Copyright 2011 LG Electronics.Inc.All right reserved.
Only for training and service purposes
C
LGE Internal Use Only- 1 -
Page 3
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
AC Volt-meter
Good Earth Ground
such as WATER PIPE,
To Instrument’s
exposed
METALLIC PARTS
0.15uF
CONDUIT etc.
1.5 Kohm/10W
Copyright 2011 LG Electronics.Inc.All right reserved.
Only for training and service purposes
C
LGE Internal Use Only- 2 -
Page 4
CAUTION: Before servicing receivers covered by this service
SERVICING PRECAUTIONS
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Copyright 2011 LG Electronics.Inc.All right reserved.
Only for training and service purposes
C
LGE Internal Use Only- 3 -
Page 5
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright 2011 LG Electronics.Inc.All right reserved.
Only for training and service purposes
C
LGE Internal Use Only- 4 -
Page 6
SPECIFICATION
No.ItemSpecificationRemark
1Display Screen Device 32,42,47Wide Color Display Module
2Aspect Ratio16:9
3LCD Module LC320EUF-SDF3
4Operating Environment Temp. : 0 deg ~ 50 deg
Humidity : 20 % ~ 90 %
5Storage Environment Temp. : -20 deg ~ 60 deg
Humidity : 10 ~ 90 %
6Input Voltage AC 100-240V~, 50 / 60Hz
7Power ConsumptionPower on (White)
32LGDTyp : 69.7W
8Outline Dimension698.40(H) x 392.85 (V) x 10.8(B) / 24.0 mm (D)
8Pixel Pitch0.36375 mm x 0.36375 mm x RGB
9Back LightEdge LED
10 Color depth 10Bit(D), 1.06 Billion colors
11 Surface treatmentHard coating(2H), Anti-glare treatment of the front
polarizer (Haze 10%)
32LW5500-CA
LCD
LC420EUF-SDF1/ LC420EUF-SDF2
LC470EUF-SDF1/ LC470EUF-SDF2
42LW5500-CA
47LW5500-CA
42LGDTyp : 90.5W
47LGDTyp : 90W
1078.6(H) x 626.0(V) x 10.8(B) / 22.9mm (D)
968.4(H) x 564.0(V) x 10.8(B) / 22.9mm(D)
32LGD
42LGD
47LGD
32LGD
42LGD
47LGD
0.4845 mm x 0.4845 mm x RGB
0.5415 mm x 0.5415 mm x RGB
NOTE : Specifications and others are subject to change without notice for improvement
1. Application range
This specification is applied to the LCD TV used LC12C chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
Copyright 2011 LG Electronics.Inc.All right reserved.
C
Only for training and service purposes
LGE Internal Use Only- 27 -
Page 29
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
710
LV2
LV1
200
400
521
540
530
700
910
900
810
AG1
A10
A5
300
Copyright 2011 LG Electronics.Inc.All right reserved.
CI_ADDR[8]:
0: RESETOUTb (in On/Off only) stay asserted until software releases them.
1: Fix amount of delay for de-assertion on RESETOUTb (in On/IOff only)
at end of RESETb pulse (O)
NAND_DATA[3]:
0: MIPS will boot from external flash (O)
1: MIPS will boot from ROM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN/SC R,G,B Trace
INCM_R
INCM_G
INCM_B
INCM_VID_COMP1
INCM_VID_AV2
INCM_TUNER
INCM_VID_AV1
INCM_VID_SC/COMP2
BCM35230_with_CAP_220pF
IC101-*1
LGE35230
B6
BCM_CAP
VI_R
A6
VI_INCM_R
C7
VI_G
A7
VI_INCM_G
B7
VI_B
C8
VI_INCM_B
C13
HSYNC_IN
A13
VSYNC_IN
C9
VI_Y1
A9
VI_PR1
B9
VI_PB1
B8
VI_INCM_COMP1
C11
VI_SC_R1
A10
VI_SC_G1
B10
VI_SC_B1
C10
VI_INCM_SC1
D10
VI_FB_1/GPIO
F13
VI_FS1
A12
VI_SC_R2
C12
VI_SC_G2
B12
VI_SC_B2
B11
VI_INCM_SC2
E12
VI_FB_2/GPIO
E14
VI_FS2
E15
VI_L1
F17
VI_C1_1
E16
VI_INCM_LC1_1
F14
VI_C1_2
E11
VI_INCM_LC1_2
C18
VI_CVBS1
B18
VI_INCM_CVBS1
A18
VI_CVBS2
C19
VI_INCM_CVBS2
A19
VI_CVBS3
B19
VI_INCM_CVBS3
C20
VI_CVBS4
B20
VI_INCM_CVBS4
E19
VI_SIF1_1
D19
VI_INCM_SIF1_1
E10
VI_SIF1_2
F11
VI_INCM_SIF1_2
SCL3_3.3V
SDA3_3.3V
+3.3V_Normal
R302
R301
1.2K
1.2K
C301
C302
33pF
33pF
50V
50V
PHONE JACK
INCM_AUD_SC/COMP2
M_REMOTE_TX
PC_L_IN
PC_R_IN
AV1_L_IN
AV1_R_IN
INCM_AUD_AV1
AV2_L_IN
AV2_R_IN
INCM_AUD_AV2
SC/COMP2_L_IN
SC/COMP2_R_IN
C3051uF10V
C3061uF10V
C3071uF10V
C3081uF10V
C3091uF10V
C3101uF10V
C3111uF10V
C3121uF10V
C3131uF10V
C3141uF10V
C3151uF10V
C3161uF10V
NON_BCM_CAP
SPDIF_INC_P
SPDIF_INC_N
SPDIF_IND_P
SPDIF_IND_N
I2SSCK_IN/GPIO
I2SWS_IN
I2SSD_IN/GPIO
AADC_LINE_L1
AADC_LINE_R1
AADC_INCM1
AADC_LINE_L2
AADC_LINE_R2
AADC_INCM2
AADC_LINE_L3
AADC_LINE_R3
AADC_INCM3
AADC_LINE_L4
AADC_LINE_R4
AADC_INCM4
AADC_LINE_L5
AADC_LINE_R5
AADC_INCM5
AADC_LINE_L6
AADC_LINE_R6
AADC_INCM6
AADC_LINE_L7
AADC_LINE_R7
AADC_INCM7
IC101
I2SSCK_OUTA/GPIO
I2SWS_OUTA/GPIO
I2SSD_OUTA0/GPIO
I2SSOSCK_OUTA/GPIO
I2SSD_OUTA1/GPIO
I2SSD_OUTA2/GPIO
I2SSCK_OUTC/GPIO
I2SWS_OUTC/GPIO
I2SSD_OUTC/GPIO
I2SSOSCK_OUTC/GPIO
I2SSCK_OUTD/GPIO
I2SWS_OUTD/GPIO
I2SSD_OUTD/GPIO
I2SSOSCK_OUTD/GPIO
SPDIF_OUTA/GPIO
AUDMUTE_0/GPIO
LGE35230(BCM35230KFSBG)
B15
C15
C14
B14
G4
F4
G5
C25
B24
A24
E22
E23
D23
C24
C23
B23
E21
D21
D22
B22
C22
A22
F21
D20
E20
A21
C21
B21
AUDMUTE_1
ADAC_AL_N
ADAC_AL_P
ADAC_AR_N
ADAC_AR_P
ADAC_CL_N
ADAC_CL_P
ADAC_CR_N
ADAC_CR_P
ADAC_DL_N
ADAC_DL_P
ADAC_DR_N
ADAC_DR_P
AF8
AF9
AG9
AC9
AD8
AD9
E2
F2
E3
F3
G2
G3
G1
H1
B13
AG8
E13
C28
C27
D28
D27
C26
A27
B27
B28
B25
A25
A26
B26
R326100
R327100
R328100
R329100
TU_RESET_SUB
HP_DET
AV1_CVBS_DET
TU_RESET
SC_RE1
SC_RE2INCM_AUD_PC
/RST_HUB
S2_RESET
SPDIF_OUT
HP_LOUT_N
HP_LOUT_P
HP_ROUT_N
HP_ROUT_P
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_N
SCART1_Rout_P
C337
22pF
OPT
C338
22pF
OPT
C339
22pF
OPT
C340
33pF
OPT
AUD_SCK
AUD_LRCK
AUD_LRCH
AUD_MASTER_CLK
Near
Near
Near
Near
Near
JK1102
JK1103
JK2501
JK1104
JK801
TU2101/2
TU2201/2/3
R3210
R3220
R3230
R3240
AUDIO INCM
Route Between AV1_L_IN & AV1_R_IN Trace
Route Between SC/COMP2_L_IN & SC/COMP2_R_IN Trace
Route Between AV2_L_IN & AV2_R_IN Trace
Route Between PC_L_IN & PC_R_IN Trace
Route Along With TUNER_SIF_IF_N
INCM_AUD_AV1
INCM_AUD_SC/COMP2
INCM_AUD_AV2
INCM_AUD_PC
INCM_SIF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
MICOM
6
50
Page 35
BODY_SHIELD
20
EAG62611201
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
ARC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_1
R730
3.6K
OPT
VR703
10V
OPT
CEC_REMOTE
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
R737
0
OPT
C714
0.1uF
16V
OPT
DDC_SDA_1
DDC_SCL_1
ARC
C730
0.1uF
VR706
10V
OPT
R77 5
150
R77 6
63. 4
R728
1K
OPT
HDMI_HPD_1
HDMI_ARC
BODY_SHIELD
GND
20
EAG62611201
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_4
R735
3.6K
OPT
VR707
10V
OPT
CEC_REMOTE
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
R727
0
DUAL COMPONENT
D707,D708
D710,D711
D713
R729
1K
OPT
HDMI_HPD_4
* HDMI CEC
CEC_REMOTE
D713
BAT54_SUZHO
R754
27K
VR708
10V
OPT
C717
OPT
0.1uF
16V
OPT
DDC_SDA_4
DDC_SCL_4
1ST : 0DD184009AA 2ND : 0DSIH00028A
1ST : T-BAT54_SUZHO, 2ND : 0DSON00138A
+3.5V_ST
G
SBD
Q710
BSS83
R741
120K
HDMI_CEC
+3.3V_Normal+3.3V_HDMI
L701
BLM18PG121SN1D
C720
0.1uF
16V
C718
10uF
C719
10uF
JK703
RSD-105156-100
BODY_SHIELD
20
EAG62611201
JK701
RSD-105156-100
BODY_SHIELD
20
EAG62611201
JK702
RSD-105156-100
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
19
18
17
16
15
14
13
12
11
10
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
9
8
7
6
5
4
3
2
1
HP_DET
5V
GND
DDC_DATA
DDC_CLK
NC
CE_REMOTE
CK-
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_2
R740
3.6K
OPT
5V_HDMI_3
R739
3.6K
OPT
VR701
10V
OPT
VR702
10V
OPT
R725
0
R731
0
HDMI1
R736
1K
OPT
HDMI_HPD_2
CEC_REMOTE
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
VR704
10V
OPT
C715
OPT
0.1uF
16V
OPT
DDC_SDA_2
DDC_SCL_2
HDMI2
R726
1K
OPT
HDMI_HPD_3
CEC_REMOTE
CK-_HDMI3
CK+_HDMI3
D0-_HDMI3
D0+_HDMI3
D1-_HDMI3
D1+_HDMI3
D2-_HDMI3
D2+_HDMI3
VR705
10V
OPT
C716
OPT
0.1uF
16V
OPT
DDC_SDA_3
DDC_SCL_3
RSD-105156-100
JK704
+5V_Normal
D707
R713
4.7K
+5V_Normal
D708
R714
4.7K
5V_HDMI_1
A1CA2
5V_HDMI_3
A1CA2
R715
4.7K
R716
4.7K
HDMI3
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
2010.10.21
8COMMON JACK
58
Page 37
Q901,Q902,Q903
Q904,Q905,Q906
D903,D904
D905,D906
DUAL COMPONENT
1ST : 0TRIY80001A 2ND : 0TR387500AA
1ST : EAH42720601, 2ND : EAH60994401
IR & KEY
IR
Q901
2SC3052
+3.5V_ST
R903
47K
R902
0
+3.5V_ST
KEY1
KEY2
3.5V
3.3V
S/T_SCL
ST_SDA
GND
GND
IR
GND
GND
IR_15P
P901
12507WR-15L
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
.
IR_12P
P902
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
EEPROM_SCL
EEPROM_SDA
LED_B/LOGO
LED_R/BUZZ
C911
100pF
50V
R933
100
R934
100
R9281.5K
D907
5.6V
AMOTECH
LED_R/BUZZ
D903
CDS3C05HDMI1
5.6V
D904
CDS3C05HDMI1
5.6V
D905
CDS3C05HDMI1
5.6V
D906
CDS3C05HDMI1
5.6V
R929
1.5K
LED_B/LG_LOGO
+3.3V_Normal
L902
BLM18PG121SN1D
16V
EEPROM_SCL
EEPROM_SDA
C913
0.1uF
16V
ESD_ATSC
R920
R919
10K
10K
1%
1%
R915
100
KEY1
R916
+3.5V_ST
R908
47K
COMMERCIAL_EU
Q903
2SC3052
COMMERCIAL_EU
WIRELESS
Q904
2SC3052
WIRELESS
+3.5V_ST
R909
3.3K
OPT
+3.5V_ST
R911
47K
C
B
E
COMMERCIAL_EU
COMMERCIAL_US
R910
0
+3.5V_ST
R912
47K
C
B
E
WIRELESS
R905
47K
R904
C
10K
B
E
OPT
Q902
2SC3052
C
B
E
COMMERCIAL
R906
COMMERCIAL
22
IR_OUT
WIRELESS
R907
WIRELESS
22
IR_PASS
KEY2
R913
10K
R914
10K
R917
COMMERCIAL
Q905
2SC3052
COMMERCIAL
R918
WIRELESS
Q906
2SC3052
WIRELESS
100
+3.5V_ST
47K
+3.5V_ST
47K
C
E
C
E
B
COMMERCIAL
B
WIRELESS
R921
47K
R922
47K
+3.5V_ST
C901
0.1uF
C902
0.1uF
OPT
BLM18PG121SN1D
16V
L901
S/T_SCL
S/T_SDA
C903
0.1uF
C904
0.1uF
OPT
D901
5.6V
AMOTECH
16V
Zener Diode is
close to wafer
C905
1000pF
50V
R935
100
R936
100
D902
5.6V
AMOTECH
ESD_ATSC
C912
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
IR/KEY
9
50
Page 38
WIRELESS READY MODEL
D1001,D1002
Q1001
Q1002
DUAL COMPONENT
1ST : EAH42720601 2ND : EAH60994401
1ST : EBK61012601, 2ND : 0TRDI80002A
1ST : EBK60752501, 2ND : EBK61011501
Wireless power
+24V
R1002
22K
WIRELESS
R1003
2.2K
WIRELESS
WIRELESS_PWR_EN
R1001
10K
WIRELESS
B
C1002
2.2uF
WIRELESS
Q1002
AO3407A
WIRELESS
C
Q1001
MMBT3904(NXP)
WIRELESS
E
JK1001
KJA-PH-3-0168
DETECT
INTERRUPT
GND_1
RESET
GND_2
I2C_SCL
I2C_SDA
GND_3
UART_RX
UART_TX
GND_4
GND_5
IR
WIRELESS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20GND_6
21
SHIELD
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_2
VCC(24V/20V/17V)_3
VCC(24V/20V/17V)_4
VCC(24V/20V/17V)_1
VCC(24V/20V/17V)_1
+3.3V_Normal
S
G
D
L1001
MLB-201209-0120P-N2
WIRELESS
C1004
10uF
35V
WIRELESS
WIRELESS_DET
WIRELESS_SCL
WIRELESS_SDA
IR_PASS
R1008
WIRELESS
R1007 1K
WIRELESS
D1001
CDS3C05HDMI1
WIRELESS
10K
5.6V
WIRELESS
D1002
5.6V
CDS3C05HDMI1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Wireless I2C connection with I2C_1
Address : 0X20
WIRELESS_SCL
WIRELESS_SDA
R100533
WIRELESS
R100633
WIRELESS
SCL2_3.3V
SDA2_3.3V
BCM35230
10
50WIRELESS
Page 39
CVBS 1 PHONE JACK
D1105
D1107
5.6V
5.6V
ZD1115
5.1V
ZD1116
5.1V
D1108
5.6V
R1110
JK1102
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
COMPONENT 1 PHONE JACK
D1101
JK1101
KJA-PH-1-0177
5 M5_GND
4 M4
3 M3_DETECT
1 M1
6 M6
5.6V
ZD1117
5.1V
ZD1110
5.1V
ZD1111
5.1V
ZD1112
5.1V
ZD1113
5.1V
ZD1114
5.1V
R1109
75
1%
470K
R1111
470K
+3.3V_Normal
R1105
2.7K
R1106
75
1%
R1107
75
1%
R1108
75
1%
+3.3V_Normal
R1112
2.7K
C1106
47pF
50V
C1107
560pF
50V
C1108
560pF
50V
R1137
10
R1138
10
R1139
10
R1143
22
R1144
22
R1114
1K
C1102
47pF
50V
C1103
27pF
50V
C1104
27pF
50V
R1113
1K
R1136
10
L1110
CM2012FR10KT
L1111
CM2012FR27KT
L1112
CM2012FR27KT
FOR EMI
C1109
560pF
50V
C1110
560pF
50V
C1125
47pF
50V
C1126
27pF
50V
C1127
27pF
50V
COMP1_DET
COMP1_Y
COMP1_Pb
COMP1_Pr
AV1_CVBS_DET
AV1_CVBS_IN
AV1_L_IN
AV1_R_IN
JACK_PACK
JK1105
PPJ238-01
[RD1]E-LUG
6C
[RD1]O-SPRING
5C
[RD1]CONTACT
4C
[WH1]O-SPRING
5B
[YL1]CONTACT
4A
[YL1]O-SPRING
5A
[YL1]E-LUG
6A
[RD2]E-LUG
6H
[RD2]O-SPRING_2
5H
[RD2]CONTACT
4H
[WH2]O-SPRING
5G
[RD2]O-SPRING_1
5F
[RD2]E-LUG-S
7F
[BL2]O-SPRING
5E
[BL2]E-LUG-S
7E
[GN2]CONTACT
4D
[GN2]O-SPRING
5D
[GN2]E-LUG
6D
CVBS2 REAR JACK
JK1104
PPJ233-01
AV2_JACK
[RD]E-LUG
5C
[RD]O-SPRING
4C
[RD]CONTACT
3C
[WH]C-LUG
4B
[YL]CONTACT
3A
[YL]O-SPRING
4A
[YL]E-LUG
5A
COMP2 REAR JACK
COMP2
COMP2
COMP2
COMP2
COMP2
COMP2
ZD1103
5.1V
ZD1104
5.1V
ZD1105
5.1V
ZD1106
5.1V
ZD1107
5.1V
ZD1108
5.1V
AV2
R1141
22
D1109
AMOTECH
5.6V
AV2
D1110
AMOTECH
5.6V
AV2
ZD1101
AV2
5.1V
ZD1102
AV2
5.1V
D1111
AV2
5.6V
COMP2
R1119
0
COMP2
R1124
75
COMP2
R1120
0
COMP2
R1125
75
COMP2
R1121
0
COMP2
R1126
75
D1112
5.6V
COMP2
D1113
5.6V
COMP2
COMP2
D1114
5.6V
AV2
10
10
10
AV2
AV2
COMP2
COMP2
COMP2
R1116
470K
R1117
470K
R1118
75
R1133
R1134
R1135
+3.3V_Normal
+3.3V_Normal
R1128
2.7K
AV2
COMP2
R1122
470K
COMP2
R1123
470K
COMP2_Pr
COMP2_Pb
COMP2_Y
COMP2
R1127
2.7K
C1118
560pF
50V
AV2
C1119
560pF
50V
AV2
C1120
47pF
50V
AV2
BLM18PG121SN1D
C1113
560pF
50V
COMP2
BLM18PG121SN1D
COMP2
C1114
560pF
50V
COMP2_Pr
COMP2_Pb
COMP2_Y
COMP2
COMP2
COMP2
COMP_NON_EU
R11301K
R1142
22
R1129
1K
AV2
L1103
L1104
AV2
C1117-*1
47pF
50V
C1121
560pF
50V
COMP2
COMP2
C1122
560pF
50V
CM2012FR27KT
C1115
27pF
50V
CM2012FR27KT
C1116
27pF
50V
CM2012FR27KT
COMP_EU
C1117
27pF
50V
COMP_EU
L1109
L1108
L1107
FOR EMI
C1123
560pF
50V
AV2
C1124
560pF
50V
AV2
COMP2
R1131
22
COMP2
R1132
22
AV2
R1140
10
SC/COMP2_R_IN
SC/COMP2_L_IN
SC_R/COMP2_Pr
C1128
27pF
50V
SC_B/COMP2_Pb
C1129
27pF
50V
L1107-*1
CM2012FR10KT
COMP_NON_EU
SC_G/COMP2_Y
COMP_NON_EU
C1130
27pF
50V
COMP_EU
SC_DET/COMP2_DET
C1130-*1
47pF
50V
AV2_R_IN
AV2_L_IN
AV2_CVBS_IN
AV2_CVBS_DET
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
COMP/AV11
50
Page 40
TI solution M_REMOTE OPTION
P1302
12507WR-12L
M_REMOTE
13
.
+3.3V_Normal
L1303
120-ohm
R1315
100
R1319
100
M_REMOTE
M_REMOTE
R1316
100
M_REMOTE
R1317
100
M_REMOTE
R1318
100
3D_M_REMOTE
R1320
22
3D_M_REMOTE
R1324
22
3D_M_REMOTE
R1325
22
3D_M_REMOTE
R1326
22
M_REMOTE_RX
M_REMOTE_TX
3D_GPIO_0
3D_GPIO_1
3D_GPIO_2
3D_SYNC_RF
R1321
2.7K
M_REMOTE
3.3V
1
GND
2
3
4
5
6
7
8
9
10
11
12
RX
TX
RESET
DC
DD
GND
GPIO_0
GPIO_1
GPIO_2
3D_SYNC
M_REMOTE
M_REMOTE
+3.3V_Normal
R1322
2.7K
M_REMOTE
R1323
2.7K
M_REMOTE
M_RFModule_RESET
DC_MREMOTE
DD_MREMOTE
ALL M_REMOTE OPTION
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
13
50M_REMOCON
Page 41
Ethernet Block
JK1401
XRJH-01A-4-DA7-180-LG(B)
R1
1
R2
2
R3
3
R4
4
R5
5
R6
6
R7
7
R8
8
R9
9
R10[GND]
10
R11
11
YL_C
D1
YL_A
D2
GN_C
D3
GN_A
D4
12
SHIELD
R1401 240
R1402
+2.5V_BCM35230
+3.3V_Normal
240
L1401
MLB-201209-0120P-N2
C1401
0.1uF
16V
D1401
5.5V
LAN_ESD
D1405
D1403
5V
5V
LAN_ESD
LAN_ESD
D1402
5.5V
LAN_ESD
D1404
5.5V
LAN_ESD
D1401,D1402
D1403,D1404
D1405,D1406
D1406
5.5V
LAN_ESD
EPHY_ACTIVITY
EPHY_LINK
DUAL COMPONENT
1ST : EAH42720601 2ND : EAH60994401
EPHY_TDP
EPHY_TDN
EPHY_RDP
EPHY_RDN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DCDC_GND and A_GND are connected
DCDC_GND and A_GND are connected in pin#27
PCB_GND and A_GND are connected
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
R2314
0
A_GND
A_GND
R2301 33
LNB
C23080.22uF
LNB
R2302 33
OPT
C2309 27pF
SDA1_3.3V
LNB
R2303 0
27pF
OPT
C2310
SCL1_3.3V
LNB
LNB_INT
R2304
4.7K
LNB
+12V
L2302
BLM18PG121SN1D
Max 1.3A
+12V_LNB
LNB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
10K/1K to match ADC Full-Scale range
(1% of accruacy)
+5V_Normal
EU
R2545
10K
IC2502
NLASB3157DFT2G
SELECT
6
VCC
5
A
4
Selece = High ==> A = B1
Selece = Low ==> A = B0
REC_8
EU
1K
1%
C2528
1uF
10V
SC_ID
EU
B1
1
EU
GND
2
B0
3
ATV_OUT
C2532
180pF
50V
OPT
INCM_VID_SC
DTV_ATV_SELECT
L2507
120-ohm
BLM18PG121SN1D
NON_DTV_OUT
L2507-*1
0
DVT_OUT
CLOSE TO SOC
C2533
0.1uF
16V
C2534
180pF
50V
OPT
R2549
36
R2551
75
1%
EU
CLOSE TO SOC
CLOSE TO JACK
TP2501
DTV/MNT_V_OUT
AUD_OUT >> EU/CHINA_HOTEL_OPT
+12V
C2501
0.1uF
50V
AUD_OUT
SCART1_Lout_N
SCART1_Lout_P
SCART1_Rout_P
SCART1_Rout_N
AUD_OUT
AUD_OUT
CLOSE TO soc
L2501
AUD_OUT
R25715.6K
R25725.6K
AUD_OUT
AUD_OUT
R25735.6K
DTV/MNT_L_OUT
AUD_OUT
R25705.6K
DTV/MNT_R_OUT
AUD_OUT
C2514
C2513
10uF
16V
10uF
16V
AUD_OUT
C2535
6800pF
AUD_OUT
R2518
1K
50V
AUD_OUT
R25191K
AUD_OUT
R2524 6800pF
50V
AUD_OUT
33pF
AUD_OUT
AUD_OUT
AUD_OUT
R252633K
C2520
R252733K
C2521
33pF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
NON CHB
28
50
Page 48
DUAL COMPONENT
China Hotel Option
+3.3V_Normal
AMP_RESET_N
SPK_R+_HOTEL
SPK_R-_HOTEL
AMP_MUTE_HOTEL
AMP_MUTE_HOTEL
R2901 200
CN_HOTEL
B
R2902
10K
CN_HOTEL
C
Q2901
MMBT3904(NXP)
CN_HOTEL
E
AUDIO_R
+24V_AMP
C2901
0.1uF
CN_HOTEL
CN_HOTEL
R2903 0
R2904
0
CN_HOTEL
P2901
12505WS-09A00
CN_HOTEL
1
2
3
4
5
6
7
8
9
10
Q2901
1ST : EBK61012601 2ND : 0TRDI80002A
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
CHINA HOTEL
29
Page 49
LVDS
P3501
FI-RE51S-HFK-A
52
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
GND
[51Pin LVDS OUTPUT Connector]
NC
NC
NC
NC
NC
AUO_65_MIRROR
LVDS_SEL
NC
NC
L/DIM_ENABLE
GND
RA0N
RA0P
RA1N
RA1P
RA2N
RA2P
GND
RACLKN
RACLKP
GND
RA3N
RA3P
RA4N
RA4P
GND
BIT_SEL
RB0N
RB0P
RB1N
RB1P
RB2N
RB2P
GND
RBCLKN
RBCLKP
GND
RB3N
RB3P
RB4N
RB4P
GND
GND
GND
GND
GND
NC
VLCD
VLCD
VLCD
VLCD
R3512 33
LGD_2D/3D_CTRL
+3.3V_Normal
R3511
3.3K
AUO_65_MIRROR
2D/3D_CTL
PANEL_VCC
L3501
MLB-201209-0120P-N2
C3501
10uF
25V
OPT
LVDS_TXA0N
LVDS_TXA0P
LVDS_TXA1N
LVDS_TXA1P
LVDS_TXA2N
LVDS_TXA2P
LVDS_TXACLKN
LVDS_TXACLKP
LVDS_TXA3N
LVDS_TXA3P
LVDS_TXA4N
LVDS_TXA4P
LVDS_TXB0N
LVDS_TXB0P
LVDS_TXB1N
LVDS_TXB1P
LVDS_TXB2N
LVDS_TXB2P
LVDS_TXBCLKN
LVDS_TXBCLKP
LVDS_TXB3N
LVDS_TXB3P
LVDS_TXB4N
LVDS_TXB4P
C3502
1000pF
50V
LVDS_SEL
+3.3V_Normal
R3501
3.3K
LVDS_SEL_HIGH
R3502
10K
LVDS_SEL_LOW
C3503
0.1uF
50V
BIT_SEL
[41Pin LVDS OUTPUT Connector]
P3502
FI-RE41S-HFK-A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
R3503
10K
BIT_SEL_LOW
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
GND
NC
NC
NC
NC
NC
NC
NC
NC
GND
RC0N
RC0P
RC1N
RC1P
RC2N
RC2P
GND
RCCLKN
RCCLKP
GND
RC3N
RC3P
RC4N
RC4P
GND
GND
RD0N
RD0P
RD1N
RD1P
RD2N
RD2P
GND
RDCLKN
RDCLKP
GND
RD3N
RD3P
RD4N
RD4P
GND
GND
R3514 33
AUO_2D/3D_CTRL
2D/3D_CTL
LVDS_TXC0N
LVDS_TXC0P
LVDS_TXC1N
LVDS_TXC1P
LVDS_TXC2N
LVDS_TXC2P
LVDS_TXCCLKN
LVDS_TXCCLKP
LVDS_TXC3N
LVDS_TXC3P
LVDS_TXC4N
LVDS_TXC4P
LVDS_TXD0N
LVDS_TXD0P
LVDS_TXD1N
LVDS_TXD1P
LVDS_TXD2N
LVDS_TXD2P
LVDS_TXDCLKN
LVDS_TXDCLKP
LVDS_TXD3N
LVDS_TXD3P
LVDS_TXD4N
LVDS_TXD4P
LOCAL DIMMING
[To LED DRIVER]
P3503
12507WR-08L
1
2
3
4
5
6
7
8
9
NON USED L/DIMMING
(FOR EDGE_LED)
L/DIM0_MOSI
L/DIM0_SCLK
L/DIM0_VS
M1_MOSI
M1_SCLK
M2_MOSI
M2_SCLK
M3_MOSI
M3_SCLK
+3.3V_FRC
R3509
10K
OPT
R3510
10K
PLACE SERIAL RESISTORS CLOSE TO URSA4
R350633
R3507 33
R3504 0
LPB_42/47/55
R3505 0
LPB_42/47/55
R350833
R3513
4.7K
M0_SCLK
M0_MOSI
SCL2_3.3V
SDA2_3.3V
L_VS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
Interface block
2010. 10. 20
35
58
Page 50
+1.26V_FRC
C5201
0.1uF
+1.26V_FRC
C5202
0.1uF
L5205
CIC21J501NE
L5201
CIC21J501NE
C5210
22uF
10V
DVDD_DDR_1V
C5246
22uF
10V
VDDC10
C5206
0.1uF
C5211
22uF
10V
VDDC10
C5243
0.22uF
6.3V
C5225
0.1uF
C5228
0.1uF
+1.5V_FRC_DDR
C5213
0.1uF
+1.5V_FRC_DDR
C5244
0.22uF
6.3V
C5231
0.1uF
C5232
0.1uF
C5234
0.1uF
C5247
1uF
6.3V
Place Close to Bead
+3.3V_FRC
+3.3V_FRC
+3.3V_FRC
+3.3V_FRC
GPIO1 : HI => B8/94, LOW => B4/98
CHIP_CONF : {GPIO8, PWM1, PWM0}
CHIP_CONF = 3’d5 : boot from interal SRAM
CHIP_CONF = 3’d6 : boot from EEPROM
CHIP_CONF = 3’d7 : boot from SPI Flash
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Place the serail damping resistors
in the middle of DRAM pattern
FRC_DMU
FRC_DQSL
FRC_DQSLB
FRC_DQSU
FRC_DQSUB
FRC_DML
FRC_ODT
FRC_RASB
FRC_CKE
FRC_MCLK
FRC_MCLKB
FRC_DDR3_RESETBDDR3_RESETB
FRC_A[10]
FRC_BA1
FRC_A[12]
FRC_A[4]
FRC_A[6]
FRC_A[8]
FRC_A[1]
FRC_A[11]
FRC_A[0]
FRC_A[2]
FRC_A[13]
FRC_A[9]
FRC_A[7]
FRC_A[5]
FRC_A[3]
FRC_BA2
FRC_BA0
FRC_WEB
FRC_CASB
R531122
R531222
R531322
R531422
R531522
R531622
R531722
R531822
R531922
R532022
R532122
R532222
AR5301
22
AR5302
22
AR5303
22
AR5304
22
AR5305
22
DDR3_DMU
DDR3_DQSL
DDR3_DQSLB
DDR3_DQSU
DDR3_DQSUB
DDR3_DML
DDR3_ODT
DDR3_RASB
DDR3_CKE
DDR3_MCK
DDR3_MCKB
DDR3_A[10]
DDR3_BA1
DDR3_A[12]
DDR3_A[4]
DDR3_A[6]
DDR3_A[8]
DDR3_A[1]
DDR3_A[11]
DDR3_A[0]
DDR3_A[2]
DDR3_A[13]
DDR3_A[9]
DDR3_A[7]
DDR3_A[5]
DDR3_A[3]
DDR3_BA2
DDR3_BA0
DDR3_WEB
DDR3_CASB
FRC_DQL[4]
FRC_DQL[6]
FRC_DQL[2]
FRC_DQL[0]
FRC_DQU[5]
FRC_DQU[3]
FRC_DQU[7]
FRC_DQU[1]
FRC_DQU[4]
FRC_DQU[6]
FRC_DQU[2]
FRC_DQU[0]
FRC_DQL[3]
FRC_DQL[1]
FRC_DQL[5]
FRC_DQL[7]
AR5306
22
AR5307
22
AR5308
22
AR5309
22
DDR3_DQL[4]
DDR3_DQL[6]
DDR3_DQL[2]
DDR3_DQL[0]
DDR3_DQU[5]
DDR3_DQU[3]
DDR3_DQU[7]
DDR3_DQU[1]
DDR3_DQU[4]
DDR3_DQU[6]
DDR3_DQU[2]
DDR3_DQU[0]
DDR3_DQL[3]
DDR3_DQL[1]
DDR3_DQL[5]
DDR3_DQL[7]
+1.5V_FRC_DDR
C5303
0.1uF
16V
C5304
22uF
10V
Place Close to DDR Pin
NON 21:9 Cinema(1600MHz)
IC5301
H5TQ1G63DFR-PBC
MVREFCA
M8
H1
L8
B2
D9
G7
K2
K8
N1
N9
R1
R9
A1
A8
C1
C9
D2
E9
F1
H2
H9
J1
J9
L1
L9
T7
A9
B3
E1
G8
J2
J8
M1
M9
P1
P9
T1
T9
B1
B9
D1
D8
E2
E8
F9
G1
G9
MVREFDQ
+1.5V_FRC_DDR
R5305
240
1%
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MStar URSA5
2010. 08.18
DDR3 4Mbit53
55
Page 52
CORE +1.26V_FRC
+12V
L5402
CIC21J501NE
C5402
C5404
10uF
10uF
25V
25V
Placed on SMD-TOP
C5406
0.1uF
PGND
AGND
VIN
FB
IC5401
AOZ1072AI
1
2
2A
3
4
TYPICAL 980mA
+3.3V_FRC
R5405
R5404
20K
OPT
10K
R5406
3.3K
1%
R5407
3.9K
1%
R5408
12K
1%
OPT
R5409 10K
R1
C5410
100pF
50V
OPT
R2
POWER_ON/OFF2_2
L5403
3.6uH
LX_2
8
LX_1
7
EN
6
COMP
5
NR8040T3R6N
C5407
1uF
10V
C5408
R5402
3300pF
20K
+1.26V_FRC
C5412
22uF
10V
C5414
22uF
10V
+3.3V_FRC
C5416
10uF
16V
C5417
0.1uF
16V
+1.5V_FRC
AP7173-SPG-13 HF(DIODES)
IN
PG
R5413
10K
C5418
1uF
10V
VCC
EN
IC5403
1
2
THERMAL
3
4
EAN41406705
TYPICAL 350mA
[EP]
8
OUT
9
7
FB
6
SS
5
GND
C5419
560pF
50V
R1
R5414
4.3K
1%
R5415
3.9K
1%
R2
R5416
1K
1%
C5420
10uF
16V
+1.5V_FRC_DDR
C5421
10uF
16V
+12V
L5401
CIC21J501NE
C5401
10uF
25V
Vout=(1+R1/R2)*0.8
+3.3V_FRC
IC5402
AOZ1072AI-3
PGND
1
VIN
AGND
FB
2
2A
3
4
EAN60922902
C5403
10uF
25V
C5405
0.1uF
Vout=0.6*(1+R1/R2)
+1.5V of DDR&URSA5 uses same power line
TYPICAL 300mA
+3.3V_FRC
L5404
3.6uH
R5403
10K
R5401
20K
NR8040T3R6N
POWER_ON/OFF2_2
C5409
2200pF
R5410
27K
1%
R5411
4.3K
1%
R1
C5411
100pF
50V
OPT
C5413
22uF
10V
C5415
22uF
10V
LX_2
8
LX_1
7
EN
6
COMP
5
R5412
10K
1%
R2
Vout=0.8*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MStar URSA5
URSA5 Power Block
2010. 08.18
54
55
Page 53
USB / DVR Ready
+3.3V_Normal
3AU04S-305-ZC-(LG)
JK5501
1234
USB D OWN STRE AM
5
USB
L5501
MLB-201209-0120P-N2
120-ohm
C5505
C5501
100uF
10uF
16V
10V
OPT
D5505
RCLAMP0502BA
IC5501
AP2191DSG
NC
8
OUT_2
7
OUT_1
6
FLG
5
D5501
CDS3C05HDMI1
5.6V
GND
1
IN_1
2
IN_2
3
EN
4
R5501
4.7K
OPT
SIDE_USB_CTL2
D5502
CDS3C05HDMI1
5.6V
R5502
2.7K
WIFI_DM
WIFI_DP
+5V_USB
C5502
0.1uF
SIDE_USB_OCD2
COMMON JP FOR WIFI MODEL
JP1201
JP1202
3AU04S-305-ZC-(LG)
JK5502
1234
USB D OWN STRE AM
5
L5502
MLB-201209-0120P-N2
C5506
100uF
16V
120-ohm
C5503
10uF
10V
OPT
D5506
RCLAMP0502BA
IC5502
AP2191DSG
NC
8
OUT_2
7
OUT_1
6
FLG
5
D5503
CDS3C05HDMI1
5.6V
GND
1
IN_1
2
IN_2
3
EN
4
CDS3C05HDMI1
+3.3V_Normal
R5503
4.7K
OPT
SIDE_USB_CTL1
D5504
5.6V
R5504
2.7K
SIDE_USB_DM
SIDE_USB_DP
+5V_USB
C5504
0.1uF
SIDE_USB_OCD1
JP1203
JP1204
/RST_HUB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
BCM35230
USB (NON WIFI)
2010. 10. 20
55
Page 54
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SMD GASKET
M1-*3
MDS62110206
GASKET_6.5T
M2-*3
MDS62110206
GASKET_6.5T
M3-*3
MDS62110206
GASKET_6.5T
M4-*3
MDS62110206
GASKET_6.5T
M5-*3
MDS62110206
GASKET_6.5T
M6-*3
MDS62110206
GASKET_6.5T
M7-*3
MDS62110206
GASKET_6.5T
M8-*3
MDS62110206
GASKET_6.5T
M9-*3
MDS62110206
GASKET_6.5T
M10-*3
MDS62110206
GASKET_6.5T
M11-*3
MDS62110206
GASKET_6.5T
M12-*3
MDS62110206
GASKET_6.5T
SMD GASKET 6.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
MDS62110204
GASKET_5.5T
M1-*2
M2-*2
M3-*2
M4-*2
M5-*2
M6-*2
M7-*2
M8-*2
M9-*2
M10-*2
M11-*2
M12-*2
SMD GASKET 5.5T
M1-*1
MDS62110210
GASKET_5.0T
M2-*1
MDS62110210
GASKET_5.0T
M3-*1
MDS62110210
GASKET_5.0T
M4-*1
MDS62110210
GASKET_5.0T
M5-*1
MDS62110210
GASKET_5.0T
M6-*1
MDS62110210
GASKET_5.0T
M7-*1
MDS62110210
GASKET_5.0T
M8-*1
MDS62110210
GASKET_5.0T
M9-*1
MDS62110210
GASKET_5.0T
M10-*1
MDS62110210
GASKET_5.0T
M11-*1
MDS62110210
GASKET_5.0T
M12-*1
MDS62110210
GASKET_5.0T
SMD GASKET 5.0T
M1
MDS62110208
GASKET_4.5T
M2
MDS62110208
GASKET_4.5T
M3
MDS62110208
GASKET_4.5T
M4
MDS62110208
GASKET_4.5T
M5
MDS62110208
GASKET_4.5T
M6
MDS62110208
GASKET_4.5T
M7
MDS62110208
GASKET_4.5T
M8
MDS62110208
GASKET_4.5T
M9
MDS62110208
GASKET_4.5T
M10
MDS62110208
GASKET_4.5T
M11
MDS62110208
GASKET_4.5T
M12
MDS62110208
GASKET_4.5T
SMD GASKET 4.5T
SMD GASKET
BCM35230
GASKET3.5T_HEATSINK
MDS62110213
M20
GASKET3.5T_HEATSINK
MDS62110213
M21
GASKET3.5T_HEATSINK
MDS62110213
M22
GASKET3.5T_HEATSINK
MDS62110213
M23
M1-*6
MDS61887710
GASKET_9.5T
M2-*6
MDS61887710
GASKET_9.5T
M3-*6
MDS61887710
GASKET_9.5T
M4-*6
MDS61887710
GASKET_9.5T
M5-*6
MDS61887710
GASKET_9.5T
M6-*6
MDS61887710
GASKET_9.5T
M7-*6
MDS61887710
GASKET_9.5T
M8-*6
MDS61887710
GASKET_9.5T
M9-*6
MDS61887710
GASKET_9.5T
M10-*6
MDS61887710
GASKET_9.5T
M11-*6
MDS61887710
GASKET_9.5T
M12-*6
MDS61887710
GASKET_9.5T
SMD GASKET 9.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
GASKET_8.5T
M1-*5
MDS62110209
M2-*5
MDS62110209
M3-*5
MDS62110209
M4-*5
MDS62110209
M5-*5
MDS62110209
M6-*5
MDS62110209
M7-*5
MDS62110209
M8-*5
MDS62110209
M9-*5
MDS62110209
M10-*5
MDS62110209
M11-*5
MDS62110209
M12-*5
MDS62110209
SMD GASKET 8.5T
M1-*4
MDS62110205
GASKET_7.5T
M2-*4
MDS62110205
GASKET_7.5T
M3-*4
MDS62110205
GASKET_7.5T
M4-*4
MDS62110205
GASKET_7.5T
M5-*4
MDS62110205
GASKET_7.5T
M6-*4
MDS62110205
GASKET_7.5T
M7-*4
MDS62110205
GASKET_7.5T
M8-*4
MDS62110205
GASKET_7.5T
M9-*4
MDS62110205
GASKET_7.5T
M10-*4
MDS62110205
GASKET_7.5T
M11-*4
MDS62110205
GASKET_7.5T
M12-*4
MDS62110205
GASKET_7.5T
SMD GASKET 7.5T
2010. 09. 18
56
56
Page 55
FROM LIPS & POWER B/D
+3.5V_ST
RT1P141C-T112
Q502
R502
RL_ON
10K
+3.5V_ST
+12V
MLB-201209-0120P-N2
C506
0.1uF
50V
#16/#20/#23
LD - GND OR USE
LE(N.L.D.) - OPEN
LE(L.D.) - USE
C
Q501
B
2SC3052
E
L503
MLB-201209-0120P-N2
C508
0.1uF
16V
L501
R508
4.7K
3
1
2
PWR ON
3.5V
3.5V
GND/P.DIM2
NORMAL_26~55
1
1
24V
3
3
GND
5
5
GND
7
7
9
9
11
11
GND
13
13
GND
15
15
12V
17
17
12V
19
19
12V
21
2122
23
2324
SLIM_32~55
SMAW200-H24S2
P502
FW20020-24S
2
2
4
4
6
6
8
8
10
10
12
12
14
14
16
16
18
18
20
20
22
24
25
P501
24V
24V
GND
GND
3.5V
3.5V
GND
GND/V-sync
INV ON
A.DIM
P.DIM1
Err OUT
L504
MLB-201209-0120P-N2
POWER_16_URSA_SCAN
R574 0
R573 0
POWER_16_BCM_SCAN
R518
0
POWER_16_GND
C519
0.1uF
+24V
50V
L_VS
L/DIM0_VS
INV_CTL_18
A_DIM_20
PWM_DIM_22
Power_DET
PD_+20V
R510-*4
5.6K
1%
PD_+20V
R511-*4
1.3K
1%
PD_+18.5V
R510-*3
4.7K
1%
PD_+18.5V
R511-*3
1.21K
1%
+12V
PD_+12V
R512
2.7K
1%
PD_+12V
R513
1.21K
1%
+24V
+3.5V_ST
PD_24V
R510
8.2K
1%
PD_24V
R511
1.5K
1%
PD_+3.5V
R515
0
5%
NCP803SN293
VCC
C580
0.1uF
16V
PD_+18.5_20_24V
PD_+18.5_20_24V
NCP803SN293
VCC
C581
0.1uF
16V
PD_+18.5_20_24V
R517
100K
IC503
RESET
3
2
1
GND
R516
100K
IC502
RESET
3
2
1
GND
+3.5V_ST
R520
100
R519
100
PD_+18.5_20_24V
R522
10K
OPT
ESD
C520
0.1uF
16V
not to RESET at 8kV ESD
ST_3.5V-->3.5V
POWER_DET
15V-->3.6V
20V-->3.5V
24V-->3.48V
12V-->3.58V
+0.9V_CORE_BCM35230
+12V
L502
BLM18PG121SN1D
Placed on SMD-TOP
C505
C503
10uF
10uF
16V
16V
POWER_ON/OFF2_2
R503
C504
100pF
50V
0.9V_CORE_FB
R501
12K
1%
R2
1K
R504
2K
C509
+3.3V_Normal
TEST
C507
1000pF
50V
R505
6.8K
1%
R1
10K
R506
330
50V
220pF
R507
C510
0.01uF
50V
OPT
ENABLE
TPS40192DRCR
1
FB
2
COMP
3
VDD
4
PGD
5
C513
0.1uF
16V
0.9V_CORE_FB
IC501
11
THERMAL
EP_GND
HDRV
10
9
8
7
6
SW
BOOT
LDRV
BP5
R5774.7
C515
0.47uF
25V
R5784.7
C516
4.7uF
10V
Vout=0.591*(1+R1/R2)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.