The information in this user's guide is provided for reference only. Kontron does not assume any liability
arising out of the application or use of the information or products described herein. This user's guide may
contain or reference information and products protected by copyrights or patents and does not convey any
license under the patent rights of Kontron, nor the rights of others.
Kontron is a registered trademark of Kontron. All trademarks, registered trademarks, and trade names used
in this user's guide are the property of their respective owners. All rights reserved. Printed in Canada. This
user's guide contains information proprietary to Kontron. Customers may reprint and use this user's guide in
other publications. Customers may alter this user's guide and publish it only after they remove the Kontron
name, cover, and logo.
Kontron reserves the right to make changes without notice in product or component design as warranted by
evolution in user needs or progress in engineering or manufacturing technology. Changes that affect the
operation of the unit will be documented in the next revision of this user's guide.
Before handling the board, read the instructions and safety guidelines on the following pages to prevent
damage to the product and to ensure your own personal safety. Refer to the "Advisories" section in the
Preface for advisory conventions used in this user's guide, including the distinction between Warnings,
Cautions, Important Notes, and Notes.
• Always use caution when handling/operating the computer. Only qualified, experienced,
authorized electronics service personnel should access the interior of the computer. The power
supplies produce high voltages and energy hazards, which can cause bodily harm.
• Use extreme caution when installing or removing components. Refer to the installation
instructions in this user's guide for precautions and procedures. If you have any questions, please
contact Kontron Technical Support
WARNING
High voltages are present inside the chassis when the unit's power cord is plugged
into an electrical outlet. Turn off system power, turn off the power supply, and then
disconnect the power cord from its source before removing the chassis cover. Turning
off the system power switch does not remove power to components.
viiiAT8910/AT8940
Page 10
Safety Instructions
www.kontron.com
Preventing Electrostatic Discharge
Static electricity can harm system boards. Perform service at an ESD workstation and follow proper ESD
procedure to reduce the risk of damage to components. Kontron strongly encourages you to follow proper
ESD procedure, which can include wrist straps and smocks, when servicing equipment.
Take the following steps to prevent damage from electrostatic discharge (ESD):
•When unpacking a static-sensitive component from its shipping carton, do not remove the
component's antistatic packing material until you are ready to install the component in a
computer. Just before unwrapping the antistatic packaging, be sure you are at an ESD workstation
or grounded. This will discharge any static electricity that may have built up in your body.
•When transporting a sensitive component, first place it in an antistatic container or packaging.
•Handle all sensitive components at an ESD workstation. If possible, use antistatic floor pads and
workbench pads.
•Handle components and boards with care. Don't touch the components or contacts on a board. Hold
a board by its edges or by its metal mounting bracket.
•Do not handle or store system boards near strong electrostatic, electromagnetic, magnetic, or
radioactive fields.
•When you want to remove the protective foil (if present), make sure you are properly grounded and
that you touch a metalic part of the board.
CAUTION
Removing the protective foil from the top and bottom cover might create static.
When you remove those protections, make sure you follow the proper ESD procedure.
ixAT8910/AT8940
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Preface
www.kontron.com
Preface
How to Use This Guide
This user's guide is designed to be used as step-by-step instructions for installation, and as a reference for
operation, troubleshooting, and upgrades.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.
The following is a summary of chapter contents:
•Chapter 1, Product Description
•Chapter 2, Board Features
•Chapter 3, Installing the board
•Chapter 4, Hardware Management
•Chapter 5, Software Setup
•Chapter 6, Thermal Considerations
•Appendix A, Connector Pinout
•Appendix B, Software Update
•Appendix C, Getting Help
•Appendix D, Glossary
xAT8910/AT8940
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Preface
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Customer Comments
If you have any difficulties using this user's guide, discover an error, or just want to provide some feedback,
please send a message to: Tech.Writer@ca.kontron.com
or problems as soon as possible and post the revised user's guide on our Web site. Thank you.
. Detail any errors you find. We will correct the errors
Advisory Conventions
Seven types of advisories are used throughout the user guides to provide helpful information or to alert you
to the potential for hardware damage or personal injury. They are Note, Signal Paths, Jumpers Settings, BIOS
Settings, Software Usage, Cautions, and Warnings. The following is an example of each type of advisory. Use
caution when servicing electrical components.
Note:
Indicate information that is important for you to know.
Signal Path:
Indicate the places where you can fin the signal on the board.
Jumper Settings:
Indicate the jumpers that are related to this sections.
BIOS Settings:
Indicate where you can set this option in the BIOS.
Software Usage:
Indicates how you can access this feature through software.
CAUTION
Indicate potential damage to hardware and tells you how to avoid the problem.
WARNING
Indicates potential for bodily harm and tells you how to avoid the problem.
ESD Sensitive Device:
This symbol and title inform that electronic boards and their components are sensitive to static
electricity. Therefore, care must be taken during all handling operations and inspections of this
product, in order to ensure product integrity at all times.
Please read also the section "Special Handling and Unpacking Instructions".
CE Conformity:
This symbol indicates that the product described in this manual is in compliance with all applied CE
standards. Please refer also to the section "Regulatory Compliance Statements" in this manual.
Disclaimer: We have tried to identify all situations that may pose a warning or a caution condition in this
user's guide. However, Kontron does not claim to have covered all situations that might require the use of a
Caution or a Warning.
xiAT8910/AT8940
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Unpacking
Follow these recommendations while unpacking:
•Remove all items from the box. If any items listed on the purchase order are missing, notify Kontron
customer service immediately.
•Inspect the product for damage. If there is damage, notify Kontron customer service immediately.
•Save the box and packing material for possible future shipment.
Powering Up the System
Before any installation or setup, ensure that the board is unplugged from power sources or subsystems.
If you encounter a problem, verify the following items:
•Make sure that all connectors are properly connected.
Preface
•Verify your boot devices.
•If the system does not start properly, try booting without any other I/O peripherals attached.
Make sure your system provides the minimum DC voltages required at the board's slot, especially if DC power
is carried by cables.
If you are still not able to get your board running, contact our Technical Support for assistance.
Adapter Cables
Because adapter cables come from various manufacturers, pinouts can differ. The direct crimp design offered
by Kontron allows the simplest cable assembly. All cables are available from Kontron Sales Department.
Storing Boards
Electronic boards are sensitive devices. Do not handle or store device near strong electrostatic,
electromagnetic, magnetic or radioactive fields.
xiiAT8910/AT8940
Page 14
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Regulatory Compliance Statements
FCC Compliance Statement for Class B Devices
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generated, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Preface
•Consult the dealer or an experience radio/TV technician for help.
WARNING
This is a Class B product. If not installed in a properly shielded enclosure and used in
accordance with this User's Guide, this product may cause radio interference in
which case users may need to take additional measures at their own expense.
Safety Certification
All Kontron equipment meets or exceeds safety requirements based on the IEC/EN/UL/CSA 609501 family of standards entitled, "Safety of information technology equipment." All components are
chosen to reduce fire hazards and provide insulation and protection where necessary. Testing and
reports when required are performed under the international IECEE CB Scheme. Please consult the
"Kontron Safety Conformity Policy Guide" for more information. For Canada and USA input voltage
must not exceed -60Vdc for safety compliance.
CE Certification
The product(s) described in this user's guide complies with all applicable European Union (CE)
directives if it has a CE marking. For computer systems to remain CE compliant, only CE-compliant
parts may be used. Maintaining CE compliance also requires proper cable and cabling techniques.
Although Kontron offers accessories, the customer must ensure that these products are installed
with proper shielding to maintain CE compliance. Kontron does not offer engineering services for
designing cabling systems. In addition, Kontron will not retest or recertify systems or components
that have been reconfigured by customers.
xiiiAT8910/AT8940
Page 15
Preface
www.kontron.com
Limited Warranty
Kontron grants the original purchaser of Kontron's products a TWO YEAR LIMITED HARDWARE WARRANTY as
described in the following. However, no other warranties that may be granted or implied by anyone on behalf
of Kontron are valid unless the consumer has the express written consent of Kontron.
Kontron warrants their own products, excluding software, to be free from manufacturing and material
defects for a period of 24 consecutive months from the date of purchase. This warranty is not transferable nor
extendible to cover any other users or long- term storage of the product. It does not cover products which
have been modified, altered or repaired by any other party than Kontron or their authorized agents.
Furthermore, any product which has been, or is suspected of being damaged as a result of negligence,
improper use, incorrect handling, servicing or maintenance, or which has been damaged as a result of
excessive current/voltage or temperature, or which has had its serial number(s), any other markings or parts
thereof altered, defaced or removed will also be excluded from this warranty.
If the customer's eligibility for warranty has not been voided, in the event of any claim, he may return the
product at the earliest possible convenience to the original place of purchase, together with a copy of the
original document of purchase, a full description of the application the product is used on and a description
of the defect. Pack the product in such a way as to ensure safe transportation (see our safety instructions).
Kontron provides for repair or replacement of any part, assembly or sub-assembly at their own discretion, or
to refund the original cost of purchase, if appropriate. In the event of repair, refunding or replacement of
any part, the ownership of the removed or replaced parts reverts to Kontron, and the remaining part of the
original guarantee, or any new guarantee to cover the repaired or replaced items, will be transferred to cover
the new or repaired items. Any extensions to the original guarantee are considered gestures of goodwill, and
will be defined in the "Repair Report" issued by Kontron with the repaired or replaced item.
Kontron will not accept liability for any further claims resulting directly or indirectly from any warranty
claim, other than the above specified repair, replacement or refunding. In particular, all claims for damage
to any system or process in which the product was employed, or any loss incurred as a result of the product
not functioning at any given time, are excluded. The extent of Kontron liability to the customer shall not
exceed the original purchase price of the item for which the claim exists.
Kontron issues no warranty or representation, either explicit or implicit, with respect to its products
reliability, fitness, quality, marketability or ability to fulfil any particular application or purpose. As a result,
the products are sold "as is," and the responsibility to ensure their suitability for any given task remains that
of the purchaser. In no event will Kontron be liable for direct, indirect or consequential damages resulting
from the use of our hardware or software products, or documentation, even if Kontron were advised of the
possibility of such claims prior to the purchase of the product or during any period since the date of its
purchase.
Please remember that no Kontron employee, dealer or agent is authorized to make any modification or
addition to the above specified terms, either verbally or in any other form, written or electronically
transmitted, without the company's consent.
1.6Interfacing with the Environment ......................... 7
1AT8910/AT8940
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Product Description
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1. Product Description
1.1Product Overview
The AT8910/AT8940 is an ATCA 10/40GbE Fabric Interface Hub designed around the Broadcom BCM56840
architecture. All considerations are being taken to ensure this product can be used as a standard hub offered
to the broad telecom and datacenter market.
Architectural features under consideration such as 40GbE interfaces are expected to deliver a highperformance switching and routing up to 14 nodes in a redundant chassis configuration. Some of the
highlights are:
• Starting with 320 Gbps non-blocking switching bandwidth upgradable to 640 Gbps upon silicon
availability
• 320 Gbps variant with BCM56842
• 640 Gbps variant with BCM56846
• Support for 14x 10/40GbE nodes and one redundant hub meeting NEBS and ETSI standard
• Support for separate switch silicon for Base and Fabric interface
• Support for 2x 40GbE Fabric Interface to the RTM
• Support for 10GbE SFP+ Base Interface uplink front panel connectors
•14 Base Interface ports running at 10/100/1000Base-T/TX/T.
•One Hub interlink running at 10/100/1000Base-T/TX/T.
•One port configurable either as Hub interlink via Update Channel or IPMC link for IPMI/Serial
over LAN.
•Hub interlink running at 1000Base-BX
•IPMC link forced to 100Base-TX (no autonegotiation)
•ShMC A/B connect running at 10/100Base-T/TX
•4 1G/10G SFP+ front uplinks with Broadcom BCM8727 Dual XAUI to SFI transceiver.
•3 RTM uplinks running at 10/100/1000Base-T/TX/T (SGMII) or 1000Base-x (Fiber)
•SFP/SFP+ monitoring via I2C interface
•Unit Computer manages Base Switch via PCIe Gen1 x1 (2.5Gbps)
•One port connected to Unit Computer running at 1000Base-BX
•One port connected to System Manager running at 1000Base-BX
•Dual-core Freescale P2020 1000MHz processor
•Up to 2GB DDR3 SODIMM (1Gb default)
•2x 128MByte NOR FLASH with dual Image Support
•1GB NAND FLASH
•I2C Management IF to RTM clock infrastructure
•1000Base-BX Hub interconnect via backplane Update Channel
•RTC Clock support
•Interrupt source from RTM external clocking
•Synchronization Clock support from RTM via FPGA
Product Description
3AT8910/AT8940
Page 19
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FeaturesDescription
•Renesas H8S2472 Microcontroller
•PICMG 3.0 / IPMI 2.0 compliant
•Current and Voltage Sensors
•Base Board, RTM hot swap and power control
•Base Board, RTM FRU data reading and writing
IPMI
RTM Support
Power
•Firmware Update handling for field upgrades, rollbacks and watchdog functions
•Customer specific data fields
•Board Temperature monitoring via I2C enabled sensors
•ATCA LED support; BLUE LED, Out-of-Service, Healty
•128 kByte FRU data EEPROM
•8 MByte SPI FLASH for Firmware
•Ethernet link to Base Interface
•Zone 3 RTM support
•IPMB-L to RTM
•Management Power, Payload power implementation as AMC slot
•I2C Clock Management IF
•I2C SFP Diagnostic IF
•3 GbE Base-Interface Uplinks (SGMII/SERDES)
•Up to 2 40GbE Fabric-Interface Uplinks each configurable as
•1x 40GbE
•4x 10GbE
•4x 1GbE
•FI MIIM Interface
•CLK1, CLK2, CLK3 Clock distribution
•JTAG TAP and PIP port.
•2x SerialATA from System Manager
•ATCA compliant Power Input System
•Total power is below 220 W
•Hot Swap
•Holdover Circuit with min. hold-up time of 10 ms
•Polarity protrection
•Under voltage shutdown between -32 V and -36 V
•Startup/Recover at -36 V
•Voltage range 0 V to 75 V
•Transient Protection
•48V voltage and current monitoring
•Fuse monitoring
•Management power is below 15 W
•Autonomous Overheating Power Shutdown
•Standard QBrick 48V to 12V DCDC converters
•PoL DCDC converters running at 12 VIN
Product Description
4AT8910/AT8940
Page 20
www.kontron.com
FeaturesDescription
•Support for basic and micro COM Express ETX Modules with Type 1 connector, according
COMExpress 0 R1.0
•Management connection to System Manager via RS232 front RJ45.
•Basic and Micro ETX use SuperIO LPC to UART Bridge
•UART switched through FPGA
•Management connection to System Manager using front 10/100/1000Base-T RJ45 management
port.
System Manager
Power Requirements
Environmental
Temperature*
Environmental
Humidity*
Environmental Altitude*
Environmental Shock*
Environmental
Vibration*
Reliability
Safety / EMC
WarrantyTwo years limited warranty
•Front panel USB port
•Support of ETX modules up to 30W
•Additional Ethernet Connection to Base IF and redundant HUB via Dual Ethernet Controller Intel
82580DB
•1000Base-BX to Base Switch
•1000Base-BX to Update Channel
•Support for JEDEC SerialATA MO-297 SSD, Port 0 and Port 2
•Support for RTM SATA applications, Port 1 and Port 3
•Support of up to 2 eUSB Flash Modules
120 W* -38V @ -72V with 12GB of memory, no RTM. Maximum of 225W
* The power consumption will vary depending on your product configuration (RTM & extra memory)
Operating: 0-55°C/32-131°F with 30CFM airflow
Storage and Transit: -40 to +70°C/-40 to 158°F
Operating: 15% to 90% @55°C/131°F non-condensing
Storage and Transit: 5% to 95% @ 40°C/104°F non-condensing
Operating: 4,000 m / 13,123 ft
Storage and Transit: 15,000 m / 49,212 ft
Operating: 3G each axis
Storage and Transit: 18G each axis
Operating: 5-200Hz. 0.2G, each axis
Storage and Transit: 5Hz to 20Hz @ 1 m2/s3 (0.01g2 /Hz) (flat)
20Hz to 200Hz @ -3dB/oct (slope down)
•Whole board protected by active breaker
•USB voltage protected by an active breakers
Meet or exceed:
•Safety: UL 60950-1; CSA C22.2 No 60950-1-03; EN 60950-1:2001; IEC60950-1
•EMI/EMC: FCC 47 CFR Part 15, Class B; CE Mark to EN55022/EN55024/EN300386
Product Description
5AT8910/AT8940
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1.3What’s Included
This board is shipped with the following items:
• One AT8910/AT8940 board
• One RJ45-DB9 serial adaptor (1015-9404)
• Cables that have been ordered
If any item is missing or damaged, contact the supplier.
1.4Compliance
This product conforms to the following specifications:
• IEEE standard 1149.1, 2001 Edition (JTAG). Institute of Electrical and Electronics Engineers (IEEE)
• IEEE Std 1149.6-2003, IEEE Standard for Boundary-Scan Testing of Advanced Digital Networks,IEEE, 2003
(AC-JTAG).
• JEDEC JESD79-3
• JEDEC 4.20.18
• MSA SFF 8431
• IEEE 802.3 2008
•IPMI 2.0
1.5Hot-Plug Capability
The AT8940 supports Full Hot Swap capability as per PICMG3.0R3.0 for the board itself. It can be removed
from or installed in the system while it is on (without powering-down the system). Please refer to the
PICMG3.0R3.0 specification for additional details about Hot Swap.
The AT8940 supports also the RTM Hotplug.
6AT8910/AT8940
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Product Description
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1.6Interfacing with the Environment
1.6.1RTM (rear transition module)
The RTM is a single slot (6HP) AdvancedTCA Rear Transition Module. This module provides additional
connectivity for AT8940 CPU front blade.
The RTM supports hot swapping by using the switch connected to the face plate lower ejector. This switch
indicates the coming hot swap action. The insertion of the RTM to a slot is always done over a non powered
connector. During the extraction procedure, the management power is disabled only when the RTM is
removed. This procedure meets the AdvancedTCA AMC behavior.
1.6.1.2.1Inserting the RTM into the slot
The presence of the RTM is indicated by one signal. The front blade IPMC recognizes the RTM insertion when
the signal is low. After recognizing the RTM, the IPMC turns the blue LED ON and enables the management
power to the RTM. Once the IPMB-L link is working, the IPMC accesses the MMC to retrieve FRU data. After
knowing the type of RTM inserted, the IPMC negotiates with the shelf manager in order to activate the +12V
payload power. After RTM local voltages have been ramped up, the RTM’s MMC enables the RTM Link.
After this the front board IPMC informs the shelf manager there is a functional RTM blade present.
1.6.1.2.2Removing the RTM from the slot
The RTM_EJECT signal goes HIGH by opening the RTM lower ejector handle. This indicates to the front blade
IPMC that a hot swap action is going to take place. The IPMC then negotiates the removal with the System
manager and if it is granted, it proceeds with the removal process.
The IPMC proceeds to the deactivation by disabling ekey governed links, the IPMC then disables the RTM Link
and turns OFF the payload +12V power. When it is safe to remove the RTM blade from the slot, the IPMC turns
the Blue / Hot Swap LED ON. Front Blade IPMC turns OFF the management power only when there is no RTM
detected. (RTM removed from the slot)
7AT8910/AT8940
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Product Description
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1.6.2System Manager
• Support for basic and micro COM Express Modules with Type 1 connector, according COMExpress 0 R1.0
• Management connection to System Manager via RS232 front RJ45.
• Basic use SuperIO LPC to UART Bridge
• UART switched through FPGA
• Management connection to System Manager using front 10/100/1000Base-T RJ45 management port.
• Front panel USB port
• Support of COMExpress modules up to 30W
• Additional Ethernet Connection to Base IF and redundant HUB via Dual Ethernet Controller Intel 82580DB
• 1000Base-BX to Base Switch
• 1000Base-BX to Update Channel
• Support for JEDEC SerialATA MO-297 SSD, Port 0 and Port 2
• Support for RTM SATA applications, Port 1 and Port 3
0/28SerDes1000Base-KXRedundant System ManagerPort 2
2.4Fabric Interface
• Broadcom StrataXGS®IV high performance Ethernet Switch Architecture
• BCM56846 640Gbps Switching Capacity.
12AT8910/AT8940
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Board Features
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• BCM56842 320Gbps Switching Capacity.
• Support of up 14 Fabric IF to backplane running at 1000Base-X, 10GBASE-KX4, 10GBase-KR or 40GBaseKR4
• Support one port 40GBase-KR4 HUB interlink to backplane
• Support of 2 40G interfaces to RTM.
• Support of 4 1G/10G SFP+ front uplinks with Broadcom BCM84754 Quad XFI to SFI transceiver.
• SFP+/QSFP monitoring via I2C interface
• Unit Computer manages Fabric Switch via PCIe Gen1 x1 (2.5Gbps)
2.4.1Fabric Switch
2.4.1.110G Option (BCM56842 320 Gbps)
The Broadcom BCM56842 320 Gbps Ethernet Multilayer Switch with 18 integrated Warp Cores builds the core
of the 10G Fabric Interface. The Warp Cores are set in the required transfer mode; XFI, XAUI or 10GBASE-KR.
The 18 Warp Core cores are separated into four groups:
• Group 0: Warpcore[4:0] with 84 Gbps bandwidth
• Group 1: Warpcore[8:5] with 80 Gbps bandwidth
• Group 2: Warpcore[13:9] with 80 Gbps bandwidth
• Group 3: Warpcore[17:14] with 80 Gbps bandwidth
An additional 4 Gbps is allowed in Group 0 if WarpCore 0 is configured as 4x 1 GbE
The configuration of the Fabric Switch needs to limit the maximum bandwidth within the WarpCore Group.
The port mapping is defined in a way the maximum bandwidth could be reached in different chassis and
applications.
Table 2-2:Fabric Switch Port Assignment
CLI PortTypeSpeed
0/1SFP+1/10GbE
0/2SFP+1/10GbE
0/3SFP+1/10GbE
0/4SFP+1/10GbE
0/51- Hub1/10GbE
0/62- Node-Board1/10GbE
0/73- Node-Board1/10GbE
0/84- Node-Board1/10GbE
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CLI PortTypeSpeed
0/95- Node-Board1/10GbE
0/106- Node-Board1/10GbE
0/117- Node-Board1/10GbE
0/128- Node-Board1/10GbE
0/139- Node-Board1/10GbE
0/1410- Node-Board1/10GbE
0/1511- Node-Board1/10GbE
0/1612- Node-Board1/10GbE
0/1713- Node-Board1/10GbE
0/1814- Node-Board1/10GbE
0/1915- Node-Board1/10GbE
0/20RTM SFP+ FI2.110GbE
0/21RTM SFP+ FI2.210G bE
0/22RTM SFP+ FI2.310G bE
0/23RTM SFP+ FI2.410G bE
Board Features
Table 2-3:Fabric Switch Port Mapping AT8910
BCM56842 WarpCore Group
0
BCM56842
WarpCore
0
1
2
3
4
LaneSerDesOperation
01
12
23
34
05
16
27
38
09
110
211
312
013
114
215
316
017
118
219
320
Speed Connected to
Mode
4x XFI4x 1GbE or 4x 10GbEFront uplinks
-/-
XAUI10 GbEFC# 15
XAUI10 GbEFC# 13
XAUI10 GbEFC# 6
0 (Bandwidth
limitation)
RTM QSFP+ FI1
14AT8910/AT8940
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Board Features
www.kontron.com
BCM56842 WarpCore Group
1
2
BCM56842
WarpCore
5
6
7
8
9
10
11
12
13
LaneSerDesOperation
Mode
021
122
223
324
025
126
227
328
029
130
231
332
033
134
235
336
037
138
239
340
041
142
243
344
045
146
247
348
049
150
251
352
053XFI/SFI/KR1/10 GbERTM SFP+ FI2.1
154XFI/SFI/KR1/10 GbERTM SFP+ FI2.2
255XFI/SFI/KR1/10 GbERTM SFP+ FI2.3
356XFI/SFI/KR1/10 GbERTM SFP+ FI2.4
XAUI10 GbEFC# 5
XAUI10 GbEFC# 4
XAUI10 GbEFC# 2
XAUI10 GbEFC# 3
XAUI10 GbEFC# 1
XAUI10 GbEFC# 14
XAUI10 GbEFC# 12
XAUI10 GbEFC# 7
Speed Connected to
15AT8910/AT8940
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Board Features
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BCM56842 WarpCore Group
3
BCM56842
WarpCore
14
15
16
17
LaneSerDesOperation
Mode
057
158
259
360
061
162
263
364
065
166
267
368
069
170
271
372
XAUI10 GbEFC# 8
XAUI10 GbEFC# 9
XAUI10 GbEFC# 11
XAUI10 GbEFC# 10
Speed Connected to
2.4.1.240G Option (BCM56846 640 Gbps)
The Broadcom BCM56846 640 Gbps Ethernet Multilayer Switch with 18 integrated Warp Cores builds the core
of the 10G Fabric Interface. The Warp Cores are set in the required transfer mode; 40 GbE, 10 GbE, XFI, XAUI,
10GBASE-KR, 40GBASE-KR4 or XLAUI.
The 18 Warp Core cores are separated into four groups:
• Group 0: Warpcore[4:0] with 164 Gbps bandwidth
• Group 1: Warpcore[8:5] with 160 Gbps bandwidth
• Group 2: Warpcore[13:9] with 160 Gbps bandwidth
• Group 3: Warpcore[17:14] with 160 Gbps bandwidth
An additional 4 Gbps is allowed in Group 0 if WarpCore 0 is configured as 4x 1 GbE
The configuration of the Fabric Switch needs to limit the maximum bandwidth within the WarpCore Group.
The port mapping is defined in a way the maximum bandwidth could be reached in different chassis and
applications.
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Table 2-4:Fabric Switch Port Mapping AT8940
Board Features
BCM56846
WarpCore Group
0
1
BCM56846
WarpCore
0
1
2
3
4
5
6
7
8
LaneSerDesOperation
Mode
01
12
23
34
05
16
27
38
09
110
211
312
013
114
215
316
017
118
219
320
021
122
223
324
025
126
227
328
029
130
231
332
033
134
235
336
XFI4x 1GbE or 4x 10GbEFront uplinks
KR440GbERTM QSFP+ FI1
XAUI/KR410/40 GbEFC# 15
XAUI/KR410/40 GbEFC# 13
XAUI/KR410/40 GbEFC# 6
XAUI/KR410/40 GbEFC# 5
XAUI/KR410/40 GbEFC# 4
XAUI/KR410/40 GbEFC# 2
XAUI/KR410/40 GbEFC# 3
SpeedConnected to
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BCM56846
WarpCore Group
2
3
BCM56846
WarpCore
9
10
11
12
13
14
15
16
17
LaneSerDesOperation
Mode
037
138
239
340
041
142
243
344
045
146
247
348
049
150
251
352
053XFI/SFI/KR1/10 GbE
154XFI/SFI/KR1/10 GbE
255XFI/SFI/KR1/10 GbE
356XFI/SFI/KR1/10 GbE
057
158
259
360
061
162
263
364
065
166
267
368
069
170
271
372
XAUI/KR410/40 GbEFC# 1
XAUI/KR410/40 GbEFC# 14
XAUI/KR410/40 GbEFC# 12
XAUI/KR410/40 GbEFC# 7
XAUI/KR410/40 GbEFC# 8
XAUI/KR410/40 GbEFC# 9
XAUI/KR410/40 GbEFC# 11
XAUI/KR410/40 GbEFC# 10
SpeedConnected to
RTM QSFP+ FI2.0 or
SFP+ FI2.1
RTM QSFP+ FI2.1 or SFP+
FI2.2
RTM QSFP+ FI2.2 or
SFP+ FI2.3
RTM QSFP+ FI2.3 or
SFP+ FI2.4
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Note:
The table shows possible operating modes for each port. The actually available modes depend on
the port mapping configuration which is still under development for the AT8940.
2.5System Manager
Basic or micro COM Express ETX Modules with Type 1 connector, according COMExpress 0 R1.0 could operate
as a System Manager on the AT8910.
• Management connection to System Manager via RS232 front RJ45.
• Basic and Micro ETX use SuperIO LPC to UART Bridge
• UART switched through FPGA
• Management connection to System Manager using front 10/100/1000Base-T RJ45 management port.
• Front panel USB port
• Support of COMExpress modules up to 30W
• Additional Ethernet Connection to Base IF and redundant HUB via Dual Ethernet Controller Intel 82580DB
• 1000Base-KX to Base Switch
• 1000Base-KX to Update Channel
• Support for JEDEC SerialATA MO-297 SSD, Port 0 and Port 2
• Support for RTM SATA applications, Port 1 and Port 3
• Support of up to 2 eUSB Flash Modules
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2.5.1SM Management Port
The SM Management 10/100/1000Base-T Ethernet Port is located on the AT8940 faceplate.
Table 2-5:SM Management Port LED
LEDFunction/Displays
Link/Activity: Green LED
L1
L2
•Offlink down
•Onlink up but no activity
•Blinkinglink up and activity
Speed: Green/Amber LED
•Off10Base-T
•On (amber)100Base-Tx
•On (Green)1000Base-T
2.5.2Dual Gigabit Ethernet Controller
Board Features
The Intel 82580 Dual Gigabit Ethernet Controller connects to the 4 lane PCIe Interface of the Type 1
connector. The 82580 supports PCI Express Gen 1 (2.5 Gbps) or Gen 2 (5.0 Gbps).
Ethernet Port 0 operates in SerDes 1000Base-KX mode and connects to the AT8940 Base Interface.
Ethernet Port 1 operates in SerDes 1000Base-KX mode and connects to redundant ATCA hub blade Base
Interface via the Update Channel of Zone 2.
The System FPGA holds the 82580 in device off state when no COMExpress module is present.
The System FPGA holds the 82580 in reset until the COMExpress module release the peripheral devices.
2.5.3USB Front Connector
The USB front interface is a Type A receptacle according USB 2.0. It connects to the COM Express ETX Module
USB channel 2.
The USB Front Interface is filtered, overcurrent and fuse protected.
Signal Path:
USB Front Connector is located on J8.
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2.5.4USB SSD Connectors
The USB SSD Flash Disk are USB 2.0 SSD type storage module builds up with NAND flash memory.
• Solid State Drive (SSD)
• Single Port USB 2.0 interface
• Capacity: 2 GB
•Vendor: INTEL
• Package: Low Profile
Signal Path:
USB SSD Sockets are located on J2 and J6.
2.5.5SATA SSD Connectors
Board Features
The AT8910 supports two SATA SSD sockets according JEDEC MO-297 Slim Lite SSD Assembly.
The supply voltage are 12.0 V, 5 V and 3.3 V.
Signal Path:
SATA SSD Sockets are located on J3 and J12.
2.6LEDs Significations
2.6.1Hot Swap LED (Blue)
Solid On(100 % on): FRU Inactive
Long Blink ( 90 % on): FRU Activation Request
Solid Off ( 0 % on): FRU Activation In Progress / FRU Active
Short Blink ( 10 % on): FRU Deactivation Request / FRU Deactivation In Progress
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2.6.2Out Of Service (Red/Amber)
Solid On: MMC in reset
Fast Blink (~50 % on): MMC upgrade/rollback in progress
Application Defined: May be controlled by application using PICMG API
2.6.3Healthy LED (Amber/Green)
Off: Payload power down
Green: Health Ok
Amber: Health Error (Critical)
Application Defined: May be controlled by application using PICMG API
More details about the jumper settings can be found on the Quick Reference Sheet.
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3.2COM Express and Memory
The COM Express and the memory module are preinstalled and should not be removed or exchanged by the
user.
WARNING
Removing memory and/or Com Express modules may leave the board inoperable or
my even damage the board.
3.3Board Hot Swap and Installation
Because of the high-density pinout of the hard-metric connector, some precautions must be taken when
connecting or disconnecting a board to/from a backplane:
1 Rail guides must be installed on the enclosure to slide the board to the backplane.
2 Do not force the board if there is mechanical resistance while inserting the board.
3 Screw the frontplate to the enclosure to firmly attach the board to its enclosure.
4 Use ejector handles to disconnect and extract the board from its enclosure.
WARNING
Always use a grounding wrist wrap before installing or removing the board from a
chassis.
3.3.1 Installing the Board in the Chassis
To install a board in a chassis:
1 Remove the filler panel of the slot or see "Removing the Board" below.
2 Ensure the board is configured properly.
3 Carefully align the PCB edges in the bottom and top card guide.
4 Insert the board in the system until it makes contact with the backplane connectors.
5 Using both ejector handles, engage the board in the backplane connectors until both ejectors are locked.
6 Fasten screws at the top and bottom of the faceplate.
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3.3.2Removing the Board
If you would like to remove a card from your chassis please follow carefully these steps:
1 Unscrew the top and the bottom screw of the front panel.
2 Unlock the lower handle latch, depending on the software step; this may initiate a clean shutdown of the
operating system.
3 Wait until the blue LED is fully ON, this mean that the hot swap sequence is ready for board removal.
4 Use both ejectors to disengage the board from the backplane.
5 Pull the board out of the chassis.
3.3.3Installing the RTM
To install the RTM:
1 Remove the filler panel of the slot.
2 Ensure the board is configured properly.
3 Carefully align the PCB edges in the bottom and top card guide.
4 Insert the board in the system until it makes contact with the CPU board.
5 Using both ejector handles, engage the board in the front board connectors until both ejectors are locked.
6 Fasten screws at the top and bottom of the faceplate.
3.3.4Removing the RTM
To remove the RTM:
1 Unscrew the top and the bottom screw of the faceplate.
2 Unlock the lower handle latch.
3 Wait until the blue LED is fully ON, this mean that the hot swap sequence is ready for board removal.
4 Use both ejectors to disengage the board from the front board.
The purpose of the hardware management system is to monitor, control, insure proper operation and provide
hot swap support of ATCA Boards. The hardware management system watches over the basic health of the
system, reports anomalies, and takes corrective action when needed. The hardware management system can
retrieve inventory information and sensor readings as well as receive event reports and failure notifications
from boards and other Intelligent FRUs. The hardware management system can also perform basic recovery
operations such as power cycle or reset of managed entities.
4.2Hardware Management Functionality
The Front Blade Unit supports an “intelligent” hardware management system, based on the Intelligent
Platform Management Interface Specification. The hardware management system of the Front Blade Unit
provides the ability to manage the power and interconnect needs of intelligent devices, to monitor events,
and to log events to a central repository.
4.2.1IPMC specific features
4.2.1.1IPMC - ShMC interface
The principal management-oriented link within a Shelf is a two-way redundant implementation of the
Intelligent Platform Management Bus (IPMB). IPMB is based on the inter-integrated circuit (I2C) bus and is
part of the IPMI architecture. In AdvancedTCA Shelves, the main IPMB is called IPMB-0. Each entity attached
to IPMB-0 does so through an IPM Controller, the distributed management controller of the IPMI
architecture. Shelf Managers attach to IPMB-0 through a variant IPM Controller called the Shelf Management
Controller (ShMC). AdvancedTCA IPM Controllers, besides supporting dual redundant IPMBs, also have
responsibility for detecting and recovering from IPMB faults.
The reliability of the AdvancedTCA IPMB-0 is increased by using two IPMBs, with the two IPMBs referenced as
IPMB-A and IPMB-B. The aggregation of the two IPMBs is IPMB-0. The IPM Controllers aggregate the
information received on both IPMBs. An IPM Controller that has a message ready for transmit uses the IPMBs
in a round robin fashion. An IPM Controller tries to alternate the transmission of messages between IPMB-A
and IPMB-B.
If an IPM Controller is unable to transmit on the desired IPMB then it tries to send the message on the
alternate IPMB. By using this approach, an IPMB can become unavailable and then available without the IPM
Controller needing to take specific action.
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4.2.1.2IPMC - System Manager Interface
The Section 24 of [IPMI 2.0] describes how IPMI messages can be sent to and from the IPMC encapsulated in
RMCP (Remote Management Control Protocol) packets datagrams. This capability is also referred to as “IPMI
over LAN” (IOL). IPMI also defines the associated LAN-specific configuration interfaces for setting things
such as IP addresses other options, as well as commands for discovering IPMI-based systems. The Distributed
Management Task Force (DMTF) specifies the RMCP format. This LAN communication path make the Front
Blade Unit reachable to the System Manager for any management action (IPMC firmware upgrade, query of all
FRU Data, CPU reset etc.) without the need to go through the ShMC.
4.2.1.3IPMC - System Event Log
The Kontron IPMC implementation includes a Local System Event Log device as specified in the Section 31 of
[IPMI 2.0]. The local System Event Log is a nonvolatile repository for the front board and all managed FRU
events (RTM). The local SEL provides space for more than 5000 entries. However, even if blade events are
logged into the local SEL, the IPMI platform event messages are still generated by the IPMC's Event
Generator and sent to the centralized SEL hosted by the Shelf Manager through the IPMB-0 communication
path - [PICMG 3.0] chapter 3.5; [IPMI 2.0] Section 29. Local SEL is useful for maintenance purposes and
provides access to the events when the FRU is extracted from the Shelf.
4.3IPMC
4.3.1Supported commands
The table below lists the IPMI commands supported by the IPMC. This table is identical as the one provided by
AMC.0 and PICMG 3.0. The last column states the Kontron support for the specific command.
0b = module not is present
1b = module is present
[1..7] reserved
Byte1:
ETX Module power draw in Watt
Thermal Trip Configuration for
n sensors
Byte 0+(n*2):
Number #n
FFh=UNDEF
Byte 1+(n*2):
Threshold #n
FFh=UNDEF
Hardware Management
4.3.2.7OemApGetNvData
Table 4-27:Command OemApGetNvData
ByteData Field
Request Data1
2
3
4
5NV Data Param ID
Response Data1Completion Code
2..NRaw data
4.3.2.8OemApSetNvSensConfig
Table 4-28:Command OemApSetNvSensConfig
ByteData Field
Request Data1
2
3
4
5 Sensor Config Entry Number: 0..17
6Sensor Number
7..8Assertion Mask
9..10De-assertion Mask
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ByteData Field
11UNR Threshold
12UCR Threshold
13UNC Threshold
14LNR Threshold
15LCR Threshold
16UNC Threshold
17Positive Hysteresis
18Negative Hysteresis
Response Data1Completion Code
4.3.2.9OemApGetNvSensConfig
Table 4-29:Command OemApGetNvSensConfig
ByteData Field
Request Data1
2
3
4
5 Sensor Config Entry Number: 0..17
Response Data1Completion Code
2Sensor Number
3..4Assertion Mask
5..6De-assertion Mask
7UNR Threshold
8UCR Threshold
9UNC Threshold
10LNR Threshold
11LCR Threshold
12UNC Threshold
13Positive Hysteresis
14Negative Hysteresis
Hardware Management
4.3.2.10OemApFpgaWriteRead
Table 4-30:Command OemApFpfaWriteRead
ByteData Field
Request Data1
2
3
4
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ByteData Field
5Register offset
6Read data count N
7Write data
8Write data mask
Response Data1Completion Code
2..NRead data
4.3.2.11OemApGetReleaseInfo
Table 4-31:Command OemApReadSMI
ByteData Field
Request Data1
2
3
4
Response Data1Completion Code
2..6Release TAG
7. .1 2Sub-release TAG
13..20Release Date
Hardware Management
4.3.2.12OemApWriteSMI
Table 4-32:Command OemApWriteSMI
ByteData Field
Request Data1Register Address
2Data[0] LSB
3Data[1] MSB
Response Data1Completion Code
4.3.2.13OemApReadSMI
Table 4-33:Command OemApReadSMI
ByteData Field
Request Data1Register Address
Response Data1Completion Code
2Data[0] LSB
3Data[1] MSB
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4.3.3Sensor Data Records
Information that describes the IPMC capabilities is provided through two mechanisms: capabilities
commands and Sensor Data Records (SDRs). Capabilities commands are commands within the IPMI command
set that return fields providing information on other commands and functions the controller can handle.
Sensor Data Records are data records containing information about the type and number of sensors in the
platform, sensor threshold support, event generation capabilities, and information on what types of
readings the sensor provides. The primary purpose of Sensor Data Records is to describe the sensor
configuration of the hardware management subsystem to system software.
The IPMC are required to maintain Device Sensor Data Records for the sensors and objects they manage.
Access methods for the Device SDR entries are described in the [IPMI 2.0] specification, Section 35, "Sensor
Device Commands."
After a FRU is inserted, the System Manager, using the Shelf Manager, may gather the various SDRs from the
FRU's IPM Controller to learn the various objects and how to use them. The System Manager uses the "Sensor
Device Commands" to gather this information. Thus, commands, such as "Get Device SDR Info" and "Get
Device SDR," which are optional in the IPMI specification, are mandatory in AdvancedTCA systems.
Most of the current Shelf Manager implementation gathers the individual Device Sensor Data Records of each
FRU into a centralized SDR Repository. This SDR Repository may exist in either the Shelf Manager or System
Manager. If the Shelf Manager implements the SDR Repository on-board, it shall also respond to "SDR
Repository" commands.
This duplication of SDR repository commands creates sometime some confusion among AdvancedTCA users.
This is mandatory for IPMC to support the Sensor Device Commands for IPMC built-in SDR as described in the
[IPMI 2.0] specification, Section 35, "Sensor Device Commands." For the ShMC, the same set of commands
for the centralized SDR Repository must be supported but they are described in the [IPMI 2.0] specification,
Section 33, "SDR Repository Commands."
The following table shows the sensors involved in the health sensor aggregation. The Health Sensor is an
aggregation of all analog sensors and is asserted when at least one of the listed sensors report an asserted
offset for critical or non-recoverable state.
CONFIGFLASH is initialized once during manufacturing time. This partition is persistent across
system updates. It shows always the version used to initialize the flash partition during
manufacturing time.
5.2Updating Firmware
The firmware - including bootloader - image is updated using the CLI of the base Ethernet switch.
The system update package (ie: t5310-system-BETA-1.02.tar; this example will be used in the following
commands) contains an image of bootloader, Hyperviser and Linux kernel, root filesystems for both guest
OSs and config partition as well as a MD5 checksum file for consistency check.
Note:
Please make sure, the name of the update package used does not exceed 32 characters (ASCII).
Note:
Please also note, updating the active image is not allowed
Note:
If you have created custom script files (.SCR) that are saved in the Switch, make sure to copy them
on the backup flash bank (run this command in Fastpath before the update: copy active backup),
this will copy the scripts from the currently active bank to the backup flash bank. Alternatively, back
them up on an external server (Section 8.7.14 of CLI manual) for re-download after the update.
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When performing a firmware update, the software package is loaded from a remote TFTP server. A software
update of the AT8910/AT8940 Switch is done by performing the following steps:
1 Prepare network access of the board
2 Log in to the privileged exec mode of the base Ethernet CLI of the board
3 Copy system image into the backup partition of the flash memory.
The image will be copied including the configuration settings currently stored for active image
8 In case of problems with booting the system, last working image (now the backup image) will
automatically be copied and used for next time boot. This procedure restores previous system behavior.
9 It is recommended to copy active image to backup image to have a fully redundant system
(BASE Ethernet) #copy active backup
Copying active image to backup image
(BASE Ethernet) #
The image will be copied including the configuration settings currently stored for active image
5.3Updating IPMI
Updating the IPMI firmware is done with the "copy" command. In case that the update procedure fails or the
update image is corrupted, the PM will be able to restart by means of its rollback functionality.
The IPMI firmware package file is provided in tar format and is stored in the data/update directory of the
release directory tree.
Management access will be blocked for the duration of the transfer
Are you sure you want to start? (y/n) y
TFTP Code transfer starting...
Write image to flash starting...
The following chapter provide system integrators with the necessary information to satisfy thermal and
airflow requirements when using the AT8940.
6.1Thermal Monitoring
To ensure optimal operation and long-term reliability of the AT8940, all on-board components must remain
within the maximum temperature specifications. Operating the AT8940 above the maximum operating limits
will result in application performance degradation (e.g. the processor might throttles if it overheats) or may
even damage the board. To ensure functionality at the maximum temperature, the blade supports several
temperature monitoring and control features.
6.1.1Heat Sinks
Multiple key components of the AT8940 are equipped with a specifically designed heat sink to ensure the
best possible product for operational stability and long-term reliability. The physical size, shape, and
construction of the heat sinks ensure the lowest possible thermal resistance. Moreover, the heat sinks were
specifically designed to use forced airflow as found in ATCA systems.
6.1.2Temperature Sensors
The AT8940 is equipped with 10 temperature sensors that are accessible via IPMI. Sensors are precisely
positioned near critical components to accurately measure the on-board parts temperature. Temperature
monitoring must be exercised to ensure highest possible level of system thermal management. An external
system manager constitutes one of the best solution for thermal management, being able to report sensor
status to end-user or manage events filters for example.
All sensors available on the AT8940, its RTM can carry are listed into the Sensor Data Repository with their
thresholds as defined by the PICMG 3.0 specification. The following extract (from the PICMG 3.0 Base
Specification) details naming convention for thresholds as well as the meaning of each threshold level.
IPMI non-critical / PICMG 3.0 minor / telco minor:
Temperature is getting closer to operating limit; it is not really a "problem" yet. It's only a warning.
IPMI critical / PICMG 3.0 major / telco major:
Temperature is at or over normal operating limit, but not in destructive zone. Unit still operating but
MTBF might be affected.
Temperature has reached a destructive level. Device might be damaged.
Most ATCA chassis react to temperature events in the following manner: When a minor threshold is reached,
the shelf manager will incrementally increase airflow (fan speed) to bring the temperature below the crossed
threshold. When a major threshold is reached, the shelf manager will increase the fans to maximum speed.
When a critical threshold is reached, the shelf manager will shutdown the blade to prevent damage. The shelf
alarm panel, when available, can inform the operator with LEDs when an alarm (minor, major, critical) is
raised. Refer to your chassis documentation to adapt and optimize your temperature monitoring application
to chassis capabilities. See also System Airflow section for more information.
Below is the list of temperature sensors with their respective thresholds.
Table 6-1:Temperature Sensors Thresholds
Sensor IDLower ThresholdsUpper Thresholds
MinorMajorCriticalMinorMajorCritical
Temp BCM5684XN/AN/AN/A+90°C+95°C+100°C
Temp InletN/AN/AN/A+60°C+65°C+70°C
Temp Outlet-2N/AN/AN/A+80°C+85°C+90°C
Temp Diode A4N/AN/AN/A+80°C+85°C+90°C
Temp Outlet-1N/AN/AN/A+80°C+85°C+90°C
Temp BCM54680-2N/AN/AN/A+115°C+125°C+135°C
Temp BCM54680-1N/AN/AN/A+115°C+125°C+135°C
Temp Intel82580N/AN/AN/A+115°C+125°C+135°C
Temp ADT7461N/AN/AN/A+115°C+125°C+135°C
Temp DIMM
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6.1.3System Airflow
The airflow impedance (pressure) curve gives multiple information and tips about thermal operational range
of the system carrying the AT8940. Once volumetric airflow capability of your chassis is known, the pressure
curve can help determine the ambient (room) temperature setpoint that should be used for optimal
operation. If you are using various models of ATCA blades into the same chassis, it is possible to find the best
thermal fit. Having the volumetric airflow value for each chassis slot, it is then possible to decide the layout
using the pressure curves.
Table 6-2:Pressure curve AT8940
Test PoinAirflow (CFM)Pressure drop (in H2O)Airflow (m³/h)Pressure Drop (Pa)
150.0058.51.3
2100.01717.04.3
3150.03225.58.1
4200.05034.012.6
5250.07142.517.8
6300.09551. 023.7
7350.12259.530.5
8400.15268.037.9
9450.18576.546.1
10500.22185.055.0
11550.26093.464.6
12600.302101.975.0
Figure 6-1:Pressure Drop Curve
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A. Connector Pinouts
A.1Connectors and Headers Summary
ConnectorDescription
J1SM Management Port RJ45
J2, J6USB SSD Connectors
J3, J12SATA Connectors
J5SM Serial Interface RJ45
J8SM USB Connector
J9Unit Computer Fabric Console Port
J11ETXModule
J13Unit Computer Base Console Port
J18Unit Computer Ethernet Management Port
J20-J24Zone 2 Connectors
J26SP-UDIMM Connector
J31-J32RTM Connectors
P10Zone 3 Power Connector
X1Fabric 1/2 SFP+
X2Fabric 3/4 SFP+
X3Base 1/2 SPF+
X4Base 3/4 SFP+
A.2Management Port(J1 & J18)
SignalPinPinSignal
TRD0+15TRD2-
TRD0-26TRD1-
TRD1+37TRD3+
TRD2+48TRD3-
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A.3RJ45 Serial Port (J5, J9 & J13)
SignalPinPinSignal
RTS15GND
DTR26RX#
TX#37DSR
GND48CTS
A.4USB SSD Connectors(J2 & J6)
SignalPinPinSignal
VCC16N.C.
N.C.27GND
USB_DATA-38N.C.
N.C.49N.C. (Key)
USB_DATA+510N.C.
A.5SFP+ Connectors(X1, X2, X3 & X4)
SignalPinPinSignal
VeeT111VeeR
TX_Fault212RD-
TX_Disable313RD+
SDA414VeeR
SCL515VccR
MOD-ABS616VccT
Rate_ Select_0717VeeT
RX_LOS818TD+
Rate_Select_1919TD-
VeeR1020Vee T
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A.6SATA SSD Connectors(J3 & J12)
SignalPinPinSignal
GNDS1P1V_3V3
ETX_SATA_TX+S2P2V_3V3
ETX_SATA_TX-S3P3V_3V3
GNDS4P4GND
ETX_SATA_RX-S5P5GND
ETX_SATA_RX+S6P6GND
GNDS7P7V_5V
GNDS8P8V_5V
N.C.S9P9V_5V
N.C.S10P10GND
GNDS11P11N.C.
N.C.S12P12GND
N.C.S13P13V_12V
GNDS14P14V_12V
P15V_12V
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B. Software Update
To update the board software, it is recommended to use the Kontron update CD. A version of this CD can be
found on the CD/DVD provided with your board or on the Kontron Canada’s FTP
with this Update CD will have a payload impact on your board. To update your board from the update CD
follow the instructions provided in the AT8940 - Update CD User guide provided with the CD image file.
site. Updating your board
The latest versions of the Update CD is available from the Kontron Canada’s FTP
maint.html).
site(ftp.kontron.ca/support/
B-1AT8910/AT8940
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C. Getting Help
If, at any time, you encounter difficulties with your application or with any of our products, or if you simply
need guidance on system setups and capabilities, contact our Technical Support at:
North AmericaEMEA
Tel.: (450) 437-5682Tel.: +49 (0) 8341 803 333
Fax: (450) 437-8053Fax: +49 (0) 8341 803 339
If you have any questions about Kontron, our products, or services, visit our Web site at: www.kontron.com
Before returning any merchandise please do one of the following:
•Call
1Call our Technical Support department in North America at (450) 437-5682 and in EMEA at +49 (0)
8341 803 333. Make sure you have the following on hand: our Invoice #, your Purchase Order #,
and the Serial Number of the defective unit.
2Provide the serial number found on the back of the unit and explain the nature of your problem to
a service technician.
3The technician will instruct you on the return procedure if the problem cannot be solved over the
telephone.
4Make sure you receive an RMA # from our Technical Support before returning any merchandise.
•E-mail
1Send us an e-mail at: RMA@ca.kontron.com
modular.com in EMEA. In the e-mail, you must include your name, your company name, your
address, your city, your postal/zip code, your phone number, and your e-mail. You must also
include the serial number of the defective product and a description of the problem.
in North America and at: orderprocessing@kontron-
C.2When Returning a Unit
•In the box, you must include the name and telephone number of a contact person, in case further
explanations are required. Where applicable, always include all duty papers and invoice(s)
associated with the item(s) in question.
•Ensure that the unit is properly packed. Pack it in a rigid cardboard box.
•Clearly write or mark the RMA number on the outside of the package you are returning.
•Ship prepaid. We take care of insuring incoming units.
BIBase Interface. Backplane connectivity defined by the ATCA.
BIOSBasic Input/Output System
BMCBase Management Controller
CDCompact Disk
CDROM(Same as CD-ROM). Compact Disk Read-Only Memory.
CD-ROM(Same as CDROM). Compact Disk Read-Only Memory.
CFMCubic Foot per Minute
CLICommand-Line Interface
CLK1AdvancedTCA bused resource Synch clock group 1
CLK1AAdvancedTCA bused resource Synch clock group 1, bus A
CLK1BAdvancedTCA bused resource Synch clock group 1, bus A
CLK2AdvancedTCA bused resource Synch clock group 2
CLK2AAdvancedTCA bused resource Synch clock group 2, bus A
CLK2BAdvancedTCA bused resource Synch clock group 2, bus B
CLK3AdvancedTCA bused resource Synch clock group 3
CLK3AAdvancedTCA bused resource Synch clock group 3 , bus A
CLK3BAdvancedTCA bused resource Synch clock group 3 , bus B
CMOS
CPLDComplex Programmable Logic Device
CP-TACommunications Platforms Trade Association
CPUCentral Processing Unit. This sometimes refers to a whole blade, not just a processor component.
CTSClear To Send
DDR3DDR3 SDRAM or Double-Data-Rate three (3) Synchronous Dynamic Random Access Memory.
DHCPDynamic Host Conf iguration Protocol
DIMMDual In-line Memory Module
DMADirect Memory Access
DMIDesktop Management Interface
DTCData Transfer Controller
DTRData Terminal Ready
American Standard Code for Information Interchange. ASCII codes represent text in computers,
communications equipment, and other devices that work with text.
Complementary Metal Oxide Semiconductor. Also refers to the small amount of battery (or capacitor)
powered CMOS memory to hold the date, time, and system setup parameters.
D-1AT8910/AT8940
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AcronymsDescriptions
DTSDigital Thermal Sensor in IA32 processors.
DVDDigital Video Disk
ECCError Checking and Correction
EMIElectroMagnetic Interference
ETHSame as Ethernet.
FCFibre Channel
FCCFederal Communications Commission
FIFabric Interface. Backplane connectivity defined by the ATCA.
FIFOFirst In First Out
FPGAField-Programmable Gate Array
FRU
FWHFirmWare Hub. Boot flash connected to the LPC bus containing BIOS FW.
GbGigabit
GB(Same as GByte) GigaByte.
GByte(Same as GB) GigaByte.
GbEGigabit Ethernet
GHzGigaHertz
GNDGrouND
HDDHard Disc Drive
HPMPICMG Hardware Platform Management specification family
IEEEInstitute of Electrical and Electronics Engineers
IMVP-6
IO(Same as I/O). Input Output
IOHI/O Hub
IOLIPMI-Over-LAN
IPInternet Protocol
IPMIntelligent Platform Management
IPMBIntelligent Platform Management Bus
IPMB-0Intelligent Platform Management Bus Channel 0, the logical aggregation of IPMB-A and IPMB-B.
IPMB-AIntelligent Platform Management Bus A
IPMB-BIntelligent Platform Management Bus B
IPMB-LIntelligent Platform Management Bus Local
IPMCIntelligent Platform Management Controller
IPMIIntelligent Platform Management Interface
Field Replaceable Unit. Any entity that can be replaced by a user in the field. Not all FRUs are hot
swappable.
Intel Mobile Voltage Positioning. The Intel Mobile Voltage Positioning specification for the Intel®
Core™ Duo Processor. It is a DC-DC converter module that supplies the required voltage and current
to a single processor.
PHYsical layer. Generic electronics term referring to a special electronic integrated circuit or
functional block of a circuit that takes care of encoding and decoding between a pure digital domain
(on-off) and a modulation in the analog domain.
D-3AT8910/AT8940
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AcronymsDescriptions
SOLSerial Over LAN
SPISerial Peripheral Interface
SpeedStep(Same as EIST). Enhanced Intel SpeedStep Technology.
SSE2Streaming SIMD Extension 2. SIMD is "Single Instruction, Multiple Data".
SSE3Streaming SIMD Extension 3. SIMD is "Single Instruction, Multiple Data".
SSH
TCLKATelecom CLocK A. AMC Clock Interface.
TCLKBTelecom CLocK B. AMC Clock Interface.
TCLKCTelecom CLocK C. AMC Clock Interface.
TCLKDTelecom CLocK D. AMC Clock Interface.
TXTra nsmi t
TXDTr ans mit
UARTUniversal Asynchronous Receiver Transmitter
USBUniversal Serial Bus
VCCPower supply
VLANVirtual Local Area Network
XAUI
Secure SHell. A network protocol that allows data to be exchanged over a secure channel between
two computers.
X (meaning ten) Attachement Unit Interface. A standard for connecting 10 Gigabit Ethernet (10GbE)
ports.
D-4AT8910/AT8940
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