LG 43LF510T Schematic

Internal Use Only

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

LED TV

SERVICE MANUAL

CHASSIS : LT55A

MODEL : 43LF510T 43LF510T-DA

MODEL : 43LF5100 43LF5100-DA

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68606417 (1507-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

DISASSEMBLY ........................................................................................ 14

BLOCK DIAGRAM .................................................................................. 15

EXPLODED VIEW .................................................................................. 16

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

TROUBLESHOOTING .............................................................. APPENDIX

Only for training and service purposes

- 2 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explo­sion hazard.

2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas­ily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component dam­age caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alter­natively, obtain and wear a commercially available discharging
wrist strap device, which should be removed to prevent poten­tial shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or expo­sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electri­cally shorted together by conductive foam, aluminum foil or
comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replace­ment ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf­cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the compo­nent lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the cir­cuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close
as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos­sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connec­tions).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly con­nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

Only for training and service purposes

- 5 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This spec sheet is applied all of the LED TV with LT55A
chassis

2. Test condition

Each part is tested as below without special notice.

(1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage

Standard input voltage (100~240V@ 50/60Hz)
* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance: LGE TV test method followed
(2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

4. Electrical Specification

No Item Specication Remark

1 Receiving System NTSC-M, PAL-M/N, DVB-T, DVB-T2 Colombia

NTSC-M, PAL-M/N DVB-T Taiwan / Panama

2 Available Channel VHF : 2~13

UHF : 14~69
CATV : 1~125
DTV : 2~69

VHF : 2~13
UHF : 14~69
CATV : 1~125
DTV : 2~69

3 Input Voltage AC 100 ~ 240V 50/60Hz

4 Market Colombia / Panama / Taiwan

5 Screen Size 32 inch Wide (1366 × 768) 32LF510D/B-DB

43 inch Wide (1920 × 1080) 43LF5100/510T-DA

49inch Wide (1920 × 1080) 49LF5100/510T-DA

6 Aspect Ratio 16:9

7 Tuning System FS

8 Module

*A : Titan
*B : Titan Silver
*D : Silver
*E : Gold

8 Operating Environment Temp : 0 ~ 40 deg

9 Storage Environment Temp : -20 ~ 60 deg

HC320DXN-SLNS4 HD, 60Hz LGD 32LF510B-DB

HC320DXN-ABNS4 HD, 60Hz BOE 32LF510D-DB

HC430DUN-SLNL1 FHD, 60Hz LGD 43LF5100/510T-DA

NC490DUE-SADP1 FHD, 60Hz LGD 49LF5100/510T-DA

Humidity : ~ 80 %

Humidity : ~ 85 %

Colombia

Taiwan / Panama

Only for training and service purposes

- 6 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

3. 720*480 31.47 59.94 27.0 SDTV 480P

4. 720*480 31.50 60 27.027 SDTV 480P

5. 1280*720 45.00 60.00 74.25 HDTV 720P

6. 1280*720 44.96 59.94 74.176 HDTV 720P

7. 1920*1080 28.125 50.00 74.250 HDTV 1080I

8. 1920*1080 33.75 60.00 74.25 HDTV 1080I

9. 1920*1080 33.72 59.94 74.176 HDTV 1080I

10. 1920*1080 56.250 50.00 148.50 HDTV 1080P

11. 1920*1080 67.500 60.00 148.50 HDTV 1080P

12. 1920*1080 67.432 59.939 148.352 HDTV 1080P

13. 1920*1080 27.000 24.000 74.25 HDTV 1080P

14. 1920*1080 26.97 23.976 74.176 HDTV 1080P

15. 1920*1080 33.75 30.000 74.25 HDTV 1080P

16. 1920*1080 33.71 29.97 74.176 HDTV 1080P

5.2. HDMI Input (PC/DTV)

* HDMI PC support only Rear HDMI Input
* If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1

640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O

5

1024*768 48.363 60.00 65.00 VESA(XGA) O

6

1152*864 54.348 60.053 80.00 VESA O

7

1360*768 47.712 60.015 85.50 VESA (WXGA) O

8

1280*1024(FHD Only) 63.981 60.02 108.00 VESA (SXGA) O

9

1920*1080(FHD Only) 67.5 60 148.5 HDTV 1080P O

Only for training and service purposes

- 7 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

DTV

1

640 x 480 31.46 59.94 SDTV 480P

2

640 x 480 31.5 60.00 SDTV 480P

3

720*480 31.47 59.94 27.000 SDTV 480P

4

720*480 31.50 60.00 27.027 SDTV 480P

5

1280*720 37.50 50.00 74.25 HDTV 720P

6

1280*720 45.00 60.00 74.25 HDTV 720P

7

1280*720 44.96 59.94 74.176 HDTV 720P

8

1920*1080 28.12 50.00 74.25 HDTV 1080I

9

1920*1080 33.75 60.00 74.25 HDTV 1080I

10

1920*1080 33.72 59.94 74.176 HDTV 1080I

11

1920*1080 56.25 50.00 148.50 HDTV 1080P

12

1920*1080 67.50 60.00 148.50 HDTV 1080P

13

1920*1080 67.43 59.94 148.352 HDTV 1080P

14

1920*1080 27.00 24.00 74.25 HDTV 1080P

15

1920*1080 26.97 23.97 74.176 HDTV 1080P

16

1920*1080 33.75 30.00 74.25 HDTV 1080P

17

1920*1080 33.71 29.97 74.176 HDTV 1080P

* DTV Resolution #6 ~ #17 : Support dual play for 3D Models

※HDMI Monitor Range Limits

Min Vertical Freq - 58 Hz
Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz
Max Horiz. Freq - 83 kHz
Pixel Clock - 160 MHz

Only for training and service purposes

- 8 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

ADJUSTMENT INSTRUCTION

1. Application

This spec sheet is applied all of the TV with LT55A chassis.

2. Designation

(1) The adjustment is according to the order which is

designated and which must be followed, according to the

plan whic al Unit: Product Specification Standard.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run).

Temperature : at 25 ºC±5

ºC
Relative humidity : 65 ± 10%
Input voltage : 100~220V, 50/60Hz

(6) Adjustment equipments : Color Analyzer (CA-210 or

CA-110), SVC remote controller

(7) Push The “IN STOP KEY” – For memory initialization.

Case1 : Software version up
(1) After downloading S/W by USB , TV set will reboot

automatically

(2) Push “In-stop” key
(3) Push “Power on” key
(4) Function inspection
(5) After function inspection, Push “In-stop” key.

Case2 : Function check at the assembly line
(1) When TV set is entering on the assembly line, Push

“In-stop” key at first.

(2) Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover

channel information by itself.

(3) After function inspection, Push “In-stop” key.

3. Main PCB check process

* APC – After Manual-Insert, executing APC
* Boot file Download

(4) Click “Connect” tab. If “Can’t ” is displayed, Check

connection between computer, jig, and set.

(2)

(3)

Please Check the Speed :
To use speed between
from 200KHz to 400KHz

(5) Click “Auto” tab and set as below.
(6) Click “Run”.
(7) After downloading, check “OK” message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

* USB DOWNLOAD(*.epk file download)

(1) Put the USB Stick to the USB socket.
(2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low,
it didn't work. But your downloaded version is High, USB
data is automatically detecting

(3) Show the message "Copying files from memory"

(1) Execute ISP program “Mstar ISP Utility” and then click

“Config” tab.

(2) Set as below, and then click “Auto Detect” and check “OK”

message.

If “Error” is displayed, Check connection between

computer, jig, and set.

(3) Click “Read” tab, and then load download file (XXXX.bin)

by clicking “Read”

(1)

filexxx.bin

Only for training and service purposes

(4) Updating is staring.

(5) After updating is complete, The TV will restart automatically.
(6) If TV turns on, check your updated version and Tool option.

(refer to the next page about tool option)

* If downloading version is higher than your TV have, TV

can lost all channel data. In this case, you have to
channel recover. If all channel data is cleared, you didn't
have a DTV/ATV test on production line.

- 9 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

* After downloading, have to adjust Tool Option again.

(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push "OK" button.
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.

* RS-232C Connection Method.
Connection : PCBA (USB Port) -> USB to Serial Adapter
(UC-232A) -> RS-232C cable -> PC(RS-232C port)

- Product name of USB to Serial Adapter is UC-232A.

* Caution : LT55H chassis support only UC-232A driver. (only

use this one. )

4. Total Assembly line process

4.1. Adjustment Preparation

▪ W/B Equipment condition

CA210 : LED -> CH14, Test signal: Inner pattern(80IRE)

▪ Above 5 minutes H/run in the inner pattern. (“power on” key

of adjust remote control)

▪

The spec of color temperature and coordinate.

Mode Temp Coordinate spec Remark

Cool

(0)

13,000 k

9,300 k

6,500 k

(C50)

Medium

Warm

(W50)

▪ CA210 : CH 14, Test signal : Inner pattern (80IRE)

- Standard color coordinate and temperature using CA-1000
(by H/R time)

** 32LF51 (LGD, BOE), 43LF51 (LGD), 49LF51 (LGD)
INX, AUO, SHARP, CSOT, BOE Module.( In the case of ,

the color temperature spec of cool mode is 13000K)

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

X=0.271 (± 0.002)
Y=0.270 (± 0.002)

X=0.286 (± 0.002)
Y=0.289 (± 0.002)

X=0.313 (± 0.002)
Y=0.329 (± 0.002)

Cool Medium Warm

x y x y x y

<Test Signal>

- Inner pattern for W/B
adjust

- External white pattern

* Connecting picture of the measuring instrument

(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to

auto controller or push Adjustment R/C P-ONLY → Enter the

mode of White-Balance, the pattern will come out.

Full White Pattern

RS-232C Communication

CA-210

COLOR
ANALYZER
TYPE : CA-210

* Auto-control interface and directions

(1) Adjust in the place where the influx of light like floodlight

around is blocked. (illumination is less than 10 lux).

(2) Adhere closely the Color analyzer(CA210) to the module

less than 10 cm distance, keep it with the surface of the
Module and Color analyzer's prove vertically.(80° ~ 100°).

(3) Aging time

- After aging start, keep the power on (no suspension of power
supply) and heat-run over 5 minutes.

- Using 'no signal' or 'POWER ONLY' or the others, check
the back light on.

▪ Auto adjustment Map(RS-232C)

RS-232C COMMAND
[CMD ID DATA]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End

RS-232C COMMAND
[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

CENTER

(DEFAULT)

MAX

Only for training and service purposes

- 10 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

* Manual W/B process using djust Remote control.

▪ Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000

▪ Operate the zero-calibration of the CA100+ or CA-210, then

stick sensor to the module when adjusting.

▪ After enter Service Mode by pushing “ADJ” key,
▪ Enter White Balance by pushing “►” key at “8. White

Balance”.

■ For manual adjustment, it is also possible by the following

sequence.

(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface

(3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-

Balance then press the cursor to the right (KEY►). When
KEY(►) is pressed 206 Gray internal pattern will be

displayed.

(4) Adjust Cool modes

1) Fix the one of R/G/B gain to 192 (default data) and
decrease the others

(If G gain is adjusted over 172 and R and B gain less

than 192, increase G gain to 192 and increase R gain
and B gain same amount of increasing G gain.)

2) If G gain is less than 172,

Increase G gain by up to 172, and then increase R gain

and G gain same amount of increasing G gain.

3) If R gain or B gain is over 255,

Readjust G gain less than 172, Conform to R gain is 255

or B gain is 255

(5) Adjust two modes (Medium / Warm) Fix the one of R/G/B

gain to 192 (default data) and decrease the others.

(6) Adj. is completed, Exit adjust mode using “EXIT” key on

Remote controller.

* CASE Cool
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target

1) Decrease the R, G.

(2) x, y < target

1) First decrease the B gain,

2) Decrease the one of the others.

(3) x > target , y< target

1) First decrease B, so make y a little more than the target.

2) Adjust x value by decreasing the R

(4) x < target , y >target

1) First decrease B, so make x a little more than the target.

2) Adjust x value by decreasing the G

How to adjust
(1) If G gain is adjusted over 172 and R gain and B gain less

than 192 , Adjust is O.K.

(2) If G gain is less than 172 , increase G gain by up to 172,

and then increase R gain and B gain same amount of
increasing G gain.

(3) If R gain or B gain is over 255 , Readjust G gain less than

172, Conform to R gain is 255 or B gain is 255

* CASE Medium / Warm
First adjust the coordinate far away from the target value(x, y).
(1) x, y > target

1) Decrease the R, G.

(2) x, y < target

1) First decrease the B gain,

2) Decrease the one of the others.

(3) x > target , y< target

1) First decrease B, so make y a little more than the target.

2) Adjust x value by decreasing the R

(4) x < target , y >target

1) First decrease B, so make x a little more than the target.

2) Adjust x value by decreasing the G

▪ After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it
is correctly same then unplug the AC cable. If it is not same,
then correct it same with BOM and unplug AC cable. For
correct it to the model’s module from factory JIG model.

▪ Push the “IN STOP KEY” after completing the function

inspection.

▪ If internal pattern is not available, use RF input. In EZ Adj.

menu 8. White Balance, you can select one of 2 Test-pattern:
ON, OFF. Default is inner (ON). By selecting OFF, you can
adjust using RF signal in 206 Gray pattern.

Only for training and service purposes

- 11 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

4.2. EDID DATA

(1) All Data : HEXA Value
(2) Changeable Data :

1) Serial No : Controlled / Data:01

2) Month : Controlled / Data:00

3) Year : Controlled

4) Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

- HDMI1/2 (128)

- HDMI1 (256)

(2) FHD 2D EDID Data

CheckSum

(0xFF)

Physical Address

(0x1E)

HDMI 1 40 / 25 10

Remark

LF51 has Only
HDMI1

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust
MODE

ADC adjust

Adjust
‘Mode In’

ADC
Adjust

A A 0 0

A D 1 0

When transfer the ‘Mode In’,
Carry the command.

Automatically adjustment (The
use of a internal pattern)

No Item Condition Hex Data

1 Manufacturer ID GSM 1E6D

2 Version Digital : 1 01

3 Revision Digital : 3 03

● EDID DATA

(1) HD 2D EDID Data (32LF51, 32LF550D/B, LF560D/B)

- Before S/W version

CheckSum

(0xFF)

HDMI 1 74 / 5B 10

Physical Address

(0x1E)

Remark

LF51 has Only
HDMI1

- HDMI1/2 (128)

- HDMI1 (256)

4.3. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then automatically turn off.

(Must not AC power OFF during blinking)

Only for training and service purposes

- 12 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

4.4. GND & Hi-pot test

4.4.1. GND & HI-POT auto-check preparation

(1) Check the POWER CABLE and SIGNAL CABE insertion

condition

4.4.2. GND & HI-POT auto-check

(1) Pallet moves in the station. (POWER CORD / AV CORD is

tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)

(5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next
process automatically.

4.4.3. Checkpoint

(1) Test voltage

1) 3 Poles

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA

2) 2 Poles

- SIGNAL: 3KV/min at 100mA

(2) TEST time: 1 second
(3) TEST POINT

1) 3 Poles

- GND Test = POWER CORD GND and SIGNAL CABLE

GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

2) 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.

(4) LEAKAGE CURRENT: At 0.5mArms

Only for training and service purposes

- 13 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

DISASSEMBLY

Only for training and service purposes

- 14 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

BLOCK DIAGRAM

SPI_SCK/SDI/SD O/CS

SPK_L

SPK_R

30P HD LVDS wafer

(P1801)

Serial Flash

System EEPROM

I2C_SCL/SDA

Z

X-tal

24MH

NTP7515

AUD_SCK

AUD_LRCH,

AUD_LRCK,

AMP_SCL/ SDA

AUD_MASTER_CLK,

Connector

Jog KEY, LED_R, IR

(P1800)

RXACK+/-

RXA0+/-~RXA4+/-,

RXB0+/-~RXB4+/-,

51P FHD LVDS wafer

RXBCK+/-

Main SOC

M1A-LGE2136

(IC101, DDR3 256MB)

L

USB1_OCP/CT

PCM_A[0:7]

IF_N/P

LNB_TX

IC102 (1Gbit)

NAND FLASH

H27U1G8F2CTR -BC

PCM_A[8:14]

TS_DATA[0: 7]

PCM_DATA[0:7]

T4LCX244FT Buffer

FE_TS_DATA [0:

CI SLOT

DEMOD_SC L/SDA

LNB_OUT, DEMOD_RESET

7]

Tuner

SIDE

IF_AGC

TU_SCL / SDA

DDC_SCL/SDA_2, HDMI_C EC

CK+/-, D0+/-, D1+/-, D2+/ -_HDMI2

F/NIM

HDMI1

REA

EPHY_TP/TN/RP/R

N

SC1/AV2_C VBS_IN, SC1_R+/G+/B+

DTV/MNT_OUT, DTV/MNT_L/R_OUT

LAN

Only UK

F-SCART

R

OCP

DM/DP

SN1406035RGER

+5V_USB

USB

Only for training and service purposes

- 15 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

900

200

400

800

540

500

700

120

LV1

A2

701

A10

Set + Stand

901

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

Only for training and service purposes

- 16 -

LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

POWER

Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

FROM ADAPTOR 19V

JK400

KJA-DC-1-0032

4

4

2

Surge Protection

2

1

1

D471
20V

OPT

R493
120K

OPT
R492
120K

OPT
C492
10uF
25V

19V TO PANEL VCC(12V) DCDC CONVERTER

+19V

C472

C470
10uF

0.1uF

25V

25V

R470
100K

OPT

Q407

SSM3J332R

S

G

AAM

IN

SW

GND

+19V

D

MP2315GJ

1

2

3

4

OPT
C488
68uF
35V

IC403

NEW

3A

+19V to +3.5V_STANDBY

IC402

MP2315GJ

R471

AAM

C471
68uF
35V

8

7

6

5

C473
10uF

FB

VCC

EN/SYNC

BST

25V

39K

1/16W
1%

C474

0.1uF
25V

20130528 cJ.LIM

R475
68

C475

0.1uF
50V

GND

IN

SW

0.47uF

R476
47K

OPT

OPT

C477

1

2

NEW

3

3A

4

OPT
R489
10K

16V

CYNTEC

L470-*1

10uH

C478

0.1uF
25V

FB

8

VCC

7

EN/SYNC

6

BST

5

+3.5V_ST

OPT

R490

10K

R480
10K

TDK
L470

10uH

C480
10uF

20130528 cJ.LIM

C481
10uF

16V

16V

R478
100K

R479

R477
68

20K

C476

0.1uF
50V

RL_ON

POWER_ON/OFF_1

C483

C486

0.1uF

10uF

25V

16V

R481
56K

R48 2

R48 3

3.3 K

R48 4

C479

0.1uF
25V

11K
1%

1%

1K

1%

CYNTEC

L471-*1

4.7uH

TDK

L471

4.7uH

C482

C484

10uF

10uF

10V

10V

X5R => X7R

To improve CST Issue

2013.12.21 by GH.Song

+12V

OPT

ZD405

15V

C487
22uF
10V

R485
56K

C489
22uF
10V

C485

0.1uF
25V

R48 6

R48 7

1.2 K

R48 8

3.5V_ST POWER_DET

+3.5V_ST

R410

10K

+3.5V_ST

C400

0.1uF
16V

2K
1%

1%

1K
1%

5V

5.6B->5V
READY->APPLY

2013.08.07

D470

+12V to PANEL_VCC

UBW2012-121F

PANEL_CTL

L408

120OHM

OPT

C425

0.1uF
25V

R441

OPT

C490
1uF
10V

+12V

R442

10K

10K

B

R445

R446
120K

OPT

ZD408

33K

5V

C

E

POWER_DET

C427

0.22uF
25V

TR_NXP
Q403
MMBT3904(NXP)

Q405

SSM3J332R

S

B

PANEL_VCC

D

R451

R452

5.6K

5.6K

G

C

TR_KEC
Q403-*1
2N3904S

E

+3.5V_ST to +3.3V_Normal

+3.5V_ST

POWER_ON/OFF_1

R443

4.7K

R444
10K

B

R447
22K

R448

2.2K

C428

2.2uF
10V

C

TR_NXP
Q404
MMBT3904(NXP)

E

+3.5V_Normal to +1.5V_DDR

+3.3V_Normal

L409

BLM18PG121SN1D

C426
10uF

10V

1.3A

IC404

AZ1117EH-ADJTRG1

OUTIN

ADJ/GND

R449
1K
1/16W
1%

R450
200
1/16W
1%

BOOST_EN

R1

R2

FET_AOS
Q406-*1

AO3435

S

G

FET_TOSHIBA

Q406
SSM3J332R

S

G

C

B

E

L411

CB2012PK501T

R453

0

C431
10uF

10V

D

D

C429

0.1uF
16V

TR_KEC

Q404-*1
2N3904S

+1.5V_DDR

L410

BLM18PG121SN1D

C430
22uF
10V

BRAZIL_ESD

ZD403

2.5V

+3.3V_Normal

TVS_SEMTECH

ZD402

5V

TVS_KEC
ZD402-*1

Vout=1.25*(1+R2/R1)+Iadj*R2

+5V_Normal & +1.10V_VDDC

+3.3V_Normal

R403
10K

OPT

C403

4700pF

50V

USB1_CTL

Check the pull down
when AC Power On with HDD

USB1_CTL_Pull_Down

USB1_OCD

OPT
R473
30K

R472

3.3K

CB2012PK501T

+5V_Normal

R408
100K

L404

+12V

C405
10uF
25V

Vout=0.6(R1/R2)+0.6

TDK

L405

4.7uH

CYNTEC

R1

R411

4.7K
1%

R2

R413

5.1K
1%

50V

C420

3300pF

50V

CYNTEC

L406-*1

4.7uH

R41 4

OPT

OPT

C411

ZD407

82pF

5.1v

50V

C416

22pF

50V

C417

3300pF

50V

10K

R415

R416

5.1K

R417

100

1%

1%

39K

1%

ZD401

2.5V

R1

R2

C412
10uF

6.3V

C418

47pF
50V

+5V_Normal

C423
22uF
16V

C410

0.047uF
25V

C406
10uF
25V

C408

OPT

2200pF

50V

C409

OPT

2200pF

50V

R409

91K

C407
1uF

10V

SS2

EN1

EN2

ROSC/SYNC

SW_EN

NFAULT

+5V_USB

VIN123V7V24SS1

[EP]

22

1

THERMAL

25

2

3

IC400

SN1406035RGER

4

5

6

7

9

8

VIN2

SW_IN

SW_OUT

10

PGND2

LX2

BST120LX121PGND1

19

COMP1

18

FB1

17

AGND

16

RSET

15

FB2

14

COMP2

13

11

12

BST2

+5V_Normal

C432

1uF
16V

L405-*1

4.7uH

R422
15K

C419 22pF

R41 8

20K

TDK

C421

0.047uF

L406

4.7uH

25V

C491
470pF
50V

R491

5.1

Vout=0.6(R1/R2)+0.6

C413
22uF

10V

C424
22uF
16V

+1.10V_VDDC

C414
22uF

10V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5_ECI_M1A

POWER

150112

4

TOTAL LED DRIVER BLOCK

Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

L505

CIS21J121

32_43inch

+19V

BOOST_EN

EU_BR

R553
0

R554
0

32_43inch_AJ_KR_CO

R555
0

OPT
C516

0.1uF

OPT

C517

0.1uF

OPT

L503

UBW2012-121F

OPT

L504

UBW2012-121F

C500
47uF
25V

49inch

R500
1K

C501
10uF
25V

C502

0.1uF
50V
OPT

49inch
C503

0.033uF
50V

49inch

R501

18K
1%

49inch

R502
1K

1%

49inch

R503
10K

1/16W

49inch

C504

470pF

50V

49inch

C505
100pF

50V

49inch
C506

0.22uF

REDUCE INDUCTOR TEMP ISSUE

49inch

49inch

L507

49inch

L508

49inch

C531
100V
220pF

R511

R508

47

49inch

49inch

R509

49inch

3.3

OPT

D505

1N4148W-G

49inch

R510

3.9K

49inch

50V

R507

3.9K
1%

121211
1K -> 3.9K
220p -> 330p

D503

MBRD10U100CT

A1

C

A2

OPT
C532
100V
220pF

47

R513

47

49inch

49inch

R582

2.2

1%

49inch

R558

47

OPT

R512

49inch

C511

33uF
100V

0.1

OPT
R583
10K

1W

REDUCE RIPPLE CURRENT

49inch

49inch

C513

C512

33uF

33uF

100V

100V

D

49inch
Q500

G

AOD478

S

R514

0.1

49inch

1W

49inch

C514
1uF
50V

49inch

C515
1uF
50V

49inch

32_43inch_AJ_KR_CO

R515

C537

100K

4.7uF

1/8W

50V

32_43inch_AJ_KR_CO

C538

49inch

4.7uF

R516

50V
100K
1/8W

R518

47K

49inch

R581

1K

49inch

49inch

R517
680
1/8W
1%

VOUT#1=50.5V

49inch

C537-*1
10uF
35V

49inch

C538-*1
10uF
35V

OPT

R519
10K

INV_CTL

PWM_DIM

R520

10K

B

49inch

R522-*1

32_43inch

150K

R522
120K

43inch
R529-*1
13K
1%

R521
100

BLU_CURRENT_CTL

+3.3V_Normal

R523

3K

C

TR501
MMBT3904(NXP)

E

R525
270K

1/8W
1%

49inch
R529-*2

8.2K
1%

R524

100K

49inch
R532-*2

27K
1%

49inch

1%

R533-*2

3.3K

1/16W

R528
1K

1%

32inch

R529
30K
1%

C518

100pF

50V

43inch

R532-*1
12K

1%

43inch

R533-*1
10K
1%

OPT
R530
100K

R531

100K

1%

10K

C521
1000pF
50V

32inch

R532

32inch

R533

15K

1%

3.6K

1%

C522
1000pF
50V

R534

49inch

L500
33uH

49inch

49inch

R504

R505

180K

180K

49inch

C507

1uF
25V

To Improve EMI Issue

49inch

C530
100V
220pF

R506

47

49inch

49inch

49inch

C509

C508

0.1uF

330pF

50V

VOUT = VREF*(1+48.8K/680)
= 0.7 *(1+48.8K/680)
= 50.5V

49inch
IC500

TPS40210DGQR

RC

1

SS

DIS/EN

COMP

2

3

4

FB

5

16V

11

THERMAL

[EP]

VDD

10

BP

9

GDRV

8

ISNS

7

GND

6

L501
33uH

NC_1

PGND_1

PGND_2

PDIM

RISET

NC_2

EN

OVP

LS8

LS7

LS6

LS5

32inch

L506

CIS21J121

43_49inch

L502
33uH

R535
100

DT1641AS

1

2

3

4

5

6

7

8

9

10

11

12

R536
100

IC501

To Improve EMI Issue

C523
100V
220pF

C524
100V
220pF

R537

R538

R539

100

100

100

[EP]GND

VIN

24

C525 1uF

VREF

25

23

THERMAL

CS

22

NDRV

21

RSS

20

COMP

19

RT

18

LS1

17

LS2

16

LS3

15

LS4

14

LGND

13

R540
100

25V

220K

R545

R541
100

R542

R544

3.3

1/16W

39K
1%

R543

1.5K
1%

+19V

1%

R546

1.5K 1%

C526
100V
220pF

C527
100V
220pF

R547
100

C510
1uF
25V

R548

30K
C528

4700pF

50V

1%

C529

0.1uF

R549
100

25V

UF3D(SUZHOU GRANDE)

32_43inch

R550
100

D

49inch
Q502
SMN630LD

G

32_43inch

S

Q502-*1

G

AOD2922

R551

0.1

49inch

D502

D504
BR210

100V

D

S

P500

SMAW200-04

FIRST BOOST UP

1

2

3

VOUT#2

4

EXCEPT C500 C501

C533

33uF

49inch
R579
0

C534

33uF

32_43inch

R580
0

32_43inch

R578
0

C535

4.7uF
50V

C536

4.7uF
50V

C539

4.7uF
50V

33V

ZD500

43_49inch

C519
1uF
100V

49inch

C520

1uF

100V

32inch

C519-*1

4.7uF
50V

32_43inch

C520-*1
0

1/4W
5%

49inch

C540
1uF
100V

49inch

C541

1uF

100V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LED_DRIVER

150112L15.5_ECI_M1A

5

USB

Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

JK700

US-04A-VSD

5

OPT
C704
22uF
10V

+5V_USB

SIDE_USB1_DM

SIDE_USB1_DP

USB_HDD_CAP1_10uF

C700-*1

USB_HDD_CAP1_22uF

OPT

ZD700

SD05

1

2

3

4

5V

C701

OPT

OPT

C702

5pF

5pF

50V

50V

10uF

10V

C700
22uF
10V

USB_HDD_CAP2_10uF

C703-*1

10uF

10V

USB_HDD_CAP2_22uF

C703
22uF
10V

R700

2.2

R701

2.2

OPT

D700
RCLAMP0502BA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5_ECI_M1A

USB_S1

150112

7

HDMI (REAR)

Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

HDMI_1

5V_HDMI_2

SHIELDGND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

ESD_HDMI1_VARISTOR

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

EAG59023302

JK1000

This GND Pattern should be very narrow
HDMI jack burnt problem improvement

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

R1001

R1000

1.8K

VA1000

1K

5V_DET_HDMI_2

R1002

3.3K

L1001

DLP11SA900HL2L

4 3

DLP11SA900HL2L

4 3

DLP11SA900HL2L

4 3

DLP11SA900HL2L

4 3

ESD_HDMI1_VARISTOR
VA1001

ESD_HDMI1_CAP
VA1000-*1
1uF
10V

ESD_HDMI1_CAP
VA1001-*1
1uF
10V

L1002

L1003

L1004

21

21

21

21

MMBT3904(NXP)

ESD_HDMI1
VA1002

TR_NXP

AR1003

5.1

AR1004

5.1

AR1005

5.1

AR1006

5.1

Q1000

C

E

TR_KEC

Q1000-*1

2N3904S

B

C

E

ESD_HDMI1

VA1003

CEC

HDMI_CEC

R1003

10K

B

R1004

10K

AR1002
100
1/16W

ESD_HDMI1
VA1004

HPD2

DDC_SDA_2
DDC_SCL_2

HDMI_CEC

CK-_HDMI2
CK+_HDMI2

D0-_HDMI2
D0+_HDMI2

D1-_HDMI2
D1+_HDMI2

D2-_HDMI2
D2+_HDMI2

HDMI_DIODE_SUZHOU

D1002-*1
MMBD6100

A1

C

5V_HDMI_2

R1007

2.7K

+5V_Normal

R1008

2.7K

R1009
100

A2

HDMI_DIODE_KEC

A2CA1

KDS184
D1002

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5

2015/01/21

HDMI_R1S1 8

A-MA0

Copyright © 2015 LG Electronics Inc. All rights reserved.
Only for training and service purposes

LGE Internal Use Only

A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8

A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MA14

A-MBA0
A-MBA1
A-MBA2

A-MCK
A-MCKB
A-MCKE

A-MODT

A-MRASB
A-MCASB

A-MWEB

A-MRESETB

A/B_DDR3_CS

A-MDQSL
A-MDQSU

A-MDML
A-MDMU

A-MDQSLB
A-MDQSUB

A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7

A-MA0
A-MA1
A-MA2
A-MA3
A-MA4
A-MA5
A-MA6
A-MA7
A-MA8

A-MA9
A-MA10
A-MA11
A-MA12
A-MA13
A-MA14

A-MBA0
A-MBA1
A-MBA2

A-MCK
A-MCKB
A-MCKE

A-MODT

A-MRASB
A-MCASB

A-MWEB

A-MRESETB

A/B_DDR3_CS

A-MDQSL
A-MDQSU

A-MDML
A-MDMU

A-MDQSLB
A-MDQSUB

A-MDQL0
A-MDQL1
A-MDQL2
A-MDQL3
A-MDQL4
A-MDQL5
A-MDQL6
A-MDQL7
A-MDQU0
A-MDQU1
A-MDQU2
A-MDQU3
A-MDQU4
A-MDQU5
A-MDQU6
A-MDQU7

R1109

M1A_256M_UO4

IC101

LGE2134(256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

240

1%

ZQ

E11
F12
D10
B10
E15
B11
F14
C11
D14
A12
F16
D13
D15
C12
E13

A9
D16
A10

C13
B13
E17

B8

C8

B9
D11

F10

D12

A19
B18

C16
D21

C18
C17

A20
A16
C19
C15
C20
C14
B21
B15
F18
D19
D17
E21
E19
D20
D18
F20

E9

B_DDR3_A[0]
B_DDR3_A[1]
B_DDR3_A[2]
B_DDR3_A[3]
B_DDR3_A[4]
B_DDR3_A[5]
B_DDR3_A[6]
B_DDR3_A[7]
B_DDR3_A[8]
B_DDR3_A[9]
B_DDR3_A[10]
B_DDR3_A[11]
B_DDR3_A[12]
B_DDR3_A[13]
B_DDR3_A[14]

B_DDR3_BA[0]
B_DDR3_BA[1]
B_DDR3_BA[2]

B_DDR3_MCLK
B_DDR3_MCLKZ
B_DDR3_MCLKE

B_DDR3_ODT
B_DDR3_RASZ
B_DDR3_CASZ
B_DDR3_WEZ

B_RESET

B_DDR3_CS0

B_DDR3_DQSL
B_DDR3_DQSU

B_DDR3_DQML
B_DDR3_DQMU

B_DDR3_DQSBL
B_DDR3_DQSBU

B_DDR3_DQL[0]
B_DDR3_DQL[1]
B_DDR3_DQL[2]
B_DDR3_DQL[3]
B_DDR3_DQL[4]
B_DDR3_DQL[5]
B_DDR3_DQL[6]
B_DDR3_DQL[7]
B_DDR3_DQU[0]
B_DDR3_DQU[1]
B_DDR3_DQU[2]
B_DDR3_DQU[3]
B_DDR3_DQU[4]
B_DDR3_DQU[5]
B_DDR3_DQU[6]
B_DDR3_DQU[7]

ZQ

M1A_128M_UO4

IC101-*1

LGE2133(128M)

M1A_256M_AVS+

LGE2136(256M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

IC101-*2

M1A_128M_AVS+

LGE2135(128M)

E11

B_DDR3_A[0]

F12

B_DDR3_A[1]

D10

B_DDR3_A[2]

B10

B_DDR3_A[3]

E15

B_DDR3_A[4]

B11

B_DDR3_A[5]

F14

B_DDR3_A[6]

C11

B_DDR3_A[7]

D14

B_DDR3_A[8]

A12

B_DDR3_A[9]

F16

B_DDR3_A[10]

D13

B_DDR3_A[11]

D15

B_DDR3_A[12]

C12

B_DDR3_A[13]

E13

B_DDR3_A[14]

A9

B_DDR3_BA[0]

D16

B_DDR3_BA[1]

A10

B_DDR3_BA[2]

C13

B_DDR3_MCLK

B13

B_DDR3_MCLKZ

E17

B_DDR3_MCLKE

B8

B_DDR3_ODT

C8

B_DDR3_RASZ

B9

B_DDR3_CASZ

D11

B_DDR3_WEZ

F10

B_RESET

D12

B_DDR3_CS0

A19

B_DDR3_DQSL

B18

B_DDR3_DQSU

C16

B_DDR3_DQML

D21

B_DDR3_DQMU

C18

B_DDR3_DQSBL

C17

B_DDR3_DQSBU

A20

B_DDR3_DQL[0]

A16

B_DDR3_DQL[1]

C19

B_DDR3_DQL[2]

C15

B_DDR3_DQL[3]

C20

B_DDR3_DQL[4]

C14

B_DDR3_DQL[5]

B21

B_DDR3_DQL[6]

B15

B_DDR3_DQL[7]

F18

B_DDR3_DQU[0]

D19

B_DDR3_DQU[1]

D17

B_DDR3_DQU[2]

E21

B_DDR3_DQU[3]

E19

B_DDR3_DQU[4]

D20

B_DDR3_DQU[5]

D18

B_DDR3_DQU[6]

F20

B_DDR3_DQU[7]

E9

ZQ

IC101-*3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L14_CA_M1A

MAIN3_DDR

2014/06/13

12