Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This spec sheet is applied all of the LED TV with LT55H
chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan whic al Unit: Product Specification Standard.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run).
Temperature : at 25 ºC±5
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), SVC remote controller
(7) Push The “IN STOP KEY” – For memory initialization.
Case1 : Software version up
1) After downloading S/W by USB , TV set will reboot
automatically
(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.
- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting
(3) Show the message "Copying files from memory"
(4) Updating is staring.
* After downloading, have to adjust Tool
Option again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push "OK" button.
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.
Tool
Tool
Tool
Tool
Tool
ModelModule
43LF540T-DBLGD46212233904364489218273
49LF540T-DBLGD46012233904364489218273
32LF550D-DDLGD32807112640323644813826273
32LF565D-DELGD 32775317440323644813826273
55LF565T-DELGD32784
60LF565T-DESharp11281317440323644812802273
40LF570T-DAINX34186317440323644812802273
42LF620T-DDLGD32875317481285283213826353
49LF620T-DDLGD32878317481285283213826353
55LF620T-DDLGD32880317481285283213826353
43LF5400-DALGD46012233904363849218273
49LF5400-DALGD46212233904363849218273
32LF565B-DELGD 32775317440323638413826273
50LF5650-DELGD32783317440323638413826273
55LF5650-DELGD32784
60LF5650-DESharp11281317440323638412802273
40LF5700-DAINX34186317440323638412802273
43LF5700-DALGD33164317439043638413826273
option1
CSOT39952
CSOT39952
option2
option3
option4
option5
317440323644813826273
317440323638413826273
Tool
option6
(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.
(refer to the next page about tool option)
* If downloading version is higher than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.
* RS-232C Connection Method
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)
▪ Product name of USB to Serial Adapter is UC-232A.
※ Caution: LT55H chassis support only UC-232A driver. (only
CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of
LED back light
■ Above 5 minutes H/run in the inner pattern. (“power on” key of
adjust remote control)
► The spec of color temperature and coordinate
ModelModeColor TempColor coordinateRemark
Cool (C50)13,000k
Medium (0)9,300k
All
Warm (W50)6,500k
x = 0.271 (±0.002)
y = 0.270 (±0.002)
x = 0.286 (±0.002)
y = 0.289 (±0.002)
x = 0.313 (±0.002)
y = 0.329 (±0.002)
► CA210 : CH 14, Test signal : Inner pattern (80IRE)
- Standard color coordinate and temperature using CA-1000 (by
H/R time)
▪ L15 LGD, INX Module
March to December & Global
Normal line (LF55/56/57/62)
CoolMediumWarm
H/R Time(Min)
10-2282 289 297308324348
23-5281 287 296306323346
36-9279 284 294303321343
410-19277 280 292299319339
520-35275 277 290296317336
636-49274 274 289293316333
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
xyxxyx
271270286289313329
※ Test signal
- Inner pattern for W/B adjust
- External white pattern
(80IRE, 204gray)
※ W/B luminance Spec
Min 60↑
(Only 43/49LF54XX-XX)
▪ Gumi Winter table(
January to February - Gumi production of prospective models all
models except Cinema Screen
Normal line (LF55/56/57/62)
CoolMediumWarm
H/R Time(Min)
10-2286 295 301314328354
23-5284 290 299309326349
36-9282 287 297306324346
410-19279 283 294302321342
520-35276 278 291297318337
636-49274 275 289294316334
750-79273 272 288291315331
880-119272 271 287290314330
9Over 120271 270 286289313329
▪
INX, AUO, Sharp, CSOT (13000K Cool the SPEC)
spec271270286289313329
target278280293299320339
xyxxyx
271270286289313329
coolmedwarm
xyxyxy
※ Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON -> Enter
the mode of White-Balance, the pattern will come out.
▪ Aging chamber line (LF55/56/57/62)
CoolMediumWarm
H/R Time(Min)
10-5280 285 294308319340
26-10276 280 290 303 315 335
311-20272 275 286 298 311 330
421-30269 272 283 295 308 327
531-40267 268 281 291 306 323
641-50266 265 280 288 305 320
751-80265 263 279 286 304 318
881-119264 261 278 284 303 316
9Over 120264 260 278 283 303 315
Only for training and service purposes
xyxxyx
271270285293313329
● Auto-control interface and directions
(1) Adjust in the place where the influx of light like floodlight
around is blocked. (Illumination is less than 10ux).
(2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
(3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
[CMD ID DATA]
CoolMidWarmCoolMidWarm
R GainjgJajd00172192192192
G GainjhJbje00172192192192
B GainjiJcjf00192192172192
R Cut646464128
G Cut646464128
B Cut646464128
MIN
CENTER
(DEFAULT)
MAX
*Manual W/B process using adjusts Remote control.(TBD)
■ Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
■ Operate the zero-calibration of the CA100+ or CA-210, then
stick sensor to the module when adjusting.
■ After enter Service Mode by pushing “ADJ” key,
■Enter White Balance by pushing “►” key at “8. White Balance”.
(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain
to 192 (default data) and decrease the others.
(6) Adj. is completed, Exit adjust mode using “EXIT” key on
Remote controller.
▪ If internal pattern is not available, use RF input. In EZ Adj. menu
8. White Balance, you can select one of 2 Test-pattern: ON,
OFF. Default is inner (ON). By selecting OFF, you can adjust
using RF signal in 206 Gray pattern.
※ CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less
than 192 , Adjust is O.K.
(2) If G gain is less than 172 , increase G gain by up to 172,
and then increase R gain and B gain same amount of
increasing G gain.
(3) If R gain or B gain is over 255 , Readjust G gain less than
172, Conform to R gain is 255 or B gain is 255
■ For manual adjustment, it is also possible by the following
sequence.
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface
(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-
Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be
displayed.
(4) Adjust Cool modes
(i). Fix the one of R/G/B gain to 192 (default data) and
decrease the others
(If G gain is adjusted over 172 and R and B gain less than
192, increase G gain to 192 and increase R gain and B gain
same amount of increasing G gain.)
(ii). If G gain is less than 172,
Increase G gain by up to 172, and then increase R gain and
G gain same amount of increasing G gain.
(iii). If R gain or B gain is over 255,
Readjust G gain less than 172, Conform to R gain is 255 or
B gain is 255
※ CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target
i) Decrease the R, G.
(2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x > target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
▪ After You finish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is
correctly same then unplug the AC cable. If it is not same, then
correct it same with BOM and unplug AC cable. For correct it to
the model’s module from factory JIG model.
▪ Push the “IN STOP KEY” after completing the function
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TP for CI slot
/PCM_REG
/PCM_OE
/PCM_WE
/PCM_IORDPCM_A[11]
/PCM_IOWRCI_TS_DATA[1]
/PCM_CE
/PCM_IRQA
/PCM_CD
/PCM_WAIT
PCM_RST
PCM_5V_CTL
/CI_DET
TP for S2
PCM_D[0]
PCM_D[2]
PCM_D[3]
PCM_D[4]
PCM_D[5]
PCM_D[6]
PCM_D[7]
PCM_A[8]
PCM_A[9]
PCM_A[10]
PCM_A[12]
PCM_A[13]
PCM_A[14]
TP for FE_TS_DATA
CI_TS_CLK
CI_TS_VAL
CI_TS_SYNC
CI_TS_DATA[0]
CI_TS_DATA[2]
CI_TS_DATA[3]
CI_TS_DATA[4]
CI_TS_DATA[5]
CI_TS_DATA[6]
CI_TS_DATA[7]
TP for SCART
SCART1_MUTE
SC1_IDPCM_D[1]
SC1_FB
DTV/MNT_VOUT
SCART1_Lout
SCART1_Rout
SC1_R+/COMP1_Pr+
SC1_G+/COMP1_Y+
SC1_B+/COMP1_Pb+
SC1/COMP1_DET
SC1/COMP1_L_IN
SC1/COMP1_R_IN
TP for Headphone
HP_LOUT
HP_ROUT
SIDE_HP_MUTE
HP_DET
TP for L15
/VBUS_EN
RGB_DDC_SCL
RGB_DDC_SDA
TU_GND_A
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
TP_NON_EU3
140702
POWER
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
FROM POWER B/D 13.2V
+3.5V_ST
MMBT3906(NXP)
R406
10K
R404
4.7K
TR_NXP
Q400
MMBT3904(NXP)
R419
100
TR_NXP
Q402
MMBT3904(NXP)
1
TVS_SEMTECH
RL_ON
INV_CTL
+3.5V_ST
OPT
R400
10K
R401
10K
+3.5V_ST
R426
10K
TR_KEC
Q400-*1
2N3904S
B
R402
10K
+3.3V_Normal
R425
10K
TR_KEC
Q402-*1
2N3904S
B
B
B
R420
C
E
C
E
C
E
1K
C
E
+13.2V to +3.5V_STANDBY
+13.2V
L412
BLM18PG121SN1D
C438
C439
10uF
0.1uF
25V
25V
R1
R46 9
R468
68K
6.8K
1/1 6W
1/16W
1%
1%
C440
100pF
50V
R2
R471
C441
22K
1/16W
1%
2200pF
1uF
10V
Vout=0.765*(1+R1/R2)
TR_NXP
Q401
ZD404
TVS_KEC
ZD404-*1
R470
10K
C442
50V
3
2
5V
TR_KEC
Q401-*1
2N3906S-RTK
EBC
OPT
R412
33K
SMAW200-H12S5K(BK)(LTR)
PWR_ON
D13.2V
A13.2V
DRV_ON
IC405
BD9D321EFJ
EN
1
FB
2
VREG
3
SS
4
3A
GND
GND
THERMAL
+13.2V POWER_DET
+13.2V
R430
14K
1%
R431
C415
5.6K
0.1uF
1%
25V
P401
1
2
4
3
5
6
7
8
10
9
11
12
13
PDIM#2
D13.2V
D13.2V
A13.2V
GND
PDIM#1
OPT
R467
R424
3.9K
1K
PWM1
L403
MLB-201209-0120P-N2
C40 2
OPT
0.1 uF
L414
25V
L415
MLB-201209-0120P-N2
PWM_DIM
OPT
C43 3
4.7 uF
50V
C44 6
0.1 uF
25V
+13.2V
A13.2V
R435
100K
RESET_IC_KEC
IC401
KIC7529M2
VCC
3
1
IC401-*1
RESET_IC_DIODES
APX803E29
VCC
3
1
OUT
2
GND
RESET
2
GND
R454
100
+3.5V_ST
C422
0.1uF
16V
OPT
R438
4.7K
POWER_DET
POWER_DET_RESET
+13.2V to PANEL_VCC+3.5V_ST to +3.3V_Normal
PANEL_VCC
D
R451
R452
5.6K
5.6K
G
C
TR_KEC
Q403-*1
2N3904S
E
POWER_ON/OFF_1
+3.5V_ST
R443
10K
R444
10K
B
R447
22K
R448
2.2K
C428
2.2uF
10V
C
TR_NXP
Q404
MMBT3904(NXP)
E
UBW2012-121F
PANEL_CTL
L408
120OHM
OPT
C425
0.1uF
25V
R441
+13.2V
10K
R442
10K
B
R445
R446
120K
33K
NON_60_SHARP
C
TR_NXP
Q403
MMBT3904(NXP)
E
SSM3J332R
C427
0.22uF
25V
Q405
S
60_SHARP
C427-*1
0.1uF
50V
B
FET_AOS
Q406-*1
AO3435
S
G
FET_TOSHIBA
Q406
SSM3J332R
S
B
G
C
E
D
D
C429
0.1uF
16V
TR_KEC
Q404-*1
2N3904S
L410
BLM18PG121SN1D
C430
22uF
10V
+3.3V_Normal
ZD402
5V
TVS_SEMTECH
TVS_KEC
ZD402-*1
+3.5V_Normal to +1.5V_DDR
+3.5V_ST
TVS_SEMTECH
[EP]
VIN
8
9
7
6
5
BOOT
SW
GND
C443
0.1uF
16V
L413
2uH
C444
22uF
10V
C445
22uF
ZD405
5V
TVS_KEC
ZD405-*1
10V
+3.3V_Normal
L409
BLM18PG121SN1D
C426
10uF
10V
IC404
AZ1117EH-ADJTRG1
OUTIN
ADJ/GND
1.3A
R449
1K
1/16W
1%
R450
200
1/16W
1%
Vout=1.25*(1+R2/R1)+Iadj*R2
R1
R2
L411
CB2012PK501T
R453
0
C431
10uF
10V
+1.5V_DDR
ZD403
2.5V
OPT
ZD406
5.1v
+5V_Normal & +1.10V_VDDC
+13.2V
L404
CB2012PK501T
C405
C406
10uF
10uF
25V
25V
+3.3V_Normal
R403
10K
OPT
C403
4700pF
50V
USB1_CTL
Check the pull down
when AC Power On with HDD
USB1_CTL_Pull_Down
USB1_OCD
+3.3V_Normal
OPT
R473
C404
30K
4700pF
R405
10K
OPT
OPT
R474
+3.3V_Normal
30K
50V
R472
3.3K
OPT
R407
4.7K
R408
100K
+5V_Normal
C408
2200pF
2200pF
OPT
50V
OPT
C409
50V
R409
91K
C407
1uF
10V
SS2
EN1
EN2
ROSC/SYNC
SW_EN
NFAULT
+5V_USB
[EP]
1
2
3
4
5
6
THERMAL
25
7
SW_OUT
VIN123V7V24SS1
22
IC400
SNXXXXX
9
8
VIN2
SW_IN
10
PGND2
LX2
25V
0.047uF
C410
BST120LX121PGND1
19
COMP1
18
FB1
17
AGND
16
RSET
15
FB2
14
COMP2
13
11
12
BST2
+5V_Normal
Vout=0.6(R1/R2)+0.6
L405
4.7uH
R1
OPT
C411
R411
82pF
4.7K
50V
1%
R2
R413
5.1K
1%
C416
22pF
50V
C417
R41 4
3300pF
10K
50V
R422
15K
C419
22pF
50V
C420
3300pF
R41 8
50V
20K
L406
C421
0.047uF
4.7uH
25V
OPT
ZD407
5.1v
R1
R415
R416
5.1K
R417
+1.10V_VDDC
OPT
C412
C413
ZD401
10uF
2.5V
6.3V
0
5%
R2
1%
39K
1%
C418
47pF
50V
+5V_Normal
C423
22uF
16V
22uF
C414
22uF
10V
10V
C424
22uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C432
1uF
16V
L14_CA
POWER
Vout=0.6(R1/R2)+0.6
140826
4
HDMI (REAR 1 / SIDE 1 MHL)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
5V_HDMI_2
R802
1.8K
VA800
R803
1K
SHIELDGND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
ESD_HDMI1_VARISTOR
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG59023302
JK800
This GND Pattern should be very narrow
HDMI jack burnt problem improvement
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_DET_HDMI_2
R805
3.3K
ESD_HDMI1_VARISTOR
VA801
ESD_HDMI1_CAP
VA800-*1
1uF
10V
ESD_HDMI1_CAP
VA801-*1
1uF
10V
AR801
5.1
AR802
5.1
MMBT3904(NXP)
ESD_HDMI1
VA802
TR_NXP
Q800
C
E
TR_KEC
Q800-*1
2N3904S
B
C
B
E
ESD_HDMI1
VA803
ESD_HDMI1_TMDS
IP4294CZ10-TBR
ESD_HDMI1_TMDS
IP4294CZ10-TBR
HDMI_2 MHL
5V_HDMI_4
R808
10K
R809
10K
R810 100
R811 100
ESD_HDMI1
VA804
D803
1
2
3
4
5
1
2
3
4
5
D804
10
9
8
7
6
10
9
8
7
6
HPD2
DDC_SDA_2
DDC_SCL_2
HDMI_ARC
HDMI_CEC
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
BODY_SHIELD
20
JK801-*1
DAADR019A
HDMI-2_EMI_FOOSUNG
GND
20
HP_DET
19
5V
18
GND
17
DDC_DATA
16
DDC_CLK
15
NC
14
CE_REMOTE
13
CK-
12
CK_GND
11
CK+
10
EAG62611204
HDMI-2
JK801
19
HOT_PLUG_DETECT
18
VDD[+5V]
17
DDC/CEC_GND
16
SDA
This GND Pattern should be very narrow
15
SCL
HDMI jack burnt problem improvement
14
RESERVED
13
CEC
12
TMDS_CLK-
11
TMDS_CLK_SHIELD
10
TMDS_CLK+
9
TMDS_DATA0-
8
TMDS_DATA0_SHIELD
7
TMDS_DATA0+
6
TMDS_DATA1-
5
TMDS_DATA1_SHIELD
4
TMDS_DATA1+
3
TMDS_DATA2-
2
TMDS_DATA2_SHIELD
1
TMDS_DATA2+
9
8
7
6
5
4
3
2
1
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
HDMI-2
R812
1.8K
5V_DET_HDMI_4
ESD_HDMI2
VA805
HDMI-2
R813
3.3K
ESD_HDMI2
VA806
OPT
VA807
5.6V
HDMI-2_MHL
R818
0
HDMI-2_MHL_Non
R819
0
ESD_HDMI2
VA808
ESD_HDMI2
VA809
ESD_HDMI2
VA811
D805
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
1
2
3
4
5
ESD_HDMI2_TMDS
IP4294CZ10-TBR
D806
10
9
8
7
6
10
9
8
7
6
ESD_HDMI2
VA810
HDMI-2_MHL
HDMI-2
R814
33
HDMI-2
R815100
R816100
HDMI-2
AR804
5.1
AR803
5.1
C800
0.047uF
25V
HDMI-2_MHL
R817
300K
MHL Spec
HDMI-2_MHL_Non
R817-*1
3.3K
HPD4
DDC_SDA_4
DDC_SCL_4
HDMI_CEC
CK-_HDMI4
CK+_HDMI4
D0-_HDMI4
D0+_HDMI4
D1-_HDMI4
D1+_HDMI4
D2-_HDMI4
D2+_HDMI4
MHL_CD_SENSE
CEC
HDMI_CEC
HDMI_DIODE_SUZHOU
D800-*1
MMBD6100
A1
C
5V_HDMI_2
R800
2.7K
+5V_Normal
R801
2.7K
R804
100
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D800
DDC_SDA_2
DDC_SCL_2
CEC_REMOTE_S7
HDMI_DIODE_SUZHOU
D801-*1
MMBD6100
A1
C
R806
2.7K
+5V_Normal
R807
2.7K
5V_HDMI_4
HDMI_DIODE_SUZHOU
A2
HDMI_DIODE_KEC
A2CA1
KDS184
D801
D802-*1
MMBD6100
DDC_SDA_4
DDC_SCL_4
A2
A1
C
+3.5V_ST
A2CA1
HDMI_DIODE_KEC
KDS184
D802
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L15_M1A
HDMI_R1S18
140813
SPDIF
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SPDIF_OUT
+3.3V_Normal
OPT
C1001
1uF
10V
ESD Ready
SPDIF_OPTIC
C1002
18pF
50V
VINPUT
SPDIF_OPTIC
JK1001
JST1223-001
1
GND
2
VCC
3
Fiber Optic
4
FIX_POLE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
L14_CA_M1A
SPDIF
2014/06/02
10
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