
R42 0
R4214.7K
R423
OPT
R42 422
R42 522
OPT
OPT
GND
+3.3V_ST
22
22
OPT
R41 8
4.7 K
B
C403
0.1uF
16V
0
R413
4.7K
HDMI_CEC
+3.3V_ST
R488
33K
R43 0
100
HSYNC/P1.5
R42 7
4.7 K
VSYNC/P1.6
P1.7/SOGI
RST
HSCL1/P3.0/RXD
P4.3/AD3
HSDA1/P3.1/TXD
P3.2/INT0
P3.3/INT1
ISDA/P3.4/T0
ISCL/P7.5
15K
C415
0.1uF
16V
R429
OPT
OPT
R42 8
GND
+3.3V_ST
R489
33K
GND
1
2
3
4
5
6
7
8
9
10
11
4.7K
4.7K
R495
R496
+3.3V_ST
R401
1K
5
OPT
OPT
R402
GND
14:H2
14:I1
IC405
A0
A1
A2
VSS
DDC_SCL
DDC_SDA
IR
UCOM_RX
UCOM_TX
24LC16BT-I/SN
1
2
3
4
9:G7;14:A4
9:G7;14:A4
14:A3;14:E6
4
+5V_ST
R482
30K
OPT
R486
+24V
R484
30K
R43 2
OPT
0
R491
5.1K
47K
GND
C
E
OPT
R481
Q405
2SC3052
0
+3.3V_ST
R487
100K
OPT
R485
10K
9:A7;I4
RESET
POWER_DET
R490
0
IC1003
NCP803SN293
2
1
GND
OPT
VCC
3
POWER DETECT
+5.0V
+12V
R476
6.8K
15K
R477
R492
0
OPT
3
R478
OPT
10K
C
OPT
Q404
B
2SC3052
E
OPT
R479
OPT
B
1K
R480
2.2K
OPT
R483
0
IC402
KIA7029AF
I
3
1
2
R406
VCC
WP
SCL
SDA
4.7K
R405
220
R404
220
0.1uF
+3.3V_ST
+3.3V_ST
C406
16V
GND
M5V_ON
G
R403
R499
4.7K
C402
0.1uF
16V
GND
8
7
6
5
14:E6
14:E7
14:E5
UCOM_SDA_3.3V
UCOM_SCL_3.3V
LED_WARM_STBY
100
100
R471100
R464
R470
P1.1/DA0
P1.2/DA1
P1.3/DA2
P1.4/DA3
41
42
43
44
MTV416GMF
12
13
14X215X116
HSDA2/P7.4
HSCL2/P7.3
X401
24MHz
C408
22pF
50V
R43 6 22
R43 4 22
GND
SDA2_3.3V
SCL2_3.3V
14:E5
4:C5
ERROR_OUT
LED_POWER_ON
100
R44 01 00
R474
VDD
P4.2/AD2
P1.0/ET2
38
39
40
IC406
17
18
VSS
P4.0/AD0
P6.0/CLKO1
GND
100
C409
R44 1
22pF
50V
D3.3V
OPT
OPT
4.7 K
R43 5
OPT
0
R44 4 10 0
R44 2
P5.3
P5.2
P5.1
P5.0
35
36
37
19
P6.120P6.221P6.322P6.4
0
22
R44 6
R44 5 0
R44 3
OPT
OPT
OPC_EN
AMP_MUTE
3:E3
7:I5
R43 90
R435 : READY FO 1.2V BCM ENABLE
C410
0.1uF
34
P5.4
33
P5.5
32
P5.6
31
P5.7/CLKO2
30
P7.0/HBLANK
29
P4.1/AD1
28
P7.1/VBLANK
27
P7.2/HCLAMP
26
P6.7
25
P6.6
24
P6.5
23
R447 4.7K
OPT
R452
47K
GND
READY FO 1.2V BCM ENABLE
+3.3V_ST
16V
GND
R450
OPT
C412
0.1uF
OPT
+3.3V_ST
1K
R45 3
R455
4.7K
OPT
C411
100uF
16V
100
OPT
R459
4.7K
R465 100
OPT
100
R46 6
R468 100
R467
22
100
R431
OPT
R475 1K
R449 100
OPT
68K
R46 0
6.8K
R461
OPT
GND
C413
0.1uF
R462
100
R456
100
C414
0.1uF
16V
GND
KEY2
KEY1
B
14:E6
14:E6
AMP_RST
+5.0V
R472
4.7K
C
Q402
RT1N141C-T112-1
E
GND
PANEL_CTL
FLASH_WP_1
INV_ON/OFF
RL_ON
RESET
POWER_DET
9:G7;9:I3;3:C5
EDID_WP
4:H1
4:C5
4:C5
4:C7;14:E5
9:A7
9:C1
14:A4
2
9:B5;9:I4
9:B5;9:I4
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JANG.J.H
BRAZIL DVR DV
BCM3549 POWER
2009.03.23
1513
Page 30
ABCDEFGHIJ
7
6
5
CONTROL IR & LED
P701
12507WS-12L
SCL
1
SDA
2
GND
D701
3
KEY1
4
KEY2
5
5V_ST
6
GND
7
WARM_ST
8
IR
9
GND
10
3.3V_ST
11
POWER_ON
12
13
GND
CDS 3C05 HDMI 1
ZD701
OPT
ZD702
C701
0.1uF
USB JACK & USB +5V Current Protection
D3.3V
BCM Tolerance
R721
D704
5.6V
OPT
USB_DM2
USB_DP2
R718
2.7K
10:D4
10:D4
2.7K
USB_CTL1
10:D5
USB_POWER_OUT_2
C714
100uF
VOUT
1234
IC701
MIC2009YM6-TR
VIN
6
5
4
1
GND
2
ENABLE
3
R717
47
Make this trace minimum 12 mil
D703
CDS3C05GTA
CDS3C05GTA
5.6V
OPT
USB_POWER_OUT_2
UCOM_SCL_3.3V
C709
0.1uF
16V
L705
C710
0.1uF
16V
2SC3052
+3.3V_ST
Q701
UCOM_SDA_3.3V
2SC3052
R707
10K
C
E
L703
BG2012B080TF
L704
BG2012B080TF
IR
12:D4;A3
+3.3V_ST
OPT
C707
1000pF
50V
C708
0.1uF
CB3216PA501E
OPT
C705
C703
50V
0.1uF
1000pF
50V
C706
0.1uF
L701
BG2012B080TF
L702
CB3216PA501E
D702
CDS 3C05 HDMI 1
C704
ZD703
C702
100pF
1000pF
OPT
Q702
B
R710
OPT
0
R708
C
E
R709
4.7K
10K
12:F6
12:F6
KEY1
KEY2
+5V_ST
+3.3V_ST
B
R712
0
R711
0
OPT
12:H3
12:H3
OPT
0
R714
R713
0
R715
120K
OPT
LED_WARM_STBY
RL_ON
LED_POWER_ON
R716
130
ILIMIT
FAULT/
KJA-UB-4-0004
JK702
USB DOWN STREAM
5
+5V_ST
L709
USB_5VST
C716
0.1uF
16V
USB_OCD1
L708
BLM18PG121SN1D
C715
100uF
16V
Not enough space
+5.0V
L710
USB_+5V
MLB-201209-0120P-N2
10:D4
MLB-201209-0120P-N2
4
JP715
JP716
JP712
JP711
D705
CDS3C05GTA
5.6V
OPT
R719
0
D3.3V
R720
0
L707
JP713
CB3216PA501E
C713
10uF
16V
D706
CDS3C05GTA
5.6V
OPT
R722
27
R723
27
BLUETOOTH_RESET
VREG_CTRL
USB_DM1
USB_DP1
10:D4
10:D4
RS232_SWITCHING
R702
0
RS232_BYPASS
IC702
MC14053BDR2G
0ISTL00024A
R701
3
BCM_RX
9:G6
UCOM_RX
12:D4
0
Y1
1
Y0
2
Z1
3
Z
4
Z0
5
INH
6
VEE
7
VSS
8
VDD
16
R705
0
A3
RS232C_RxD
RS232C_TxD
BCM_TX
UCOM_TX
A3
9:G6
12:D4
16V
+5.0V
Y
15
X
14
13
12
11
10
9
RS232_BYPASS
R703
X1
0
X0
A
B
C
R706
4.7K
R_RS232_SWITCHING
R704
100K
C711
0.1uF
MLB-201209-0120P-N2
C712
47uF
16V
+5V_ST
L706
Blue Tooth
11
12507WR-10L
P702
10
9
8
7
6
5
4
3
2
1
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DO.J.G
CONTROL IR/BT/USB
2009.03.23BRAZIL VENUS
1514
Page 31
ABCDEFGHIJ
7
0
R5014
0
R5013
L5002
C5010
22uF
D3.3V
OPT
R5015
4.7K
RF_SWITCH
D2.5V
C5011
0.1uF
TUNER_RESETb
SDA0_3.3V
SCL0_3.3V
TU_SYNC
TU_SDATA
TU_SCLK
GAIN_SWITCH
C5012
0.01uF
3:T26
3:T26
3:T26
3:T27
3:T27
3:T27
RF_SWITCH
GAIN_SWITCH
L5005
C5016
C5014
22uF
0.1uF
D3.3V
L5004
C5015
22uF
3:T24
3:T24
Place close to Pin
C5017
0.1uF
D1.2V
L5006
C5020
C5018
0.1uF
22uF
R5020
12K
C5019
0.01uF
R5021
10K
TU_+5.0V
TU_+5.0V
R5022
R5024
0
OPT
B
A1[RD]
A2[GN]
R5023
1K
L5007
C5021
470
0.01uF
E
2SA1530A-T112-1R
Q5000
C
LD5000
SAM2333
SAM2333
LD5001
C
C
A1[RD]
A2[GN]
R5025
TU_SIF
330
D3.3V
3:T25
TU_+5.0V
LGIT
CTR
1
RF-GAIN_SW
2
B0[+5V]
3
R50010
VTU
4
RF_AGC
5
LGIT
B1[+5V]
6
24
SHIELD
NC_1
7
SIF
8
VIDEO_OUT
9
NC_2
10
NC_3
11
AIF
12
B2[2.5V]
13
B3[3.3V]
14
B4[1.2V]
15
RESET[SYRSTN]
16
SDA
17
SCL
18
RSEORF
19
SBYTE
20
SPBVAL
21
SRDT
22
SRCK
23
TU102
TDYR-H071F
6
5
R50020
R50000
LGIT
LGIT
LGIT
22uF
C5000
LGIT
L5000
C5002
16V
C5001
22pF
50V
LGIT
0.1uF
50V
LGIT
C5003
22pF
50V
LGIT
19
SHIELD
SHARP
TU101
VA1G5BF8005
C5005-*1
0.1uF
50V
LGIT
C5005
2200pF
50V
C5007
2200pF
0
R5004
22
22
22
R5005
R5006
R5007
R500822
R500922
R501022
50V
0
R5012
RF_SW
1
GAIN_SW
2
BB
3
B1
4
AFT
5
SIF
6
VIDEO
7
B2
8
B3
9
B4
10
RESET
11
SDA
12
SCL
13
RSEORF
14
SBYTE
15
SPBVAL
16
SRDT
17
SRCK
18
16V
10uF
4
C5004
91pF
50V
FI-C3216-103KJT
OPT
L5001
82
OPT
OPT
R5003
C5009
R5018
56
R5019
56
OPT
GND
TU_CVBS_IN
3:T25
3
C5035
100uF
16V
C5036
100uF
16V
+5V
TU_+5.0V
L5009
C5030
0.01uF
50V
MLB-201209-0120P-N2
L5010
MLB-201209-0120P-N2
C5031
0.1uF
16V
C5032
0.1uF
16V
OPT
C5033
4.7uF
10V
C5034
4.7uF
10V
OPT
D3.3V
C5026
0.33uF
16V
1
VIN
100
R50 26
+12V
2
C5022
0.1uF
16V
C5023
100uF
16V
INPUT
IC5002
AS7809DTRE1
1
2
GND
OUTPUT
3
C5024
0.1uF
50V
L5008
MLB-201209-0120P-N2
C5025
100uF
16V
2VC3
C5027
0.1uF
50V
6
VOUT
GND2
IC5001
KIA78R05F
4NC5
GND1
C5028
47uF
16V
C5029
0.1uF
50V
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DO.J.G
TUNER
2009.03.23BRAZIL VENUS
1515
Page 32
Page 33
Block Diagram
Overall Block Diagram
for Brazil DTV (LH70)
TU_SCLK, TU_SDATA, TU_SYNC
VA1G5BF8005
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 34
Block Diagram
I2C & RS232 Communication
I2C & RS232 Communication
VA1G5BF8005
MAX3232
Sub B/D
47PF
RS232C_RxD
RS232C_TxD
22 ohm
22 ohm
47PF
+5V_ST
4.7k ohm
4.7k ohm
D3.3V
4.7k ohm
4.7k ohm
P
7
0
22 ohm
22 ohm
Main B/D
SCL0
SDA0
SCL1
SDA1
22 ohm
22 ohm
D3.3V
4.7k ohm
4.7k ohm
+3.3V_HDMI
2.7k ohm
2.7k ohm
0 ohm
0 ohm
HDMI
S/W
1
100 ohm
100 ohm
NTP3100L
33PF
D3.3V
BCM3556
SCL3
P
7
0
100 ohm
100 ohm
SDA3
2
22 ohm
22 ohm
4.7k ohm
D3.3V
4.7k ohm
22 ohm
22 ohm
33PF
MICOM
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SCL2
SDA2
22 ohm
22 ohm
4.7k ohm
4.7k ohm
100 ohm
100 ohm
MST7323
LGE Internal Use Only
Page 35
Block Diagram
• I2C channel [LH70]
CH0
CH1
BCM3556
BCM3556
CH2
CH3
TUNER 1
TUNER 1
0xC2
0xC2
Demod(0x30)
Demod(0x30)
QPSK(0x32)
QPSK(0x32)
AMP
AMP
NTP3100L
NTP3100L
0x54
0x54
EEPROM
EEPROM
AT24C512
AT24C512
0xA6
0xA6
FRC
FRC
MST7323
MST7323
HDMI SW
HDMI SW
TDA9996
TDA9996
Micom
Micom
MTV416
MTV416
0x50
0x50
CH0 (+3.3V)
(+ 3.3V)
CH1
CH2 (+3.3V)
(+3.3V)
CH3
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 36
Block Diagram
Jack
Jack
Board
Board
D1.2V, D2.5V, +3.3V, +5.0V_ST
SPDIF , EDID_WP ….
SCL0_3.3V, SDA0_3.3V, DDC_SCL, DDC_SDA
CVBS, SIF, AV, RGB ,COMPONENT, R/L,
TU_SCLK, TU_DATA, TU_SYNK’’..
MAIN
MAIN
Board
Board
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
< Signal Interface >
LGE Internal Use Only
Page 37
1. Power-Up Boot Fail Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
SDA0/SCL0_3.3V
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 38
1. Power-Up Boot Fail Trouble Shooting
Check P801 All Voltage Level
(24V, 12V, 5V_ST)
Y
Check All Voltage Level
at L805/L807/L808
Y
Check Voltage Level 3.3V at L830
Y
Check Voltage Level 2.5V at L827
Y
Check Voltage Level 1.8V
at IC802 #2 pin or L815
Y
Check Voltage Level 1.2V at L821
Y
Check X903 Clock 54MHz
NY
N
N
N
N
N
N
Check Power connector
Replace one of L805/L807/L808
& Recheck
Replace one of
IC809/Q812/L828/L829/L830/L822
& Recheck
Replace one of IC803/L824/L827
& Recheck
Replace one of IC802/IC805/L815
& Recheck
Replace one of
IC804/Q809/L811/L817/L821
& Recheck
Replace X903
N
N
N
N
Replace Power board
Check Micom IC406
Redownload or replace
Y
Check signal transition
at IC101 #9 pin
Y
Replace IC101 Flash Memory
N
Maybe BCM3556 has troubles
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 39
2. No OSD Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
TU_SCLK, TU_SDATA, TU_SYNC
VA1G5BF8005
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 40
2. No OSD Trouble Shooting
Check 12V Voltage Level
at P801 #13 Pin
Y
Check 12V Voltage Level
at L801
Y
Check 12V Voltage Level at L909
Y
Check Voltage Level 2.5V at L827
Y
Check Voltage Level 1.8V
at IC802 #2 pin or L815
Y
Check Voltage Level 1.26V
at IC807 #6 pin
NY
N
N
N
N
N
Check Power connector
Replace one of L801/Q804
& Recheck
Replace one of
Q802/Q803/Q804/L801
& Recheck
Replace one of IC803/L824/L827
& Recheck
Replace one of IC802/IC805/L815
& Recheck
Replace IC807
& Recheck
Replace Power board
Y
Check P903
#16(TXAC-), #17(TXAC+),
#32(TXBC-), #33(TXBC+)
Y
Check LVDS Cable
Y
Check Voltage LCD Module
N
N
Maybe BCM3556(IC100) or
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7329A(IC901)
has troubles
Replace Cable
LGE Internal Use Only
Page 41
3. Digital TV Video Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
RF_Switch, Gain_Switch
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 42
3. Digital TV Video Trouble Shooting
Check RF Cable
Y
Check Tuner(TU101) Power
(5.0V, 2.5V, 3.3V, 1.2V)
Y
Check TP Clock, Data, Sync
R107, R108, R109
Y
Check cable between P203 at Jack
Board and P701 at Main Baord
Y
Maybe BCM3556(IC100)
has problems
Replace one of IC101, IC102 at
N
N
N
Jack Board or IC803/ IQ812/ C804/
Q809/+5V_ST and +12V of P801 at
Main Board& Recheck
Maybe Tuner(TU101) has problems
Maybe Cable Pin has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 43
4. Analog TV Video Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
RF_Switch, Gain_Switch
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 44
4. Analog TV Video Trouble Shooting
Check RF Cable
Y
Check Tuner(TU101) Power
(5.0V, 2.5V, 3.3V, 1.2V)
Y
Check CVBS Signal
TU101 #7 Pin and R118
Y
N
N
Replace one of IC101, IC102 at
Jack Board or IC803/ Q812/ IC804/
IC809/Q809/+5V_ST and +12V of
P801 at Main Board& Recheck
Maybe Tuner(TU101) has problems
Check cable between P203 at Jack
Board and P701 at Main Baord
Y
Check CVBS Signal
R703 and C110 at Main Baord
Y
Maybe BCM3556(IC100)
has problems
N
N
Maybe Cable Pin has problems
Replace one of R703 and C110
& Recheck
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 45
5. Component Video Trouble Shooting
Overall Block Diagram
Overall Block Diagram
for Brazil DTV (LH70))
for Brazil DTV (
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
RF_Switch, Gain_Switch
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 46
5. Component Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check Component Cable
Y
Check Component Jack JK209 at
Jack Board
Y
Check Component Signal
R292, R293, R294
R295, R296, R297
at Jack Board
Y
N
N
Replace Jack at Jack board
R292, R293, R294, R295, R296, R297
L212, L213, L214, L215, L216, L217
Replace one of
& Recheck
Check cable between P203 at Jack
Board and P701 at Main Baord
Y
Check Component Signal
C130, C131, C132
C133, C134. C135
Y
Maybe BCM3556(IC100)
has problems
N
N
Maybe Cable Pin has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Replace it
LGE Internal Use Only
Page 47
6. RGB Video Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
TU_SCLK, TU_SDATA, TU_SYNC
VA1G5BF8005
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 48
6. RGB Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check RGB Cable
Y
Check RGB Jack JK208 at Jack
Board
Y
Check RGB Signal
L207, L208, L209 at Jack Board
Y
N
N
Replace JK208 at Jack board
Replace one of L207, L208, L209
at Jack Board & Recheck
Check cable between P203 at Jack
Board and P701 at Main Board
Y
Check RGB Signal
C127, C128, C129 at Main Board
Y
Maybe BCM3556(IC100)
has problems
N
N
Maybe Cable Pin has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Replace it
LGE Internal Use Only
Page 49
7. AV Video Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
TU_SCLK, TU_SDATA, TU_SYNC
VA1G5BF8005
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
LGE Internal Use Only
X-tal
24MHz
Page 50
7. AV Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check AV Cable
Y
Y
Check AV Jack JK209 at Jack
Board
Y
Check AV Signal
R203, R204, R214, R215 at Jack
Board
Y
N
N
Replace JK209 at Jack board
Replace one of R203, R204, R214,
R215 at Jack Board
& Recheck
Check cable between P203 at Jack
Board and P701 at Main Board
Y
Check AV Signal
C124, C125 at Main Board
Y
Maybe BCM3556(IC100)
has problems
N
N
Maybe Cable Pin has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Replace it
LGE Internal Use Only
Page 51
8. HDMI Video Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
TU_SCLK, TU_SDATA, TU_SYNC
VA1G5BF8005
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 52
8. HDMI Video Trouble Shooting
Check Signal Format
Is it supported signal?
Y
Check HDMI Cable
Y
Check HDMI Jack
JK600, JK601, JK602
Y
Check IC601 Voltage Level
+1.8V_HDMI, +5.0V_HDMI
Y
Check I2C Signal
R624/R625/R157/R158
Y
N
N
N
Replace Jack
Replace one of
L601/L602/R619/R615
Replace It & Recheck
Maybe BCM3556(IC100)
has problems
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 53
9. All Source Audio Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
RF_Switch, Gain_Switch
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 54
9. All Source Audio Trouble Shooting
Make sure you can’t hear any audio
Y
Check Speaker
Y
Check Connector P501
Y
Check Signal
L504, L505
Y
Check IC501 Power
24V, 3.3V, 1.8V
L511, L503, L501
Y
Check BCM3556 I2S Output
R505, R506, R507
Y
Maybe BCM3556(IC100)
has problems
N
N
N
N
N
Replace Speaker
Replace Connector
Replace one of
L508/L509/L510/L507/L504/L505
& Recheck
Replace one of
L511L503/L501 and IC503
& Recheck
Replace It & Recheck
N
N
N
N
Maybe NTP3100 has problems.
Replace It
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 55
10. Digital TV Audio Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 56
10. Digital TV Audio Trouble Shooting
Check video output
Y
Follow procedure All source audio
trouble shooting
N
N
Follow procedure digital TV video
trouble shooting
Maybe BCM3556 internal audio
DSP has problems. Replace It
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Page 57
11. Analog TV Audio Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
RF_Switch, Gain_Switch
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 58
11. Analog TV Audio Trouble Shooting
Check video output
Y
Check Tuner(TU101) Power
(5.0V, 2.5V, 3.3V, 1.2V)
Y
Check SIF Signal
TU101 #6 Pin and R118 at Jack
Board
Y
Check SIF Signal
IC501 #4 Pin
Y
Check SIF Signal
C128 at Jack Board
Y
Check cable between P203 at Jack
Board and P701 at Main Baord
Y
N
N
N
N
N
N
Follow procedure analog TV video
trouble shooting
Replace one of IC101, IC102 at
Jack Board or IC803/ Q812/ IC804/
IC809/Q809/+5V_ST and +12V of
P801 at Main Board& Recheck
Maybe Tuner(TU101) has problems
Replace one of
L505/L514/C502/C511/Q500/Q502
IC501 & Recheck
Replace one of C123, R120, R121,
R124, L109, Q101, C128
& Recheck
Maybe Cable Pin has problems
Check SIF Signal
R704 and C106 at Main Board
Y
Follow procedure All source audio
trouble shooting
N
N
Replace one of R704/R128/C106
Maybe BCM3556 audio block has
problems. Replace It
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
& Recheck
LGE Internal Use Only
Page 59
12. Component / RGB / AV Audio Trouble Shooting
Overall Block Diagram
for Brazil DTV (LH70)
VA1G5BF8005
TU_SCLK, TU_SDATA, TU_SYNC
TU_CVBS_IN
TU_SIF
SDA0/SCL0_3.3V
RF_Switch, Gain_Switch
LVDS
DDR2(256Mbit)
Qimonda/Hynix
FRC IC
(MST7323S)
LCD Module
(FHD, 120Hz)
JACK BACK
JACK BACK
at REAR
at REAR
AV1
AV2
Component 1
Component 2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
Digital Audio (Optic)
RS-232C (Ctrl./SVC)
Bluetooth Module
USB
CVBS, L/R, AV_DET
SIDE_CVBS, SIDE_L/R, SIDE_DET
Y Pb Pr, L/R, DET
Y Pb Pr, L/R, DET
RGB/H/V
Audio L/R
3x1
HDMI Switch
SPDIF
RX/TXRX/TX
MAX3232
DP1/DM1
DP2/DM2
O.C. Protector
+5V+5V
USB_DM1
USB_DP1
USB_DM2
USB_DP2
BCM3556
BCM3556
(Brazil)
(Brazil)
DDR_Data[0:15], DQS, DM …
Addr.[0:13], ctrl. data
Data[16:31]
Data [0 … 7]
CS ,RE,WE……
I2S
SCL, SDA_3.3V
FRC Block
FRC Block
X-tal
12MHz
DDR2 (1Gbit)
DDR2 (1Gbit)
NAND Flash
(512Mbit)
Digital AMP
NTP3100L
NVRAM
Elpida/Hynix
Elpida/Hynix
Reset Switch
Copyright ⓒ 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Reset IC
X-tal
54MHz
SCL, SDA_3.3V
CLK,TDI,TDO,MS,RST
MICOM
(MTV416GMF)
JTAG
X-tal
24MHz
LGE Internal Use Only
Page 60
12. Component / RGB / AV Audio Trouble Shooting
Check Video Output
Y
Check Jack JK208/JK209
Y
Check Signal
R235, R236 (Comp1)
R216, R217 (Comp2)
R249, R250 (RGB)
R219, R221 (AV1)
R218, R220 (AV2)
at Jack Board
Y
Check cable between P203 at Jack
Board and P701 at Main Baord
Y
Check Signal
C206, C210, C211, C232, C220,
C221, C224, C225, C226, C227
at Main Board
Y
Follow procedure All source audio
trouble shooting
N
N
N
N
N
N
Follow procedure external input
video trouble shooting
Replace Jack
Replace one of
R235/R236/C231/C232 (Comp1)
R216/R217/C207/C208 (Comp2)