Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
This spec sheet is applied all of the LCD TV with LB91A
chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C±5 °C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote controller.
(7) Push The “IN STOP KEY” – For memory initialization.
3.Main PCB check process
# APC - After Manual-Insert, executing APC
3.1 Boot file Download
1. Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2. Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between computer,
jig, and set.
3. Click “Read” tab, and then load download file (XXXX.bin) by
clicking “Read”
4. Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
5. Click “Auto” tab and set as below
6. Click “Run”.
7. After downloading, check “OK” message.
LGE Internal Use Only
- 10 -
ADJUSTMENT INSTRUCTION
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push “Instop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover channel
information by itself.
3. After function inspection, Push “In-stop” key.
(4)
filexxx.bin
(1) (3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
filexxx.bin
(7)
(5)
(8) ……….OK
(6)
3.2 USB DOWNLOAD(*.epk file download)
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work.
But your downloaded version is High, USB data is
automatically detecting
3. Show the message “Copying files from memory”
4. Updating is staring.
5. Updating Completed, The TV will restart automatically.
6. If your TV is turned on, check your updated version and Tool
option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t have
a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "IN-START" key in service remote controller.
2. Select "Tool Option 1" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option.
3.3 ADC Process
3.3.1 ADC
• Input signal : Component
• Signal equipment displays.
Adjustment pattern
-Component 480I
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator( MSPG-925 SERISE)
• Input Signal : RGB (You don’t need to connect RGB Cable)
Because We use TV internal pattern
• After enter Service Mode by pushing “ADJ” key,
• Enter Internal ADC mode by pushing “” key at “5. ADC
Calibration”
* Caution
Using ‘power on’ button of the Adjustment R/C , power on TV.
3.3.2 ADC Calibration Protocol (RS232)
* Adjustment can be done using only external ADC
* Required equipment : Adjustment R/C.
3.4 Function Check
3.4.1 Check display and sound
• Check Input and Signal items. (cf. work instructions)
1. TV
2. AV (CVBS)
3. COMPONENT (480i)
4. RGB (PC : 1024 x 768 @ 60hz)
5. HDMI
6. PC Audio In
* Display and Sound check is executed by Remote controller.
Data0 Data1
1 Main total mode A A 0 0 0 0
2 Change to Component X B 0 0 40
3 Adjust Component A D 0 0 1 0
4 Change to RGB X B 0 0 6 0
5 Adjust RGB A D 0 0 10
4. Total Assembly line process
4.1 Adjustment Preparation
• W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
• Above 5 minutes H/run in the inner pattern. (Power on” key of
adjust remote control)
- Connecting picture of the measuring instrument
(On Automatic control )
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment
R/C POWER-ON -> Enter the mode of White-Balance, the
pattern will come out.
4.1.1 Auto-control interface and directions
1. Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10ux).
2. Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3. Aging time
- After aging start, keep the power on (no suspension of power
supply) and heat-run over 15 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the
back light on.
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range of
Module)
*Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “•” key at “3. White Balance”.
* After done all adjustments, Press “In-start” button and compare
Tool option and Area option value with its BOM, if it is correctly
same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection.
4.2 DDC EDID Write (RGB 128Byte )
• Connect D-sub Signal Cable to D-Sub Jack.
• Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.3 DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.4 EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
300
200
200T
521
530
804
510
120
900
500
540
806
550
802
801
803
805
400
310
200N
A2
LV1
A10
IC102
Copyright ⓒ 2009 LG Electronics Inc. All right reserved.
Only for traning and service purposes
LGE Internal Use Only
NC_1
NC_2
NC_3
NC_4
NC_5
NC_6
NC_7
NC_8
VCC_1
VSS_1
NC_9
NC_10
NC_11
NC_12
NC_13
NC_14
NC_15
R/B
RE
CE
CLE
ALE
WE
WP
+3.3V
VCC
HOLD#
SCLK
SI
HY27US08121B-TPCB
1
Nand Flash
2
3
4
5
6
7
1386 WON
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
EAN38563401
L102
0.1uF
SPI_CK
SPI_DI
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
C102
R120
R117 3.9K
OPT
C101
IC103
Serial Flash
1
$0.76
2
3
4
+3.3V
0.1uF
8
7
6
5
NAND FLASH MEMORY
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
MX25L3205DM2I-12G 32MBIT 4M X 8BIT 2.7VTO3.6V 12NSEC UNIFORM SECTOR SOIC(EIAJ) ST 8P MACRONIX INTERNATIONAL CO.,LTD.
1K
R112
R113 1K
R114
1K
MX25L3205DM2I-12G
R115
4.7K
CS#
SO
R109
33
WP#
GND
EAN39050401
NC_28
NC_27
NC_26
NC_25
I/O7
I/O6
I/O5
I/O4
NC_24
NC_23
PRE
VCC_2
VSS_2
NC_22
NC_21
NC_20
I/O3
I/O2
I/O1
I/O0
NC_19
NC_18
NC_17
NC_16
EEPROM
E0
E1
E2
VSS
0
+3.3V
AR102
22
C103
10uF 6.3V
C104 0.1uF
AR103
22
IC101
M24512-WMW6
VCC
8
1
$0.418
2
3
4
EAN43349001
WC
7
SCL
6
SDA
5
M24512-WMW6 512KBIT 64K x 8bit 1.8VTO5.5V 5MSEC SOIC(EIAJ) ST 8P STM
Model OPT Description, 081218 Updated
OPT1
OPT0
FHD
H
L
MODEL OPTION
R226
0
+3.3V
1.2K
R110
1/16W
5%
R111 4.7K
R116 4.7K
/DEMOD_RESET
R107 1.2K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R125
R127
+3.3V
1K
1K
R126
OPT
FHD
1K
R128
OPT
HD
R132
R134
1K
R133
26"UNDER
1K
32"UP
R135
LCD
PDP
1K
1K
R137
HD
1K
R138
FHD
+5V_GENERAL
R118 1.2K
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
OPT
R119 1.2K
FRC
NO FRC
**LH35FD-AA
42/37/32LH20D-AA
26/22LH20D-AA
(Small)
I2C
FE_TUNER_SDA
FE_TUNER_SCL
EEPROM_SDA
EEPROM_SCL
SUB/AMP_SCL
SUB/AMP_SDA
HD/Small
LVDS_CH_B
LVDS_CH_A
Apply +5V_GENERAL and 12V_DIP_DET simultaneously for 26"Inch Up
Apply +5V_GENERAL and 15V_DIP_DET simultaneously for 22"Inch
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN_2
EAX59793902(0)_AUS_MERCURY
For LH20_LH35 MP PCB_090131
AUS_LH20/LH35
EAX59793902(0)
MSTAR_S6
2009.01.31
2 11
Qimonda_1G_DDR
Copyright ⓒ 2009 LG Electronics Inc. All right reserved.
Only for traning and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2
EAX59793902(0)_AUS_MERCURY
For LH20_LH35 MP PCB_090131
AUS_LH20/LH35
EAX59793902(0)
DDR2
2009.01.31
3 11
+5V_TUNER
Copyright ⓒ 2009 LG Electronics Inc. All right reserved.
Only for traning and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUS_LH20/LH35
EAX59793902(0)
TUNER
2009.01.31
4 11
Component and AV(CVBS)
Copyright ⓒ 2009 LG Electronics Inc. All right reserved.
Only for traning and service purposes
LGE Internal Use Only
JK502
0
3E
4E [RD]O-SPRING-S
9E [RD]E-LUG_2
8D [WH]C-LUG-S
9D [WH]E-LUG
8C [RD]C-LUG-S
9C [RD]E-LUG_1
8B [BL]C-LUG-S
9B [BL]E-LUG
3A [GN]CONTACT-S
4A [GN]O-SPRING-S
9A [GN]E-LUG
R533
R5340
[RD]CONTACT-S
D513
30V
C509
OPT
R537
75
C510
OPT
R535
75
C511
OPT
R536
75
IC501
CAT24C02WI-GT3
A0
A1
A2
VSS
D514
30V
ADUC30S03010L_AMODIODE
D515
ADUC30S03010L_AMODIODE
30V
D516
ADUC30S03010L_AMODIODE
30V
D517
ADUC30S03010L_AMODIODE
30V
VCC
1
8
WP
2
7
SCL
3
6
SDA
4
5
C512
0.1uF
16V
R538
2.2K
C514
C513
18pF
18pF
50V
50V
ADMC5M03200L_AMODIODE
OPT
D503
AMOTECH
5.6V
D505
AMOTECH
5.6V
D506
AMOTECH
30V
D509
AMOTECH
30V
D510
AMOTECH
5.6V
D507
AMOTECH
30V
D511
AMOTECH
30V
D508
AMOTECH
5.6V
D504
AMOTECH
5.6V
D512
AMOTECH
5.6V
D519
ENKMC2838-T112
A1
C
A2
R539
2.2K
R540
22
D518
5.6V
1112131415
678
12345
JK501
KCN-DS-1-0089
C515
0.1uF
16V
9
R509
75
10K
10
R541
R510
R511
470K
6H[RD]CONTACT-L
5H[RD]O-SPRING-L
7G[WH]C-LUG-L
6F[YL]CONTACT-L
5F[YL]O-SPRING-L
PPJ228-01
[ PC ]
002:E17
DSUB_VSYNC
DSUB_HSYNC
002:E17
DSUB_B
002:E18
002:E18
DSUB_G
DSUB_R
002:E17
EAX59793902(0)_AUS_MERCURY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INTERFACE
C504
50V
470K
1000pF
C505
50V
1000pF
+3.3V
R516
4.7K
R514
0
R515
0
+3.3V
R517
4.7K
C503
0.1uF
16V
R512
470K
100pF
R513
470K
R544
100
R542
22
D520
ADMC5M03200L_AMODIODE
5.6V
OPT
+3.3V
R545
4.7K
D522
R543
ADMC5M03200L_AMODIODE
0
5.6V
OPT
OPT
16
C506
50V
C507
100pF
50V
SPDIF OPTIC JACK
R500
SPDIF_OUT
10K
R518
10K
R519
+5V_ST
R520
10K
R521
10K
R5310
R5320
EDID_WP
ISP_RXD
ISP_TXD
DSUB_DET
COMP1_R_IN
002:S13
COMP1_L_IN
002:S13
COMP1_Pr_IN
002:E15
COMP1_Pb_IN
002:E16
COMP1_DET
001:AJ20
COMP1_Y_IN
002:E15
AV1_CVBS_IN
AV1_DET
AV1_L_IN
AV1_R_IN
001:Y14
R527
12K
R528
12K
R523
75
R526
1K
R522
75
C508
R524
47pF
75
50V
R525
1K
R529
12K
R530
12K
R546
1K
For LH20_LH35 MP PCB_090131
4.7K
+3.3V
IC500
NL17SZ00DFT2G
A
1
B
2
GND
3
R547
VCC
5
C500
0.1uF
16V
Y
4
0
OPT
PC AUDIO
JK505
PEJ024-01
E_SPRING
3
T_TERMINAL1
6A
B_TERMINAL1
7A
R_SPRING
4
T_SPRING
5
B_TERMINAL2
7B
T_TERMINAL2
6B
SHIELD_PLATE
8
D501
ADMC5M03200L_AMODIODE
5.6V
D502
ADMC5M03200L_AMODIODE
5.6V
R571
22
1/16W
5%
OPT
OPT
C501
100pF
50V
C502
100pF
50V
+3.3V
R573
0
R572
1K
OPT
C516
OPT
100pF
D500
ADMC5M03200L_AMODIODE
R501
470K
R502
470K
R503
15K
R504
15K
50V
+5V_GENERAL
R574
C532
0.1uF
16V
R507
0
R505
10K
R508
0
R506
10K
JK503
JST1223-001
GND
VINPUT
1
VCC
2
3
4
FIX_POLE
0
OPT
AV2(SIDE)
Fib er O pti c
JK504
PPJ218-02
FHD
[YL]O_SPRING
4A
[YL]CONTACT
5A
[YL]U_CAN
2A
[WH]C_LUG
3B
[WH]U_CAN
2B
[RD]O_SPRING
4C
[RD]CONTACT
5C
[RD]U_CAN
2C
D525
AMOTECH
5.6V
R552
0
D526
AMOTECH
30V
D527
AMOTECH
5.6V
D528
AMOTECH
5.6V
R554
75
R555
470K
R556
470K
R558
4.7K
C524
0.1uF
16V
C525
47pF
50V
C526
100pF
50V
C527
100pF
50V
R561
10K
R562
10K
R560
1K
12K
R563
12K
R564
AV2_DET
AV2_CVBS_IN
AV2_L_IN
AV2_R_IN
FHD Option has been applied to this block
SIDE AV-IN_Only LH35
+3.3V
PC_R_IN
002:S15
Side USB
JK508
PC_L_IN
002:S15
KJA-UB-0-0037
REAR USB
5
USB DOW N S TREA M
JK506
KJA-UB-4-0004
5
SIDE USB
DBG_TX
DBG_RX
GND
1
2
3
4
GND
1
2
3
4
+5V_USB
DM
DP
GND
+5V_USB
DM
DP
GND
+5V_ST
C534
10uF
4.7K
REAR USB
C531
100uF
0
R569
REAR USB
0
R570
REAR USB
D523
CDS3C05HDMI1
5.6V
C517
0.33uF
16V
9
ROU T2
R548
R549
4.7K
C518 220pF 50V
C519 220pF 50V
JK507
KCN-DS-1-0088
REAR USB
DOU T28RIN 2
7
10
DIN 2
REAR USB
R568
D524
CDS3C05HDMI1
5.6V
C521
0.33uF
16V
6V-5
IC502
MAX3232CDR
11
12
DIN 1
R551
100
1
0
BLM18PG121SN1D
C520
10uF
10V
RS232C
C2+
C2-
4
13
RIN 1
ROU T1
R553
6
7
2
100
120-ohm
180
C1-2V+
3
14
DOU T1
3
L501
R550
8
OPT
C522
0.33uF
16V
15
GND16VCC
0
OPT
4
R567
0
ILIMIT
0.047uF
IR_OUT
001:AJ26
R557
9
IC503
MIC2019YM6
VOUT
6
5
FAULT
4
EAN60223701
DEVELOPE
C523
25V
C1+
1
D529
ADUC30S03010L_AMODIODE
30V
D530
ADUC30S03010L_AMODIODE
30V
10
5
OPT
OPT
VIN
1
GND
2
ENABLE
3
+5V_ST
C528
0.1uF
50V
+3.3V
USB_CTL
001:AJ26
R559
4.7K
R565
SIDE_USB_DM
SIDE_USB_DP
BLM18PG121SN1D
C529
10uF
10K
R566
47
001:AN8
001:AN8
L502
C530
0.1uF
USB_OCD
001:AI14
+5V_USB
AUS_LH20/LH35
EAX59793902(0)
INTERFACE
2009.01.31
5 11
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