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Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
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Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
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Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 7
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Only for training and service purposes
- 6 -
1. Application Range
This specification sheet is applied to the LCD TV used LA96C
chassis.
2. Specification
Each part is tested as below without special appointment
Caution : When still image is displayed for a period of 20
minutes or longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch),
there can some afterimage in the black level area.
3. Method of PTC MICOM Download
3.1 Connection of MICOM JIG
1) Connect port(3) with Power Code
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)
• Notice!
Because PTC Download JIG has internal memory, it can save
download files using download program (SAP Configuration).
Push the START button (4) after file saving, then it execute
download.
3.2 Execution of download program (SAP
Configuration)
3.2.1 Execution of SAP Configuration
1. Select HCS12
2. Target Frequency Settings :
A. Checking the factor -> Use Specified Target Frequency…,
Don’t check other checking boxes. You must follow fig.
6. Push the ‘Save Image to Cyclone PRO’ button, files
transfer from PC to the Download JIG.
- 9 -
ADJUSTMENT INSTRUCTION
1
2
34
Page 10
- 10 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.3 PTC download by USB
a. Attach the USB Memory to TV
b. MENU > OPTION
-> press left arrow key once
-> press the key ‘7’ for 7 times
c. Select PTC Software.
d. Select downloading file. (*.s19)
e. Downloading.
- When the downloading is completed, TV will reset itself
automatically.
- If you fail to download, retry to download with PC.
- Do not remove USB in downloading.
4. Main PCB check process
* APC - After Manual-Insult, executing APC
4.1 Download
4.1.1 Boot file Download
1. Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2. Set as below, and then click “Auto Detect” and check “OK”
message If display “Error”, Check connect computer, jig,
and set.
3. Click “Read” tab, and then load download file (XXXX.bin) by
clicking “Read”
4. Click “Connect” tab.
If display “Can’t ”, Check connect computer, jig, and set.
5. Click “Auto” tab and set as below
6. Click “Run”.
7. After downloading, check “OK” message.
(3)
filexxx.bin
(1)
(4)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
filexxx.bin
(5)
(7) .OK
(5)
(6)
Page 11
- 11 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
* USB DOWNLOAD(*.epk file download)
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work. But your downloaded version is High, USB data
is automatically detecting
3. Show the message “Copying files from memory”
4. Updating is staring.
5. Updating Completed, The TV will restart automatically.
6. If your TV is turned on, check your updated version and Tool
option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel
recover. if all channel data is cleared, you didn’t have a
DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "Adj" key in service remote controller.
2. Select "Tool Option 1~ 4" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option
4. Board-level adjustment
4.1 ADC adjustment
4.1.1 Overview
ADC adjustment is needed to find the optimum black level and
gain in Analog-to-Digital device and to compensate RGB
deviation.
Protocol Command Set ack
Enter adj.ad 00 00 d 00 OK00x
mode
Begin adj. ad 00 10
Return adj.OKx (Success)
resultNGx (Fail)
Read adj. (main)(main)
dataad 00 20
000000000000000000000000007c007b006dx
(sub ) (Sub)
ad 00 21
000000070000000000000000007c00830077x
Confirm adj. ad 00 99NG 03 00x (Fail)
NG 03 01x (Fail)
NG 03 02x (Fail)
OK 03 03x (Success)
End adj. ad 00 90 d 00 OK90x
Page 12
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- 12 -
5. ADC Process
5.1 PC input ADC
5.1.1 Auto RGB Gain/Offset Adjustment
• Convert to PC in Input-source.
• Signal equipment displays.
Output Voltage : 700 mVp-p
- Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 65 in Pattern Generator (MSPG-925 SERISE)
Adjustment pattern (PC)
• Adjust by commanding AUTO_COLOR_ADJUST.
5.1.2 Confirmation
• We confirm whether “0xAA (RGB)” address of EEPROM
“0xA2” is “0xAA” or not.
• If “0xAA (RGB)” address of EEPROM “0xA2” isn’t “0xAA”, we
adjust once more.
• We can confirm the ADC values from “0xA4~0XA9 (RGB)”
addresses in a page “0xA2”
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ” key, execute “ADC Adjust” by
pushing “•” key at “ 5. ADC Calibration” and click “Start”.
5.2 COMPONENT input ADC
5.2.1 Component Gain/Offset Adjustment
• Convert to Component in Input-source.
• Signal equipment displays.
- Impress Resolution 480i
Page 13
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Only for training and service purposes
- 13 -
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator( MSPG-925 SERISE)
- Impress Resolution 1080p
MODEL: 223 in Pattern Generator(1080p Mode)
PATTERN: 65 in Pattern Generator( MSPG-925 SERISE)
5.2.2 Confirmation
• We confirm whether “0xB3 (480i)/0xBC (1080p)” address of
EEPROM “0xA2” is “0xAA” or not.
• If “0xB3 (480i)/0xBC(1080i)” address of EEPROM “0xA2”
isn’t “0xAA”, we adjust once more.
• We can confirm the ADC values from “0xAD~0XB2
(480i)/0XB6~BB(1080p)” addresses in a page “0xA2”
* Manual ADC process using Service Remocon. After enter
Service Mode by pushing “ADJ” key, execute “ADC Adjust” by
pushing “•” key at “ 5. ADC Calibration” and then click “Start”.
- Impress Resolution 480i/1080p/RGB
5.3 Function Check
5.3.1 Check display and sound
• Check Input and Signal items. ( cf. work instructions)
1.TV
2. AV (CVBS/ S-Video)
3.COMPONENT (480i)
4.RGB (PC : 1024 x 768 @ 60hz)
5.HDMI
6.PC Audio In and H/P Out
* Display and Sound check is executed by Remote controller.
5.4.1 Overview
It is a VESA regulation. A PC or a MNT will display an optimal
resolution through information sharing without any necessity of
user input. It is a realization of “Plug and Play”.
5.4.2 Equipment
• Adj. R/C
• Since embedded EDID data is used, EDID download jig,
HDMI cable and D-sub cable are not need.
5.4.3 Download method
1) Press Adj. key On the Adj. R/C, press Adj. key then select
EDID D/L. By pressing Enter key, EDID download will
begin.
2) If Download is successful, OK is displayed.
3) If Download is a failure, NG is displayed.
4) Re-try download.
5.4.4 EDID DATA
•Reference: Download is only possible in POWER ON MODE.
• HDMI I [C/S: 1DBA]
Page 14
• HDMI II [C/S: 1DAA]
• RGB [C/S: 71FF]
6. Final Assembly adj.
6.1 White Balance adj.
6.1.1 Overview
•W/B adj.: Objective & How-it-works
- Objective: To reduce each Panel’s W/B deviation
- How-it-works : When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range.
In order to prevent saturation of Full Dynamic
range and data, one of R/G/B is fixed at 192,
and the other two is lowered to find the
desired value.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Color Analyzer
Computer
RS-232C
# Pattern Generator
* If TV internal pattern is used,not needed
Signal Source
Probe
RS-232C
RS-232C
START 6E A 50 A LEN A 03 A CMD A 00 A VAL A CS A
STOP
RS-232C COMMAND
[CMD ID DATA]
Explanation
Wb 00 00 Begin White Balance adjust.
Wb 00 10 Begin Gain adjust (internal white pattern)
Wb 00 1f End Gain adjust
Wb 00 20 Begin Offset adjust (internal white pattern)
Wb 00 2f End Offset adjust
Wb 00 ff End White Balance adjust(internal pattern
disappears )
Item Command
(lower case ASCII)
Data Range
(Hex.)
Default
(Decimal)
CMD1 CMD2 MIN MAX
R Gain j g 00 C0 TBD
G Gain j h 00 C0 TBD
B Gain j i 00 C0 TBD
R Cut TBD
G Cut TBD
Cool
B Cut TBD
R Gain j a 00 C0 TBD
G Gain j b 00 C0 TBD
B Gain j c 00 C0 TBD
R Cut TBD
G Cut TBD
Medium
B Cut TBD
R Gain j d 00 C0 TBD
G Gain j e 00 C0 TBD
B Gain j f 00 C0 TBD
R Cut TBD
Warm
G Cut TBD
Page 15
6.1.5 Adj. method
6.1.5.1 Auto adj. method
1) Set TV in adj. mode using POWER On Key
2) Zero calibrate probe then place it on the center of the
Display
3) Connect Cable(RS-232C)
4) Select mode in adj. Program and begin adj.
5) When adj. is complete (OK Sign), check adj. status per
mode (Warm, Medium, Cool)
6) Remove probe and RS-232C cable to complete adj.
• Adj. must begin w/ command “wb 00 00”, and end w/“wb 00
ff”and adj. offset if needed.
6.1.5.2 Manual adj. method
Dynamic contrast : off
Dynamic color : off
OPC : Off
Energy saving mode : Off
1) Set TV Picture Mode to Standard and in Advanced Control,
set Dynamic Contrast and Color ‘Off’.
2) Set TV in adj. mode using POWER On Key
3) Press ADJ key -> EZ adjust using adj. R/C
4) Using CH + / - KEY, select 10.TEST PATTERN then press
Enter to place in HEAT RUN mode and wait for 30 minutes.
5) Zero calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10 cm of the surface.
6) Press ADJ key -> 7. White-Balance then press the cursor
to the right (KEY )
(When is pressed Full White internal pattern will be
displayed)
7) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.
8) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature
•If internal pattern is not available, use HDMI input. In EZ Adj.
menu 7.White Balance, you can select one of 3 options:
None, Inner, HDMI. Default is inner. By selecting HDMI, you
can adjust using HDMI signal.
• Adj. condition and cautionary items
1) Lighting condition in surrounding area
Surrounding lighting should be lower than 10 lux. Try to
isolate adj. area into dark surrounding.
2) Probe location
- LCD: Color Analyzer (CA-210) probe should be within 10cm
and perpendicular of the module surface (80°~ 100°)
- In case of LCD, B/L on should be checked using no signal or
Full white Pattern
6.1.6 Reference (White Balance adj. coordinate and color
temperature)
6.1.6.1 Adjustment Preparation
• W/B Equipment condition
CA210: CH 9, Test signal: Inner pattern (85IRE)
• Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
• 15 Pin D-Sub Jack is connected to the AUTO W/B
EQUIPMENT.
• Adjust Process will start by execute I2C Command (Inner
pattern (0xF3, 0xFF)).
∆ Manual White Balance adjust process using Service Remo-
con. After enter Service Mode by pushing “ADJ” key, enter
“White Balance” by pushing “•” key at “ 6. White Balance”.
(CA-210, CH-9)
*Adjust “R/G/B - GAIN” by pushing “”, “” key at “Cool”
*Adjust “R/G/B - GAIN” by pushing “”, “” key at “Medium”
*Adjust “R/G/B - GAIN” by pushing “”, “” key at “Warm”
- 15 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Cool 11,000K
X=0.276 ± 0.003
Y=0.283 ± 0.003
Medium 9,300K
X=0.285 ± 0.003
Y=0.293 ± 0.003
Color
Temperature
Warm 6,500K
X=0.313 ± 0.003
Y=0.329 ± 0.003
<Test Signal>
Inner pattern
(216gray, 85 IRE)
Page 16
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 16 -
TROUBLESHOOTING
1. Power-up boot check
Check stand-by Voltage.
P701 10pin : +3.5V_ST
Check X100 clock
Check Power connector
and AC S/W on?
OK
No
OK
Check Q706 Output.
12V, 5V
Replace Power board.
Replace X100.
OK
Check Fuse.
OK
No
Check P701 PWR_ON.
1pin : 3.5V
OK
Re-download software.
No
OK
Check Multi Voltage
P701 7pin : 12V, 2pin : 24V
Replace Power board
No
Replace Mstar(IC100) or Main board
OK
Replace Q706
No
Check inverter control & error
P701 24pin : Low
P701 18pin : high
OK
Check Power board or Module
No
Check Mstar LVDS output
R812, R813,..., R821
Replace Mstar(IC100) or Main board
No
OK
Page 17
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17 -
2. Digital TV Video
Check RF cable & Signal.
Check Tuner 5V Power
IC1001 4pin
OK
OK
Check Check Demodulator Input
Clock(X1005)
Check IC1002
(19",22")Check IC1002.
No
Check IF_P/N Signal
OK
Replace Tuner.
No
Replace X1005.
No
OK
Check Mstar LVDS output
R812, R813,..., R821
Check IC1004(LGDT) Output
- AR1070, AR1071
OK
Replace IC1004.
No
Replace Mstar(IC100) or Main board.
No
3. Analog TV Video
Check RF cable.
Check Tuner 5V Power.
IC1001 4pin
OK
Check CVBS signal.
TU1001 #19 Pin
Check IC1002
Check IC1005(19",22")
No
OK
Bad Tuner.
No
OK
Check Mstar LVDS outputReplace Mstar(IC100) or Main board.
No
Page 18
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
4. Component Video
Check Component Cable.
Check JK1200.
OK
Check input signal format.
Is it supported?
OK
Replace Jack.
No
OK
Check Mstar LVDS outputReplace Mstar(IC100) or Main board.
No
5. RGB Video
Check RGB Cable conductors for
damage.
Check JK1204.
OK
OK
Check input signal format.
Is it supported?
OK
Check signal R/G/B/H/V-Sync
C113, C108, C114, R146, R149
Replace Jack.
No
Check EDID.
OK
Replace the defective IC or re-download EDID data
No
Check other set.
If no problem, check signal line.
No
OK
Check Mstar LVDS outputReplace Mstar(IC100) or Main board.
No
Page 19
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19 -
6. AV Video
Check AV Cable for damage or open conductor.
Check JK1200(*JK1202).
OK
Check input signal format.
Is it supported?
OK
Replace Jack.
No
OK
Check Mstar LVDS outputReplace Mstar(IC100) or Main board.
No
Check HDMI Cable conductors for
damage of open conductor.
Check JK500, 501, 502
OK
OK
Check input signal format.
Is it supported?
OK
Check EDID & EEPROM
IC500, 501, 502.
I2C Signal (#5, #6)
Replace Jack.
No
Replace the defective IC or re-download
EDID data.
No
Check HDCP key NVRAM(IC105)
power & I2C Signal (#5, #6)
Replace the defective IC.
No
OK
Check HDMI Signal
Check other set.
If no problem, check signal line.
No
Replace Main board.
No
OK
7. HDMI Video
OK
Check Mstar LVDS output
Replace Mstar(IC100) or Main board.
No
Page 20
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 20 -
8. All Source Audio
Check Mstar I2S Output
R604, R605, R606
Check IC500 Power
*24V, 3.3V, 1.8V.
OK
OK
Make sure you can’t hear any audio.
OK
Check Mstar AUDIO_MASTER_CLK
OK
Check Connector & P600
Check Regulator IC601, IC704
No
Check signal line. Or replace IC100.
No
Replace Mstar(IC100) or Main board.
No
Check Output Signal P600 1, 2, 3, 4 pin.
OK
Replace NTP(Audio AMP) IC500
No
Replace connector if found to be damaged.
No
OK
Check speaker resistance
and connector damage.
Replace speaker.
No
Page 21
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 22 -
BLOCK DIAGRAM
Page 23
- 23 -
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
D-sub RGB
HDMI 1
Side AV
CVBS, L/R
DDR2 (512Mbit)
Qimonda / Hynix
NAND Flash
(256Mb)
Digital AMP
NTP3100A
RS-232C (Ctrl./SVC)
I2S
EEPROM
512Kb
RGB/H/V
Half-NIM Tuner
DDR_Data[0:15], DQS, DM …
Addr.[ ], ctrl. data
MAX3232
Saturn6
Saturn6
(ATSC
(ATSC
US)
US)
MPEG2/4
Linux
Scaler
PIP : x
Headphone(opt)
Data [0 … 7]
IF +/-
SIF
TU_CVBS
Reset / IF_AGC …
SDA/SCL_5V
JTAG
CLK,TDI,TDO,MS,RST
Addr[0…1], CS …
Audio L/R
Audio L/R (for RGB)
HDMI 2
Audio L/R
Out
RX/TXRX/TX
JACK PACK
JACK PACK
at REAR
at REAR
JACK PACK
JACK PACK
at SIDE
at SIDE
SCL, SDA_3.3V
TR Buffer
VSB
Demod.
X-tal
Reset Switch
Reset IC
12MH
z
TS In[0…7]
TS_clk, SOP, Val
H/P Amp.
EEPROM
EEPROM
EEPROM
Data[16:31]
DDR2 (512Mbit)
Qimonda / Hynix
AV
Component 1
Y Pb Pr, L/R
CVBS, L/R
Speaker Out(8ohm)
USB2.0
SCL, SDA_3.3V
IO Expander
SCL,
SDA_3.3V
GPIO
DP/D
M
O.C. Protector
+5V+5V
LCD Module
LVDS
MPEG2,
LINUX
AMP
PTC
MPI Control
RJP
RJP Control
IR OUT
Page 24
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 24 -
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
EXPLODED VIEW
300
510
500
120
200
810
900
806
801
520
802
550
530
803
804
540
805
590
800
400
A5
A10
LV1
A2
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 25
PStoPDF trial version. http://www.oakdoc.com
SIDE_AV
JK1202
PPJ218-01
4A
5A
2A
3B
2B
4C
5C
2C
[YL]O_SPRING
[YL]CONTACT
[YL]U_CAN
[WH]C_LUG
[WH]U_CAN
[RD]O_SPRING
[RD]CONTACT
[RD]U_CAN
OPT
OPT
OPT
D1215
ADUC30S03010L
30V
D1221
ADMC5M03200L
5.6V
L1206
BG2012B080TF
D1213
ADMC5M03200L
5.6V
L1207
BG2012B080TF
D1214
ADMC5M03200L
5.6V
R1238
75
R1248
C1219
100pF
10K
+3.3V
R1246
470K
R1247
470K
L1208
BG2012B080TF
C1224
100pF
C1225
100pF
008:D26
C1227
100pF
OPT
R1254
1K
R1259
10K
50V
R1258
50V
R1264
12K
10K
R1263
12K
SIDEAV_CVBS_IN
009:P28
SIDEAV_SW
008:R33
SIDEAV_L_IN
008:R33
SIDEAV_R_IN
R,G,B PC&DDC
D1223
ENKMC2838-T112
C
+5V_ST_PTC
A1
A2
COMPONENT1,AV1
R1205
R1207
R1210
10K
C1250
R1211
10K
C1252
47pF
100pF
C1251
100pF
50V
12K
12K
AV_R_IN
AV_L_IN
AV_CVBS_IN
008:R32
008:R32
008:D26
IC1200
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
D1242
ADMC5M03200L
L1218
L1217
ADMC5M03200L
D1243
5.6V
5.6V
OPT
OPT
D1245
OPT
[RD]CONTACT-L
[RD]O-SPRING-L
[WH]C-LUG-L
[YL]CONTACT-L
[YL]O-SPRING-L
ADUC30S03010L
30V
JK1200
PPJ228-01
[RD]CONTACT-S
6H
5H
7G
6F
5F
3E
[RD]O-SPRING-S
4E
[RD]E-LUG_2
9E
[WH]C-LUG-S
8D
[WH]E-LUG
9D
[RD]C-LUG-S
8C
[RD]E-LUG_1
9C
[BL]C-LUG-S
8B
[BL]E-LUG
9B
[GN]CONTACT-S
3A
[GN]O-SPRING-S
4A
[GN]E-LUG
ADUC30S03010L
9A
OPT
OPT
OPT
D1208
D1212
ADMC5M03200L
OPT
30V
5.6V
D1211
ADMC5M03200L
5.6V
D1210
ADUC30S03010L
30V
D1209
ADUC30S03010L
30V
OPT
R1245
470K
R1244
470K
R1243
75
R1242
75
R1241
R1251
10K
C1221
1000pF
50V
R1252
10K
C1220
1000pF
50V
75
R1255
12K
R1256
12K
008:D31
COMP1_R_IN
008:R33
COMP1_L_IN
008:R33
COMP1_PR
008:D31
COMP1_PB
008:D31
COMP1_Y
008:D29
008:D29
008:D28
008:D29
008:D29
DSUB_VSYNC
DSUB_HSYNC
DSUB_B
DSUB_G
DSUB_R
BG2012B080TF
R1206
470K
50V
BG2012B080TF
R1208
470K
50V
R1215
75
1%
3
GND
4
R1232
0
0 R1233
ADUC30S03010L
R1234
75
R1235
75
R1236
75
VCC
8
WP
7
SCL
6
SDA
5
D1207
30V
C1216
0.1uF
OPT
C1217
0.1uF
OPT
C1218
0.1uF
OPT
C1222
18pF
50V
D1216
ADUC30S03010L
30V
D1217
30V
D1218
ADUC30S03010L
30V
D1219
ADUC30S03010L
30V
R1249
4.7K
ADMC5M03200L
C1223
18pF
50V
D1222
5.6V
OPT
R1253
4.7K
R1257
22
R1262
10K
R1265
22
C1228
16V
0.1uF
R1269
100
D1224
ADMC5M03200L
5.6V
OPT
SIGN25
0
R1268
OPT
008:AP22;002:S21;002:S8
ISP_TXD
008:AB27;008:AR31
+5V_GENERAL
R1270
OPT
10K
D1225
ADMC5M03200L
5.6V
OPT
EEPROM_WP
ISP_RXD
008:AB27
PC AUDIO
JK1205
PEJ024-01
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
3
6A
7A
4
5
7B
6B
8
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
SHIELD_PLATE
OPT
OPT
D1234
5.6V
ADMC5M03200L
D1235
5.6V
ADMC5M03200L
C1240
100pF
50V
C1241
100pF
50V
R1297
470K
R1298
470K
R1300
10K
R1301
10K
R1304
12K
R1303
12K
R1305
0
R1307
0
PC_R_IN
008:R32
PC_L_IN
008:R31
KCN-DS-1-0089
JK1204
11
12
6
7
1
2
32/37/42 AUO
IN/OUT
13
14
15
8
9
3
4
16
10
5
1
14
Page 26
PStoPDF trial version. http://www.oakdoc.com
HDMI1
22
QJ41193-CFEE1-7F
JK500
HDMI2
22
QJ41193-CFEE1-7F
JK501
2010_PWR BLOCK
PGND
VIN
AGND
AOZ1073AIL
FB
C6001
2.2uF
10V
2010_PWR
C6002
10uF
25V
AOZ1073AIL
FB
R4007
4.7K
IC4000
1
2
3
4
+3.5V_ST
R4009
5.1K
1/10W
5%
2010_PWR
IC4001
1
2
3
4
1%
2010_PWR
C4004
2010_PWR
C6003
47uF
10V
2.2uF
10V
2010_PWR
C4030
100uF
16V
2010_PWR
D4000
MBRA340T3G
40V
2010_PWR
Q4008
Si4800BDY
D8
8
D7
7
D6
6
D5
5
3.3V
1S2
2G2
3S1
4G1
2010_PWR
Q4007
AO4813
1S2
2G2
3S1
4G1
1
2
3
4
2010_PWR
Q4009
AO4813
S1
S2
S3
G
8 D2_2
7 D2_1
6 D1_2
5 D1_1
R4045
2010_PWR
R4046
2010_PWR
8 D2_2
7 D2_1
6 D1_2
5 D1_1
100K
1%
30K
1%
R4047
2010_PWR
+5V_ST
2010_PWR
L4005
22uH
2010_PWR
IC4003
BD9306AFVM
FB
8
R4032
R4031
R4030
2010_PWR
C4015
10uF
25V
2010_PWR
0
0
1K
OPT
COMP
GND
VCC
2010_PWR
C4019
47uF
10V
+5V_ST_PTC
R4039
22K
1K
R4035
R4037
10K
2010_PWR
7
6
5
+5V_ST_PTC
C4021
47uF
10V
2010_PWR
R4042
OPT
22K
OPT
2010_PWR
Q4005
2SC3875S(ALY)
B
1K
R4036
R4038
10K
2010_PWR
2010_PWR
R4034
0
R4033
47K
5V_ST
C
E
R4043
10K
2010_PWR
R4044
OPT
2010_PWR
Q4006
2SC3875S(ALY)
B
C4013
0.1uF
2010_PWR
IC4002
SC632ULTRT
GND
1
C1+
2
C1-
3
IN
4
+5V_ST_PTC
OPT
L6000
2010_PWR
C6004
47uF
10V
R4015
R4018
200
47K
1/10W
1%
5%
LX_2
8
LX_1
7
EN
10K
6
R4024
COMP
5
R4022
11K
1/10W
5%
C4008
1000pF
50V
R4012
27K
1%
2010_PWR
L4003
R4016
3.6uH
+12V
10K
C4010
R4017
2010_PWR
11K
1/10W
5%
47K
2010_PWR
LX_2
8
LX_1
7
EN
6
COMP
5
C4007
1000pF
50V
+12V
10uF
10V
R4021
9
THERMAL
2010_PWR
L4004
3.6uH
2010_PWR
C4014
47K
R4027
10uF
[EP]GND
C2-
8
7
6
5
10V
0.1uFC4011
C2+
OUT
EN
3.3V
2010_PWR
2010_PWR
0.1uFC4018
2010_PWR
C4012
22uF
16V
C4009
2.2uF
10V
009:N25;009:AU17
DCDC_EN
5V_ST
2010_PWR
C4020
22uF
16V
MSTAR_POWER_ON
002:AE6;004:AG4;009:N27
008:AR31;004:Q27;004:T24
POWER_ON/OFF1
MSTAR_POWER_ON
002:AG13;004:AG4;009:N27
2010_PWR
R4041
15K
3.3V
0
R4040
20K
RT
1
C4023
100pF
CT
2
50V
ENB
3
GD
4
5V_ST
2010_PWR
C4027
2.2uF
25V
OPT
C4028
10uF
16V
C
E
EDID
+3.3V_ST
5V_HDMI_1
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
20
21
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
20
21
R552
R501
820
OPT
GND
008:Q29;002:R11
5V_HDMI_2
R502
820
AVRL161A1R1NT
OPT
GND
1K
VR500
AVRL161A1R1NT
R553
1K
VR501
C501
0.1uF
16V
JP504
JP502
R509
R569
R570
R571
R572
R573
R574
R575
R576
C502
0.1uF
16V
R511
R507
R508
R577
R578
R579
R580
R581
R582
R583
R584
JP503
JP505
2SC3052
0
0
0
0
0
0
0
0
0
2SC3052
0R506
0
0
0
0
0
0
0
0
0
0
C
Q504EB
0R510
0
C
Q505EB
R513
10K
008:D39
008:D39
008:D39
008:D39
008:D38
008:D38
008:D38
008:D38
+3.3V_ST
R514
10K
008:D35;002:S7
008:D37
008:D37
008:D36
008:D36
008:D35
R556
47K
OPT
008:D37
DDC_SDA_1
008:D38;002:R20
DDC_SCL_1
008:D37;002:R21
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
R557
47K
OPT
008:D35
008:D35;002:R7
DDC_SDA_2
DDC_SCL_2
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
008:D36
D0+_HDMI2
008:D36
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
008:D36
D2+_HDMI2
HPD2
HPD1
CAT24C02WI-GT3
A0
A1
A2
VSS
EDID
VSS
IC500
1
2
HDMI1
3
4
IC501
CAT24C02WI-GT3
A0
1
A1
2
HDMI2
A2
3
4
A1
D501
ENKMC2838-T112
C509
0.1uF
50V
JP500
C512
8pF
50V
OPT
A1
D502
ENKMC2838-T112
C510
0.1uF
50V
JP501
C513
8pF
50V
OPT
5V_HDMI_1
A2
C
R542
10K
OPT
OPT
5V_HDMI_2
A2
C
R543
10K
OPT
C515
8pF
50V
OPT
C516
8pF
50V
R545
100
R546
100
EEPROM_WP
DDC_SCL_1
DDC_SDA_1
EEPROM_WP
DDC_SCL_2
DDC_SDA_2
+3.5V_ST
C6000
2.2uF
10V
+12V
2010_PWR
L4001
MLB-201209-0120P-N2
C4002
0.1uF
+12V
2010_PWR
L4000
MLB-201209-0120P-N2
C4000
0.1uF
16V
16V
GND
C1+
C1-
IN
2010_PWR
IC6000
SC632ULTRT
1
2
3
4
C4003
22uF
16V
R4050
10K
C4001
22uF
16V
THERMAL
1%
9
R4003
10K
1%
[EP]GND
C2-
8
C2+
7
OUT
6
EN
5
PGND
VIN
AGND
+5V_GENERAL
VCC
8
WP
7
SCL
6
SDA
5
VCC
8
WP
7
SCL
6
SDA
5
R531
R530
22
22
R533
R532
R536
R539
4.7K
4.7K
+5V_GENERAL
R537
R540
4.7K
4.7K
22
22
R4048
C4034
1K
15K
+3.3V
2010_PWR
1%
C4036
220uF
16V
2010_PWR
BLM18PG121SN1D
2010_PWR
C4035
22uF
25V
2010_PWR
100pF
50V
L4009
2010_PWR
C4037
220uF
16V
12V_DCDC
2010_PWR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
004:Q26
Placed on SMD-TOP
C IN
+5V
C732
22uF
16V
Placed on SMD-TOP
+5V_GENERAL
CB3216PA501E
C786
C787
22uF
22uF
L716
CB3216PA501E
Vout=0.8*(1+R1/R2)
C411
56K
560pF
1/10W
50V
1%
R769
18K
1/10W
1%
C733
22uF
OPT
465 mA @85% efficiency
L711
Vout=0.8*(1+R1/R2)
Close to IC
R723
22K
1/10W
1%
R722
75K
1/8W
1%
OPT
+3.3V
R770
Close to IC
R1
R2
D700
OPT
100V
1N4148W_DIODES
R1
R2
GND
OPT
D703
100V
1N4148W_DIODES
FB
IN
BS
008:AR30;004:AM17;005:AA6
POWER_EN
R756
EN/SYNC
SW_2
SW_1
VCC
R421
100K
5%
C737
1uF
10V
OPT
R737
0
OPT
R733
10K
IC704
MP2212DN
FB
1
GND
2
IN
3
BS
4
R734
1/10W
8
7
6
5
10
1%
+1.26 Core for Saturn5
+3.3V
R738
1/10W
IC705
MP2212DN
1
2
$0.24
3
4
R731
OPT
10K
Close to IC
1/8W
EN/SYNC
8
SW_2
7
SW_1
6
VCC
5
R744
0
R724
10
24KR736
C788
1uF
16V
1/10W
10K
4.9A 0.0150OHM 34MHZ
NR8040T3R6N
C789
0.1uF
50V
100
82K
R422
C741
0.1uF
50V
MAX 3A
C790
0.1uF
16V
OPT
$0.07
L726
3.6uH
1uF
10V
C412
L710
3.6uH
NR8040T3R6N
C OUT
C791
22uF
16V
+3.3V
C751
10uF
L720
2009_PWR
BLM18PG121SN1D
C746
0.1uF
6.3V
16V
+1.26V_VDDC
1600 mA
3A, DCR=0.025 ohm
L717
BLM18PG121SN1D
C792
22uF
16V
Placed on SMD-TOP
BLM18PG121SN1D
Placed on SMD-TOP
C793
0.1uF
C750
22uF
16V
L727
CB3216PA501E
+3.3V_FE
C780
0.1uF
16V
+5V_ST ON
+24V_AUDIO
+12V
L734
OPT
Placed on SMD-TOP
C763
22uF
16V
OPT
002:AE6;002:AG13;009:N27
MSTAR_POWER_ON
L735
CB3216PA501E
OPT
Close to IC
C764
22uF
16V
OPT
13K
1/8W
1%
R761
OPT
+5V_EXT
R2
OPT
D704
100V
1N4148W_DIODES
1K
R412
OPT
2009_PWR
2SC3875S(ALY)
R413
10K
Q403
FB
GND
IN
BS
R414
22K
B
MP2212DN
1
2
3
4
+5V_GENERAL
C765
10uF
10V
+5V_ST_PTC
C
E
R415
2.2K
1/10W
IC703
R762
10K
OPT
C766
0.1uF
16V
C405
2.2uF
C767
R763
EN/SYNC
8
SW_2
7
SW_1
6
VCC
5
CB3216PA501E
+5V_ST_PTC
25V
Close to IC
1000pF
OPT
Close to IC
L736
OPT
68K
R1
R764
C768
1uF
10V
OPT
2009_PWR
C406
100uF
16V
008:AR30;004:X17;005:AA6
OPT
R765
100
L737
3.6uH
OPT
C770
0.1uF
50V
OPT
0
OPT
R767
R766
+5V_EXT
C769
1uF
10V
2009_PWR
Q404
AO4813
1S2
2G2
3S1
4G1
C771
22uF
16V
3216
OPT
OPT
10K
OPT
10
37LH250H09.05.19
Power
8 D2_2
7 D2_1
6 D1_2
5 D1_1
POWER_EN
OPT
C772
0.1uF
16V
+5V_GENERAL
4 14
+5V_EXT
+5V_ST
OPT
C773
0.1uF
16V
PI Result
C407
220uF
16V
2009_PWR
Page 29
PStoPDF trial version. http://www.oakdoc.com
TUNER
+5V_TU
L1003
500
C1007
C1005
C1011
17
SHIELD
TU1001
TDVW-H104P
NC_1
1
NC_2
2
GND_1
3
+B1[5V]
4
RF_AGC
5
GND_2
6
DATA
7
CLOCK
8
AS
9
DIF[+]
10
DIF[-]
11
IF_AGC
12
SIF
13
NC_3
14
AUDIF
15
VIDEO
16
R1031
C1008
0.1uF
0.01uF
25V
OPT
C1027
100pF
50V
0
OPT
0.1uF
50V
50V
C1015
100pF
50V
10uF
10V
C1017
100pF
50V
C1013
220uF
16V
R1023
R1022
IF_AGC
R1007
12K
R1009
R1008
10K
R1016
OPT
OPT
47
R1004
2.2K
OPT
C1009
0.01uF
50V
C2250
220uF
16V
+5V_TU
R1013
R1017
4.7K
4.7K
22
22
OPT
C1024
27pF
50V
R1010
470
0
E
B
C
0.1uF
C1021
OPT
L1004
ISA1530AC1
Q1000
R1003
0
SIFMO
OPT
C1025
27pF
50V
6.8uH
MStar Option
R1005
0
R1006
C1012
10K
0.047uF
OPT
50V
R1018
0
OPT
ISA1530AC1
Q1001
+5V_TU
+5V_TU
B
R1026
R1027
R1019
270
R1020
E
C
270
FE_SIF
0
0
L1001
(I2C Channel 6)
FE_TUNER_SDA
FE_TUNER_SCL
50V
0.1uF
C1014
C1004
82pF
50V
R1032
R1033
R1021
0
FM Rejection Option
0
0
FE_VMAIN
008:D24
0
1/10W
5%
0
1/10W
5%
L1013
L1014
C1006
47pF
L1002
270nH
Close to tuner
IF_N
IF_P
LGDT3305
R1061
IF_P
IF_N
R1062
0.1uF
C1066
0.1uF
R1060
SIGN273
1K
IF_AGC
C1067
0.1uF
100
100
C1068
0.01uF
0.01uF
R1063
+3.3V_DVDD_PVSB
C1069
C1070
R1064
1K
TS_0
TS_1
TS_2
TS_3
TS_4
TS_5
TS_6
TS_7
+1.2V_DVDD_PVSB
100
R1065
R1066
R1067
OPT
R1068
5.1K
OPT
0
OPT
OPT
+3.3V_DVDD_PVSB
470
R1069
TS_0
TS_1
TS_2
TS_3
TS_4
TS_5
TS_6
TS_7
C2138
0.1uF
50V
1
2
3
4
5
6
7
8
9
10
11
12
VROA
VINA2
VINA1
INCAP
VSSAAD10A
I2CSEL
ANTCON
VDD
I2CRPT_SCL
I2CRPT_SDA
IF OUT
RF OUT
AR1070
AR1071
48
13
LD1000
C1071
27pF
47
VSSAD10
VCCAAD10A
TPERR
VDD33
14
100
100
X1005
25MHz
46
45
44
XM
VSS
VDD
IC1004
LGDT3305
TPDATA[0]
TPVALID
15
16
17
VSS33
43
XTALO
TPDATA[1]
18
1MR1072
42
XTALI
TPDATA[2]
19
41
VSS33
TPDATA[3]
20
C1072
27pF
0
R1073
40
21
SLIM_SCAN
TPDATA[4]
+3.3V_AVDD_PVSB
R1074
47K
CB3216PA501E
37
38
39
OPM
VDD33
TPDATA[5]
TPDATA[6]
22
23
24
C1073
1uF
10V
+3.3V_AVDD_PVSB
L1219
NRST
36
PLLAVSS
35
PLLAVDD
34
VSS33
33
VSS
32
VDD
31
VSS
30
SCL
29
VDD33
28
SDA
27
NIRQ
26
TPSOP
25
TPCLK
TPDATA[7]
1N4148W
D1000
R1075
OPT
R1076
OPT
VSB_RESET
R1077
22
R1078
22
AR1079
100
1/16W
FE_DEMOD_SCL
FE_DEMOD_SDA
TS_SYNC
TS_CLK
TS_VALID
TUNER 5V
PANEL_POWER
L1012
C1081
0.1uF
16V
INPUT
C1082
100uF
16V
IC1003
AS7809DTRE1
1
2
VCOMO
MStar Option
IC1002
GND2
KIA78R05F
6
1
2VC3
4NC5
VIN
C1036
0.33uF
16V
R1028
100
OPT
OPT
C1037
0.1uF
16V
L1010
OUTPUT
3
C1034
GND
0.1uF
16V
BG2012B800
C1035
100uF
16V
VOUT
GND1
C1039
47uF
16V
C1040
0.1uF
+5V_TU
C1041
0.01uF
25V
The value of coil & cap’ could be changed to optimized each
MLB-201209-0120P-N2
VSB_CTRL
Mercury Option
+5V_GENERAL
L1000
OPT
R1001
4.7K
OPT
C1002
100uF
16V
OPT
008:AR30;004:X17;004:AM17
C1077
2.2uF
25V
R1036
C1078
2.2uF
25V
POWER_EN
R1035
20K
C1076
16V
OPT
R1002
1K
100
OPT
1uF
C1003
0.1uF
50V
OPT
VIN
EN
NC_1
EN
VIN
NC_2
2
1
SC4215ISTRT
1
2
3
4
OPT
IC1001
SC156515M-1.8TR
3
GND
IC1000
8
7
6
5
4
5
GND
ADJ
VO
NC_3
+3.3V_PVSB
VO
R1014
OPT
15K
ADJ
R1015
OPT
8.2K
C1018
100uF
16V
R1011
R1012
V0 = 0.8(R1+R2) / R2
LGDT3305 POWER
+3.3V_FE
L1005
500
C1020
0.1uF
50V
+1.2V_PVSB
R2
20K
R1
10K
C1019
100uF
C1079
0.1uF
16V
50V
VSB +3.3V B+ BLOCK
+3.3V_PVSB
L1007
C1023
10uF
3216
+3.3V_AVDD_PVSB
500
C1026
0.1uF
16V
50V
VSB +1.0V B+ BLOCK
+1.2V_PVSB
R1034
0
1/4W
5%
3216
C1038
10uF
16V
+3.3V_PVSB
L1008
500
C1028
10uF
16V
3216
+1.2V_DVDD_PVSB
C1043
0.1uF
50V
C1044
0.1uF
50V
C1030
0.1uF
+3.3V_DVDD_PVSB
C1032
0.1uF
50V
C1033
0.1uF
50V
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
37LH250H
DDR26 14
09.05.19
Page 31
PStoPDF trial version. http://www.oakdoc.com
LVDS
Except FHD
P800
FI-X30SSL-HF
GND
1
2
TXA1-[9]
TXA1+[8]
TXA2-[7]
TXA2+[6]
TXAC-[5]
TXAC+[4]
TXA3-[3]
TXA3+[2]
TXA4-[1]
TXA4+[0]
0
Except FHD
0
Except FHD
R849
0
Except FHD
0
R850
Except FHD
0
Except FHD
0
Except FHD
R853
0
Except FHD
0
Except FHD
R855
0
Except FHD
0
Except FHD
R847
R848
R851
R852
R854
R856
LVDS_TXA3+
LVDS_TXA3-
LVDS_TXAC+
LVDS_TXAC-
LVDS_TXA2+
LVDS_TXA2-
LVDS_TXA1+
LVDS_TXA1-
LVDS_TXA0+
LVDS_TXA0-
33
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
MDS61887701
GND
GAS1
R857
R858
R860
OPT
R859
OPT
0
0
OPT
0
OPT
0
PWM_DIM
OPC_OUT
LVDS_TXA3+
LVDS_TXA3-
LVDS_TXAC+
LVDS_TXAC-
LVDS_TXA2+
LVDS_TXA2-
LVDS_TXA1+
LVDS_TXA1-
LVDS_TXA0+
LVDS_TXA0-
OPC_EN
LVDS_SEL
PANEL_POWER
008:AF11;004:M20;007:Z21
004:M19;007:Z21
008:AQ28;007:Z20
008:AR30;007:Z21
+3.3V_ST
10K
OPT
R861
0
OPT
R4000
TXA4+[0]
TXA4-[1]
TXA3+[2]
TXA3-[3]
TXAC+[4]
TXAC-[5]
TXA2+[6]
TXA2-[7]
TXA1+[8]
TXA1-[9]
TXA0+[10]
TXA0-[11]
TXB4+[0]
TXB4-[1]
TXB3+[2]
TXB3-[3]
TXBC+[4]
TXBC-[5]
TXB2+[6]
TXB2-[7]
TXB1+[8]
TXB1-[9]
TXB0+[10]
TXB0-[11]
008:AR30;007:O14
LVDS_SEL
PWM_DIM
OPC_OUT
OPC_EN
BIT_SEL
FHD
P801
TF05-51S
+3.3V_ST
OPT
R862
10K
0
OPT
R844
25V
22uF
R863
0R845
OPT
0.1uF
1000pF
C2257
C2258
OPT
0
R841
OPT
0
R840
OPT
0
R842
OPT
0
R843
0
OPT
PANEL_POWER
C2259
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
37LH250H
FPGA
09.05.19
10 14
Page 35
PStoPDF trial version. http://www.oakdoc.com
IR & LED & CONTROL
P1100
12507WS-12L
50V
1000pF
C1104
0.1uF
R1104
R1105
C1106
1000pF
C1105
008:O6;009:Y8
0
0
50V
IR
LED_GR
LED_AM
C1108
16V
009:R32
009:R33
0.1uF
LED_B
1
LED_R
2
GND
3
KEY1
4
KEY2
5
5V_ST
6
GND
7
NC
8
IR
9
GND
10
NC
11
NC
12
13
GND
ZD1111
5.6B
D1101
UDZS5.1B
5.1V
ZD1110
5.6B
D1102
UDZS5.1B
5.1V
ZD1112
5.6B
C1101
100pF
50V
50V
1000pF
C1102
0.1uF
L1100
BG2012B080TF
C1103
BG2012B080TF
BG2012B080TF
L1102
CB3216PA501E
L1103
L1104
+5V_ST_PTC
+5V_ST_PTC
R1110
4.7K
4.7K
R1113
R1115
R1116
100
100
009:AD29
009:AD28
KEY_CTL_0
KEY_CTL_1
RJP
+12V
MLB-201209-0120P-N2
C2220
47uF
25V
L1237
C2221
47uF
25V
JK1100
MJ-657PT-8-SD
9
9
C2222
0.01uF
1
2
3
4
5
6
7
8
Q1118
AO4813
S2
1
2K
2K
C2224
0.01uF
100R2464
100R2465
R2470
100R2466
100R2468
100R2469
OPT
C2256
4.7uF
25V
10K
R2472
5.1K
R2473
5.1K
OPT
5.1VZD1105
C2223
47uF
25V
1
2
R2467
3
4
5
6
7
8
0.01uFC2225
R2471
5.1VZD1106
R2560
100K
R2474
0.01uFC2226
G2
2
S1
3
G1
4
5.1VZD1107
0.01uF
C2227
5.1VZD1108
0.01uFC2228
8
7
6
5
5.1VZD1109
D2_2
D2_1
D1_2
D1_1
0.01uFC2229
RJP_CTRL0
RJP_CTRL1
RJP_CTRL2
RJP_CTRL3
RJP_CTRL4
C2230
47uF
25V
009:N30
009:N31
009:N31
009:N31
009:N31
R2476
10K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
37LH250H
IR&RJP
09.05.19
1114
Page 36
PStoPDF trial version. http://www.oakdoc.com
UART
R925
OPT
012:J8
008:AQ27
012:K17
009:AF26
008:AO31
PTC_RX_MSTAR_5V
PTC_RX_MSTAR
009:Q29;012:Q8
PTC_TX_1
PTC_TX
RX_G6
PTC_DEBUG_TX
+5V_ST_PTC
0R907
0R958
R2521
4.7K
+3.3V_ST
R910
R909
R2522
4.7K
R955
R956
R957
012:C9
PTC_TX_1
+5V_ST_PTC
Q902
2SC3875S(ALY)
B
10KR917
22K
C
E
R922
+5V_ST_PTC
Q903
2SC3875S(ALY)
B
1KR923
R927
22K
C
E
Serial Port
+5V_ST_PTC
+5V_ST_PTC
R921
22K
Q901
C
2SC3875S(ALY)
10KR912
B
+5V_ST_PTC
L900
MLB-201209-0120P-N2
008:AQ28
012:D13
009:Q29;012:Z7
+5V_ST_PTC
TX_F5
008:AR32
C
Q905EB
R926
10K
E
IC901
MC14053BDR2G
1
2
3
4
5
6
7
8
009:AF25;012:J7
16
15
14
13
12
11
10
9
+3.3V_ST
Q1200
BSS83
D
B
S
G
GND
Y1
0
OPT
OPT
OPT
OPT
Y0
0
Z1
0
100
Z
Z0
0
INH
VEE
VSS
PTC_RX_5V
C902
0.1uF
VDD
Y
R913
0
0
0
0
100R918
100R919
100R920
PTC_TX_MSTAR
PTC_RX_MSTAR_5V
PTC_DEBUG_RX
009:AF25;012:K14
PTC_RX_5V
OPT
0R959
2SC3875S(ALY)
R914
X
R915
X1
OPT
R916
X0
A
B
C
OPT
1KR924
Q904
2SC3875S(ALY)
B
1KR929
R928
22K
C
E
008:AB27
009:Q29;012:D9
UART_SWB
+5V_ST_PTC
MSTAR_TX
PTC_DEBUG_TX
009:W35
+3.3V_ST
R1200
4.7K
R1201
4.7K
+5V_ST_PTC
IC902
ST3232CDR
C1+
C904
C903
0.047uF
0.33uFC905
+3.3V_ST
G
C906
0.33uF
V+
C1-
C2+
C2-
V-
T2OUT
R2IN
100R930
100R931
0.33uF
Q1201
BSS83
D
B
S
GND
VCC
16
1
GND
15
2
T1OUT
14
3
R1IN
13
4
R1OUT
12
5
T1IN
11
6
T2IN
10
7
R2OUT
8
9
IC903
MC14053BDR2G
Y1
1
Y0
2
Z1
3
Z
4
Z0
5
INH
6
VEE
7
VSS
8
C907
0.1uF
100R932
100R934
C909
220pF
0R935
100R933
VDD
16
Y
15
X
14
X1
13
X0
12
A
11
B
10
C
9
C908
0.1uF
100R936
100R937
100R938
2SC3875S(ALY)
RxD
C910
220pF
D900
SDC15
A1
A2
100R939
100R940
+5V_ST_PTC
C
Q906EB
R941
10K
A1
C
A2
D901
SDC15
C
P900
KCN-DS-1-0088
1
6
2
7
3
8
4
9
5
10
+5V_ST_PTC
L901
MLB-201209-0120P-N2
MSTAR_RX
PTC_DEBUG_RX
1KR942
008:AB27
009:Q29;012:J8
UART_SWA
009:W36
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
37LH250H
UART12 14
09.05.19
Page 37
PStoPDF trial version. http://www.oakdoc.com
USB JACK (DOWN LOAD ONLYU)
VOUT
ILIMIT
FAULT/
R2513
180
P1207
1234
USB DOWN STREAM
KJA-UB-4-0004
5
SIGN799
L1300
CB3216PA501E
D1304
ADMC5M03200L
5.6V
C2251
47uF
10V
008:AR34
008:AR34
D1305
ADMC5M03200L
5.6V
C2252
47uF
10V
USB_DM
USB_DP
USB +5V Over Current Protection --> USB Jack
MIC2009YM6-TR
6
5
4
IC1304
R2514
47
+3.3V
R2515
VIN
1
GND
2
ENABLE
3
4.7K
USB_CTL
R2518
10K
C2248
10uF
10V
+5V_EXT
USB_OCD
C2249
0.1uF
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
37LH250H
USB JACK
09.05.19
1314
Page 38
PStoPDF trial version. http://www.oakdoc.com
B-LAN
BLAN
TU1002
TMMB-H001P(W/O Tuner)
RF_OUT[NC]
1
GND_1
2
+3.3V
3
TSCL
4
TSDA
5
GND_2
6
IF_AGC
7
DIF-P
8
DIF-N
9
+5V
10
GND_3
11
JP2-P1
12
JP2-P4
13
J1-P2
14
J1-P3
15
J1-P4
16
J1-P5
17
PTS
18
JP1-P3
19
JP1-P4
20
JP1-P5
21
JP1-P6
22
JP1-P7
23
JP1-P10
24
J2-P1
25
J2-P2
26
J2-P3
27
J2-P4
28
J2-P6
29
30
SHIELD
GND
b_LAN MPI JACK
MJ-623PT-6-S-SD
BLAN
JK1401
R2529
0
1
2
3
4
5
6
7
R2519
R1409
R1402
R1403
R1404
R1405
BLAN
P1400
YFDW254-06S
1
5
0
0
0
0
0
0
POWER LINE
BEXT_5V
OPT
D1408
30V
2
R2530
43
6
b_com_PWCTRL
b_MPI_DIN
b_MPI_DOUT
b_SPI_DATA_OUT
b_SPI_DATA_IN
b_SPI_CLOCK
***Lines is same length as Possible as
R1400
R2562
0
OPT
R1410
0
R1407
0
L1401
MLB-201209-0120P-N2
R1406
0
R1401
0
BEXT_MPI_OUT
BEXT_MPI_DIN
BEXT_Game_Control_Latch
BEXT_IR_MODEM
014:L15
5.6V
5.6V
5.6V
OPT
OPT
OPT
D1402
D1403
D1400
5.6V
OPT
D1401
0
014:S7;014:Y26
014:S7;014:Y26
014:Y24;014:Y13
OPT
009:BA31
014:S14;014:Y25
014:S13;014:Y25
0
R2539
0
BEXT_MPI_OUT
BEXT_MPI_DIN
BEXT_Game_Control_Latch
BEXT_IR_MODEM
014:K7
014:L17
014:L17
MLB-201209-0120P-N2
D1404
014:K9
014:K9
014:L16
BLAN
OPT
C1411
100uF
16V
5.6V
L502
D1405
D1406
5.6V
OPT
GND
BEXT_5V
C1412
0.22uF
50V
D1407
5.6V
5.6V
OPT
OPT
b_IR_IN_MODEM
014:K8
+5V_BLAN
BLAN
C1413
100uF
16V
009:M6;014:Y23
014:K20;014:Y25
009:K10
014:K20;014:Y25
009:I12;009:N26
009:K10
DUM_MPI_DOUT
009:I14;009:AJ28
R1418
0
R1414
0
R1413
0
R1415
0
R1416
0
R1417
0
GND
b_SPI_DATA_OUT
DUM_SPI_DATA_OUT
b_SPI_DATA_IN
DUM_SPI_DATA_IN
014:K21;014:Y26
009:K11
014:K21;014:Y26
BUFFERED_MPI_DIN
DUM_BUFFERED_MPI_DIN
009:K11
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
SHIELD_PLATE
SPI_DATA_IN
b_MPI_DOUT
b_MPI_DIN
JIG WAFER
BLAN
JK1400
PEJ024-01
3
6A
7A
4
5
7B
6B
8
BLAN
P1405
12505WS-15A00
16
GND
GND
NC
1
GND
2
R2568
MPI IN
0
3
R2569
MPI OUT
0
4
R2570
PM4
0
5
R2571
PM2
0
6
R2572
PM1
0
7
GND
8
NC
9
R2573
PTO
0
10
NC
11
5V ON
12
12V ON
13
5VST
14
NC
15
b_MPI_DIN
014:K21;014:S7
b_MPI_DOUT
014:K21;014:S7
b_SPI_DATA_OUT
014:K20;014:S14
b_SPI_DATA_IN
014:K20;014:S13
b_SPI_CLOCK
014:K20;014:Y13
b_IR_IN_MODEM
009:M6;014:N19
bLAN_CHECK_5VON
014:AF26
bLAN_CHECK_12VON
014:AD21
bLAN_CHECK_5V
014:AF27
B-LAN POWER
bLAN_POWER_MANAGE
009:AA35;014:AD21
bLAN_CHECK_12VON
014:Y21
bLAN_POWER_MANAGE
009:AA35;014:AF25
bLAN_CHECK_5V
014:Y21
bLAN_CHECK_5VON
014:Y22
5VST_JIG
BLAN CHECK
R1904
47K
R2565
10K
R2537
R1905
47K
OPT
R1906
0
OPT
22K
L1404
MLB-201209-0120P-N2
5VST_JIG
BLAN CHECK
R628
47K
+12V_C
R1909
47K
R1910
47K
Q908
B
5VST_JIG
BLAN CHECK
R2566
10K
C
E
2SC3875S(ALY)
5VST
5VST
8 D2_2
7 D2_1
6 D1_2
5 D1_1
+5V_BLAN
C1906
22uF
25V
+12V_C_MPI
BLAN
Q507
AO4813
R630
C801
22K
2.2uF
OPT
C1903
2.2uF
25V
R631
2.2K
C
Q506
B
E
2SC3875S(ALY)
+12V_C
C1904
BLAN
47uF
25V
25V
R629
22K
OPT
R2567
0
0
R1093
C802
BLAN
100uF
16V
1S2
2G2
3S1
4G1
B-LAN ON/OFF Control
R1419
R1420
R1421
R1422
R1423
R1434
R1435
R1436
R1437
R1438
0
0
0
0
0
0
0
0
0
0
MC14053BDR2G
Y1
1
Y0
2
Z1
3
Z
4
Z0
5
INH
6
VEE
7
VSS
8
***MPI_OUT bypass
BLAN
IC1400
MC14053BDR2G
Y1
1
Y0
2
Z1
3
Z
4
Z0
5
INH
6
VEE
7
VSS
8
BLAN
IC1401
C1415
R1454
R1449
R1450
R2538
10K
OPT
0.1uF
0
0
0
0
0
0
0
0
0
OPT
0
OPT
0
OPT
0
0
0
VDD
16
Y
15
X
14
13
12
11
10
16
15
14
13
12
11
10
9
R1453
X1
R1452
X0
R1451
A
R1448
B
C
9
VDD
Y
R1431
X
R1430
X1
R1429
X0
R1428
A
R1425
B
R1426
C
R1427
C1414
0.1uF
MPI_DOUT
009:I13;009:AO27
bLAN_CTRL_1
+5V_ST_PTC
L1403
MLB-201209-0120P-N2
SPI_DATA_OUT
009:I12;009:N25
SPI_CLOCK
014:K20;014:Y24
b_SPI_CLOCK
DUM_SPI_CLOCK
bLAN_CTRL_0
009:I13;009:AJ27
009:K9
+5V_ST_PTC
L1402
MLB-201209-0120P-N2
bLAN_CTRL_0
014:Y12
bLAN_CTRL_1
014:Y5
+5V_ST_PTC
R1462
2SC3875S(ALY)
R2531
2SC3875S(ALY)
0
C
Q1402EB
+5V_ST_PTC
0
C
Q1404EB
R1463
10K
R2532
10K
R1466
10K
4.7KR1464
OPT
4.7KR2533
OPT
R1465
0
10K
R2534
0
R2535
0R1467
0R2536
bLAN_CTRL_PTC_0
009:AA35
bLAN_CTRL_PTC_1
009:AA36
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
37LH250H
B-LAN
09.05.19
14 14
Page 39
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