Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
Analogue TV :
(RF) VHF: E2 to E12, UHF : E21 to E69
(CATV) S1 to S20, HYPER: S21 to S47
Digital TV : VHF, UHF
Satellite TV : VHF, UHF, C-Band, Ku-Band
* DVB-T2 ( T2 model only support )
*DVB-S/S2(Satellite model only support )
Satellite Digital TV : VHF, UHF, C-Band, Ku-Band
Digital TV : VHF, UHF
Analog TV : VHF, UHF, CATV
This document is applied to LD50B chassis TV which is
manufactured in TV (or Monitor) Factory or is produced on the
basis of this data.
2. Designation
1) The adjustment is according to the order which is designated and which must be followed, according to the plan which
can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specication Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA-
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV
have, TV can lost all channel data. In this case, you
have to channel recover. if all channel data is cleared,
you didn’t have a DTV/ATV test on production line.
- 9 -
LGE Internal Use Only
Page 10
3.1. EDID Process
3.1.1. EDID download
1) Press “Power only” key of service remote controller.
2) Press the “ADJ” Key of service remote controller.
3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.
4) Select “Start” menu to download EDID data.
5) Check the “OK” message.
6) Press EXIT key on R/C.
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XWUGXWGwG~iGGGG
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XZUGzGiVjG
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X[UG{GzGzG
X[UG{GzGzG
X\UGlUGpGhG
X\UGlUGpGhG
X]UGzwrGsGhG
X]UGzwrGsGhG
X^UzwkpmGsGhG
X^UzwkpmGsGhG
GGG
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→ Caution: - Do not connect HDMI & D-sub Cable when
* Edid data and Model option download (RS232)
NOItemCMD 1CMD 2Data 0
GG
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oktpXGGGGGGGGGGGGvrGGG
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download EDID.
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3.2. Function Check
3.2.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI( 22inch - PC : 1920 x 1080 @ 60Hz, 24/28inch - PC :
1366 x 768 @ 60Hz )
* Display and Sound check is executed by Remote controller
*SCART(MT47DC only support)
*Composite/Component(MT47VC only support)
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
3.3. CI+ key writing process.
(Device CN)
3.3.1. Download method
Enter
download
MODE
EDID data and
Model option
download
Download
‘Mode In’
AA00When transfer the
DownloadAE0010Automatically download
→ Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
3.1.2. EDID
- HDMI : Checksum - 96 7E
‘Mode In’,
Carry the command.
(The use of a internal
Data)
3.3.1.1. Communication Prot Connection
Connection : PCBA (USB Port) → USB to Serial Adapter (UC-
232A) → RS-232C cable → PC(RS-232C port)
3.3.2. CI+ Key Download
1) Set CI+ Key path Directory at Start Mac & CI+ Download
Programme.
2) Set COM 1,2,3,4 / 115200(Baudrate) (1)/(2)
3) Click port connection button(1)
4) Start CI+ Key Download, Push the button(4)
5) Check OK or NG.
6) After completing download, CI + key values are increase by
one automatically. To write CI+ key next SET, click CI+ key
writing button(5) directly.
7) Check whether the key was downloaded or not at ‘In Start’
1) Check the method of CI+ Key value
a) Check the method on Instart menu
2 ) Check the method of CI+ key value(RS232)
a) Into the main ass’y mode(RS232: aa 00 00)
CMD 1CMD 2Data 0
AA00
b) Check the mothed of CI+ key by command
(RS232: ci 00 20)
CMD 1CMD 2Data 0
CI20
4.2. Model name & Serial number Download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect USB Port → USB to Serial Adapter (UC-232A) →
RS-232C cable → PC(RS-232C port)
3) Write Model Name & Serial Number by use USB Port
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4.2.2. Method & notice
1) Model Name & Serial Number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
3) Result value
i 01 OK 1d1852d21c1ed5dcx
CI+ Key Value
4. Total Assembly line process
4.1. Tool option & ADC Check
1) Press "Power on" key of service remote control.
2) Connect USB Port → USB to Serial Adapter (UC-232A) →
RS-232C cable → PC(RS-232C port)
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok.
* Manual Download (Model Name and Serial Num-
ber)
If the TV set is downloaded By OTA or Service man, Sometimes model name or serial number is initialized.( Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the 'Instart' key of ADJ remote controller.
2) Go to the menu 'Model Number D/L' like below photo.
3) Input the Factory model name (ex 24LN4500) or Serial
number like photo.
4) Check the model name Instart menu → Factory name
displayed (ex 24MT55D)
5) Check the Diagnostics (DTV country only) → Buyer model
displayed (ex 24MT45D-PZP)
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI( 22inch - PC : 1920 x 1080 @ 60Hz, 24/28inch - PC :
1366 x 768 @ 60Hz )
* Display and Sound check is executed by Remote controller
*SCART(MT47DC only support)
*Composite/Component(MT47VC only support)
→ Caution : Not to push the INSTOP KEY after completion if the
function inspection.
4.3.2. PCMCIA CARD Check
You must adjust DTV 29 Channel and insert PCMCIA CARD
to socket.
- If PCMCIA CARD works normally, video signals will appear
on screen.But it works abnormally, "No CA module" will appear on screen.
→ Caution: Set up "RF mode" before launching products.
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* When doing Adjustment, Please make circumstance as
below.
4.4. White balance adjustment
-Equipment
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
*RGB Gains are xed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
→ Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
- Cool Panel
Color
Temperature
Luminance
(cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins
Cool9,300°K X=0.276 (±0.04)
Medium8,000°K X=0.290 (±0.04)
Warm6,500°K X=0.318 (±0.04)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
WarmMin : 70Typ : 110
Y=0.275 (±0.04)
Y=0.298 (±0.04)
Y=0.334 (±0.04)
<Test Signal>
Inner pattern
(204gray,80IRE)
Inner pattern
(204gray,80IRE)
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
1) Set Input to HDMI (with Input Label set to PC) and connect
HDMI cable to set – HDMI Mode
2) Cut off H sync or V sync of signal.
3) Check DPM operation refer to the below table.
Operating ConditionSync
Power S/W On Sleep mode -
RGB,HDMI
(H/V)
Off/OffOffAmber1
VideoLED
(SET)
Wattage
(W)
4.6. Model Name & SW Version & Adjust check.
* Press the ‘Instart’ key of ADJ remote controller
4.6.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller
to go out SVC menu.
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White Bal-
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
LG-NonOS SB51_ExtSPI 3’b000 51 boot from SPI
LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
14.06.09 : Don’t use AUD_MASTER_CLK
because wavy noise issue
+3.3V_ST
OPT
R119 4.7K
R116 4.7K
R120 4.7K
R117 4.7K
BOOT KEY OPTION
OPT
+3.3V_ST
R123 2.7K
OPT
R124 4.7K
OPT
R114
10K
R115
10K
OPT
C100
100pF
50V
If calculate current LED_RED level = 2.469V
If R123 is 2.7K, LED_RED level = 2.75V
And LED_RED high threshold is 2.5V when boot up
Please use 2.7K for R123
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
/SPI_CS
SPI_SDO
SPI_FLASH_MACRONIX
MX25L8035EM2I-10G
CS#
1
SO/SIO1
2
WP#/SIO2
3
GND
4
IC100
SPI_SCK
SPI_SDI
SPI_FLASH_WINBOND
IC100-*1
W25Q80DVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
+3.3V_ST
C104
0.1uF
VCC
8
16V
NC/SIO3
7
SCLK
6
R122
SI/SIO0
33
5
8
7
6
5
VCC
HOLD[IO3]
CLK
DI[IO0]
MT47_CI
2015/04/06
MAIN1_EU1 12
Page 22
COMP_L_IN
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI2015/04/06
MAIN2_EU
2 12
Page 23
JK400
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
KJA-DC-1-0032
HD(12V Panel)
IC400
AAM
GND
IN
SW
AAM
GND
IN
SW
MP2315GJ
1
2
3
4
IC401
MP2315GJ
1
2
3
4
JP400
4
2
1
C400
47uF
25V
105C
JP401
Add C401/2 to solve EMI issue.
150507 HJChoi
+19V
C402
C401
10uF
10uF
25V
25V
Check the Ripple
HD(12V Panel)
C404
2.2uF
25V
C405
2.2uF
25V
OPT
R402
1K
HD(12V Panel)
C406
0.1uF
50V
OPT
R403
47K
C407
0.1uF
50V
MULTI_ON
FB
8
VCC
7
EN/SYNC
6
68->100 150322 YJLee
To reduce SW spike voltage
BST
5
HD(12V Panel)
HD(12V Panel)
FB
8
VCC
7
EN/SYNC
6
68->100 150322 YJLee
BST
To reduce SW spike voltage
5
C403
0.1uF
16V
R406
100
C412
0.1uF
50V
R407
100
C413
0.1uF
50V
HD(12V Panel)
R409
10K
HD(12V Panel)
OPT
R410
2K
+3.3V_Normal
R411
10K
OPT
R412
2K
C417
0.1uF
16V
C418
0.1uF
16V
HD(12V Panel)
R418
33K
L402
10uH
HD(12V Panel)
HD(12V Panel)
C422
10uF
16V
R419
75K
L401
4.7uH
C423
22uF
6.3V
HD(12V Panel)
C424
10uF
16V
C425
10uF
10V
OPT
C428
0.1uF
25V
HD(12V Panel)
C429
0.1uF
16V
HD(12V Panel)
R42 1
43K
1%
HD(12V Panel)
R42 2
100 K
1%
HD(12V Panel)
R42 3
10K
1%
R42 7
4.7 K
1%
R42 8
0
5%
R42 9
10K
1%
C408
1000pF
+12V_Normal
50V
EMI
C414
0.01uF
3.3V NORMAL SWITCH
+3.3V_ST
SSM3J332R
Q402
D
S
R440
+3.3V_ST
+1.15V_VDDC
POWER_ON/OFF1
C415
C419
0.1uF
C421
0.1uF
16V
16V
OPT
OPT
0.1uF
25V
16V
EMI
OPT
R401
10K
C439
G
4.7uF
22K
10V
100
R438
R434
100K
C
Q400
B
2N3904S
E
C434
10V
1uF
OPT
C438
0.1uF
16V
+3.3V_Normal
C426
0.01uF
25V
Add to solve EMI
150615 YJLee
3.3V TO 1.5V LDO(DDR Power)
+3.3V_Normal
+1.5V_DDR
MULTI_ON
LED_AMBER
R456
4.7K
D400
MMBD6100
A2
A1
C
R400
10K
C410
0.47uF
C409
2.2uF
25V
IC404
AZ1117EH-ADJTRG1
OUTIN
C433
10uF
10V
ADJ/GND
R1
R2
R4431K1/16W
1%
R444
200
1/16W
1%
C435
10uF
10V
ZD400
2.5V
Vout = 1.25*(1+R2/R1) + Iadj*R2
PANEL POWER CONTROL
HD(12V Panel)
HD(12V Panel)
R442-*1
75K
+12V_PANEL_POWER
+5V_Normal
+12V_Normal
HD(12V Panel)
R437
R435
0
0
FHD(5V Panel)
AAM
GND
IN
SW
IC403
MP2315GJ
1
2
3
4
FB
8
VCC
7
EN/SYNC
6
68->100 150322 YJLee
To reduce SW spike voltage
BST
5
R415
100
C416
0.1uF
50V
OPT
R417
2K
C420
0.1uF
16V
L403
10uH
C427
10uF
R43 0
R43 1
8.2 K
R43 2
+5V_Normal
47K
1%
1%
10K
1%
R420
33K
C432
C431
10uF
10V
0.1uF
10V
16V
16V
OPT
C411
0.1uF
50V
R405
1K
OPT
1K
R433
FHD(5V Panel)
FHD(5V Panel)
C
B
E
FHD(5V Panel)
PANEL_CTL
Q404
R445
0
FHD(5V Panel)
R441
100K
R436
4.7K
R439
SSM3J332R
Q403
D
S
G
C440
4.7uF
16V
FHD(5V Panel)
R442
10K
C
Q401
B
2N3904S
E
10K
FHD(5V Panel)
R446
0
+5V_PANEL_POWER
R447
0
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
POWER
2015/04/06
4 12
Page 24
LCD MODULE (HD)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PIN22(23.6")
0~0.7V
2.7~3.3V
PIN22(27.5")
0~0.7V JEDIA
2.7~3.3V
+12V_PANEL_POWER
HD(12V Panel)
C600
0.1uF
25V
VESA
JEDIA
VESA
4.7K/10W*4ea 5.6/10W*2ea
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
23.6" (LVDS)
27.5" (LVDS)
HD(12V Panel)
5.6 K
R60 4
R607
0
HD(12V Panel)
HD(12V Panel)
P600
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
R608
0
5.6 K
R60 5
JP600
21
22
23
24
25
26
27
28
29
30
31
LCD MODULE (FHD)
+5V_PANEL_POWER
FHD(5V Panel)
FHD(5V Panel)
C602
0.1uF
16V
FHD(5V Panel)
5.6 K
R61 5
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
RXB3+
RXB3-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXB1+
RXB1-
RXB0+
RXB0-
5.6 K
R61 6
JP613
JP614
FHD(5V Panel)
P602
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
IR/TOUCH/JOYSTICK CONTROL WAFER
KEY2
KEY1
LED_RED
LED_AMBER
R600
10K
10K
R601
OPT
C
B
Q600
2N3904S
E
R602
10K
4.7K
OPT
R603
C
B
Q601
2N3904S
E
R611
100
R612
100
(IR VCC)
OPT
D410
D411
18V
VA600
30V
OPT
30V
+3.3V_ST
JP601
JP602
JP603
JP609
JP610
JP611
+3.3V_ST
R613
3.3K
R614
3.3K
R609
IR
200
50V
C601
1000pF
P603
12507WR-08L
1
2
3
4
5
6
7
8
9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
IR/CONTROL/MODULE
2015/04/06
6 12
Page 25
USB(SIDE)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
RS232C(SIDE)
DEBUG FOR MSTAR
SW_DEBUG_RGB
P700
12507WS-04L
1
2
3
4
5
20V
VA702
SW_DEBUG_RGB
+5V_Normal
20V
VA703
SW_DEBUG_RGB
+5V_Normal
R702
10K
R704
10K
0
R703
0
R705
SDA Net sawp with SCL
for same with MSTAR Jig
12.11.10
RGB_DDC_SCL
RGB_DDC_SDA
SPG
SPG15-UCS-0203
JK701-*1
1234
USB DOWN STREAM
C705
22uF
5
Freeport
3AU04S-305-ZC-(LG)
JK701
1234
USB DOW N ST REAM
5
JP713
PC AUDIO(SIDE)
(AUDIO IN)NON_EMI
L700-*1
0
1/16W
5%
(AUDIO IN)NON_EMI
L701-*1
0
1/16W
5%
AUDIO_IN
6 M6
1 M1
3 M3_DETECT
4 M4
KJA-PH-1-0177
5 M5_GND
JK702
AUDIO_IN
R724
1K
+5V_Normal
+3.3V_Normal
4.7K
USB_OCD
PC_AUDIO_DET
PC_R_IN
PC_L_IN
C708
0.1uF
16V
R738
MAX 1.5A(USB 2.0)
IC701
BD2242G
R709
2.2
R734
2.2
Add for EOS
150216 YJLee
12.08.10
47K->470K
OPT
R718
470K
OPT
R717
470K
VIN
1
GND
2
EN
3
+3.3V_Normal
AUDIO_IN
R721
470K
AUDIO_IN
R719
15K
AUDIO_IN
R720
15K
USB_CTL
R725
10K
USB_DM
USB_DP
(AUDIO IN)EMI
C700
1uF
6.3V
AUDIO_IN
R722
10K
AUDIO_IN
R723
10K
VOUT
6
5V
L700
AUDIO_IN
VA713
L701
VA714
AUDIO_IN
OPT
VA715
18V
18V
18V
R726
14K
ILIM
OC
VA716
OPT
C707
220pF
50V
OPT
C706
220pF
50V
5
4
18V
C723
ZD700
10uF
10V
OPT
JP712
JP711
OPT
VA712
18V
JP715
BLM15BD121SN1
(AUDIO IN)EMI
JP718
BLM15BD121SN1
(AUDIO IN)EMI
JP717
JP716
SW_DEBUG_RS232C
P701
12507WS-04L
1
2
3
4
PM_RXD
PM_TXD
100
R700
100
R701
+3.3V_ST
20V
VA700
SW_DEBUG_RS232C
JP700
JP701
20V
VA701
SW_DEBUG_RS232C
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
120918
JIG GND Point addition
JP714JP720 JP721JP719
5
Jack Shield (HDMI1, HDMI2)
JackShield(for NonCKD)
M700
MGJ64944801
JackShield(for CKD)
M700-*1
MGJ64944802
MT47_CI
2015/04/06
INTERFACE7 12
Page 26
HDMI
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
HDMI_1
HDMI PORT#1
SHIELD
20
EAG59023302
JK801
5V_HDMI_1
19
18
17
16
15
14
13
12
11
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
HDMI PORT#1
R801
1K
OPT
VA800
18V
5.1
AR800
5.1
AR801
+3.3V_ST
R802
47K
HDMI PORT#1
HDMI PORT#1
R805
10K
OPT
VA804
5.6V
OPT
VA803
OPT
VA809
18V
R8040
OPT
OPT
VA806
18V
(OPT)ESD_HDMI1_SEMTECH(DEV)
(OPT)ESD_HDMI1_SEMTECH(DEV)
B
18V
D800
RCLAMP0524PA
1
2
3
4
5
D801
RCLAMP0524PA
1
2
3
4
5
R809
47K
HDMI PORT#1
C
Q800
2N3904S
HDMI PORT#1
E
10
9
8
7
6
10
9
8
7
6
HDMI PORT#1
Q802
2N3904S
HDMI_ARC
HDMI_CEC
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
5V_DET_HDMI_1
C
E
B
HDMI PORT#1
IP4283CZ10-TBA
TMDS_CH1-
1
TMDS_CH1+
2
GND_1
3
TMDS_CH2-
4
TMDS_CH2+
5
(OPT)ESD_HDMI_NXP
D800-*1
HDMI PORT#1
R812
10K
VA812
18V
HDMI PORT#1
NC_4
TMDS_CH1-
10
NC_3
TMDS_CH1+
9
GND_2
8
NC_2
TMDS_CH2-
7
NC_1
TMDS_CH2+
6
VA814
18V
D801-*1
IP4283CZ10-TBA
1
2
GND_1
3
4
5
(OPT)ESD_HDMI_NXP
10
9
8
7
6
HPD1
DDC_SDA_1
DDC_SCL_1
NC_4
NC_3
GND_2
NC_2
NC_1
CEC
HDMI_CEC
5V_HDMI_1
HDMI PORT#1
R819
2.7K
R823
100
+5V_Normal
A2CA1
D804
MMBD6100
HDMI PORT#1
R820
2.7K
CEC_REMOTE_S7
HDMI PORT#1
DDC_SDA_1
DDC_SCL_1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
2015/04/06
HDMI8 12
Page 27
AUDIO AMP(ROHM)
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
+3.3V_AMP
19V_AMP
BLM15PX121SN1
L900
UBW2012-121F
+3.3V_Normal
L901
C902
Add to solve EMI
0.01uF
150615 YJLee
25V
+19V+19V
C900
0.1uF
50V
19V_AMP_2
L902
UBW2012-121F
C901
0.1uF
50V
AMP_SDA
AMP_SCL
+3.3V_Normal
AMP_MUTE
10K
AR900
Add to improve EMI
C905,C907,C909
YJLee 150615
AUD_SCK
AUD_LRCK
AUD_LRCH
1.5K
C903
2700pF
50V
R903
C904
0.027uF
50V
R904
10K
C905
33pF
50V
10V
1uF
C906
+3.3V_ST
B
3.3K
R905
C
E
C907
33pF
50V
R906
10K
Q902
2N3904S
SDATA
TEST1
REG15
R907100
C909
1000pF
[EP]
ADDR
1
BCLK
2
LRCK
3
4
5
PLL
6
7
DGND
8
C908
1uF
10V
50V
SCL
SDA
31
32
THERMAL
33
BM28720MUV
9
10
DVDD
TEST2
MUTEX
30
IC900
11
TEST3
AMP_RESET
OPT
1000pF
50V
C910
NC_2
RSTX
28
29
12
13
ERROR
STADAO
TP901
10V
C91110uF
REG_G
27
14
NC_1
10V
4.7uF
C913
OUT1P
BSP1P
25
26
24
23
22
21
20
19
18
17
15
BSP2N16OUT2N
10V
C9124.7uF
VCCP1
GNDP1
BSP1N
OUT1N
OUT2P
BSP2P
GNDP2
VCCP2
19V_AMP
19V_AMP_2
C918
10uF
25V
C919
10uF
25V
C920
10uF
25V
C921
10uF
25V
C925
C923
4.7uF
10V
10V
4.7uF
C928
680pF
50V
R915
5.6
R916
5.6
C929
680pF
50V
C926
680pF
50V
R913
5.6
R914
5.6
C927
680pF
50V
L905
10uH
PS064E-100MS
L906
10uH
PS064E-100MS
L903
10uH
PS064E-100MS
L904
10uH
PS064E-100MS
Close to Speaker
C933
0.33uF
50V
C934
0.33uF
50V
C931
0.33uF
50V
C932
0.33uF
50V
OPT
C937
0.47uF
50V
OPT
C936
0.47uF
50V
JP908
JP910
JP909
SMAW250-H04R
JP911
WAFER-ANGLE
4
3
2
1
P900
SPK_L+
SPK_L-
SPK_R+
SPK_R-
Headphone block
+3.3V_Normal
Head Phone
R901
47K
OPT
VA901
18V
KJA-PH-1-0177-2
JK900
Head Phone
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
JP900
JP902
JP901
JP903
Head Phone
VA900
18V
Head Phone
R902
1K
Head Phone
VA902
18V
HP_DET
+3.3V_AMP
Head Phone
R909
+3.3V_AMP
R910
1K
Head Phone
R908
1K
100K
C915
1000pF
OPT
C914
1000pF
50V
OPT
50V
Head Phone
C917
22uF
6.3V
Head Phone
C916
22uF
6.3V
HP_LOUT
10uF->22uF
150527 YJLee
HP_ROUT
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
AMP_ROHM/HP
2015/04/06
9 12
Page 28
+19V
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
LED DRIVER
BLU_CURRENT_CTL
WLED_DIM_ADJ
R1017
0
1/8W
5%
CMI23.6 HD
R1022-*1
12K
1%
R1021
2K
R1020
510K
1/8W
1%
L1001
33uH
EMI
EMI
C1009
10uF
R1016
100
R1019
100K
1%
1%
C1021
LGD FHD
R1022
1000pF
9.1K
50V
1%
CH1
CH2
CH3
CH4
25V
C1019
100pF
50V
R1037
33K
1%
100k->33k(3V->1.6V)
140323 YJLee
CMI23.6 HD_NOT
R1000
CMI23.6 HD
R1001
CMI23.6 HD
0
0
+19V
R1063
0
R1056 100K
C1010
10uF
25V
LED_CH3
Switching Freq:306KHz
22BM/23.6CMI
R1035
R1036
200K
20K
1%
1%
27.5BOE
22BM/27.5BOE
R1025
R1024
1.3K
6.2K
1%
1%
23.6CMI
R1024-*1
R1025-*1
5.1K
3.3K
1%
0
R1066
CMI23.6 HD
+19V
100K
100K
LED_CH1
LED_CH2
R1059
R1058
GND->19V MPS recommend
150326 YJLee
1%
OPT
R1006
100K
R1010
47K
C1003
0.1uF
16V
ISET
ADIM
LED4
LED3
LED2
LED1
NC_1
NC_2
VCC2
High : 1.5V
OPT
R1007
0
R1032
1K
R1030
10K
L1003
10uH
4700pF
R1038
270 1%
C1017
22uF
6.3V
WLED_ENABLE
C1024
50V
C1025
0.47uF
50V
Add sync circuit
150413 YJLee
OPT
C1018
10uF
10V
C1028
0.1uF
R1002
33
Isense_3.9K
R1008
3.9K
1%
+3.3V_ST
R10 39
5.1 K
1%
R10 41
16V
R10 34
27K
1%
10K
1%
Isense_3.9K
R1009-*1
3.9K
1%
Isense_0ohm
R1009
0
5%
G
Isense_0.01ohm
IC1001
MP3378
GND
1
OSC
2
3
4
5
6
7
8
OVP
9
10
11
FB
12
AAM
13
14
29
THERMAL
33K->51K
R1018
51K
[EP]GND
PWM
28
EN
27
COMP
26
C1022
VCC1
25
1uF
25V
VIN1
24
GATE
23
ISENSE
22
SYNC
21
BST
20
AGND
19
GND2_2
18
GND2_1
17
SW_1
16
VIN2
15
C1000
0.1uF
50V
R1023
C1020
100K
100pF
1%
50V
+19V
C1023
1uF
25V
R1029
100
68->100 150322 YJLee
C1015
To reduce SW spike voltage
0.1uF
50V
+19V
C1011
2.2uF
25V
D
S
R1044
Q1002
AOD2922
0.1
1%
D1002
BR210
100V
0.1
1%
R1043
R1043-*1
Isense_0.01ohm
Isense_0.06ohm
0.06
1%
Vout
L1000
L1002
500
500
Apply 500ohm Bead for EMI
150615 YJLee
7
6
5
4
3
2
1
12507WR-06L
P1004
(UPSIDE WAFER)LGD FHD/CMI 23.6"
CMI23.6 HD
R1062
0
M1004
M1005
M1006
M1007
M1008
CH1
CH2
Vout
CH3
CH4
R1042
0
CMI23.6 HD_NOT
7
6
5
4
3
2
1
12507WR-06L
P1005
(LFET WAFER)LGD FHD/CMI 23.6"
OPT
C1001
1uF
50V
OPT
C1002
1uF
50V
OPT
R1004
100K
OPT
R1005
100K
C1027
33uF
100V
33uF
100V
C1026
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
LED DRIVER
2015/04/06
10 12
Page 29
128SCALER
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
M1_DDR(2DDR)
2015/04/06
12 12
Page 30
CI Region
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
PCMCI
2015/04/06
19 12
Page 31
TUNER_T/C
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
TU2600
+3.3V_TU
+3.3V_TU
+3.3V_Normal
9
SHIELD
TDJS-G101D(A)
SCL
1
SDA
2
B[+3.3V]
3
CVBS
4
IF_AGC
5
SIF
6
IF[N]
7
IF[P]
8
R2600
10
R2601
10
C2601
20pF
50V
R2602 33
R2603 33
C2602
20pF
50V
+3.3V_TU
C2603
100pF
50V
C2600
0.1uF
16V
IF_P_MSTAR
IF_N_MSTAR
R2604
1K
C2605
20pF
50V
C2604
0.1uF
16V
IF_AGC_MAIN
should be guarded by ground
C2606
20pF
50V
R2605
1K
TU_SCL
TU_SDA
C2643
22uF
6.3V
L2606
UBW2012-121F
C2644
0.1uF
16V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MT47_CI
2015/04/06
TUNER_EU8 12
Page 32
SCART
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SCART AMP
DTV/MNT_L_OUT
SCART1_Lout
C2821
10uF
16V
330pF
C2819
R2861
2.2K
OPT
R2865
470K
220K
R2857
R2866
33K
C2823
33pF
R2862
5.6K
R2868
10K
IC2801
AZ4580MTR-E1
OUT1
1
IN1-
2
IN1+
3
VEE
4
+19V
C2817
0.1uF
50V
VCC
8
OUT2
7
IN2-
6
5
IN2+
R2869
R2867
33K
10K
C2824
33pF
R2863
5.6K
R2858
220K
R2864
470K
C2820
330pF
R2860
2.2K
OPT
C2822
10uF
16V
SCART1_Rout
DTV/MNT_R_OUT
FULL SCART
JK2801
PSC008-01
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND2
SYNC_GND1
RGB_IO
R_OUT
RGB_GND
R_GND
D2B_OUT
G_OUT
D2B_IN
G_GND
ID
B_OUT
AUDIO_L_IN
B_GND
AUDIO_GND
AUDIO_L_OUT
AUDIO_R_IN
AUDIO_R_OUT
5.6V
ZD2806
5.6V
ZD2807
VA2811
18V
ESD_SCART
ESD_SCART
VA2812
18V
VA2813
18V
ESD_SCART
VA2814
18V
ESD_SCART
VA2815
5.6V
ESD_SCART
VA2817
5.6V
ESD_SCART
VA2808
5.6V
OPT
R2806
75
1%
R2802
75
1%
R2803
75
1%
R2804
470K
R2805
470K
VA2810
5.6V
R2807
75
1%
+3.3V_Normal
R2808
C2801
47pF
50V
CLOSE TO MSTAR
CLOSE TO MSTAR
10K
R2810
1K
SCART1_DET
SC1_CVBS_IN
C2806
1000pF
50V
C2807
1000pF
50V
SC1_R+
SC1_G+
SC1_B+
R2830
75
C3485
68pF
50V
L2607
220nH
R2811
75
1%
R2814
15K
VA2816
18V
ESD_SCART
R2812
10K
R2813
10K
C3484
68pF
50V
R2815
22
R2817
3.9K
R2818
12K
R2819
12K
DTV/MNT_VOUT
SC1_FB
SC1_ID
SC1_L_IN
SC1_R_IN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
VA2818
5.6V
OPT
VA2819
5.6V
OPT
C2804
1000pF
50V
C2805
1000pF
50V
DTV/MNT_L_OUT
DTV/MNT_R_OUT
MT47_CI
SCART
2015/04/06
28 12
Page 33
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