LG 43LF5100-SA, 49LF5100-SA Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LJ55A

MODEL : 43LF5100 43LF5100-SA

49LF5100 49LF5100-SA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL68606519 (1505-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

DISASSEMBLY ........................................................................................ 15

BLOCK DIAGRAM ...................................................................................16

EXPLODED VIEW .................................................................................. 17

SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX

TROUBLESHOOTING ...............................................................APPENDIX

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This spec sheet is applied all of the LED TV with LJ55A chassis

2. Test condition

Each part is tested as below without special notice.

1) Temperature : 25 ºC ± 5 ºC, CST : 40 ºC±5 ºC

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage Standard input voltage (100~240V@ 50/60Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

5) The receiver must be operated for about 20 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC: CE, IEC

4. Electrical Specification

No Item Specication Measurement Result Remark

1 Receiving System 1) SBTVD / NTSC / PAL-M / PAL-N

2 Available Channel 1) VHF : 02~13

3 Input Voltage 1) AC 100 ~ 240V 50/60Hz

4 Market Central and South AMERICA

5 Aspect Ratio 16:9

2) UHF : 14~69

3) CATV : 01~135

6 Tuning System FS

7 Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : ~ 80 %

8 Storage Environment 1) Temp : -20 ~ 60 deg

2) Humidity : ~ 85 %

Only for training and service purposes

- 6 -

5. External Input Support Format

5.1. Component input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed

1. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I

2. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

3. 720*480 31.47 59.94 27.0 SDTV 480P

4. 720*480 31.50 60 27.027 SDTV 480P

5. 1280*720 44.96 59.94 74.176 HDTV 720P

6. 1280*720 45.00 60.00 74.25 HDTV 720P

7. 1920*1080 28.12 50.00 74.250 HDTV 1080I

8. 1920*1080 33.72 59.94 74.176 HDTV 1080I

9. 1920*1080 33.75 60.00 74.25 HDTV 1080I

10. 1920*1080 26.97 23.976 74.176 HDTV 1080P

11. 1920*1080 27.00 24.000 74.25 HDTV 1080P

12. 1920*1080 33.71 29.97 74.176 HDTV 1080P

13. 1920*1080 33.75 30.000 74.25 HDTV 1080P

14. 1920*1080 56.25 50.00 148.50 HDTV 1080P

15. 1920*1080 67.43 59.939 148.352 HDTV 1080P

16. 1920*1080 67.50 60.00 148.50 HDTV 1080P

5.2. HDMI Input (PC/DTV)

*HDMI PC support only Rear HDMI Input *If use DVI to HDMI cable for PC, you have to use external SPK for PC audio sound.

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

PC DDC

1

640*350 31.46 70.09 25.17 EGA X

2 720*400 31.46 70.08 28.32 DOS O

3 640*480 31.46 59.94 25.17 VESA(VGA) O

4 800*600 37.87 60.31 40.00 VESA(SVGA) O

5

1024*768 48.36 60.00 65.00 VESA(XGA) O

6

1152*864 54.34 60.053 80.00 VESA O

7

1360*768 47.71 60.015 85.50 VESA (WXGA) O

8

1280*1024 (FHD Only) 63.98 60.02 108.00 VESA (SXGA) O

9

1920*1080 (FHD Only) 67.5 60 148.5 HDTV 1080P O

10

3840 x 2160 (UF67 ONLY) 67.5 30.00 297.00

11

3840 x 2160 (UF67 ONLY) 56.25 25.00 297.00

12

3840 x 2160 (UF67 ONLY) 54.0 24.00 297.00

13

4096 x 2160 (UF67 ONLY) 53.95 23.97 296.703

14

4096 x 2160 (UF67 ONLY) 54 24.00 297.00

Only for training and service purposes

- 7 -

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

DTV

1

640 * 480 31.46 59.94 25.125 SDTV 480P

2

640 * 480 31.5 60.00 25.125 SDTV 480P

3

720*480 31.47 59.94 27.000 SDTV 480I

4

720*480 31.50 60.00 27.027 SDTV 480I

5

1280*720 37.50 50.00 74.25 HDTV 720P

6

1280*720 44.96 59.94 74.176 HDTV 720P

7

1280*720 45.00 60.00 74.25 HDTV 720P

8

1920*1080 28.12 50.00 74.25 HDTV 1080I

9

1920*1080 33.72 59.94 74.176 HDTV 1080I

10

1920*1080 33.75 60.00 74.25 HDTV 1080I

11

1920*1080 26.97 23.97 74.176 HDTV 1080P

12

1920*1080 27.00 24.00 74.25 HDTV 1080P

13

1920*1080 33.71 29.97 74.176 HDTV 1080P

14

1920*1080 33.75 30.00 74.25 HDTV 1080P

15

1920*1080 56.25 50.00 148.50 HDTV 1080P

16

1920*1080 67.43 59.94 148.352 HDTV 1080P

17

1920*1080 67.5 60.00 148.50 HDTV 1080P

18

3840 x 2160(UF67 ONLY) 53.95 23.98 UDTV 2160P

19

3840 x 2160(UF67 ONLY) 54 24.00 UDTV 2160P

20

3840 x 2160(UF67 ONLY) 56.25 25.00 UDTV 2160P

21

3840 x 2160(UF67 ONLY) 61.43 29.97 UDTV 2160P

22

3840 x 2160(UF67 ONLY) 67.5 30.00 UDTV 2160P

23

3840 x 2160(UF67 ONLY) 135 60.00 UDTV 2160P

24

3840 x 2160(UF67 ONLY) 135 59.94 UDTV 2160P

25

4096 x 2160(UF67 ONLY) 53.95 23.98 UDTV 2160P

26

4096 x 2160(UF67 ONLY) 54 24.00 UDTV 2160P

27

4096 x 2160(UF67 ONLY) 56.25 25.00 UDTV 2160P

28

4096 x 2160(UF67 ONLY) 61.43 29.97 UDTV 2160P

29

4096 x 2160(UF67 ONLY) 67.5 30.00 UDTV 2160P

30

4096 x 2160(UF67 ONLY) 135 60.00 UDTV 2160P

31

4096 x 2160(UF67 ONLY) 135 59.94 UDTV 2160P

* DTV Resolution #6 ~ #17 : Support dual play for 3D Models

※ HDMI Monitor Range Limits

Min Vertical Freq - 58 Hz Max Vertical Freq - 62 Hz Min Horiz. Freq - 30 kHz Max Horiz. Freq - 83 kHz Pixel Clock - 160 MHz

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application

This spec sheet is applied all of the TV with LJ55A chassis.

2. Designation

1) The adjustment is according to the order which is

designated and which must be followed, according to the plan whic al Unit: Product Specification Standard.

2) Power adjustment : Free Voltage.

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specification Standard.

5) Reserve after operation: Above 5 Minutes (Heat Run).

Temperature : at 25 ºC±5 Relative humidity : 65 ± 10% Input voltage : 100~220V, 50/60Hz

6) Adjustment equipments : Color Analyzer (CA-210 or

CA-110), SVC remote controller

7) Push The “IN STOP KEY” – For memory initialization.

Case1 : Software version up

1) After downloading S/W by USB , TV set will reboot automatically

2) Push “In-stop” key

3) Push “Power on” key

4) Function inspection

5) After function inspection, Push “In-stop” key.

ºC

3. Main PCB check process

* APC – After Manual-Insert, executing APC * Boot file Download

1) Execute ISP program “Mstar ISP Utility” and then click “Config” tab.

2) Set as below, and then click “Auto Detect” and check “OK” message.

If “Error” is displayed, Check connection between

computer, jig, and set.

3) Click “Read” tab, and then load download file (XXXX.bin) by clicking “Read”

(1)

filexxx.bin

4) Click “Connect” tab. If “Can’t ” is displayed, Check connection between computer, jig, and set.

(2)

(3)

Case2 : Function check at the assembly line

1) When TV set is entering on the assembly line, Push “In-stop” key at first.

2) Push “Power on” key for turning it on.

→ If you push “Power on” key, TV set will recover channel

information by itself.

3).After function inspection, Push “In-stop” key.

Please Check the Speed

To use speed between

from 200KHz to 400KHz

5) Click “Auto” tab and set as below.

6) Click “Run”.

7) After downloading, check “OK” message.

(4)

filexxx.bin

(5)

(7)...........OK

(6)

Only for training and service purposes

- 9 -

* USB DOWNLOAD(*.epk file download)

1) Put the USB Stick to the USB socket.

2) Automatically detecting update file in USB Stick.

- If your downloaded program version in USB Stick is Low, it didn't work. But your downloaded version is High, USB data is automatically detecting

3) Show the message "Copying files from memory"

4) Updating is staring.

* After downloading, have to adjust Tool

Option again.

1) Push "IN-START" key in service remote controller.

2) Select "Tool Option 1" and Push "OK" button.

3) Punch in the number. (Each model has their number.)

4) Completed selecting Tool option.

BLU

Tool

Model

32LF510B-

SB/D

43LF5100-

SA

49LF5100-

SA

Module

Type

option1

option2

option3

option4

LGD POLA 551 41899 4044 36384 9218

LGD POLA 556 33707 4044 36384 9218

LGD POLA 558 33707 4044 36384 9218

* RS-232C Connection Method Connection : PCBA (USB Port) -> USB to Serial Adapter

(UC-232A) -> RS-232C cable -> PC(RS-232C port)

▪ Product name of USB to Serial Adapter is UC-232A.

※ Caution: LJ55H chassis support only UC-232A driver. (only

use this one. )

option5

Tool

option6

273

5) After updating is complete, The TV will restart automatically.

6) If TV turns on, check your updated version and Tool option. (refer to the next page about tool option)

* If downloading version is higher than your TV have, TV

can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn't have a DTV/ATV test on production line.

Only for training and service purposes

- 10 -

4. Total Assembly line process

4.1. Adjustment Preparation

■ W/B Equipment condition

CA210 : CH14, Test signal : Inner pattern (80IRE) – in case of

LED back light

■ Above 5 minutes H/run in the inner pattern. (“power on” key of

adjust remote control)

► The spec of color temperature and coordinate

Model Mode Color Temp Color coordinate Remark

Cool (C50) 13,000k

Medium (0) 9,300k

All

Warm (W50) 6,500k

► CA210 : CH 14, Test signal : Inner pattern (80IRE)

- Standard color coordinate and temperature using CA-1000 (by

H/R time)

▪ L15 LGD, INX Module

March to December & Global Normal line

H/R Time(Min)

271 270 286 289 313 329

1 0-2 282 289 297 308 324 348

2 3-5 281 287 296 306 323 346

3 6-9 279 284 294 303 321 343

4 10-19 277 280 292 299 319 339

5 20-35 275 277 290 296 317 336

6 36-49 274 274 289 293 316 333

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

x = 0.271 (±0.002) y = 0.270 (±0.002)

x = 0.286 (±0.002) y = 0.289 (±0.002)

x = 0.313 (±0.002) y = 0.329 (±0.002)

Cool Medium Warm

x y x x y x

※ Test signal

- Inner pattern for W/B adjust

- External white pattern (80IRE, 204gray)

▪ Gumi Winter table(

January to February - Gumi production of prospective models all

models except Cinema Screen

Normal line

Cool Medium Warm

H/R Time(Min)

1 0-2 286 295 301 314 328 354

2 3-5 284 290 299 309 326 349

3 6-9 282 287 297 306 324 346

4 10-19 279 283 294 302 321 342

5 20-35 276 278 291 297 318 337

6 36-49 274 275 289 294 316 334

7 50-79 273 272 288 291 315 331

8 80-119 272 271 287 290 314 330

9 Over 120 271 270 286 289 313 329

▪

INX, AUO, Sharp, CSOT (13000K Cool the SPEC)

spec 271 270 286 289 313 329

target 278 280 293 299 320 339

x y x x y x

271 270 286 289 313 329

cool med warm

x y x y x y

※ Connecting picture of the measuring instrument (On Automatic control)

Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER-ON -> Enter the mode of White-Balance, the pattern will come out.

▪ Aging chamber line

Cool Medium Warm

H/R Time(Min)

1 0-5 280 285 294 308 319 340

2 6-10 276 280 290 303 315 335

3 11-20 272 275 286 298 311 330

4 21-30 269 272 283 295 308 327

5 31-40 267 268 281 291 306 323

6 41-50 266 265 280 288 305 320

7 51-80 265 263 279 286 304 318

8 81-119 264 261 278 284 303 316

9 Over 120 264 260 278 283 303 315

Only for training and service purposes

x y x x y x

271 270 285 293 313 329

● Auto-control interface and directions

1) Adjust in the place where the influx of light like floodlight around is blocked. (Illumination is less than 10ux).

2) Adhere closely the Color Analyzer ( CA210 ) to the module less than 10cm distance, keep it with the surface of the Module and Color Analyzer’s Prove vertically.(80~100°).

3) Aging time

- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.

- 11 -

● Auto adjustment Map(RS-232C)

RS-232C COMMAND [ CMD ID DATA ] Wb 00 00 White Balance Start Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN

CENTER

(DEFAULT)

MAX

*Manual W/B process using adjusts Remote control.(TBD)

■ Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000

■ Operate the zero-calibration of the CA100+ or CA-210, then

stick sensor to the module when adjusting.

■ After enter Service Mode by pushing “ADJ” key,

■Enter White Balance by pushing “►” key at “8. White Balance”.

5) Adjust two modes (Medium / Warm) Fix the one of R/G/B gain to 192 (default data) and decrease the others.

6) Adj. is completed, Exit adjust mode using “EXIT” key on Remote controller.

▪ If internal pattern is not available, use RF input. In EZ Adj. menu

8. White Balance, you can select one of 2 Test-pattern: ON, OFF. Default is inner (ON). By selecting OFF, you can adjust using RF signal in 206 Gray pattern.

※ CASE Cool First adjust the coordinate far away from the target value(x, y).

1) x, y > target

i) Decrease the R, G.

2) x, y < target

i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target , y< target

i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R

4) x < target , y >target

i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

How to adjust

1) If G gain is adjusted over 172 and R gain and B gain less

than 192 , Adjust is O.K.

2) If G gain is less than 172 , increase G gain by up to 172, and

then increase R gain and B gain same amount of increasing G gain.

3) If R gain or B gain is over 255 , Readjust G gain less than

172, Conform to R gain is 255 or B gain is 255

■ For manual adjustment, it is also possible by the following

sequence.

1) Set TV in Adj. mode using POWER ON

2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface

3) Press ADJ key -> EZ adjust using adj. R/C -> 8. White-Balance

then press the cursor to the right (KEY►). When KEY(►) is

pressed 206 Gray internal pattern will be displayed.

4) Adjust Cool modes

(i). Fix the one of R/G/B gain to 192 (default data) and

decrease the others

(If G gain is adjusted over 172 and R and B gain less than

192, increase G gain to 192 and increase R gain and B gain

same amount of increasing G gain.) (ii). If G gain is less than 172, Increase G gain by up to 172, and then increase R gain and

G gain same amount of increasing G gain. (iii). If R gain or B gain is over 255, Readjust G gain less than 172, Conform to R gain is 255 or

B gain is 255

※ CASE Medium / Warm First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R

4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

▪ After You finish all adjustments, Press “In-start” button and

compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.

▪ Push the “IN STOP KEY” after completing the function

inspection.

Only for training and service purposes

- 12 -

4.2. DPM operation confirmation (Only Apply for MNT Model)

Check if Power LED Color and Power Consumption operate as standard.

■ Set Input to RGB and connect D-sub cable to set

■ Measurement Condition: (100~240V@ 50/60Hz)

■ Confirm DPM operation at the state of screen without Signal

- HDMI1/2 (128)

4.3. EDID DATA

1) All Data : HEXA Value

2) Changeable Data : *: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum

- Auto Download

■ After enter Service Mode by pushing “ADJ” key,

■ Enter EDID D/L mode.

■ Enter “START” by pushing “OK” key.

- HDMI1 (256)

- HDMI2 (256)

2) FHD 2D EDID Data (S/W 1.01.20)

CheckSum

(0xFF)

HDMI 1 40 / 25 10

HDMI 2 40 / 15 20

Physical Address

- HDMI1/2 (128)

(0x1E)

Remark

※ Edid data and Model option download (RS232C)

NO Item CMD 1 CMD 2 Data 0

Enter download MODE

Edid data and Model option download

Download ‘Mode In’

Download A E 00 10

A A 0 0

When transfer the ‘Mode In’, Carry the command

Automatically download (The use of a internal Data)

● EDID DATA

1) HD 2D EDID Data

Before S/W version

CheckSum

(0xFF)

HDMI 1 74 / 5B 10 LF51 has Only

HDMI 2 74 / 4B 20

Only for training and service purposes

Physical Address

(0x1E)

Remark

HDMI1

- 13 -

- HDMI1 (256)

- HDMI2 (256)

4.4. Outgoing condition Configuration

■ When pressing IN-STOP key by SVC remocon, Red LED

are blinked alternatively. And then automatically turn off.

(Must not AC power OFF during blinking)

4.5. GND & Hi-pot test

4.5.1. GND & HI-POT auto-check preparation

1) Check the POWER CABLE and SIGNAL CABE insertion condition

4.5.2. GND & HI-POT auto-check

1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)

2) Connect the AV JACK Tester.

3) Controller (GWS103-4) on.

4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).

(Remove A/V CORD from A/V JACK BOX)

5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

4.5.3. Checkpoint

1) Test voltage

① 3 Poles

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA

② 2 Poles

- SIGNAL: 3KV/min at 100mA

2) TEST time: 1 second

3) TEST POINT

① 3 Poles

- GND Test = POWER CORD GND and SIGNAL CABLE

GND.

- Hi-pot Test = POWER CORD GND and LIVE &

NEUTRAL.

② 2 Poles

- Hi-pot Test = Accessible Metal and LIVE & NEUTRAL.

4) LEAKAGE CURRENT: At 0.5mArms

Only for training and service purposes

- 14 -

DISASSEMBLY

Only for training and service purposes

- 15 -

BLOCK DIAGRAM

Serial Flash

SPI_SCK/SDI/SDO/CS

System EEPROM

I2C_SCL/SDA

SPK_L

SPK_R

30P HD LVDS wafer

(P1801)

HZ

24M

X- tal

NTP7515

AUD_LRCH,

AMP_SCL/SDA

AUD_MASTER_CLK,

AUD_LRCK, AUD_SCK

Connector

(P1800)

Jog KEY, LED_R, IR

RXACK+/-

RXB0+/- ~RXB4+/-,

RXA0+/-~RXA4+/-,

51P FHD LVDS wafer

-

RXBCK+/

Main SOC

M1A-LGE2136

(IC101, DDR3 256MB)

PCM_A[0:7]

IC102 (1Gbit)

NAND FLASH

H27U1G8F2CTR-BC

T4LCX244FT Buffer

CI SLOT

PCM_A[8:14]

TS_DATA[0:7]

PCM_DATA[0:7]

SIDE

IF_N/P

LNB_TX

LNB_OUT, DEMOD_RESET

FE_TS_DATA[0:7]

TU_SCL / SDA

DEMOD_SCL/SDA

Tuner

F/NIM

IF_AGC

EPHY_TP/TN/RP/RN

DDC_SCL/SDA_2, HDMI_CEC

CK+/-, D0+/ -, D1+/ -, D2+/ -_HDMI2

HDMI1

LAN

Only UK

REAR

USB1_OCP/CTL

OCP

DM/DP

SN1406035RGER

SC1/AV2_CVBS_IN, SC1_R+/G+/B+

DTV/MNT_OUT, DTV/MNT_L/R_OUT

+5V_USB

F- SCART

USB

Only for training and service purposes

- 16 -

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400

900

LV1

200

540

800

500

120

700

A10

A2

901

701

Set + Stand

Only for training and service purposes

- 17 -

POWER

LGE Internal Use Only

FROM ADAPTOR 19V

JK400

KJA-DC-1-0032

4

2

Surge Protection

2

1

D471 20V

OPT R493 120K

OPT R492 120K

OPT C492 10uF 25V

19V TO PANEL VCC(12V) DCDC CONVERTER

+19V

C472

C470 10uF

0.1uF

25V

R470 100K

OPT Q407 SSM3J332R

S

G

AAM

IN

SW

GND

+19V

D

MP2315GJ

1

2

3

4

OPT C488 68uF 35V

IC403

NEW

3A

+19V to +3.5V_STANDBY

IC402

MP2315GJ

R471

AAM

C471 68uF 35V

8

7

6

5

C473 10uF

FB

VCC

EN/SYNC

BST

25V

39K

1/16W 1%

C474

0.1uF 25V

20130528 cJ.LIM

R475 68

C475

0.1uF 50V

GND

IN

SW

0.47uF

OPT R476 47K

OPT

C477

1

2

NEW

3

3A

4

OPT R489 10K

16V

CYNTEC

L470-*1

10uH

C478

0.1uF 25V

FB

8

VCC

7

EN/SYNC

6

BST

5

+3.5V_ST

OPT

R490

10K

R480 10K

TDK L470

10uH

C480 10uF

20130528 cJ.LIM

C481 10uF

16V

R478 100K

R479

R477 68

20K

C476

0.1uF 50V

RL_ON

POWER_ON/OFF_1

C483

C486

0.1uF

10uF

25V

16V

R481 56K

R48 2

R48 3

3.3 K

R48 4

C479

0.1uF 25V

11K 1%

1%

1K

1%

CYNTEC

L471-*1

4.7uH

TDK

L471

4.7uH

C482

C484

10uF

10V

X5R => X7R

To improve CST Issue

2013.12.21 by GH.Song

+12V

OPT

ZD405

15V

C487 22uF 10V

R485 56K

C489 22uF 10V

C485

0.1uF 25V

R48 6

R48 7

1.2 K

R48 8

3.5V_ST POWER_DET

+3.5V_ST

R410

10K

+3.5V_ST

C400

0.1uF 16V

2K 1%

1%

1K 1%

5V

5.6B->5V READY->APPLY

2013.08.07

D470

+12V to PANEL_VCC

UBW2012-121F

PANEL_CTL

L408

120OHM

OPT

C425

0.1uF 25V

R441

OPT

C490 1uF 10V

+12V

R442

10K

B

R445

R446 120K

OPT

ZD408

33K

5V

C

E

POWER_DET

C427

0.22uF 25V

TR_NXP Q403 MMBT3904(NXP)

Q405

SSM3J332R

S

B

PANEL_VCC

D

R451

R452

5.6K

G

C

TR_KEC Q403-*1 2N3904S

E

+3.5V_ST to +3.3V_Normal

+3.5V_ST

POWER_ON/OFF_1

R443

4.7K

R444 10K

B

R447 22K

R448

2.2K

C428

2.2uF 10V

C

TR_NXP Q404 MMBT3904(NXP)

E

+3.5V_Normal to +1.5V_DDR

+3.3V_Normal

L409

BLM18PG121SN1D

C426 10uF

10V

1.3A

IC404

AZ1117EH-ADJTRG1

OUTIN

ADJ/GND

R449 1K 1/16W 1%

R450 200 1/16W 1%

BOOST_EN

R1

R2

FET_AOS Q406-*1

AO3435

S

G

FET_TOSHIBA

Q406 SSM3J332R

S

G

C

B

E

L411

CB2012PK501T

R453

0

C431 10uF

10V

D

C429

0.1uF 16V

TR_KEC

Q404-*1 2N3904S

+1.5V_DDR

L410

BLM18PG121SN1D

C430 22uF 10V

BRAZIL_ESD

ZD403

2.5V

+3.3V_Normal

TVS_SEMTECH

ZD402

5V

TVS_KEC ZD402-*1

Vout=1.25*(1+R2/R1)+Iadj*R2

+5V_Normal & +1.10V_VDDC

+3.3V_Normal

R403 10K

OPT

C403

4700pF

50V

USB1_CTL

Check the pull down when AC Power On with HDD

USB1_CTL_Pull_Down

USB1_OCD

OPT R473 30K

R472

3.3K

CB2012PK501T

+5V_Normal

R408 100K

L404

+12V

C405 10uF 25V

Vout=0.6(R1/R2)+0.6

TDK

L405

4.7uH

CYNTEC

R1

R411

4.7K 1%

R2

R413

5.1K 1%

50V

C420

3300pF

50V

CYNTEC

L406-*1

4.7uH

R41 4

OPT

C411

ZD407

82pF

5.1v

50V

C416

22pF

50V

C417

3300pF

50V

10K

R415

R416

5.1K

R417

100

1%

39K

1%

ZD401

2.5V

R1

R2

C412 10uF

6.3V

C418

47pF 50V

+5V_Normal

C423 22uF 16V

C410

0.047uF 25V

C406 10uF 25V

C408

OPT

2200pF

50V

C409

OPT

2200pF

50V

R409

91K

C407 1uF

10V

SS2

EN1

EN2

ROSC/SYNC

SW_EN

NFAULT

+5V_USB

VIN123V7V24SS1

[EP]

22

1

THERMAL

25

2

3

IC400

SN1406035RGER

4

5

6

7

9

8

VIN2

SW_IN

SW_OUT

10

PGND2

LX2

BST120LX121PGND1

19

COMP1

18

FB1

17

AGND

16

RSET

15

FB2

14

COMP2

13

11

12

BST2

+5V_Normal

C432

1uF 16V

L405-*1

4.7uH

R422 15K

C419 22pF

R41 8

20K

TDK

C421

0.047uF

L406

4.7uH

25V

C491 470pF 50V

R491

5.1

Vout=0.6(R1/R2)+0.6

C413 22uF

10V

C424 22uF 16V

+1.10V_VDDC

C414 22uF

10V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5_ECI_M1A

POWER

150112

4

TOTAL LED DRIVER BLOCK

LGE Internal Use Only

L505

CIS21J121

32_43inch

+19V

BOOST_EN

EU_BR

R553 0

R554 0

32_43inch_AJ_KR_CO

R555 0

OPT C516

0.1uF

OPT

C517

0.1uF

OPT

L503

UBW2012-121F

OPT

L504

UBW2012-121F

C500 47uF 25V

49inch

R500 1K

C501 10uF 25V

C502

0.1uF 50V OPT

49inch C503

0.033uF 50V

49inch

R501

18K 1%

49inch 470pF

49inch

R502 1K

1%

49inch

R503 10K

1/16W

C504

50V

49inch

C505 100pF

50V

49inch C506

0.22uF

REDUCE INDUCTOR TEMP ISSUE

49inch

L507

49inch

L508

49inch

C531 100V 220pF

R511

R508

47

49inch

R509

49inch

3.3

OPT

D505

1N4148W-G

49inch

R510

3.9K

49inch

50V

R507

3.9K 1%

121211 1K -> 3.9K 220p -> 330p

D503

MBRD10U100CT

A1

C

A2

OPT C532 100V 220pF

47

R513

47

49inch

R582

2.2

1%

49inch

R558

47

OPT

R512

49inch

C511

33uF 100V

0.1

OPT R583 10K

1W

REDUCE RIPPLE CURRENT

49inch

C513

C512

33uF

100V

D

49inch Q500

G

AOD478

S

R514

0.1

49inch

1W

49inch

C514 1uF 50V

49inch

C515 1uF 50V

49inch

32_43inch_AJ_KR_CO

R515

C537

100K

4.7uF

1/8W

50V

32_43inch_AJ_KR_CO

C538

49inch

4.7uF

R516

50V 100K 1/8W

R518

47K

49inch

R581

1K

49inch

R517 680 1/8W 1%

VOUT#1=50.5V

49inch

C537-*1 10uF 35V

49inch

C538-*1 10uF 35V

OPT

R519 10K

INV_CTL

PWM_DIM

R520

10K

B

49inch

R522-*1

32_43inch

150K

R522 120K

43inch R529-*1 13K 1%

R521 100

BLU_CURRENT_CTL

+3.3V_Normal

R523

3K

C

TR501 MMBT3904(NXP)

E

R525 270K

1/8W 1%

49inch R529-*2

8.2K 1%

R524

100K

49inch R532-*2

27K 1%

49inch

1%

R533-*2

3.3K

1/16W

R528 1K

1%

32inch

R529 30K 1%

C518

100pF

50V

43inch

R532-*1 12K

1%

43inch

R533-*1 10K 1%

OPT R530 100K

R531

100K

1%

10K

C521 1000pF 50V

32inch

R532

32inch

R533

15K

1%

3.6K

1%

C522 1000pF 50V

R534

49inch

L500 33uH

49inch

R504

R505

180K

49inch

C507

1uF 25V

To Improve EMI Issue

49inch

C530 100V 220pF

R506

47

49inch

C509

C508

0.1uF

330pF

50V

VOUT = VREF*(1+48.8K/680) = 0.7 *(1+48.8K/680) = 50.5V

49inch

IC500

TPS40210DGQR

RC

1

SS

DIS/EN

COMP

2

3

4

FB

5

16V

11

THERMAL

[EP]

VDD

10

BP

9

GDRV

8

ISNS

7

GND

6

L501 33uH

NC_1

PGND_1

PGND_2

PDIM

RISET

NC_2

EN

OVP

LS8

LS7

LS6

LS5

32inch

L506

CIS21J121

43_49inch

L502 33uH

R535 100

DT1641AS

1

2

3

4

5

6

7

8

9

10

11

12

R536 100

IC501

To Improve EMI Issue

C523 100V 220pF

C524 100V 220pF

R537

R538

R539

100

[EP]GND

VIN

24

C525 1uF

VREF

25

23

THERMAL

CS

22

NDRV

21

RSS

20

COMP

19

RT

18

LS1

17

LS2

16

LS3

15

LS4

14

LGND

13

R540 100

25V

220K

R545

R541 100

R542

R544

3.3

1/16W

39K 1%

R543

1.5K 1%

+19V

1%

R546

1.5K 1%

C526 100V 220pF

C527 100V 220pF

R547 100

C510 1uF 25V

R548

30K C528

4700pF

50V

1%

C529

0.1uF

R549 100

25V

UF3D(SUZHOU GRANDE)

32_43inch

R550 100

D

49inch Q502 SMN630LD

G

32_43inch

S

Q502-*1

G

AOD2922

R551

0.1

49inch

D502

D504 BR210

100V

D

S

P500

SMAW200-04

FIRST BOOST UP

1

2

3

VOUT#2

4

EXCEPT C500 C501

C533

33uF

49inch R579 0

C534

33uF

32_43inch

R580 0

32_43inch

R578 0

C535

4.7uF 50V

C536

4.7uF 50V

C539

4.7uF 50V

33V

ZD500

43_49inch

C519 1uF 100V

49inch

C520

1uF

100V

32inch

C519-*1

4.7uF 50V

32_43inch

C520-*1 0

1/4W 5%

49inch

C540 1uF 100V

49inch

C541

1uF

100V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LED_DRIVER

150112L15.5_ECI_M1A

5

USB

LGE Internal Use Only

JK700

US-04A-VSD

5

OPT C704 22uF 10V

+5V_USB

SIDE_USB1_DM

SIDE_USB1_DP

USB_HDD_CAP1_10uF

C700-*1

USB_HDD_CAP1_22uF

OPT

ZD700

SD05

1

2

3

4

5V

C701

OPT

C702

5pF

50V

10uF

10V

C700 22uF 10V

USB_HDD_CAP2_10uF

C703-*1

10uF

10V

USB_HDD_CAP2_22uF

C703 22uF 10V

R700

2.2

R701

2.2

OPT D700 RCLAMP0502BA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5_ECI_M1A

USB_S1

150112

7

HDMI (REAR)

LGE Internal Use Only

HDMI_1

5V_HDMI_2

SHIELDGND

20

HP_DET

19

5V

18

GND

17

DDC_DATA

ESD_HDMI1_VARISTOR

16

DDC_CLK

15

NC

14

CE_REMOTE

13

CK-

12

CK_GND

11

CK+

10

EAG59023302

JK1000

This GND Pattern should be very narrow HDMI jack burnt problem improvement

9

8

7

6

5

4

3

2

1

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

R1001

R1000

1.8K

VA1000

1K

5V_DET_HDMI_2

R1002

3.3K

ESD_HDMI1_VARISTOR VA1001

ESD_HDMI1_CAP VA1000-*1 1uF 10V

ESD_HDMI1_CAP VA1001-*1 1uF 10V

AR1000

5.1

AR1001

5.1

MMBT3904(NXP)

ESD_HDMI1 VA1002

TR_NXP

Q1000

C

E

TR_KEC

Q1000-*1

2N3904S

B

C

B

E

ESD_HDMI1

VA1003

ESD_HDMI1_TMDS

IP4294CZ10-TBR

ESD_HDMI1_TMDS

IP4294CZ10-TBR

1 2 3 4 5

R1003

10K

R1004

10K

D1000

D1001

AR1002 100 1/16W

ESD_HDMI1 VA1004

10 9 8 7 6

HPD2

DDC_SDA_2 DDC_SCL_2

HDMI_CEC

CK-_HDMI2

CK+_HDMI2

D0-_HDMI2

D0+_HDMI2

D1-_HDMI2

D1+_HDMI2

D2-_HDMI2

D2+_HDMI2

CEC

HDMI_CEC

HDMI_DIODE_SUZHOU

D1002-*1 MMBD6100

A1

C

R1007

2.7K

+5V_Normal

R1008

2.7K

5V_HDMI_2

R1009 100

A2

HDMI_DIODE_KEC

A2CA1

KDS184 D1002

DDC_SDA_2

DDC_SCL_2

CEC_REMOTE_S7

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

L15.5

2015/01/21

HDMI_R1S1 8

LG 43LF5100-SA, 49LF5100-SA Schematic

Specifications and Main Features

Frequently Asked Questions

User Manual