LG 43LF5700, 43LF5700-TA Schematic
Internal Use Only
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
LED TV
SERVICE MANUAL
CHASSIS : LB55H
MODEL : 43LF5700 43LF5700-TA
43LF5710 43LF5710-TB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in KoreaP/NO : MFL68625529 (1501-REV00)
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ........................................................................ 3
SERVICING PRECAUTIONS ................................................................... 4
SPECIFICATION ...................................................................................... 6
ADJUSTMENT INSTRUCTION ............................................................... 9
BLOCK DIAGRAM ................................................................................. 14
EXPLODED VIEW .................................................................................. 17
SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX
TROUBLE SHOOTING GUIDE ................................................ APPENDIX
Only for training and service purposes
- 2 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Only for training and service purposes
- 3 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some sol-
der removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Only for training and service purposes
- 4 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
Only for training and service purposes
- 5 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
1. Application range
This specification is applied to the LED TV used LB55H
chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
4. Model General Specification
No. Item Specication Remarks
1 Market
2 Broadcasting system
3 Channel Storage
4 Receiving system
5 Video(Composite) Input PAL, SECAM, NTSC 4 System : PAL, SECAM, NTSC, PAL60
6 Component Input Y/Cb/Cr, Y/Pb/Pr
7 HDMI Input
8 SPDIF out SPDIF out Depend on model
9 USB Input
10 Headphone
Asia, Oceania, Africa, Middle East
(PAL/DVB Market)
1) PAL B/G/D/K/I, SECAM B/G/D/K
2) NTSC-M
3) DVB-T
4) DVB-T//T2
5) DVB-T/T2/S2
1) DVB-T & Analog TV : 1500EA
2) DVB-T/T2 & Analog TV : 1500EA
3) DVB-T/T2/S2 & Analog TV : 6000EA
Analog : VHF,UHF,CATV
Digital : DVB
HDMI1-DTV/PC
HDMI2-DTV/MHL
For My Media(Movie/Photo/Music List) and
SVC
1): Support all model
2): Support all model
3): depend on model
4): depend on model
5): depend on model
Satellite Digital TV : VHF, UHF, C-Band, Ku-Band
Digital TV : VHF, UHF
Analogue TV : VHF, UHF, CATV
► DVB-T
- Guard Interval (Bitrate_Mbit/s) :1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate
QPSK : 1/2, 2/3, 3/4, 5/6, 7/8
16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval (Bitrate_Mbit/s)
1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate
QPSK : 1/2, 2/5, 2/3, 3/4, 5/6
16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-S
- symbol rate
DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s
DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi
DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8
DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
Support HDCP 1.4
LF54 can’t support MHL
Only for training and service purposes
- 6 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Component Video Input (Y, Cb/Pb, Cr/Pr)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark
1 720*576 15.625 50.00 13.5 SDTV ,DVD 576I
2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
4 720*576 31.25 50.00 27.00 SDTV 576P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*480 31.47 59.94 27.00 SDTV 480P
7 1280*720 37.50 50.00 74.25 HDTV 720P
8 1280*720 45.00 60.00 74.25 HDTV 720P
9 1280*720 44.96 59.94 74.176 HDTV 720P
10 1920*1080 28.125 50.00 74.25 HDTV 1080I Except HD Model
11 1920*1080 33.75 60.00 74.25 HDTV 1080I Except HD Model
12 1920*1080 33.72 59.94 74.176 HDTV 1080I Except HD Model
13 1920*1080 56.25 50.00 148.50 HDTV 1080P Except HD Model
14 1920*1080 67.50 60.00 148.50 HDTV 1080P Except HD Model
15 1920*1080 67.432 59.94 148.352 HDTV 1080P Except HD Model
16 1920*1080 27.00 24.00 74.25 HDTV 1080P Except HD Model
17 1920*1080 26.97 23.94 74.176 HDTV 1080P Except HD Model
18 1920*1080 33.75 30.00 74.25 HDTV 1080P Except HD Model
19 1920*1080 33.71 29.97 74.176 HDTV 1080P Except HD Model
Only for training and service purposes
- 7 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
6. HDMI Input : Refer to adjust specification about EDID data.
6.1. DTV mode
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark
PC(DVI) DDC
1 640*350 31.468 70.09 25.17 EGA X
2 720*400 31.469 70.08 28.32 DOS O
3 640*480 31.469 59.94 25.17 VESA(VGA) O
4 800*600 37.879 60.31 40.00 VESA(SVGA) O
5 1024*768 48.363 60.00 65.00 VESA(XGA) O
6 1152*864 54.348 60.053 80.00 VESA O
7 1360*768 47.712 60.015 85.50 VESA (WXGA) O
8 1280*1024 63.981 60.020 108.0 VESA (SXGA) O Except HD Model
9 1920*1080 67.50 60.00 148.5 HDTV 1080P O Except HD Model
10 3840*2160 54 24.00 297.00 UDTV 2160P O Only UD Model
11 3840*2160 56.25 25.00 297.00 UDTV 2160P O Only UD Model
12 3840*2160 67.5 30.00 297.00 UDTV 2160P O Only UD Model
13 4096*2160 53.95 23.97 296.703 UDTV 2160P O Only UD Model
14 4096*2160 54 24 297 UDTV 2160P O Only UD Model
DTV
1 640*480 31.469 59.94 27.00
2 640*480 31.5 60.00 27.027
3 720*480 31.469 59.94 27.00
4 720*480 31.50 60.00 27.027
5 720*576 31.250 50.00 27.00
6 1280*720 37.50 50.00 74.25
7 1280*720 45.00 60.00 74.25
8 1280*720 44.96 59.94 74.176
9 1920*1080 28.125 50.00 74.25
10 1920*1080 33.75 60.00 74.25
11 1920*1080 33.72 59.94 74.176
12 1920*1080 56.250 50.00 148.50
13 1920*1080 67.50 60.00 148.50
14 1920*1080 67.432 59.94 148.35
15 1920*1080 27.00 24.00 74.25
16 1920*1080 26.973 23.976 74.175
17 1920*1080 33.75 30.00 74.25
18 1920*1080 33.716 29.97 74.175
19 3840*2160 53.95 23.98 297.00 UHD only
20 3840*2160 54.00 24.00 297.00 UHD only
21 3840*2160 56.25 25.00 297.00 UHD only
22 3840*2160 61.43 29.97 297.00 UHD only
23 3840*2160 67.50 30.00 297.00 UHD only
24 3840*2160 112.50 50.00 594.00 UHD only
25 3840*2160 135.00 59.94 593.41 UHD only
26 3840*2160 135.00 60.00 594.00 UHD only
27 4096*2160 53.95 23.98 297.00 UHD only
28 4096*2160 54.00 24.00 297.00 UHD only
29 4096*2160 56.25 25.00 297.00 UHD only
30 4096*2160 61.43 29.97 297.00 UHD only
31 4096*2160 67.50 30.00 297.00 UHD only
32 4096*2160 112.50 50.00 594.00 UHD only
33 4096*2160 135.00 59.94 593.41 UHD only
34 4096*2160 135.00 60.00 594.00 UHD only
Only for training and service purposes
- 8 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED TV with
LB55H chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 ± 10 %
Input voltage : 100-220 V~, 50/60 Hz
(6) Adjustment equipments
: Color Analyzer(CA-210 or CA-110), Service remote control.
(7) Push the “IN STOP" key - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
(4) Click "Connect" tab. If "Can't" is displayed, check connection
between computer, jig and set.
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
(5) Click "Auto" tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
(4)
filexxx.bin
(5)
(7)...........OK
(6)
3. Main PCB check process
▪ APC - After Manual-Insert, executing APC
* Boot file Download
(1) Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
(2) Set as below, and then click "Auto Detect" and check "OK"
message.
If "Error" is displayed, check connection between computer,
jig, and set.
(3) Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
(1)
filexxx.bin
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If version of update file in USB Stick is lower, it will not
work. But version of update file is higher, USB data will be
detected automatically.
Only for training and service purposes
- 9 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
(3) Show the message "Copying files from memory".
(4) Updating is starting.
(5) Updating Completed, the TV will restart automatically.
(6) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If updated version is newer than what TV has, the TV can
lost all channel data. In this case, you have to channel
recover. If all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
4. ADC Process
4.1. ADC
- Enter Service Mode by pushing "ADJ" key,
- Enter Internal ADC mode by pushing "►" key at "8. ADC
Calibration".
<Caution> Using "P-ONLY" key of the Adjustment remote
* ADC Calibration Protocol (RS232)
No. Item CMD 1 CMD 2 Data 0
Enter Adjust
MODE
ADC adjust
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration ►
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L
13. Sub B/C
14. Ext. Input Adjust
15. SPK Lipsync Adjust
16. SPDIF Lipsync Adjust
control, power on TV.
Adjust
‘Mode In’
ADC
Adjust
A A 0 0
A D 1 0
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC Type ◄ ►
Start
NG
NG
OTP
Reset
When transfer the ‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal pattern)
* After downloading, have to adjust Tool Option again.
(1) Push "IN-START" key in service remote control.
(2) Select "Tool Option 1" and push "OK" key.
(3) Punch in the number. (Each model has their number)
(4) Completed selecting Tool option.
*
RS-232C Connection Method.
Connection : PCBA (USB Port) → USB to Serial Adapter
(UC-232A) → RS-232C cable → PC(RS-232C port)
● Product name of USB to Serial Adapter is UC-232A.
Adjust Sequence
▪ aa 00 00 [Enter Adjust Mode]
▪ xb 00 40 [Component1 Input (480i)]
▪ ad 00 10 [Adjust 480i Comp1]
▪ aa 00 90 End Adjust mode
* Required equipment : Adjustment remote control.
4.2. Function Check
4.2.1. Check display and sound
■ Check Input and Signal items.
(1) TV
(2) AV (CVBS)
(3) COMPONENT (480i)
(4) HDMI
* Display and Sound check is executed by Remote control.
<Caution> Not to push the "INSTOP" key after completion if
the function inspection.
Only for training and service purposes
- 10 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
5. Total Assembly line process
5.1. Adjustment Preparation
▪ W/B Equipment condition
CA210: CH14, Test signal: Inner pattern(80IRE)-LED Module
▪ Above 5 minutes H/run in the inner pattern. ("power on" key
of Adjustment remote control)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside Pattern is used when W/B is controlled. Connect to
auto controller or push Adjustment Remote control POWER
ON → Enter the mode of White-Balance, the pattern will
come out.
* The spec of color temperature and coordinate.
Mode Color Temp Color coordinate Remark
Cool (C50) 13,000 K
Medium (0) 9,300 K
Warm (W50) 6,500 K
X=0.271 (± 0.002)
Y=0.270 (± 0.002)
X=0.286 (± 0.002)
Y=0.289 (± 0.002)
X=0.313 (± 0.002)
Y=0.329 (± 0.002)
<Test Signal>
- Inner pattern
for W/B adjust
- External white
pattern
(80IRE, 204gray)
* W/B Table in process of aging time
- LGD Module
(normal line) March ~ December
Aging time(Min) Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 282 289 297 308 324 348
2 3-5 281 287 296 306 323 346
3 6-9 279 284 294 303 321 343
4 10-19 277 280 292 299 319 339
5 20-35 275 277 290 296 317 336
6 36-49 274 274 289 293 316 333
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
(normal line) January ~ Feburary
Aging time Cool Medium Warm
color coordinate x y x y x y
Target 271 270 286 289 313 329
1 0-2 286 295 301 314 328 354
2 3-5 284 290 299 309 326 349
3 6-9 282 287 297 306 324 346
4 10-19 279 283 294 302 321 342
5 20-35 276 278 291 297 318 337
6 36-49 274 275 289 294 316 334
7 50-79 273 272 288 291 315 331
8 80-119 272 271 287 290 314 330
9 Over 120 271 270 286 289 313 329
- AUO/INX/COST/SHARP/BOE Module which cool spec is
13000 K
Cool Medium Warm
x y x y x y
spec 271 270 286 289 313 329
target 278 280 293 299 320 339
Full White Pattern
RS-232C Communication
CA-210
COLOR
ANALYZER
TYPE : CA-210
* Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10 lux).
(2) Adhere closely the Color analyzer(CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
▪ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
MIN
<Caution>
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.(When R/G/B Gain are all
C0, it is the FULL Dynamic Range of Module)
CENTER
(DEFAULT)
MAX
Only for training and service purposes
- 11 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
* Manual W/B process using adjust Remote control.
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000.
■ Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■ Enter White Balance by pushing “►” key at “9. White
Balance”.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance ►
10. 10 Point WB
11. Test Pattern
12 EDID D/L
13. Sub B/C
14. Ext. Input Adjust
15. SPK Lipsync Adjust
16. SPDIF Lipsync Adjust
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using “P-ONLY” key on remote
controller and then operate heat run longer than 15
minutes.(If not executed this step, the condition for W/B
may be different.)
(2) Push “Exit” key.
(3) Enter White Balance mode by pushing the ADJ key and
select “9. White Balance”. When KEY (►) is pressed,
206 Gray internal pattern will be displayed.
(4) Zero Calibrate the probe of Color Analyzer, then place it
on the center of LCD module within 10 cm of the surface
(5) Select each items (Red/Green/Blue Gain) using ▲/▼
(CH +/-) key on Remote control.
(6) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.
(7) Adjust three modes all (Cool / Medium / Warm)
- For All model w/o LS345
Fix the one of R/G/B gain and change the others
- For G-FIX model
Cool Mode
1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others. (If G gain is adjusted over 172
and R and B gain less than 192 , Adjust is O.K.)
2) If G gain is less than 172, Increase G gain by up to
172, and then increase R gain and G gain same
amount of increasing G gain.
3) If R gain or B gain is over 255, readjust G gain less
than 172, Conform to R gain is 255 or B gain is 255
Medium / Warm Mode - Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(8) When adjustment is completed, exit adjustment mode
using EXIT key on Remote control.
Whit Balance
Color Temp. ◄ ►
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern
Backlight
Reset To Set
Cool
172
192
192
64
64
64
ON
100
* CASE Cool
First adjust the coordinate far away from the target
value(x, y).
1) x, y > target
i) Decrease the R, G.
2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3) x > target, y < target
i) First decrease B, so make y a little more than the
target.
ii) Adjust x value by decreasing the R.
4) x < target, y > target
i) First decrease B, so make x a little more than the
target.
ii) Adjust x value by decreasing the G.
* After You finish all adjustments, Press “In-start” button
and compare Tool option and Area option value with its
BOM, if it is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and
unplug AC cable.
For correct it to the model’s module from factory JIG
model.
* Push the “IN STOP" key after completing the function
inspection.
5.2. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
5.3. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***: Year : Controlled
****: Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option Commercial
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L ►
13. Sub B/C
14. Ext. Input Adjust
15. SPK Lipsync Adjust
16. SPDIF Lipsync Adjust
EDID D/L
HDMI1 NG
HDMI2 NG
Reset
Start
EDID D/L
HDMI1 OK
HDMI2 OK
Reset
Start
Only for training and service purposes
- 12 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
[Caution]
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
5.4. Outgoing condition Configuration
■ When pressing IN-STOP key by Service remote control,
Red LED are blinked alternatively. And then automatically
turn off. (Must not AC power OFF during blinking)
* Edid data and Model option download (RS232)
NO Item CMD 1 CMD 2 Data 0
Enter download
Mode
EDID data and
Model option
download
(1) FHD 8BIT 2D HDMI EDID DATA
0 00 FF FF FF FF FF FF 00 1E 6D A B
10 C 01 03 80 A0 5a 78 0A EE 91 A3 54 4C 99 26
20 0F 50 54 A1 08 00 31 40 45 40 61 40 71 40 81 80
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 A0 5A 00 00 00 1E 66 21 50 B0 51 00 1B 30
50 40 70 36 00 A0 5A 00 00 00 1E 00 00 00 FD 00 3A
60 3E 1E 53 10 00 0A 20 20 20 20 20 20 D
70 D 01 E
80 02 03 22 F1 4E 10 9F 04 13 05 14 03 02 12 20 21
90 22 15 01 26 15 07 50 09 57 07 f
A0 80 1E 01 1d 80 18 71 1c 16 20 58 2c 25 00 20 C2
B0 31 00 0 9e 01 1d 00 72 51 d0 1e 20 6e 28 55 00
C0 20 C2 31 00 00 1e 02 3a 80 18 71 38 2d 40 58 2c
D0 45 00 A0 5a 00 00 00 1e 01 1d 00 Bc 52 d0 1e 20
E0 B8 28 55 40 C4 8e 21 00 00 1e 00 00 00 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 E
(2) Detail EDID Options are below
Model Name HEX EDID Table DDC Function
HD/FHD Model 0001 01 00 Analog/Digital
MODEL NAME MODEL NAME(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20 (LG TV)
Download
‘Mode In’
Download A E 00 10
A A 0 0
When transfer the ‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal pattern)
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
0 1 2 3 4 5 6 7 8 9 A B C D E F
a. Product ID
b. Serial No: Controlled on production line.
c. Month, Year: Controlled on production line:
ex) Week : '01' -> '01'
Year : '2014' -> '18' fix
d. Model Name(Hex): Refer to the ASCII Code Table.
Cf) model name in EDID data is below.
5.5. GND and HI-POT Test
5.5.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion
condition.
(2) You can’t use Tuner Ground & Tuner signal line at all
models (applied Isolator inner tuner)
5.5.2. GND & HI-POT auto-check
(1) Pallet moves in the station.(POWER CORD / AV CORD is
tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process(Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next
process automatically.
5.5.3. Checkpoint
(1) Test voltage
1) 3 Poles
- GND: 1.5 KV/min at 100 mA
- SIGNAL: 3 KV/min at 100 mA
2) 2 Poles
- SIGNAL: 3 KV/min at 100 mA
(2) TEST time: 1 second
(3) TEST POINT
1) 3 Poles
- GND Test = POWER CORD GND and SIGNAL
CABLE GND.
- Hi-pot Test = POWER CORD GND and LIVE &
NEUTRAL.
2) 2 Poles
- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5 mArms
e. Checksum: Changeable by total EDID data.
EDID C/S data 2D FHD 8BIT
Check Sum
(Hex)
Block 0 40
Block 1
25 (HDMI1)
15 (HDMI2)
Only for training and service purposes
- 13 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
1. MAIN
BLOCK DIAGRAM
IC1300
Serial Flash
SPI_SCK/SDI/SD O/CS
SPK_L
IC104
(8Mbit)
IC102
(256Kbit)
System EEPROM
I2C_SCL/SDA
(1Gbit)
NAND FLASH
PCM_A[0-7],…
AUD_LRCH,
AUD_MASTER_CLK,
SPK_R
30P HD LVDS wafer
(P1101)
51P FHD LVDS wafer
(P1100)
(P600)
(IC3401)
STA380BW
AMP_SC L/SDA
AUD_LRCK, AU D_SCK
Connector
KEY1/2, LED_R, IR
RXA0+/-~RXA4+/ -, RXACK+/-
RXB0+/-~RXB4+/-, RXBCK+/-
(IC101)
Main SOC
M1A -256MB T
USB1_OCD/CTL
TPS65281
SIDE_USB_DM/DP
+5V_USB
USB
(JK700)
SIDE
Only for training and service purposes
AV2_L/R_IN
SPDIF_OUT
AV2_CVB S_IN
D_IF
HP_L/ROU T, SIDE_HP_MUTE
CK+/-, D0+/-, D1+/-, D2+/-,_H DMI4, DDC_SCL/SDA_4, HDMI_CEC
SIF
CVBS
TU_SCL / SDA
DDC_SCL/SDA_2, HDMI_CEC
CK+/-, D0+/-, D1+/-, D2+/-_HDMI2
COMP2_L/R_IN
COMP2_Y+/AV_CVB S_IN, COMP2_Pb+/Pr+
AV2
(JK803)
HDMI2(MHL)
- 14 -
HDMI1
(JK801)
(JK1001)
SPDIF(Optic)
(JK1701)
REAR
Comp1 & AV1
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
2. I2C
TUNER
AMP
DEMOD
LNB
EEPROM
URSA
VCOM
Digital_Eye
HW_I2C
I2C_SC(D)KM1/GPIO80(81)
Only for training and service purposes
SW_I2C
GPIO159(160)
- 15 -
SW_I2C
I2C_SC(D)KM3/I2C_DDCR_CK/GPIO76/(77)
HW_I2C
HW_I2C
SDAM2/GPIO55(56)
SCK(D)M0/GPIO58(59)
HW I2C 4ea + SW I2C 1ea
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
3. POWER
+13.2V_AMP
3.3V_Normal
Tuner 3.3V
+5V_Normal
+1.10V_VDDC
PANNEL Vcc
L410
13.2V → 3.5V
IC405 (DCDC)
L412
AVDD_NODIE
L206
AVDD_DMPLL
L207
AVDD_AU33
L205
L205
13.2V → 3.5V
IC400 (DCDC)
L404
IC404 (LDO)
3.3V → 1.5V DDR
3.3V_Normal
L5600
L408
+13.2V
Only for training and service purposes
- 16 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
400
IMPORTANT SAFETY NOTICE
910
900
410
120
800
521
540
530
LV1
200
810
820
121
500
A10
A2
Stand Screw
Only for training and service purposes
- 17 -
LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
TP for NON-EU models(except EU and China)
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORD PCM_A[11]
/PCM_IOWR CI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
TP for L15
/VBUS_EN
RGB_DDC_SCL
RGB_DDC_SDA
TU_GND_A
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
TP_NON_EU 3
140702
POWER
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
FROM POWER B/D 13.2V
+3.5V_ST
TR_NXP
MMBT3906(NXP)
R406
10K
R404
4.7K
TR_NXP
Q400
MMBT3904(NXP)
R419
100
TR_NXP
Q402
MMBT3904(NXP)
1
TVS_SEMTECH
RL_ON
INV_CTL
+3.5V_ST
OPT
R400
10K
R401
10K
+3.5V_ST
R426
10K
TR_KEC
Q400-*1
2N3904S
B
R402
10K
+3.3V_Normal
R425
10K
TR_KEC
Q402-*1
2N3904S
B
B
B
R420
C
E
C
E
C
E
1K
C
E
+13.2V to +3.5V_STANDBY
+13.2V
L412
BLM18PG121SN1D
C438
C439
10uF
0.1uF
25V
25V
R1
R46 9
R468
68K
6.8K
1/1 6W
1/16W
1%
1%
C440
100pF
50V
R2
R471
22K
1/16W
1%
C441
1uF
10V
C442
2200pF
Vout=0.765*(1+R1/R2)
Q401
2
ZD404
TVS_KEC
ZD404-*1
R470
10K
50V
2N3906S-RTK
3
5V
EN
FB
VREG
SS
TR_KEC
Q401-*1
EBC
OPT
R412
33K
P401
SMAW200-H12S5K(BK)(LTR)
PWR_ON
1
GND
3
D13.2V
5
A13.2V
7
GND
9
DRV_ON
11
13
IC405
BD9D321EFJ
1
2
3
4
3A
9
THERMAL
8
7
6
5
[EP]
VIN
BOOT
SW
GND
+13.2V POWER_DET
+13.2V
R430
14K
1%
R431
C415
5.6K
0.1uF
1%
25V
OPT
R467
1K
PDIM#2
2
D13.2V
4
D13.2V
6
A13.2V
8
GND
10
PDIM#1
12
R424
3.9K
PWM1
L403
MLB-201209-0120P-N2
C40 2
OPT
0.1 uF
L414
25V
L415
MLB-201209-0120P-N2
PWM_DIM
OPT
C43 3
4.7 uF
C44 6
0.1 uF
50V
25V
+13.2V
A13.2V
R435
100K
RESET_IC_KEC
IC401
KIC7529M2
VCC
3
1
IC401-*1
RESET_IC_DIODES
APX803E29
VCC
3
1
OUT
2
GND
RESET
2
GND
R454
100
+3.5V_ST
C422
0.1uF
16V
OPT
R438
4.7K
POWER_DET
POWER_DET_RESET
+13.2V to PANEL_VCC +3.5V_ST to +3.3V_Normal
PANEL_VCC
D
R451
R452
5.6K
5.6K
G
C
TR_KEC
Q403-*1
2N3904S
E
POWER_ON/OFF_1
+3.5V_ST
R443
10K
R444
10K
B
R447
22K
R448
2.2K
C428
2.2uF
10V
C
TR_NXP
Q404
MMBT3904(NXP)
E
UBW2012-121F
PANEL_CTL
L408
120OHM
OPT
C425
0.1uF
25V
R441
+13.2V
10K
R442
10K
B
R445
R446
120K
33K
NON_60_SHARP
C
TR_NXP
Q403
MMBT3904(NXP)
E
SSM3J332R
C427
0.22uF
25V
Q405
S
60_SHARP
C427-*1
0.1uF
50V
B
FET_AOS
Q406-*1
AO3435
S
G
FET_TOSHIBA
Q406
SSM3J332R
S
B
G
C
E
D
D
C429
0.1uF
16V
TR_KEC
Q404-*1
2N3904S
L410
BLM18PG121SN1D
C430
22uF
10V
+3.3V_Normal
ZD402
5V
TVS_SEMTECH
TVS_KEC
ZD402-*1
+3.5V_Normal to +1.5V_DDR
C443
0.1uF
16V
L413
2uH
C444
22uF
+3.5V_ST
TVS_SEMTECH
ZD405
5V
TVS_KEC
ZD405-*1
C445
22uF
10V
10V
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
10V
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
1.3A
R449
1K
1/16W
1%
R450
200
1/16W
1%
Vout=1.25*(1+R2/R1)+Iadj*R2
R1
R2
L411
CB2012PK501T
R453
0
C431
10uF
10V
+1.5V_DDR
ZD403
2.5V
OPT
ZD406
5.1v
+5V_Normal & +1.10V_VDDC
+13.2V
L404
CB2012PK501T
C405
C406
10uF
10uF
25V
25V
+3.3V_Normal
R403
10K
OPT
C403
4700pF
50V
USB1_CTL
Check the pull down
when AC Power On with HDD
USB1_CTL_Pull_Down
USB1_OCD
+3.3V_Normal
OPT
R473
C404
30K
4700pF
R405
10K
OPT
OPT
R474
+3.3V_Normal
30K
50V
R472
3.3K
OPT
R407
4.7K
R408
100K
+5V_Normal
C408
2200pF
2200pF
OPT
50V
OPT
C409
50V
R409
91K
C407
1uF
10V
SS2
EN1
EN2
ROSC/SYNC
SW_EN
NFAULT
+5V_USB
[EP]
1
2
3
4
5
6
THERMAL
25
7
SW_OUT
VIN123V7V24SS1
22
IC400
SNXXXXX
9
8
VIN2
SW_IN
10
PGND2
LX2
25V
0.047uF
C410
BST120LX121PGND1
19
COMP1
18
FB1
17
AGND
16
RSET
15
FB2
14
COMP2
13
11
12
BST2
+5V_Normal
Vout=0.6(R1/R2)+0.6
L405
4.7uH
R1
OPT
C411
R411
82pF
4.7K
50V
1%
R2
R413
5.1K
1%
C416
22pF
50V
C417
R41 4
3300pF
10K
50V
R422
15K
C419
22pF
50V
C420
3300pF
R41 8
50V
20K
L406
C421
0.047uF
4.7uH
25V
OPT
ZD407
5.1v
R1
R415
R416
5.1K
R417
+1.10V_VDDC
OPT
C412
C413
ZD401
10uF
2.5V
6.3V
0
5%
R2
1%
39K
1%
C418
47pF
50V
+5V_Normal
C423
22uF
16V
22uF
C414
22uF
10V
10V
C424
22uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C432
1uF
16V
L14_CA
POWER
Vout=0.6(R1/R2)+0.6
140826
4
HDMI (REAR 1 / SIDE 1 MHL)
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
R802
1.8K
VA800
R803
1K
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK800
This GND Pattern should be very narrow
HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_DET_HDMI_2
R805
3.3K
ESD_HDMI1_VARISTOR
VA801
ESD_HDMI1_CAP
VA800-*1
1uF
10V
ESD_HDMI1_CAP
VA801-*1
1uF
10V
AR801
5.1
AR802
5.1
MMBT3904(NXP)
ESD_HDMI1
VA802
TR_NXP
Q800
C
E
TR_KEC
Q800-*1
2N3904S
B
C
B
E
ESD_HDMI1
VA803
ESD_HDMI1_TMDS
IP4294CZ10-TBR
ESD_HDMI1_TMDS
IP4294CZ10-TBR
HDMI_2 MHL
5V_HDMI_4
R808
10K
R809
10K
R810 100
R811 100
ESD_HDMI1
VA804
D803
1
2
3
4
5
1
2
3
4
5
D804
10
9
8
7
6
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
BODY_SHIELD
20
JK801-*1
DAADR019A
HDMI-2_EMI_FOOSUNG
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG62611204
HDMI-2
JK801
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
This GND Pattern should be very narrow
15
SCL
HDMI jack burnt problem improvement
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
HDMI-2
R812
1.8K
5V_DET_HDMI_4
ESD_HDMI2
VA805
HDMI-2
R813
3.3K
ESD_HDMI2
VA806
OPT
VA807
5.6V
AR804
AR803
HDMI-2_MHL_Non
R819
0
5.1
5.1
ESD_HDMI2
HDMI-2_MHL
R818
0
ESD_HDMI2
VA809
ESD_HDMI2
VA808
VA811
ESD_HDMI2
VA810
HDMI-2_MHL
HDMI-2
R814
33
HDMI-2
R815 100
R816 100
HDMI-2
D805
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
D806
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
HDMI-2_MHL
C800
R817
0.047uF
300K
25V
MHL Spec
HDMI-2_MHL_Non
R817-*1
3.3K
10
9
8
7
6
10
9
8
7
6
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
HDMI_CEC
HDMI_DIODE_SUZHOU
D800-*1
MMBD6100
A1
C
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
R804
100
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D800
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
HDMI_DIODE_SUZHOU
D801-*1
MMBD6100
A1
C
R806
2.7K
+5V_Normal
R807
2.7K
5V_HDMI_4
HDMI_DIODE_SUZHOU
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D801
D802-*1
MMBD6100
DDC_SDA_4
DDC_SCL_4
A2
A1
C
+3.5V_ST
A2CA1
HDMI_DIODE_KEC
KDS184
D802
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
HDMI_R1S1 8
140813
SPDIF
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
+3.3V_Normal
OPT
C1001
1uF
10V
ESD Ready
SPDIF_OPTIC
C1002
18pF
50V
GND
VCC
VINPUT
SPDIF_OPTIC
JK1001
JST1223-001
1
2
3
4
FIX_POLE
Fiber Optic
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
SPDIF
2014/06/02
10
DDR_EXT
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
R1201
DDR_EXT
R1202
1K
1%
DDR_EXT
C1201
1K
0.1uF
1%
CLose to DDR3
DDR_EXT
C1202
1000pF
A-MVREFDQ
+1.5V_DDR+1.5V_DDR
DDR_EXT
R1204
DDR_EXT
R1205
1K
1%
1K
1%
CLose to MAIN IC
DDR_EXT
DDR_EXT
C1213
C1214
0.1uF
1000pF
A-MVREFCA
+1.5V_DDR
Option : Ripple Check !!!
OPT
C1217
0.1uF
C1218
0.1uF
OPT
C1216
10uF
10V
OPT
C1219
+1.5V_DDR
OPT
OPT
OPT
C1221
OPT
C1222
1uF
1uF
C1220
1uF
1uF
C1223
OPT
OPT
C1224
0.1uF
1uF
DDR_1600_1G_NAN
IC1201-*1
NT5CB64M16FP-DH
EAN61859502
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12
T3
NC_6
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
DDR_1600_1G_SS
IC1201
K4B1G1646G-BCK0
EAN61836301
DDR_EXT
R1203
240 1%
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
+1.5V_DDR
A-MVREFCA
A-MVREFDQ
C1203 10uF 10V
C1204 0.1uF
C1205 0.1uF
C1206 0.1uF
C1207 0.1uF
C1208 0.1uF
C1209 0.1uF
C1210 0.1uF
C1211 0.1uF
C1212 0.1uF
A-MA14
DDR_1600_2G_SS
IC1201-*2
K4B2G1646Q-BCK0
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_7
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
N3
P7
P3
N2
P8
P2
R8
R2
T8
R3
L7
R7
N7
T3
M7
M2
N8
M3
J7
K7
K9
L2
K1
J3
K3
L3
T2
F3
G3
C7
B7
E7
D3
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
EAN61848803
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10/AP
A11
A12/BC
A13
NC_5
BA0
BA1
BA2
CK
CK
CKE
CS
ODT
RAS
CAS
WE
RESET
DQSL
DQSL
DQSU
DQSU
DML
DMU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
DDR_1600_2G_SK
IC1201-*3
H5TQ2G63FFR-PBC
EAN61829204
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
A10/AP
R7
A11
N7
A12/BC
T3
A13
M7
NC_5
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
RESET
F3
DQSL
G3
DQSL
C7
DQSU
B7
DQSU
E7
DML
D3
DMU
E3
DQL0
F7
DQL1
F2
DQL2
F8
DQL3
H3
DQL4
H8
DQL5
G2
DQL6
H7
DQL7
D7
DQU0
C3
DQU1
C8
DQU2
C2
DQU3
A7
DQU4
A2
DQU5
B8
DQU6
A3
DQU7
M8
VREFCA
H1
VREFDQ
L8
ZQ
B2
VDD_1
D9
VDD_2
G7
VDD_3
K2
VDD_4
K8
VDD_5
N1
VDD_6
N9
VDD_7
R1
VDD_8
R9
VDD_9
A1
VDDQ_1
A8
VDDQ_2
C1
VDDQ_3
C9
VDDQ_4
D2
VDDQ_5
E9
VDDQ_6
F1
VDDQ_7
H2
VDDQ_8
H9
VDDQ_9
J1
NC_1
J9
NC_2
L1
NC_3
L9
NC_4
T7
NC_6
A9
VSS_1
B3
VSS_2
E1
VSS_3
G8
VSS_4
J2
VSS_5
J8
VSS_6
M1
VSS_7
M9
VSS_8
P1
VSS_9
P9
VSS_10
T1
VSS_11
T9
VSS_12
B1
VSSQ_1
B9
VSSQ_2
D1
VSSQ_3
D8
VSSQ_4
E2
VSSQ_5
E8
VSSQ_6
F9
VSSQ_7
G1
VSSQ_8
G9
VSSQ_9
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
DDR_EXT
A10/AP
A12/BC
NC_5
RESET
DQSL
DQSL
DQSU
DQSU
DQL0
DQL1
DQL2
DQL3
DQL4
DQL5
DQL6
DQL7
DQU0
DQU1
DQU2
DQU3
DQU4
DQU5
DQU6
DQU7
N3
A0
P7
A1
P3
A2
N2
A3
P8
A4
P2
A5
R8
A6
R2
A7
T8
A8
R3
A9
L7
R7
A11
N7
T3
A13
M7
M2
BA0
N8
BA1
M3
BA2
J7
CK
K7
CK
K9
CKE
L2
CS
K1
ODT
J3
RAS
K3
CAS
L3
WE
T2
F3
G3
C7
B7
E7
DML
D3
DMU
E3
F7
F2
F8
H3
H8
G2
H7
D7
C3
C8
C2
A7
A2
B8
A3
A-MA0
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8
A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MBA0
A-MBA1
A-MBA2
A-MCKE
A/B_DDR3_CS
A-MODT
A-MRASB
A-MCASB
A-MWEB
A-MRESETB
A-MDQSL
A-MDQSLB
A-MDQSU
A-MDQSUB
A-MDML
A-MDMU
A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7
DDR_EXT
R1207
DDR_EXT
R1208
56
1%
56
1%
DDR_EXT
R1206
10K
DDR_EXT
C1215
0.01uF
50V
+1.5V_DDR
A-MCK
A-MCKB
A-MA0
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8
A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MA14
A-MBA0
A-MBA1
A-MBA2
A-MCK
A-MCKB
A-MCKE
A-MODT
A-MRASB
A-MCASB
A-MWEB
A-MRESETB
A/B_DDR3_CS
A-MDQSL
A-MDQSU
A-MDML
A-MDMU
A-MDQSLB
A-MDQSUB
A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7
R1209
240
1%
M1A_256M_UO4
LGE2134(256M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
IC101
LGE2133(128M)
E11
B_DDR3_A[0]
F12
B_DDR3_A[1]
D10
B_DDR3_A[2]
B10
B_DDR3_A[3]
E15
B_DDR3_A[4]
B11
B_DDR3_A[5]
F14
B_DDR3_A[6]
C11
B_DDR3_A[7]
D14
B_DDR3_A[8]
A12
B_DDR3_A[9]
F16
B_DDR3_A[10]
D13
B_DDR3_A[11]
D15
B_DDR3_A[12]
C12
B_DDR3_A[13]
E13
B_DDR3_A[14]
A9
B_DDR3_BA[0]
D16
B_DDR3_BA[1]
A10
B_DDR3_BA[2]
C13
B_DDR3_MCLK
B13
B_DDR3_MCLKZ
E17
B_DDR3_MCLKE
B8
B_DDR3_ODT
C8
B_DDR3_RASZ
B9
B_DDR3_CASZ
D11
B_DDR3_WEZ
F10
B_RESET
D12
B_DDR3_CS0
A19
B_DDR3_DQSL
B18
B_DDR3_DQSU
C16
B_DDR3_DQML
D21
B_DDR3_DQMU
C18
B_DDR3_DQSBL
C17
B_DDR3_DQSBU
A20
B_DDR3_DQL[0]
A16
B_DDR3_DQL[1]
C19
B_DDR3_DQL[2]
C15
B_DDR3_DQL[3]
C20
B_DDR3_DQL[4]
C14
B_DDR3_DQL[5]
B21
B_DDR3_DQL[6]
B15
B_DDR3_DQL[7]
F18
B_DDR3_DQU[0]
D19
B_DDR3_DQU[1]
D17
B_DDR3_DQU[2]
E21
B_DDR3_DQU[3]
E19
B_DDR3_DQU[4]
D20
B_DDR3_DQU[5]
D18
B_DDR3_DQU[6]
F20
B_DDR3_DQU[7]
E9
ZQ
M1A_128M_UO4
IC101-*1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
DDR
2014/06/13
12
Serial Flash for SPI boot
Copyright © 2015 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
/FLASH_WP
OPT
R1300
10K
+3.5V_ST
/SPI_CS
SPI_SDO
R1301
4.7K
OPT
WP#/SIO2
SPI_FLASH_MACRONIX
IC1300
MX25L8035EM2I-10G
CS#
1
SO/SIO1
2
3
GND
4
SPI_FLASH_WINBOND
IC1300-*1
W25Q80DVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
8
7
6
5
8
7
6
5
VCC
NC/SIO3
SCLK
SI/SIO0
VCC
HOLD[IO3]
CLK
DI[IO0]
R1302
33
+3.5V_ST+3.5V_ST
C1300
0.1uF
16V
SPI_SCK
SPI_SDI
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
S_FLASH
140721
13
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