LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied LCD TV with LA12C chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature:
20ºC ± 5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC : FCC, ICES, IEC specification
- Wireless : WirelessHD Specification (Option)
No Item Specification Remark
1. Receiving System 1) ATSC / NTSC-M OK
2. Available Channel 1) VHF : 02~13 OK
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage 1) AC 100 ~ 240V~, 50/60Hz OK 110V, 50/60Hz on the label
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. HDMI Input - 3D
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 Side by Side HDTV 1080I
Top & Bottom
2 1280*720 Side by Side HDTV 720P
Top & Bottom
9. RGB-PC Input - 3D
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 67.50 60 148.50Side by Side HDTV 1080P
Top & Bottom
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1280*720 90.00 60.00 148.50 HDMI 3D Frame Packing1.4a HDTV 720P
2 1280*720 45.00 60.00 74.25 Side by Side 1.3 HDTV 720P
Top & Bottom 1.4a HDTV 720P
HDMI 3D Top & Bottom
3 1920*1080 33.75 60.00 74.25 Side by Side , 1.3 HDTV 1080I
Top & Bottom
HDMI 3D Side by Side 1.4a HDTV 1080I
(Half)
4 1920*1080 67.50 60 148.50 Side by Side 1.3 HDTV 1080P
Top & Bottom
Checkerboard
Single Frame Sequential
5 1920*1080 54.00 24.000 148.50 HDMI 3D Frame Packing 1.4a HDTV 1080P
6 1920*1080 27.00 24.000 74.25 Side by Side 1.3 HDTV 1080P
Top & Bottom
Checkerboard
HDMI 3D Top & Bottom 1.4a HDTV 1080P
7 1920*1080 67.50 30.000 148.50 HDMI 3D Frame Packing 1.4a HDTV 1080P
8 1920*1080 33.75 30.000 74.25 Side by Side 1.3 HDTV 1080P
Top & Bottom
Checkerboard
7. RF Input - 3D
- 10 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
NoSide by Side Top & Bottom Checkerboard
Single Frame Sequential
Frame Packing
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 33.75 30.000 74.25Side by Side HDTV 1080P
Top & Bottom
Checkerboard
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 33.75 30.000 74.25Side by Side HDTV 1080P
Top & Bottom
Checkerboard
10. USB Input - 3D
11. DLNA Input - 3D
12. 3D Input
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. Optical specs for LCD Module.
0.334
0.307
GREEN
0.606
0.152
BLUE
0.058
0.279
WHITE
-0.05
0.292
+0.05
0.630
RED
0.330
0.320
GREEN
0.620
0.150
BLUE
0.040
0.280
WHITE
Typ.
-0.05
0.290
Typ.
+0.05
T645HW05-V0
1,100:1 1,600:1LGD Module
3 Contrast ratio
3,200:1 4,000:1AUO Module (32LW5700/65LW6500)
4 3D Crosstalk 1 3 %
5 Luminance Uniformity 1.3 % 2D Only
Response Time(Gray to Gray) 5 6 ms
Response Time(MPRT) 6 9 ms
Response Time(Uniformity / MPRT) 1
6
Response Time(Uniformity / G to G) 1
No Item Min Typ Max Unit Remark
320400 cd/m
100250 cd/m
T315HB01-V0
320400 cd/m
120150 cd/m
LC420EUF-SDF1
320400 cd/m
120150 cd/m
LC470EUF-SDF1
320400 cd/m
120150 cd/m
LC550EUF-SDF1
2D
3D
2D
3D
2D
3D
2D
3D
2D
3D
360 450 cd/m
1
Max Luminance
(Center 1-point /
Full White Pattern)
100125 cd/m
T645HW05-V0
0.630
RED
0.330
0.320
GREEN
0.620
0.150
BLUE
0.040
0.280
WHITE
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Typ.
-0.03
0.290
Typ.
+0.03
T315HB01-V0
0.650
RED
0.333
0.307
GREEN
0.604
0.150
BLUE
0.059
0.279
WHITE
Typ.
-0.05
0.292
Typ.
+0.05
LC420EUF-SDF1
0.648
RED
0.332
0.306
GREEN
0.606
0.150
BLUE
0.058
0.279
WHITE
Typ.
-0.05
0.292
Typ.
+0.05
LC470EUF-SDF1
2 Color
coordinate
(Default)
REDTyp. 0.648 Typ. LC550EUF-SDF1
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 12 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA12C Chassis applied LCD TV
all models manufactured in TV factory .
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the
circumstance of 25±5°C of temperature and 65±10%
of relative humidity
2.4 The input voltage of the receiver must keep
100~240V~, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15. In case of keeping module
is in the circumstance of 0°C, it should be placed in
the circumstance of above 15°C for 2 hours In case
of keeping module is in the circumstance of below 20°C, it should be placed in the circumstance of
above 15°C for 3 hours.
• Caution
When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. Adjustment items
3.1 Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID downloads for HDMI and RGB-PC
• Remark
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly stages can be checked by using the
INSTART Menu 1.ADJUST CHECK.
3.2 Final Assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (IN-STOP)
(5) GND and HI-POT test
3.3. Appendix
(1)Tool option menu, USB Download (S/W Update, Option
and Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4. MAIN PCBA Adjustments
4.1. ADC Calibration
4.1.1. Overview
• ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
1) Connect: PCBA Jig RS-232C Port == PC RS-232C Port
4.2.5. Download
1) US, Canada models (11Y LCD TV + MAC + Widevine +
ESN Key)
2) Korea, Mexico models (11Y LCD TV + MAC + Widevine
Only)
4.1.6. Inspection
- In INSTART menu, check these keys.
4.3. LAN port Inspection (Ping Test)
4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
4.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) Remove LAN CABLE
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.4. EDID Download
4.4.1. Overview
• It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.4.2. Equipment
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
• Adjust remocon.
4.3.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
* Caution) When EDID Download, must remove RGB/HDMI
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
1) Surrounding Temperature: 25±5°C
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
4) Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.6.2. Test method
(1) Input 3D test signal as Fig.1.
<Step1><Step2><Step3>
<Step4><Step5>
O
K
O K
Fig.1
<HDMI Mode 872, Pattern No.83
Fig.2
- 19 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.7. HDMI ARC Function Inspection
5.7.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220
↑)
- HDMI Cable (for 1.4 version)
5.7.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 20 -
LV1
LV2
¿˝¿¸∏µ ø‹∫¿‘∑
§ø§
¿‘√øµªÛ
3D
TV
¿∑
¿ß¡¨
Ω∏∆ TV
¿Ã¿¸
∞∆º¡§
3D ø…º«
≥∞±
»Æ¿Œ
«ˆ¿Áπº¤
πº¤æ»≥ ¡§∫«•Ω
≥»
º±»£√≥
∆¿Ã¡ˆ
øµªÛ√≥∏∑
¡øλ˜
º±≈
¡ˆøÚ
«—/øµ/º˝¿⁄
ó
»√∞
¿Ã¿¸√≥
A2
A23
A13
A5
A10
300
200
500
120
510
511
810
900
910
800
530
540
521
400
710
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN/SC R,G,B Trace
INCM_R
INCM_G
INCM_B
INCM_VID_COMP1
INCM_VID_AV2
INCM_TUNER
INCM_VID_AV1
INCM_VID_SC/COMP2
BCM35230_with_CAP_220pF
IC101-*1
LGE35230
B6
BCM_CAP
VI_R
A6
VI_INCM_R
C7
VI_G
A7
VI_INCM_G
B7
VI_B
C8
VI_INCM_B
C13
HSYNC_IN
A13
VSYNC_IN
C9
VI_Y1
A9
VI_PR1
B9
VI_PB1
B8
VI_INCM_COMP1
C11
VI_SC_R1
A10
VI_SC_G1
B10
VI_SC_B1
C10
VI_INCM_SC1
D10
VI_FB_1/GPIO
F13
VI_FS1
A12
VI_SC_R2
C12
VI_SC_G2
B12
VI_SC_B2
B11
VI_INCM_SC2
E12
VI_FB_2/GPIO
E14
VI_FS2
E15
VI_L1
F17
VI_C1_1
E16
VI_INCM_LC1_1
F14
VI_C1_2
E11
VI_INCM_LC1_2
C18
VI_CVBS1
B18
VI_INCM_CVBS1
A18
VI_CVBS2
C19
VI_INCM_CVBS2
A19
VI_CVBS3
B19
VI_INCM_CVBS3
C20
VI_CVBS4
B20
VI_INCM_CVBS4
E19
VI_SIF1_1
D19
VI_INCM_SIF1_1
E10
VI_SIF1_2
F11
VI_INCM_SIF1_2
0.1uFC320
0.1uFC321
DSUB_G+
INCM_G
0.1uFC322
0.1uFC323
0R325
R316
36
R313
10K
0.1uFC319
R314
12K
R315
120
OPT
+2.5V_BCM35230
0.1uFC327
0.1uFC328
R317
36
DSUB_HSYNC
DSUB_VSYNC
R318
0
SC_FB
0.1uFC325
0.1uFC326
R319
10K
OPT
0.1uFC324
R320
12K
OPT
LGE35230(BCM35230KFSBG)
C13
A13
0.1uFC329
0.1uFC330
0.1uFC331
0.1uFC332
C11
0.1uFC333
A10
0.1uFC334
B10
0.1uFC335
C10
0.1uFC336
D10
F13
A12
C12
B12
B11
E12
E14
E15
F17
E16
F14
E11
C18
B18
A18
C19
A19
B19
C20
B20
E19
D19
E10
F11
B6
A6
C7
A7
B7
C8
C9
A9
B9
B8
SCL3_3.3V
SDA3_3.3V
+3.3V_Normal
R301
1.2K
C301
33pF
50V
PHONE JACK
INCM_AUD_SC/COMP2
R302
1.2K
M_REMOTE_TX
C302
33pF
50V
AV1_R_IN
INCM_AUD_AV1
AV2_R_IN
INCM_AUD_AV2
SC/COMP2_L_IN
SC/COMP2_R_IN
PC_L_IN
PC_R_IN
AV1_L_IN
AV2_L_IN
LGE35230(BCM35230KFSBG)
B15
SPDIF_INC_P
C15
SPDIF_INC_N
C14
SPDIF_IND_P
B14
SPDIF_IND_N
G4
I2SSCK_IN/GPIO
F4
I2SWS_IN
G5
I2SSD_IN/GPIO
1uF 10VC305
1uF 10VC306
1uF 10VC307
1uF 10VC308
1uF 10VC309
1uF 10VC310
1uF 10VC311
1uF 10VC312
1uF 10VC313
1uF 10VC314
1uF 10VC315
1uF 10VC316
C25
B24
A24
E22
E23
D23
C24
C23
B23
E21
D21
D22
B22
C22
A22
F21
D20
E20
A21
C21
B21
AADC_LINE_L1
AADC_LINE_R1
AADC_INCM1
AADC_LINE_L2
AADC_LINE_R2
AADC_INCM2
AADC_LINE_L3
AADC_LINE_R3
AADC_INCM3
AADC_LINE_L4
AADC_LINE_R4
AADC_INCM4
AADC_LINE_L5
AADC_LINE_R5
AADC_INCM5
AADC_LINE_L6
AADC_LINE_R6
AADC_INCM6
AADC_LINE_L7
AADC_LINE_R7
AADC_INCM7
IC101
NON_BCM_CAP
I2SSCK_OUTA/GPIO
I2SWS_OUTA/GPIO
I2SSD_OUTA0/GPIO
I2SSOSCK_OUTA/GPIO
I2SSD_OUTA1/GPIO
I2SSD_OUTA2/GPIO
I2SSCK_OUTC/GPIO
I2SWS_OUTC/GPIO
I2SSD_OUTC/GPIO
I2SSOSCK_OUTC/GPIO
I2SSCK_OUTD/GPIO
I2SWS_OUTD/GPIO
I2SSD_OUTD/GPIO
I2SSOSCK_OUTD/GPIO
SPDIF_OUTA/GPIO
AUDMUTE_0/GPIO
AUDMUTE_1
ADAC_AL_N
ADAC_AL_P
ADAC_AR_N
ADAC_AR_P
ADAC_CL_N
ADAC_CL_P
ADAC_CR_N
ADAC_CR_P
ADAC_DL_N
ADAC_DL_P
ADAC_DR_N
ADAC_DR_P
TU_RESET_SUB
HP_DET
AV1_CVBS_DET
TU_RESET
SC_RE1
SC_RE2INCM_AUD_PC
/RST_HUB
S2_RESET
SPDIF_OUT
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
100R326
100R327
100R328
100R329
C337
22pF
OPT
C338
22pF
OPT
C339
22pF
OPT
AUD_SCK
AUD_LRCK
AUD_LRCH
AUD_MASTER_CLK
C340
33pF
OPT
AUDIO INCM
Route Between AV1_L_IN & AV1_R_IN Trace
Near
Near
Near
Near
Near
JK1102
JK1103
JK2501
JK1104
JK801
TU2101/2
TU2201/2/3
0R321
Route Between SC/COMP2_L_IN & SC/COMP2_R_IN Trace
0R322
Route Between AV2_L_IN & AV2_R_IN Trace
0R323
Route Between PC_L_IN & PC_R_IN Trace
0R324
Route Along With TUNER_SIF_IF_N
INCM_AUD_AV1
INCM_AUD_SC/COMP2
INCM_AUD_AV2
INCM_AUD_PC
INCM_SIF
AF8
AF9
AG9
AC9
AD8
AD9
E2
F2
E3
F3
G2
G3
G1
H1
B13
AG8
E13
C28
C27
D28
D27
C26
A27
B27
B28
B25
A25
A26
B26
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
MAIN DDR
4
50
FROM LIPS & POWER B/D
RL_ON
+3.5V_ST
+12V
#16/#20/#23
LD - GND OR USE
LE(N.L.D.) - OPEN
LE(L.D.) - USE
R502
10K
B
MLB-201209-0120P-N2
MLB-201209-0120P-N2
C506
0.1uF
50V
L501
C508
0.1uF
16V
C
E
Q501
2SC3052
L503
+3.5V_ST
R508
4.7K
RT1P141C-T112
Q502
1
2
3
PWR ON
GND/P.DIM2
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
SMAW200-H24S2
NORMAL_26~55
P502
FW20020-24S
1
1
3
3
5
5
7
7
9
9
11
11
13
13
15
15
17
17
19
19
2122
21
2324
23
SLIM_32~55
25
P501
2
2
4
4
6
6
8
8
10
10
12
12
14
14
16
16
18
18
20
20
22
24
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
L504
MLB-201209-0120P-N2
POWER_16_URSA_SCAN
POWER_16_BCM_SCAN
0
R518
POWER_16_GND
R574
R573
C519
0.1uF
50V
Power_DET
PD_+20V
R510-*4
5.6K
1%
PD_+20V
R511-*4
1.3K
1%
PD_+18.5V
R510-*3
4.7K
1%
PD_+18.5V
R511-*3
1.21K
1%
+12V
1.21K
1%
PD_+12V
R512
2.7K
1%
NON_PD_+3.5V
R513
+24V
+3.5V_ST
PD_24V
R510
8.2K
1%
PD_24V
R511
1.5K
1%
PD_+3.5V
R515
0
5%
VCC
C580
0.1uF
16V
VCC
C581
0.1uF
16V
NON_PD_+3.5V
R517
100K
IC503
NCP803SN293
3
1
GND
NON_PD_+3.5V
R516
100K
NON_PD_+3.5V
IC502
NCP803SN293
3
1
GND
+3.5V_ST
R522
10K
OPT
R520
RESET
2
RESET
2
100
R519
100
NON_PD_+3.5V
+0.9V_CORE_BCM35230
+12V
L502
BLM18PG121SN1D
Placed on SMD-TOP
C505
C503
10uF
10uF
16V
16V
POWER_ON/OFF2_2
R503
C504
100pF
50V
0.9V_CORE_FB
R501
12K
1/16W
1%
R2
1K
R504
2K
+3.3V_Normal
TEST
C507
1000pF
50V
R505
6.8K
10K
R506
330
R1
R507
50VC509
220pF
OPT
C510
0.01uF
50V
ENABLE
FB
COMP
VDD
PGD
C513
0.1uF
16V
0.9V_CORE_FB
IC501
TPS40192DRCR
1
2
3
4
5
EP_GND
HDRV
10
SW
11
9
THERMAL
8
7
6
BOOT
LDRV
BP5
C515
0.47uF
C516
25V
4.7uF
10V
Vout=0.591*(1+R1/R2)
4.7R577
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.