LG 32LF5700 Schematic

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS :

MODEL : 32LF5700 32LF5700-ZE

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL62251609 (0906-REV00)

CONTENTS

CONTENTS .......................................................................................2

PRODUCT SAFETY ................................................................................3

SPECIFICATION ......................................................................................6

ADJUSTMENT INSTRUCTION .............................................................13

BLOCK DIAGRAM..................................................................................20

WIRING DIAGRAM.................................................................................22

TROUBLE SHOOTING ..........................................................................24

STANDARD REPAIR PROCESS ………..............................................32

STANDARD REPAIR PROCESS DETAIL TECHNICAL MANUAL....36

EXPLODED VIEW .................................................................................41

SCHEMATIC DIAGRAMME.................................................................. 45

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

IMPORTANT SAFETY NOTICE

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on page 4 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES

devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

SERVICING PRECAUTIONS

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle(0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500。F to 600。F)

b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500。F to 600。F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as

possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as

possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repai

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement.

1. Application Range. 3. Test method

This spec sheet is applied to the 32"/42"LCD TV used LF5700, LH5700 chassis. 3.1 Performance : LGE TV test method followed.

3.2 Demanded other specification

2. Specification

Each part is tested as below without special appointment

2.1 Temperature : 25±5°C(77±9°F), CST : 40±5°C

2.2 Relative Humidity : 65±10%

2.3 Power Voltage : Standard input voltage (100~240V@ 50/60Hz)

• Standard Voltage of each products is marked by models

2.4 Specification and performance of each parts are followed

each drawing and specification by part number in

accordance with BOM .

2.5 The receiver must be operated for about 5 minutes prior to the adjustment.

4. General Specification

No Item Specification Remark

1 Display Screen Device 32”/42” wide Color Display Module

Safety : CE, IEC specification EMC : CE, IEC

2 Aspect Ratio 16:9

3 Operating Environment

4 Storage Environment

5 Input Voltage AC100 ~ 240V, 50/60Hz

6 Power Consumption

7 Module Size

Pixel Pitch

Back Light

10 Display Colors 10-bit(D), 1.06 Billion Color

11 Coating 3H, AG

Temp. : 5 ~ 35 deg Humidity : 10 ~ 90%

Temp. : -20 ~ 50 deg Humidity : 10 ~ 90 %

Power ON

32LF5700 175W

32LH5700 175W

42LF5700 220W

42LH5700 220W

32LF5700 760.0(H) x 450.0(V) x 48.0(D)

32LH5700 760.0(H) x 450.0(V) x 48.0(D)

42LF5700 983.0(H) x 576.0(V) x 46.0(D)

42LH5700 983.0(H) x 576.0(V) x 46.0(D)

32LF5700 0.36375(H) x 0.36375(V)

32LH5700 0.36375(H) x 0.36375(V)

42LF5700 0.48450(H) x 0.48450(V)

42LH5700 0.48450(H) x 0.48450(V)

32LF5700 EEFL

32LH5700 EEFL

42LF5700 EEFL

42LH5700 EEFL

MAKER : 32” – LGD 42” – LGD

LGE SPEC.

Unit : W

Unit : mm

5. MODEL General Specification

No Item Specification Remark

1 Broadcasting system

2 Receiving system

3 SCART Jack (2EA) PAL, SECAM

4 Video Input RCA(1EA) PAL, SECAM, NTSC Side

5 Component Input (1EA)

6 RGB Input RGB-PC Analog(D-SUB 15PIN)

7 HDMI Input (3EA)

1) PAL-I, PAL/SECAM BG/DK

2) DVB-T

3) DVB-S/S2

Analog : Upper Heterodyne Digital : DVB-T(COFDM), DVB-S/S2

Y/Cb/Cr Y/Pb/Pr

HDMI1-DTV/DVI HDMI2-DTV HDMI3-DTV

SCART1 Jack is Full SACRT and support RF-OUT(TV-OUT) SCART2 jack is Half SCART and support MNT-OUT

PC(HDMI version 1.3) Support HDCP

8 Audio Input (3EA) L/R Input

9 SDPIF out (1EA) In digital mode only

10 Headphone out(1EA) Side

11 USB(1EA) JPEG, MP3, Side

12 PCMCIA(1EA) CI(Common Interface) Side

6. Chroma & Brightness

6.1 32LF5700 32" F-HD,50Hz LCD Module (LC320WUN)

No Item Min Typ Max Unit Remark

PSM : Vivid, CSM : Cool,

Luminance

1 Luminance, white

2 View angle (R/L, U/D) 178/178 - - degree

3 Contrast ratio 900 1300 -

(white)

Variation 1.3

400 500 - cd/m²

White(100 IRE) Dynamic contrast : off Dynamic color L off

White

Red

4 Color Coordinate

Green

Blue

1) Standard Test Condition (The unit has been ‘ON’)

2) Stable for approximately 30 minutes in a dark environment at 25±2_

3) The values specified are at approximate distance 50Cm from the LCD surface

4) Ta= 25±2°C, VLCD=12.0V, fV=60Hz(NTSC), 50Hz(PAL), Dclk=74.25MHz VBR_A=1.65V, ExtVBR_B=100%

Typ.

-0.03

0.279

0.292

0.638

0.334

0.291

0.607

0.145

0.062

Typ.

+0.03

PSM : Vivid, CSM : Cool, White(80 IRE) Dynamic contrast : off Dynamic color L off

6.2 32LH5700 32" F-HD,100Hz LCD Module (LC320WUD)

No Item Min Typ Max Unit Remark

PSM : Vivid, CSM : Cool, White(100 IRE) Dynamic contrast : off Dynamic color L off

1 Luminance, white

Luminance (white)

Variation - - 1.3

400 500 - cd/m²

2 View angle (R/L, U/D) - 178/178 - degree

3 Contrast ratio 900 1300 -

White

Red

4 Color Coordinate

Green

Blue

1) Standard Test Condition (The unit has been ‘ON’)

2) Stable for approximately 30 minutes in a dark environment at 25±2_

3) The values specified are at approximate distance 50Cm from the LCD surface

4) Ta= 25±2°C, VLCD=12.0V, fV=120Hz(NTSC), 100Hz(PAL), Dclk=74.25MHz VBR_A=1.65V, ExtVBR_B=100%

Typ.

-0.03

0.279

0.292

0.638

0.334

0.291

0.607

0.145

0.062

Typ.

+0.03

PSM : Vivid, CSM : Cool, White(80 IRE) Dynamic contrast : off Dynamic color L off

6.3 42LF/LH5700 42" F-HD,100Hz LCD Module (LC420WUF)

No Item Min Typ Max Unit Remark

Luminance

1 Luminance

2 View angle (R/L, U/D) 178/178 - degree

3 Contrast ratio 1000 1400

(white)

Variation 1.3

400 500 - cd/m²

PSM : Vivid, CSM : Cool, White(100 IRE) Dynamic contrast : off Dynamic color L off

White

Red

4 Color Coordinate

Green

Blue

1) Standard Test Condition (The unit has been ‘ON’)

2) Stable for approximately 30 minutes in a dark environment at 25±2_

3) The values specified are at approximate distance 50Cm from the LCD surface

4) Ta= 25±2°C, VLCD=12.0V, fV=120Hz(NTSC), 100Hz(PAL), Dclk=74.25MHz VBR_A=1.65V, ExtVBR_B=100%

Typ.

-0.03

0.279

0.292

0.638

0.334

0.290

0.606

0.144

0.064

Typ.

+0.03

PSM : Vivid, CSM : Cool, White(80 IRE) Dynamic contrast : off Dynamic color L off

7. SET Optical Feature

(Measurement Condition: Full white/ User Mode : Contrast[100], Brightness[50], Color Temp[Normal], Back Light[100]) Æ Measure the black luminance after 30 seconds.

No Item Module

1 32 inch LGD 450 1200

2 42 inch LGD 450 1200

Luminance (cd/m

AV, COMPONENT, HDMI AV, COMPONENT, HDMI

)

C/R(min)

Remark

8. Component Video Input (Y, PB, PR)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500

4 720*480 31.47 59.94 27.000 SDTV 480P

5 720*480 31.50 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45.00 60.00 74.250 HDTV 720P

SDTV, DVD 576I(625I) 50Hz

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

9 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10 1920*1080 33.72 59.94 74.176 HDTV 1080I

11 1920*1080 33.75 60.00 74.250 HDTV 1080I

12 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

13 1920×1080 56.25 50 148.50 HDTV 1080P

14 1920×1080 67.5 60 148.50 HDTV 1080P

9. RGB PC

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Remark

1. 720*400 31.468 70.08 28.32

2. 640*480 31.469 59.94 25.17 VESA

3. 800*600 37.879 60.31 40.00 VESA

4. 1024*768 48.363 60.00 65.00 VESA(XGA)

5. 1280*768 47.78 59.87 80.125 VESA(WXGA)

6 1360*768 47.72 59.80 84.625 VESA(WXGA)

7 1280*1024 63.98 60.02 108. SXGA

8 1400*1050 65.317 59.979 121.75 SXGA

9. 1920*1080 66.587 59.934 138.5 WUXGA

10. HDMI Input (DTV)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

1 640*480 31.649 59.94 25.175 SDTV 480p 60Hz

2 640*480 31.469 60 25.20 SDTV 480p 60Hz

3 720*480 31.47 59.94 27.00 SDTV 480p 60Hz

4 720*480 31.50 60 27.027 SDTV 480p 60Hz

5 720*576 31.25 50.00 27.00 SDTV 576p 50Hz

6 1280*720 37.50 50.00 74.176 HDTV 720p 50Hz

7 1280*720 44.96 59.94 74.176 HDTV 720p 60Hz

8 1280*720 45.00 60 74.250 HDTV 720p 60Hz

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remark

9 1920*1080 28.125 50.00 74.250 HDTV 1080i 50Hz

10 1920*1080 33.72 59.94 74.176 HDTV 1080i 60Hz

11 1920*1080 33.75 60 74.250 HDTV 1080i 60Hz

12 1920*1080 27.00 24.00 74.25 HDTV 1080p 24Hz

13 1920*1080 33.750 30 74.25 HDTV 1080p 30Hz

14 1920*1080 56.25 50.00 148.50 HDTV 1080p 50Hz

15 1920*1080 67.433 59.94 148.352 HDTV 1080p 60Hz

16 1920*1080 67.50 60 148.50 HDTV 1080p 60Hz

11. HDMI Input (PC Mode)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1. 720*400 31.468 70.08 28.32 HDCP

2. 640*480 31.469 59.94 25.17 VESA HDCP

3. 800*600 37.879 60.31 40.00 VESA HDCP

4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP

5. 1280*768 47.78 59.87 80.125 VESA(WXGA) HDCP

6 1360*768 47.72 59.80 84.625 VESA(WXGA) HDCP

7 1280*1024 63.98 60.02 108. SXGA HDCP

8 1400*1050 65.317 59.979 121.75 SXGA HDCP

9. 1920*1080 66.587 59.934 138.5 WUXGA HDCP

12. Mechanical specification

12-1. 32LF5700-ZE

No.

Product

1. Dimension

Product

Weight

12-2. 32LH57700-ZC

No.

Product

1. Dimension

Product

Weight

12-3. 42LF5700-ZE

No.

Product

1. Dimension

Product

Weight

12-4. 42LH7700-ZC

Item Content Unit Remark

Before Packing

After Packing

Only SET

With BOX

Item Content Unit Remark

Before Packing

After Packing

Only SET 12.6

With BOX 14.9

Item Content Unit Remark

Before Packing

After Packing

Only SET 20.1

With BOX 26

Width (W) Length (D) Height (H) mm

813.8

982 189 660

Width (W) Length (D) Height (H) mm

815

982

Width (W) Length (D) Height (H) mm

1034

1330

231.9 598.8 mm

12.6

223.8 583.8

189

294 735

257

625

772

With Stand

Box Out Size

With Stand

Box Out Size

With Stand

Box Out Size

No.

Product

Dimension

Product Weight

Item Content Unit Remark

Before Packing

After Packing

Only SET 19

With BOX 23.9

Width (W) Length (D) Height (H) mm

1052.2

1330

296.2 719.1

228

770

With Stand

Box Out Size

1. USB DOWNLOAD

To update the system software, use only the “USB IN ” jack on the SIDE of the TV.

(The USB IN jack on the side of the TV works for the music or photo service.)

1-1) sub Micom & TV Software Download

a) Put the “hmx_lf5700.hdf” in the USB.

b) Connect the USB device to the

ADJUSTMENT INSTRUCTION

“USB IN” jack on the side of the TV.

c) Power Off and Power On. d) Waiting until the new software upgrade is finished.

e) Fishing the version uploading, you have to put USB stick and

f) After putting “AC Power” on and check updated version on your TV.

“AC Power” off.

z If downloading version is more high than your TV have, TV can lost all channel data.

In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.

2. OTA DOWNLOAD

Auto update case.

a) Click the Software Update. b) Click the Auto Update.

Manual Update Case.

1. DVB-T a) Click the Software Update. b) Click the Manual Update.

c) If found, the OTA detection message is shown.

c-1) Select “Yes”. c-2) The TV is reboot and OTA process starts. c-3) Select “No”

c-4) OTA process does not start. d) The TV is reboot and OTA process starts. e) If not, the OTA not detection message is shown.

c-1) Select “Yes”. c-2) The tv is reboot and OTA process starts. c-3) Select “No” c-4) OTA process does not start.

d) The TV is reboot and OTA process shows. e) If not , the OTA not detection message is shown.

2. DVB-S/S2

a) Click the Software Update.

b) Click the Manual Update.

c) Change Frequency, Polarization, Symbol Rate, FEC

for OTA TP. d) Click “Search” button e) If found, the OTA detection message is shown.

e-1) Select “Yes”. e-2) The tv is reboot and OTA process starts. e-3) Select “No” e-4) OTA process does not start.

f) The TV is reboot and OTA process shows.

If not , the OTA not detection message is shown.

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