LG 32LG30R, 32LG30R-MA Service Manual

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP81A

MODEL : 32LG30R 32LG30R-MA

website:http://biz.LGservice.com

Internal Use Only

Only for training and service purposes

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ..........................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................19

EXPLODED VIEW .................................................................................. 20

EXPLODED VIEW PARTS LIST..............................................................21

REPLACEMENT PARTS LIST ............................................................... 22

SVC. SHEET ...............................................................................................

Only for training and service purposes

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

IMPORTANT SAFETY NOTICE

0.15uF

Only for training and service purposes

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500°F to 600°F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Only for training and service purposes

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Only for training and service purposes

- 6 -

1. Application range

This specification is applied to LP81A chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature : 25 ± 5°C(77 ± 9°F), CST : 40 ± 5°C (2) Humidity : 65% ± 10% (3) Power : Standard input voltage (100-240V~, 50/60Hz)

* Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

each drawing and specification by part number in accordance with BOM.

(5) The receiver must be operated for about 20 minutes prior

to the adjustment.

3. Test method

(1) Performance : LGE TV test method followed (2) Demanded other specification

Safety : CE, IEC Specification EMC : CE, IEC

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

4. General Specification(LCD Module)

Item Specification Measurement Result Remark

Display Screen Device 26” wide Color Display Module Resolution:1366X768(HD)

32” wide Color Display Module Resolution:1366X768(HD) Aspect Ratio 16:9 LCD Module 26” TFT WXGA LCD 26” HD MAKER :CMO

32” TFT WXGA LCD 32” HD MAKER :LPL CPT, CMO, AUO, SHARP Operating Environment 1) Temp. : 0 ~ 40 deg LGE SPEC

2) Humidity : 0 ~ 85%

Storage Environment 1) Temp. : -20 ~ 60 deg

2) Humidity : 0 ~ 85 % Input Voltage 100-240V~, 50/60Hz Power Consumption Power on (Blue) : LG30/LG50 Volume: 1/8 volume of sound distortion point

Power on (White) : LG60 ≤ TBD 26” HD ≤ TBD 32” HD

St-By (Red) ≤ 1.0 W (All) LG60:St-by Light condition LCD Module Maker Inch (H) x (V) x (D) unit Remark (Maker : AUO, CMO, CMO(HD) Outline Dimension 26” 626 x 373 x 43.7 mm [with inverter] CPT, LPL, SHARP) Pixel Pitch 26” 0.1405 x 0.4215 mm

Back Light 26” 12 CCFL mm Outline Dimension 32” 760 x 450 x 47.4 mm [with inverter] Pixel Pitch 32” 0.17025 x 0.51075 mm Back Light 32” 16 CCFL mm

LPL(HD) Outline Dimension 32” 760 x 450 x 48 mm [with inverter]

Pixel Pitch 32” 0.17025 x 0.51075 mm

Back Light 32” 12 EEFL mm Display Colors Coating 3H, AG/ 2H, AG LPL, CMO, AUO / Sharp

Only for training and service purposes

- 7 -

5. Model Specification

Remark

Rear 1EA, Side 1EA

Rear

Side (S-Video Priority)

Rear

LG30 Tool, 32LG60

LG50, LG70 Tool

L/R Input

Side(1EA)-LG30 Tool only (LG50, LG60, LG70 not Support)

Side(1EA) - LG60, LG70 Tool Only (LG30, LG50 Not Support)

Specification

Central and South America

PAL SECAM B/G/D/K, PAL I/II, NTSC-M

BAND NTSC

VHF 2~13

UHF 14~69

CATV 1~125

Upper Heterodyne

NTSC, PAL-M/N

Y/Cb/Cr, Y/ Pb/Pr

RGB-PC, S/W Upgrade

HDMI-DTV, Only PCM MODE

PC Audio, Component (2EA), AV (2EA)

Remote control, Commercial

Divx, MP3, JPEG

Item

Market

Broadcasting system

Available Channel

Receiving system

Video Input (2EA)

AV Output (1EA)

S-Video Input (1EA)

Component Input (2EA)

RGB Input (1EA)

HDMI Input 2EA

3EA

Audio Input (5EA)

RS-232C

USB Input

6. Component Video Input (Y, PB, PR)

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

720*480 31.47 59.94 27.000 SDTV 480P

720*480 31.50 60.00 27.027 SDTV 480P

720*576 31.25 50.00 27.000 SDTV 576P 50Hz

1280*720 44.96 59.94 74.176 HDTV 720P

1280*720 45.00 60.00 74.250 HDTV 720P

1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

1920*1080 33.72 59.94 74.176 HDTV 1080I

1920*1080 33.75 60.00 74.25 HDTV 1080I

1920*1080 56.25 50 148.5 HDTV 1080P

1920*1080 67.432 59.94 148.350 HDTV 1080P

1920*1080 67.5 60.00 148.5 HDTV 1080P

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

640*350 31.468 70.80 25.17 EGA

720*400 31.469 70.08 28.32 DOS

640*480 31.469 59.94 25.17 VESA(VGA)

800*600 37.879 60.31 40 VESA(SVGA)

1024*768 48.363 60 65 VESA(XGA)

1280*768 47.776 59.87 79.5 VESA(WXGA)

1360*768 47.72 59.799 84.75 VESA(WXGA)

1366*768 47.7 60 84.62 VESA(WXGA)

1280*1024 63.668 59.895 109.00 SXGA Only FHD

1400*1050 65.317 59.978 121.75 SXGA Only FHD

1600*1200 74.537 59.869 161.00 UXGA Only FHD

1920*1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

720_400 31.468 70.08 28.32

640_480 31.469 59.94 25.17 VESA(VGA)

800_600 37.879 60.31 40.00 VESA(SVGA)

1024_768 48.363 60.00 65.00 VESA(XGA)

1280_768 47.776 59.87 79.5 VESA(WXGA)

1360_768 47.72 59.799 84.62 VESA(WXGA)

1366_768 47.7 60 84.62 VESA(WXGA)

1280_1024 63.595 60.0 108.875 SXGA Only FHD

1400_1050 65.160 60.0 122.50 SXGA Only FHD

1600_1200 74.077 60.0 130.375 UXGA Only FHD

1920_1080 66.647 59.988 138.625 WUXGA Only FHD

Only for training and service purposes

- 8 -

8. HDMI input (PC)

- Spec. out but display correctly at only HDMI/DVI IN 1 via DVI to HDMI Cable

Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

720*480 31.47 59.94 27 SDTV 480P Support(not spec)

720*480 31.5 60 27.027 SDTV 480P support(not spec)

720*576 31.25 50 27 SDTV 576P support(not spec)

1280*720 44.96 59.94 74.176 HDTV 720P

1280*720 45 60 74.25 HDTV 720P

1280*720 37.5 50 74.25 HDTV 720P

1920*1080 28.125 50 74.25 HDTV 1080I

1920*1080 33.72 59.94 74.176 HDTV 1080I

1920*1080 33.75 60 74.25 HDTV 1080I

1920*1080 56.25 50 148.5 HDTV 1080P

1920*1080 67.432 59.94 148.350 HDTV 1080P

1920*1080 67.5 60.00 148.5 HDTV 1080P

1920*1080 27 24 74.25 HDTV 1080P

1920*1080 33.75 30 74.25 HDTV 1080P

9. HDMI input (DTV)

7. RGB Input (Analog PC)

Only for training and service purposes

- 9 -

ADJUSTMENT INSTRUCTION

1. Application Range

This spec. sheet is applied all of the 32/37/42/47/52” LCD TV, LP81A chassis (HURRICANE 5) by manufacturing LG TV Plant all over the world.

2. Specification

1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2) Adjustment must be done in the correct order.

3) The adjustment must be performed in the circumstance of 25±5°C of temperature and 65±10% of relative humidity if there is no specific designation.

4) The input voltage of the receiver must keep 100-220V, 50/60Hz.

5) Before adjustment, execute Heat-Run for 15 minutes at RF no signal.

3. S/W program download

3-1. Preliminary steps

(1) Download method 1 (PCB Assy)

- HD

- FHD

(2) Connect the download jig to D-sub jack

3-2. Download steps

(1) Execute ‘ISP Tool’ program in PC, then a main window will

be opened

(2) Click the connect button and confirm “Dialog Box”.

(3) Click the Config button and Change speed

E2PROM Device setting : over the 350Khz

(4) Read and write bin file

Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”.

(5).Click “Auto(2)” tab and set as below (6).click “Run(3)”. (7).After downloading, check “OK(4)” message.

Double click

(1)

fi lexx x.bi n

)

.......... OK

)

(2)

Only for training and service purposes

- 10 -

## USB DOWNLOAD

1) Put the USB Stick to the USB socket

2) Automatically detecting update file in USB Stick

3) Select “Start” Button and press “ok” button Updating is staring.

4) Finishing the version updating, you have to put out USB

stick and “AC Power” off.

5) After putting “AC Power” on and check updated version

on your TV.

4. ADC Process

* Required Equipments

- Remote controller for adjustment

- MSPG-925F Pattern Generator

4-1. Method of Auto RGB Color Balance

- Convert to RGB PC in Input-source

- Input the PC 1024x768 @ 60Hz 1/2 Black & White Pattern(MSPG-925F model:60, pattern:54) into RGB.

- Adjust by commanding AUTO_COLOR_ADJUST(0xF1) 0x00 0x02 instruction.

(1) Confirmation

- We confirm whether “0xF1 (offset), 0xF2 (gain)” address of EEPROM “0xBC” is “0xAA” or not.

- If “0xF1”, “0xF2” address of EEPROM “0xBC” isn’t “0xAA”, we adjust once more

- We can confirm the ADC values from “0x00~0x05” addresses in a page “0xBC”

* Manual ADC process using Service Remocon. After enter

Service Mode by pushing “ADJ” key, execute “Auto-RGB” by pushing “_” key at “Auto-RGB”.

4-2. Component input ADC

(1) Component Gain/Offset Adjustment7

- Convert to Component in Input-source

- Input the Component ( Which has 720p@60Hz YPbPr signal : 100% Color Bar (MSPG-925F Model: 217/ Pattern: 65 ) into Component.

- Adjust by commanding AUTO_COLOR_ADJUST (0xF1) 0x00 0x02 instruction

(2) Confirmation

- We confirm whether “0xF3 (offset), 0xF4 (gain)” address of EEPROM “0xBC” is “0xAA” or not.

- If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t “0xAA”, we adjust once more.

- We can confirm the ADC values from “0x06~0x0B” addresses in a page “0xBC”.

* Manual ADC process using Service Remocon. After

enter Service Mode by pushing “ADJ” key, execute “Auto-RGB” by pushing “_” key at “Auto-RGB”.

** TOOL Option, Area Option change and AC off Before PCBA check, you have to change the Tool option, Area option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)

5. TOOL Option, Area Option change

(1) Profile : Must be changed the option value because being

different with some setting value depend on module maker,

inch and market. (2) Equipment : adjustment remote control. (3) Adjustment method

The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) * Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value

* Never push the IN-STOP KEY after completing the function

inspection.

+ 22 hidden pages