Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500
°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
This spec sheet is applied all of the LCD TV with LT91A
chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ±5 °C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote controller.
(7) Push The “IN STOP KEY” – For memory initialization.
3.Main PCB check process
# APC - After Manual-Insert, executing APC
3.1 Boot file Download
1. Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2. Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between computer,
jig, and set.
3. Click “Read” tab, and then load download file (XXXX.bin) by
clicking “Read”
4. Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
5. Click “Auto” tab and set as below
6. Click “Run”.
7. After downloading, check “OK” message.
LGE Internal Use Only
- 10 -
ADJUSTMENT INSTRUCTION
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push “Instop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover channel
information by itself.
3. After function inspection, Push “In-stop” key.
(4)
filexxx.bin
(1) (3)
Please Check the Speed :
To use speed between
from 200KHz to 400KHz
filexxx.bin
(7)
(5)
(8) ……….OK
(6)
s3.2 USB DOWNLOAD(*.epk file download)
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it
didn’t work.
But your downloaded version is High, USB data is
automatically detecting
3. Show the message “Copying files from memory”
4. Updating is staring.
5. Updating Completed, The TV will restart automatically.
6. If your TV is turned on, check your updated version and Tool
option. (explain the Tool option, next stage)
* If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t have
a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
1. Push "IN-START" key in service remote controller.
2. Select "Tool Option 1" and Push “OK” button.
3. Punch in the number. (Each model has their number.)
4. Completed selecting Tool option.
3.3 ADC Process
3.3.1 ADC
• Input signal : Component
• Signal equipment displays.
Adjustment pattern
-Component 480I
MODEL: 209 in Pattern Generator(480i Mode)
PATTERN : 65 in Pattern Generator( MSPG-925 SERISE)
• Input Signal : RGB (You don’t need to connect RGB Cable)
Because We use TV internal pattern
• After enter Service Mode by pushing “ADJ” key,
• Enter Internal ADC mode by pushing “” key at “5. ADC
Calibration”
* Caution
Using ‘power on’ button of the Adjustment R/C , power on TV.
3.3.2 ADC Calibration Protocol (RS232)
* Adjustment can be done using only external ADC
* Required equipment : Adjustment R/C.
3.4 Function Check
3.4.1 Check display and sound
• Check Input and Signal items. (cf. work instructions)
1. TV
2. AV (SCART1/SCART2/CVBS)
3. COMPONENT (480i)
4. RGB (PC : 1024 x 768 @ 60hz)
5. HDMI
6. PC Audio In
* Display and Sound check is executed by Remote controller.
• W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
• Above 5 minutes H/run in the inner pattern. (Power on” key of
adjust remote control)
- Connecting picture of the measuring instrument
(On Automatic control )
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment
R/C POWER-ON -> Enter the mode of White-Balance, the
pattern will come out.
4.1.1 Auto-control interface and directions
1. Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10ux).
2. Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3. Aging time
- After aging start, keep the power on (no suspension of power
supply) and heat-run over 15 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the
back light on.
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range of
Module)
*Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “•” key at “3. White Balance”.
* After done all adjustments, Press “In-start” button and compare
Tool option and Area option value with its BOM, if it is correctly
same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection.
4.2 DDC EDID Write (RGB 128Byte )
• Connect D-sub Signal Cable to D-Sub Jack.
• Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4.3 DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 15 -
LGE Internal Use Only
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
300
200
801
802
803
804
805
806
520
530
540
550
400
900
120
510
500
310
200T
200N
A2
LV1
A10
320
NAND_FLASH_MEMORY
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
LGE Use Only
PStoPDF trial version. http://www.oakdoc.com
NAND FLASH MEMORY
/PF_CE0
H : Serial Flash
L : NAND Flash
/PF_CE1
H : 16 bit
L : 8 bit
/F_RB
/PF_OE
/PF_CE0
+3.3V
OPT
R108
1K
/PF_CE1
10K
PF_ALE
R105
/PF_WE
0
C
R101
OPT
Q101
B
PF_WP
Serial FLASH MEMORY
Flash_WP_1
MX25L3205DM2I-12G 32MBIT 4M X 8BIT 2.7VTO3.6V 12NSEC UNIFORM SECTOR SOIC(EIAJ) ST 8P MACRONIX INTERNATIONAL CO.,LTD.
M24512-WMW6 512KBIT 64K x 8bit 1.8VTO5.5V 5MSEC SOIC(EIAJ) ST 8P STM
L103
C105
0.1uF
EEPROM_SCL
EEPROM_SDA
+3.3V_ST
R231
0
001:I24;001:Y13;007:V23
001:I24;001:Y14;007:V23
Model OPT Description, 081218 Updated
OPT1
OPT0
FHD
H
L
LCD
PDP
FRC
NO FRC
HD/Small
LVDS_CH_B
LVDS_CH_A
OPT2
Blinking_LED
Moving_LED
OPT0
MODEL OPTION
R226
0
+3.3V
1.2K
R110
1/16W
5%
4.7KR111
/DEMOD_RESET
1.2KR107
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
4.7KR116
R125
R127
OPT
+3.3V
1K
1K
1K
R126
OPT
1K
R128
1K
1K
FHD
1K
HD
R132
R134
R133
26"UNDER
1K
R135
32"UP
R137
HD
1K
R138
FHD
+5V_GENERAL
1.2KR118
MODEL_OPT_0
MODEL_OPT_1
MODEL_OPT_2
MODEL_OPT_3
MODEL_OPT_4
OPT
1.2KR119
XXLH30FD,LH20FD
LH20D
22LH20D
(Small)
I2C
FE_TUNER_SDA
FE_TUNER_SCL
EEPROM_SDA
EEPROM_SCL
SUB/AMP_SCL
SUB/AMP_SDA
+12V
0
Big_+24V/Small_+15V
R121
22"UNDER_DIP_DET
26"UP_DIP_DET
R129
12K1%
DIP_DET
DIP_DET
R136
1K
R139
1.1K
DIP_DET
H
H
H
POWER DETECT
0
+5V_GENERAL
R122
R140
10K
DIP_DET
DIP_DET
R141
1K
C
Q103
B
2SC3052
DIP_DET
E
Apply +5V_GENERAL and 15V_DIP_DET simultaneously for 22"Inch
Apply +5V_GENERAL and 12V_DIP_DET simultaneously for 26"Inch Up
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN_2
EAX60838501_MERCURY
Taiwan_LH20/LH30
EAX60838501
MSTAR_S6
2009.02.10
2 11
PStoPDF trial version. http://www.oakdoc.com
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2
EAX60838501_MERCURY
Taiwan_LH20/LH30
EAX60838501
DDR2
2009.02.10
3 11
PStoPDF trial version. http://www.oakdoc.com
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX60838501_MERCURY
Taiwan_LH20/LH30
EAX60838501
TUNER
2009.02.10
4 11
PStoPDF trial version. http://www.oakdoc.com
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
LGE Use Only
Component and AV(CVBS)
[RD]CONTACT-L
[RD]O-SPRING-L
[WH]C-LUG-L
[YL]CONTACT-L
[YL]O-SPRING-L
6H
5H
7G
6F
5F
PPJ228-01
[ PC ]
002:E17
DSUB_VSYNC
DSUB_HSYNC
002:E17
DSUB_B
002:E18
002:E18
DSUB_G
DSUB_R
002:E17
JK502
0
0 R534
R533
3E
[RD]CONTACT-S
4E
[RD]O-SPRING-S
9E
[RD]E-LUG_2
8D [WH]C-LUG-S
9D [WH]E-LUG
8C [RD]C-LUG-S
9C [RD]E-LUG_1
8B [BL]C-LUG-S
9B [BL]E-LUG
3A [GN]CONTACT-S
4A [GN]O-SPRING-S
9A [GN]E-LUG
D513
30V
C509
OPT
751%R537
C510
OPT
751%R535
C511
OPT
751%R536
IC501
CAT24C02WI-GT3
A0
1
A1
2
A2
3
VSS
4
D514
30V
ADUC30S03010L_AMODIODE
D515
ADUC30S03010L_AMODIODE
30V
D516
ADUC30S03010L_AMODIODE
30V
D517
ADUC30S03010L_AMODIODE
30V
VCC
8
WP
7
SCL
6
SDA
5
C512
0.1uF
16V
R538
2.2K
C513
18pF
50V
ADMC5M03200L_AMODIODE
ENKMC2838-T112
C514
18pF
50V
D518
5.6V
OPT
678
C
D503
AMOTECH
5.6V
D505
AMOTECH
5.6V
D506
AMOTECH
30V
D509
AMOTECH
30V
D510
AMOTECH
5.6V
D507
AMOTECH
30V
D511
AMOTECH
30V
D508
AMOTECH
5.6V
D504
AMOTECH
5.6V
D512
AMOTECH
5.6V
D519
A1
A2
R539
2.2K
C515
0.1uF
16V
R540
22
1112131415
9
12345
P501
KCN-DS-1-0089
R510
470K
R511
470K
R509
75
+3.3V
R514
0
R512
470K
R513
470K
R541
R544
10K
100
R542
22
OPT
R543
0
OPT
16
10
50V C504
1000pF
50V C505
1000pF
R516
4.7K
R515
0
+3.3V
R517
4.7K
C503
0.1uF
16V
C506
100pF
50V
C507
100pF
50V
D520
ADMC5M03200L_AMODIODE
5.6V
+3.3V
R545
4.7K
D522
ADMC5M03200L_AMODIODE
5.6V
OPT
10K
R518
10K
R519
+5V_ST
R520
10K
R521
10K
R522
R523
75
R524
75
1K
75
R525
R526
1K
R546
1K
R527
12K
R528
12K
0 R531
R529
12K
R530
12K
0 R532
C508
47pF
50V
EDID_WP
ISP_RXD
ISP_TXD
DSUB_DET
COMP1_R_IN
002:S13
COMP1_L_IN
002:S13
COMP1_Pr_IN
002:E15
COMP1_Pb_IN
002:E16
COMP1_DET
001:AJ20
COMP1_Y_IN
002:E15
AV1_CVBS_IN
AV1_DET
AV1_L_IN
AV1_R_IN
001:Y14
SPDIF OPTIC JACK
R500
4.7K
SPDIF_OUT
A
B
GND
+3.3V
IC500
NL17SZ00DFT2G
R547
VCC
5
Y
4
0
OPT
C500
0.1uF
16V
R571
22
1/16W
5%
1
2
3
PC AUDIO
JK501
PEJ024-01
3
6A
7A
4
5
7B
6B
8
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
SHIELD_PLATE
ADMC5M03200L_AMODIODE
D501
C501
100pF
5.6V
50V
OPT
ADMC5M03200L_AMODIODE
D502
C502
100pF
5.6V
OPT
50V
+3.3V
R573
R572
1K
OPT
OPT
D500
ADMC5M03200L_AMODIODE
R503
15K
R501
470K
R504
15K
R502
470K
+5V_GENERAL
0
C516
100pF
50V
10K
10K
R506
R505
R508
0
R507
0
R574
C532
0.1uF
16V
JK503
JST1223-001
GND
VINPUT
1
VCC
2
3
4
FIX_POLE
0
OPT
AV2(SIDE)
Fiber Optic
LH30
JK504
PPJ218-01
4A
5A
2A
3B
2B
4C
5C
2C
[YL]O_SPRING
[YL]CONTACT
[YL]U_CAN
[WH]C_LUG
[WH]U_CAN
[RD]O_SPRING
[RD]CONTACT
[RD]U_CAN
FHD
D525
AMOTECH
5.6V
FHD
D526
AMOTECH
30V
FHD
D527
AMOTECH
5.6V
FHD
D528
AMOTECH
5.6V
R552
0
FHD
FHD
FHD
R556
470K
FHD
R555
R554
75
470K
FHD
R558
4.7K
FHD
C524
0.1uF
16V
FHD
C525
47pF
50V
FHD
C526
100pF
50V
FHD
C527
100pF
50V
R560
1K
FHD
R561
10K
FHD
R562
10K
FHD
AV2_DET
AV2_CVBS_IN
FHD
12K
FHD
12K
AV2_L_IN
R563
AV2_R_IN
R564
FHD Option has been applied to this block
SIDE AV-IN_Only LH30
PC_R_IN
002:S15
+3.3V
PC_L_IN
002:S15
Side USB
1234
USB DOWN STREAM
P502
KJA-UB-4-0004
5
+5V_ST
R548
4.7K
DBG_TX
DBG_RX
D523
CDS3C05HDMI1
5.6V
C517
0.33uF
16V
RIN2
8
9
ROUT2
R549
4.7K
220pF 50VC518
220pF 50VC519
BLM18PG121SN1D
C520
10uF
10V
DOUT2
6V-5
7
MAX3232CDR
11
10
DIN2
L501
120-ohm
180
R550
D524
CDS3C05HDMI1
5.6V
C521
0.33uF
16V
IC502
12
DIN1
R551
100
OPT
0
RS232C
C2-
C2+
4
13
RIN1
ROUT1
R553
R567
100
VOUT
ILIMIT
FAULT
3
14
MIC2019YM6
DEVELOPE
C1-
DOUT1
6
5
4
EAN60223701
IC503
C522
0.33uF
16V
V+
2
15
GND16VCC
0
OPT
001:AJ26
R557
+3.3V
VIN
1
GND
2
ENABLE
3
+5V_ST
C523
0.047uF
25V
C1+
1
IR_OUT
OPT
D529
ADUC30S03010L_AMODIODE
30V
D530
OPT
ADUC30S03010L_AMODIODE
30V
R559
4.7K
USB_CTL
001:AJ26
C528
0.1uF
50V
BLM18PG121SN1D
C529
10uF
10V
R565
10K
R566
47
SIDE_USB_DM
SIDE_USB_DP
+5V_USB_SIDE
L502
0.1uF
001:AN8
C530
USB_OCD
001:AI14
001:AN8
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
INTERFACE
EAX60838501_MERCURY
P503
KCN-DS-1-0088
6
7
8
1
2
3
4
Taiwan_LH20/LH30
EAX60838501
INTERFACE
9
10
5
2009.02.10
5 11
PStoPDF trial version. http://www.oakdoc.com
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
LGE Use Only
PANEL_POWER
FHD
P602
TF05-51S
52
R619
R622
2K
1/10W
PANEL_AGP
OPC
220uF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
R613
R614
R615
R611
R612
FHD_V4
FHD_V4
FHD_V4
0
OPT
22
0
0
0
OPT
OPT
+3.3V
R631
2.2K
R632
R616
0
OPC_OUT
PWM_DIM
OPT
LVDS_A4+
LVDS_A4LVDS_A3+
LVDS_A3-
LVDS_AC+
LVDS_AC-
LVDS_A2+
LVDS_A2-
LVDS_A1+
LVDS_A1-
LVDS_A0+
LVDS_A0-
LVDS_B4+
LVDS_B4-
LVDS_B3+
LVDS_B3-
LVDS_BC+
LVDS_BC-
LVDS_B2+
LVDS_B2-
LVDS_B1+
LVDS_B1-
LVDS_B0+
LVDS_B0-
0
1/10W
2K
R620
510
R621
OPT
+3.3V
0
C608
16V
OPC_EN
+3.3V
OPT
OPT
3.3K
R617
R618
C609
1000pF
0
C610
0.1uF
50V
BIT_SEL
+3.3V
R623
2.2K
OPT
OPT
R624
R625
22
0
****LVDS_SEL****
High:JEIDA
Low/NC:VESA
****************
LVDS_SEL
PWM_DIM
OPC_OUT
PANEL_POWER
CB3216PA501E
26"UP_HD
26"UP_HD
0
0 R627
26"UP_HD
L606
R626
LVDS_B3+
LVDS_B3-
LVDS_BC+
LVDS_BC-
LVDS_B2+
LVDS_B2-
LVDS_B1+
LVDS_B1-
LVDS_B0+
LVDS_B0-
26"UP_HD
22
0
OPT
R629
R628
26"UP_HD
P603
FF10001-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
CB3216PA501E
22"UNDER
LVDS_B3-
LVDS_BC+
LVDS_BC-
PANEL_POWER
L607
LVDS_B3+
LVDS_B2+
LVDS_B2-
LVDS_B1+
LVDS_B1-
LVDS_B0+
LVDS_B0-
P954
FF10001-30
22"UNDER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
0
R630
OPT
28
29
30
31
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
EAX60838501_MERCURY
Taiwan_LH20/LH30
EAX60838501
LVDS
2009.02.10
6 11
PStoPDF trial version. http://www.oakdoc.com
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
LGE Use Only
22
QJ41193-FEE2-7F
JK701
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
20
21
5V_HDMI_1
EAG39789401
+5V_ST
R742
OPT
R703
10K
0
47K
R709
OPT
1K
22R707
22
007:X6;007:AG23;007:AL6
HDMI1_SDA
002:D9;007:J16
HDMI1_SCL
002:D9;007:J16
CEC_REMOTE
002:D7
HDMI1_CLK-
002:D7
HDMI1_CLK+
002:D8
HDMI1_RX0-
002:D7
HDMI1_RX0+
002:D8
HDMI1_RX1-
002:D8
HDMI1_RX1+
002:D8
HDMI1_RX2-
002:D8
HDMI1_RX2+
HPD1
22
QJ41193-FEE2-7F
JK702
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
20
21
EAG39789401
5V_HDMI_2
GND
R713
Q703EB
JP709
R722
R721
C703
0.1uF
16V
22R720
22
0
1K
R743
2K
JP705
UI_HW_PORT2
C
Q702EB
2SC3052
C701
1K
0.1uF
16V
R741
2K
JP702
R701
R708
JP703
R706
GND
UI_HW_PORT1
+5V_ST
R744
OPT
R719
10K
OPT
47K
R723
1K
002:D9
002:D10
002:D10
002:D10
002:D10
002:D11
002:D11
HDMI2_SDA
HDMI2_SCL
CEC_REMOTE
HDMI2_CLK-
HDMI2_CLK+
HDMI2_RX0-
HDMI2_RX0+
HDMI2_RX1-
HDMI2_RX1+
HDMI2_RX2-
HDMI2_RX2+
HPD2
JACK_GND
LH30
JK703
LH30 SIDE HDMI
20
19
18
17
16
15
14
13
12
11
10
9
8
EAG42463001
7
6
5
4
3
2
1
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
D2_GND
D2+
5V_HDMI_3
FHD
R745
1K
2K
FHD
R728
UI_HW_PORT3/SIDE
GND
Only LH30_FHD
JP707
JP708
R734
R735
Q704
FHD
22
FHD
22R733
0
FHD
C
+5V_ST
R746
OPT
R732
10K
B
OPT
C706
0.1uF
16V
007:J6;007:X6;007:AG23
47K
R736
1K
FHD
002:E13;007:AL16
HDMI3_SDA
002:E14;007:AL16
HDMI3_SCL
CEC_REMOTE
002:E12
HDMI3_CLK-
002:E12
HDMI3_CLK+
002:E12
HDMI3_RX0-
002:E12
HDMI3_RX0+
002:E13
HDMI3_RX1-
002:E13
HDMI3_RX1+
002:E13
HDMI3_RX2-
002:E13
HDMI3_RX2+
HPD3
C
E
FHD
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
IC701
5V_HDMI_1
VCC
JP701
8
7
6
5
R702
WP
0
SCL
SDA
R710
C702
47K
0.1uF
0R705
0R704
+5V_ST
A1CA2
ENKMC2838-T112
D704
R711
47K
EDID_WP
HDMI1_SCL
HDMI1_SDA
HDCP EEPROM
4.7K
R747
C704
0.1uF
+3.3V
Place this near by S6
IC704
CAT24WC08W-T
R712
4.7K
A0
1
A1
2
A2
3
VSS
4
VCC
8
WP
7
SCL
6
SDA
5
Addr:10101--
R716
5V_HDMI_2
IC702
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
GND
VCC
JP704
8
7
6
5
R714
WP
0
SCL
SDA
R724
C705
47K
0.1uF
0R717
0R715
+5V_ST
A1CA2
ENKMC2838-T112
D705
R725
47K
EDID_WP
HDMI2_SCL
HDMI2_SDA
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
IC703
LH30
VCC
8
JP706
R729
WP
7
6
5
0
FHD
SCL
FHD
SDA
FHD
5V_HDMI_3
FHD
C707
0.1uF
0R730
FHD
0R731
R737
47K
+5V_ST
A1CA2
ENKMC2838-T112
D706
FHD
EDID_WP
R738
47K
FHD
HDMI3_SCL
HDMI3_SDA
FHD Option has been applied to this block
+3.3V_ST
R726
68K
MMBD301LT1G
Q701
SSM6N15FU
R740
SOURCE1
HDMI_CEC002:E14
22
22R718
EEPROM_SCL
EEPROM_SDA
0
GATE1
DRAIN2
1
2
3
R739
OPT
D703
30V
DRAIN1
6
GATE2
5
SOURCE2
4
0
R727
9.1K
CEC_REMOTE
007:J6;007:X6;007:AL6
C708
0.1uF
16V
GND
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI
EAX60838501_MERCURY
Taiwan_LH20/LH30
EAX60838501
HDMI
2009.02.10
7 11
PStoPDF trial version. http://www.oakdoc.com
Copyright ⓒ 2009 LG Electonics. Inc. All right reserved.
Only for training and service purposes
LGE Use Only
+1.8V_AMP
BLM18PG121SN1D
002:X20
002:X20
001:I25;001:AJ12;010:W23
001:I25;001:AJ12;010:W23
002:X20
002:X20
L801
C801
1uF
10V
001:AA21
AUDIO_MASTER_CLK
+1.8V_AMP
L802
BLM18PG121SN1D
C802
50V
MS_LRCH
MS_LRCK
SUB/AMP_SDA
SUB/AMP_SCL
AMP_RST
MS_SCK
R801
Big_+24V/Small_+15V
L803
CB3216PA501E
AMP_VCC
C815
0.1uF
50V
C814
22000pF
50V
R802
100
C806
1000pF
50V
C804
0
100pF
50V
C8050.1uF
C803
1uF
0.1uF
10V
R804
0
+3.3V
C808
0.1uF
C807
1000pF
50V
R803
3.3K
50V
0.1uF
BST1A
C811
VDR1A
16V
RESET
DVSS_1
VSS_IO
VDD_IO
DGND_PLL
AGND_PLL
AVDD_PLL
DVDD_PLL
+1.8V_AMP
C810
1uF
10V
100R805
100R806
100R807
100R808
100R809
C812
C809
33pF
33pF
50V
50V
CLK_I
TEST0
AD
LFM
C813
0.1uF
50V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PGND1A_2
56
IC801
EAN60664001
NTP-3100L
15
16
DVDD
DVSS_2
OUT1A_255PGND1A_1
54
17
SDATA
PVDD1A_2
OUT1A_1
53
18
BCK
WCK
PVDD1A_1
52
19
SDA
51
20
PVDD1B_1
PVDD1B_2
49
50
21
22
SCL
MONITOR_023MONITOR_124MONITOR_2
TP801
OUT1B_148OUT1B_2
C817
1uF
10V
TP802
47
TP803
PGND1B_2
46
25
26
FAULT
VDR2B
C816
0.1uF
50V
R810
27
BST2B
C818
22000pF
50V
C819
0.1uF
16V
VDR1B44BST1B45PGND1B_1
43
28
PGND2B_1
33K
AMP_VCC
SPK_L+
SPK_L-
SPK_R+
SPK_R-
WAFER-ANGLE
4
3
2
1
P801
008:AH19
SPEAKER_L
008:AH19
008:AH20
SPEAKER_R
008:AH20
D802
1N4148W
100V
OPT
C844
C820
0.1uF
50V
NC
42
VDR2A
41
BST2A
40
PGND2A_2
39
PGND2A_1
38
OUT2A_2
37
OUT2A_1
36
PVDD2A_2
35
PVDD2A_1
34
PVDD2B_2
33
PVDD2B_1
32
OUT2B_2
31
OUT2B_1
30
PGND2B_2
29
100
R811
OPT
C823
35V
68uF
0.1uF16V
C824
22000pF
50V
2SC3052
Q801
R813
10K
C822
10uF
35V
C825
22000pF
50V
+3.3V_ST
C
E
D803
1N4148W
D804
1N4148W
100V
OPT
D805
1N4148W
C1005
0.1uF
50V
R815
B
10K
C
ENKMC2838-T112
100V
100V
OPT
OPT
C1006
0.1uF
50V
D801
R816
12
12
R828
C830
1000pF
50V
C831
1000pF
50V
12
R817
R829
12
R818
12
12
C832
1000pF
50V
C833
1000pF
50V
R819
12
C827
0.1uF
50V
A1
A2
AMP_VCC
NTP_MUTE
SB_MUTE
C828
0.1uF
50V
R996
12
R997
C829
10uF
35V
001:AO10
001:AO10
L804
DA-8580
EAP38319001
2S
1S1F
L805
DA-8580
EAP38319001
2S
1S1F
C836
008:AJ8
008:AJ10
008:AJ12
008:AJ14
0.1uF
50V
C837
0.1uF
50V
C838
0.1uF
50V
C839
0.1uF
50V
SPK_L+
SPK_L-
SPK_R+
SPK_R-
2F
2F
C834
0.47uF
50V
C835
0.47uF
50V
R820
4.7K
R821
4.7K
R822
4.7K
R823
4.7K
C840
0.01uF
50V
R824
3.3
R825
3.3
C841
0.01uF
50V
C842
0.01uF
50V
R826
3.3
R827
3.3
C843
0.01uF
50V
L806
120-ohm
L807
120-ohm
L809
120-ohm
L808
120-ohm
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AMP
EAX60838501_MERCURY
Taiwan_LH20/LH30
EAX60838501
AMP
2009.02.10
8 11
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