LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied LCD TV with LA12C chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature:
20ºC ± 5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : UL, CSA, IEC specification
- EMC : FCC, ICES, IEC specification
- Wireless : WirelessHD Specification (Option)
No Item Specification Remark
1. Receiving System 1) ATSC / NTSC-M OK
2. Available Channel 1) VHF : 02~13 OK
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
3. Input Voltage 1) AC 100 ~ 240V~, 50/60Hz OK 110V, 50/60Hz on the label
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. HDMI Input - 3D
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 Side by Side HDTV 1080I
Top & Bottom
2 1280*720 Side by Side HDTV 720P
Top & Bottom
9. RGB-PC Input - 3D
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 67.50 60 148.50Side by Side HDTV 1080P
Top & Bottom
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1280*720 90.00 60.00 148.50 HDMI 3D Frame Packing1.4a HDTV 720P
2 1280*720 45.00 60.00 74.25 Side by Side 1.3 HDTV 720P
Top & Bottom 1.4a HDTV 720P
HDMI 3D Top & Bottom
3 1920*1080 33.75 60.00 74.25 Side by Side , 1.3 HDTV 1080I
Top & Bottom
HDMI 3D Side by Side 1.4a HDTV 1080I
(Half)
4 1920*1080 67.50 60 148.50 Side by Side 1.3 HDTV 1080P
Top & Bottom
Checkerboard
Single Frame Sequential
5 1920*1080 54.00 24.000 148.50 HDMI 3D Frame Packing 1.4a HDTV 1080P
6 1920*1080 27.00 24.000 74.25 Side by Side 1.3 HDTV 1080P
Top & Bottom
Checkerboard
HDMI 3D Top & Bottom 1.4a HDTV 1080P
7 1920*1080 67.50 30.000 148.50 HDMI 3D Frame Packing 1.4a HDTV 1080P
8 1920*1080 33.75 30.000 74.25 Side by Side 1.3 HDTV 1080P
Top & Bottom
Checkerboard
7. RF Input - 3D
Page 10
- 10 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
NoSide by Side Top & Bottom Checkerboard
Single Frame Sequential
Frame Packing
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 33.75 30.000 74.25Side by Side HDTV 1080P
Top & Bottom
Checkerboard
No Resolution H-freq(kHz) V-freq.(Hz)
Pixel clock(MHz
) 3D input proposed mode Proposed
1 1920*1080 33.75 30.000 74.25Side by Side HDTV 1080P
Top & Bottom
Checkerboard
10. USB Input - 3D
11. DLNA Input - 3D
12. 3D Input
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. Optical specs for LCD Module.
0.334
0.307
GREEN
0.606
0.152
BLUE
0.058
0.279
WHITE
-0.05
0.292
+0.05
0.630
RED
0.330
0.320
GREEN
0.620
0.150
BLUE
0.040
0.280
WHITE
Typ.
-0.05
0.290
Typ.
+0.05
T645HW05-V0
1,100:1 1,600:1LGD Module
3 Contrast ratio
3,200:1 4,000:1AUO Module (32LW5700/65LW6500)
4 3D Crosstalk 1 3 %
5 Luminance Uniformity 1.3 % 2D Only
Response Time(Gray to Gray) 5 6 ms
Response Time(MPRT) 6 9 ms
Response Time(Uniformity / MPRT) 1
6
Response Time(Uniformity / G to G) 1
No Item Min Typ Max Unit Remark
320400 cd/m
100250 cd/m
T315HB01-V0
320400 cd/m
120150 cd/m
LC420EUF-SDF1
320400 cd/m
120150 cd/m
LC470EUF-SDF1
320400 cd/m
120150 cd/m
LC550EUF-SDF1
2D
3D
2D
3D
2D
3D
2D
3D
2D
3D
360 450 cd/m
1
Max Luminance
(Center 1-point /
Full White Pattern)
100125 cd/m
T645HW05-V0
0.630
RED
0.330
0.320
GREEN
0.620
0.150
BLUE
0.040
0.280
WHITE
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
X
Typ.
-0.03
0.290
Typ.
+0.03
T315HB01-V0
0.650
RED
0.333
0.307
GREEN
0.604
0.150
BLUE
0.059
0.279
WHITE
Typ.
-0.05
0.292
Typ.
+0.05
LC420EUF-SDF1
0.648
RED
0.332
0.306
GREEN
0.606
0.150
BLUE
0.058
0.279
WHITE
Typ.
-0.05
0.292
Typ.
+0.05
LC470EUF-SDF1
2 Color
coordinate
(Default)
REDTyp. 0.648 Typ. LC550EUF-SDF1
Page 12
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Only for training and service purposes
- 12 -
ADJUSTMENT INSTRUCTION
1. Application range
This spec. sheet applies to LA12C Chassis applied LCD TV
all models manufactured in TV factory .
2. Specification
2.1 Because this is not a hot chassis, it is not necessary
to use an isolation transformer. However, the use of
isolation transformer will help protect test instrument.
2.2 Adjustment must be done in the correct order.
2.3 The adjustment must be performed in the
circumstance of 25±5°C of temperature and 65±10%
of relative humidity
2.4 The input voltage of the receiver must keep
100~240V~, 50/60Hz.
2.5 The receiver must be operated for about 5 minutes
prior to the adjustment when module is in the
circumstance of over 15. In case of keeping module
is in the circumstance of 0°C, it should be placed in
the circumstance of above 15°C for 2 hours In case
of keeping module is in the circumstance of below 20°C, it should be placed in the circumstance of
above 15°C for 3 hours.
• Caution
When a still image is displayed for 20 minutes or longer
(especially where W/B scale is strong. Digital pattern 13ch
and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
3. Adjustment items
3.1 Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID downloads for HDMI and RGB-PC
• Remark
- Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and
final assembly stages can be checked by using the
INSTART Menu 1.ADJUST CHECK.
3.2 Final Assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (IN-STOP)
(5) GND and HI-POT test
3.3. Appendix
(1)Tool option menu, USB Download (S/W Update, Option
and Service only)
(2) Manual adjustment for ADC calibration and White balance.
(3) Shipment conditions, Channel pre-set
4. MAIN PCBA Adjustments
4.1. ADC Calibration
4.1.1. Overview
• ADC adjustment is needed to find the optimum black level
and gain in Analog-to-Digital device and to compensate RGB
deviation.
1) Connect: PCBA Jig RS-232C Port == PC RS-232C Port
4.2.5. Download
1) US, Canada models (11Y LCD TV + MAC + Widevine +
ESN Key)
2) Korea, Mexico models (11Y LCD TV + MAC + Widevine
Only)
4.1.6. Inspection
- In INSTART menu, check these keys.
4.3. LAN port Inspection (Ping Test)
4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
4.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) Connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) Remove LAN CABLE
Page 14
- 14 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.4. EDID Download
4.4.1. Overview
• It is a VESA regulation. A PC or a MNT will display an
optimal resolution through information sharing without any
necessity of user input. It is a realization of “Plug and Play”.
4.4.2. Equipment
• Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
• Adjust remocon.
4.3.3 Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.
5) If Download is failure, Re-try downloads.
* Caution) When EDID Download, must remove RGB/HDMI
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to
prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find
the desired value.
(3) Adj. condition: normal temperature
1) Surrounding Temperature: 25±5°C
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
4) Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark
surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be
within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
1) After Aging Start, Keep the Power ON status during 5
Minutes.
2) In case of LCD, Back-light on should be checked using no
signal or Full-white pattern.
5.6.2. Test method
(1) Input 3D test signal as Fig.1.
<Step1><Step2><Step3>
<Step4><Step5>
O
K
O K
Fig.1
<HDMI Mode 872, Pattern No.83
Fig.2
Page 19
- 19 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
5.7. HDMI ARC Function Inspection
5.7.1. Test equipment
- Optic Receiver Speaker
- MSHG-600 (SW: 1220
↑)
- HDMI Cable (for 1.4 version)
5.7.2. Test method
(1) Insert the HDMI Cable to the HDMI ARC port from the
master equipment (HDMI1)
(2) Check the sound from the TV Set
(3) Check the Sound from the Speaker or using AV & Optic
TEST program (It’s connected to MSHG-600)
* Remark: Inspect in Power Only Mode and check SW version
in a master equipment
Page 20
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 20 -
LV1
LV2
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A2
A23
A13
A5
A10
300
200
500
120
510
511
810
900
910
800
530
540
521
400
710
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN/SC R,G,B Trace
INCM_R
INCM_G
INCM_B
INCM_VID_COMP1
INCM_VID_AV2
INCM_TUNER
INCM_VID_AV1
INCM_VID_SC/COMP2
BCM35230_with_CAP_220pF
IC101-*1
LGE35230
B6
BCM_CAP
VI_R
A6
VI_INCM_R
C7
VI_G
A7
VI_INCM_G
B7
VI_B
C8
VI_INCM_B
C13
HSYNC_IN
A13
VSYNC_IN
C9
VI_Y1
A9
VI_PR1
B9
VI_PB1
B8
VI_INCM_COMP1
C11
VI_SC_R1
A10
VI_SC_G1
B10
VI_SC_B1
C10
VI_INCM_SC1
D10
VI_FB_1/GPIO
F13
VI_FS1
A12
VI_SC_R2
C12
VI_SC_G2
B12
VI_SC_B2
B11
VI_INCM_SC2
E12
VI_FB_2/GPIO
E14
VI_FS2
E15
VI_L1
F17
VI_C1_1
E16
VI_INCM_LC1_1
F14
VI_C1_2
E11
VI_INCM_LC1_2
C18
VI_CVBS1
B18
VI_INCM_CVBS1
A18
VI_CVBS2
C19
VI_INCM_CVBS2
A19
VI_CVBS3
B19
VI_INCM_CVBS3
C20
VI_CVBS4
B20
VI_INCM_CVBS4
E19
VI_SIF1_1
D19
VI_INCM_SIF1_1
E10
VI_SIF1_2
F11
VI_INCM_SIF1_2
0.1uFC320
0.1uFC321
DSUB_G+
INCM_G
0.1uFC322
0.1uFC323
0R325
R316
36
R313
10K
0.1uFC319
R314
12K
R315
120
OPT
+2.5V_BCM35230
0.1uFC327
0.1uFC328
R317
36
DSUB_HSYNC
DSUB_VSYNC
R318
0
SC_FB
0.1uFC325
0.1uFC326
R319
10K
OPT
0.1uFC324
R320
12K
OPT
LGE35230(BCM35230KFSBG)
C13
A13
0.1uFC329
0.1uFC330
0.1uFC331
0.1uFC332
C11
0.1uFC333
A10
0.1uFC334
B10
0.1uFC335
C10
0.1uFC336
D10
F13
A12
C12
B12
B11
E12
E14
E15
F17
E16
F14
E11
C18
B18
A18
C19
A19
B19
C20
B20
E19
D19
E10
F11
B6
A6
C7
A7
B7
C8
C9
A9
B9
B8
SCL3_3.3V
SDA3_3.3V
+3.3V_Normal
R301
1.2K
C301
33pF
50V
PHONE JACK
INCM_AUD_SC/COMP2
R302
1.2K
M_REMOTE_TX
C302
33pF
50V
AV1_R_IN
INCM_AUD_AV1
AV2_R_IN
INCM_AUD_AV2
SC/COMP2_L_IN
SC/COMP2_R_IN
PC_L_IN
PC_R_IN
AV1_L_IN
AV2_L_IN
LGE35230(BCM35230KFSBG)
B15
SPDIF_INC_P
C15
SPDIF_INC_N
C14
SPDIF_IND_P
B14
SPDIF_IND_N
G4
I2SSCK_IN/GPIO
F4
I2SWS_IN
G5
I2SSD_IN/GPIO
1uF 10VC305
1uF 10VC306
1uF 10VC307
1uF 10VC308
1uF 10VC309
1uF 10VC310
1uF 10VC311
1uF 10VC312
1uF 10VC313
1uF 10VC314
1uF 10VC315
1uF 10VC316
C25
B24
A24
E22
E23
D23
C24
C23
B23
E21
D21
D22
B22
C22
A22
F21
D20
E20
A21
C21
B21
AADC_LINE_L1
AADC_LINE_R1
AADC_INCM1
AADC_LINE_L2
AADC_LINE_R2
AADC_INCM2
AADC_LINE_L3
AADC_LINE_R3
AADC_INCM3
AADC_LINE_L4
AADC_LINE_R4
AADC_INCM4
AADC_LINE_L5
AADC_LINE_R5
AADC_INCM5
AADC_LINE_L6
AADC_LINE_R6
AADC_INCM6
AADC_LINE_L7
AADC_LINE_R7
AADC_INCM7
IC101
NON_BCM_CAP
I2SSCK_OUTA/GPIO
I2SWS_OUTA/GPIO
I2SSD_OUTA0/GPIO
I2SSOSCK_OUTA/GPIO
I2SSD_OUTA1/GPIO
I2SSD_OUTA2/GPIO
I2SSCK_OUTC/GPIO
I2SWS_OUTC/GPIO
I2SSD_OUTC/GPIO
I2SSOSCK_OUTC/GPIO
I2SSCK_OUTD/GPIO
I2SWS_OUTD/GPIO
I2SSD_OUTD/GPIO
I2SSOSCK_OUTD/GPIO
SPDIF_OUTA/GPIO
AUDMUTE_0/GPIO
AUDMUTE_1
ADAC_AL_N
ADAC_AL_P
ADAC_AR_N
ADAC_AR_P
ADAC_CL_N
ADAC_CL_P
ADAC_CR_N
ADAC_CR_P
ADAC_DL_N
ADAC_DL_P
ADAC_DR_N
ADAC_DR_P
AF8
AF9
AG9
AC9
AD8
AD9
E2
F2
E3
F3
G2
G3
G1
H1
B13
AG8
E13
C28
C27
D28
D27
C26
A27
B27
B28
B25
A25
A26
B26
TU_RESET_SUB
HP_DET
AV1_CVBS_DET
TU_RESET
SC_RE1
SC_RE2INCM_AUD_PC
/RST_HUB
S2_RESET
SPDIF_OUT
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
100R326
100R327
100R328
100R329
C337
22pF
OPT
C338
22pF
OPT
C339
22pF
OPT
AUD_SCK
AUD_LRCK
AUD_LRCH
AUD_MASTER_CLK
C340
33pF
OPT
AUDIO INCM
Route Between AV1_L_IN & AV1_R_IN Trace
Near
Near
Near
Near
Near
JK1102
JK1103
JK2501
JK1104
JK801
TU2101/2
TU2201/2/3
0R321
Route Between SC/COMP2_L_IN & SC/COMP2_R_IN Trace
0R322
Route Between AV2_L_IN & AV2_R_IN Trace
0R323
Route Between PC_L_IN & PC_R_IN Trace
0R324
Route Along With TUNER_SIF_IF_N
INCM_AUD_AV1
INCM_AUD_SC/COMP2
INCM_AUD_AV2
INCM_AUD_PC
INCM_SIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
MAIN DDR
4
50
Page 27
FROM LIPS & POWER B/D
RL_ON
+3.5V_ST
+12V
#16/#20/#23
LD - GND OR USE
LE(N.L.D.) - OPEN
LE(L.D.) - USE
R502
10K
B
MLB-201209-0120P-N2
MLB-201209-0120P-N2
C506
0.1uF
50V
L501
C508
0.1uF
16V
C
E
Q501
2SC3052
L503
+3.5V_ST
R508
4.7K
RT1P141C-T112
Q502
1
2
3
PWR ON
GND/P.DIM2
24V
GND
GND
3.5V
3.5V
GND
GND
12V
12V
12V
SMAW200-H24S2
NORMAL_26~55
P502
FW20020-24S
1
1
3
3
5
5
7
7
9
9
11
11
13
13
15
15
17
17
19
19
21
2122
23
2324
SLIM_32~55
25
P501
2
2
4
4
6
6
8
8
10
10
12
12
14
14
16
16
18
18
20
20
22
24
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
L504
MLB-201209-0120P-N2
POWER_16_URSA_SCAN
POWER_16_BCM_SCAN
0
R518
POWER_16_GND
R574
R573
C519
0.1uF
50V
Power_DET
PD_+20V
R510-*4
5.6K
1%
PD_+20V
R511-*4
1.3K
1%
PD_+18.5V
R510-*3
4.7K
1%
PD_+18.5V
R511-*3
1.21K
1%
+12V
1.21K
1%
PD_+12V
R512
2.7K
1%
NON_PD_+3.5V
R513
+24V
+3.5V_ST
PD_24V
R510
8.2K
1%
PD_24V
R511
1.5K
1%
PD_+3.5V
R515
0
5%
VCC
C580
0.1uF
16V
VCC
C581
0.1uF
16V
NON_PD_+3.5V
R517
100K
IC503
NCP803SN293
3
1
GND
NON_PD_+3.5V
R516
100K
NON_PD_+3.5V
IC502
NCP803SN293
3
1
GND
+3.5V_ST
R522
10K
OPT
R520
RESET
2
RESET
2
100
R519
100
NON_PD_+3.5V
+0.9V_CORE_BCM35230
+12V
L502
BLM18PG121SN1D
Placed on SMD-TOP
C505
C503
10uF
10uF
16V
16V
POWER_ON/OFF2_2
R503
C504
100pF
50V
0.9V_CORE_FB
R501
12K
1/16W
1%
R2
1K
R504
2K
+3.3V_Normal
TEST
C507
1000pF
50V
R505
6.8K
10K
R506
330
R1
R507
50VC509
220pF
OPT
C510
0.01uF
50V
ENABLE
FB
COMP
VDD
PGD
C513
0.1uF
16V
0.9V_CORE_FB
IC501
TPS40192DRCR
1
2
3
4
5
EP_GND
HDRV
10
SW
11
9
THERMAL
8
7
6
BOOT
LDRV
BP5
C515
0.47uF
C516
25V
4.7uF
10V
Vout=0.591*(1+R1/R2)
4.7R577
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
HDMI4
D2-_HDMI4
D2+_HDMI4
DDC_SCL_1
DDC_SDA_1
HDMI_HPD_1
DDC_SCL_2
DDC_SDA_2
HDMI_HPD_2
BCM35230
HDMI7
31
Page 30
RGB/ PC AUDIO/ SPDIF/ EARPHONE/ RS232C
RGB PC
DSUB_VSYNC
DSUB_HSYNC
DUAL COMPONENT
LPF READEY
(For H/P Noise Improvement)
R868
0
R869
0
C828
0.22uF
10V
Q801EB
2SC3052
C829
0.22uF
10V
BG2012B080TF
+3.3V_Normal
C
BG2012B080TF
R842
4.7K
L804
L805
HP_LOUT
OPT
R843
0
R844
1K
SIDE_HP_MUTE
HP_ROUT
D811
5.6V
OPT
+5V_Normal
EDID_WP
RGB_DDC_SCL
RGB_DDC_SDA
+3.3V_Normal
R819
10K
1K R820
D812
5.6V
ESD_COMMON
D812-*1
5.6V
ESD_CERADIODE
DSUB_DET
EARPHON JACK
+3.3V_Normal
R822
2.7K
HP_LOUT
HP_DET
1K R821
HP_ROUT
EARPHONE AMP
HP_LOUT_N
HP_LOUT_P
HP_ROUT_P
HP_ROUT_N
R823
R824
4.7K
OPT
C819
1uF
C816
1uF
10V
C817
1uF
10V
10V
10V
C818
1uF
R825
R826
OPT
OPT
KJA-PH-0-0177
5GND
4L
3DETECT
1R
0
0
JK803
EAG61030001
SPK_R+_HOTEL
SPK_R-_HOTEL
OPT
R828
R827
4.7K
INL-
INL+
INR+
INR-
Close to the IC
OUTL
16
1
2
3
4
EAN60724701
5G06G17
OUTR
SGND
15
IC804
TPA6132A2
+3.3V_Normal
14
D810
KDS184
A2
C
A1
IC801
74F08D
D0A
1
D0B
R801
22
R802
22
2
Q0
3
D1A
0R850
4
OPT
D1B
0R851
5
OPT
Q1
6
GND
7
DSUB_B+
DSUB_G+
DSUB_R+
+5V_Normal
IC802
VCC
14
D3B
13
D3A
12
Q3
11
D2B
0R852
10
OPT
D2A
0R853
9
OPT
Q2
8
R807
10K
OPT
R808
10K
OPT
R812
75
R811
75
R813
75
D804
C830
47pF
50V
C831
47pF
50V
C832
47pF
50V
30V
D805
30V
AT24C02BN-SH-T
A0
1
A1
2
A2
3
GND
4
5.6V
D808-*1
ESD_CERADIODE
5.6V
D806-*1
ESD_CERADIODE
5.6V
D807-*1
ESD_CERADIODE
C807
22pF
50V
C808
22pF
50V
ESD_COMMON
D808
30V
ESD_COMMON
D806
30V
ESD_COMMON
D807
30V
VCC
8
WP
7
SCL
6
SDA
5
BLM15BD121SN1
BLM15BD121SN1
L807
BLM15BD121SN1
L808
Closed to JACK
L806
C809
18pF
R814
R815
2.7K
2.7K
C810
18pF
50V
50V
R817
10K
22R848
22R847
D809
5.6V
OPT
5
91010
15
L803
120-ohm
BLM18PG121SN1D
C822
10uF
10V
C821
1uF
10V
EN13VDD
12
11
10
9
8
HPVSS
C823
2.2uF
10V
D804,D805,D806
D807,D808,D813
D814
D810
Q801
IC805
C824
0.1uF
16V
HPVDD
CPP
2.2uF
PGND
CPN
1ST : EAH39491601, 2ND : EAH33945901
1ST : 0DD184009AA, 2ND : 0DSIH00028A
1ST : 0TRIY80001A, 2ND : 0TR387500AA
1ST : EAN61151201, 2ND : EAN61130001
R837
C825
100K
2.2uF
OPT
10V
C826
10V
PC AUDIO
JK801
KJA-PH-0-0177
SPDIF OUT
SPDIF_OUT
5 GND
4L
3 DETECT
1R
ESD_COMMON
ESD_COMMON
R803
0
D801
AMOTECH
5.6V
D802
AMOTECH
5.6V
R804
470K
R805
470K
R806
2.7K
R866
22
C801
560pF
50V
R867
22
C802
560pF
50V
+3.3V_Normal
D803
30V
OPT
C803
0.1uF
16V
C804
560pF
50V
C805
560pF
50V
PC_L_IN
PC_R_IN
2F11TC1-EM52-4F
VIN
A
VCC
B
GND
C
JK802
Fiber Optic
4
SHIELD
111112121313141415
6677889
112233445
JK804
SLIM-15F-D-2
16
16
RS232C
10
5
JP809
9
8
7
6
SPG09-DB-009
JK805
R862
0
R863
0
R864
0
R865
0
4
3
2
1
BCM_RX
NEC_RXD
BCM_TX
NEC_TXD
0.1uF C812
C813
0.1uF
0.1uF C814
0.1uF C815
DOUT2
RIN2
0
IR_OUT
100
+3.5V_ST
IC803
MAX3232CDR
C1+
1
V+
2
C1-
3
C2+
4
C2-
5
V-
6
7
8
EAN41348201
VCC
16
GND
15
DOUT1
14
RIN1
13
ROUT1
12
DIN1
11
DIN2
10
ROUT2
9
R833
100
R834
ESD_COMMON
D813-*1
D813
30V
5.6V
ESD_CERADIODE
+3.5V_ST
D814
30V
ESD_COMMON
5.6V
D814-*1
R860
4.7K
OPT
IR_OUT
ESD_CERADIODE
R861
4.7K
OPT
R838
JP810
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
2010.10.21
8COMMON JACK
58
Page 31
Q901,Q902,Q903
Q904,Q905,Q906
D903,D904
D905,D906
DUAL COMPONENT
1ST : 0TRIY80001A 2ND : 0TR387500AA
1ST : EAH42720601, 2ND : EAH60994401
IR & KEY
IR
2SC3052
Q901
R903
47K
+3.5V_ST
C
E
R902
0
OPT
+3.5V_ST
IR_12P
P902
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
EEPROM_SCL
EEPROM_SDA
LED_B/LOGO
LED_R/BUZZ
+3.3V_Normal
BLM18PG121SN1D
16V
EEPROM_SCL
EEPROM_SDA
L902
C913
0.1uF
ESD_ATSC
16V
R920
R919
10K
10K
1%
1%
R915
COMMERCIAL
R913
10K
COMMERCIAL
R914
10K
2SC3052
WIRELESS
2SC3052
WIRELESS
Q905
Q906
R917
R918
100
R916
100
47K
47K
+3.5V_ST
C
E
+3.5V_ST
C
E
B
COMMERCIAL
B
WIRELESS
D902
5.6V
C901
0.1uF
+3.5V_ST
C902
0.1uF
16V
OPT
R921
47K
0.1uF
L901
BLM18PG121SN1D
C904
0.1uF
S/T_SCL
S/T_SDA
C903
AMOTECH
16V
OPT
D901
5.6V
C905
1000pF
50V
R935
100
R936
100
AMOTECH
ESD_ATSC
LED_B/LG_LOGO
C912
0.1uF
Zener Diode is
close to wafer
R922
47K
KEY1
+3.5V_ST
R905
47K
R904
10K
B
Q902
2SC3052
R908
47K
C
B
E
COMMERCIAL
R906
COMMERCIAL_EU
COMMERCIAL
22
COMMERCIAL_EU
Q903
2SC3052
COMMERCIAL_US
IR_OUT
WIRELESS
R907
WIRELESS
WIRELESS
22
Q904
2SC3052
WIRELESS
IR_PASS
R909
3.3K
OPT
R911
R912
+3.5V_ST
+3.5V_ST
47K
+3.5V_ST
47K
C
B
E
COMMERCIAL_EU
R910
0
C
B
E
WIRELESS
KEY2
C911
100pF
50V
R933
100
R934
100
D907
5.6V
AMOTECH
LED_R/BUZZ
D903
CDS3C05HDMI1
5.6V
D904
CDS3C05HDMI1
5.6V
D905
CDS3C05HDMI1
5.6V
D906
CDS3C05HDMI1
5.6V
1.5KR928
R929
1.5K
KEY1
KEY2
S/T_SCL
ST_SDA
GND
3.5V
GND
GND
3.3V
GND
IR
IR_15P
P901
12507WR-15L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
IR/KEY
9
50
Page 32
D1001,D1002
Q1001
Q1002
DUAL COMPONENT
1ST : EAH42720601 2ND : EAH60994401
1ST : EBK61012601, 2ND : 0TRDI80002A
1ST : EBK60752501, 2ND : EBK61011501
Wireless power
+24V
R1002
22K
WIRELESS
R1003
2.2K
WIRELESS
WIRELESS_PWR_EN10K
R1001
WIRELESS
B
WIRELESS
C
Q1001
MMBT3904(NXP)
WIRELESS
E
C1002
2.2uF
WIRELESS
Q1002
AO3407A
JK1001
KJA-PH-3-0168
DETECT
GND_1
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
RESET
WIRELESS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
IR
18
19
20GND_6
21
SHIELD
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_2
VCC(24V/20V/17V)_3
VCC(24V/20V/17V)_4
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_1
+3.3V_Normal
S
G
D
L1001
MLB-201209-0120P-N2
WIRELESS
C1004
10uF
35V
WIRELESS
WIRELESS_DET
WIRELESS_SCL
WIRELESS_SDA
IR_PASS
WIRELESS
WIRELESS
CDS3C05HDMI1
D1001
WIRELESS
R1008
10K
1KR1007
5.6V
WIRELESS
CDS3C05HDMI1
D1002
INTERRUPT
5.6V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Wireless I2C connection with I2C_1
Address : 0X20
WIRELESS_SCL
WIRELESS_SDA
WIRELESS
WIRELESS
33R1005
SCL2_3.3V
33R1006
SDA2_3.3V
BCM35230
10
50WIRELESS
Page 33
CVBS 1 PHONE JACK
JK1102
KJA-PH-1-0177
5 M5_GND
4M4
3 M3_DETECT
1M1
6M6
5.6V
D1107
COMPONENT 1 PHONE JACK
JK1101
KJA-PH-1-0177
5 M5_GND
4M4
3 M3_DETECT
1M1
6M6
ZD1115
5.1V
ZD1116
D1108
5.6V
ZD1117
5.1V
ZD1110
ZD1111
5.1V
ZD1112
ZD1113
5.1V
ZD1114
D1105
5.6V
5.1V
D1101
5.6V
5.1V
5.1V
5.1V
R1110
470K
+3.3V_Normal
470K
R1109
75
R1111
R1105
2.7K
R1106
75
R1107
75
R1108
75
1%
1%
1%
1%
+3.3V_Normal
R1112
2.7K
C1106
47pF
50V
R1137
10
R1138
10
R1139
10
C1107
560pF
50V
C1108
560pF
50V
R1143
22
R1144
22
R1113
1K
R1136
10
R1114
1K
COMP_PI_OLD
CM2012FR27KT
C1102
27pF
50V
COMP_PI_OLD
CM2012FR27KT
C1103
27pF
50V
CM2012FR27KT
C1104
27pF
50V
L1110
L1111
L1112
FOR EMI
C1109
560pF
50V
C1110
560pF
50V
C1125
27pF
50V
COMP_PI_OLD
C1126
27pF
50V
C1127
27pF
50V
COMP1_DET
COMP1_Y
COMP1_Pb
COMP1_Pr
AV1_CVBS_DET
AV1_CVBS_IN
AV1_L_IN
AV1_R_IN
JACK_PACK
JK1105
PPJ238-01
6C
5C
4C
5B
4A
5A
6A
6H
5H
4H
5G
5F
7F
5E
7E
4D
5D
6D
COMPONENT PI Filter
CM2012FR10KT
C1102-*1
47pF
50V
CM2012FR10KT
C1117-*1
47pF
50V
[RD1]E-LUG
[RD1]O-SPRING
[RD1]CONTACT
[WH1]O-SPRING
[YL1]CONTACT
[YL1]O-SPRING
[YL1]E-LUG
[RD2]E-LUG
[RD2]O-SPRING_2
[RD2]CONTACT
[WH2]O-SPRING
[RD2]O-SPRING_1
[RD2]E-LUG-S
[BL2]O-SPRING
[BL2]E-LUG-S
[GN2]CONTACT
[GN2]O-SPRING
[GN2]E-LUG
L1110-*1
C1125-*1
47pF
50V
L1107-*1
C1130-*1
47pF
50V
CVBS2 REAR JACK
JK1104
PPJ233-01
AV2_JACK
5C
4C
3C
4B
3A
4A
5A
[RD]E-LUG
[RD]O-SPRING
[RD]CONTACT
[WH]C-LUG
[YL]CONTACT
[YL]O-SPRING
[YL]E-LUG
COMP2 REAR JACK
COMP2
COMP2
COMP2
COMP2
COMP2
COMP2
ZD1103
5.1V
ZD1104
ZD1105
5.1V
ZD1106
ZD1107
5.1V
ZD1108
5.1V
5.1V
5.1V
AV2
R1141
22
D1109
AMOTECH
5.6V
AV2
D1110
AMOTECH
5.6V
AV2
ZD1101
AV2
5.1V
ZD1102
AV2
5.1V
D1111
AV2
5.6V
COMP2
R1119
0
COMP2
R1124
75
COMP2
R1120
0
COMP2
R1125
75
COMP2
R1121
0
COMP2
R1126
75
D1112
5.6V
COMP2
D1113
5.6V
COMP2
COMP2
D1114
5.6V
R1116
AV2
470K
R1117
470K
AV2
R1118
AV2
75
+3.3V_Normal
R1128
2.7K
AV2
COMP2
R1122
470K
COMP2
R1123
470K
R1133
10
COMP2
R1134
10
COMP2
R1135
10
COMP2
+3.3V_Normal
COMP2
R1127
2.7K
COMP2_Pr
COMP2_Pb
COMP2_Y
C1120
47pF
50V
AV2
BLM18PG121SN1D
C1113
560pF
50V
COMP2
BLM18PG121SN1D
COMP2
C1114
560pF
50V
COMP2_Pr
COMP2_Pb
COMP2_Y
1K R1130
COMP2
C1118
560pF
50V
AV2
C1119
560pF
50V
AV2
COMP2
COMP2
R1142
22
R1129
AV2
L1103
L1104
C1123
560pF
50V
C1121
560pF
50V
COMP2
COMP2
C1122
560pF
50V
L1109
CM2012FR27KT
C1115
27pF
50V
L1108
CM2012FR27KT
C1116
27pF
50V
L1107
CM2012FR27KT
COMP_PI_OLD
C1117
27pF
50V
COMP_PI_OLD
FOR EMI
AV2
C1124
560pF
50V
AV2
COMP2
R1131
22
COMP2
R1132
22
AV2
R1140
10
SC/COMP2_R_IN
SC/COMP2_L_IN
SC_R/COMP2_Pr
C1128
27pF
50V
SC_B/COMP2_Pb
C1129
27pF
50V
SC_G/COMP2_Y
C1130
27pF
50V
COMP_PI_OLD
SC_DET/COMP2_DET
AV2
1K
AV2_R_IN
AV2_L_IN
AV2_CVBS_IN
AV2_CVBS_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
COMP/AV11
50
Page 34
USB_WIFI
+3.3V_Normal
WIFI_DM
L1203
BLM18PG121SN1D
WIFI
WIFI_DP
+3.3V_USB
+5V_USB
MLB-201209-0120P-N2
C1234
WIFI
0.1uF
16V
For EMI
Close to BCM IC
R1232
R1233
0
WIFI
0
WIFI
CDS3C05HDMI1
WIFI_ESD
WIFI
1uF
10V
C1209
0.1uF
C1210
WIFI
1/16W
12K1%R1204
120-ohmL1202 WIFI
WIFI
WIFI
D1201
5.6V
R1205
1M
WIFI
X1201
24MHz
WIFI
C1211
WIFI
15pF
C1233
0.1uF
16V
WIFI
C1213
1%
15pF
WIFI
CDS3C05HDMI1
SIDE_USB_DP
SIDE_USB_DM
C1232
100uF
16V
D1202
WIFI_ESD
5.6V
R1206
100K
WIFI
VDD
GND
DM
DP
P1201
12507WR-04L
WIFI
1
2
3
4
5
.
+3.3V_USB
D1201,D1202
D1203,D1204
D1205,D1206
1ST : EAH42720601 2ND : EAH60994401
USB / DVR Ready
MLB-201209-0120P-N2
C1231
100uF
3AU04S-305-ZC-(LG)
JK1201
1234
USB DOWN STREAM
5
16V
RCLAMP0502BATCT
D1207
DEV
DUAL COMPONENT
L1205
120-ohm
C1220
10uF
10V
D1203
CDS3C05HDMI1
5.6V
OUT_2
OUT_1
NC
FLG
IC1204
AP2191DSG
8
7
6
5
EAN61849601
GND
1
IN_1
2
IN_2
3
EN
4
D1205
CDS3C05HDMI1
5.6V
+3.3V_Normal
R1221
4.7K
OPT
USB_CTL1
NON_WIFI
R1230
NON_WIFI
NON_WIFI
NON_WIFI
R1223
2.7K
0R1224
0R1225
0
0R1231
/USB_OCD1
SIDE_USB_CTL1
SIDE_USB_OCD1
USB_DM1
USB_DP1
SIDE_USB_DM
SIDE_USB_DP
+5V_USB
C1224
0.1uF
+3.3V_USB
C1204
1uF
10V
WIFI
C1205
0.1uF
WIFI
USB_DM1
USB_DP1
USB_DM2
USB_DP2
C1206
0.1uF
WIFI
C1207
0.1uF
WIFI
C1208
0.1uF
WIFI
USBDM_DN[1]
USBDP_DN[1]
USBDM_DN[2]
USBDP_DN[2]
VDDA33_1
NC_1
NC_2
NC_3
NC_4
[EP]VSS
1
2
3
4
5
6
7
8
9
THERMAL
10
VDDA33_2
RBIAS36VDD33_3
37
TEST
XTALIN/CLKIN
PLLFILT
33
34
35
IC1202
USB2512B-AEZG
WIFI
11
12
13
OCS_N[1]
PRTPWR[1]/BC_EN[1]
C1212
USB_CTL1
/USB_OCD1
XTALOUT
32
14
CRFILT
WIFI
USBDM_UP
USBDP_UP
30
31
15
16
VDD33_1
C1214
0.1uF
PRTPWR[2]/BC_EN[2]
1uF
10V
WIFI
USB_CTL2
VDDA33_3
29
17
OCS_N[2]
SUSP_IND/LOCAL_PWR/NON_REM[0]
28
VBUS_DET
27
RESET_N
26
HS_IND/CFG_SEL[1]
25
SCL/SMBCLK/CFG_SEL[0]
24
VDD33_2
23
SDA/SMBDATA/NON_REM[1]
22
NC_8
21
NC_7
20
NC_6
19
18
NC_5
/USB_OCD2
WIFI
R1207
100K
C1216
0.1uF
WIFI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R1208
C1215
0.1uF
WIFI
WIFI
100K
R1209
WIFI
100K
R1212
100K
OPT
R1213
100K
OPT
R1215
R1214
R1216
+3.3V_USB
WIFI
C1217
4.7uF
C1218
0.1uF
OPT
100K
100K
100K
/RST_HUB
+3.3V_USB
OPT
OPT
OPT
USB
3AU04S-305-ZC-(LG)
JK1202
1234
USB DOWN STREAM
5
L1204
MLB-201209-0120P-N2
120-ohm
C1230
C1219
100uF
10uF
16V
10V
RCLAMP0502BATCT
D1208
DEV
NC
OUT_2
OUT_1
FLG
D1204
CDS3C05HDMI1
5.6V
IC1203
AP2191DSG
8
7
6
5
EAN61849601
GND
1
IN_1
2
IN_2
3
EN
4
D1206
CDS3C05HDMI1
5.6V
+3.3V_Normal
R1220
4.7K
OPT
USB_CTL2
R1228
NON_WIFI
NON_WIFI
NON_WIFI
NON_WIFI
R1222
2.7K
0
0R1229
0R1226
0R1227
+5V_USB
/USB_OCD2
SIDE_USB_CTL2
SIDE_USB_OCD2
USB_DM2
USB_DP2
WIFI_DM
WIFI_DP
C1223
0.1uF
BCM35230
USB + WIFI
12
Page 35
TI solution M_REMOTE OPTION
P1302
12507WR-12L
M_REMOTE
13
+3.3V_Normal
L1303
120-ohm
R1315
100
R1319
100
M_REMOTE
M_REMOTE
M_REMOTE
M_REMOTE
M_REMOTE
M_REMOTE
M_REMOTE
M_REMOTE
R1316
100
R1317
100
R1318
100
R1320
22
R1324
22
R1325
22
R1326
22
M_REMOTE_RX
3.3V
1
GND
2
3
4
5
6
7
8
9
10
11
12
.
RX
TX
RESET
DC
DD
GND
GPIO_0
GPIO_1
GPIO_2
3D_SYNC
M_REMOTE
M_REMOTE
ALL M_REMOTE OPTION
M_REMOTE_TX
3D_GPIO_0
3D_GPIO_1
3D_GPIO_2
3D_SYNC_RF
R1321
2.7K
M_REMOTE
R1322
2.7K
M_REMOTE
+3.3V_Normal
R1323
2.7K
M_REMOTE
M_RFModule_RESET
DC_MREMOTE
DD_MREMOTE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
13
50M_REMOCON
Page 36
Ethernet Block
JK1401
XRJH-01A-4-DA7-180-LG(B)
R1
1
R2
2
R3
3
R4
4
R5
5
R6
6
R7
7
R8
8
R9
9
R10[GND]
10
R11
11
YL_C
D1
YL_A
D2
GN_C
D3
GN_A
D4
12
SHIELD
R1402
+2.5V_BCM35230
240R1401
240
L1401
MLB-201209-0120P-N2
C1401
0.1uF
16V
+3.3V_Normal
D1403
5V
LAN_ESD
D1401
5.5V
LAN_ESD
LAN_ESD
D1405
DUAL COMPONENT
D1401,D1402
D1403,D1404
D1405,D1406
D1404
D1402
5.5V
LAN_ESD
5V
5.5V
LAN_ESD
D1406
5.5V
LAN_ESD
EPHY_ACTIVITY
EPHY_LINK
1ST : EAH42720601 2ND : EAH60994401
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
NON CI50
20
Page 39
NON_CHB & CHB TUNER (KOR/USA)
NON_CHB_TUNER_V_S
TU2101
UFA55AL
NC_1
1
NC_2
2
+B[+5V]
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+1.2V
13
+3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
NON_CHB_TUNER_H_S
TU2101-*1
UDA55AL
NC_1
1
NC_2
2
+B[+5V]
3
NC[RF_AGC]
4
AS
5
SCL
6
SDA
7
NC(IF_TP)
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+1.2V
13
+3.3V
14
RESET
15
IF_AGC_CNTL
16
DIF_1
17
DIF_2
18
19
SHIELD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CHB_TUNER
37
TU2102
TDSB-H031F
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
SHIELD
SW_CTL1[NC]
SW_CTL2[NC]
SW_5V
S_3.3V
S_1.8V
TU_SCL
TU_SDA
M_1.8V
M_SIF
M_3.3V
M_CVBS
GND_1
SD_1.2V
SD_3.3V
TU_RESET
M_IF_AGC
M_DIF[N]
M_DIF[P]
SD_ERROR
SD_SYNC
SD_VALID
SD_MCL
SD_D0
NC
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
SD_2.5V[OPT]
SD_RESET
SIF/NC
S_CVBS
SD_SCL
SD_SDA
R2101
R2163
OPT
close to TUNER
0
R2102
OPT
75
OPT
0
PIN 25~30 MUST BE SEPARATED TUNER GND
C2101
0.1uF
16V
OPT
C2105
C2103
0.1uF
100pF
16V
50V
CLOSE TO PIN 25
R2168
0
CHB
R2169
0
CHB
CLOSE TO PIN 29
C2102
18pF
50V
OPT
close to TUNER
RF_SWITCH_CTL
+1.26V_TU
OPT
C2106
100uF
16V
C2104
18pF
50V
SCL1_3.3V
SDA1_3.3V
+5V_TU
C2107
100pF
50V
R2104
C2108
16V
0.1uF
0
OPT
+3.3V_S_TU
OPT
R2106
R2107
100K
BLM18PG121SN1D
C2111
OPT
0.1uF
16V
Close to Tuner
BLM18PG121SN1D
Close to Tuner
C2112
100pF
50V
R2161
0
OPT
1/16W
5%
0
CHB
L2114
CHB
L2115 CHB
C2183
0.1uF
16V
+3.3V_DE
R2112
1K
R2113
1K
RF_SWITCH_CTL_2
CHB
close to TUNER
C2113
0.1uF
16V
IF_N
IF_P
+5V_TU
R2114
OPT
220
CHB
B
OPT
+3.3V_S_TU
C2117
100pF
50V
+1.8V_S_TU
C2115
100pF
50V
CHB
C2116
100uF
16V
E
C
C2121
16V
CHB
C2120
0.1uF
16V
CHB
C2118
18pF
50V
R2116
220
CHB
Q2101
MMBT3906(NXP)
CHB
IC2102
IC2103
0.1uF
C2122
18pF
50V
R2117
100
L2116
BLM18PG121SN1D
CHB
+3.3V_TU
R2166
1K
C2177
0.1uF
Close to Tuner
R2121
100
CHB
CHB_CVBS
DUAL COMPONENT
1ST : EAN61829801, 2ND : EAN544289201
1ST : EAN61507501, 2ND : EAN54428101
SCL0_3.3V
R2120
100K
C2123
16V
0.1uF
SDA0_3.3V
C2124
100pF
50V
CHB
OPT
C2125
0.1uF
16V
CHB
TU_RESET
+1.8V_M_TU
C2127
100uF
16V
CHB
IF_AGC
R2122
33
CHB
R2123
CHB
33
R2124
CHB
33
R2125
CHB
33
+3.3V_S_TU
R2128
100K
OPT
C2126
0.1uF
16V
CHB
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
L2112
BLM18PG121SN1D
CHB
TU_RESET_SUB
C2129
100pF
50V
C2128
100pF
CHB
50V
CHB_TS_SYNC
CHB_TS_VAL
CHB_TS_CLK
CHB_TS_DATA
FE_TS_DATA[0-7]
CHB
+5V_TU
R2134
470
B
R2133
4.7K
+3.3V_M_TU
C2131
0.1uF
16V
E
Q2104
C
MMBT3906(NXP)
C2134
100uF
16V
CHB
R2138
82
R2139
1K
OPT
OPT
0
R2136
0
R2137
1K
OPT
RF_BOOSTER_CTL
TS_VAL_ERR
TU_TS_SYNC
TU_TS_CLK
S2_RESET
R2142
220
R2140
+5V_TU
B
TU_SIF
R2143
220
E
Q2105
MMBT3906(NXP)
C
+5V_Normal
L2104
BLM18PG121SN1D
C2147
C2151
22uF
0.1uF
16V
16V
+3.3V_Normal
L2103
MLB-201209-0120P-N2
C2140
0.1uF
16V
+3.3V_TU
TU_CVBS
CHB
C2176
0.1uF
+3.3V_TU
L2111
120-ohm
C2180
2.2uF
16V
NON_CHB_LGIT_TUNER
+5V_TU
BLM18PG121SN1D
L2101
C2109
C2154
C2157
22uF
0.1uF
16V
16V
0.1uF
16V
OPT
+3.3V_TU
C2141
22uF
16V
IC2102
AZ1117BH-1.8TRE1
CHB
3IN1
2
OUT
AZ1117BH-ADJTRE1
INPUT
C2144
0.1uF
R2145
16V
ADJ/GND
1
C2142
10uF
10V
CHB
3
CHB
IC2103
C2149
0.1uF
16V
C2145
0.1uF
16V
CHB
+1.8V_CHB_TU
1
C2178
2.2uF
16V
ADJ/GND
VOUT = VREF *(1+R2/R1)
NON_CHB_TUNER_V_L
19
TU2101-*2
TDVJ-H131F
SHIELD
10
11
12
13
14
15
16
17
18
1
2
3
4
5
6
7
8
9
NC_1
NC_2
+B1[5V]
RF_AGC
MOPLL_AS
SCL
SDA
NC_3
SIF
NC
VIDEO
GND
+B2[1.2V]
+B3[3.3V]
RESET
IF_AGC
DIF_1[N]
DIF_2[P]
BCM35230
ATSC_TUNER
+3.3V_TU
2
C2153
0.1uF
+1.8V_CHB_TU
CHB
C2152
0.1uF
OUTPUT
MLB-201209-0120P-N2
MLB-201209-0120P-N2
MLB-201209-0120P-N2
BLM18PG121SN1D
BLM18PG121SN1D
R1
220
R2135
NON_CHB_TUNER_H_L
19
L2107
CHB
L2105
CHB
L2106
CHB
L2108
CHB
L2109
TU2101-*3
TDVJ-H101F
SHIELD
120-ohm
120-ohm
R2
R2167
4.7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
+3.3V_S_TU
+3.3V_M_TU
+3.3V_DE
C2181
22uF
ANT_PWR[OPT]
BST_CNTL
+B
NC[RF_AGC]
AS
SCL
SDA
NC(IF_TP)
SIF
NC
VIDEO
GND
1.2V
3.3V
RESET
IF_AGC_CNTL
DIF_1
DIF_2
C2163
10uF
10V
C2161
10uF
10V
C2162
10uF
10V
+1.8V_S_TU
C2160
10uF
10V
+1.8V_M_TU
C2159
10uF
10V
BLM18PG121SN1D
CHB
CHB
L2110
CHB
CHB
C2182
22uF
10V
C2169
0.1uF
CHB
C2167
0.1uF
CHB
C2168
0.1uF
C2166
0.1uF
CHB
C2165
0.1uF
CHB
+1.26V_TU
21
C2179
0.1uF
50V
50
Page 40
LNB_INT
Non_DVB-S2 LNB Part_Allegro
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
NON LNB50
24
Page 41
SC_CVBS_IN
DTV_ATV_SELECT
DTV/MNT_V_OUT
SC_FB
SC_ID
SC_RE1
SC_RE2
SCART_MUTE
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
INCM_VID_SC
JP2601
JP2602
JP2603
JP2604
JP2605
JP2606
JP2607
JP2608
JP2609
JP2610
JP2611
JP2612
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
CHB
27
50
Page 43
NON CHINA HOTEL
SPK_R+_HOTEL
SPK_R-_HOTEL
JP3001
JP3002
JP3003
JP3004
JP3005
JP3006
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
NON CHINA HOTEL
30
50
Page 44
LVDS
P3501
FI-RE51S-HFK-A
LOCAL DIMMING
[51Pin LVDS OUTPUT Connector]
NC
1
NC
2
NC
3
NC
4
NC
5
AUO_65_MIRROR
6
LVDS_SEL
7
NC
8
NC
9
L/DIM_ENABLE
10
GND
11
RA0N
12
RA0P
13
RA1N
14
RA1P
15
RA2N
16
RA2P
17
GND
18
RACLKN
19
RACLKP
20
GND
21
RA3N
22
RA3P
23
RA4N
24
RA4P
25
GND
26
BIT_SEL
27
RB0N
28
RB0P
29
RB1N
30
RB1P
31
RB2N
32
RB2P
33
GND
34
RBCLKN
35
RBCLKP
36
GND
37
RB3N
38
RB3P
39
RB4N
40
RB4P
41
GND
42
GND
43
GND
44
GND
45
GND
46
NC
47
VLCD
48
VLCD
49
VLCD
50
VLCD
51
52
GND
LGD_2D/3D_CTRL
+3.3V_Normal
33R3512
R3511
3.3K
AUO_65_MIRROR
PANEL_VCC
2D/3D_CTL
LVDS_TXA0N
LVDS_TXA0P
LVDS_TXA1N
LVDS_TXA1P
LVDS_TXA2N
LVDS_TXA2P
LVDS_TXACLKN
LVDS_TXACLKP
LVDS_TXA3N
LVDS_TXA3P
LVDS_TXA4N
LVDS_TXA4P
LVDS_TXB0N
LVDS_TXB0P
LVDS_TXB1N
LVDS_TXB1P
LVDS_TXB2N
LVDS_TXB2P
LVDS_TXBCLKN
LVDS_TXBCLKP
LVDS_TXB3N
LVDS_TXB3P
LVDS_TXB4N
LVDS_TXB4P
L3501
MLB-201209-0120P-N2
C3502
C3501
1000pF
10uF
50V
25V
OPT
LVDS_SEL
+3.3V_Normal
R3501
3.3K
LVDS_SEL_HIGH
R3502
10K
LVDS_SEL_LOW
C3503
0.1uF
50V
BIT_SEL
BIT_SEL_LOW
[41Pin LVDS OUTPUT Connector]
FI-RE41S-HFK-A
R3503
10K
P3502
[To LED DRIVER]
P3503
12507WR-08L
1
2
NC
1
NC
2
NC
3
NC
4
NC
5
NC
6
NC
7
NC
8
GND
9
RC0N
10
RC0P
11
RC1N
12
RC1P
13
RC2N
14
RC2P
15
GND
16
RCCLKN
17
RCCLKP
18
GND
19
RC3N
20
RC3P
21
RC4N
22
RC4P
23
GND
24
GND
25
RD0N
26
RD0P
27
RD1N
28
RD1P
29
RD2N
30
RD2P
31
GND
32
RDCLKN
33
RDCLKP
34
GND
35
RD3N
36
RD3P
37
RD4N
38
RD4P
39
GND
40
GND
41
42
GND
R3514
AUO_2D/3D_CTRL
33
2D/3D_CTL
LVDS_TXC0N
LVDS_TXC0P
LVDS_TXC1N
LVDS_TXC1P
LVDS_TXC2N
LVDS_TXC2P
LVDS_TXCCLKN
LVDS_TXCCLKP
LVDS_TXC3N
LVDS_TXC3P
LVDS_TXC4N
LVDS_TXC4P
NON USED L/DIMMING
LVDS_TXD0N
LVDS_TXD0P
LVDS_TXD1N
LVDS_TXD1P
LVDS_TXD2N
LVDS_TXD2P
LVDS_TXDCLKN
LVDS_TXDCLKP
LVDS_TXD3N
LVDS_TXD3P
LVDS_TXD4N
LVDS_TXD4P
3
4
5
6
7
8
9
(FOR EDGE_LED)
L/DIM0_MOSI
L/DIM0_SCLK
L/DIM0_VS
M1_MOSI
M1_SCLK
M2_MOSI
M2_SCLK
M3_MOSI
M3_SCLK
+3.3V_FRC
OPT
R3509
10K
R3510
10K
PLACE SERIAL RESISTORS CLOSE TO URSA4
33R3506
33R3507
0R3504
LPB_42/47/55
0R3505
LPB_42/47/55
33R3508
R3513
4.7K
M0_SCLK
M0_MOSI
SCL2_3.3V
SDA2_3.3V
L_VS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MStar URSA5
DDR3 4Mbit53
2010. 08.18
55
Page 47
CORE +1.26V_FRC
+12V
AOZ1072AI
L5402
CIC21J501NE
C5402
10uF
25V
Placed on SMD-TOP
C5404
10uF
25V
C5406
0.1uF
PGND
AGND
1
VIN
2
3
FB
4
IC5401
2A
TYPICAL 980mA
+3.3V_FRC
R5405
C5408
3300pF
R5404
20K
OPT
10K
R5406
3.3K
1%
R5407
3.9K
1%
R5408
12K
1%
R5409
R1
R2
OPT
100pF
10K
C5410
50V
OPT
POWER_ON/OFF2_2
L5403
3.6uH
NR8040T3R6N
LX_2
8
LX_1
7
6
5
EN
COMP
C5407
1uF
10V
R5402
20K
C5412
22uF
10V
+1.26V_FRC
C5414
22uF
10V
+3.3V_FRC
C5416
10uF
16V
C5417
0.1uF
16V
+1.5V_FRC
AP7173-SPG-13 HF(DIODES)
R5413
10K
C5418
1uF
10V
TYPICAL 350mA
+1.5V_FRC_DDR
IC5403
9
THERMAL
[EP]
8
OUT
7
FB
6
SS
5
GND
C5419
560pF
50V
R1
R5414
4.3K
1%
R5415
3.9K
1%
R2
R5416
1K
1%
C5420
10uF
16V
C5421
10uF
16V
1
IN
2
PG
3
VCC
4
EN
EAN41406705
Vout=(1+R1/R2)*0.8
+12V
L5401
CIC21J501NE
C5403
C5401
10uF
10uF
25V
25V
Vout=0.8*(1+R1/R2)
+3.3V_FRC
IC5402
AOZ1072AI-3
PGND
1
VIN
AGND
2
2A
3
FB
4
EAN60922902
C5405
0.1uF
Vout=0.6*(1+R1/R2)
+1.5V of DDR&URSA5 uses same power line
TYPICAL 300mA
+3.3V_FRC
L5404
3.6uH
R5401
20K
R5403
10K
NR8040T3R6N
POWER_ON/OFF2_2
C5409
2200pF
R5410
27K
1%
R5411
4.3K
1%
R5412
10K
1%
R1
C5411
100pF
OPT
R2
C5415
C5413
22uF
22uF
10V
10V
50V
LX_2
8
LX_1
7
EN
6
COMP
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MStar URSA5
URSA5 Power Block
2010. 08.18
54
55
Page 48
SMD GASKET
SMD GASKET 4.5T
M1
M2
M3
GASKET_4.5T
MDS62110208
MDS62110208
MDS62110208
GASKET_4.5T
GASKET_4.5T
SMD GASKET 5.0T
M1-*1
M2-*1
M3-*1
GASKET_5.0T
GASKET_5.0T
MDS62110210
GASKET_5.0T
MDS62110210
MDS62110210
SMD GASKET 5.5T
M2-*2
M3-*2
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
M1-*2
MDS62110204
GASKET_5.5T
M4
MDS62110208
M4-*1
MDS62110210
M4-*2
MDS62110204
M5
MDS62110208
GASKET_4.5T
M5-*1
GASKET_5.0T
MDS62110210
M5-*2
GASKET_5.5T
M6
GASKET_4.5T
GASKET_5.0T
MDS62110204
GASKET_5.5T
MDS62110208
M6-*1
MDS62110210
M6-*2
MDS62110204
M7
MDS62110208
GASKET_4.5T
M7-*1
GASKET_5.0T
MDS62110210
M7-*2
GASKET_5.5T
M8
GASKET_4.5T
M8-*1
GASKET_5.0T
MDS62110204
GASKET_5.5T
MDS62110208
GASKET_4.5T
GASKET_5.0T
MDS62110210
M8-*2
MDS62110204
GASKET_5.5T
M9
MDS62110208
M9-*1
MDS62110210
M9-*2
M10
GASKET_4.5T
M10-*1
GASKET_5.0T
MDS62110204
GASKET_5.5T
M11
MDS62110208
GASKET_4.5T
M11-*1
GASKET_5.0T
MDS62110210
M10-*2
MDS62110204
GASKET_5.5T
MDS62110208
GASKET_4.5T
GASKET_5.0T
MDS62110210
M11-*2
MDS62110204
GASKET_5.5T
M12
MDS62110208
M12-*1
GASKET_4.5T
GASKET_5.0T
MDS62110210
M12-*2
MDS62110204
GASKET_5.5T
SMD GASKET 7.5T
M1-*4
M2-*4
MDS62110205
GASKET_7.5T
M3-*4
MDS62110205
GASKET_7.5T
MDS62110205
GASKET_7.5T
SMD GASKET 8.5T
M1-*5
MDS62110209
GASKET_8.5T
MDS62110209
GASKET_8.5T
MDS62110209
M3-*5
M2-*5
SMD GASKET 9.5T
M1-*6
M2-*6
MDS61887710
GASKET_9.5T
M3-*6
MDS61887710
GASKET_9.5T
MDS61887710
GASKET_9.5T
M4-*4
MDS62110205
M4-*5
GASKET_8.5T
M4-*6
MDS61887710
M5-*4
GASKET_7.5T
MDS62110209
GASKET_8.5T
M5-*6
GASKET_9.5T
MDS62110205
GASKET_7.5T
M5-*5
MDS62110209
GASKET_8.5T
M6-*6
MDS61887710
GASKET_9.5T
M6-*4
MDS62110205
GASKET_7.5T
M6-*5
MDS62110209
MDS61887710
GASKET_9.5T
M7-*4
MDS62110205
M7-*5
GASKET_8.5T
M7-*6
MDS61887710
M8-*4
GASKET_7.5T
MDS62110209
GASKET_8.5T
M8-*6
GASKET_9.5T
MDS62110205
GASKET_7.5T
M8-*5
MDS62110209
GASKET_8.5T
M9-*6
MDS61887710
GASKET_9.5T
M9-*4
MDS62110205
M9-*5
MDS61887710
M10-*4
GASKET_7.5T
MDS62110209
GASKET_8.5T
M10-*6
GASKET_9.5T
M11-*4
MDS62110205
GASKET_7.5T
M10-*5
MDS62110209
GASKET_8.5T
M11-*6
MDS61887710
GASKET_9.5T
MDS62110205
GASKET_7.5T
M11-*5
MDS62110209
GASKET_8.5T
MDS61887710
GASKET_9.5T
M12-*4
MDS62110205
M12-*6
MDS61887710
GASKET_7.5T
M12-*5
MDS62110209
GASKET_8.5T
GASKET_9.5T
SMD GASKET 6.5T
M1-*3
MDS62110206
GASKET_6.5T
M2-*3
MDS62110206
GASKET_6.5T
M3-*3
MDS62110206
M4-*3
GASKET_6.5T
M5-*3
MDS62110206
GASKET_6.5T
MDS62110206
GASKET_6.5T
M6-*3
MDS62110206
M7-*3
MDS62110206
GASKET_6.5T
M8-*3
GASKET_6.5T
M9-*3
MDS62110206
GASKET_6.5T
MDS62110206
GASKET_6.5T
M10-*3
MDS62110206
M11-*3
MDS62110206
GASKET_6.5T
M12-*3
GASKET_6.5T
MDS62110206
GASKET_6.5T
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
M20
MDS62110213
GASKET3.5T_HEATSINK
GASKET3.5T_HEATSINK
M21
MDS62110213
M22
MDS62110213
GASKET3.5T_HEATSINK
GASKET3.5T_HEATSINK
M23
MDS62110213
BCM35230
SMD GASKET
2010. 09. 18
56
56
Page 49
Page 50
GP3-BCM (3D FPR/ATSC) trouble shooting guide
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Applied chassis & models
Chassis: LA12C
Models : 47/55LW6500-UA
2010. 12. 28.
LCD TV Division
LCD TV Lab. / AT1Gr.
Page 51
1. Overview for LGE35230 (ATSC) - US
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JACK PACK
JACK PACK
at SIDE
at SIDE
RF
UFA
55AL
Side Component Gender
USB1
USB2
D-sub RGB
Audio L/R (for RGB)
HDMI 1
HDMI 2
HDMI 3
HDMI 4
Digital Audio (Optic)
IF +/TU_CVBS
SIF
Side AV Gender
SDA/SCL_5V
Reset / IF_AGC
…
DP/DM/ +5V
DP/DM/ +5V
RGB/H/V
Audio L/R
SIL9287B
HDMI Switch
SPDIF
Y Pb Pr, L/R
CVBS, L/R
4x1
LGE35230
LGE35230
(ATSC)
(ATSC)
LVDS_60Hz
LVDS_120Hz
URSA5
DDR_Data[0:15], DQS, DM …
Addr.[ ], ctrl. data
Data [0 … 7]
Addr[0…1], CS …
MCLK
I2S
HP_L/R
DDR3 (2Gbit)
NAND Flash
(8Gbit)
Digital AMP
TAS5727
HP AMP
TPA6132
DDR3 (2Gbit)
AV1
JACK PACK
JACK PACK
at REAR
at REAR
Component 1
RS-232C (Ctrl./SVC)
Ethernet
CVBS, L/R
Y Pb Pr, L/R
Wireless Ready
Power
MAX3232
RX/TX
SCL, SDA_3.3V
SCL, SDA_3.3V
54MHz
RX/TX
NVRAM
MICOM
(NEC)
X-tal
M_REMOTE
(MODULE)
Page 52
2. Video Signal block
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK (0x98)
OK (0x7F, 0x6F)
OK (0x7F, 0x5F)
OK (0x7F, 0x4F)
OK (0x7F, 0x3F)
1. Adjust Check
: This menu displays Country Group, Tool Option and Adjust Result
Information. This is very useful when you want to know about TV systems
adjustment as White Balance, ADC.
1) Country Group
- You can change Country Group and Tool Optio n only. This change is saved
real-time.
2) Tool Option
- You can change Tool Option value. Move a cursor to dialog box and push
some numbers with remote-controller.
3) Adjust White Balance
- This dialog box shows the result of White Balance adjustment. OK/NG
4) Adjust ADC
- You need not control ADC
5) EDID
- This dialog box shows the status of EDID Download.
Page 82
22. Trouble shooting - SW download
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
The latest S/W put in the ‘LG DTV’ folder of USB Memory
USB connects to USB jack for service.
If SW update screen appears,
push the OK button.
The SW update is finished, please check new SW version by
in-start menu.
Page 83
BCM35230 Block Diagram
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
A-
A-
A-
DEMOD
DEMOD
Cable
Cable
DEMOD
(Sub)
(Sub)
Air
Air
RF
RF
Splitter
Splitter
RF
RF
Switch
Switch
TUNER
TUNER
(Sub)
(Sub)
TUNER
TUNER
(Main)
(Main)
(Sub)
D-
D-
DEMOD
DEMOD
(Sub)
(Sub)
A-
A-
A-
DEMOD
DEMOD
DEMOD
(Main)
(Main)
(Main)
D-
D-
DEMOD
DEMOD
(Main)
(Main)
CVBS(CHB)
S_TS(CHB)
GCHB IC
Decoder)
DIF(+/-)
(with
CVBS
CVBS(M)
S_TS(CHB)
NAND
Flash(8Gb)
CVBS
TS_S/P
SYSTEM
DDR3 X 16 X 2
(2Gb)
51P
SYSTEM EEPROM X 1
(1Mb)
51P
CAM,
DVR
Ready
USB1
USB2
WIFI
HDMI1
HDMI2
HDMI3
HDMI4
H/P
A/V1
COMP1
COMP2
PC-RGB
PC-AUDIO
OPTIC
LAN
RS-232C
USB
HUB IC
Side
HDMI
HUB IC
Rear
LAN PHY
(10M/100
)
USB
HDMI
S/W
L/R Out
CVBS
COMP
RGB,H/V
L/R In
SPDIF OUT
Ethernet
(HDCP
EEPROM)
BCM
35230
LVDS
I2S Out
I2C
I2C
UART
URSA5
Audio
AMP
Audio
AMP
Sub Micom
41P
(sanyo)
Wireless Ready
M-Remote
Module
1
Page 84
Dual_TUNER/CHB (한국/북미)
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Main SoC
<ATSC>
AGCI
FEAINP/N
IF_AGC_MAIN
IF_N/P_MAIN
BCM
35230(B0)
TU_RESET, TU_RESET_SUB
TU_SIF
RF_SW_CTL1/2
SCL/DA0_3.3V
I2C(Main)
TU_CVBS
SCL/DA1_3.3V
SCL/DA3_3.3V
CHBO_TS_DATA[S], CLK, Sync,VAL_ERR
TW9910_reset
CHB_reset
TW9910_
DATA[P]
CLK
CHB
(LG1140)
4
9
(TW9910)
CHB_TS_DATA[S]
CLK.SYNC/VAL
VDEC
I2C(Sub)
Dual Tuner
(H/NIM+F/NIM)
Or
H/NIM
IF_N/P
CHB_CVBS
IF_AGC
2
Page 85
Jack Interface
Y
P
P
E
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PC L,R
COMP2_R/G/B
Scart R,G,B
Scart CVBS
Scart ID
CVBS Out
Audio L/R out
Audio L/R In
CVBS in
RGB Control I/O
DSUB_R / G / B
DSUB_ V / HSYNC
AT24C02BN-10SU-1.8
RGB DET
0 OHM
Recording Ctrl
R
R
EDID EEPROM
[EDID_WP]MICOM
COMP2 OPT
0 OHM
generated by TR
Switching IC
NLASB3157DFT2G
[ATV_OUT]
TUNER
Level
0V, 6V,12V
OPAMP
IC1501
LM324D
REC_8 Ctrl1
REC_8 Ctrl2
0V ~ 0.98V
[SC_L/R_out P/N]
RGB_DDC_SCL
RGB_DDC_SDA
[VI_SC_R1],[VI_SC_G1],[VI_SC_B1]
[VI_CVBS1]
[I2SSCK_OUTD/GPIO]
[I2SWS_OUTD/GPIO]
[FS_IN1]
[VDAC1]
[GPIO]
[SPDIF_OUT]
BCM35230
(B0)
[ADAC_CL_P/N]
[ADAC_CR_P/N]
[SC/COMP2_L/R_IN]
[SC_CVBS_IN]
[SC_FB]
[DSUB_R+/G+/B+]
[DSUB_V/H SYNC]
[RGB_DDC_SCL]
[RGB_DDC_SDA]
[BSC_S_SCL]
[BSC_S_SDA]
[DSUB_DET] // GPIO
[PC_L_IN]
[PC_R_IN]
[COMP1_Y]
[COMP1_Pb]
[COMP1_Pr]
[COMP1_DET]
[AV1_R_IN]
[AV1_L_IN]
[AV1_CVBS_IN]
[AV1_CVBS_DET]
[AV1_R_IN]
[AV1_L_IN]
[AV1_CVBS_IN]
[AV1_CVBS_DET]
SPDIF
COMP1
COMP_
COMP_
COMP_
COMP D
AV1
R
L
CVBS
AV DET
AV2
R
L
CVBS
AV DET
3
Page 86
HDMI(Sillicon Image SIL9287)
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[HDMI_ARC]
ARC(Audio Return Channel)
HDMI_HPD2
5V_HDMI_2
HDMI_HPD1
5V_HDMI_1
DDC HDMI I2C
DDC HDMI I2C
HDMI1
HDMI1
HDMI2
HDMI2
BCM
35230(B0)
[RDB/TDB_GPIO_I2C]
SDA2 3.3V/SCL3.3V_I2C
TMDS
HDMI switch
SIL9287
5V_HDMI_3
HDMI_HPD3
4
DDC HDMI I2C
DDC HDMI I2C
5V_HDMI_4
HDMI_HPD4
CEC
CEC
NEC
MICOM
HDMI3
HDMI3
HDMI4
HDMI4
Page 87
LVDS Tx (FHD120Hz)
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
URSA5
LGE7303
PANEL_VCC
(+12V)
LVDS Tx
Block
Dual-link LVDS Output
24
10-bit (R)
Dual-link LVDS Output
24
10-bit (R)
51Pin
LVDS
LVDS_SEL
BIT_SEL
• LVDS_SEL : “H”=JEIDA, “L” or NC=VESA (LGD)
• BIT_SEL : “H” or NC = 10-bit, “L” = 8-bit
Output
41Pin
LVDS
Output
5
Page 88
USB / WIFI / M-REMOTE / UART
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
[USB_PORT1]
[USB_PORT2]
BCM
35230(B0)
[M_REMOTE_RX]
[M_REMOTE_TX]
[BCM_TX]
[BCM_RX]
Wifi DM/DP
USB DM/DP
M_REMOTE_RX
M_REMOTE_TX
BCM_TX / RX
USB2512B_AEZG
TX / RXTX / RX
WIFI
USB
USB
TI Solution M_REMOTE
TI Solution M_REMOTE
IR REMOTE
IR_OUT
CDR
MAX3232
MICOM_TX/RX
[SANYO_TXD/RX D] MICOM
9PIN DSUB
6
Page 89
AUDIO
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PC L/R
AV1 L/R
AV2 L/R
Scart /COMP2 L/R
[ADDCD_LINE_1]
[ADDCD_LINE_2]
[ADDCD_LINE_3]
[ADDCD_LINE_4]
BCM
35230(B0)
[ADAC_CL/CR]
[I2SWS_IN]
[I2SSD_IN]
Scart L/R
I2S
I2C1 3.3V
LM324
OP AMP
AMP_MUTE
MICOM
AMP_RESET
MICOM
Mute
CTRL
[TR]
SCART_MUTE
MAIN
NTP7400/TAS5727
Digital AMP
0x54
WOOFER
NTP7400/TAS5727
Digital AMP
0x56
SIDE_HP_MUTE
LPF
SCART
AUDIO L/R OUT
4P wafer
LPF
LPF
5P wafer
LPF
LPF
Tuner
TR BUF
[VI_SIF]
[HDMI0_ARC]
[ADAC_AL/AR]
[SPDIF_OUTA]
HP_L/R
7
SPDIF_OUT
HDMI_ARC
TPA6132A2
AMP
LPF
HEAD PHONE
Page 90
I2C Map
Copyright ⓒ 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
※PV2 회로도 기준
Eye-Q
IC501
MICOM
EEPROM
+3.5V_ST
4.7KΩ
33Ω
100KHz
33Ω
33Ω
33Ω
IC602
MICOM
0x52
IC701
HDMI SW
0xC0
JK1001
WIRELESS
0x98
URSA5
P101
BBS
+5V_NORMAL
IC802
RGB EEPROM
Soft Touch
+3.5V_ST
4.7KΩ
+3.3V_NORMAL
100KHz
??KHz
400KHz
400KHz
+3.3V_NORMAL
2.7KΩ
33Ω
33Ω
33Ω
33Ω
1.5KΩ
Level
Shifter
1.2KΩ
33pF
GND
BSC_S_SCL
BSC_S_SDA
33pF
GND
33Ω
RDB
TDB
MIPS
CH2
CH2
BSCB
CH3
BSCC
BCM35230 A0/B0
PCU
내장
Demod
8051
CH1
CH4
GPIO
controller
CH3
CH5
TV
Micro
BSCA
CH0
CH1
+3.3V_NORMAL
1.2KΩ
33Ω
GPIO0
GPIO1
33pF
GND
+3.3V_NORMAL
1.2KΩ
33Ω
I2SWS_IN
I2SSD_IN
33pF
GND
1.2KΩ
33Ω
BSCDATAA
BSCCLKA
33pF
※CH 표기 기준
회로도CFG 기준
REDBLUE
400KHz
33Ω
100KHz
33Ω
100KHz
33Ω
100KHz
33Ω
400KHz
33Ω
400KHz
33Ω
400KHz
33Ω
400KHz
33Ω
+3.3V_NORMAL
400KHz
GND
IC103
NVRAM
0xA8
IC1702
AUDIO AMP
0x54
IC1701
Woofer AMP
0x56
IC2701/2
CHB
0x88, 0XF2
DEMOD
DVB-T/C
DEMOD
DVB-S2
S_TUNER
IC2301
LNB
TUxx
TUNER
8
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