Kontron RTM8050 User Manual

If it's embedded, it's Kontron.

» Kontron User's Guide «

RTM8050

Document Revision 1.2
November 2009

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Revision History

Rev. Index Brief Description of Changes Date of Issue

1.0 First Release April 2009

1.0.1 Added IPMB-L Address 0xA6 August 2009

1.1 Second Release September 2009

1.2 Third Release November 2009

Customer Service

Contact Information: Kontron Canada, Inc.

4555 Ambroise-Lafortune
Boisbriand, Québec, Canada
J7H 0A4
Tel: [phone]

[phone]
Fax: [phone]
E-mail: [e-mail]

Visit our site at: www.kontron.com

© 2009 Kontron, an International Corporation. All rights reserved.

The information in this user's guide is provided for reference only. Kontron does not assume any liability
arising out of the application or use of the information or products described herein. This user's guide may
contain or reference information and products protected by copyrights or patents and does not convey any
license under the patent rights of Kontron, nor the rights of others.

Kontron is a registered trademark of Kontron. All trademarks, registered trademarks, and trade names used
in this user's guide are the property of their respective owners. All rights reserved. Printed in Canada. This
user's guide contains information proprietary to Kontron. Customers may reprint and use this user's guide in
other publications. Customers may alter this user's guide and publish it only after they remove the Kontron
name, cover, and logo.

Kontron Modular Computer GMBH

Sudetenstrasse 7
87600 Kaufbeuren
Germany
[phone]

[phone]

[e-mail]

Kontron reserves the right to make changes without notice in product or component design as warranted by
evolution in user needs or progress in engineering or manufacturing technology. Changes that affect the
operation of the unit will be documented in the next revision of this user's guide.

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Table of Contents

Safety Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vi

Before You Begin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vi

Preventing Electrostatic Discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .vii

Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii

How to Use This Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii

Customer Comments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix

Advisory Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix

Unpacking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x

Powering Up the System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x

Adapter Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x

Table of Contents

Storing Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .x

Regulatory Compliance Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi

Limited Warranty . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xii

1. Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.2 What’s Included. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Board Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.5 Hot-Swap Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.6 Interfacing with the Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.6.1 RTM (rear transition module) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

2. Board Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 USB 2.0 Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.3 SAS Onboard Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.4 HD Mezzanine Hot-Swap Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.5 Serial Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.6 SFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.7 MMC Boot Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

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2.8 Hardware Management Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.8.1 Sensor Data Record (SDR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

2.8.2 Hardware Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

2.8.3 Field Replaceable Unit (FRU) Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

2.8.4 MMC Firmware Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

2.8.5 MMC Firmware Upgrade Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

2.8.6 Boot Block Upgrade Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

2.9 Face Plate Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2.9.1 Hot Swap LED (LED0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.9.2 Out Of Service (LED1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.9.3 Healthy LED (LED2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

2.9.4 RTMDISK Hot Swap LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

3. Hot Swap and Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.1 RTM Hot Swap and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3.1.1 Installing the RTM in the chassis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.1.2 Removing the RTM from the chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

3.2 RTMHDD Hot Swap and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.2.1 Installing the Hot Swap RTMHDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2.2 Removing the Hot Swap RTMHDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

A. Connector Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1

A.1 Connectors and Headers Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-1

A.2 AdvancedTCA I/O RTM Connector (P30) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-2

A.3 SAS Faceplate Connector (J1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-3

A.4 SFP Channel (J4 & J5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-3

A.5 Dual USB Port (J7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-4

A.6 Serial Port(J9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-4

A.7 Hot Swap Hard Disk Module(J13). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .A-4

B. Software Update . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .B-1

B.1 MMC Firmware Update Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .B-1

C. Getting Help. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C-1

C.1 Returning Defective Merchandise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1

C.2 When Returning a Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .C-2

D. Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-1

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List of Figures

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List of Figures

Figure 2-1: Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

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List of Tables

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List of Tables

Table 1-1 Board Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2-1 USB Connector Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 2-2 Serial Port Connector Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 2-3 IPMI Hardware Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 2-4 Board Information Area. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 2-5 Product Information Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 2-6 Type 16 Module Current Requirements Records. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 2-7 Hot-Swap LED Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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Safety Instructions

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Safety Instructions

Before You Begin

Before handling the board, read the instructions and safety guidelines on the following pages to prevent
damage to the product and to ensure your own personal safety. Refer to the "Advisories" section in the
Preface for advisory conventions used in this user's guide, including the distinction between Warnings,
Cautions, Important Notes, and Notes.

• Always use caution when handling/operating the computer. Only qualified, experienced,
authorized electronics service personnel should access the interior of the computer. The power
supplies produce high voltages and energy hazards, which can cause bodily harm.

• Use extreme caution when installing or removing components. Refer to the installation
instructions in this user's guide for precautions and procedures. If you have any questions, please
contact Kontron Technical Support

WARNING

High voltages are present inside the chassis when the unit's power cord is plugged
into an electrical outlet. Turn off system power, turn off the power supply, and then
disconnect the power cord from its source before removing the chassis cover. Turning
off the system power switch does not remove power to components.

vi RTM8050

Safety Instructions

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Preventing Electrostatic Discharge

Static electricity can harm system boards. Perform service at an ESD workstation and follow proper ESD
procedure to reduce the risk of damage to components. Kontron strongly encourages you to follow proper
ESD procedure, which can include wrist straps and smocks, when servicing equipment.

Take the following steps to prevent damage from electrostatic discharge (ESD):

•When unpacking a static-sensitive component from its shipping carton, do not remove the
component's antistatic packing material until you are ready to install the component in a
computer. Just before unwrapping the antistatic packaging, be sure you are at an ESD workstation
or grounded. This will discharge any static electricity that may have built up in your body.

•When transporting a sensitive component, first place it in an antistatic container or packaging.

•Handle all sensitive components at an ESD workstation. If possible, use antistatic floor pads and
workbench pads.

•Handle components and boards with care. Don't touch the components or contacts on a board. Hold
a board by its edges or by its metal mounting bracket.

•Do not handle or store system boards near strong electrostatic, electromagnetic, magnetic, or
radioactive fields.

•When you want to remove the protective foil (if present), make sure you are properly grounded and
that you touch a metalic part of the board.

CAUTION

Removing the protective foil from the top and bottom cover might create static.
When you remove those protections, make sure you follow the proper ESD procedure.

vii RTM8050

Preface

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Preface

How to Use This Guide

This user's guide is designed to be used as step-by-step instructions for installation, and as a reference for
operation, troubleshooting, and upgrades.

For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.

The following is a summary of chapter contents:

•Chapter 1, Product Description

•Chapter 2, Board Features

•Chapter 3, Installing the board

•Appendix A, Connector Pinout

•Appendix B, Software Update

•Appendix C, Getting Help

•Appendix D, Glossary

viii RTM8050

Preface

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Customer Comments

If you have any difficulties using this user's guide, discover an error, or just want to provide some feedback,
please send a message to: [e-mail]
or problems as soon as possible and post the revised user's guide on our Web site. Thank you.

. Detail any errors you find. We will correct the errors

Advisory Conventions

Seven types of advisories are used throughout the user guides to provide helpful information or to alert you
to the potential for hardware damage or personal injury. They are Note, Signal Paths, Jumpers Settings, BIOS
Settings, Software Usage, Cautions, and Warnings. The following is an example of each type of advisory. Use
caution when servicing electrical components.

Note:

Indicate information that is important for you to know.

Signal Path:

Indicate the places where you can fin the signal on the board.

Jumper Settings:

Indicate the jumpers that are related to this sections.

BIOS Settings:

Indicate where you can set this option in the BIOS.

Software Usage:

Indicates how you can access this feature through software.

CAUTION

Indicate potential damage to hardware and tells you how to avoid the problem.

WARNING

Indicates potential for bodily harm and tells you how to avoid the problem.

ESD Sensitive Device:

This symbol and title inform that electronic boards and their components are sensitive to static
electricity. Therefore, care must be taken during all handling operations and inspections of this
product, in order to ensure product integrity at all times.
Please read also the section "Special Handling and Unpacking Instructions".

CE Conformity:

This symbol indicates that the product described in this manual is in compliance with all applied CE
standards. Please refer also to the section "Regulatory Compliance Statements" in this manual.

Disclaimer: We have tried to identify all situations that may pose a warning or a caution condition in this
user's guide. However, Kontron does not claim to have covered all situations that might require the use of a
Caution or a Warning.

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Unpacking

Follow these recommendations while unpacking:

•Remove all items from the box. If any items listed on the purchase order are missing, notify Kontron
customer service immediately.

•Inspect the product for damage. If there is damage, notify Kontron customer service immediately.

•Save the box and packing material for possible future shipment.

Powering Up the System

Before any installation or setup, ensure that the board is unplugged from power sources or subsystems.

If you encounter a problem, verify the following items:

•Make sure that all connectors are properly connected.

Preface

•Verify your boot devices.

•If the system does not start properly, try booting without any other I/O peripherals attached,
including AMC adapters.

Make sure your system provides the minimum DC voltages required at the board's slot, especially if DC power
is carried by cables.

If you are still not able to get your board running, contact our Technical Support for assistance.

Adapter Cables

Because adapter cables come from various manufacturers, pinouts can differ. The direct crimp design offered
by Kontron allows the simplest cable assembly. All cables are available from Kontron Sales Department.

Storing Boards

Electronic boards are sensitive devices. Do not handle or store device near strong electrostatic,
electromagnetic, magnetic or radioactive fields.

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Regulatory Compliance Statements

FCC Compliance Statement for Class A Devices

This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generated, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:

•Reorient or relocate the receiving antenna.

•Increase the separation between the equipment and receiver.

•Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.

Preface

•Consult the dealer or an experience radio/TV technician for help.

WARNING

This is a Class A product. If not installed in a properly shielded enclosure and used in
accordance with this User's Guide, this product may cause radio interference in
which case users may need to take additional measures at their own expense.

Safety Certification

All Kontron equipment meets or exceeds safety requirements based on the IEC/EN/UL/CSA 60950­1 family of standards entitled, "Safety of information technology equipment." All components are
chosen to reduce fire hazards and provide insulation and protection where necessary. Testing and
reports when required are performed under the international IECEE CB Scheme. Please consult the
"Kontron Safety Conformity Policy Guide" for more information. For Canada and USA input voltage
must not exceed -60Vdc for safety compliance.

CE Certification

The product(s) described in this user's guide complies with all applicable European Union (CE)
directives if it has a CE marking. For computer systems to remain CE compliant, only CE-compliant
parts may be used. Maintaining CE compliance also requires proper cable and cabling techniques.
Although Kontron offers accessories, the customer must ensure that these products are installed
with proper shielding to maintain CE compliance. Kontron does not offer engineering services for
designing cabling systems. In addition, Kontron will not retest or recertify systems or components
that have been reconfigured by customers.

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Preface

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Limited Warranty

Kontron grants the original purchaser of Kontron's products a TWO YEAR LIMITED HARDWARE WARRANTY as
described in the following. However, no other warranties that may be granted or implied by anyone on behalf
of Kontron are valid unless the consumer has the express written consent of Kontron.

Kontron warrants their own products, excluding software, to be free from manufacturing and material
defects for a period of 24 consecutive months from the date of purchase. This warranty is not transferable nor
extendible to cover any other users or long- term storage of the product. It does not cover products which
have been modified, altered or repaired by any other party than Kontron or their authorized agents.
Furthermore, any product which has been, or is suspected of being damaged as a result of negligence,
improper use, incorrect handling, servicing or maintenance, or which has been damaged as a result of
excessive current/voltage or temperature, or which has had its serial number(s), any other markings or parts
thereof altered, defaced or removed will also be excluded from this warranty.

If the customer's eligibility for warranty has not been voided, in the event of any claim, he may return the
product at the earliest possible convenience to the original place of purchase, together with a copy of the
original document of purchase, a full description of the application the product is used on and a description
of the defect. Pack the product in such a way as to ensure safe transportation (see our safety instructions).

Kontron provides for repair or replacement of any part, assembly or sub-assembly at their own discretion, or
to refund the original cost of purchase, if appropriate. In the event of repair, refunding or replacement of
any part, the ownership of the removed or replaced parts reverts to Kontron, and the remaining part of the
original guarantee, or any new guarantee to cover the repaired or replaced items, will be transferred to cover
the new or repaired items. Any extensions to the original guarantee are considered gestures of goodwill, and
will be defined in the "Repair Report" issued by Kontron with the repaired or replaced item.

Kontron will not accept liability for any further claims resulting directly or indirectly from any warranty
claim, other than the above specified repair, replacement or refunding. In particular, all claims for damage
to any system or process in which the product was employed, or any loss incurred as a result of the product
not functioning at any given time, are excluded. The extent of Kontron liability to the customer shall not
exceed the original purchase price of the item for which the claim exists.

Kontron issues no warranty or representation, either explicit or implicit, with respect to its products
reliability, fitness, quality, marketability or ability to fulfil any particular application or purpose. As a result,
the products are sold "as is," and the responsibility to ensure their suitability for any given task remains that
of the purchaser. In no event will Kontron be liable for direct, indirect or consequential damages resulting
from the use of our hardware or software products, or documentation, even if Kontron were advised of the
possibility of such claims prior to the purchase of the product or during any period since the date of its
purchase.

Please remember that no Kontron employee, dealer or agent is authorized to make any modification or
addition to the above specified terms, either verbally or in any other form, written or electronically
transmitted, without the company's consent.

xii RTM8050

Product Description

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1. Product Description

1.1 Product Overview

The RTM8050 is a single slot (6HP) AdvancedTCA Rear Transition Module. This RTM provides additional
connectivity to the AT8050 CPU front board.

1.2 What’s Included

This board is shipped with the following items:

• One RTM8050 board

• One RTMHDD board with SAS hard disk

• One CD-ROM containing documentations and drivers.

• Cables that have been ordered

If any item is missing or damaged, contact the supplier.

1.3 Board Specifications

Table 1-1:Board Specifications

Features Description

Compatible Products • AT8050

• PICMG3.0 R3.0 (see note in section 1.4)

• SAS1R10

• SFF-8470

Compliancy

IPMI Features

Supervisory

• IEEE 802.3z (fiber interface)

• IEEE 802.3 (copper interface)

• PICMG HPM.1

• USB 2.0

• Management Controller compliant to PICMG 3.0 and IPMI v2.0 .

• Management Controller is run time field reprogrammable without payload impact.

• Robust fail safe reprogramming implementation (which includes two firmware images) that
could perform automatic or manual rollback if a problem occurs during critical reprogramming
phase.

• Remote upgrade capability (via IPMB).

• Management Controller self test which can detect failure under its code integrity and trig an
automatic rollback.

• Hardware system monitor through IPMI (voltages, currents, temperature), temperature monitor
/ alarm; board temperature sensor, power failure.

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Features Description

Mechanical • 322.25 x 93.74 x 29 mm

Power Requirements

Environmental
Temperature*

Environmental
Humidity*

Environmental Altitude*

Environmental Shock*

Environmental
Vibration*

Reliability

Safety / EMC

Warranty Two years limited warranty

• 10W Typical without hard drive.

• 20 W Typical with hard drive.

Operating: 0-55°C/32-131°F with 30CFM airflow
Storage and Transit: -40 to +70°C/-40 to 158°F

Operating: 15% to 90% @55°C/131°F non-condensing
Storage and Transit: 5% to 95% @ 40°C/104°F non-condensing

Operating: 4,000 m / 13,123 ft
Storage and Transit: 15,000 m / 49,212 ft

Operating: 3G, half-sine 11ms, each axis
Storage and Transit: 18G, half-sine 11ms, each axis

Operating: 5-200Hz. 0.2G, each axis
Storage and Transit: 5 Hz to 20 Hz @ 1 m2/s3 (0.01 g2 /Hz) (flat) 20 Hz to 200 Hz @ -3 dB/oct (slop

down)

• Whole board protected by active breaker

• USB voltage protected by an active breakers

• Safety: CE Mark to EN 60950-1:2001. Meets or exceeds UL 60950-1/CSA C22.2 No 60950-1-07.

• Designed to meet GR-1089-CORE

• EMI/EMC: FCC 47 CFR Part 15, Class A; CE Mark to EN55022/EN55024/EN300386

Product Description

* Designed to meet or exceed

1.4 Compliance

This product conforms to the following specifications:

• PICMG3.0 R3.0 - Advanced Telecommunication Computing Architecture (see note below)

•PICMG HPM.1

• SAS1R10 - Serial Attached SCSI - 1.1 Revision 10. (SAS-1.1)

• SFF-8470 (T10 Technical Committee and SCSI Trade Association)

• IEEE 802.3z (fiber interface)

• IEEE 802.3 (copper interface)

Note:

Board might not be 100% compliant to ATCA PICMG 3.0 Specification REQ 4.94 when a hard drive is
present on the RTMHDD. The HDD might connect the Logic Ground and the Shelf Ground. By default
the Logic Ground and the Shelf Ground are connected through a removable screw.

2 RTM8050

Product Description

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1.5 Hot-Swap Capability

The RTM8050 supports Full Hot Swap capability as per PICMG3.0R3.0. It can be removed from or installed in
the system while it is on (without powering-down the system). Please refer to the PICMG3.0R3.0
specification for additional details.

WARNING

All the managements infrastructures are present for hot-swap, but the user must
take the proper action to protect its data under the OS installed on the Front Board
(such as unmount a SAS drive)

1.6 Interfacing with the Environment

1.6.1 RTM (rear transition module)

The RTM8050 is a single slot (6HP) AdvancedTCA Rear Transition Module. This module provides additional
connectivity for AT8050 CPU front board.

1.6.1.1 SAS Feature

• Compliant to SAS-1.1 Revision 10 / SFF-8470

• SAS signal integrity guarantee over a four meters cable

1.6.1.2 Serial Port Feature

• One (1) serial port available on the RTM face plate through one (1) RJ-45 connector

• RS-232 signals level at RTM face plate connector.

• Serial port speed capability is: 9.6kbits/s to 115.2kbits/s.

1.6.1.3 FRU Data EEPROM

• FRU Data EEPROM size is 32Kbit and it includes board identification and serial number.

1.6.1.4 Hot Swap

As a Hot Swappable Intelligent Managed FRU, the RTM8050 (FRU2) includes a Management Controller, the
AdvancedTCA Hot Swap indicator (Blue LED), and the standard AdvancedTCA handle switch.

The RTM8050 includes a PCI-Express SAS controller; proper PCI-Express Hot-Plug support is required in O/S
to complete hot-extract and hot-insert cycles.

As a Hot Swappable Non-Intelligent Managed FRU, the RTMHDD (FRU3) mezzanine adds support for SAS hot
swapping; it includes its own ejector latch and Blue LED, under control of the front board's IPMC.

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Product Description

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1.6.1.4.1 Insertion and Removal of the Managed FRUs

After insertion, the front board detects and activates the management components of the FRU. When the
handle is closed, the power budget and the e-keying negotiations start. Then, the front board's IPMC
activates the payload components of the FRU.

Opening the RTM handle switch on the RTM FRU and will start the deactivation process, which either
deactivates the whole board (front board, RTM and RTMHDD) or only the RTM8050 and its RTMHDD
mezzanine, depending on a configuration policy available through the CMOS configuration menu.

The operational state of the FRU is reported through the management subsystem FRU Hot Swap sensors. The
BLUE LED is 100% off when a FRU is operational and unsafe for extraction. An always on(100%) indicates
that a FRU can safely be extracted; transitional states are identified through blinking patterns. Additional
details on the standard FRU Hot Swap sensor and the BLUE LED usage can be found in the AdvancedTCA
specifications.

4 RTM8050

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2. Board Features

2.1 Block Diagram

Figure 2-1:Block Diagram

Board Features

5 RTM8050

Board Features

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2.2 USB 2.0 Interface

The RTM8050 feature two USB connectors on the faceplate.

USB features include:

• Capability to daisy chain as many as 127 devices per interface

• Fast bi-directional

• Isochronous/asynchronous interface

• 480 MBPS transfer rate

• Standardization of peripheral interfaces into a single format

• Backward compatible with USB 1.1 devices

USB supports Plug and Play and hot-swapping operations (OS level). These features allow USB devices to be
automatically attached, configured and detached, without reboot or running setup.

Table 2-1:USB Connector Pinout

Pin Signal

1 VCC

2 DATA-

3 DATA+

4 GND

Signal Path:

The USB Port are available through the RTM face plate (J7).

2.3 SAS Onboard Controller

The SAS controller is only offered through the RTM on which the controller is located. The controller used is
the 4 ports PCI-express from LSI: LSISAS1064e. The controller has access to

• Front board AMC bay SAS port

• HDD mounted on RTM8050

• Two external links

To achieve a redundant scheme two more interfaces are routed from external connector to RTM and AMC
HDDs.

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Board Features

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2.4 HD Mezzanine Hot-Swap Option

Kontron offers the possibility to add a Hot-Swap SAS hard drive on the RTM8050. This hard drive is located on
the lower part of the RTM8050. The Hotswap infrastructure includes Hotswap LED, Hotswap handle, hard disk
presence status, thermal sensor and Non-Intelligent-Managed-FRU EEPROM. All of which are connected to
the MMC. The HD supported is a SAS drive. This module is called RTMDISK. It is managed by the IPMC and
presented as a regular managed FRU to management subsystem.

2.5 Serial Port

The RTM8050 has one serial port available on the face plate. Serial ports is coming from the front board
through zone 3 connector. RS232 buffers are used to convert LVTTL level from zone 3 to RS232 level at the
face plate connector. Serial port works from 9.6 to 115.2 kbits/s.

Table 2-2:Serial Port Connector Pinout

Pin Signal

1 RTS

1 DTR

3 TX#

4 GND

5 N.C.

6 RX#

7 N.C.

8 CTS

Note:

Standard product uses a RJ-45 8 pins connector. RI (ring indicator) and DCD (data carrier detect)
signals are not available.
The pinout is a custom one, not the same as RS-232D TIA/EIA-561.

Signal Path:

Serial port is available on the RTM face plate through J9.

2.6 SFP

The RTM8050 has two SFP modules connectors available on the RTM face plate. The SFP module signals are
coming from the front board 1000Base-KX interface through zone 3 connector.

2.7 MMC Boot Block

The MMC runs a firmware from its internal 256KB flash. It is programmed by an additional 8K boot block. It
keeps the last two copies of the MMC firmware in dedicated flash memories. The boot block activates the MMC
image and can rollback a firmware update in the MMC in case of problems.

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Board Features

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2.8 Hardware Management Overview

The RTM communicates with the front board using the IPMB-L channel. Kontron Intelligent RTM address on
the IPMB-L is fixed and has a value of 0xA6.

The memory subsystem of the MMC consists of an integrated flash memory to hold the MMC operation code
and integrated RAM for data. The field replacement unit (FRU) inventory information is stored in the
nonvolatile memory on an EEPROM connected via a local I2C interface to the MMC. It is possible to store up to
4 KBytes within the FRU inventory information. Event generation over IPMB-L bus to reach the front board
that forward it to the ShMc ensure that 'post-mortem' logging information is available even if the power of
the RTM is disabled.

The onboard DC voltages and temperature are monitored by the MMC device. The MMC will send an event to
the front board if any of the thresholds are exceeded.

To increase the reliability of the RTM8050 management subsystem, an external watchdog supervisor only for
the MMC is implemented. The MMC must strobe the external watchdog at 500 μsec. intervals to ensure
continuity of operation of the board's management subsystem. If the MMC ceases to strobe the watchdog
supervisor, the watchdog resets the MMC. The watchdog timeout expires after one second if strobes are not
generated. The external watchdog supervisor is not configurable and must not be confused with the IPMI
v1.5 watchdog timer commands. This external watchdog of the MMC is implemented in a separate chip.

2.8.1 Sensor Data Record (SDR)

Every sensor on the RTM is associated with a Sensor Data Record (SDR). Sensor Data Records contain
information about the sensors identification such as sensor type, sensor name, sensor unit. SDR also
contain the configuration of a specific sensor such as threshold/hystheresis, event generation capabilities
that specifies sensor behaviour. Some fields of the sensor SDR are configurable through IPMI v1.5 command
and are set with built-in initial value. Finally one field wich is the sensor owner must reflect the module
addresses that allow a system management software to identify the owner of the SDR when it is scanned from
the front board IPMC and merged within the IPMC Device SDR repository.

From IPMI prespective, the RTM8050 management controller is set up as a satellite management controller
(SMC). It does support sensor devices, and use the IPMI static sensor population feature of IPMI v1.5 to
merge the hot swaped RTM sensor with the front board sensors population. The usual way the SHMC is
informed about an RTM insertion is through the RTM Module Hot Swap sensor and a radial presence line on
the RTM connector. All SDRs can be queried using Device SDR commands to the firmware. Module sensors
that have been implemented are listed below.

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2.8.2 Hardware Sensors

Table 2-3:IPMI Hardware Sensors

Board Features

IPMI
sensor
ID

0 Module HS Hot Swap state * N

1 Temp Air In Ait Inlet Temperature (Degrees) * X

2 Temp Air Out Ait Outlet Temperature (Degrees) * X

3 Temp SASCtrl LSI SAS Controller Temperature (Degrees) * X

4 Temp MMC Module Management Controller Temperature (Degrees) * X

5 Vcc +3.3VSUS Voltage on board 3.3V suspend (management) power supply * X

6 Vcc +3.3V Voltage on board 3.3V backend power supply - X

7 Vcc +5V Voltage on board 5V backend power supply - X

8 Vcc +1.2V Voltage on board 1.2V backend power supply - X

9 Vcc BlueLED Voltage on board blue LED VPUMP suspend power supply * X

10 Vcc +12V Voltage on board 12V payload power supply - X

11 Vcc +12VDisk Voltage on board 12V payload disk power supply - X

12 SFP-A Pres SFP-A Slot/Connector Status -

13 SFP-A OC SFP-A Over Current Status - X

14 SFP-B Pres SFP-B Slot/Connector Status -

15 SFP-B OC SFP-B Over Current Status - X

16 USB0 OC USB Over Current Status - X

17 USB1 OC USB Over Current Status -

18 Disk Bay Removable Disk Bay Slot/Connector Status * X

19 Power State Board Power State * X

20 Power Good Actual power good status * X

21 Pwr Good Ev Power good status event that occur since the last power on or reset - X

22 Health Error General health status *

23 Ver change Firmware Change Detection *

24 IPMBL State IPMB-L branch from FRU0 fault detection sensor *

25 FRU Agent FRU Information Agent - FRU0 Data Error Detection *

26 MMC Reboot IPMC reboot detection *

27 MMC FwUp Kontron OEM IPMC firmware upgrade Status *

28 MMC Stor Err Management sub-system health: non volatile memory error *

29 IPMI Info-1 Internal Management Controller firmware diagnostic *

30 IPMI Info-2 Internal Management Controller firmware diagnostic *

Sensor Name Description (Sensor Type, Event trigger) Scanning En-

abled under
Power State

Health LED
(Green to Am­ber)

X Exceed critical threshold / Error Assertion

*Power On/Off

-Power On

N No change

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Board Features

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2.8.2.1 IPMB-L Link Sensor

The RTM8050 has an IPMB-L link to communicate with the processor board and other devices in the chassis
chassis IPMB-0 bus. MMC monitors the bus for any link failure and sends the bus failure event to the front
board upon the recovery occurs.

2.8.3 Field Replaceable Unit (FRU) Information

The FRU Information provides inventory data about the boards where the FRU Information Device is located.
The part number or version number can be read through software.

FRU information in the RTM8050 includes data describing the RTM8050 board similar to AMC.0 R2.0
specification requirements. This information is retrieved by the RTM, enabling reporting of board-specific
information through a standardized mechanism.

Table 2-4:Board Information Area

Board Information Area

Field Description Value (hex)

Format Version 0x01

Board Area Length *Calculated

Language code 0x00

Manufacturing Date / Time *Based on mfg. date

Board Manufacturer type/length *Calculated

Board Manufacturer “Kontron”

Board Product Name type/length *Calculated

Board Product Name “RTM8050”

Board Serial Number type/length *Calculated

Board Serial Number Manufacturer S/N

Board Part Number type/length *Calculated

Board Customer Part Number "T5705###_R"

FRU File ID type/length *Calculated

FRU File ID "FRU5705-YY"

No more fields 0xC1

Padding 0x00

Board Area Checksum *Calculated

Table 2-5:Product Information Area

Product Information Area

Field Description Value (hex)

Format Version 0x01

Product Area Length *Calculated

Language Code 0x00

Manufacturer Name type/length *Calculated

10 RT M805 0

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Product Information Area

Manufacturer Name “Kontron”

Product Name type/length *Calculated

Product Name “RTM8050”

Product Part/Model Number type/length *Calculated

Product Part/Model Number "T5705_XX"*

Product Version type/length *Calculated

Product Version “XX” *

Product Serial Number type/length *Calculated

Product Serial Number Manufacturer S/N

Asset Tag type/length 0xC0

Asset Tag

FRU File ID type/length *Calculated

FRU File ID bytes "FRU5705-YY"**

No more fields 0xC1

Padding 0x00

Product Info Area Checksum *Calculated

Board Features

Table 2-6:Type 16 Module Current Requirements Records

Type 16 – Module Current Requirements Record

Record Type ID C0h

Record format version 02h

Manufacturer ID 00315Ah (PICMG Record ID)

PICMG Record ID 16h (Module Power Descriptor table)

Record Format Version 00h

Current Draw 0Ch (1.2 Amps at 12 V => 14.4 Watts)

2.8.4 MMC Firmware Code

MMC firmware code is organized into boot code and operational code, both of which are stored in a flash
module. Upon an MMC reset, the MMC executes the boot code and performs the following:

1 Self test to verify the status of its hardware and memory.

2 Performs a checksum of the operational code.

3 Set operational state that tells the boot block the firmware operate correctly.

Upon successful verification of the operational code checksum, the firmware will jump to the operational
code.

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Board Features

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2.8.5 MMC Firmware Upgrade Procedure

The upgrade procedure is compliant to PICMG HPM.1. MMC Firmware upgrades can be done by using
IPMITOOL from sourceforge
through any IPMI interface without payload impact.

from the front board or remotely on the chassis. It has been designed to upgrade

2.8.6 Boot Block Upgrade Procedure

Type the following to perform MMC firmware upgrade

ipmifwu -fb <file> -P /dev/ttyS1 -M rtm -p <ENTER>

Note:

During boot block firmware upgrade the MMC is held in reset

2.8.6.1 Hot-Swap Process

The RTM8050 has the ability to be hot-swapped in and out of the front board. The onboard MMC manages the
RTM's power-up and power-down transitions. The list below illustrates this process for power down request.

1 Ejector latch is opened. HOT_SWAP_PB# assertion. MMC firmware detects the assertion of this

signal.

2 MMC sends "Module Handle Open" event message to the front board. The corresponding M state of

the front board moves from M4-> M5.

3 The front board moves from M5 -> M6 if the SHMC grants the request. The front board IPMC sends

the FRU control requesting quiesced state to the RTM.

4 The firmware deasserts payload power and sends "Module Quiesced" event message to the front

board where it transitions from M6 to M1 state.

Note:

Depending on your BIOS configuration, a hot-swap process might turn off the front board. Please
refer to the BIOS section “Managed FRU Deactivation Policies” of the AT8050.

2.8.6.2 Hot-Swap LED

The RTM8050 and RTMDISK support a blue Hot Swap LED mounted on the front panel. This LED indicates when
it is safe to remove the RTM from the front board or the hard disk from the RTM. The on-board MMC drives this
LED to indicate the hot-swap state. The following states are possible:

Table 2-7:Hot-Swap LED Description

LED state Description

OFF M4 state; normal state when board is in operation.

ON M1 state; ready for hot swap.

Short blink M5 state; deactivation request

Long blink M2 state; activation request.

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Board Features

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When the RTM latch is disengaged from the faceplate, the hot swap switch embedded in the PCB will assert a
"HOT_SWAP_PB#" signal to the MMC, and the MMC will send “Module Handle Open” event message to the
front board which moves from the M4 state to the M5 state. At the M5 state, the front board will ask the SHMC
(or Shelf Manager) for permission to move the RTM to the M6 state. Then the IPMC of the front board,
through IPMB-L, will set the RTM/HDD Hot Swap LED to indicate this state with a short blink. Once
permission is received from the SHMC or higher-level software, the front board will move to the M6 state.

The SHMC or higher level software can reject the request to move to the M6 state. If this occurs, the RTM/HDD
will returns the Hot Swap LED to a solid off condition, indicating that the RTM has returned to M4 state.

If the RTM/HDD reaches the M6 state through an extraction request through the RTM/HDD handle latch, the
MMC communicates to the front board that the module must discontinue operation in preparation for
removal. The Hot Swap LED continues to flash during this preparation time, just like it does at the M5 state.
When main RTM/HDD payload power is successfully removed from the RTM/HDD slot, the Hot Swap LED
remains lit, indicating it is safe to remove the RTM from the chassis or the hard disk from the RTM.

Refer to the AT8050 manual for information on "Managed FRU Deactivation Policies" affecting the FRU
deactivation process.

2.9 Face Plate Indicators

All LEDs can be overriden with standard PICMG LED APIs

2.9.1 Hot Swap LED (LED0)

The Blue / Hot Swap LED indicates the hot swap status of the RTM. The LED is ON when it is safe to remove the
RTM from the slot. During normal operation, this LED is OFF.

2.9.2 Out Of Service (LED1)

The AdvancedTCA LED1 is red or amber and indicates an Out-of-Service (OOS) condition. During normal
operation, the OOS LED is OFF. This LED is ON during firmware upgrade and is user configurable if needed by a
customer application.

2.9.3 Healthy LED (LED2)

The AdvancedTCA LED2 is green or amber and indicates a healthy condition. The healthy LED indicates if the
blade is powered up and all voltages and temperatures are within specifications. During normal operation,
this LED is ON (green). This LED is also ON (amber) when one of the RTM8050 voltage or temperature fails.

2.9.4 RTMDISK Hot Swap LED

The Blue / Hot Swap LED indicates the hot swap status of the RTMDISK. The LED is ON when it is safe to
remove the RTMDISK from the RTM. During normal operation, this LED is OFF.

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Hot Swap and Installation

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3. Hot Swap and Installation

3.1 RTM Hot Swap and Installation

Because of the high-density pinout of the hard-metric connector, some precautions must be taken when
connecting or disconnecting a RTM to/from an AT8050:

1 Rail guides must be installed on the enclosure to slide the RTM to the AT8050.

2 Do not force theRTM if there is mechanical resistance while inserting it.

3 Screw the faceplate to the enclosure to firmly attach the RTM to its enclosure.

4 Use extractor handles to disconnect and extract the RTM from its enclosure.

WARNING

Always use a grounding wrist wrap before installing or removing the board from a
chassis.

3.1.1 Installing the RTM in the chassis

To install the RTM:

1 Remove the filler panel of the slot.

2 Ensure the RTM is configured properly.

3 Carefully align the PCB edges at the bottom and top card guide.

4 Insert the RTM in the system until it makes contact with the CPU board.

5 Using both ejector handles, engage the RTM in the CPU board connectors until both ejectors are

locked.

6 Fasten screws at the top and bottom of the faceplate.

3.1.2 Removing the RTM from the chassis

To remove the RTM:

1 Unscrew the top and the bottom screw of the faceplate.

2 Unlock the lower handle latch.

3 Wait until the blue LED is fully ON, this mean that the hot swap sequence is ready for RTM removal.

4 Use both ejectors to disengage the RTM from the CPU board.

5 Pull the RTM out of the chassis.

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Hot Swap and Installation

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3.2 RTMHDD Hot Swap and Installation

3.2.1 Installing the Hot Swap RTMHDD

To install the RTMHDD:

1 Carefully engage the RTMHDD into the guide. Push it until it fully mate with its connector. Secure

the hard disk handle to the locking position.

2 The blue LED shall turn ON as soon as the RTMHDD is fully inserted. It will turn OFF at the end of the

hot swap sequence.

3.2.2 Removing the Hot Swap RTMHDD

To remove the RTMHDD:

1 Pull out the handle to unlock the RTMHDD.

2 Wait for the blue LED to turn solid on (100% on).

3 Pull out the RTMHDD using the handle.

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A. Connector Pinouts

P30

J1

J7

J9

J4

J5

J13

A.1 Connectors and Headers Summary

Connector Description

P30 RTM Connector

J1 SAS Connector

J4 SFP Connector

J5 SFP Connector

J7 Dual USB Connectors

J9 RJ-45 Serial Port Connector

J13 Hot Swap Hard Disk Module

A-1 RTM8050

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A.2 AdvancedTCA I/O RTM Connector (P30)

Pin ROW A ROW B ROW C ROW D ROW E ROW F

1 V_12V_1 V_12V_5 V_12V_2 V_3V2_SUS FPGA_IO_3 RTM_PRSNT#

2 V_12V_3 V_12V_6 V_12V_4 NC_D2 IPMC_SCL IPMC_SDA

3 SP_TX SP_RX JTAG_TD1 JTAG_TD0 JTAG_TMS JTAG_TCK

4 USB1_D+ USB1_D- INT_0 INT_1 RTML_TX RTML_RX

5 SP_RTS# SP_CTS# MD2# SRSVD_D5 CLK_PE+ CLK_PE-

6 SATA_TX+ SATA_TX- SATA_RX+ SATA_RX- SFP1_SCL SFP1_SDA

7 SAS_0_TX+ SAS_0_TX- SAS_0_RX+ SAS_0_RX- SAS_1_TX- SAS_1_TX+

8 GBE_TX1+ GBE_TX1- GBE_RX1+ GBE_RX1- GBE_TX2+ GBE_TX2-

9 PE6_TX- PE6_TX+ PE7_RX- PE7_RX+ PE5_TX+ PE5_TX-

10 PE4_TX- PE4_TX+ PE5_RX+ PE5_RX- PE7_TX+ PE7_TX-

Pin ROW G ROW H ROW AB ROW CD ROW EF ROW GH

1 FPGA_IO_1 RTM_EN# GND GND GND GND

2 USB0_D+ USB0_D- GND GND GND GND

3 JTAG_TRST FPGA_IO_2 GND GND GND GND

4 RTML_CLK PROG GND GND GND GND

5 RSVD_G5 JTAG_SEL GND GND GND GND

6 SFP0_SCL SFP0_SDA GND GND GND GND

7 SAS_1_RX+ SAS_1_RX- GND GND GND GND

8 GBE_RX2+ GBE_RX2- GND GND GND GND

9 PE6_RX- PE6_RX+ GND GND GND GND

10 PE4_RX- PE4_RX+ GND GND GND GND

A-2 RTM8050

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A.3 SAS Faceplate Connector (J1)

Pin Signal Pin Signal

S1 RX_0+ G1 GND

S2 RX_0- G2 GND

S3 RX_1+ G3 GND

S4 RX_1- G4 GND

S5 RX_2+ G5 GND

S6 RX_2- G6 GND

S7 RX_3+ G7 GND

S8 RX_3- G8 GND

S9 TX_3- G9 GND

S10 TX_3+

S11 TX_2- MTG1 CGND_1

S12 TX_2+ MTG2 CGND_2

S13 TX_1-

S14 TX_1+

S15 TX_0-

S16 TX_0+

A.4 SFP Channel (J4 & J5)

Pin Signal Pin Signal Pin Signal

1 VEET_1 11 VEER_3 21 cGND_1

2 TX_FAULT 12 RD- 22 cGND_2

3 TX_DIS 13 RD+ 23 cGND_3

4 MODDEF2 14 VEER_4 24 cGND_4

5 MODDEF1 15 VCCR 25 cGND_5

6 MODEFF0 16 VCCT 26 cGND_6

7 R_SEL (N.C.) 17 VEET_2 27 cGND_7

8 LOS 18 TD+ 28 cGND_8

9 VEER1 19 TD- 29 cGND_9

10 VEER2 20 VEET_3 30 cGND_10

31 cGND_11

A-3 RTM8050

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A.5 Dual USB Port (J7)

Pin Signal

1 VCC

2 DATA-

3 DATA+

4 GND

A.6 Serial Port(J9)

Pin Signal

1 RTS

2 DTR

3 TX#

4 GND

5 N.C.

6 RX#

7 N.C.

8 CTS

A.7 Hot Swap Hard Disk Module(J13)

Pin Signal Pin Signal

S1 GND P1 3.3V_SUS_HD

S2 PortA_TX+ P2 3.3V

S3 PortA_TX- P3 3.3V_PRE

S4 GND P4 SMB_SCL

S5 PortA_RX- P5 HD_PRESENT#

S6 PortA_RX+ P6 GND

S7 GND P7 5V_PRE

S8 GND P8 5V

S9 PortB_TX+ P9 5V

S10 PortB_TX- P10 V_PUMP_R

S11 GND P11 SMB_SDA

S12 PortB_RX- P12 GND

S13 PortB_RX+ P13 12V_PRE

S14 GND P14 12V

P15 12V

A-4 RTM8050

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B. Software Update

B.1 MMC Firmware Update Procedure

To update the software of your board, it is recommended to use the update CD, please contact you local
technical support departement for the proper procedure to follow.

B-1 RTM8050

www.kontron.com

C. Getting Help

If, at any time, you encounter difficulties with your application or with any of our products, or if you simply
need guidance on system setups and capabilities, contact our Technical Support at:

North America EMEA

Tel.: [phone] Tel.: [phone]

Fax: [phone] Fax: [phone]

If you have any questions about Kontron, our products, or services, visit our Web site at: www.kontron.com

You also can contact us by E-mail at:

North America: [e-mail]

EMEA: [e-mail]

Or at the following address:

North America EMEA

Kontron Canada, Inc. Kontron Modular Computers GmbH

4555, Ambroise-Lafortune Sudetenstrasse 7

Boisbriand, Québec 87600 Kaufbeuren

J7H 0A4 Canada Germany

C.1 Returning Defective Merchandise

Before returning any merchandise please do one of the following:

• Call

1 Call our Technical Support department in North America at [phone] and in EMEA at +49

(0) 8341 803 333. Make sure you have the following on hand: our Invoice #, your Purchase
Order #, and the Serial Number of the defective unit.

2 Provide the serial number found on the back of the unit and explain the nature of your problem

to a service technician.

C-1 RTM8050

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•E-mail

3 The technician will instruct you on the return procedure if the problem cannot be solved over

the telephone.

4 Make sure you receive an RMA # from our Technical Support before returning any merchandise.

1 Send us an e-mail at: [e-mail]

[e-mail]

your company name, your address, your city, your postal/zip code, your phone number, and
your e-mail. You must also include the serial number of the defective product and a description
of the problem.

in North America and at:

in EMEA. In the e-mail, you must include your name,

C.2 When Returning a Unit

• In the box, you must include the name and telephone number of a contact person, in case
further explanations are required. Where applicable, always include all duty papers and
invoice(s) associated with the item(s) in question.

• Ensure that the unit is properly packed. Pack it in a rigid cardboard box.

• Clearly write or mark the RMA number on the outside of the package you are returning.

• Ship prepaid. We take care of insuring incoming units.

North America EMEA

Kontron Canada, Inc. Kontron Modular Computers GmbH

4555, Ambroise-Lafortune Sudetenstrasse 7

Boisbriand, Québec 87600 Kaufbeuren

J7H 0A4 Canada Germany

C-2 RTM8050

www.kontron.com

D. Glossary

Acronyms Descriptions

ACPI Advanced Configuration & Power Interface

AdvancedMC (Same as AMC). Advanced Mezzanine Card.

AMC (Same as AdvancedMC). Advanced Mezzanine Card.

AMC.0 Advanced Mezzanine Card Base Specification.

AMC.1

AMC.2

AMC.3

ATC A Advanced Telecommunications Computing Architecture

BIOS Basic Input/Output System

CMOS

CPU Central Processing Unit. This sometimes refers to a whole blade, not just a processor component.

CTS Clear To Send

DTR Data Terminal Ready

EMI ElectroMagnetic Interference

FCC Federal Communications Commission

FRU

GND GrouND

HDD Hard Disc Drive

HPM PICMG Hardware Platform Management specification family

HPM.1 Hardware Platform Management IPM Controller Firmware Upgrade Specification

I2C Inter Integrated Circuit bus

ID IDentification

IEEE Institute of Electrical and Electronics Engineers

IPM Intelligent Platform Management

IPMB Intelligent Platform Management Bus

IPMB-0 Intelligent Platform Management Bus Channel 0, the logical aggregation of IPMB-A and IPMB-B.

IPMB-A Intelligent Platform Management Bus A

IPMB-B Intelligent Platform Management Bus B

IPMB-L Intelligent Platform Management Bus Local

IPMC Intelligent Platform Management Controller

IPMI Intelligent Platform Management Interface

IPMIFWU Intelligent Platform Management Interface FirmWare Update

LED Light-Emitting Diode

MMC Module Management Controller. MMCs are linked to the IPMC.

NC Not Connected

OOS Out Of Service

PCI Express and Advanced Switching on AdvancedMC. A subsidiary specification to the Advanced
Mezzanine Card Base Specification (AMC.0).

Ethernet Advanced Mezzanine Card Specification. A subsidiary specification to the Advanced
Mezzanine Card Base Specification (AMC.0).

Advanced Mezzanine Card Specification for Storage. A subsidiary specification to the Advanced
Mezzanine Card Base Specification (AMC.0).

Complementary Metal Oxide Semiconductor. Also refers to the small amount of battery (or capacitor)
powered CMOS memory to hold the date, time, and system setup parameters.

Field Replaceable Unit. Any entity that can be replaced by a user in the field. Not all FRUs are hot
swappable.

D-1 RTM8050

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Acronyms Descriptions

OS Operating System

PICMG PCI Industrial Computer Manufacturers Group

PICMG® PCI Industrial Computer Manufacturers Group

POST Power-On Self-Test

RAM Random Access Memory

RS-232 (Same as RS232). Recommended Standard 232.

RS232 (Same as RS-232). Recommended Standard 232.

RTM Rear Transition Module

RTS Request To Send

SAS Serial Attached SCSI

SFP Small Form-factor Pluggable

ShMC Shelf Management Controller

TX Tr ansmi t

TXD Tr ans mit

USB Universal Serial Bus

VCC Power supply

D-2 RTM8050