LG 24MT47DC-PZ/WZ Schematic

Internal Use Only
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LED TV
SERVICE MANUAL
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LD50B
24MT47DC 24MT47DC-PZ
24MT47DC-WZ
MFL68920155 (1508-REV00)
Printed in KoreaP/NO :
CONTENTS
CONTENTS .............................................................................................. 2
SAFETY PRECAUTIONS ......................................................................... 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING ........................................................................... 13
BLOCK DIAGRAM .................................................................................. 17
EXPLODED VIEW .................................................................................. 18
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 2 -
LGE Internal Use Only
AC Volt-meter
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground such as WATER PIPE,
To Instrument's exposed METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
0.15µF
1.5 Kohm/10W
CONDUIT etc.
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 4 -
LGE Internal Use Only
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 5 -
LGE Internal Use Only
SPECIFICATION
NOTE : Specications and others are subject to change without notice for improvement.
1. Application Range
This spec sheet is applied all of the TV used LD50B chassis.
2. Specication
Each part is tested as below without special appointment
1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F), CST : 40 ˚C ± 5 ˚C
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage : Standard input voltage (100 V - 240 V ~, 50 / 60 Hz)
· Standard Voltage of each products is marked by models
4) Specication and performance of each parts are followed each drawing and specication by part number in accord-
ance with BOM.
5) The receiver must be operated for about 5 minutes prior to the adjustment.
3.Test method
1) Performance : LGE TV test method followed
2) Demanded other specication
- Safety : CE,IEC specication
- EMC : CE,IEC specication
4. Electrical specication
4.1. Model general specication
No Item Specication Remarks
1 Market EU(PAL/DVB Market) DTV & Analog (Total 39countries)
DTV (MPEG2/4, DVB-T) :39 countries UK/Italy/Germany/France/Spain/Sweden/Finland/Nether­lands/ Belgium/Luxemburg/ Greece/Denmark/Czech/ Austria /Hungary/Swiss/Croatia/Turkey Norway/Slovenia/Poland/Ukraine/Portugal/Ireland/Morocco/ Latvia/Estonia/Lithania/Rumania/Bulgaria/Russia/Slovakia Bosnia/Serbia/Albania/Kazakhstan/Belarus/Macedonia/Mon­golia *4 Country, Nordic option(EU model only)
- Denmark , Finland, Norway, Sweden DTV (MPEG2/4, DVB-T2): 8 countries UK/Denmark/Sweden/Finland/Norway/Ireland/Ukraine/ Kazakhstan DTV (MPEG2/4, DVB-C): 39 countries UK/Italy/Germany/France/Spain/Sweden/Finland/Nether­lands/ Belgium/Luxemburg/ Greece/Denmark/Czech/ Austria /Hungary/Swiss/Croatia/Turkey Norway/Slovenia/Poland/Ukraine/Portugal/Ireland/Morocco/ Latvia/Estonia/Lithania/Rumania/Bulgaria/Russia/Slovakia Bosnia/Serbia/Albania/Kazakhstan/Belarus/Macedonia/Mon­golia DTV (MPEG2/4,DVB-S): 29 countries Italy/Germany/France/Spain/Netherlands/ Belgium/ Luxemburg/ Greece/ Czech/Austria /Hungary/Swiss/Croatia/ Turkey/Slovenia/Poland/Portugal/ Morocco/Latvia/ Estonia/Lithuania/Rumania/Bulgaria/Russia/Slovakia Bosnia/Serbia/Albania/ Belarus Supported satellite : 22 satellites HISPASAT 1C/1D, ATLANTIC BIRD 2, NILESAT 101/102, ATLANTIC BIRD 3, AMOS 2/3, THOR 5/6, IRIUS 4, EUTELSAT-W3A, EUROBIRD 9A, EUTELSAT-W2A, HOT­BIRD 6/8/9, EUTELSAT-SESAT, ASTRA 1L/H/M/KR, ASTRA 3A/3B, BADR 4/6, ASTRA 2D, EUROBIRD 3, EUTELSAT­W7, HELLASSAT 2, EXPRESS AM1, TURKSAT 2A/3A, INTERSAT10
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
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LGE Internal Use Only
No Item Specication Remarks
2 Broadcasting system - Analogue TV
1) PAL-BG
2) PAL-DK
3) PAL-I/I’
4) SECAM-BG
5) SECAM-DK
6) SECAM L/L’
- Digital TV
1) DVB-T/C/T2
- Satellite Digital TV
1) DVB-T2/C/S/S2
3 Channel Storage 1)DVB-T/C & Analog TV : 1500EA
2)DVB-T/T2/C/S2 & Analog TV : 6000EA
4 Receiving system Analog : Upper Heterodyne
Digital : COFDM, QAM
5 Interface RF / Composite /
Component(CVBS) / HDMI / SCART / USB / LAN(option)
6 DVB DVB-T CI : UK, Finland, Denmark, Norway, Sweden, Russia, Spain,
DVB-C CI : Switzerland, Austria, Slovenia, Hungary, Bulgaria
DVB-S CI + : Germany (Astra HD+)
Analogue TV : (RF) VHF: E2 to E12, UHF : E21 to E69 (CATV) S1 to S20, HYPER: S21 to S47 Digital TV : VHF, UHF Satellite TV : VHF, UHF, C-Band, Ku-Band * DVB-T2 ( T2 model only support ) *DVB-S/S2(Satellite model only support )
Satellite Digital TV : VHF, UHF, C-Band, Ku-Band Digital TV : VHF, UHF Analog TV : VHF, UHF, CATV
► DVB-T
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32
- Modulation : Code Rate QPSK : 1/2, 2/3, 3/4, 5/6, 7/8 16-QAM : 1/2, 2/3, 3/4, 5/6, 7/8 64-QAM : 1/2, 2/3, 3/4, 5/6, 7/8
► DVB-T2
- Guard Interval(Bitrate_Mbit/s) 1/4, 1/8, 1/16, 1/32, 1/128, 19/128, 19/256,
- Modulation : Code Rate QPSK : 1/2, 2/5, 2/3, 3/4, 5/6 16-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 64-QAM : 1/2, 2/5, 2/3, 3/4, 5/6 256-QAM : 1/2, 2/5, 2/3, 3/4, 5/6
► DVB-C
- Symbolrate :
4.0Msymbols/s to 7.2Msymbols/s
- Modulation : 16QAM, 64-QAM, 128-QAM and 256-QAM
► DVB-S/S2
- symbolrate DVB-S2 (8PSK / QPSK) : 2 ~ 45Msymbol/s DVB-S (QPSK) : 2 ~ 45Msymbol/s
- viterbi DVB-S mode : 1/2, 2/3, 3/4, 5/6, 7/8 DVB-S2 mode : 1/2, 2/3, 3/4, 3/5, 4/5, 5/6, 8/9, 9/10
Refer to ”5. Feature and Function” *SCART(MT47DC only support) *Composite/Component(MT47VC only support)
Ireland, Luxemburg, Belgium, Netherland
CI+ : France(Canal+), Italy(DGTVi)
CI+ : Switzerland(UPC,Cablecom), Netherland(Ziggo),
Germany(KDG,CWB), Finland(labwise)
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- 7 -
LGE Internal Use Only
5. External Input Support Format
- HDMI (PC)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720*400 31.468 70.080 28.321
2 640*480 31.469 59.940 25.175
3 640*480 37.500 75.000 31.500
4 800*600 37.879 60.317 40.000
5 800*600 46.875 75.000 49.500
6 1024*768 48.363 60.004 65.000
7 1024*768 60.023 75.029 78.750
8 1280*800 49.702 59.810 83.500
9 1366*768 47.717 59.79 85.5
- HDMI (DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P
2 720*576 31.25 50.00 27.864 SDTV 576P
3 1280*720 37.50 50.00 74.250 HDTV 720P
4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P
5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I
6 1920* 1080 28.125 50.00 74.25 HDTV 1080I
7 1920* 1080 27.00 24 74.25 HDTV 1080P
8 1920* 1080 33.75 30.00 74.25 HDTV 1080P
9 1920* 1080 56.250 50 148.5 HDTV 1080P
10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 8 -
LGE Internal Use Only
ADJUSTMENT INSTRUCTION
(2)
(6)
(5)
1. Application Range
This document is applied to LD50B chassis TV which is manufactured in TV (or Monitor) Factory or is produced on the basis of this data.
2. Designation
1) The adjustment is according to the order which is designat­ed and which must be followed, according to the plan which can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specication Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA-
110), DDC Adjustment Jig equipment, SVC remote control­ler.
7) Push The "IN STOP KEY" – For memory initialization
Case1 : Software version up
1) After downloading S/W by USB , Multi-vision set will reboot automatically
2) Push "In-stop" key
3) Push "Power on" key
4) Function inspection
5) After function inspection, Push "In-stop" key.
Case2 : Function check at the assembly line
1) When TV set is entering on the assembly line, Push "In-
stop" ke y at rst.
2) Push "Power on" key for turning it on.
→ If you push "Power on" key, TV set will recover channel
information by itself.
3) After function inspection, Push "In-stop" key.
4) Click “Read” tab, and then load download le(XXXX.bin) by
clicking “Read”
(4)
filexxx.bin
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
(5)
(7) ……….OK
* USB DOWNLOAD(*.epk le download)
1) Make New folder named “LG_DTV” and put ISP le(*.epk)
in the folder.
2) Put the USB Stick to the USB socket.
3) Automatically detecting update le in USB Stick
- If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting.
4) Show the message “Copy the le from the Memory…”
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot le Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Cong” tab.
2) Set as below, and then click “Auto Detect” and check “OK” message. If display “Error”, Check connect computer, jig, and set.
3) Click “Connect” tab. If display “Can’t ”, Check connect computer, jig, and set.
(1) (3)
Please Check the Speed :
Use the speed under
OK
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
200KHz.
5) Updating is starting.
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV
have, TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
- 9 -
LGE Internal Use Only
3.1. EDID Process
3.1.1. EDID download
1) Press “Power only” key of service remote controller.
2) Press the “ADJ” Key of service remote controller.
3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.
4) Select “Start” menu to download EDID data.
5) Check the “OK” message.
6) Press EXIT key on R/C.
G
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XUG{GvYG G G
YUG{GvZG G G
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ZUG{Gv[G G G
ZUG{Gv[G G G
[UG{Gv\G G G
[UG{Gv\G G G
\UG{Gv]G
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XYUGlkpkGkVsG ඖG G
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X\UGlUGpGhG
X\UGlUGpGhG
X]UGzwrGsGhG
X]UGzwrGsGhG
X^UzwkpmGsGhG
X^UzwkpmGsGhG
G G G
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→ Caution: - Do not connect HDMI & D-sub Cable when
* Edid data and Model option download (RS232)
NO Item CMD 1CMD 2Data 0
G G
G G
G G
G G
lkpkGkVsG
lkpkGkVsG
oktpXGG GG GG GG GG GG vrG G G
oktpXGG GG GG GG GG GG vrG G G
G G
G G
yniGG GG GG GG GG GG GG vrG G G
yniGG GG GG GG GG GG GG vrG G G
G G G
G G G
G zG G yG G
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download EDID.
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3.2. Function Check
3.2.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI( 22inch - PC : 1920 x 1080 @ 60Hz, 24/28inch - PC :
1366 x 768 @ 60Hz )
* Display and Sound check is executed by Remote controller
*SCART(MT47DC only support) *Composite/Component(MT47VC only support)
→ Caution : Not to push the INSTOP KEY after completion if
the function inspection.
3.3. CI+ key writing process. (Device CN)
3.3.1. Download method
Enter
download
MODE
EDID data and
Model option
download
Download ‘Mode In’
A A 0 0 When transfer the
Download A E 00 10 Automatically download
→ Caution
* Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
3.1.2. EDID
- HDMI : Checksum - 96 7E
‘Mode In’,
Carry the command.
(The use of a internal
Data)
3.3.1.1. Communication Prot Connection
Connection : PCBA (USB Port) → USB to Serial Adapter (UC-
232A) → RS-232C cable → PC(RS-232C port)
3.3.2. CI+ Key Download
1) Set CI+ Key path Directory at Start Mac & CI+ Download Programme.
2) Set COM 1,2,3,4 / 115200(Baudrate) (1)/(2)
3) Click port connection button(1)
4) Start CI+ Key Download, Push the button(4)
5) Check OK or NG.
6) After completing download, CI + key values are increase by one automatically. To write CI+ key next SET, click CI+ key writing button(5) directly.
7) Check whether the key was downloaded or not at ‘In Start’
Copyright © LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
menu. (Refer to below).
LGE Internal Use Only
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