Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transfo rmer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Good Earth Ground
such as WATER PIPE,
To Instrument's
exposed
METALLIC PARTS
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unl ess sp ecified othe rwise in this service manua l, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components com monly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" compon ents. The following techniques
should be used to help reduce the incide nce of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alter natively, obtain and wear a comme rcially availab le
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most re pla cem ent ES dev ice s are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi nimiz e bodil y motions w hen h an dl ing u np ac kaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carp eted floor can ge ner ate st atic electricit y
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only un til the solder fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of the circuit board. (Use this techniq ue onl y on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break an d loc ate the nearest component that is dir ect ly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
Analogue TV :
(RF) VHF: E2 to E12, UHF : E21 to E69
(CATV) S1 to S20, HYPER: S21 to S47
Digital TV : VHF, UHF
Satellite TV : VHF, UHF, C-Band, Ku-Band
* DVB-T2 ( T2 model only support )
*DVB-S/S2(Satellite model only support )
This document is applied to LD41A chassis TV which is manufactured in TV (or Monitor) Factory or is produced on the basis
of this data.
2. Designation
1) The adjustment is according to the order which is designated and which must be followed, according to the plan which
can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specication Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220 V, 60 Hz
6) Adjustment equipments : Color Analyzer (CA-210 or CA-
6) Updating Completed, The TV will restart automatically.
7) If your TV is turned on, check your updated version and
Tool option. (explain the Tool option, next stage)
* If downloading version is more high than your TV
have, TV can lost all channel data. In this case, you
have to channel recover. if all channel data is cleared,
you didn’t have a DTV/ATV test on production line.
LGE Internal Use Only
Page 12
3.1. EDID Process
3.1.1. EDID download
1) Press “Power only” key of service remote controller.
2) Press the “ADJ” Key of service remote controller.
3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.
4) Select “Start” menu to download EDID data.
5) Check the “OK” message.
6) Press EXIT key on R/C.
G
G
WUG{GvXGGG
WUG{GvXGG G
XUG{GvYGGG
XUG{GvYGG G
YUG{GvZGGG
YUG{GvZGG G
ZUG{Gv[GGG
ZUG{Gv[GG G
[UG{Gv\GGG
[UG{Gv\GG G
\UG{Gv]G
\UG{Gv]G
]UGjGnG
]UGjGnG
^UGhGvG
^UGhGvG
_UGhkjGjG
_UGhkjGjG
`UG~GiGGG
`UG~GiGG G
XWUGXWGwG~iGGGG
XWUGXWGwG~iGGG G
XXUG{GwGGGGG
XXUG{GwGG GG G
XYUGlkpkGkVsGඖGG
XYUGlkpkGkVsGඖG G
XZUGzGiVjG
XZUGzGiVjG
X[UG{GzGzG
X[UG{GzGzG
X\UGlUGpGhG
X\UGlUGpGhG
X]UGzwrGsGhG
X]UGzwrGsGhG
X^UzwkpmGsGhG
X^UzwkpmGsGhG
GGG
GG G
→ Caution: - Do not connect HDMI & D-sub Cable when
* Edid data and Model option download (RS232)
NOItemCMD 1CMD 2Data 0
GG
G G
GG
G G
oktpXGGGGGGGGGGGGvrGGG
oktpXGG GG GG G GG GG GvrG GG
GG
G G
yniGGGGGGGGGGGGGGvrGGG
yniGG GG G GG GG GG GG GvrGG G
GGG
GGG
GzGGyGG
GzGG yGG
download EDID.
lkpkGkVsG
lkpkGkVsG
G
G
G
G
3.1.2. RGB EDID Data
- RGB EDID Data (Rev2, 2012.08.29) – Checksum : C1
1) Press "Power on" key of service remote control.
2) Connect USB Port → USB to Serial Adapter (UC-232A) →
RS-232C cable → PC(RS-232C port)
3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)
4) Check the ‘ADC’ is ok.
4.2. Model name & Serial number Download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect USB Port → USB to Serial Adapter (UC-232A) →
RS-232C cable → PC(RS-232C port)
3) Write Model Name & Serial Number by use USB Port
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below).
4.2.2. Method & notice
1) Model Name & Serial Number D/L is using of scan equipment.
2) Setting of scan equipment operated by Manufacturing
Technology Group.
3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
* Manual Download (Model Name and Serial
Number)
If the TV set is downloaded By OTA or Service man, Sometimes model name or serial number is initialized.( Not always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the 'Instart' key of ADJ remote controller.
2) Go to the menu 'Model Number D/L' like below photo.
3) Input the Factory model name (ex 24LN4500) or Serial
number like photo.
4.3. Function Check
4.3.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
1) TV(DTV, RF, Satellite(Satellite model))
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI1/2(PC : 1366 x 768 @ 60Hz) –
5) RGB(PC : 1366 x 768 @ 60Hz)
6) PC Audio In
7) Headphone out
8) USB
9) LAN (2xMT55V model Only)
* Display and Sound check is executed by Remote controller
* Some models do not support RGB & PC audio in. It depends
on model spec.
→ Caution : Not to push the INSTOP KEY after completion if the
function inspection.
4.3.2. PCMCIA CARD Check
You must adjust DTV 29 Channel and insert PCMCIA CARD
to socket.
- If PCMCIA CARD works normally, video signals will appear
on screen.
But it works abnormally, "No CA module" will appear on
screen.
→ Caution: Set up "RF mode" before launching products.
4.3.3. PIP Check
1) Press "Power on" key of service remote control.
2) Input RGB & TV(ATV or DTV) signal.
3) Set Input mode to RGB.
4) Press ‘PIP" key of ADJ remote controller
5) Check TV Video & Audio signal of Sub picture.
4) Check the model name Instart menu → Factory name
displayed (ex 24MT55D)
5) Check the Diagnostics (DTV country only) → Buyer model
displayed (ex 24MT45D-PZP)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remocon
*RGB Gains are xed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
→ Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
Color
Temperature
Luminance
(cd/m²)
*Note : x,y coordinates are drifted about 0.007 after 30 mins
*Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "White Bal-
G
WUG{GvXGG G
XUG{GvYGG G
YUG{GvZGG G
ZUG{Gv[GG G
[UG{Gv\G
\UG{Gv]G
]UGjGnGG G
^UGhGvG
_UGhkjGjG GG GG GG GG
`UG~GiGG GG GG GG GG ඖG G G
XWUGXWGwG~iGGG G
XXUG{GwGG GG G
XYUGlkpkGkVsGG GG GG GG GG GG G GG G
XZUGzGiVjG
X[UG{GzGzG
X\GlUGpGhG
GG G
Cool9,300°KX=0.290 (±0.03)
Medium8,000°K X=0.300 (±0.03)
Warm6,500°K X=0.318 (±0.03)
CoolMin : 80Typ : 110<Test Signal>
MediumMin : 80Typ : 110
WarmMin : 70Typ : 110
Y=0.298 (±0.03)
Y=0.310 (±0.03)
Y=0.334 (±0.03)
<Test Signal>
Inner pattern
(204gray,80IRE)
Inner pattern
(204gray,80IRE)
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
ance".
G G
~GiG
jG{UGඔG jG ඖG
G G
yTnGGXWWG G
nTnGGXW[G G
iTnGGX`YG G
yTjGG][G G
nTjGG][G G
iTjGG][G G
G G
{TwGGvuG G
iGGXWWG G
yGG{GzG G
4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
1) Set Input to RGB-PC and connect D-sub cable to set –
RGB Mode
Set Input to HDMI (with Input Label set to PC) and con-
nect HDMI cable to set – HDMI Mode
2) Cut off H sync or V sync of signal.
3) Check DPM operation refer to the below table.
Operating ConditionSync
Power S/W On Sleep mode -
RGB,HDMI
(H/V)
Off/OffOffAmber1
VideoLED
(SET)
Wattage
(W)
4.6. Model Name & SW Version & Adjust check.
* Press the ‘Instart’ key of ADJ remote controller
4.6.1. Model Name& SW Version Check
1) Check ‘Model Name’.
2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)
4.6.2. Adjust Check
1) Check ‘Country Group’
2) Check ‘Area Option’
3) Check ‘Tool Option’ (Refer to the BOM Comments)
4) Check ‘Adjust ADC[Comp&RGB]’ is OK.
5) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controller
to go out SVC menu.
* When doing Adjustment, Please make circumstance as
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
JK400
KJA-DC-1-0032
11.11.07
6604->6601
8
7
6
5
8
7
6
5
8
7
6
5
FB
VCC
EN/SYNC
BST
FB
VCC
EN/SYNC
BST
FB
VCC
EN/SYNC
BST
IC403
MP2315GJ
1
2
3
4
MULTI_ON
8
7
6
5
C415
0.1uF
R406
68
C412
0.1uF
50V
R407
68
C413
0.1uF
50V
16V
FB
VCC
EN/SYNC
BST
R408
68
C414
0.1uF
50V
R409
10K
OPT
R410
2K
R411
100K
R412
20K
+3.3V_Normal
R414
10K
OPT
R413
2K
R415
68
C416
0.1uF
50V
C417
0.1uF
16V
C418
0.1uF
16V
R416
75K
1%
C419
0.1uF
16V
OPT
R417
2K
L400
4.7uH
L401
10uH
R418
33K
10uH
L402
C422
10uF
R419
33K
C421
22uF
6.3V
C420
0.1uF
16V
16V
C423
22uF
6.3V
C424
10uF
C425
10uF
16V
OPT
10V
C426
10uF
L403
10uH
+12V_Normal
R42 1
43K
C432
0.1uF
1%
R42 2
100 K
1%
R42 3
10K
1%
+3.3V_ST
R401
10K
+3.3V_ST
R42 7
5.1 K
1%
R42 8
27K
1%
R42 9
10K
1%
+1.15V_VDDC
R42 4
4.7 K
1%
R42 5
0
5%
R42 6
10K
1%
+5V_Normal
R43 0
39K
1%
R43 1
R43 2
15K
1%
10K
1%
16V
POWER_ON/OFF1
3.3V TO 1.5V LDO(DDR Power)
+3.3V_Normal
R433
10K
+3.3V_ST
R434
100K
B
C433
10uF
10V
PANEL POWER CONTROL
+5V_Normal
+12V_Normal
FHD(5V Panel)
R435
0
PANEL_CTL
FHD
R3466
1K
HD(12V Panel)
R437
0
NC_1
EN2
VIN3
NC4
B
R436
4.7K
+3.3V_ST
R440
22K
R438
100
C
Q400
MMBT3904(NXP)
E
TJ4220GDP-ADJ
1
2
3
4
C
MMBT3904(NXP)
Q404
FHD
R3467
E
0
FHD
10K
R439
IC404
B
9
THERMAL
C439
4.7uF
10V
[EP]GND
GND
8
ADJ/SENSE
7
VOUT
6
NC_2
5
R441
100K
FHD(5V Panel)
R442
10K
C
Q401
MMBT3904(NXP)
E
G
PMV48XP
Q402
C434
1uF
10V
OPT
C435
0.01uF
25V
C440
4.7uF
16V
HD(12V Panel)
R442-*1
4.7K
S
D
1%
10K
R445
1%
R443
1K
1%
R444
10K
+12V_PANEL_POWER
HD(12V Panel)
Q403
AO3407A
S
G
C436
D
1uF
16V
HD(12V Panel)
13.06.28
For Module Power Sequence
R441 : 22k --> 100k
R442 : 1k --> 10k
R446
0
+3.3V_Normal
C438
0.1uF
16V
+1.5V_DDR
C437
10uF
10V
OPT
+5V_PANEL_POWER
FHD(5V Panel)
R447
0
C428
0.1uF
16V
C429
0.1uF
16V
C430
0.1uF
10V
16V
OPT
R420
33K
C427
C431
10uF
10uF
10V
10V
IC400
AAM
GND
IN
SW
AAM
GND
IN
SW
MP2315GJ
1
2
3
4
IC401
MP2315GJ
1
2
3
4
C406
0.1uF
50V
C407
0.1uF
50V
R402
47K
OPT
R403
47K
JP400
4
2
1
JP401
C400
47uF
25V
105C
+19V
OPT
OPT
C402
C401
10uF
10uF
25V
25V
Check the Ripple
C404
2.2uF
25V
C405
2.2uF
25V
19V to 1.15V (M1 Core)
IC402
10K
C410
0.47uF
MP2315GJ
AAM
1
IN
2
SW
3
GND
4
19V TO 5V DCDC CONVERTER
OPT
16V
OPT
R405
AAM
47K
IN
C411
0.1uF
50V
SW
GND
C403
2.2uF
25V
MULTI_ON
LED_AMBER
C408
0.1uF
50V
D400
MMBD6100
A2
A1
OPT
R404
47K
R400
C
C409
2.2uF
25V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
POWER
2013/09/16
4 13
Page 23
Module(HD)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
PIN22
0~0.7V
2.7~3.3V
PIN22 (29")
0~0.7V JEDIA
2.7~3.3V
PIN21
21.6
GND
ALL panel
NC
+12V_PANEL_POWER
111116
100uF Ecap
Deletion
EAE38362801
HD(12V Panel)
C600
0.1uF
16V
VESA
JEDIA
VESA
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
26"/27.5" (LVDS)
R607 0
4.7K/10W*4ea 5.6/10W*2ea
5.6 K
R60 4
HD(12V Panel)
23.6" (LVDS)
R608 0
5.6 K
R60 5
HD(12V Panel)
JP600
HD(12V Panel)
P600
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Module(FHD)
+5V_PANEL_POWER
FHD(5V Panel)
C602
0.1uF
16V
For Interlace Mode
High : Interlace Mode
Low : Normal Mode
2013.07.15
INTERLACE_CTRL
RXACK+
RXACK-
RXA2+
RXA2-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXA3+
RXA3-
RXA1+
RXA1-
RXA0+
RXA0-
RXB3+
RXB3-
RXB1+
RXB1-
RXB0+
RXB0-
+3.3V_Normal
OPT
R625
4.7K
5.6 K
R61 5
FHD(5V Panel)
FHD(5V Panel)
OPT
R626
100
JP613
5.6 K
R61 6
JP614
FHD(5V Panel)
R627
0
FHD(5V Panel)
P602
10031HR-30
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
IR/LED and Control
KEY_SCL
KEY_SDA
LB_joy_stick
R606-*2 150
Amber LED(Non M75):5.9mA
Amber LED(M75) : 16mA
LED_RED
R600
10K
OPT
LED_AMBER
R601
C
B
Q600
MMBT3904(NXP)
E
10K
R602
10K
OPT
(IR Port protection against ESD)
C
B
Q601
MMBT3904(NXP)
E
4.7K
R603
+3.3V_ST
IR
1/10W
1%
+3.3V_ST
MT_joy_stick
R606150
1/10W
1%
touch_key
R606-*1 270
1/10W
1%
121018
100ohm->200ohm
KEY2
KEY1
+3.3V_ST
MT_joy_stick
R610270
LB_joy_stick
121118
touch_key
R610-*2
R610-*1 330
680
1/10W
5%
Red LED(Non M75):4.8mA
Red LED(M75) : 5.9mA
R604,R610
2012->1608
R609
200
1/10W
1%
1/10W
1%
0424
50V
C601
1000pF
Close to Wafer
20V
VA600
+3.3V_ST
R613
3.3K
R611
100
R612
100
TOUCH KEY
R623
22
TOUCH KEY
R624
22
R614
3.3K
D410
CDS3C30GTH
30V
D411
30V
CDS3C30GTH
12.07.17
Change D601~3
JP601
JP602
JP603
JP606
JP605
JP604
JP608
JP609
JP610
JP611
JP612
JP607
P601
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
IR_OUT(Ready)
+3.3V_ST
R617
IR_OUT
22
(OPT)IR_OUT
Q602
MMBT3904(NXP)
(OPT)IR_OUT
C
E
(OPT)IR_OUT
R618
10K
B
C603
1000pF
50V
(OPT)IR_OUT
MMBT3904(NXP)
OPT
R619
0
(OPT)IR_OUT
(OPT)IR_OUT
R620
10K
Q603
+3.3V_ST
C
E
R621
10K
(OPT)IR_OUT
B
(OPT)IR_OUT
R622
47K
IR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
IR/CONTROL/MODULE
2013/05/23
6
Page 24
DSUB RGB
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
130529
DSUB_VSYNC/HSYNC Pull-Down
DSUB_VSYNC
2:E18
DSUB_HSYNC
2:E18
DSUB_B+
DSUB_G+
DSUB_R+
11.10.31
To Improve EMI
DSUB
R731
2.4K
DSUB
R732
10K
RS232C(SIDE)
75
R700
DSUB
DSUB
VA700
20V
DSUB
R701
75
R702
75
To Improve Ringing issue
LOW capacitance Part apply
121128
ESD improve
OPT->APPLY
DSUB
VA701
20V
DSUB
DSUB
VA703
11.10.27
Hotel_Model(RS232C apply)
NON_Hotel_Model(RS232C Bypass)
PM_TXD
PM_RXD
VA702
VA704
20V
20V
OPT
OPT
R705
10K
DSUB
121128
ESD improve
OPT->APPLY
121128
ESD improve
OPT->APPLY
JP700
JP701
JP703
JP704
DSUB
DSUB
5.5V
5.5V
5.5V
VA706
VA705
C700
0.33uF
16V
Hotel_Model(RS232C apply)
RIN 2
DOU T2
8
7
Hotel_Model(RS232C apply)
9
10
DIN 2
ROU T2
NON_Hotel_Model(RS232C Bypass)
JK700
KJA-PH-1-0177
C701
0.33uF
16V
6V-5
IC700
MAX3232CDR
11
12
DIN 1
R703
0
R704
0
R706
100
JP702
4 M4
5 M5_GND
C2-
ROU T1
3 M3_DETECT
Hotel_Model(RS232C apply)
C2+
4
13
RIN 1
R707
100
1 M1
DSUB
D700
MMBD6100
A2
C
A1
R708
10K
DSUB
20V
DSUB
JP707
JP705
DSUB
H_SYN C
DDC_D ATA
BLUE_ GND
GND_2
RED2GREEN3BLUE4GND_15DDC_G ND
GREEN _GND
RED_G ND
13
12
11
8
7
6
1
JK703
SPG09-DB-010
C702
0.33uF
16V
0.1uF
C1-2V+
3
14
15
GND16VCC
DOU T1
VA708
20V
VA709
20V
JP708
JP706
6 M6
Hotel_Model(RS232C apply)
+5V_Normal
VA707
121128
ESD improve
OPT->APPLY
VA710
20V
DSUB
JP709
121128
JP710
SHILE D
16
+3.3V_ST
C704
0.1uF
16V
(OPT)IR_OUT
R709
0
ESD improve
OPT->APPLY
DDC_C LOCK
V_SYN C
NC10SYNC_ GND
15
14
9
C703
16V
Hotel_Model(RS232C apply)
C1+
1
Hotel_Model(RS232C apply)
+3.3V_ST
VA711
20V
DSUB
R710
47K
DSUB
IR_OUT
R711
10K
DSUB
DSUB
B
RGB_DDC_SCL
RGB_DDC_SDA
R713
47K
C
E
+3.3V_ST
DSUB_DET
Q700
MMBT3904(NXP)
DSUB
SW DEBUG Wafer
12507WS-04L
1
2
3
4
P701
USB(SIDE)
3AU04S-305-ZC-(LG)
JK701
1234
USB DOWN STR EAM
5
JP713
JP712
JP711
C705
0.1uF
VA712
121128
ESD improve
OPT->APPLY
DSUB/SCART Switch
IC701
AP2191DSG
NC
GND
8
1
OUT_2
IN_1
7
2
OUT_1
IN_2
6
3
FLG
EN
5
16V
20V
VA716
121128
ESD improve
OPT->APPLY
20V
4
111026
ESD diode deletion
EAH39491601 2EA
120103
ESD diode addition
EAF61530301 2EA
USB_DM
USB_DP
USB_CTL
1:AL8
1:AL7
R725
10K
+5V_Normal
R726
47
C708
0.1uF
16V
USB_OCD
DSUB_R+
DSUB_G+
DSUB_B+
SC1_R+
SC1_G+
SC1_B+
C711
0.01uF
25V
DSUB
C710
6.3V
22uF
OPT
DSUB
C712
6.3V
C709
22uF
470pF
50V
C713
0.01uF
25V
DSUB
DSUB
C714
6.3V
22uF
OPT
DSUB
C715
6.3V
22uF
C716
0.01uF
25V
DSUB
C717
6.3V
22uF
OPT
DSUB
C718
6.3V
22uF
C719
0.01uF
25V
DSUB
C720
6.3V
22uF
OPT
DSUB
C721
6.3V
22uF
C727
0.01uF
25V
DSUB
C728
6.3V
22uF
OPT
DSUB
C729
6.3V
22uF
C730
0.01uF
25V
DSUB
C731
6.3V
22uF
OPT
DSUB
C732
6.3V
22uF
RED_1_INPUT
DSUB
HD_SYNC_SIGNAL_DETECTOR
DSUB
R727 470K
GREEN_1_INUT
GROUND1
BLUE_1_INPUT
GROUND2
RED_2_INPUT
GROUND3
GREEN_2_INPUT
GROUND4
BLUE_2_INPUT
VD_1_INPUT
1
2
3
4
5
6
7
8
9
10
11
12
IC702
BA7657F
+5V_Normal
HD_1_INPUT
24
HD_2_INPUT
23
HD_OUTPUT
22
RED_OUTPUT
21
VCC
20
GREEN_OUTPUT
19
COMPOSITE_VIDEO_INPUT
18
COMPOSITE_SYNC_OUTPUT
17
CONTROL
16
BLUE_OUTPUT
15
VD_OUTPUT
14
VD_2_INPUT
13
DSUB
DSUB
R712
22
DSUB
R715
75
DSUB
R716
75
DSUB
R714
68K
R734
0
DSUB
C722
0.1uF
R728
2K
DSUB
C725
22uF
10V
DSUB
R729
75
DSUB
C733
22uF
10V
DSUB_HSYNC
DSUB/SC1_HSYNC
DSUB/SC1_R+
DSUB/SC1_G+
DSUB/SC1_B+
DSUB/SC1_VSYNC
SC1_FB
DSUB_VSYNC
PC AUDIO(SIDE)
+3.3V_Normal
AUDIO_IN
R721
12.08.10
470K
47K->470K
VA715
JP715
20V
OPT
6 M6
AUDIO_IN
1 M1
3 M3_DETECT
4 M4
5 M5_GND
KJA-PH-1-0177
JK702
120918
JIG GND Point addition
5
Jack Shield (HDMI1, HDMI2, RGB)
JP718
VA713
20V
AUDIO_IN
JP717
VA714
20V
AUDIO_IN
JP716
JP719JP721JP720JP714
JackShield(for NonCKD)
C707
220pF
50V
C706
220pF
50V
M700
MGJ63348201
AUDIO_IN
AUDIO_IN
R718
470K
OPT
R717
470K
OPT
AUDIO_IN
R719
15K
AUDIO_IN
R720
15K
M700-*1
MGJ63348202
AUDIO_IN
R724
1K
R722
10K
AUDIO_IN
R723
10K
AUDIO_IN
JackShield(for CKD)
PC_AUDIO_DET
PC_R_IN
PC_L_IN
ETHERNET
MAIN(ETHERNET)
JK704-*1
RJ45VT-01SN002
9
9
111026
LAN Jack deletion
111117
LAN Jack Addition for T2
SUB(ETHERNET_XMULTIPLE(MP))
JK704
RJ45VT-01SN002
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
1
2
3
4
5
6
7
8
9
9
LAN JACK
C734
0.01uF
50V
LAN JACK
C735
0.01uF
50V
DSUB/SC1_OUT_CTRL
LAN JACK
5.6B
ZD700
5.6B
ZD701
LAN JACK
OPT
VA717
5.5V
OPT
DSUB
R730
4.7K
VA718
5.5V
OPT
R733
B
VA719
10K
+3.3V_ST
C
E
5.5V
DSUB
Q701
MMBT3904(NXP)
DSUB
OPT
5.5V
VA720
EPHY_TP
EPHY_TN
EPHY_RP
EPHY_RN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
INTERFACE
2013/05/23
7
Page 25
HDMI
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
2013/05/23
HDMI8
Page 26
+19V
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
21.5 inch LGD Panel : LED_CH2, LED_CH3 SET
23 inch LGD Panel : LED_CH2, LED_CH3 SET
27 inch LGD Panel : LED_CH2 SET
29 inch CMI Panel : LED_CH1, LED_CH2 SET
23.8 inch LGD FHD panel : LED CH1/CH2 : NOTSET
LED CH3 SET
JP1010
JP1011
JP1012
JP1014M1004
JP1013
M1002
M1000
M1001
M1003
R10270
CMI_29"
CMI_29"
R10280
CMI_29"
CMI_29"
R1026
10K
CMI_29"
ZD1000
33V
+19V
+24V_BLU
0
R3423
JP1004
JP1005
0
R1010
JP1006
C1011
OPT
1uF
10V
OPT
WLED_ENABLE
WLED_DIM_ADJ
GND
C1027
33uF
100V
-55TO+105C
CMI_29"
C1026
33uF
100V
-55TO+105C
M1005
M1006
M1007
M1008
CMI_29"
R1046
1M
1/8W
1%
CMI_29"
R1045
1M
1/8W
1%
CMI_29"
C1028
0.1uF
250V
LGD FHD/CMI 24"
R1045-*1
0
7
6
5
4
3
2
1
12507WR-06L
P1004
LGD FHD
CMI_29"
C1029
0.1uF
250V
LGD FHD/CMI 24"
LGD FHD/CMI 24"
C1028-*1
1uF
100V
6
5
4
3
2
1
12507WR-06L
LGD FHD
P1005
C1029-*1
1uF
100V
7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
LED DRIVER
2013/05/23
10
Page 27
R1201
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
PCMCI
2013/05/23
19
Page 29
TU_GND_A
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
2013/05/23
TUNER_EU_ERRC26
Page 30
DVB-S2 LNB Part Allegro
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
(Option:LNB)
2A
LNB
D2702
30V
LNB
C2704
0.01uF
50V
LNB
C2706
10uF
25V
LNB
C2707
10uF
25V
LNB
C2708
10uF
25V
LNB_SX34
D2704-*1
40V
D2704
LNB_SMAB34
40V
3A
LNB
L2701
SP-7850_15
15uH
3.5A
+12V_LNB
Max 1.3A
LNB
C2710
10uF
25V
Input trace widths should be sized to conduct at least 3A
Ouput trace widths should be sized to conduct at least 2A
LNB_OUT
LNB
C2700
18pF
50V
close to TUNER
R2700
0
LNB
D2700
LNB
C2701
18pF
50V
LNB
C2702
33pF
50V
Close to Tuner
Surge protectioin
Caution!! need isolated GND
A_GND
LNB
R2701
2.2K
1W
MBR230LSFT1G
LNB
C2703
0.22uF
25V
A_GND
LNB
D2701
30V
close to Boost pin(#1)
LNB
C2705
0.1uF
50V
A_GND
LNB_SMAB34
D2703
40V
LNB_SX34
D2703-*1
40V
A_GND
LNB
50V
C2709
0.1uF
VCP
LNB
NC_1
TDI
TDO
[EP]GND
1
2
3
4
5
A_GND
GNDLX
NC_2
NC_3
BOOST
18
19
20
THERMAL
21
LNB
IC2700
A8303SESTR-T
7
8
6
SCL9ADD
SDA
IRQ
LNB
R2702
33
LNB
R2703
33
DEMOD_SCL
DEMOD_SDA
16LX17
15
14
13
12
11
10
TONECTRL
LNB_TX
VIN
GND
VREG
ISET
TCAP
A_GND
close to VIN pin(#15)
LNB
C2711
0.1uF
50V
LNB
C2713
0.1uF
50V
LNB
C2712
0.22uF
25V
LNB
R2704
36K
1/16W 1%
Max 1.3A
+12V_Normal
BLM18PG121SN1D
L2700
+12V_LNB
LNB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Page 31
SCART / COMPONENT&COMPSIT
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
SCART AMP
COMPONENT
6A
[GN/YL]E-LUG
5A
[GN/YL]O-SPRING
4A
[GN/YL]CONTACT
5B
[BL]O-SPRING
7C
[RD1]E-LUG-S
5C
[RD1]O-SPRING
4C
[RD1]CONTACT
5D
[WH]O-SPRING
4E
[RD2]CONTACT
5E
[RD2]O-SPRING
6E
PPJ245N2-01
[RD2]E-LUG
JK2800
ZD2800-*1
(OPT)ESD_COMP_ZENER_KEC
ZD2801-*1
(OPT)ESD_COMP_ZENER_KEC
ESD_COMP_ZENER_KEC
5.6B
ZD2800
5.6B
ZD2801
ESD_COMP_ZENER_KEC
OPT
VA2800
5.6V
5.6B
ZD2802
5.6B
ZD2803
5.6B
ZD2804
5.6B
ZD2805
VA2801
5.6V
OPT
VA2802
5.6V
OPT
R28 00
75
1%
R28 01
75
1%
C2802
1000pF
50V
C2803
1000pF
50V
+3.3V_Normal
R2809
470K
R2820
470K
R2821
75
1%
R2828
10K
VA2803
OPT
R2824
5.6V
+3.3V_Normal
10K
R2829
1K
R2822
10K
R2823
10K
R2825
OPT
C2800
0.1uF
16V
+19V
EU
C2817
VCC
OUT2
IN2-
IN2+
0.1uF
50V
EU
R2869
EU
R2860
R2864
470K
C2820
330pF
50V
2.2K
C2822
EU
10uF
OPT
EU
16V
SCART1_Rout
EU
R2867
33K
10K
EU
C2824
33pF
50V
EU
R2863
5.6K
EU
R2858
220K
DTV/MNT_R_OUT
IC2801
COMP_Y+/AV_CVBS_IN
DTV/MNT_L_OUT
1K
COMP_Pr+
AV_CVBS_DET
COMP_Pb+
SCART1_Lout
C2821
10uF
16V
EU
330pF
C2819
EU
R2861
2.2K
OPT
R2865
470K
EU
50V
220K
R2857
EU
R2866
33K
C2823
33pF
50V
EU
EU
R2862
5.6K
R2868
10K
EU
AZ4580MTR-E1
OUT1
1
IN1-
2
IN1+
3
VEE
4
8
EU
7
6
5
CLOSE TO MSTAR
CLOSE TO MSTAR
COMP_DET
R2826
12K
R2827
12K
COMP_L_IN
COMP_R_IN
FULL SCART
SCART
JK2801
PSC008-01
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AV_DET
COM_GND
SYNC_IN
SYNC_OUT
SYNC_GND2
SYNC_GND1
RGB_IO
R_OUT
RGB_GND
R_GND
D2B_OUT
G_OUT
D2B_IN
G_GND
ID
B_OUT
AUDIO_L_IN
B_GND
AUDIO_GND
AUDIO_L_OUT
AUDIO_R_IN
AUDIO_R_OUT
D2811
20V
D2812
20V
D2813
20V
D2814
20V
D2815
5.6V
D2817
5.6V
5.6B
ZD2806
5.6B
ZD2807
EU
EU
EU
EU
EU
EU
+3.3V_Normal
SC1_R+
SC1_G+
SC1_B+
+3.3V_Normal
OPT
R2816
75
R2830
IN
GND
BIAS
C3484
68pF
EU
50V
22
R2817
3.9K
EU
EU
EU
R2818
12K
R2819
12K
OPT
C2809
0.1uF
16V
OPT
C2810
4.7uF
10V
OPT
C2811
16V
0.1uF
SC1_L_IN
SC1_R_IN
DTV/MNT_VOUT
+3.3V_Normal
DSUB
B
LB45
R2873
0
R2874
10K
C
DSUB
Q2000
MMBT3904(NXP)
E
SC1_FB
DSUB/SC1_VSYNC
SC1_ID
Analog Switch
Scaler Vsync
SAR2(LED Amber)
OPT
IC2802
MM1756DURE
VCC
6
PS
5
OUT
4
EU
EU
75
C3485
68pF
50V
R2811
75
1%
L2607
220nH
EU
1
2
3
EU
EU
R2815
EU
R2814
15K
D2816
20V
EU
EU
R2812
10K
EU
R2813
10K
R2808
10K
R2810
1K
SCART1_DET
D2808
5.6V
OPT
EU
R2807
75
D2810
5.6V
EU
1%
EU
EU
R2806
75
EU
1%
R2802
EU
75
1%
R2803
EU
75
1%
EU
R2804
470K
EU
R2805
470K
OPT
C2801
47pF
50V
SC1_CVBS_IN
EU
C2806
1000pF
50V
EU
C2807
1000pF
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D2818
5.6V
OPT
D2819
5.6V
OPT
EU
C2804
1000pF
50V
EU
C2805
1000pF
50V
DTV/MNT_L_OUT
DTV/MNT_R_OUT
MA55
COMPONENT/SCART
2013/05/23
28
Page 32
AUDIO AMP(TI)
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JP3400
JP3406
JP3405
JP3407
R3400
47K
Head Phone
VA3401
VA3400
20V
20V
OPT
Head Phone
R3412
1K
VA3402
20V
Head Phone
HP_DET
OPT
Q3400
MMBT3904(NXP)
E
C
E
C
OPT
Q3402
MMBT3904(NXP)
B
B
B
B
C
OPT
Q3404
MMBT3904(NXP)
E
C
OPT
Q3403
MMBT3904(NXP)
E
Head Phone
Head Phone
MUTE control
R3415
R3414
C3402
1000pF
1K
50V
OPT
C3400
1000pF
1K
OPT
50V
Head Phone
C3406
10uF
10V
Head Phone
C3405
10uF
10V
OPT
Q3405
MMBT3906(NXP)
C
B
OPT
R3416
3.3K
HP_LOUT
HP_ROUT
+3.3V_ST
E
C
B
Q3406
E
MMBT3904(NXP)
OPT
OPT
R3417
10K
D3400
MMBD6100
C
A2
A1
OPT
SB_MUTE
HP_MUTE
Dip Detection Circuit
+19V
OPT
KDS226
AC
D3401
OPT
C
R3420
470
E
OPT
MMBT3906(NXP)
B
Q3407
C
R3421
12K
OPT
R3422
12K
C3429
4.7uF
50V
OPT
85C
OPT
R3418
47K
OPT
C3410
10uF
25V
A
OPT
R3419
220K
11.10.27
Apply->OPT
MA55
AMP_TAS5733/HP
OPT
SPK_L+
SPK_L-
SPK_R+
SPK_R-
OPT
C3428
47uF
25V
105C
SB_MUTE
3K:
With SCART MUTE BLOCK
12K:
Without SCART MUTE BLOCK
2013/05/23
34
4
3
2
1
Page 33
/PF_CE1
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LG-NonOS SB51_ExtSPI 3’b000 51 boot from SPI
LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
+3.3V_ST
OPT
OPT
R119 4.7K
R116 4.7K
R123 2.7K
OPT
R120 4.7K
R117 4.7K
R124 4.7K
BOOT KEY OPTION
R104 100
+3.3V_ST
OPT
IC104-*3
VCC
1
8
WP
7
2
SCL
6
3
SDA
5
4
AUD_MASTER_CLK
If calculate current LED_RED level = 2.469V
If R123 is 2.7K, LED_RED level = 2.75V
And LED_RED high threshold is 2.5V when boot up
Please use 2.7K for R123
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
2013/05/23
MAIN1_NON_EU51
Page 34
MODEL OPTION
Copyright ⓒ 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
MAIN2_NON_EU
2013/05/23
52
Page 35
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.