LG 29MT45A Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS :

MODEL :

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LM91X

29MT45A 29MT45A-PMP

MFL68127212 (1402-REV00)

Printed in KoreaP/NO :

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ......................................................................... 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 8

TROUBLE SHOOTING ........................................................................... 12

BLOCK DIAGRAM .................................................................................. 23

EXPLODED VIEW .................................................................................. 24

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

- 2 -

LGE Internal Use Only

AC Volt-meter

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transfo rmer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e circuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Good Earth Ground such as WATER PIPE,

To Instrument's exposed METALLIC PARTS

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

0.15µF

1.5 Kohm/10W

CONDUIT etc.

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LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unl ess sp ecified othe rwise in this service manua l, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components com monly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" compon ents. The following techniques should be used to help reduce the incide nce of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter natively, obtain and wear a comme rcially availab le discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most re pla cem ent ES dev ice s are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carp eted floor can ge ner ate st atic electricit y sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 ˚F to 600 ˚F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500 ˚F to 600 ˚F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 ˚F to 600 ˚F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only un til the solder fl ows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

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LGE Internal Use Only

IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern si de of the circuit board. (Use this techniq ue onl y on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break an d loc ate the nearest component that is dir ect ly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

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LGE Internal Use Only

SPECIFICATION

NOTE : Specications and others are subject to change without notice for improvement.

1. Application Range

This spec sheet is applied all of the TV used LM91X chassis.

2. Specication

Each part is tested as below without special appointment

1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F), CST : 40 ˚C ± 5 ˚C

2) Relative Humidity : 65 % ± 10 %

3) Power Voltage : Standard input voltage (100 V - 240 V ~, 50 / 60 Hz)

· Standard Voltage of each products is marked by models

4) Specication and performance of each parts are followed each drawing and specication by part number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to the adjustment.

3.Test method

1) Performance : LGE TV test method followed

2) Demanded other specication

- Safety : CE,IEC specication

- EMC : CE,IEC specication

4. General specication

4.1. RGB-PC

No. Item Specication Remarks 1 Supported Sync. Type Separate Sync.(RGB), SOG

2 Operating Frequency Analog

3 Operating Frequency Analog

4 Operating Environment

5 Storage Environment

Temp : 10 °C ~ 35 °C Humidity : 20 % ~ 80 %

Temp : -10 °C ~ 60 °C non condensing Humidity : 5 % ~ 90 % non condensing

4.2. TV

No. Item Specication Remarks 1 Market Central and South America 2 Broadcasting system NTSC, PAL-M, PAL-N

BAND Available Channel

3 Available Channel

4 Receiving system Upper Heterodyne 5 Video Input PAL, SECAM, NTSC Rear (1EA) 6 RGB Input RGB-PC(Analog (D-SUB 15Pin) Rear (1EA) 7 USB Input MP3, JPEG, Movie Rear (1EA) 8 AV Audio Output RF/AV/HDMI Audio Output Rear (1EA) 9 HDMI Input HDMI-DTV Rear (1EA) 10 Audio Input (1EA) AV&RGB-PC L/R Input(1EA)

VHF UHF CATV

Horizontal 30 ~ 69 kHz Vertical 56 ~ 61 Hz Max 1366 × 768 @ 60 Hz Recommend 1366 × 768 @ 60 Hz

02~13 14~69 02~125

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LGE Internal Use Only

5. RGB Input ( PC )

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark

1 640*480 31.469 59.94 25.175

2 800*600 37.879 60.317 40.0

3 1024*768 48.363 60.0 65.0

4 1280*720 47.77 59.85 74.5

5 1152*864 54.34 60.05 80

6 1366*768 47.71 59.79 85.5

6. HDMI Input (DTV)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

Spec. out but display.2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4 720*480 31.47 59.94 27 SDTV 480P

5 720*480 31.5 60.00 27.027 SDTV 480P

6 720*576 31.25 50.00 27 SDTV 576P

7 1280*720 44.96 59.94 74.176 HDTV 720P

8 1280*720 45 60.00 74.25 HDTV 720P

9 1280*720 37.5 50.00 74.25 HDTV 720P

10 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.5 HDTV 1080P

14 1920*1080 67.432 59.94 148.350 HDTV 1080P

15 1920*1080 67.5 60.00 148.5 HDTV 1080P

16 1920*1080 27 24.00 74.25 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 26.97 23.97 74.25 HDTV 1080P

19 1920*1080 33.716 29.976 74.25 HDTV 1080P

- 7 -

LGE Internal Use Only

ADJUSTMENT INSTRUCTION

1. Application Range

This spec. sheet applies to LM91X Chassis applied TV all models manufactured in TV factory

2. Specication

1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.

2) Adjustment must be done in the correct order.

3) The adjustment must be performed in the circumstance of 25 °C ± 5 °C of temperature and 65 % ± 10 % of relative humidity if there is no specic designation.

4) The input voltage of the receiver must keep AC 100-240 V~, 50/60 Hz.

5) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over

15. In case of keeping module is in the circumstance of 0 °C, it should be placed in the circumstance of above 15 °C for 2 hours. In case of keeping module is in the circumstance of below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.

[Caution] When still image is displayed for a period of 20 minutes or longer (Especially where W/B scale is strong. Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area.

3. Main PCBA Adjustments

3.1. ADC Calibration

- An ADC calibration is automatically adjusted from DFT-Jig

- If it needs to adjust manually, refer to appendix.

NO Item CMD 1CMD 2Data 0

Enter

Adjust MODE

ADC

adjust

Adjust

‘Mode In’

ADC

adjust

A A 0 0 When transfer the

A D 1 0 Automatically adjustment

‘Mode In’,

Carry the command.

3.2.3. Download method

- The EDID data is automatically saved.

3.2.4. EDID DATA

- 29MT45A(RGB-PC)

** RGB-PC : 128Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D C8 59 01 01 01 01

10 01 17 01 03 68 34 1D 78 EA 53 4D A3 56 4F 9E 26

20 0F 47 4A A1 08 00 01 40 45 40 61 40 71 40 81 00

30 81 C0 01 01 01 01 66 21 56 AA 51 00 1E 30 46 8F

40 33 00 3F 43 21 00 00 1E 00 00 00 FD 00 38 3D 1E

50 45 09 00 0A 20 20 20 20 20 20 00 00 00 FC 00 32

60 44 20 48 44 20 4C 47 20 54 56 0A 20 00 00 00 FF

70 00 0A 20 20 20 20 20 20 20 20 20 20 20 20 00 67

- 29MT45A(HDMI)

** HDMI : 256Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D CA 59 01 01 01 01

10 01 17 01 03 80 34 1D 78 EA 53 4D A3 56 4F 9E 26

20 0F 47 4A 21 08 00 81 80 81 C0 71 40 B3 00 81 40

30 90 40 95 00 A9 C0 66 21 56 AA 51 00 1E 30 46 8F

40 33 00 09 25 21 00 00 1A 02 3A 80 18 71 38 2D 40

50 58 2C 45 00 09 25 21 00 00 1E 00 00 00 FD 00 38

60 3D 1E 45 0F 00 0A 20 20 20 20 20 20 00 00 00 FC

70 00 32 44 20 48 44 20 4C 47 20 54 56 0A 20 01 30

80 02 03 21 F1 4F 84 05 03 02 20 22 10 11 13 12 14

90 1F 07 16 01 26 11 07 50 09 7F 07 65 03 0C 00 10

A0 00 02 3A 80 18 71 38 2D 40 58 2C 45 00 09 25 21

B0 00 00 1A 01 1D 80 18 71 1C 16 20 58 2C 25 00 09

C0 25 21 00 00 9E 01 1D 00 72 51 D0 1E 20 6E 28 55

D0 00 09 25 21 00 00 1E 01 1D 80 D0 72 1C 16 20 10

E0 2C 25 80 09 25 21 00 00 9E 02 3A 80 D0 72 38 2D

F0 40 10 2C 45 20 09 25 21 00 00 1E 00 00 00 00 6F

* ADC Calibration Protocol (RS-232)

Adjust Sequence ▪aa 00 00 [Enter Adjust Mode] ▪xb 00 60 [RGB Input (1024*768)] ▪ad 00 10 [Adjust 1024*768 RGB] ▪aa 00 90 End Adjust mode

3.2. EDID Download

3.2.1. Overview

- It is a VESA regulation. A PC or a MNT will display an

optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.

3.2.2. Equipment

- Since EDID data is embedded, EDID download JIG, HDMI

cable and D-sub cable are not need.

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LGE Internal Use Only

4. Final Assembly Adjustment

4.1. White Balance Adjustment

4.1.1. Overview

▪ W/B adj. Objective & How-it-works (1) Objective: To reduce each Panel's W/B deviation (2) How-it-works : When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is xed at 192, and the other two is lowered to nd the desired value.

(3) Adjustment condition : normal temperature

1) Surrounding Temperature : 25 °C ± 5 °C

2) Warm-up time: About 5 Min

3) Surrounding Humidity : 20 % ~ 80 %

4) Before White balance adjustment, Keep power on

status, don’t power off * Adj. condition and cautionary items (1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding.

(2) Probe location: Color Analyzer (CA-210) probe should

be within 10cm and perpendicular of the module surface (80°~ 100°)

(3) Aging time

1) After Aging Start, Keep the Power ON status during

5 Minutes.

2) In case of LCD, Back-light on should be checked

using no signal or Full-white pattern.

4.1.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-

Gray(Model: 217, Pattern: 49) * Color Analyzer Matrix should be calibrated using CS-1000

4.1.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD ID DATA

wb 00 00 Begin White Balance adjustment

wb 00 ff

End White Balance adjustment (internal pattern disappears )

(2) Adjustment Map

Command

(lower caseASCII)

CMD1 CMD2 MIN MAX

Cool

Medium

Warm

Adj. item

R Gain j g 00 C0

G Gain j h 00 C0

B Gain j i 00 C0

R Cut

G Cut

B Cut

R Gain j a 00 C0

G Gain j b 00 C0

B Gain j c 00 C0

R Cut

G Cut

B Cut

R Gain j d 00 C0

G Gain j e 00 C0

B Gain j f 00 C0

R Cut

G Cut

Explantion

Data Range

(Hex.)

Default

(Decimal)

4.1.3. Equipment connection

Co lor Ana ly ze r

Pro be

DFT JIG

RRGB Cabl e S -23 2C

Signal S ourc e

* If TV internal pattern is used, not needed

Co m pu ter

Patt er n G en erat or

RS-23 2C

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LGE Internal Use Only

4.1.5. Adj. method

*Auto WB calibration

1) Set TV in ADJ mode using P-ONLY key (or POWER ON

key)

2) Place optical probe on the center of the display

- It need to check probe condition of zero calibration

before adjustment.

3) Connect RS-232C Cable

4) Select mode in ADJ Program and begin a adjustment.

5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode (Cool, Medium, Warm)

6) Remove probe and RS-232C cable. ▪ W/B Adj. must begin as start command “wb 00 00” , and n-

ish as end command “wb 00 ff”, and Adj. offset if need.

* LED White balance table If Model is Polaris Model, G-gain x is applied. (1) Cool Mode

1) Purpose : Especially G-gain x adjust leads to the lu-

minance enhancement. Adjust the color temperature to reduce the deviation of the module color temperature.

2) Principle : To adjust the white balance without the

saturation, Adjust the G gain more than 172 ( If R gain or G gain is more than 255 , G gain can adjust less than 172 ) and change the others ( R/B Gain ).

3) Adjustment mode : mode – Cool (2) Medium / Warm Mode

1) Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.

2) Principle : To adjust the white balance without the

saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others.

3)Adjustment mode : Two modes – Medium / Warm

4.1.6 Reference

(White Balance Adj. coordinate and color temperature)

1) Luminance: 204 Gray, 80IRE

2) Standard color coordinate and temperature using CS-1000

(over 26 inch)

4.1.7. Reference

(White Balance Adj. coordinate and color temperature)

* The spec of color temperature and coordinate.

Color Temperature

Luminance (cd/m²)

*Note : x,y coordinates are drifted about 0.007 after 30 mins heat-run. So checking color coordinate within 5-min at total assembly line, consider x,y coordinates might be up to 0.007 than x,y target of each color temperature.

Cool 9,300k °K X=0.274 (±0.03)

Medium 8,000k °K X=0.290 (±0.03)

Warm 6,500k °K X=0.318 (±0.03)

Cool Min : 80 Typ : 110 <Test Signal>

Medium Min : 80 Typ : 110

Warm Min : 70 Typ : 110

Y=0.278 (±0.03)

Y=0.298 (±0.03)

Y=0.334 (±0.03)

- Inner pattern for W/B adjust

- External white pattern

(80IRE, 204gray)

Inner pattern (204gray,80IRE)

5. Tool Option selection

▪ Method : Press "ADJ" key on the Adjustment remote control,

then select Tool option.

6. Ship-out mode check(In-stop)

▪ After nal inspection, press "IN-STOP" key of the Adjustment

remote control and check that the unit goes to Stand-by mode.

7. GND and Hi-pot

7.1. GND & HI-POT auto-check preparation

1) Check the POWER CABLE and SIGNAL CABE insertion condition

7.2. GND & HI-POT auto-check

1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)

2) Connect the AV JACK Tester.

3) Controller (GWS103-4) on.

4) GND Test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, execute next process (Hi-pot test).

(Remove A/V CORD from A/V JACK BOX)

5) HI-POT test (Auto)

- If Test is failed, Buzzer operates.

- If Test is passed, GOOD Lamp on and move to next

process automatically.

7.3. Checkpoint

1) Test voltage

- GND: 1.5KV/min at 100mA

- SIGNAL: 3KV/min at 100mA

2) TEST time: 1 second

3) TEST POINT

- GND Test = POWER CORD GND and SIGNAL CA-

BLE GND.

- Hi-pot Test = POWER CORD GND and LIVE & NEU-

TRAL.

4) LEAKAGE CURRENT: At 0.5mArms

8. Audio

Measurement condition:

1) RF input: Mono, 1 KHz sine wave signal, 100 % Modulation

2) CVBS, Component: 1 KHz sine wave signal 0.5 Vrms

3) RGB PC: 1 KHz sine wave signal 0.7 Vrms

No. Item Min Typ Max Unit Remark

Audio practical max Output, L/R

(Distortion=10% max Output)

4.5 5.0 6.0WVrms

(1) Measurement condition

- EQ/AVL/Clear Voice: Off (2) Speaker(8Ω Impedance)

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LGE Internal Use Only

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