Leica EM TXP User Manual

Leica EM TXP

Target Surfacing System

Leica EM TXP – Target Surfacing

The Leica EM TXP is a unique target preparation device especially
developed for cutting and polishing samples prior to examina­ tion by SEM, TEM and LM techniques. It excels with challenging
speci mens where pinpointing and preparing barely visible targets
becomes easy. Before the Leica EM TXP, sawing, milling grinding
and polishing exactly to the target was often a very time-consum­ing and difficult procedure as points of interest were easily
missed and specimens often difficult to handle due to their small
size. With the Leica EM TXP such samples can easily be prepared.

Leica Design by W. Hölbl

90° rotation view

Processing observation

Front face observation

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System

Integrated Viewing System

Stereo microscopic target observation

during the working process

With the specimen pivot arm the sample can be observed during
preparation at an angle between 0° and 60°, directly onto the front
face, or 90° to the front face for distance determination with an
eyepiece graticule. The Leica EM TXP features brilliant ring LED
top light and optimized backlight illumination for excellent viewing.

■ Accurate location and preparation of microtargets

Front side decapsuled integrated circuit

■ Observation with a stereo microscope

■ Multifunctional machine processing

■ Automatic process control

■ to produce a mirror-like surface quality

SM LED gold wire bond

PCB cross section with soldered pin

PCB cross section

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