LG 32LW5500 Schematic

Internal Use Only
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LCD TV
SERVICE MANUAL
CHASSIS : LC12C
MODEL : 32LW5500 42LW5500 47LW5500
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Printed in ChinaP/NO : MFL67002332 (1109-REV00)
CONTENTS
CONTENTS ..............................................................................................1
SAFETY PRECAUTIONS .........................................................................2
SPECIFICATION .......................................................................................5
ADJUSTMENT INSTRUCTION .............................................................. 8
EXPLODED VIEW ..................................................................................28
SVC. SHEET ...............................................................................................
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SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1Mand 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
AC Volt-meter
Good Earth Ground such as WATER PIPE,
To Instrument’s exposed METALLIC PARTS
0.15uF
CONDUIT etc.
1.5 Kohm/10W
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CAUTION: Before servicing receivers covered by this service
SERVICING PRECAUTIONS
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
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SPECIFICATION
No. Item Specification Remark
1 Display Screen Device 32,42,47Wide Color Display Module
2 Aspect Ratio 16:9
3 LCD Module LC320EUF-SDF3
4 Operating Environment Temp. : 0 deg ~ 50 deg
Humidity : 20 % ~ 90 %
5 Storage Environment Temp. : -20 deg ~ 60 deg
Humidity : 10 ~ 90 %
6 Input Voltage AC 100-240V~, 50 / 60Hz
7 Power Consumption Power on (White)
32LGD Typ : 69.7W
8 Outline Dimension 698.40(H) x 392.85 (V) x 10.8(B) / 24.0 mm (D)
8 Pixel Pitch 0.36375 mm x 0.36375 mm x RGB
9 Back Light Edge LED
10 Color depth 10Bit(D), 1.06 Billion colors
11 Surface treatment Hard coating(2H), Anti-glare treatment of the front
polarizer (Haze 10%)
32LW5500-CA
LCD
LC420EUF-SDF1/ LC420EUF-SDF2
LC470EUF-SDF1/ LC470EUF-SDF2
42LW5500-CA
47LW5500-CA
42LGD Typ : 90.5W
47LGD Typ : 90W
1078.6(H) x 626.0(V) x 10.8(B) / 22.9mm (D)
968.4(H) x 564.0(V) x 10.8(B) / 22.9mm(D)
32LGD
42LGD
47LGD
32LGD
42LGD
47LGD
0.4845 mm x 0.4845 mm x RGB
0.5415 mm x 0.5415 mm x RGB
NOTE : Specifications and others are subject to change without notice for improvement
1. Application range
This specification is applied to the LCD TV used LC12C chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF), CST: 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage: Standard input voltage (AC 100-240 V~ 50 / 60 Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with
BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety : CE, IEC specification
- EMC :CE, IEC
4. Module General Specification
.
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No.
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz)
1. 720x480 15.73 60.00 SDTV,DVD 480i
2. 720x480 15.63 59.94 SDTV,DVD 480i
3. 720x480 31.47 59.94 480p
4. 720x480 31.50 60.00 480p
5. 720x576 15.625 50.00 SDTV,DVD 625 Line
6. 720x576 31.25 50.00 HDTV 576p
7. 1280x720 45.00 50.00 HDTV 720p
8. 1280x720 44.96 59.94 HDTV 720p
9. 1280x720 45.00 60.00 HDTV 720p
10. 1920x1080 31.25 50.00 HDTV 1080i
11. 1920x1080 33.75 60.00 HDTV 1080i
12. 1920x1080 33.72 59.94 HDTV 1080i
13. 1920x1080 56.250 50 HDTV 1080p
14. 1920x1080 67.5 60 HDTV 1080p
6. RGB (PC)
5. Component Video Input (Y, CB/PB, CR/PR)
No.
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1. 720*400 31.468 70.08 28.321 For only DOS mode
2. 640*480 31.469 59.94 25.17 VESA
3. 800*600 37.879 60.31 40.00 VESA
4. 1024*768 48.363 60.00 65.00 VESA(XGA)
5. 1280*768 47.78 59.87 79.5 WXGA
6. 1360*768 47.72 59.8 84.75 WXGA
7. 1920*1080 66.587 59.93 138.625 WUXGA FHD model
Specification
Proposed Remarks
Input 848*480
-> 640*480 60 Hz Display
60 Hz, 852*480 60 Hz
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No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*400 31.468 70.08 28.321 HDCP
2. 640*480 31.469 59.94 25.17 VESA HDCP
3. 800*600 37.879 60.31 40.00 VESA HDCP
4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP
5. 1280*768 47.78 59.87 79.5 WXGA HDCP
6. 1360*768 47.72 59.8 84.75 WXGA HDCP
7. 1280*1024 63.595 60.0 108.875 SXGA HDCP/FHD model
8. 1920*1080 67.5 60.00 138.625 WUXGA HDCP/FHD model
(2) PC Mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*480 31.469 /31.5 59.94 /60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 /45 59.94 /60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72 /33.75 59.94 /60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97 /27 23.97 /24 74.17/74.25 HDTV 1080P
8. 1920*1080 33.716 /33.75 29.976 /30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 /67.5 59.94 /60 148.35/148.50 HDTV 1080P
7. HDMI Input
(1) DTV Mode
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1. Application range
Chassis Model Name
Module
type
Local
dimming
Remark
Edge LED O 1 point W/B adjustment
ADJUSTMENT INSTRUCTION
LC12C
32/42/47LW5500-CA
1.1 This spec sheet is applied all of the LCD TV with LC12C chassis.
1.2 Main manufacturing type
SET ( o )
CKD ( o )
SKD ( o )
2. Specification
2.1 Because this is not a hot chassis, it is not necessary to use an isolation transformer.
However, the use of isolation transformer will help protect test instrument.
2.2
Adjustment must be done in the correct order.
2.3
The adjustment must be performed in the circumstance of 25 ±5 °C of temperature and
65±10% of relative humidity if there is no specific designation.
2.4
The input voltage of the receiver must keep 100~240V, 50/60Hz.
2.5 At first worker must turn on the SET by using Power Only Key.
2.6
The receiver must be operated for about 5 minutes prior to the adjustment when module
is in the circumstance of over 15
In case of keeping module is in the circumstance of 0°C, it should be placed in the
circumstance of above 15°C for 2 hours
In case of keeping module is in the circumstance of below -20°C, it should be
placed in the circumstance of above 15°C for 3 hours,.
Caution) When still image is displayed for a period of 20 minutes or longer (especially where
W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some
afterimage in the black level area.
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3. Adjustment items
3.1 Main PCB check process
MAC Address Download
Adjust 480i Comp1
Adjust 1920*1080p Comp1, RGB
EDID/DDC download
Above adjustment items can be also performed in Final Assembly if needed. Both
Board-level and Final assembly adjustment items can be check using In-Star Menu
1.ADJUST CHECK.
3.2 Final assembly adjustment
White Balance adjustment
RS-232C functionality check
PING Test
Local Dimming Function Check
Factory Option setting per destination
Ship-out mode setting (In-Stop)
3.3 Etc
Ship-out mode
Service Option Default
USB Download(S/W Update, Option, Service only)
ISP Download (Option)
4. Automatic Adjustment
4.1 MAC Address
4.1.1 Equipment & Condition
Play file: Serial.exe
MAC Address edit
Input Start / End MAC address
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4.1.2 Download method
4.1.2.1 Communication Port connection
PCBA
PC(RS-232C)
RS-232C Port
Connect: PCBA Jig-> RS-232C Port== PC-> RS-232C Port
4.1.2.2 MAC Address Download
Com 1,2,3,4 and 115200(Baudrate)
Port connection button click(1)
Load button click(2) for MAC Address write.
Start MAC Address write button(3)
Check the OK Or NG
4.2 LAN PORT (Automatic IP)
4.2.1 Equipment & Condition
Each other connection to LAN Port of IP Hub and Jig
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4.3.1. Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test
Program.
*IP Number : 12.12.2.2
4.3.2. LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
4.4 Model name & Serial number Download
4.4.1 Model name & Serial number D/L
Press “Power on” key of service remocon.(Baud rate : 115200 bps)
Connect RS232 Signal Cable to RS-232 Jack.
Write Serial number by use RS-232.
Must check the serial number at Instart menu.
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5. Manual Adjustment
5.1 White Balance Adjustment
5.1.1 Overview
W/B adj. Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works: When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic
Range. In order to prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find the desired value.
-Adj. condition : normal temperature
1) Surrounding Temperature: 25±5
2) Warm-up time: About 5 Min
3) Surrounding Humidity: 20% ~ 80%
5.1.2 Equipment
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is needed)
3) Adjust Remocon
4) Video Signal Generator MSPG-925F 720p/216-Gray(Model:217, Pattern:78)
Only when internal pattern is not available
Color Analyzer Matrix should be calibrated using CS-1000
5.1.3 Equipment connection MAP
Color Analyzer
Probe
Computer
RS-232C
Pattern Generator
Signal
Source
※If TV internal pattern is used, not needed
RS-232C
RS-232C
5.1.4 Adj. Command (Protocol)
<Command Format>
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS A
STOP
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- LEN: Number of Data Byte to be sent
- CMD: Command
- VAL: FOS Data value
- CS: Checksum of sent data
- A: Acknowledge
Ex) [Send: JA_00_DD] / [Ack: A_00_okDDX]
RS-232C Command used during auto-adj.
RS-232C COMMAND
Explanation
[CMD ID DATA]
wb 00 00 Begin White Balance adj.
wb 00 10 Gain adj.(internal white pattern)
wb 00 1f Gain adj. completed
wb 00 20 Offset adj.(internal white pattern)
wb 00 2f Offset adj. completed
wb 00 ff End White Balance adj.
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(endc)) -> Off-set adj.
wb 00 ff ->End white balance auto adj.
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Adj. Map
Adj. item Command
(lower caseASCII)
Data Range
(Hex.)
Default
(Decimal)
Details
CMD1 CMD2 MIN MAX
Cool
R Gain j g 00 C0 TBD
G Gain j h 00 C0 TBD
B Gain j i 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Medium
R Gain j a 00 C0 TBD
G Gain j b 00 C0 TBD
B Gain j c 00 C0 TBD
R Cut TBD
G Cut TBD
B Cut TBD
Warm
R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
G Cut TBD
5.1.5 Adj. method
5.1.5.1 Auto adj. method
1) Set TV in adj. mode using ADJ key
2) Zero calibrate probe then place it on the center of the Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sing), check adj. status pre mode
(Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
W/B Adj. must begin as start command “wb 00 00” , and finish as end command “wb 00 ff”,
and Adj. offset if need
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5.1.5.2 Manual adj. method
1) Set TV in Adj. mode using ADJ key
2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within
10cm of the surface..
3) Press ADJ key Æ EZ adjust using adj. R/C Æ 7. White-Balance then press the cursor to the
right (KEY).
(When KEY() is pressed 216 Gray internal pattern will be displayed)
4) One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet
the desired value.
5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of color temperature.
If internal pattern is not available, use RF input. In EZ Adj. menu 7.White Balance, you can
select one of 2 Test-pattern: ON, OFF. Default is inner(ON). By selecting OFF, you can
adjust using RF signal in 216 Gray pattern.
Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.
2) Probe location
- PDP: Color Analyzer (CA-100, CA-100+, CA210) probe should be firmly attached to the
Module
- LCD: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the
module surface (80°~ 100°)
3) Aging time
- After Aging Start, Keep the Power ON status during 5 Minutes.
- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
5.1.6 Reference (White Balance Adj. coordinate and color temperature)
Luminance: 216 Gray
Standard color coordinate and temperature using CS-1000 (over 26 inch)
Mode
Cool
Coordinate
x y
Temp
0.269 0.273 13000K
uv
0.0000
Medium 0.285 0.293 9300K 0.0000
Warm 0.313 0.329 6500K 0.0000
Standard color coordinate and temperature using CA-210(CH 14)
Mode
Cool
0.269±0.002 0.273±0.002 13000K
Coordinate
x y
Medium 0.285±0.002 0.293±0.002 9300K 0.0000
Warm 0.313±0.002 0.329±0.002 6500K 0.0000
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C
Temp uv
0.0000
LGE Internal Use Only- 15 -
1) Edge LED Models : LV5500/LV4500/LW6500/LW5500/LV2500
Aging time Cool Medium Warm
GP3
1
2
3
4
5
6
7
8
9
(Min) x y x y x y
0-2
3-5 6-9
10-19
20-35
36-49
50-79
80-149
Over 150
269 273 285 293 313 329
279 288 295 308 319 338
278 286 294 306 318 336
277 285 293 305 317 335
276 283 292 303 316 333
274 280 290 300 314 330
272 277 288 297 312 327
271 275 287 295 311 325
270 274 286 294 310 324
269 273 285 293 309 323
5.1.7 Local Dimming Inspection (Optional) Edge LED models with local dimming
1) Press ‘TILT” key of the Adj. R/C and check moving patterns. The black bar patterns moves from
bottom to top.
If local dimming function does not work, a whole screen shows full white.
5.2 EYE-Q function check
Step 1) Turn on TV
Step 2) Press EYE key of Adj. R/C
Step 3) Cover the Eye Q II sensor on the front of the using your hand and wait for 6 seconds
Step 4) Confirm that R/G/B value is lower than 10 of the “Raw Data (Sensor data, Back light )” . If after
6 seconds, R/G/B value is not lower than 10, replace Eye Q II sensor
Step 5) Remove your hand from the Eye Q II sensor and wait for 6 seconds
Step 6) Confirm that “ok” pop up.
If change is not seen, replace Eye Q II sensor
Copyright 2011 LG Electronics.Inc.All right reserved. Only for training and service purposes
C
LGE Internal Use Only- 16 -
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