LG 22LN4050 Schematic

Internal Use Only

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LED TV

SERVICE MANUAL

CHASSIS : LB35A

MODEL : 22LN4050 22LN4050-TB

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67732805 (1304-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

TROUBLE SHOOTING GUIDE ............................................................... 13

BLOCK DIAGRAM .................................................................................. 23

EXPLODED VIEW .................................................................................. 24

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug

or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

1. Application range

This specification is applied to the LB35A chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C (2) Relative Humidity: 65 % ± 10 % (3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

(4) Specification and performance of each parts are followed

ea ch dra wing and speci ficat ion by part number in accordance with BOM.

(5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

* HDMI 1.4 with Deep Color is only apply for FHD Model

No. Item Specication Remarks

1. Market NON EU

PAL/SECAM B/G/D/K

2. Broadcasting system

BAND PAL(BG,I) NTSC(M) China(DK)

3. Channel Storage

4. Receiving system Upper Heterodyne

5. Video Input PAL, SECAM, NTSC Rear (2EA)

6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)

7. USB Input MP3, JPEG,Movie Side(1EA)

8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)

9. D-SUB INPUT S/W Upgrade Only Rear (1EA)

10. HDMI Input HDMI-DTV, Only PCM MODE Rear (2EA)

11. Audio Input (1EA) AV&Component L/R Input(2EA)

VHF/UHF 01-C69 2~78 C1~C69

Cable S1~S47 1~71 S1~S47

PAL-I NTSC-M

Only for training and service purposes

- 6 -

5. Component Video Input (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11. 1920*1080 33.72 59.94 74.176 HDTV 1080I

12. 1920*1080 33.75 60.00 74.25 HDTV 1080I

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

6. HDMI Input

6.1. PC Mode

* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

1. 640×480 31.469 59.94 25.17 VESA(VGA)

2. 800×600 37.879 60.317 40.00 VESA(SVGA)

3. 1024×768 48.363 60.004 65.00 VESA(XGA)

4. 1280×768 47.776 59.87 79.5 VESA(WXGA)

5. 1360×768 47.72 59.799 84.62 VESA(WXGA)

6 1366×768 47.7 60.00 84.62 WXGA

7. 1280×1024 63.595 60.00 108.875 SXGA

8. 1920×1080 66.647 59.988 138.625 WUXGA

* Monitor Range Limits Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz Pixel Clock - 150 MHz

Only for training and service purposes

- 7 -

6.2. DTV Mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27 SDTV 480P

5. 720*480 31.5 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27 SDTV 576P

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45 60.00 74.25 HDTV 720P

9. 1280*720 37.5 50.00 74.25 HDTV 720P

10. 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.5 HDTV 1080P

14 1920*1080 67.432 59.94 148.350 HDTV 1080P

15 1920*1080 67.5 60.00 148.5 HDTV 1080P

16 1920*1080 27 24.00 74.25 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 26.97 23.97 74.25 HDTV 1080P

19 1920*1080 33.716 29.976 74.25 HDTV 1080P

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LED TV with LB35A chassis.

2. Designation

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation. (4) The input voltage of the receiver must keep 100-220 V,

50/60Hz. (5)

The receiver must be operated for over 5 minutes prior to

the adjustment when module is in the circumstance of

above 15 °C.

► In case of keeping module is in the circumstance of 0

°C, it should be placed in the circumstance of above 15 °C for 2 hours.

► In case of keeping module is in the circumstance of

below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.

* Caution

When a still image is displayed for 20 minutes or longer (especially where W/B scale is strong. Digital pattern 13ch an d/ or Cr os s h at ch pa tt ern 0 9ch), there can s ome afterimage in the black level area.

3. MAIN PCBA Adjustments

3.1. ADC Calibration

3.1.1. Using D/L Jig

- An ADC calibration is automatically adjusted from DFT-Jig

- If it needs to adjust manually, refer to appendix.

* ADC Calibration Protocol (RS232)

NO Item CMD 1 CMD 2 Data 0

Enter Adjust MODE

ADC adjust

Adjust Sequence ▪ aa 00 00 [Enter Adjust Mode] ▪ xb 00 40 [Component1 Input (480i)] ▪ ad 00 10 [Adjust 480i Comp1] ▪ aa 00 90 End Adjust mode

Adjust ‘Mode In’

ADC Adjust

A A 0 0

A D 1 0

When transfer the ‘Mode In’, Carry the command.

Automatically adjustment (The use of a internal pattern)

3.2. EDID Download

▪ HD MODEL

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 01 17 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26 20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01 30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28 40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30 50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C 60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD 70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 80 02 03 28 F1 4F 84 07 01 16 02 03 11 12 13 14 05 90 20 22 1F 10 26 11 07 50 09 7F 07 83 01 00 00 68 A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

▪ 8BIT FHD MODEL

** HDMI 1 : 256Bytes

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01 10 01 17 01 03 80 A0 5A 78 0A D9 B0 A3 57 49 9C 25 20 11 49 4B 21 08 00 01 01 45 40 61 40 01 01 81 80 30 01 01 D1 C0 01 01 02 3A 80 18 71 38 2D 40 58 2C 40 45 00 08 44 21 00 00 1E 1B 21 50 A0 51 00 1E 30 50 48 88 35 00 BC 88 21 00 00 1C 00 00 00 FC 00 4C 60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD 70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 80 02 03 28 F1 4F 90 07 01 16 02 03 11 12 13 04 14 90 05 20 22 1F 26 11 07 50 09 7F 07 83 01 00 00 68 A0 03 0C 00 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 B0 40 80 35 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0

C0 2D 10 10 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 D0 51 F0 16 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D

E0 80 18 71 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

a. White Balance Adjustment

EDID C/S data

Check sum

(Hex)

** HDMI 1 : 256Bytes

HD FHD (8Bit)

HDMI HDMI

Block 0 A5 C1

Block 1

44(HDMI1) 44 (HDMI1) 34(HDMI2) 34 (HDMI2)

ⓐ

Only for training and service purposes

- 9 -

4. White Balance Adjustment

4.1. Overview

4.1.1. W/B adj. Objective & How-it-works

(1) Objective: To reduce each Panel’s W/B deviation (2) How-it-works: When R/G/B gain in the OSD is at 192, it

means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.

(3) Adj. condition: normal temperature

1) Surrounding Temperature: 25 °C ± 5 °C

2) Warm-up time: About 5 Min◦

3) Surrounding Humidity: 20% ~ 80%

4) Befor e White balance adjustment, Keep po wer on status, don’t power off

4.1.2. Adj. condition and cautionary items

(1) Lighting condition in surrounding area surrounding lighting

should be lower 10 lux. Try to isolate adj. area into dark surrounding. (2) Probe location: Color Analyzer(CA-210) probe should be

within 10 cm and perpendicular of the module surface (80°~ 100°) (3) Aging time

1) After Aging Start, Keep the Power ON status during 5 Minutes.

2) In case of LCD, Back-light on should be checked using no signal or Full-white pattern.

4.2. Equipment

(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)

(2) Adj. Computer (During auto adj., RS-232C protocol is

needed) (3) Adjust Remocon (4) Video Signal Generator MSPG-925F 720p/204-Gray (Model: 217, Pattern: 49) * Color Analyzer Matrix should be calibrated using CS-1000.

4.3. Equipment connection

Co lor Anal yze r

Pro be

RS -232 C

Sig nal Sou rce

* If TV internal pattern is used, not needed

Pattern Gen era to r

4.4. Adjustment Command (Protocol)

(1) RS-232C Command used during auto-adj.

RS-232C COMMAND

CMD DATA ID

wb 00 00 Begin White Balance adjustment

wb 00 ff

End White Balance adjustment (internal pattern disappears )

Explantion

RS- 232 C

Co mp ute r

RS- 232 C

(2) Adjustment Map

Cool

Medium

Warm

Adj. item

R Gain j g 00 C0 G Gain j h 00 C0 B Gain j i 00 C0 R Cut G Cut B Cut R Gain j a 00 C0 G Gain j b 00 C0 B Gain j c 00 C0 R Cut G Cut B Cut R Gain j d 00 C0 G Gain j e 00 C0 B Gain j f 00 C0 R Cut

G Cut

Command

(lower caseASCII) CMD1 CMD2 MIN MAX

Data Range

(Hex.)

Default

(Decimal)

4.5. Adjustment method

4.5.1. Auto WB calibration

(1) Set TV in ADJ mode using P-Only key(or POWER ON key). (2) Place optical probe on the center of the display.

- It need to check probe condition of zero calibration before adjustment.

(3) Connect RS-232C Cable (4) Select mode in ADJ Program and begin a adjustment. (5) When WB adjustment is completed with OK message,

check adjustment status of pre-set mode. (Cool, Medium, Warm)

(6) Remove probe and RS-232C cable.

▪ W/B Adj. must begin as start command “wb 00 00” , and

finish as end command “wb 00 ff”, and Adj. offset if need.

4.5.2. LED White balance table

- If Model is Polaris Model, G-gain fix is applied.

(1) Cool Mode

1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

2) Pr inciple : To adjust the white ba lance without the saturation, Fix the G gain to 172 (default data) and change the others (R/B Gain ).

3) Adjustment mode : mode - Cool

(2) Medium / Warm Mode

1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.

2) Pr inciple : To adjust the white ba lance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others.

3) Adjustment mode : Two modes - Medium / Warm

Only for training and service purposes

- 10 -

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