LG 42LC2RH Schematic

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP62D FACTORY MODEL : 42LC2RH-ZH

MODEL : 42LC2RH

website:http://biz.LGservice.com

e-mail:http://www.LGEservice.com/techsup.html

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CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ..........................................................................3

SPECIFICATION........................................................................................6

ADJUSTMENT INSTRUCTION................................................................11

TROUBLE SHOOTING............................................................................16

BLOCK DIAGRAM...................................................................................23

EXPLODED VIEW .................................................................................. 24

REPLACEMENT PARTS LIST ............................................................... 26

SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

X-RAY Radiation

Warning:

To determine the presence of high voltage, use an accurate high impedance HV meter.

Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate

23.5

1.5KV: 14-19 inch, 26 1.5KV: 19-21 inch,

29.0

1.5KV: 25-29 inch, 30.0 1.5KV: 32 inch If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the LCD PANEL. For continued X-RAY RADIATION protection, the replacement panel must be the same type panel as specified in the Replacement Parts List.

IMPORTANT SAFETY NOTICE

0.15uF

To Instrument's exposed METALLIC PARTS

AC Volt-meter

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE, CONDUIT etc.

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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high

voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specified otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its

electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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1. Application range

This specification is applied to LP62D chassis.

2. Requirement for Test

Testing for standard of each part must be followed in below condition.

(1) Temperature : 25°C±5°C(77±9°F), CST : 40±5 (2) Humidity : 65%±10% (3) Power : Standard input voltage (AC 100-240V, 50/60Hz)

*Standard Voltage of each products is marked by models

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

3.1 Performance : LGE TV test method followed

3.2 Demanded other specification Safety : CE, IEC Specification EMC : CE, IEC

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. General TV Specification

No Item Specification Remark

1. Video input applicable system PAL-D/K, B/G, I, NTSC-M, SECAM, NTSC 4.43

2. Receivable Broadcasting System 1) PAL/SECAM BG

2) PAL/SECAM DK

3) PAL I/I

4) SECAM L/L' only ZH

5) PAL-N/M

6) NTSC M only TH

3. RF Input Channel VHF : E2 ~ E12 PAL UHF : E21 ~ E69 CATV : S1 ~ S20 HYPER : S21~ S47 L/L' : B, C, D FRANCE VHF : 2~13 NTSC UHF : 14~69 CATV : 1~125

4. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz

5. Market Worldwide

6. Active Screen Size 1067.308 mm(diagonal) 42.02 inches

7. Tuning System FVS 100 program FS

8. Operating Environment 1) Temp : 0 ~ 40 deg

2) Humidity : 10 ~ 90 %RH

9. Storage Environment 1) Temp : -20 ~ 50 deg

2) Humidity : 10 ~ 90 %RH

10. Display LCD Module 32"/42" : LPL 37" : AUO, LPL

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5. General Specification

6. Set Optical Feature

No Item Specification Remark

1 Panel 42" TFT WXGA LCD 2 Frequency range H : 31 ~ 61KhzV : 56 ~ 75Hz PC Input 3 Control Function 1) Contrast/Brightness

2) H-Position / V-Position

3) Tracking : Clock / Phase

4) Auto Configure

5) Reset

4 Component Jack Y/Pb/Pr : 1EA ZH

(480i/576i/480p/576p/720p/1080i) Y/Pb/Pr : 2EA TH

5 Power ON LED Power consumption

White ≤ 230W

Stand by RED ≤ 1W

6 LCD Module

Outline Dimension

42" 1006 x 610 x 56 (H)mmx(V)mmx(D)mm Pixel Pitch 42" 0.227 x 0.681 x RGB Pixel Format 1366 x 768 Pixels RGB strip arrangement Coating Hard coating(3H), Anti-glare treatment of

the front polarizer,

Back Light 42" 20CCFL

No Parameter Symbol Value Unit Remark

Min Typ Max

1. Contrast Ratio CR 300 400 (*) Normal Mode

- 100IRE Full white window pattern

- APC : Clear (Dynamic)

D 700 1000 (*) Normal Mode

(With AI)

- 100IRE Full white window pattern

- APC : Standard

2. Surface Luminance, LWH 360 450

Cd/m2(*) Normal Mode

white

- 100IRE Full white window pattern

- APC : Clear (Dynamic)

3. White Coordinate Normal X axis 0.280 0.283 0.286 - 85IRE Full White Pattern Y axis 0.295 0.298 0.301 - APC : Standard

Cool X axis 0.271 0.274 0.277

Y axis 0.283 0.286 0.289

Warm X axis 0.300 0.303 0.306

Y axis 0.316 0.319 0.322

4. Color Temperature Normal 8300 9300 10300 - 85IRE Full White Pattern

Warm 6200 7200 8200 - APC : Standard Cool 10000 11000 12000

5. Color pull in Range PAL -500 +500 Hz

NTSC -500 +500 Hz

6. Color killer Sensitivity -80 dBm

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7. Model Specification

No Item Specification Remark

1. Market EU

2. Broadcasting system PAL BG/I/DK, SECAM

3. Available Channel BAND PAL

VHF/UHF C1 ~ C69 CATV S1 ~ S47

4. Receiving system Upper Heterodyne

5. SCART Jack(2EA) PAL, SECAM, NTSC 4 System :

PAL, SECAM, NTSC, PAL60

6. Video Input (2EA) PAL, SECAM, NTSC 4 System :

PAL, SECAM, NTSC, PAL60

7. S-Video Input (2EA) PAL, SECAM, NTSC 4 System :

PAL, SECAM, NTSC, PAL60

8. Component Input (1EA) Y/Cb/Cr, Y/ Pb/Pr

9. RGB Input (1EA) RGB-PC,

RGB-DTV

10. HDMI Input (2EA) HDMI-PC HDMI-DTV

11. Audio Input (4 EA) PC Audio, Component (1EA), AV (2EA) L/R Input

12. Wired Control (1EA)

13. Audio variable out(1EA)

8. Chroma & Brightness(Module)

No. Parameter Symbol Min Typ Max Unit Remark

1. Contrast Ratio CR 300 400 (*)Normal Mode

- 100IRE Full white window pattern

CRD(With AI) 700 1000 -APC : Clear(Dynamic)

2. Surface Luminance L

WH 400 500 Cd/m

(*)Normal Mode

white

- 100IRE Full white window pattern

-APC : Clear(Dynamic)

3 Luminance Variation 5

WHITE 5P 1.3

4 Response Timer Rise Time Tr

R 816ms

Decay Time Tr

D 916ms

Gray to Gray 9 16 ms

5 Color Coordinates RED Rx Typ 0.640 Typ

[CIE] Ry -0.03 0.341 +0.03

Green Gx 0.287

Gy 0.610

Blue Bx 0.146

By 0.069

White Wx 0.285

Wy 0.293

6 Viewing Angle

x axis, right(ø=0º)

r 85 89 degree

x axis, left(ø=180º)

l 85 89 degree

y axis, up(

=90º)

u 85 89 degree

y axis, down(ø=0º)

d 85 89 degree

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9. RGB Input ( PC )

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1 720 x 400 31.469 70.08 28.32 DOS

2. 640 x 480 31.469 59.94 25.17 VESA(VGA) 3 640 x 480 37.500 75.00 31.50 VESA(VGA) 4 800 x 600 37.879 60.31 40.00 VESA(SVGA) 5 800 x 600 46.875 75.00 49.50 VESA(SVGA) 6 832 x 624 49.725 74.55 57.28 Macintosh 7 1024 x 768 48.363 60.00 65.00 VESA(XGA) 8 1024 x 768 56.476 70.06 75.00 VESA(XGA) 9 1024 x 768 60.023 75.02 78.75 VESA(XGA)

10 1280 x 768 47.693 59.99 80.125 WXGA(42XGA,50", 60") 11 1360 x 768 47.700 60.00 84.62 WXGA(42XGA,50", 60") 12 1366 x 768 47.700 60.00 84.62 WXGA(42XGA,50", 60")

10. RGB input ( DTV )

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1. 720 x 480 31.47 59.94 27.000 SDTV 480P

2. 720 x 480 31.50 60.00 27.027 SDTV 480P

3. 720 x 576 31.25 50.00 27.000 SDTV 576P

4. 1280 x 720 44.96 59.94 74.176 HDTV 720P

5. 1280 x 720 45.00 60.00 74.250 HDTV 720P

6. 1280 x 720 37.50 50.00 74.25 HDTV 720P 50Hz

7. 1920 x 1080 33.72 59.94 74.176 HDTV 1080I

8. 1920 x 1080 33.75 60.00 74.250 HDTV 1080I

9. 1920 x 1080 28.125 50.00 74.250 HDTV 1080I 50Hz

8. Component Video Input (Y, PB, PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1. 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I)

4. 720 x 480 31.47 59.94 27.000 SDTV 480P

5. 720 x 480 31.50 60.00 27.027 SDTV 480P

6. 720 x 576 31.25 50.00 27.000 SDTV 576P

7. 1280 x 720 44.96 59.94 74.176 HDTV 720P

8. 1280 x 720 45.00 60.00 74.250 HDTV 720P

9. 1280 x 720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920 x 1080 33.72 59.94 74.176 HDTV 1080I

11. 1920 x 1080 33.75 60.00 74.250 HDTV 1080I

12. 1920 x 1080 28.125 50.00 74.250 HDTV 1080I 50Hz

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11. HDMI Input ( PC )

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1 720 x 400 31.469 70.08 28.32 DOS 2 640 x 480 31.469 59.94 25.17 VESA(VGA) 3 640 x 480 37.500 75.00 31.50 VESA(VGA) 4 800 x 600 37.879 60.31 40.00 VESA(SVGA) 5 800 x 600 46.875 75.00 49.50 VESA(SVGA)

6. 832 x 624 49.725 74.55 57.28 Macintosh 7 1024 x 768 48.363 60.00 65.00 VESA(XGA) 8 1024 x 768 56.476 70.06 75.00 VESA(XGA) 9 1024 x 768 60.023 75.02 78.75 VESA(XGA)

10 1280 x 768 47.693 59.99 80.125 WXGA(42XGA,50", 60") 11 1360 x 768 47.700 60.00 84.62 WXGA(42XGA,50", 60") 12 1366 x 768 47.700 60.00 84.62 WXGA(42XGA,50", 60")

12. HDMI input ( DTV )

13. Mechanical Specification

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Remarks

1. 720 x 480 31.47 59.94 27.000 SDTV 480P

2. 720 x 480 31.50 60.00 27.027 SDTV 480P

3. 720 x 576 31.25 50.00 27.000 SDTV 576P

4. 1280 x 720 44.96 59.94 74.176 HDTV 720P

5. 1280 x 720 45.00 60.00 74.250 HDTV 720P

6. 1280 x 720 37.50 50.00 74.25 HDTV 720P 50Hz

7. 1920 x 1080 33.72 59.94 74.176 HDTV 1080I

8. 1920 x 1080 33.75 60.00 74.250 HDTV 1080I

9. 1920 x 1080 28.125 50.00 74.250 HDTV 1080I 50Hz

No Item Content Remark

1. Product Width Length Height Unit

Dimension Before Packing 1054 286 813.5 mm SET(With Stand)

After Packing 1166 402 950 mm

2. ProductWeight Only SET 37 Kg

With BOX 42.3 Kg

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ADJUSTMENT INSTRUCTION

1. Application Range

This spec sheet is applied to all of the LP62A/B/C/D chassis(H3-High) manufactured at LG TV Plant all over the world.

2. Specification

2.1 Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation transformer will help to protect test instruments.

2.2 Adjustment must be done in the correct sequence.

2.3 The adjustment must be performed at 25±5°C

temperature and 65±10% relative humidity if there is no specified designation.

2.4 The input voltage of the receiver must be kept between

100~220V, 50/60Hz.

2.5 Before adjustment, execute Heat-Run for 30 minutes at

RF no signal

3. Adjustment items

3.1 PCB assembly adjustment items

• Channel memory

- Download the channel data from BOM to EEPROM by using LGIDS.

• Option adjustment following BOM

- Tool Option1

- Tool Option2

- Area Option

(Fig. 1)

1) Push the ADJ key in the Adjust Remocon.

2) Input the Option Number that was specified in the BOM,

into the Shipping area.

3) Select "Tool Option1/ Tool Option2/ Area Option" by using

/ (CH+/-) key , and press the number key(0~9)

consecutively

ex) If the value of Tool Option1 is 7, input the data using

number key "7" (Fig. 1)

3.2 SET assembly adjustment items

• Auto AV(ZH-AV3, TH-AV1) Color Balance

• Aging (by Power on key)

• Adjustment of White Balance

• Auto Component Color Balance adjustment

- Standard equipment : MSPG925FA

• Auto RGB Color Balance adjustment

- Standard equipment : MSPG925FA

4. EDID

Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

=> Caution: - Never connect HDMI & DVI-D & DVI-A Cable at

the same time.

- Use the proper cables below for EDID Writing

4.1 EDID Data

4.1.1. ANALOG(256 Bytes )

• BLOCK1 (128BYTE)

4.1.2. HDMI(256 Bytes )

• BLOCK1 (128BYTE)

BLOCK2 (128BYTE)

=> Detail EDID Options are below (a, b, c, d, e) a. Product ID b. Serial No : Controlled on production line c. Month, Year : Controlled on production line:

ex) Montly : '03' => '03'

Year : '2005' => '0F'

d. Model Name/Monitor Name:

e. Checksum: Changeable by total EDID data

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 00 FF FF FF FF FF FF FF 1E 6D 10 01 03 01 46 27 78 EA D9 B0 A3 57 49 9C 25 20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FD 00 38 60 4B 1F 3D 09 00 0A 20 20 20 20 20 20 70 00 99

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 00 FF FF FF FF FF FF FF 1E 6D 10 01 03 80 46 27 78 EA D9 B0 A3 57 49 9C 25 20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01 30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88 40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30 50 40 80 37 00 BC 88 21 00 00 18 60 00 00 00

70 00 38 4B 1F 3D 09 00 0A 20 20 20 20 20 20 01 14

00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 00 02 03 24 F1 49 85 04 02 01 03 11 12 13 14 23 09 10 07 07 23 09 07 07 23 09 07 07 83 01 00 00 65 03 20 0C 00 10 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 30 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 40 96 00 13 8E 21 00 00 18 2A 12 00 10 41 43 17 20 50 28 60 35 00 00 00 32 00 00 1C 01 1D 80 18 71 1C 60 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00 00 70 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 6B

LP62x

Cortez Version x.xx Panel Used XX hr. Tool Option1 7 Tool Option2 161 Area Option 16

: :

Model Name

42LC2RH-ZH 00 00 00 FC 00 34 32 4C 43 32 52 2D 48 4D 48 0A 20 20

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5. ADC Calibration

5.1 Adjustment of RF/AV/S-VIDEO

* Required Equipments

• Remote controller for adjustment

• 802F Pattern Generator, Master (MSPG-925FA), etc.

• MSPG-925FA Pattern Generator

(Which has Video Signal: 100% Color Bar Pattern

shown in Fig. 1)

=> Model : 202 / Pattern: 33 (PAL : ZH, TH)

Model : 201 / Pattern : 33 (NTSC : MH)

(Fig. 1)

5.1.1 Method of Auto RF/AV/S-VIDEO Color Balance.

1) Press the FRONT-AV KEY on R/C for converting input mode.

2) Input the Video Signal: 100% Color Bar signal into AV3(ZH), AV1(TH), VIDEO1(MH)

3) Set the PSM to Standard mode in the Picture menu.

4) Press INSTART key on R/C for adjustment.

5) Press the

(Vol.+) key to operate the set, then it becomes

automatically

6) Auto-RGB OK means the adjustment is completed

5.1.2 Requirement

• This AV color balance adjustment should be performed

before White Balance Adjustment.

• After AV color balance adjustment, change the mode from

AV to RF.(Cencel Heat-run mode).

5.2 Adjustment of Component.

* Required Equipments

• Remote controller for adjustment

• 802F Pattern Generator, Master (MSPG-925FA), etc.

• MSPG-925FA Pattern Generator

(Which has 720p YPbPr signal : 100% Color Bar

Pattern shown in Fig. 2 )

=> Model: 217 / Pattern: 33

• It is very import to use correct adjustment pattern like

Fig. 2.

- Within the pattern, color sequence should be aligned : W-Y-C-G-M-R-BLUE-BLACK

(If color sequence is reversed (Black -> ... -> White),

reverse the pattern with REV key, when using

Master pattern generator like MSPG-925)

- If Minimum Black Level and/or Maximum White Level is not correct, Do select 100% Color Bar Pattern.

(Fig. 2)

5.2.1 Method of Auto Component Color Balance

1) Input the Component 720p 100% Color Bar(MSPG-925FA model:217, pattern:33) signal into Component.

(ZH : component , TH/MH : component 1 or 2)

2) Set the PSM to Standard mode in the Picture menu.

3) Press the INSTART key on R/C for adjustment.

4) Press the

(Vol. +) key to operate the set , then it

becomes automatically.

5) Auto-RGB OK means the adjustment is completed.

5.3 Adjustment of RGB

* Required Equipments

• Remote controller for adjustment

• 802F Pattern Generator, Master (MSPG-925FA), etc.

• MSPG-925FA Pattern Generator

(Which has XGA [1024x768] 60Hz PC Format output

signal : 100% Color Bar Pattern shown in Fig. 3 )

• It is very import to use correct adjustment pattern like.

- Within the pattern, color sequence should be aligned : W-Y-C-G-M-R-BLUE-BLACK

(If color sequence is reversed (Black ->...-> White),

reverse the pattern with REV key, when using Master pattern generator like MSPG-925)

- If Minimum Black Level and/or Maximum White Level is not correct, Do select 100% Color Bar Pattern.

(Fig. 3)

5.3.1 Method of Auto RGB Color Balance

1) Input the PC 1024x768@60Hz 1/2 Black&White Pattern (MSPG-925FA model:3, pattern:33) into RGB.

2) Set the PSM to Standard mode in Picture menu.

3) Press the INSTART key on R/C for adjustment.

4) Press the

(Vol. +) key operate To set , then it becomes

automatically.

5) Auto-RGB OK means adjustment is completed.

=> Caution : Before White-balance, the AV ADC should

be done. (ZH:AV3, TH:AV1, MH:VIDEO1)

=> After Aging, When the procedure is changed White

balance adjustment, it will be canceled Heat_run mode auto.

(Notice : Before White-balance, change input mode Move

to AV3(ZH) or AV1(TH) or VIDEO1(MH) by using the FRONT-AV KEY on Remote controller.)

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