Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°
F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
This specification sheet is applied to all of the LCD TV with
LD01U chassis.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 ºC ± 5 ºC
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig equipment, Service remote control.
7) Push The “IN STOP” key - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between
computer, jig, and set.
3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD
1) Put the USB Stick to the USB socket
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message “Copying files from memory”
filexxx.bin
(4)
(7) ……….OK
(5)
(6)
(1)
fil exxx.bi n
(2)
(3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
4) Updating is staring.
5) Uploading completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and
Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote controller
2) Select “Tool Option 1” and Push “OK” button.
3) Punch in the number. (Each model has their number)
4) Completed selecting Tool option.
3.1. ADC Process
(1) ADC
- Enter Service Mode by pushing “ADJ” key,
- Enter Internal ADC mode by pushing “
G
” key at “5. ADC
Calibration”
<Caution> Using ‘power on’ button of the Adjustment R/C,
power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode
* Required equipment : Adjustment R/C.
3.2. Function Check
* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART1/SCART2/CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60 Hz)
5) HDMI
6) PC Audio In
* Display and Sound check is executed by Remote control.
Adjust ‘Mode In’AA0 0 When transfer the ‘Mode In’,
Carry the command.
ADC AdjustAD1 0 Automatically adjustment
(The use of a internal pattern)
EZ ADJUT
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Country Group
5. ADC Calibration
6. White Balance
7. Test Pattern
8. EDID D/L
9. Sub B/C
10. V-Com
11. P-Gamma
ADC Calibration
ADC Comp 480i
ADC Comp 1080p
ADC RGB
NG
NG
NG
Reset
Start
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210
: CCFL/EEFL -> CH9, Test signal: Inner pattern(80IRE)
LED -> CH14, Test signal: Inner pattern(80IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
· Edge LED W/B Table is process of time (Only LGD Module)
CA210: CH14, Test signal : Inner pattern(80IRE)
* Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER ON ->
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10 cm distance, keep it with the surface of the
Module and Color Analyzer’s prove vertically.(80° ~ 100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
• Auto adjustment Map(RS-232C)
RS-232C COMMAND
[CMD ID DATA]
Wb 0000White Balance Start
Wb 00ffWhite Balance End
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “
G
” key at “6. White
Balance”.
* After you finished all adjustments, Press “In-start” key and
compare Tool option and Area option value with its BOM, if
it is correctly same then unplug the AC cable. If it is not
same, then correct it same with BOM and unplug AC cable.
For correct it to the model’s module from factory Jig model.
* Push the “IN STOP” key after completing the function
inspection. And Mechanical Power Switch must be set
“ON”.
4.2. DDC EDID Write (RGB 128Byte )
• Connect D-sub Signal Cable to D-sub Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.3. DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
A The Vcom (Common Voltage) is a Reference Voltage of
Liquid Crystal Driving.
-> Liquid Crystal need for Polarity Change with every frame.
- Adjust sequence
· Press the PIP key of th ADJ remote control.(This PIP key is
hot key to enter the VCOM adjuting mode)
(Or After enter Service Mode by pushing “ADJ” key, then
Enter V-Com Adjust mode by pushing “
G” key at “10. V-
Com”.)
· As pushing the right or the left key on the remote control,
and find the V-COM value which is no or minimized the
Flicker. (If there is no flicker at default value, Press the exit
key and finish the VCOM adjustment.)
· Push the “OK” key to store value. Then the message “Saing
OK” is pop.
· Press the exit key to finish VCOM adjustment.
(Visual Adjust and control the Voltage level)
4.6. Outgoing condition Configuration
- When pressing IN-STOP key by SVC remocon, Red LED are
blinked alternatively. And then Automatically turn off.
(Must not AC power OFF during blinking)
4.7. Hi-pot Test
Confirm whether is normal or not when between power
board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2
kV(dc) for one second.
5. Model name & Serial number D/L
• Press “Power on” key of service remocon.
(Baud rate : 115200 bps)
• Connect RS232 Signal Cable to RS-232 Jack.
• Write Serial number by use RS-232.
• Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
5.1. Signal TABLE
CMD : A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n
Delay : 20ms
5.2. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0,
Phase
Data write : Model Name and Serial Number write in
EEPROM,.
5.3. Method & notice
A. Serial number D/L is using of scan equipment.
B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
If the TV set is downloaded by OTA or Service man, Sometimes
model name or serial number is initialized.(Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘5.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
4) Check the model name Instart menu -> Factory name
displayed (ex 42LD450-ZA)
5) Check the Diagnostics (DTV country only) -> Buyer model
displayed (ex 42LD450)
6. CI+ Key Download method
(1) Download Procedure
1) Press "Power on" button of a service remote control.
(Baud rate : 115200 bps)
2) Connect RS232-C Signal Cable.
3) Write CI+ Key through RS-232-C.
4) Check whether the key was downloaded or not at ‘In
Start’ menu. (Refer to below).
=> Check the Download to CI+ Key value in LGset.
1. check the method of CI+ Key value
a. check the method on Instart menu
b. check the method of RS232C Command
1) into the main ass’y mode (RS232 : aa 00 00)
2) check the key download for transmitted command
(RS232 : ci 00 10)
3) result value
- normally status for download : OKx
- abnormally status for download : NGx
2. Check the method of CI+ Key value (RS232)
1) into the main ass’y mode (RS232 : aa 00 00)
2) Check the method of CI+ key by command (RS232 :
ci 00 20)
3) Result value
i 01 OK 1d1852d21c1ed5dcx
7. Local Dimming Function Check
Step1) Turn on TV.
Step2) Press “P-only” key, entrance to power only mode and
Press “Exit” key
Step3) Press “Tilt” key, entrance to Local Dimming mode.
Step4) At the Local Dimming mode, module Edge Backlight
moving right to left Back light of module moving
Step5) confirm the Local Dimming mode
Step6) Press “Exit” key
LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.
Only for training and service purposes
300
500
510
120
A10
200
800
530
550
810
900
910
540
521
400
A21
A2
A5
LV1
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
/F_RB
/PF_OE
/PF_CE0
+3.3V_Normal
OPT
R104
B
3.3K
R102
NAND_FLASH_1G_HYNIX
EAN35669102
IC102-*1
H27U1G8F2BTR-BC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
IC103-*1
CAT24C08WI-GT3-H-RECV(TV)
NC_1
NC_2
VSS
8
1
7
2
A2
6
3
5
4
10K
C
E
VCC
WP
SCL
SDA
/PF_CE1
PF_ALE
/PF_WE
Q101
KRC103S
OPT
+3.3V_Normal
1K
R109 3.9K
R107
C101
OPT
R1081K
0.1uF
VDD_1
VSS_1
R105
1K
OPT
R106
1K
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
NAND_FLASH_1G_SS
EAN61857001
K9F1G08U0D-SCB0
NC_1
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
NC_2
NC_3
NC_4
NC_5
NC_6
R/B
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
CLE
ALE
NC_11
NC_12
NC_13
NC_14
NC_15
1
2
3
4
5
6
7
RE
8
CE
9
10
11
12
13
14
15
16
17
WE
18
WP
19
20
21
22
23
24
HDCP_EEPROM_ON_SEMI_NEW
C105
0.1uF
+3.3V_Normal
C104
8pF
OPT
C106
8pF
OPT
HDCP EEPROM
HDCP_EEPROM_CATALYST_OLD
R113
4.7K
CAT24WC08W-T
A0
A1
A2
VSS
IC103
1
$0.199
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
R127 4.7K
+3.3V_Normal
R128
R129 22
C107
0.1uF
Addr:10101--
22
I2C_SCL
I2C_SDA
EEPROM
EEPROM_1MBIT_ST
IC104
M24M01-HRMN6TP
NC
1
E1
2
E2
A0’h
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R11122
R11222
<T3 CHIP Config(AUD_LRCH)>
Boot from SPI flash : 1’b0
Boot from NOR flash : 1’b1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HIGH
FRC_HW_OPT
100/120Hz LVDS
PHM_ON
DVB_T2
FHD
default
OLED
W2
W1
V2
IP
V1
IM
Y2
Y1
U3
QP
V3
QM
Y5
Y4
U1
U2
R3
T3
T2
T1
G14
G13
B7
A7
AF17
AE17
F14
F13
F15
D20
E20
D19
F18
E18
D18
E19
N1
P3
P1
P2
P4
P5
R6
T6
U5
V5
U6
V6
U4
W3
W4
V4
Y3
W5
R4
T5
R5
T4
P7
VRM
R7
VAG
P6
VRP
R1
R2
E21
E22
D21
F21
E23
D22
F22
D23
F23
F8
G8
K8
A4
Y17
NO_FRC : LOW LOW
U3_INTERNAL : HIGH LOW
U5_EXTERNALBOOT :HIGH HIGH
reserved for FRC : LOW HIGH
--> This option is only applied in EU.
In case of NON_EU, default value set LOW.
-->In case of GP2, This port was used for GIP/NON_GIP
--> MODEL_OPT_5, MODEL_OPT_6
: Only 3D_SG GPIO OUTPUT CONTROL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PWM_BUZZ/IIC_LED :Using IIC for LED Breathing & PWM Buzz
PWM_LED : Using PWM Signal for LED Lighting
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MODEL OPTION
PIN NO.
8
11
PWM_BUZZ/IIC_LED
30
31
HIGH
B/L_LED
TOUCH_KEY
GP2
LOW
B/L_LAMP
PWM_LED
TACT_KEY
GP3
MODEL_OPT_0
LOW
LOW
LOW : LED
HIGH : LAMP
MODEL_OPT_1
LOW
LOW
HIGH
HIGH
Low
MODEL_OPT_2
LOW
LOW
HIGH
LOW
HIGH
MODEL_OPT_3
LOW
HIGH
LOW
LOW
LOW
Description
LK330/LK430 for KR/US
10Y EYE-Q Sensor
KEY & PWM LED & No Buzz & No LED Blink
LK330/LK430/LK530
KEY & PWM LED & No Buzz & No LED Blink
LV25/LV35/LV45/LW45/LV55/LK45/LK55
S/T & IIC LED & NO BUZZ & LED Blink
IIC LED(09Y IIC Protocol) & No BUZZ
S/T & IIC LED & No Buzz & LED Blink
TBD
TBD
R10 41
R10 37
22
22
R10 68
R10 69
IR
OCD1A
POWER_DET
LED_R/BUZZ
LED_B/LG_LOGO
NEC_ISP_Rx
NEC_ISP_Tx
S7_NEC_RXD
S7_NEC_TXD
POWER_ON/OFF2_2
MODEL OPTION
PIN NAME
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
PWM_BUZZ/IIC_LED : For model that use LED Lighting used IIC
PWM_LED : For model that use LED Lighting used PWM Signal
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
31
SHIELD
TU3701
TDFR-C036D
close to TUNER
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_4
16
SCL
17
SDA
ERR
SYNC
VALID
MCL
D0
D1
D2
D3
D4
D5
D6
D7
R3701 100
FULL_NIM
18
19
20
21
22
23
24
25
26
27
28
29
30
R3705 0
C3701
0.1uF
16V
R3707 0
C3706
0.1uF
16V
C3702
0.1uF 16V
C3737
100pF
50V
FULL_NIM
R3702 100
close to IF line
RF_SW_OPT
OPT
close to TUNER
+1.2V/+1.8V_TU
FULL_NIM
C3738
C3705
0.1uF
16V
100uF
16V
+5V_TU
C3704
C3703
0.1uF
100pF
16V
50V
close to the tuner pin, add,09029
CONTROL_ATTEN
CN
C3739
10uF
6.3V
Close to the tuner
Pull-up can’t be applied
because of MODEL_OPT_2
C3728
0.1uF
16V
OPT
+3.3V_TU
C3707
100pF
50V
HALF_NIM
R3760 0
R3761 0
HALF_NIM
FULL_NIM_CHINA
FULL_NIM
FULL_NIM
FULL_NIM_CHINA
RF_SWITCH_CTL
C3731
10uF
10V
OPT
C
Q3704
2SC3052
OPT
E
C3708
0.1uF
16V
R3724
FULL_NIM
R3730
FULL_NIM
R3731
FULL_NIM
R3725
FULL_NIM
FULL_NIM
FULL_NIM
FULL_NIM
R3727
R3728
R3729
R3726
R3721
R3722
R3723
Close to the CI Slot
R3706
FULL_NIM_BR
OPTION : RF AGC
R3754
10K
B
OPT
R3732
100
IF_N_MSTAR
IF_P_MSTAR
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
0
0
0
0
0
0
0
0
0
0
0
0
FE_AGC_SPEED_CTL
IF_AGC_SEL
TU_I2C_NON_FILTER
+3.3V_TU
R3733
100K
C3710
0.1uF
16V
FE_TS_SYNC
FE_TS_VAL_ERR
FE_TS_CLK
TU_I2C_NON_FILTER
C3711
18pF
50V
TUNER_RESET
R3704
FE_TS_DATA[0]
FE_TS_DATA[1]
FE_TS_DATA[2]
FE_TS_DATA[3]
FE_TS_DATA[4]
FE_TS_DATA[5]
FE_TS_DATA[6]
FE_TS_DATA[7]
GPIO must be added.
33
TU_I2C_NON_FILTER
C3713
33
TU_I2C_NON_FILTER
18pF
50V
TU_I2C_FILTER
C3711-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3735-*1
COIL
0
HALF_NIM
BOOSTER_OPT
TU_IIC_NON_ATSC_SANYO
R3740-*1
1K
TU_IIC_ATSC_SANYO
R3735
R3736
C3742
20pF
TU_I2C_FILTER
50V
C3713-*1
20pF
50V
TU_I2C_FILTER
TU_I2C_FILTER
R3736-*1
C3743
20pF
50V
COIL
IF_AGC_MAIN
should be guarded by ground
C3712
22pF
50V
FULL_NIM
FE_TS_DATA[0-7]
FULL_NIM_BR
TU3701-*2
TDFR-B036F
RF_S/W_CNTL
1
BST_CNTL
2
+B1[5V]
3
NC_1[RF_AGC]
4
NC_2
5
SCLT
6
SDAT
7
NC_3
8
SIF
9
NC_4
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_5
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
31
SHIELD
+5V_TU
C3709
0.01uF
25V
+3.3V_TU
R3740
1.2K
L3701
BLM18PG121SN1D
BOOSTER_OPT
R3734
0
Q3701
ISA1530AC1
E
B
C
BOOSTER_OPT
TU_IIC_ATSC_SANYO
R3741
1.2K
FULL_NIM
C3714
22pF
50V
FULL_NIM
BOOSTER_OPT
BOOSTER_OPT
R3737
2.2K
C
Q3702
2SC3052
E
TU_IIC_NON_ATSC_SANYO
R3741-*1
1K
TU_SCL
TU_SDA
+3.3V_TU
R3742
4.7K
R3744
4.7K
FULL_NIM
CN_2INPUT_H_ALTO
31
SHIELD
BOOSTER_OPT
R3743
10K
B
BOOSTER_OPT
TU3701-*4
TDFR-C236D
RF_S/W_CNTL
1
BST_CNTL
2
+B1[+5V]
3
NC[RF_AGC]
4
NC_1
5
SCLT
6
SDAT
7
NC_2
8
SIF
9
NC_3
10
VIDEO
11
GND
12
+B2[1.2V]
13
+B3[3.3V]
14
RESET
15
NC_4
16
SCL
17
SDA
18
ERR
19
SYNC
20
VALID
21
MCL
22
D0
23
D1
24
D2
25
D3
26
D4
27
D5
28
D6
29
D7
30
BOOSTER : CHINA OPT
BOOSTER_OPT
R3745
10K
The pull-up/down of LNA2_CTL
is depended on MODLE_OPT_1.
GPIO must be added for FE_BOOSTER_CTL
R3749 0
DEMOD_SCL
DEMOD_SDA
FE_BOOSTER_CTL
LNA2_CTL
R3750
1K
OPT
+5V_Normal
+5V_TU
R3751
220
B
+3.3V_TU
C3717
0.1uF
16V
R3752
220
E
Q3703
ISA1530AC1
C
Please, check multi Item! 10/12
FULL_NIM_SEMTEK
R3769 10K
L3704
FULL_NIM_BCD
200mA
IC3703-*1
AP1117EG-13
OUTIN
ADJ/GND
HALF_NIM_1.2V_DIODES
R3771 10K
FULL_NIM_BCD
R3770 10K
FULL_NIM_BCD
+5V_TU
C3719
22uF
10V
TUNER_L
R3753
4.7K
TU_CVBS
HALF_NIM_1.2V_BCD
AZ1117BH-ADJTRE1
INPUT
IC3701
AP2132MP-2.5TRG1
PG
1
FULL_NIM_BCD
EN
2
VIN
3
VCTRL
4
IC3701-*1
SC4215ISTRT
NC_1
1
FULL_NIM_SEMTEK
EN
2
VIN
3
NC_2
4
MLB-201209-0120P-N2
C3724
0.1uF
16V
GP2R
+5V_TU
R3755
470
E
B
Q3705
C
IC3703
ADJ/GND
3
1
2
HALF_NIM
OUTPUT
R3768
1.2K
R1
[EP]
GND
8
ADJ
9
7
THERMAL
VOUT
6
NC
5
GND
8
ADJ
7
VO
6
NC_3
5
+5V_TUNER
L3702
C3722
22uF
16V
location movement,0929
R3758
82
TU_SIF
ISA1530AC1
DEMOD_RESET
This was being applied to the only china demod,
so this has to be deleted in both main and ISDB sheet.
R2
HALF_NIM
R3767
+1.2V/+1.8V_TU
10
HALF_NIM
R3766
1
1/10W
HALF_NIM
FULL_NIM_BCD
R3748-*1
10K
FULL_NIM_SEMTEK
R3748
5.1K
R1
R3747
9.1K
FULL_NIM
1005
R2
C3740
0.1uF
16V
C3741
10uF
10V
HALF_NIM
+1.2V/+1.8V_TU
FULL_NIM
C3729
0.1uF
16V
Vo=0.8*(1+R1/R2)
C3726
0.1uF
16V
+3.3V_TU
60mA
Size changeSize change
L3703
MLB-201209-0120P-N2
C3725
C3723
0.1uF
22uF
16V
10V
20101023
14
R3703
150
OPT
380mA
R3764
0
1/10W
FULL_NIM
FULL_NIM
C3730
10uF
10V
+3.3V_Normal
C3715
22uF
10V
Add,0929
C3727
0.1uF
16V
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