LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
Page 4
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Page 5
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Page 6
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 6 -
1. Application range
This specification is applied to the 22” Wide LCD TV used
LA96E chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature: 20±5ºC
2) Relative Humidity: 65±10%
3) Power Voltage : Standard input voltage(100-120V~, 50/60Hz)
* Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: UL, CSA, IEC specification
- EMC: FCC, ICES, IEC specification
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 8 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied for all of the LCD TV with
LA96E chassis.
2. Specification
1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power Adjustment : 100-240V~, 50/60Hz
3) Magnetic Field Condition : Nil.
4) Input signal Unit : Product Specification Standard
5) Reserve after operation : Above 30 Minutes
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent), DDC
Adjustment Jig equipment, SVC remote control
3. Method of PTC MICOM Download
3.1. Connection of MICOM JIG
1) Connect port(3) with Power Code
2) Connect jack(1) with PTC Micom.
3) Connect USB Cable to the computer
4) Download Program execution (SAP Configuration)
* Notice!
Because PTC Download JIG has internal memory, it can
save download files using download program (SAP
Configuration). Push the START button (4) after file saving,
then it execute download.
3.2. Execution of download program
(SAP Configuration)
3.2.1. Execution of SAP Configuration
(1) Select HCS12
(2) Target Frequency Settings :
1) Checking the factor -> Use Specified Target
Frequency…, Unsecure target….
Don’t check other checking boxes. You must follow fig.
(6) Push the ‘Save Image to Cyclone PRO’ button, files
transfer from PC to the Download JIG.
4. Start button
3. Power
1. Connect to Micom port of TV board.
2. Connect to computer.
3
4
1
2
5
6
Page 9
- 9 -
4. Main PCB check process
* APC - After Manual-Insult, executing APC
4.1. Software download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
3) Click “Connect” tab. If display “Can’t”, Check connect
computer, jig, and set.
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
5) Click “Auto” tab and set as below
6) click “Run”.
7) After downloading, check “OK” message.
4.2. USB DOWNLOAD
1) Put the USB Stick to the USB socket
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it’s not work. But your downloaded version is High, USB
data is automatically detecting
3) Show the message “Copying files from memory”
4) Updating is staring.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
(1)
(3)
(2)
OK
Please Check Speed :
To us speed between from 200 KHz
to 400 KHz
(4)
filexxx.bin
(5)
(7) ........ OK
(6)
filexxx.bin
USB PORT
Page 10
- 10 -
5) Finishing the version updating, you have to put out USB
stick and “AC Power” off
6) After putting “AC Power” on and check updated version on
your TV
4.3. ADC Process
4.3.1. PC input ADC
(1) Auto RGB Gain/Offset Adjustment
1) Convert to PC in Input-source
I2C COMMAND:0xF4(SELECT INPUT) 0x00 0x60(RGB)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 Series)
[gray pattern that left & right is black and center is
white signal (Refer below picture)].
3) Adjust by commanding AUTO_COLOR _ADJUST
(0xF1) 0x00 0x02 instruction.
(2) Confirmation
1) We confirm whether “0xB6” address of EEPROM
“0xA2” is “0xAA” or not.
2) If “0xB6(RGB)” address of EEPROM “0xB2” isn’t
“0xAA”, we adjust once more.
3) We can confirm the ADC values from “0xB0~0xB5
(RGB)” addresses in a page “0xA2”
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing “ADJ” key, execute “Autoadjust” by pushing “
G” key at “0. ADC CALIBRATION”.
4.3.2. COMPONENT input ADC
(1) Component Gain/Offset Adjustment
1) Convert to Component in Input-source
I2C command : 0xF4(Select input) 0x00 0x40(Component)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT),
0x60(RGB), 0x90(HDMI)
2) Signal equipment displays
Impress Resolution 480i
MODEL : 209 in Pattern Generator(480i Mode)
PATTERN : 08 in Pattern Generator(MSPG-925
Series)
3) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction.
4) Signal equipment display
- Impress Resolution : 1080i
- MODEL: 223 in Pattern Generator(1080i Mode)
- PATTERN: 08 in Pattern generator(MAPG-925
series)
5) Adjust by commanding AUTO_COLOR ADJUST(0xF1)
0x00 0x02 instruction.
* Manual ADC process using Service Remote control. After
enter Service Mode by pushing “ADJ” key, execute “Autoadjust” by pushing “
G” key at “0. ADC CALIBRATION”.
(2) Confirmation
1) We confirm whether “0xBF(480i)/0xC8(1080i)” address
of EEPROM “0xA2” is “0xAA” or not.
2) If “0xBF(480i)/0xC8(1080i)” address of EEPROM “0xA2”
isn’t “0xAA”, we adjust once more.
3) We can confirm the ADC values from
“0xB9~0xBE(480i)/ 0xC2~(1080i)” addresses in a page
“0xA2”.
* Manual ADC Confirmation using Service Remocon. After
enter Service Mode by pushing “INSTART” key.
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
<Adjustment pattern (PC)>
EZ ADJUST
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN: OFF
5. 2HOUR OFF: ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE: ON
9. DEBUG MODE: OFF
10. TVLINK-COMM.ADJUST
0. ADC CALIBRATION : RGB
<Adjustment pattern (COMPONENT)>
EZ ADJUST
1. ADC ADJUST
2. SUB B/C ADJUST
3. W/B ADJUST
4. WHITE PATTERN: OFF
5. 2HOUR OFF: ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MODE: ON
9. DEBUG MODE: OFF
10. TVLINK-COMM.ADJUST
0. ADC CALIBRATION : COMPONENT
Page 11
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
4.4. Function Check
4.4.1. Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (CVBS/ S-Video)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In and H/P Out
* Display and Sound check is executed by Remote control.
2) Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
3) 15 Pin D-Sub Jack is connected to the AUTO W/B
EQUIPMENT.
4) Adjust Process will start by execute I2C Command (Inner
pattern (0xF3, 0xFF)).
* Manual ADC process using Service Remo-con. After enter
Service Mode by pushing “ADJ” key, enter “W/B ADJUST” by
pushing “
G” key at “ 3. W/B ADJUST”. (CA-210, CH-9)
* Adjust “R/G/B - GAIN” by pushing “
F”, “G” key at “Cool”
* Adjust “R/G/B - GAIN” by pushing “
F”, “G” key at “Medium”
* Adjust “R/G/B - GAIN” by pushing “
F”, “G” key at “Warm”
5.2. DDC EDID WRITE
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Connect HDMI Signal Cable to HDMI Jack.
3) Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
4) Check whether written EDID data is correct or not. (Refer to
Product spec).
5) Remark
A week manufacture in address 0x10 can be changed. And
thus Checksum (Address: 0x7F) can be also changed.
5.2.1. EDID DATA
(1) DIGITAL DATA 256Byte
- Remark: A week manufacture in address 0x10 can be
changed. And thus Checksum (Address: 0x7F) can be
also changed.
EZ ADJUST
0. ADC CALIBRATION: RGB
1. ADC ADJUST
2. SUB B/C ADJUST
4. WHITE PATTERN: OFF
5. 2HOUR OFF: ON
6. OAD
7. UART DOWNLOAD
8. FACTORY MOD : ON
9. DEBUG MODE: OFF
10. TVLINK-COMM.ADJUST
3. W/B ADJUST
Color Temperature
Cool11,000KX=0.276 ± 0.003 <Test Signal>
Y=0.283 ± 0.003 Inner pattern
Medium9,300KX=0.285 ± 0.003 (216gray, 85IRE)
Y=0.293 ± 0.003
Warm6,500KX=0.313 ± 0.003
Y=0.329 ± 0.003
W/B ADJUST
0. MODE : RGB
1. WHITE PATTERN : White
2. TEMPERATURE : Cool
4. G - GAIN : 172
5. B - GAIN : 192
6. R – OFFSET : 128
7. G – OFFSET : 128
8. B – OFFSET : 128
9. RESET
3. R - GAIN : 172
MODEL : 32LG30/AUO_32LG3DC
S/W VER : 1.33.0/ 0.0024
UTT : 1
ADC CAL.
RGB : OK
YPbPr(SD) : OK
YPbPr(HD) : OK
1. POWER OFF HISTORY
2. SS CONROL
3. BAUD RATE9600
4. AUDIO EQON
5. CHANNEL MUTE ON
6.DTV SNR
0. AREA OPTION: USA
Page 12
- 12 -
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
5.3. HDCP setting
(High-Bandwidth Digital Contents Protection)
1) Connect D-sub Signal Cable to D-Sub Jack.
2) Input HDCP key with HDCP-key- in-program.
3) HDCP Key value is stored on EEPROM(AT24C512) which
is 80~A1 addresses of 0xA0~0xA2 page
4) Write data by 64bytes.
5) AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
6) HDCP Key value is different among the sets.
5.4. Outgoing condition Configuration
1) After all function test., press IN-STOP Key by SVC Remote
controller. And Make Ship Condition.
2) When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then turn off automatically.
(Must not AC power OFF during blinking)
5.5. Internal pressure
1) Test Voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
2) Test Point
- GND Test = between power cord GND and Signal cable
metal GND
- Internal pressure test = between power cord GND and
AC input Live.
3) leakage current: 0.5mArms (but, 32LG3DCH as hospital TV
limited by 0.1mArms.)
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Page 13
LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 13 -
300
200
510
830
500
120
122
123
540
530
560
820
400
401
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Page 14
PStoPDF trial version. http://www.oakdoc.com
SIDE_AV
REAR AV JACK
JK1202
PPJ218-01
4A
5A
2A
3B
2B
4C
5C
2C
PPJ148-07
JK1206
[YL]O_SPRING
[YL]CONTACT
[YL]U_CAN
[WH]C_LUG
[WH]U_CAN
[RD]O_SPRING
[RD]CONTACT
[RD]U_CAN
1
[YL]GND
2
3
[YL]CONTACT
4
[WH]GND
5
[WH]C-LUG-L
6
[RD]GND
7
8
[RD]CONTACT
[YL]O-SPRING
[RD]O-SPRING
D1215
ADUC30S03010L
30V
OPT
D1213
OPT
ADMC5M03200L
5.6V
D1214
OPT
ADMC5M03200L
5.6V
ADUC30S03010L
ADMC5M03200L
D1221
ADMC5M03200L
5.6V
L1206
BG2012B080TF
L1207
BG2012B080TF
D1245
OPT
30V
OPT
D1243
ADMC5M03200L
5.6V
D1242
5.6V
OPT
R1238
75
R1248
10K
C1219
100pF
L1217
BG2012B080TF
L1218
BG2012B080TF
+3.3V
R1246
470K
R1247
470K
R1208
470K
R1206
470K
L1208
BG2012B080TF
R1215
75
1%
C1224
100pF
C1225
100pF
50V
50V
100pF
C1250
100pF
50V
C1251
50V
R1254
1K
R1259
10K
R1258
10K
R1211
10K
R1205
10K
C1252
47pF
50V
C1227
100pF
R1210
12K
R1207
12K
R1264
12K
R1263
12K
008:R32
008:R32
008:D26
AV_R_IN
AV_L_IN
AV_CVBS_IN
008:D26
SIDEAV_CVBS_IN
009:AA29
SIDEAV_SW
008:R33
SIDEAV_L_IN
008:R33
SIDEAV_R_IN
R,G,B PC&DDC
008:D29
DSUB_VSYNC
DSUB_HSYNC
008:D29
008:D28
008:D29
008:D29
DSUB_B
DSUB_G
DSUB_R
IC1200
AT24C02BN-10SU-1.8
A0
1
A1
2
A2
3
GND
4
0
0 R1233
ADUC30S03010L
R1232
R1234
75
R1235
75
R1236
75
+5V_ST_PTC
D1223
ENKMC2838-T112
A1
C
A2
C1228
0.1uF
R1265
22
16V
R1269
100
D1224
ADMC5M03200L
5.6V
OPT
SIGN25
0
R1268
OPT
OPT
EEPROM_WP
008:AR22;002:T21
ISP_RXD
008:AB27
ISP_TXD
008:AB27;008:AR31
+5V_GENERAL
R1270
10K
D1225
ADMC5M03200L
5.6V
OPT
R1249
C1222
18pF
50V
D1216
ADUC30S03010L
30V
D1217
30V
D1218
ADUC30S03010L
30V
D1219
ADUC30S03010L
30V
4.7K
C1223
18pF
50V
ADMC5M03200L
D1222
5.6V
OPT
VCC
8
WP
7
SCL
6
SDA
5
D1207
30V
C1216
0.1uF
OPT
C1217
0.1uF
OPT
C1218
0.1uF
OPT
R1253
4.7K
R1257
22
R1262
10K
COMP JACK
JK1207
PPJ209-02
2A [GN]1P_CAN
4A [GN]CONTACT
3A [GN]O_SPRING
2B [BL]1P_CAN
5B [BL]C_LUG_L
2C [RD]1P_CAN1
5C [RD]C_LUG_L
2D [WH]1P_CAN
5D [WH]C_LUG_L
2E [RD]1P_CAN2
4E [RD]CONTACT
3E [RD]O_SPRING
ADUC30S03010L
D1208
30V
OPT
OPT
OPT
OPT
OPT
D1209
ADUC30S03010L
30V
D1210
ADUC30S03010L
30V
D1211
ADMC5M03200L
5.6V
D1212
ADMC5M03200L
5.6V
R1244
470K
R1245
470K
R1241
R1242
75
R1243
75
11
12
13
14
15
JK1204
KCN-DS-1-0089
COMP1_Y
75
008:D31
6
7
8
9
1
2
3
4
16
10
5
PC AUDIO
COMP1_PB
C1220
1000pF
50V
C1221
1000pF
50V
R1252
10K
R1251
10K
R1256
12K
R1255
12K
008:D31
COMP1_PR
008:D31
COMP1_L_IN
008:R33
COMP1_R_IN
008:R33
JK1205
PEJ024-01
3
6A
7A
4
5
7B
6B
8
E_SPRING
T_TERMINAL1
B_TERMINAL1
R_SPRING
T_SPRING
B_TERMINAL2
T_TERMINAL2
SHIELD_PLATE
OPT
OPT
D1234
5.6V
ADMC5M03200L
D1235
5.6V
ADMC5M03200L
C1240
100pF
50V
C1241
100pF
50V
R1297
470K
R1298
470K
R1300
10K
R1301
10K
12K
R1304
12K
R1303
R1305
0
R1307
0
PC_R_IN
008:R32
PC_L_IN
008:R31
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
IN/OUT
1
14
Page 15
PStoPDF trial version. http://www.oakdoc.com
HDMI1
22
QJ41193-CFEE1-7F
JK500
EDID
+3.3V_ST
5V_HDMI_1
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
20
21
R552
1K
VR500
AVRL161A1R1NT
C501
0.1uF
16V
JP502
R509
R569
R570
R571
R572
R573
R574
R575
R576
R501
820
OPT
GND
R511
JP503
Q504EB
2SC3052
0R510
0
0
0
0
0
0
0
0
0
0
C
R556
47K
R513
OPT
10K
DDC_SDA_1
008:D38;002:S20
DDC_SCL_1
008:D37;002:S20
008:D39
CK-_HDMI1
008:D39
CK+_HDMI1
008:D39
D0-_HDMI1
008:D39
D0+_HDMI1
008:D38
D1-_HDMI1
008:D38
D1+_HDMI1
008:D38
D2-_HDMI1
008:D38
D2+_HDMI1
HPD1
008:D37
IC500
CAT24C02WI-GT3
A0
1
A1
2
HDMI1
A2
3
VSS
4
A1
D501
ENKMC2838-T112
C509
0.1uF
50V
JP500
C512
8pF
50V
OPT
5V_HDMI_1
A2
C
R542
10K
OPT
OPT
C515
8pF
50V
R545
100
008:AR22;001:AK23
EEPROM_WP
008:D37;002:I23
DDC_SCL_1
008:D38;002:I24
DDC_SDA_1
+5V_GENERAL
VCC
8
WP
7
SCL
6
SDA
5
R531
R530
R536
R539
4.7K
4.7K
22
22
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
Power
4 14
Page 18
PStoPDF trial version. http://www.oakdoc.com
TUNER
+5V_TU
L1003
500
C1007
C1005
C1011
17
SHIELD
TU1001
TDVW-H104P
NC_1
1
NC_2
2
GND_1
3
+B1[5V]
4
RF_AGC
5
GND_2
6
DATA
7
CLOCK
8
AS
9
DIF[+]
10
DIF[-]
11
IF_AGC
12
SIF
13
NC_3
14
AUDIF
15
VIDEO
16
R1031
C1008
0.1uF
0.01uF
25V
OPT
C1027
100pF
50V
0
OPT
0.1uF
50V
50V
C1015
100pF
50V
10uF
10V
C1017
100pF
50V
C1013
220uF
16V
R1023
R1022
IF_AGC
R1007
12K
R1009
OPT
50V
R1008
10K
R1016
47
OPT
R1004
2.2K
OPT
C1009
0.01uF
C2250
220uF
16V
+5V_TU
R1013
4.7K
22
22
OPT
C1024
27pF
50V
R1010
470
0
E
B
C
0.1uF
C1021
OPT
L1004
ISA1530AC1
Q1000
R1003
0
SIFMO
OPT
6.8uH
R1017
4.7K
C1025
27pF
50V
+5V_TU
+5V_TU
R1026
R1027
0
0
FE_SIF
MStar Option
R1019
R1005
0
R1006
R1018
0
OPT
ISA1530AC1
Q1001
C1012
10K
0.047uF
OPT
50V
270
R1020
270
E
B
C
(I2C Channel 6)
FE_TUNER_SDA
FE_TUNER_SCL
50V
0.1uF
C1014
L1001
C1004
82pF
50V
R1032
R1033
R1021
0
FM Rejection Option
0
0
FE_VMAIN
008:D24
0
1/10W
5%
0
1/10W
5%
L1013
L1014
C1006
47pF
L1002
270nH
Close to tuner
IF_N
IF_P
LGDT3305
R1061
IF_P
IF_N
R1062
0.1uF
C1066
0.1uF
R1060
SIGN273
1K
IF_AGC
C1067
0.1uF
100
100
C1068
0.01uF
0.01uF
R1063
+3.3V_DVDD_PVSB
C1069
C1070
R1064
1K
TS_0
TS_1
TS_2
TS_3
TS_4
TS_5
TS_6
TS_7
+1.2V_DVDD_PVSB
100
R1065
R1066
R1067
OPT
R1068
5.1K
OPT
0
OPT
OPT
+3.3V_DVDD_PVSB
470
R1069
TS_0
TS_1
TS_2
TS_3
TS_4
TS_5
TS_6
TS_7
C2138
0.1uF
50V
1
2
3
4
5
6
7
8
9
10
11
12
VROA
VINA2
VINA1
INCAP
VSSAAD10A
I2CSEL
ANTCON
VDD
I2CRPT_SCL
I2CRPT_SDA
IF OUT
RF OUT
AR1070
AR1071
C1071
48
VCCAAD10A
TPERR
13
LD1000
27pF
47
46
VSSAD10
LGDT3305
VDD33
14
15
100
100
VDD
TPVALID
45
16
X1005
25MHz
44
43
XM
VSS
IC1004
VSS33
TPDATA[0]
17
18
1MR1072
42
XTALI
XTALO
TPDATA[1]
TPDATA[2]
19
41
VSS33
TPDATA[3]
20
C1072
27pF
0
R1073
40
21
SLIM_SCAN
TPDATA[4]
R1074
47K
CB3216PA501E
38
39
OPM
VDD33
TPDATA[5]
TPDATA[6]
22
23
37
+3.3V_AVDD_PVSB
1N4148W
D1000
C1073
1uF
10V
+3.3V_AVDD_PVSB
L1219
NRST
36
PLLAVSS
35
PLLAVDD
34
VSS33
33
VSS
32
VDD
31
VSS
30
SCL
29
VDD33
28
SDA
27
NIRQ
26
TPSOP
25
TPCLK
TPDATA[7]
24
R1075
OPT
C1074
R1076
VSB_RESET
R1077
22
FE_DEMOD_SCL
R1078
22
FE_DEMOD_SDA
C1075
OPT
OPT
OPT
AR1079
100
1/16W
TS_SYNC
TS_CLK
TS_VALID
TUNER 5V
PANEL_POWER
L1012
C1081
0.1uF
16V
C1082
100uF
16V
INPUT
IC1003
AS7809DTRE1
1
2
VCOMO
MStar Option
IC1002
GND2
KIA78R05F
6
1
2VC3
4NC5
VIN
C1036
0.33uF
16V
100
R1028
OPT
OPT
C1037
0.1uF
16V
L1010
OUTPUT
3
C1034
GND
0.1uF
BG2012B800
C1035
100uF
16V
16V
VOUT
GND1
C1039
47uF
16V
C1040
0.1uF
+5V_TU
C1041
0.01uF
25V
The value of coil & cap’ could be changed to optimized each
MLB-201209-0120P-N2
VSB_CTRL
Mercury Option
+5V_GENERAL
L1000
R1001
4.7K
OPT
C1077
2.2uF
25V
C1002
100uF
16V
OPT
OPT
008:AR30;004:AI10
POWER_EN
R1036
20K
C1076
C1078
2.2uF
25V
R1035
16V
OPT
R1002
1K
C1003
0.1uF
50V
OPT
100
OPT
1uF
VIN
EN
NC_1
EN
VIN
NC_2
2
1
SC4215ISTRT
1
2
3
4
OPT
IC1001
SC156515M-1.8TR
3
GND
IC1000
8
7
6
5
4
5
GND
ADJ
VO
NC_3
+3.3V_PVSB
VO
R1014
OPT
15K
ADJ
R1015
OPT
8.2K
C1018
100uF
16V
R1011
R1012
V0 = 0.8(R1+R2) / R2
LGDT3305 POWER
+3.3V_FE
L1005
500
C1020
0.1uF
50V
+1.2V_PVSB
R2
20K
R1
10K
C1019
100uF
C1079
0.1uF
16V
50V
VSB +3.3V B+ BLOCK
+3.3V_PVSB
L1007
C1023
10uF
3216
+3.3V_AVDD_PVSB
500
C1026
0.1uF
16V
50V
VSB +1.0V B+ BLOCK
+1.2V_PVSB
R1034
0
1/4W
5%
3216
+3.3V_PVSB
C1038
10uF
16V
L1008
C1028
500
10uF
16V
3216
+1.2V_DVDD_PVSB
C1043
C1044
0.1uF
0.1uF
50V
50V
C1030
0.1uF
+3.3V_DVDD_PVSB
C1032
0.1uF
50V
C1033
0.1uF
50V
50V
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
DDR26 14
Page 20
PStoPDF trial version. http://www.oakdoc.com
LVDS
P800
FI-X30SSL-HF
GND
1
2
TXA1-[9]
TXA1+[8]
TXA2-[7]
TXA2+[6]
TXAC-[5]
TXAC+[4]
TXA3-[3]
TXA3+[2]
TXA4-[1]
TXA4+[0]
3
4
5
6
0
R847
R848
0
R849
0
0
R850
0
R851
0
R852
R853
0
R854
0
R855
0
0
R856
LVDS_TXA3+
LVDS_TXA3-
LVDS_TXAC+
LVDS_TXAC-
LVDS_TXA2+
LVDS_TXA2-
LVDS_TXA1+
LVDS_TXA1-
LVDS_TXA0+
LVDS_TXA0-
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
GND
32
33
R858
R857
R860
OPT
R859
OPT
0
0
OPT
0
OPT
0
C803
25V
22uF
OPT
C804
PWM_DIM
OPC_OUT
LVDS_TXA3+
LVDS_TXA3-
LVDS_TXAC+
LVDS_TXAC-
LVDS_TXA2+
LVDS_TXA2-
LVDS_TXA1+
LVDS_TXA1-
LVDS_TXA0+
LVDS_TXA0-
008:AQ28
OPC_EN
008:AR30
LVDS_SEL
PANEL_POWER
0.1uF
C805
1000pF
OPT
R801
004:R20
10K
OPT
008:AF11;004:R21
+3.3V_ST
0
R861
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
FPGA
10 14
Page 24
PStoPDF trial version. http://www.oakdoc.com
IR & LED & CONTROL
P1100
12505WS-15A00
NC
1
NC
2
C1106
1000pF
50V
C1105
IR
008:O6;009:AJ9
R1104
R1105
UPPER SMT
OPT
0
0
R1117
R1119
0
OPT
0
R1118
0
C1108
0.1uF
16V
LED_GR
LED_AM
R1120
0
009:AC33
009:AC33
BG2012B080TF
BG2012B080TF
L1102
CB3216PA501E
GND
3
GND
4
KEY0
5
KEY1
6
NC
7
ZD1111
5.6B
ZD1110
5.6B
UDZS5.1B
D1101
5.1V
ZD1112
5.6B
C1101
100pF
50V
UDZS5.1B
D1102
5.1V
0.1uF
L1100
BG2012B080TF
50V
1000pF
C1102
C1103
0.1uF
50V
1000pF
C1104
5V
8
NC
9
IR
10
NC
11
GND
12
G
13
R
14
GND
15
16
GND
L1103
L1104
+5V_ST_PTC
+5V_ST_PTC
R1110
4.7K
4.7K
R1113
R1115
R1116
100
100
009:AO30
009:AO29
KEY_CTL_0
KEY_CTL_1
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
IR&RJP
1114
Page 25
PStoPDF trial version. http://www.oakdoc.com
UART
R925
OPT
012:J8
008:AQ27
012:K17
009:AQ27
008:AO31
PTC_RX_MSTAR_5V
PTC_RX_MSTAR
009:AC30;012:Q8
PTC_TX_1
PTC_TX
RX_G6
PTC_DEBUG_TX
+5V_ST_PTC
0R907
0R958
R2521
4.7K
+3.3V_ST
R909
R2522
4.7K
R910
R955
R956
R957
012:C9
PTC_TX_1
+5V_ST_PTC
Q902
2SC3875S(ALY)
B
10KR917
R922
22K
C
E
+5V_ST_PTC
Q903
2SC3875S(ALY)
B
1KR923
R927
22K
C
E
Serial Port
+5V_ST_PTC
+5V_ST_PTC
R921
22K
Q901
C
2SC3875S(ALY)
10KR912
B
+5V_ST_PTC
L900
MLB-201209-0120P-N2
008:AQ28
012:D13
009:AC30;012:Z7
+5V_ST_PTC
TX_F5
008:AR32
R926
10K
C
Q905EB
E
IC901
MC14053BDR2G
1
2
3
4
5
6
7
8
009:AQ26;012:J7
16
15
14
13
12
11
10
9
+3.3V_ST
Q1200
BSS83
D
B
S
G
GND
Y1
0
OPT
OPT
OPT
OPT
Y0
0
Z1
0
100
Z
Z0
0
INH
VEE
VSS
PTC_RX_5V
C902
0.1uF
VDD
Y
R913
0
0
0
0
100R918
100R919
100R920
0R959
PTC_TX_MSTAR
PTC_RX_MSTAR_5V
PTC_DEBUG_RX
009:AQ26;012:K14
PTC_RX_5V
OPT
2SC3875S(ALY)
R914
X
R915
X1
OPT
R916
X0
A
B
C
OPT
1KR924
Q904
2SC3875S(ALY)
B
1KR929
R928
22K
C
E
008:AB27
009:AC30;012:D9
UART_SWB
+5V_ST_PTC
MSTAR_TX
PTC_DEBUG_TX
009:AH36
+3.3V_ST
R1200
4.7K
R1201
4.7K
+5V_ST_PTC
IC902
ST3232CDR
C1+
C904
C903
0.047uF
0.33uF
+3.3V_ST
Q1201
BSS83
D
B
S
GND
V+
C1-
C906
C2+
0.33uF
C2-
0.33uFC905
V-
T2OUT
R2IN
100R930
100R931
G
VCC
16
1
GND
15
2
T1OUT
14
3
R1IN
13
4
R1OUT
12
5
T1IN
11
6
T2IN
10
7
R2OUT
8
9
IC903
MC14053BDR2G
Y1
1
Y0
2
Z1
3
Z
4
Z0
5
INH
6
VEE
7
VSS
8
C907
0.1uF
100R932
100R934
C909
220pF
0R935
100R933
VDD
16
Y
15
X
14
X1
13
X0
12
A
11
B
10
C
9
C908
0.1uF
100R936
100R937
100R938
2SC3875S(ALY)
C910
220pF
SDC15
A1
A2
100R939
100R940
+5V_ST_PTC
C
Q906EB
RxD
D900
A1
C
A2
R941
10K
D901
SDC15
KCN-DS-1-0088
C
MLB-201209-0120P-N2
P900
1
6
2
7
3
8
4
9
5
10
L901
MSTAR_RX
PTC_DEBUG_RX
1KR942
+5V_ST_PTC
009:AH37
008:AB27
009:AC30;012:J8
UART_SWA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
UART12 14
Page 26
PStoPDF trial version. http://www.oakdoc.com
USB JACK (DOWN LOAD ONLYU)
VOUT
ILIMIT
FAULT/
R2513
180
P1207
1234
USB DOWN STREAM
UB01123-4HHS-4F
5
SIGN799
L1300
CB3216PA501E
D1304
ADMC5M03200L
5.6V
C2251
47uF
10V
008:AQ34
008:AQ34
D1305
ADMC5M03200L
5.6V
C2252
47uF
10V
USB_DM
USB_DP
USB +5V Over Current Protection --> USB Jack
MIC2009YM6-TR
6
5
4
+3.3V
IC1304
VIN
1
GND
2
ENABLE
3
R2514
47
R2515
4.7K
USB_CTL
R2518
10K
C2248
10uF
+5V_EXT
C2249
10V
0.1uF
USB_OCD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
26/32LG3DDH
USB JACK
1314
Page 27
PStoPDF trial version. http://www.oakdoc.com
CH_UP
JK1500
1
5
008:AB20
NC
ON/OFF
CH_DN
AUDIO
COM
MUTE
NORMAL
HP_MUTE
P_GND
Drawing with Line pattern
HP_DET
008:P29
008:Q28
008:Q28
R1500
HP_R
HP_L
25V
C1502
220uF
C1503
0.1uF
50V
0
R1511
+5V_GENERAL
0
R1501
1K
OPT
R1503
R1502
1K
OPT
R1504
OPT
R1514
0
GND
R1505
3K
R1508
0
D
Q1500
G
FDV301N
S
R1509
0
D
Q1501
G
FDV301N
S
R1506
0
C1501
2.2uF
16V
R1510
OPT
R1507
9.1K
25V
1uF
C1500
2
3
6
4
R1512
R1513
SHUTDOWN
10
8
7
0
014:R6
0
BYPASS
T1501
AT2812A
R9127
0
1/4W
5%
HP_R_OUT
014:R5
HP_L_OUT
IC1500
TPA6110A2DGNRG4
1
GND
2
3
IN2-
4
R1515
50V
1
2
3
4
C1505
C1504
100pF
50V
100pF
13K
50V
R1517
1K
1/10W
5%
R1518
1K
1/10W
5%
L1501
8OHM
L1500
8OHM
100pF
C1506
OPT
R1528
2.2
1W
5%
C1509
0.022uF
50V
UPS_Power
GND
1%
5%
C1510
C1507
100pF
50V
1W
C1508
0.1uF
50V
R1521
9.1K
R1530
R1529
200
200
1/8W
1/8W
1%
470
R1527
DJ-S3600LM
5
1
2
3
4
Pillow_POWER_MANAGE
25V
1uF
C1512
C1513
MBW3216-501TF
C1511
10uF
16V
R1524
750
1/8W
5%
R1525
0
1/4W
5%
470
1W
R1526
014:N18;014:AC2
12VDC_1
R1522
470
1/10W
5%
014:N20;014:AC2
12VDC_1
R1523
470
1/10W
5%
R1516
22
R1520
OPT
IN1-
8
7
6
5
13K
VO1
R1519
VDD
VO2
1%
JK1501
100uF
100uF
L1502
16V
16V
1
2
1
2
1
2
1
2
+5V_GENERAL
470uF
C4007
16V
470uF
C1516
OPT
16V
IC1501
PC17L1(5V/35V 4P)
IC1502
PC17L1(5V/35V 4P)
IC1503
PC17L1(5V/35V 4P)
IC1504
PC17L1(5V/35V 4P)
1K
R1531
1K
R1532
C1514
100pF
50V
C1515
100pF
50V
PILLOW_OUT
PILLOW_OUT
4
3
4
3
4
3
4
3
HP_R_OUT
HP_L_OUT
014:K12
014:K9
+12V
12VD
2F
C2711
10uF
35V
14
UPS_Power
L1507
6
5
3
4
P_GND
USP_1
R2710
10K
R2711
10K
2
5
PILLOW_OUT
R2712
4.7K
R2713
4.7K
3
6
L1508
R2714
10K
R2715
10K
7
C2712
2.2uF
50V
C2713
2.2uF
50V
C2716
100uF
C2717
100uF
16V
C2714
10K
2.2uF
R2717
50V
C2715
2.2uF
50V
200
R2716
16V
L2701
L2700
OPT
5VST
5VD
R1543
3K
R1542
33
R1538
OPT
22K
P_CH_DN
009:K27
47K
R1537
R1541
0
OPT
R1547
33
PILLOW_MUTE
009:AE29
P_ON_OFF
009:R26
R1544
47K
+12V_C
R1545
47K
R1546
47K
C
Q1502
B
E
2SC3875S(ALY)
014:V27;014:AB9;014:AC16;014:AF7
P_CH_UP
009:K26
R1548
22K
OPT
0
R1549
5VD
2SC3875S(ALY)
5VST_1
OPT
OPT
C1518
2.2uF
25V
C1517
10uF
16V
L6002
R1550
22K
Q1503
B
Q1504EB
PILLOW_SPK
MLB-201209-0120P-N2
C1520
+12V_C
D1500
R1534
33
R1535
33
R1540
3K
R1536
3K
R1539
33
GND
R1533
47K
4.7K
R2700
008:U29
5VST
L6001
MLB-201209-0120P-N2
2.2uF
25V
R1551
2.2K
C
E
2SC3875S(ALY)
C1519
47uF
25V
1/4W
R1553
1N4148W
100V
C
Q2700
2SC3052
5%
10
R1552
47K
+5V_GENERAL
10K
R2701
C
B
E
1S2
C1521
100uF
2G2
16V
3S1
4G1
014:V27;014:X6;014:AC16;014:AF7
009:AL36
SEL_PILLOW_0
R2702
R2703
AO4813
1/4W
Q1505
4.7K
R2705
R9128
10K
OPT
OPT
R2704
0
Q2701
2SC3052
5VST
OPT
R9129
10K
0
014:V27;014:X6;014:AB9;014:AF7
8 D2_2
7 D2_1
6 D1_2
5 D1_1
5VD
1/10W
R1555
200
10K
C2704
0.1uF
C2705
0.1uF
C2706
0.1uF
50V
DET_PILLOW
008:AB21;009:AA24
C1525
10uF
16V
Q1506EB
2SC3875S(ALY)
CB3216UA121
L2702
PVCCL_1
PVCCL_2
MUTE
BYPASS
AGND_1
AGND_2
PVCCR_1
VCLAMP
PVCCR_2
D1501
1N4148W
C
SD
LIN
RIN
1/4W
100V
C2703
22uF
35V
R2708
C
R2707
B
9.1K
E
0
1/4W
5%
R2706
OPT
C2700
1uF
16V
5VD
12VD
C1523
22uF
25V
USP_1
1%
8
7
RL1500
IM02NSL
1
2
L1503
10K
OPT
R2709
0
1/4W
OPT
5%
R9130
0
1/4W
5%
C2701
1uF
16V
12VD
L1504
014:V27;014:X6;014:AB9;014:AC16
6
5
12VD
3
4
OPT
L1505
1%
1/8W
470
R1556
5VD
C2702
10uF
35V
L2703
CB3216UA121
IC2700
TPA3124D2PWPR
1
2
3
4
5
6
7
8
9
10
11
12
5VST
R1560
4.7K
4.7K
R1559
5%
10
R1558
009:AL36
SEL_PILLOW_1
R1557
47K
C2707
0.1uF
50V
PGNDL_2
24
PGNDL_1
23
LOUT
22
BSL
21
AVCC_2
20
AVCC_1
19
GAIN0
18
GAIN1
17
BSR
16
ROUT
15
PGNDR_2
14
PGNDR_1
13
L2704
DA-8580
EAP38319001
2S
1S1F
C2709
0.22uF
25V
C2708
0.22uF
25V
C2710
0.1uF
50V
SW1500
JSS2201S090
USP_1
L1506
8
7
RL1501
IM02NSL
1
2
Drawing with Line pattern
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
12VDC_1
26/32LG3DDH
HOSPITAL
14 14
Page 28
Page 29
1. Power-up boot check
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check standby Voltage
P1408 9pin : +3.5V_ST
↓ OK
Check DC-DC output
IC3000 Pin 6: +5V_ST_PTC
↓ OK
Check Q404 Output
Pin 8: +5V_ST
↓ OK
Check X100 clock
↓ OK
Check P1408 OR_RELAY_ON
1Pin : 3.5V
↓ OK
Check Multi Voltage
P1408 17pin : 12V,
2pin : 24V
↓ OK
Check Q706 Output.
12V, 5V
→
NO
→
NO
→
NO
→
NO
→
NO
→
NO
→
NO
Check Power connector
Replace IC3000
Re-download PTC S/W
Replace X100
Re-download software& PTC
Replace Power board
Replace Q706
→
OK
→
OK
Check Fuse
Replace Mstar(IC100)
or Main board
→
OK
Replace Power board
↓ OK
Check inverter control & error
P1408 18pin : Low
P1408 20pin : high
↓ OK
Check Mstar LVDS output
R847,R848….R856
→
NO
→
NO
Check Power board
or Module
Replace Mstar(IC100)
or Main board
Page 30
2. Digital TV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable & Signal
↓ OK
Check Tuner 5V Power
TU1001 4Pin
↓ OK
Check IF_P/N Signal
↓ OK
Check Check Demodulator Input
Clock(X1005)
↓ OK
Check IC1004(LGDT) Output
- AR1070, AR1071
↓ OK
Check Mstar LVDS output
R847,R848….R856
→
NO
→
NO
→
NO
→
NO
→
NO
Check IC1002
Check IC1003
Bad Tuner. Replace Tuner.
Replace X1005
Replace IC1004
Replace Mstar(IC100)
or Main board
3. Analog TV Video
Check RF Cable
↓ OK
Check Tuner 5V Power
TU1001 4Pin
↓ OK
Check CVBS signal.
TU1001 #19 Pin
↓ OK
Check Mstar LVDS output
→
NO
→
NO
→
NO
Check IC1002
Check IC1003
Bad Tuner. Replace Tuner.
Replace Mstar(IC100)
or Main board
Page 31
4. Component Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
↓ OK
Check Component Cable.
↓ OK
Check JK1207
↓ OK
Check Mstar LVDS output
5. RGB Video
Check input signal format.
Is it supported?
↓ OK
Check RGB Cable conductors for
damage.
↓ OK
Check JK1204
↓ OK
Check EDID
↓ OK
Check signal
R/G/B/H/V-Sync
C113,C108,C114,R146,R149
↓ OK
Check Mstar LVDS output
→
NO
→
NO
→
NO
→
NO
→
NO
→
NO
Replace Jack.
Replace Mstar(IC100)
or Main board
Replace Jack.
Replace the defective IC or re-
download
EDID data.
`
Check other set.
If no problem, check signal line.
Replace Mstar(IC100)
or Main board
Page 32
6. AV Video
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check input signal format.
Is it supported?
↓ OK
Check AV Cable for damage or
open conductor.
↓ OK
Check JK1206
↓ OK
Check Mstar LVDS output
7. HDMI Video
Check input signal format.
Is it supported?
↓ OK
Check HDMI Cable for damage or
open conductor.
↓ OK
Check JK500
↓ OK
Check EDID & EEPROM IC500
I2C Signal (#5, #6)
↓ OK
Check HDCP key NVRAM(IC105)
power & I2C Signal (#5, #6)
↓ OK
→
NO
→
NO
→
NO
→
NO
→
NO
Replace Jack.
Replace Mstar(IC100)
or Main board
Replace Jack.
Replace the defective IC or re-
download
EDID data.
Replace the defective IC.
Check HDMI Signal
↓ OK
Check Mstar LVDS output
→
NO
→
NO
Check other set.
If no problem, check signal line.→NO
Replace Mstar(IC100)
or Main board
Replace Main board
Page 33
8. All Source Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Make sure you
can’t hear any audio.
↓ OK
Check Mstar AUDIO_MASTER_CLK
R606
↓ OK
Check Mstar I2S Output
R604, R605, R606
↓ OK
Check IC600 Power
24V, 3.3V, 1.8V.
↓ OK
Check Output Signal
P1400 1,2,3,4 PIN
↓ OK
Check Connector & P600
↓ OK
Check speaker resistance
and connector damage.
→
NO
→
NO
→
NO
→
NO
→
NO
→
NO
Replace Mstar(IC100)
or Main board
Check signal line
Or replace IC100
Check Regulaor
IC601.IC3001
Replace NTP(Audio AMP)
IC600
Replace connector
if found to be damaged.
Replace speaker.
Page 34
9. Digital TV Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check Tuner 5V Power
TU1001 4Pin
↓ OK
Check IF_P/N Signal
↓ OK
Check Check Demodulator Input
Clock(X1005)
↓ OK
Check IC1004(LGDT) Output
- AR1070, AR1071
↓ OK
Check Output Signal
P1400 1,2,3,4 PIN
↓ OK
Check Connector & P600
↓ OK
Check speaker resistance
and connector damage.
→
NO
→
NO
→
NO
→
NO
→
NO
→
NO
→
NO
Check IC1002
Check IC1003
Bad Tuner. Replace Tuner.
Replace X1005
Replace IC1004
Replace NTP(Audio AMP)
IC600
Replace connector
if found to be damaged.
Replace speaker.
→
NO
Bad Tuner. Replace
Tuner.
Page 35
10. Analog TV Audio
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Check RF Cable
↓ OK
Check Tuner 5V Power
TU1001 4Pin
↓ OK
Check SIF buffer signal.
↓ OK
Follow procedure All source audio
trouble shooting guide.
11. Pillow Speaker Audio
Check Switch
SW1500 Location(Pillow Speaker)
↓ OK
Check Connection & JK1500
→
NO
→
NO
→
NO
Replace Connector if found to be
→
NO
Check IC1002
Check IC1003
Check SIF Signal line.
Replace Mstar(IC100)
or Main board
damaged
→
NO
Bad Tuner. Replace
Tuner.
Page 36
26LG3DDH
Copyright ⓒ 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
MPEG2,
LINUX
Half-NIM Tuner
IF +/-
Demod.
TR Buffer
SCL, SDA_3.3V
VSB
TS In[0…7]
TS_clk, SOP, Val
TU_CVBS
SIF
SDA/SCL_5V
Reset / IF_AGC …
LVDS
MPI Control
PTC
LCD Module
JACK PACK
JACK PACK
at REAR
at REAR
JACK PACK
JACK PACK
at SIDE
at SIDE
AV
Component 1
D-sub RGB
Audio L/R (for RGB)
HDMI
1
RS-232C (Ctrl./SVC)
USB2.0
IR OUT
Speaker Out(8ohm)
Universal Pillow
Mechanical Switch
Side AV
Headphone(opt)
CVBS, L/R
Y Pb Pr, L/R
EEPROM
EEPROM
RGB/H/V
Audio L/R
RX/TXRX/TX
MAX3232
DP/DM
O.C. Protector
AMP
Audio AMP
PILLOW_SPK
TPA3124D2PWPR
P_CH_UP, P_ON_OFF, P_CH_DN
DET_PILLOW
CVBS, L/R
Audio L/R
Out
H/P Amp.
Saturn6
Saturn6
(ATSC
(ATSC
US)
US)
12MH
z
Reset IC
Reset Switch
X-tal
Data [0 … 7]
NAND Flash
Addr[0…1], CS …
(256Mb)
MPEG2/4
Linux
Scaler
+5V+5V
PIP : x
DDR_Data[0:15], DQS, DM …
Addr.[ ], ctrl. data
Data[16:31]
I2S
SCL, SDA_3.3V
SCL,
SDA_3.3V
CLK,TDI,TDO,MS,RST
Digital AMP
DDR2 (512Mbit)
Qimonda / Hynix
DDR2 (512Mbit)
Qimonda / Hynix
NTP3100A
EEPROM
512Kb
IO Expander
JTAG
GPIO
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