Keithley 7076 Service manual

Model

7076

General Purpose Matrix Card

Dual 4 x 12
Instruction Manual

Contains Operating and Servicing Information

Publication Date: April 1991
Document Number: 7076-901-01 Rev. B

WARRANTY

Keithley Instruments, Inc. warrants this product to be free from defects in material and workmanship for a period of 1 year from date of
shipment.

Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable batteries,
diskettes, and documentation.

During the warranty period, we will, at our option, either repair or replace any product that prows to be defective

To exercise this warranty, write or call your local Keithley representative, or contact Keithley headquarters in Cleveland, Ohio. You will
be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service facility. Repairs
will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for the balance of the origi­nal warranty period, or at least 90 days.

LIMITATION OF WARRANTY

This warranty does not apply to defects resulting from product modification without Keithley’s express written consent, or misuse of
any product ot’ part. This warranty also does not apply to fuses, software. non-rechargeable batteries, damage from battery leakage, or
problems arising from normal wear or failure to follow instructions.

THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY IMPLIED
WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PROVIDED HEREIN ARE
BUYER’S SOLE AND EXCLUSIVE REMEDIES.

NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT, INDI­RECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS INSTRUMENTS AND
SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE OF THE POSSIBILITY OF
SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIMITED TO: COSTS OF REMOVAL
AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY PERSON, OR DAMAGE TO PROPERTY.

Keithley Instruments, Inc. * 28775 Aurora Road * Cleveland, OH 44139 - 216-248-0400 -Fax: [phone] - http://www.keithley.com

General Purpose Matrix Card Dual 4

Model 7076

Instruction Manual

x

12

01990, Keithley Instruments, Inc.

All rights reserved.

Cleveland, Ohio, U. S. A.

Document Number: 7076-901-01

All Keithley product names are trademarks or registered trademarks of Keithky Instruments, Inc.
Other brand and product names are trademarks or registered trademarks of their respective holders

SAFETY PRECAUTIONS

The following safety precautions should be observed before using the Model 7076 and the associated instruments.

This matrix card is intended for use by qualified personnel who recognize shock hazards and are familiar with the safety

precautions required to avoid possible injury. Read over this manual carefully before using the matrix card.

ALWAYS remove power from the entire system (Model 707, test instruments, DUT, etc.) and discharge any capacitors
before doing any of the following:

1. Installing or removing the matrix card from the mainframe.

2. Connecting or disconnecting cables from the matrix card. The pins of cable connectors are easily accessible making
them extremely hazardous to handle while power is applied.

3. Making internal changes to the card (such as removing or installing jumpers).

Exercise extreme caution when a shock hazard is present at the test f?xture. User-supplied lethal voltages may be present
on the tlxture or the connector jacks. The American National Standards Institute (ANSI) states that a shock hazard exists
when voltage levels greater than 30V RMS or42.4V peak are present. A good safety practice is to expect that hazardous
voltage is present in any unknown circuit before measuring.

Do not connect the card or any other instrumentation to humans.

Inspect the connecting cables and test leads for possible wear, cracks, or breaks before each use.

For maximum safety, do not touch the test fixture, test cables or any instruments while power is applied to the circuit
under test.

Do not touch any object which could provide a current path to the common side of the circuit under test or power line
(earth) ground.

Do not exceed the maximum signal levels of the test fixture, as defined in the specifications and operation section of this
manual.

Do not connect the matrix card directly to unlimited power circuits. This product is intended to be used with impedance
limited sources. NEVER connect the matrix card directly to ac mains.

When connecting sources, install protective devices to limit fault current and voltage to the card.

The chassis connections must only be used as shield connections for measuring circuits, NOT as safety earth ground

connections.

Model 7076 Dual 4x12 Two-Pole Matrix Card

MATRIXCON”GURATION:Dual4rowsby12columns.Alsocanfigurableas8rowsby

12 mhmns. Jumpers can be removed to isolate any row from the backplane.
CROSSPOINT CONFIGURATION: 2 pole Form A (HI, GUARD).
CONNECTOR TYPE: 25.pin subminiature D connector, two for column connection, one

far row connection.

MAXIMUM

DC Signals: IIOV DC, IA switched, 30VA ksistive load).

AC Signals: 175” AC peak, IA switched, 62SVA (resistive load).
COMMON MODE VOLTAGE: IIOV DC, 175V AC peak pin to pi” or pi” to chassi%
CONTACT LIFE:

Cold Switching: 10s closures.

At M.Mm”rn Signal Level: 105 closures.
PATH RESISTANCE (per conductorb <0.5On initial, <1.5R at end of contact life
CONTACTPOTENTIAL: <5pV per crosspaint (HI lo GUARD).
OFFSET CURRENT: <lOOpA.
ISOLATION:

PatlIz >lOw2, <7PF.

Differential: >lOQ l2opF nominal.

Common Mode: >lOQ 2OOpFnominal.
CROSSTALK (IMHr, Mfi 1o;db <-5OdB.
INSERTION LOSS (IMHz, 5On source, 5OR load): 0.05dB typical.
3dB BANDWIDTH (500 load): 15MHz typical.
RELAY DRIVE CURRENT (per crosspoint): 28mA.
RELAY SE’ITLING TIME: <3ms.
ENVIRONMENT:

Operating: 0’ to 5O”C, up to 35°C at 70% R.H.

storage: -250 to WC.
ACCESSORY SUPPLIED: instruction manual, jumpers for 8 x 12 expansion.

SIGNAL LEVEL:

5pcifications subject to change without notice.

Column

Jumpers

- (user

Table of Contents

SECTION 1 - General Information

1.1 INTRODUCTION

1.2

1.3 WARRANTY INFORMATION

1.4 MANUAL ADDENDA

1.5

1.6

1.7

1.7.1 Inspection for Damage

1.7.2 Shipping Contents

1.7.3 Instruction Manual

1.8

1.9 OPTIONAL ACCESSORIES

FEATURES .

SAFETY SYMBOLS AND TERMS
SPECIFICATIONS . .
UNPACKING AND INSPECTION

. . .

REPACKING FOR SHIPMENT

SECTION 2 - Operation

2.1

2.2

2.3

2.4 BASIC MATRIX CONFIGURATIONS

2.4.1 4x24Matrix

2.4.2

2.5

2.5.1

2.5.2

2.5.3

2.5.4

2.6

2.6.1 Standard Cable (Model 7075-MTC)

2.6.2 High Isolation Cables (Model 7076-RMTC and Model 707&CMTC)

2.7

2.7.1 Backplane Row Jumpers

2.7.2

2.7.3 Wide Matrix Expansion

2.7.4 Partial Matrix Implementation

2.7.5

2.8

2.8.1 Single Card System

2.8.2 Multiple Card System

2.8.3

2.8.4 Matrix/Multiplexer System

2.9

INTRODUCTION
HANDLING PRECAUTIONS
CARD INSTALLATION AND REMOVAL

8xl2Matrix .........................................

TYPICAL MATRIX SWITCHING SCHEMES

Single-ended Switching.
Differential Switching

Guarding ...........................................

Sensing .............................................

CONNECTIONS

MATRIXEXPANSION. ..................................

Narrow Matrix Expansion

Mainframe Matrix Expansion

T(PICAL CONNECTION SCHEMES

Multiple Mainframe System

BANDWIDTH and CROSSTALK

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1-l
l-1
1-l
1-l
1-l
1-l
1-l
1-l
l-2
l-2
l-2

l-2

2-l
2-l
2-l

2-2
2-6

2-7

2-8
2-8
2-8
2-9
2-9
2-10
2-11

2-13
2-15
2-15
2-17
2-18
2-19
2-19
2-20
2-20
2-21
2-21

2-22
2-25

SECTION 3

3.1

3.2 THICK FILM RESISTOR NETWORK TESTING

3.2.1 Four-terminal Ohms Measurements

- Applications

INTRODUCTION ..............................................................

..............................................

3-1

....................................... 3-l

3-3

3.2.2

VoltageDividerChecks

3.3 TRANSISTOR TESTING

3.3.1

3.3.2

Current Gain Checks
Is and Vm Measurements

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SECTION 4 - Service Information

3-4

. 3-6

3-6
3-8

4.1

4.2

4.3

4.4

4.4.1

4.4.2

4.4.3

4.4.4

4.4.5

4.4.6

4.4.7

4.4.8

4.5

4.5.1

4.5.2

4.5.3

4.6

4.7

4.7.1

4.7.2

INTRODUCTION
HANDLING AND CLEANING PRECAUTIONS

RELAY TEST PROGRAM SET-UP

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........

...................

PERFORMANCE VERIFICATION ...................

Environmental Conditions
Recommended Equipment
Matrix Card Connections

Path Resistance Tests
Offset Current Tests
Contact Potential Tests
Path Isolation Tests

.............................

Differential and Common Mode Isolation Tests

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........

IWNCIPLES OF OPERATION ......................

Card Identification
Switching Circuitry
Power Up Safeguard

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SPECIAL HANDLING OF STATIC-SENSITIVE DEVICES
TROUBLESHOOTING

Recommended Equipment
Troubleshooting Procedure

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4-l
4-l
4-l
4-2
4-2
4-3
4-3
4-3
4-4
4-6
4-7
4-9
4-12

. 4-12

4-12

4-12
4-13

4-13

. 4-13

4-13

SECTION 5

5.1

5.2

5.3

5.4

5.5

INTRODUCTION
PARTSLIST
ORDERING INFORMATION
FACTORYSERVICE
COMPONENT LAYOUT AND SCHEMATIC DIAGRAM

- Replaceable Parts

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5-l

5-l

5-l

5-l

5-l

SECTION 2 - Operation

List of Illustrations

Figure 2-l
Figure 2-2
Figure 2-3
Figure 24
Figure 2-5
Figure 2-6
Figure 2-7
Figure 2-8
Figure 2-9
Figure 2-10

Figure 2-11
Figure 2-12
Figure 2-13
Figure 2-14

Figure 2-15
Figure 2-16

Figure 2-17

Figure 2-18

Figure 2-19

Figure 2-20

Figure 2-21

Figure 2-22

Figure 2-23

Figure 2-24

Figure 2-25

Figure 2-26

Matrix Card Installation ..........................................

Model7076 ....................................................

Simplified Component Layout
Model 7076 Configured as4 x 24 Matrix
Model7076Configuredas8x12Matrix
Column Jumper Installation
Single-ended Switching Example (Using 7075-MTC Cable)
Differential Switching Example (Using High Isolation Cables)
Driven Guard Example (Using High Isolation Cables)
Sensing Example (Using High Isolation Cables)
D-sub Receptacle Contact Assignments
Model 7075-MTC Standard Cable
D-sub Plug Pin Assignments for High Isolation Cables
Schematic Drawing of Backplane Jumper Configuration (Factory Default)
Narrow Matrix Example (4 x 72)

Dual4x72Matrices ............................

WideMatrixExample(8x36)
Partial Matrix Expansion (8 x 36)
Single Card System Example
Multiple Card System Example
Multiple Mainframe Example
Matrix/Multiplexer System

-3dB Bandwidth (Crosspoint Al closed, Rs = RL = 5OQ) ...................

-3db Bandwidth (Crosspoint HI2 closed, RS = RRL = 500)
Crosstalk (Crosspoints Gl and H2 closed, 5OQ source on ROW G, 500 load on

COLUMN l’, Measurements at ROW H)
Crosstalk (Cross

COLUMN 11, Mp

oints All and 812 closed, 5On source on ROW A, 5OQ load on

easurements at ROW B)

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2-3
24
2-5
2-6
2-7
2-8
2-8
2-8
2-9
2-9
2-10
2-12
2-14
2-16

.

2-17
2-18
2-18
2-20
2-21
2-22
2-23
2-24
2-25
2-25

2-26

2-26

SECTION 3 - Applications

Figure 3-l
Figure 3-2
Figure 3-3
Figure 34
Figure 35
Figure 3-6
Figure 3-7
Figure 3-8

Thick Film Resistor Network Testing

4-Terminal Ohms Measurements

Voltage Divider Checks . .
Transistor Testing . . .
Transistor Current Gain Checks .
Common Emitter Characteristics of an NPN Silicon Transistor
Transistor IE Measurements
Transistor VsEMeasurements

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.

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3-2
3-3
3-5
3-6
3-7
3-8
3-9
3-10

SECTION 4

- Service Information

Figure 4-l
Figure 4-2
Figure 4-3
Figure 4-4
Figure 4-5
Figure 4-6
Figure 4-7
Figure 4-8
Figure 4-9
Figure 4-10

Relay Test Setup . . . . . . . . .

Path Resistance Testing . . . . . . . . .

Common Mode Offset Current Testing
Differential Mode Offset Current Testing
Contact Potential Testing .
Path Isolation Testing (Guarded)
Differential Isolation Testing . . .

Common Mode Isolation Testing .
ID Data Timing Diagram
D-sub Receptacle Contact Assignments .

. .

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4-2
44
4-5
4-6
4-7
4-8
4-11
4-11
4-12
4-14

SECTION 2 - Operation

List of Tables

Table 2-1 Column Number Assignments

Table 2-2 4 x 24 Matrix Crosspoint Assignments . . . .

Table 2-3
Table 24 Cable Conductor Identification (Model 7075-MTC)
Table 2-5
Table 2-6
Table 2-7 Narrow Matrix Expansion* . . .
Table 2-8

Available Cables and Connectors

Model 7076.RMTC Conductor Identification
Model 7076~CMTC Conductor Identification .

Wide Matrix Expansion’ .

SECTION 4 - Service Information

Table 4-l Verification Equipment
Table 4-2 Path Isolation Tests
Table 4-3
Table 44
Table 4-5 Troubleshooting Summary”

Differential and Common Mode Isolation Test
Recommended Troubleshooting Equipment

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2-3
2-7
2-11
2-13
2-15
2-15
2-17
2-19

4-3
4-9
4-10
4-13
4-14

SECTION 1

General Information

1 .l INTRODUCTION

This section contains general information about the
Model 7076 General Purpose Matrix Card Dual 4 x 12.

1.2 FEATURES

The Model 7076 is a general purpose, two-pole, dual 4 x
12 (four row by 12 column) matrix card. Some of the key
feahxes include:

l Guard capability. Each HI path on the PC board is sur-

rounded by a second path that can be used for guard­ing.

l Low contact potential and offset current for minimal

effects on low-level signals.

. Quick disconnects using 2.5pin D-Sub connectors on

the rear panel.

. Row backplane jumpers. Cutting jumpers disconnects

rows from the Model 707 backplane.

l Column jumpers. Installing jumpers configures card

as an 8 x 12 matrix.

1.5 SAFETY SYMBOLS AND TERMS

The following symbols and terms may be found on an in­strument or used in this manual.

Then
should refer to the operating instructions located in the
instruction manual.

The
may be present on the terminal(s). Use standard safety
precautions to avoid personal contact with these volt­ages.

The WARNING heading used in this manual explains
dangers that might result in personal injury or death. Al­ways read the associated information very carefully be­fore performing the indicated procedure.

The CAUTION heading used in this manual explains
hazards that could damage the matrixcard. Such damage

may invalidate the warranty.

symbol on an instrument indicates that the user

f

symbol on an instrument shows that high voltage

1.3 WARRANTY INFORMATION

Warranty information is located on the inside front cover

of this instruction manual. Should your Model 7076 re­quire warranty service, contact the Keithley representa­tive or authorized repair facility in your area for further
information. When returning the matrix card for repair,
be sure to fill out and include the service form at the back
of this manual in order to provide the repair facility with
the necessary information.

1.4 MANUAL ADDENDA

Any improvements or changes concerning the matrix

card or manual will be explained in an addendum in­cluded with the unit. Be sure to note these changes and
incorporate them into the manual.

The terms COLUMN, COLUMNS, ROW and ROWS are

used in this manual as a reference to the rear panel recep­tacles of the matrix card.

1.6 SPECIFICATIONS

Model 7076 specifications may be found at the front of
this manual. These specifications are exclusive of the ma-

trix mainframe specifications.

1.7 UNPACKING AND INSPECTION

1.7.1

The Model 7076 is packaged in a re-sealable, anti-static
bag to protect it from damage due to static discharge and

Inspection for Damage

l-l

SECTION 1
General

Information

from contamination that could degrade its performance.
Before removing the card from the bag, observe the fol­lowing precautions on handling.

Handling Precautions:

1. Always grasp the card by the handle and side edges.
Do not touch the edge connectors and do not touch

board surfaces or components.

2. When not installed in a Model 707 mainframe, keep

the card in the anti-static bag and store in the origi­nal packing carton.

Afterremovingthecard fromitsanti-staticbag,inspectit
for any obvious signs of physical damage. Report any
such damage to the shipping agent immediately.

If you are going to install the card in the Model 707 main­frame at this time, be sure to follow the additional han­dling precautions explained in paragraph 2.2.

1.7.2 Shipping Contents

The following items are included with every Model 7076
order:

1.8 REPACKING FOR SHIPMENT

Should it become necessary to return the Model 7076 for
repair, carefully pack the unit in its original packing car­ton or the equivalent, and include the following informa­tion:

l Advise as to the warranty status of the matrix card.
l Write ATTENTION REPAIR DEPARTMENT on the

shipping label.

l Filloutandincludetheserviceformlocatedat theback

of this manual.

1.9 OPTIONAL ACCESSORIES

The following accessories are available for use with the
Model 7076:

Model 7075-MTC Standard RowlCohmn Cable
Assembly

The Model 707S-MTC is a three-meter (IO-feet), 24 con­ductor cable terminated with a 25-pin D-subminiature
(D-sub) connector on both ends. This cable connects to
either the ROWS or COLUMN receptacles on the rear
panel of the card. This cable assembly is constructed us­ing a general purpose flat cable that is fitted into a
shielded round jacket.

l Model 7076 Dual 4 x 12 Two-pole Matrix Card.
l Column jumper sets.
l Model 7076 Instruction Manual.
l Additionalaccessoriesasordered.Note that thecables

may be shipped in a separate packing carton.

1.7.3

Instruction Manual

The Model 7076 Instruction Manual is three-hole drilled
so that it can be added to the three-ring binder of the
Model 707 Switching Matrix Instruction Manual. After
removing the plastic wrapping, place the manual in the
binderafterthemainframeinstructionmanual.Notethat
a manual identification tab is included and should pre­cede the matrix card instruction manual.

If an additional instruction manual is required, order the
manual package, Keithley part number 7076-901-00. The
manual package includes an instruction manual and any
applicable addenda.

Thiscable iscommonly cut at a convenient length to pro­vide two separate cables. The cables can then be used to
connect to both the ROW and COLUMN receptacles. The
unterminated ends of the cables can then be connected to
instrumentation and DUTs.

Model 7076-RMTC HighIsolationRow CableAssembly

The Model 707GRMTC is a three meter (IO-feet), 2%con­ductor cable terminated with a 25pin D-sub connectors
onbothendsandisconfigured tomatetotheROWrecep-

tacle of the Model 7076. Each conductor pair (signal and

drain) of the shielded cable is wrapped with insulated

foil to minimize crosstalk between conductor pairs.

This cable is commonly cut at a convenient length to pro­vide two separate cables. The cables can then be used to
connect to both COLUMN receptacles. The unter­minated ends of the cables can then be connected to in­strumentation and DUTs.

l-2

General

SECTION 1

Information

Model 7076-Ch4TC High isolation Column Cable

Assembly

The Model 7076-CMTC is a 3-meter (lo-feet), 28-conduc-

tor cable terminated with a 25-pin D-sub connector on
both ends. This cable connects to either one of the two
COLUMN receptacles on the Model 7076. Each conduc­tor pair (signal and drain) of the shielded cable is

wrapped with insulated foil to minimize crosstalk be­tween conductor pairs.

This cable is commonly cut at a convenient length to pro­vide two separate cables. The cables can then be used to
connect to both COLUMN receptacles. The unter­minated ends of the cables can then be connected to in­strumentation and DUTs.

1-3

SECTION 2

Operation

2.1 INTRODUCTION

WARNING
The matrix configuration procedures in this
section should only be performed by quali­fied personnel who recognize shock hazards
and are familiar with the safety precautions
required to avoid possible injury. Review
the safety precautions found at the front of
this manual.

This section contains information on aspects of matrix
card operation and is arranged as follows:

2.2 Handling Precautions: Details precautions that
should be observed when handling the matrix card to en­sure that its performance is not degraded due to contami-

lMiOIl.

2.3 Card Installation and Removal: Covers the basic pro­cedure for installing and removing the card from the
Model 707 Switching Matrix.

2.4 Basic Matrix Configurations: Covers the basic matrix
configurations that the card can be configured for; dual 4
x 12 matrices, a single 4 x 24 matrix or a single 8 x 12 ma­trix.

2.5 Typical Matrix Switching Schemes: Explains some
of the basic ways that a matrix can be used to source or
measure. Covers single-ended switching, differential

(floating) switching, sensing, shielding, and guarding.

2.2 HANDLING PRECAUTIONS

To maintain high impedance isolation, care should be
taken when handling the matrix card to avoid contami­nation from such foreign materials as body oils. Such
contamination can substantially lower leakage resis­tances, degrading performance.

To avoid possible contamination, always grasp the card
by the handle and side edges. Do not touch the edge con­nectors of the card and do not touch board surfaces or
components. On D-subminiature (D-sub) connectors, do
not touch areas adjacent to the electrical contacts.

CAUTION
Do not store the card by leaning it against an
object (such as B wall) with its edge connec­tars in contact with a contaminated surface
(such as the flood. The edge connectors will
become contaminated, and tapes and solder
connections on the PC board may break as
the card bends. ALWAYS store the card (in
its anti-static bag) in the original shipping
carton.

Dirt build-up over a period of time is another possible
source of contamination. To avoid this problem, operate
the mainframe and matrix card in a clean environment.

If the card becomes contaminated, it should be tbor­oughly cleaned as explained in paragraph 4.2.

2.6 Connections: JXxwses the various methods and
techniques that can be used to connect DUTs and in&u­mentation to the matrix card.

2.7 Matrix Expansion: Discusses the various matrix con­figurations that are possible by using multiple cards. The

significance of backplane row jumpers on matrix con-

figurations is also covered here.

2.8 Typical Connection Schemes: Provides examples of
external connections for single card, multiple card and
multiple mainframe systems.

2.3 CARD INSTALLATION AND REMOVAL

WARNING
To avoid electrical shock that could result in
injury or death, ALWAYS remove power
from the entire system (Model 707, test in­struments, DUT, etc.) and discharge any ca­pacitors before doing any of the following:

1. Installing or removing the matrix card
from the mainframe.

2-1

SECTION 2
operation

2. Connecting or disconnecting cables from
the matrix card. The pins of the cable connec­tors are easily accessible making them ex­tremely hazardous to handle while power is

applied.

3. Making internal changes to the card (such
as removing or installing jumpers).

Cable connections to the matrix card make it difficult to

install or remove the card from the mainframe. Thus, it is

advisable to install the card and then make cable connec-

tions to it. Conversely, cables should be disconnected be­fore removing the card from the mainframe.

Referring to Figure 2-1, perform the following procedure
to install the Model 7076 matrix card in the Model 707:

CAUTION
Contamination will degrade the perform­ance of the matrix card. To avoid contamina­tion, always grasp the card by the handle and
side edges. Do not touch the edge connectors

of the card, and do not touch the board SUP

faces or components. On connectors, do not

touch areas adjacent to the electrical con-

tacts.

Turn the Model 707 off.
Select a slot in the mainframe and remove the cover­plate. The cover-plate is fastened to the mainframe
chassis with two screws. Retain the cover-plate and

screws for future use.

With the relay side of the matrix card facing towards

the fan, feed the card into the slot such that the top

and bottom card edges seat into the card edge guides

of the mainframe. Slide the matrix card all the way
into the mainframe and tighten the two spring
loaded panel fasteners.

4. To remove the card from the mainframe make sure
the Model 707 is off, power is removed from external
circuitry, and then reverse the above procedure.

2.4 BASIC MATRIX CONFIGURATIONS

A simplified schematic of the Model 7076 matrix card is
shown in Figure 2-2A. As shipped from the factory, the
matrix card is configured as two separate 4 x 12 matrices.
Each of the 96 crosspoints is made up of a two-pole
switch. By closing the appropriate crosspoint switch, any
matrix row can be connected to any column in the same
matrix. In this manual, the columns of every Model 7076
matrixcard arereferred to as columns 1 through 12 and 1’
through 12’. Columns 1 through 12 correspond to the col­umns receptacle (on the connection panel) labeled “TO
ROWS A-D”, while references to columns 1’ through 12
correspond to the columns receptacle labeled “TO ROWS
E-H”.

Note that even though there are 24 unique columns in
this configuration, the Model 707 recognizes only 12 col­umns for programming purposes. The crosspoint assign­ments for the matrix card are provided in Figure Z-28.
For example, to connect r6w A to column 10, the Model

707 would have to be programmed to close crosspoint
A10 (row A, column 10); and to connect row E to column
10’ (22nd column), crosspoint El0 would have to be
closed. These crosspoint closures assume that the matrix
card is installed in slot 1 of the mainframe. The crosspoint
assignments in Figure 2-2B are valid regardless of how
the card is configured.

The column number assignments for programming the
Model 707 are determined by the mainframe slot that the
matrixcard is installed in. For example, the column num­ber assignments of a matrix card installed in slot 4 of the
mainframe are numbered 37 through 48. Column num­ber assignments for all six mainframe slots are listed in
Table 2-1.

WARNING
The mounting screws must be secured to en­sure a proper chassis ground connection be­tween the card and the mainframe. Failure to
properly secure this ground connection may
result in personal injury or death due to elec­tric shock.

2-2

Notice in Figure 2-2A that there are backplane jumpers
located on the matrix card. With the jumpers installed,

the matrix card is connected to the backplane of the

Model 707 allowing matrix expansion (see paragraph

2.7). With the jumpers removed, the matrix card is iso­lated from any other cards installed in the mainframe.

The physical location of these jumpers on the board is

shown in Figure 2-3.

SECTION 2

Operation

Mounting Screws

Figure 2-1.

Matrix Card Installation

Table 2-l. Column Number Assignments

1 7076 Card Location 1

Slot 1
Slot 2
Slot 3
Slot 4
Slot 5
Slot 6

Card Handle

Matrix Column Numbers

1 through 12
13 through 24
25 through 36
37 through 48
49 through 60
61 through 72

2-3

SECTION 2

r-----

_------------

---

1

r----

A. Simplified Schematic

--------------

1

‘igure 2-2.

2-4

Model 7076

SECTION 2

Oaeration

I I

0 0

1 I I

I

l

.

Cigure 2-3. SimpIified Component layout

2.4.1

Figure 2-4 shows how the Model 7076 can be configured
as a single 4 x 24 matrix. Row jumper wires are used to
connect rows A, B, C and D to rows E, F, G and H respec­tively. These connections can be made wherever it is
most convenient, such as at the connector of a custom­ized cable ass$mbly, or at the instrumentation (see
Figure Z-15) or DUT test fixture.

In a multiple card system where badcplane jumpers are

left installed, row jumpers are only required at one card.

4 x 24 Matrix

r--------------------~

Removing the backplane jumpers will isolate the 4 x 24
matrix from any other card installed in the mainframe.

Crosspoint assignments for progmmming the Model 707
do not change even though the matrix configuration of
the card has changed (see Figure 2-28). For example, to
connectrowAtothe24th(12’)columnofthe4x24matrix
(see the equivalent circuit in Figure 2-4), the Model 707

would have to be programmed to close crosspoint El2

kmmingtbecardisinstaUedinslot 1 of themainframe).
Table 2-2 provides the crosspoint assignments for a
Mode17076 configuredasa4x24matrixinstalled inslot 1
of the mainframe. Table2-I provides the column number
assignments for the other mainframe slots.

Fmv

J”rnpers

\ I

I

I
I 1 2 3 4 5 6 7 I 8 Backplane

I

Column

Jumpers

TTTTTTTTI I II/~ I

Column

I

I

I
I
I
I

I

‘igure 2-4.

2-6

Equivalent Circuit

Model 7076 Configuredas 4 x 24Matri.r

Table 2-2. 4 x 24 Matrix Crosspoint Assignments

SECTION 2

Operation

M.&X Matrix Column

Row* 1

A(E) Al

B(F) Bl
C(G) Cl
D(H) Dl

2 3 . . . 12

A2 A3 A12

B2

c2

D2 D3 D12 Hl

E :::

B12

Cl2 Gl

1’ 2’ 3’ . . .

El
Fl

----------------_

r----

Column

E2
F2

E

12’

E3

E
H3 H12

:::

El2
F12

G12

1

2.4.2

Figure 2-5 shows that the Model 7076 can be configured
asastandard8~12matibyinstallingtbecolumnjump­em. The location of the column jumpers on the PC-board
is shown in Figure 2-3. As shipped from the factory, the

12columnjumperssetsarenotinstalled. Installingthe lated from any other card installed in the mainframe.

8 x 12 Matrix

jumpers sets,
Model 7076 as

With the Model 7076 backplane jumpers installed, the 8 x
12 matrix is connected to the backplane of the Model 707
allowing matrix expansion (see paragraph 2.7). With the
backplane jumpers removed, the 8 x 12 matrix will be iso-

as shown in Figure
an 8 x 12 matrix.

2-6, configures

the

2-7

SECTION 2
Operation

COI 1 Cal 1

Jumpers

H

. .
. .

Not Installed
(as shipped)

Note : See Fig. 2-3 for location

of jumpers on Pcboard.

?gure 2-6. Column Jumper Installation

2.5 TYPICAL MATRIX SWITCHING SCHEMES

The following paragraphs describe some basic switching
schemes that are possible with a two-pole switching ma­trix.

2.5.1

In the single-ended switching configuration, the source
or measure instrument is connected to the DUT through
a single pathway as shown in Figure 2-7. Note that the
shield of the Model 7075~MTC cable is connected to the
shield around the DUT.

Single-ended Switching

2.5.2 Differential Switching

The differential or floating switching configuration is
shown in Figure 2-8. The advantage of using this con­figuration is that the terminals of the source or measure
inslmment are not confined to the same matrix
crosspoint. Each terminal of the instrument can be con­nected to any matrix crosspoint. The guard terminals of
the matrix card are used as a shield.

Figure 2-7.

Source or

Measure

Single-ended Switching Example (Using 707.5MTC Cable)

7076

1

Shield

L---l

‘igure 2-8.

2-8

A Earth Ground

Diflerential Switching Example (Using High Isolation Cables)

SECTION 2

0pL?Mi0?l

2.5.3 Guarding

Figure 2-9 shows how the matrix card can be used with a

driven guard. Since the driven guard is at virtually the
.same potential as signal high, protection from possible
hazardous voltages (up to 175V peak) must be provided.
Many instruments have the capability of configuring
their input or output such that a driven guard is placed
on the inner shield of a triax connector. The outer shield,
connected to system common, provides protection from
the guard voltage. When making connections from the
matrix card to the DUT, a safety shield may be required,
depending on the type of connectors used.

2.5.4

Sensing

Figure Z-100 shows how the matrix card can be config­ured to use instruments that have sensing capability. The
main advantage of using sensing is to cancel the effects of
matrix card path resistance (4.5) and the resistance of
external cabling. Whenever path resistance is a consid­eration, sensing should be used.

The standard cable (Model 7075-I&K) can also be used,

however the high (H) paths in the cable will not be SW-

rounded by guard (G).

System Common

4

Earth Ground

h

Figure Z-10.

7076

Driven Guard Example (Using High Isolation Cables)

Source or

MWSWS

7076

Sensing Example (Using High Isolation Cables)

SECTION 2
Operation

2.6 CONNECTIONS

CAUTION

To prevent damage (not covered by the war­ranty) and a possible safety hazard, do not

exceed the maximum allowable limits of the

Model 7076. Maximum signal levels are

listed

front of the manual.

As shipped, all rows and columns of the Model 7076 ma­trix card are connected to the three 25-pin D-sub recepta­cles mounted on the rear panel of the matrix card. One re­ceptacle is provided for row connections and two recep­tacles are provided for column connections. The COL­UMNS receptacle located near the top is for rows A
through D, while the other COLUMNS receptacle is for
rows E through H.

in the specifications located at the

N/C

Cd 1 Gd

Cd 1 HI

Cd 2 Gd

Col2HI

Cd 3 Gd

Cd 3 HI

Cd 4 Gd

Co14 HI

Cd 5 Gd

Co15 HI

Cd 6 Gd

Co16 HI

Cd 7 Gd

Co17 HI

Cd 6 Gd

Co16 HI

Cd 9 Gd

Co19 HI

CollOGd

Col 10 HI

Co111 Gd

Col 11 HI

Co112 Gd

Cd 12 HI

Columns

(A W

Columns

(E H)

View of receptacles

looking at Rear Panel

Pin identification for the D-sub receptacles is provided in
Figure 2-11. Adjacent to the each contact designation of
the D-sub receptacles is the corresponding row or col­umn that it is internally connected to.

Cable Connections

There are two basic cable types available to make connec-

tions to the matrix card; the standard cable (Model

7075~MTC),

7076~RMTC and Model 7076-CMK). Basically, the stan­dard cable is a general purpose cable that will mate to
either the ROWS or COLUMN receptacles. The high iso­lation cables provide better isolation between paths. The
Model 7076-RMTC is used to connect to the ROWS recep­tacle, while the Model 707~CMTC is used to connect to
the COLUMN receptacles.

The available cables, as well as some miscellaneous con­nectors for customized user supplied terminations, are

and high isolation cables (Model

N/C

Row A Gd

Row A HI

Row A Gd

Row B Gd

Row B HI

Row 6 Gd

Row C Gd

Row C HI

Row C Gd

ROW D Gd

Row D HI

Row D Gd

Row E Gd

Row E HI

Row E Gd

Row F Gd

Row F HI

Row F Gd

Row G Gd

Row G HI

Row G Gd

Row H Gd

Row H HI

Row H Gd

A) COLUMNS Receptacle

(1 of 2)

‘igure Z-11. D-sub Receptacle Contact Assigments

2-10

HI = High

Gd = Guard

N/C = No connection

B) ROWS Receptacle

Table 2-3. Available Cables and Connectors

SECTION 2

Ckmntion

Manufacturer Model or Part Number
Keithley Model 7075.MTC Standard Cable

Keithley

Keithley Model 7076-RMTC High Isolation

Keithley cs400 25-pin D-sub plug that will mate to the ROWS and COL-

Keithley C%Ol 25-contact D-sub receptacle that will mate to cables termi­Keithley G-590

Belden 9868

summarized in Table 2-3. The cables available from
Keithley are described in more detail in paragraphs 2.6.1
and 2.6.2.

Model 7076.CMTC High Isolation Three-meter (10 feet), high isolation (for high isolation) cable
Columns Cable

Rows Cable

82257000
3357-9225

Description
Standard three-meter (10 feet) cable assembly terminated

with 25-pin D-sub plugs on both ends. Mates to either the
ROWS or COLUMN receptacles of the matrix card.

assembly terminated with 25-pin D-sub plugs on both ends.
Use to mate to either COLUMNS receptacle of the matrix
card.
Three-meter (10 feet), high isolation (for high isolation) cable
assembly terminated with 25-pin D-sub plugs on both ends.
Use to mate to the ROWS receptacle of the matrix card.

UMN receptacles of the matrix card. Solder-cup connections
simplify the building of custom cables.

nated with a 25-pin D-sub plug.
Plastic backshell housing for CS400.
High isolation cable. Same cable used for the Models
7076-RMTC and 707tXMTC cable assemblies. See para­graph 2.6.2 for description.
25-pin D-sub plug for customized ribbon cable assemblies.
Junction shell for 3M 8225-7000 D-sub plug.

The same basic procedure applies for connecting the ca­ble plug to a test fixture receptacle.

WARNING

To avoid electrical shock that could result in

injury or death, ALWAYS remove power
from the entire system (Model 707, test in­struments, DUT, etc.) and discharge any ca­pacitors before connecting or disconnecting
cables from the matrix card. The pins of the
cable connectors are easily accessible mak­ing them extremely hazardous to handle
while power is applied.

Use the following procedure to connect a cable termi­nated with a 25-pin D-sub plug to the matrix card:

1. Install thematrixcardin theModel707mainframeas
explained in paragraph 2.3.

2. Push the plug of the cable onto the appropriate re­ceptacle of the matrix card. The cable plug and ma­trix card receptacle will only mate one way.

3. Tighten the screws of the plug housing to secure it to

the panel.

2.6.1 Standard Cable (Model 7075-MTC)

The standard cable (Model 7075-MT0 is a three-meter

(10 feet), general purpose 24-conductor, shielded cable

that is terminated with a Z-pin D-sub male plug on each
end thatwillconnect toeither theROWSorCOLLJMNre­ceptacles on the matrix card.

The standard cable (shown in Figure 2-12) is comprised

of a flat ribbon cable that is located inside a shielded,

round cable casing. The braided shield of the cable sur-

rounds the ribbon cable and is subsequently connected to

chassis ground when the cable is connected to a Model

7076 that is installed in a Model 707 mainframe.

Pin designations on the D-sub plugs of the standard cable

correspond to the contact designations on the D-sub re-

ceptacles of the matrix card. Thus, if connecting the stan-

dard cable to a COLUMNS receptacle, refer to

Figure 2-1lA for column identification. If connecting the
standard cable to the ROWS receptacle, refer to
Figure 2-1lB for row identification.

2-11

SECTION 2

2CConductor Flat Ribbon

Cable (located inside shielded

round cable casing)

.

11
IO

9
a
7

6
5

4

3
2

1

.
.
.
.
.
.
.

.

.
.
.

z4 IX ::*

23

.

22 19 .

. 18

21 17 .

. 16

20 15

.

19

.

18

.

17

.

16

.

15

.

14

.

I

21 ' '.
20

14
13 .

12
11 .
10

9 .
8

7 .
6

5 .
4
3 .
2

1 (Red Tracer) -

I_‘------------L

4 4

I

D-Sub

Plug

25

.

24

.

23

10

9
a
7
6
5

4

3
2

1

L Braided shield surrounds

ribbon cable.

.
.22

21

.

.

l

20

.

Note : View from

19

.

mating end of plug

- D-Sub plug

I

‘igure 2-12. Model 7075MTC Standard Cable

To connect the mati to instrumentation and DUT, a test
fixture using a D-sub receptacle can beused to mate to the
D-sub plug of the cable. The Keithley part number for the
D-sub receptacle is listed in Table 2-3.

Modifying the Standard Cable
A common way to use the standard cable is to cut it at a

convenient length. The result is two cables that are unter­tiated at one end. The flat ribbon cables at the unter­minated ends of the cables can then be connected to in-

2-12

strumentation and DUT, while the other ends will mate
to the ROWS and COLUMN receptacles of the matrix
card. The conductor designations of the ribbon cable are
shown in Figure Z-12. The red tracer identifies conductor

#I of the ribbon cable. Table 2-4 is provided to corre­spend the ribbon cable conductors to the matrix card row
or column terminal. For example, if the standard cable is
connected to the ROWS receptacle, ribbon cable conduc­tor

#24

will correspond to Row A Guard of the matrix
card. Jf the cable was instead connected to the COL­UMNS receptacle, ribbon cable conductor #24 will corre
spend to Column 1 Guard of the matrix card.

SECTION 2

Operation

Table 2-4. Cable Conductor Identification

(Model 7075-MTC)

Matrix Row/Column Terminal

Ribbon

Cable

Zonductor

I*

2
3
4
5
6

i

9
10
11
12
13
14
15
16
17
18
19
20

li

Ei

Connected to

ROWS

Receptacle

ROW H, Guard

ROW H, HI COLUMN 12, Guard

ROW H, Guard
ROW G, Guard
ROW G, HI COLUMN 10, HI
ROW G, Guard COLUMN 10, Guard
ROW F, Guard COLUMN 9, HI
ROW F, IU COLLJMN 9, Guard
ROW F. Guard COLUMN 8. HI
ROWE; Guard
ROWE, HI
ROW E, Guard COLUMN 7, Guard
ROW D, Guard COLUMN 6, HI
ROW D, HI
ROW D, Guard
ROW C, Guard COLUMN 5, Guard
ROW C, HI
ROW C, Guard COLUMN 4, Guard
ROW 0, Guard COLUMN 3, HI
ROW B, Hl
ROW 0, Guard
ROW A, Guard
ROW A, HI
ROW A, Guard

Connected to
COLUMNS

Receptacle
COLUMN 12, HI
COLUMN 11, HI

COLUMN 11, Guard

COLUMN 8; Guard
COLUMN 7, HI

COLUMN 6, Guard
COLUMN 5, HI

COLUMN 4, HI

COLUMN 3, Guard
COLUMN 2, HI

COLUMN 2, Guard
COLUMN 1, HI
COLUMN 1, Guard

plug pin assignment for this cable is configured to mate
with the ROWS receptacle of the matrix card. Pin identifi­cation for this cable is shown in Figure 2-13A.

The Model 7076~CMTC is a 3-meter (10 feet) 2&conduc­tor cable terminated with a D-Sub plug on each end. The
plug pin assignment for this cable is configured to mate
with either of the two COLUMN receptacles of the matrix
card. Pin identification for this cable is shown in
Figure 2-138.

For connections to instrumentation and DUT, a test fix­ture using a D-sub receptacles can be used to mate
D-sub plugs of the cables. The Keitbley part number for
the D-sub receptacle is listed in Table 2-3.

Modifying the High Isolation Cable

Another way to use the Model 7076-RMTC or Model
7076CMTC is to cut the cable at asuitable length and add
appropriate user teqnination. Each cable can then be
mated to the matrix card while the unterminated ends
can be wired to another connector or directly to instm-

mentation and DUT.

to

the

*Conductor #I of the ribbon cable is identified by the red tracer.

2.6.2

High Isolation Cables
(Model 7076~RMTC and
Model 7076~CMTC)

Shielded high isolation cables (Model 707~RMTC and
Model 707~CMTC) are available to optimize perform­ance by
HI signal path in the cable is completely surrounded by
Guard (insulated foil) to maximize the effects of guard­ing. The outer foil shield of the cable is connected to the
housings of the D-sub plugs. This shield is connected to
chassis ground when the cable is connected to a Model
7076 that is properly installed in the Model 707 main­frame.

The Model 707~RMTC is a 3meter (10 feet) 28-conduc­tar cable terminated with a D-sub plug on each end. The

minimizing crosstalk between signal paths. Each

Each cable contains 12 conductor pairs each of which cor­responds to a row or column. Each pair contains a color­coded insulated wire (HI), and a bare drain wire (Guard).
Each pair is wrapped in an insulated, color-coded foil
which is also connected to Guard. The color combination
of the HI conductor insulator and the surrounding foil is
used for identification. Table 2-5 identifies the conduc­tors of the Model 7076XMTC cable, while Table 2-6 pro-

vides identjfication for the Model 7076~CMTC cable.
Note that for both cables, the black with red foil and
white with blue foil pairs (as well as the main outer
shield) are connected to chassis ground at the housing of
the D-Sub plugs.

CAUTION
When terminating a cable that has been cut,
make sure that all exposed conductors are
properly insulated using Teflon@ or PVC
tubing and/or heat shrink material. The con­ductive side of the foil and drain wire of each
wire pair must be electrically isolated from
the other wire pairs.

2-13

SECTION 2
Operation

RowAHI

12

.

l

l

.

25

24

RowBGd “0 23

10

RowCHI ‘.

RowDGd .

8 l

7 ’

Row EHI .

RowFGd .

6
5

4 ’

RowGHI 3.

l

.

.

22
21

2o RowDHI

.

” RowEGd

l

16

l

17

.

.

l6 RowGGd

15

HI = High

12

11

.

l

l

24 Col2Gd

l

Gd = Guard

Row A Gd 25 Cd 1 Gd

Cd 1 HI
Cd2 HI .

Row B HI

Co13 HI “0 c ;I;;:;

Row C Gd

.

Col4HI ‘.

.

2’

Cd 5 Gd

Col5HI *.
Col6HI .

7

2o Cal 6Gd

l

Note : View from
mating end of plug

Row F HI

‘ipre Z-23.

Note : Unlabled pins are not connected to cable

A) ROWS Cable Plugs

(Model 7076-RMTC)

D-sub Plug Pin Assignments for High Isolation Cables

B) COLUMNS Cable Plugs

(Model 7076-CMTC)

2-14

SECTION 2

Operation

Table 2-5. Model 7076~RMTC Conductor

Identification

Matrix

ROW

Row A

Row B
Row C

Row D

Row E

Row F
Row G
Row H

Chassis
Chassis
Chassis

Cable Wire Color

Brown (HI), Red Foil w/Drain (Guard)
Red (HI), Red Foil w/Drain (Guard)
Orange (HI), Red Foil w/Drain (Guard)
Yellow (HI), Red Foil w/Drain (Guard)
Blue (HI), Red Foil w/Drain (Guard)
White (HI), Red Foil w/Drain (Guard)
Brown (HI), Blue Foil w/Drain (Guard)
Red (HI), Blue Foil w/Drain (Guard)
Black (Chassis). Red Foil w/Drain
(Chassis) ~’
White (Chassis), Blue Foil w/Drain
(Chassis)
Main outer shield w/Drain (Chassis)

Combination

Table 2-6. Model 7076-CMTC Conductor

Identification

Matrix
Column

Column 1
column 2
Column 3
Column 4
Column 5

column 6

column 7

Column 8
Column 9

Column 10
Column 11
Column 12
Chassis

Chassis
Chassis

Cable Wire Color Combination

Brown (Hi), Red Foil w/Drain (Guard)
Red (HI), Red Foil w/Drain (Guard)
Orange (HI), Red Foil w/Drain (Guard)
Yellow (HI,) Red Foil w/Drain (Guard)
Blue (HI), Red Foil w/Drain (Guard)
White (HI), Red Foil w/Drain (Guard)
Brown @II), Blue Foil w/Drain (Guard)
Red (HI), Blue Foil w/Drain (Guard)
Orange (HI), Blue Foil w/Drain
(Guard)
Ydlow (HI), Blue Foil w/Drain (Guard)
Blue (HI), Blue Foil w/Drain (Guard)
Black (HI), Blue Foil w/Drain (Guard)
Black (Chassis), Red Foil w/Drain
(Chassis)
White (Chassis), Blue Foil w/Drain
(Chassis)
Main outer shield w/Drain (Chassis)

2.7.1

The easiest way to to accomplish matirow expansion is
through the backplane of the Model 707 mainframe. It is
through this mainframe backplane where row connec-

tions to other cards are made. As previously explained in
paragraph 2.4, the Mode17076 has eight sets of backplane
jumpers that connect the rows of the matrix card to the
mainframe backplane.

There is another set of backplane jumpers that must be

considered when building larger matrices through rows.
This set of backplane jumpers is located in the Model 707

mainframe. With these mainframe backplane jumpers in-

stalled, the rows of all mainframe slots are connected to-

gether. With these jumpers removed, the rows of

frame slots 1,2 and 3 are isolated from the rows of main-

frame slots 4,5 and 6.

Backplane Row Jumpers

main-

NOTE
The Model 707 is shipped with its backplane
row jumpers installed. Some configurations
require that these backplane row jumpers be
removed. The procedure to remove these
jumpers can beg found in the Model 707 In­struction Manual.

Backplane Compatibility Considerations

The Model 7076 may be incompatible with other card
types when expansion is done through the backplane.
For example, in a particular test system it may be neces­sary to connect Guard of the Model 7076 (which is a two­pole card) to Low of a three-pole card. As shipped, the
Model 7076 backplane row jumpers connect the Guard
signal paths to the Guard terminals of the three-pole gen­eral purpose backplane of the Model 707 mainframe. The
Low signal paths of the other card are connected to the
Low backplane terminals of the Model 707. With this con­figuration, Guard of the Model 7076 cannot be routed to
Low of the other card.

2.7 MATRIX EXPANSION

With the use of additional matrix cards, larger matrices
can be configured through the backplane of the Model

707. Thus, unless otherwise noted, the examples pro­vided in the following paragraphs assume that the Model
7076 backplane jumpers are installed.

The Model 7076 provides some flexibility in altering the
backplane route of the guard signal paths. The backplane

row jumpers are shown in Figure 2-3 and Figure 2-14.

They have circuit designations W125 through W140. The

odd circuit designations (W125, W127, W129, W131,
W133, W135, W137 and W139) identify the guard jump­ers of the card. These jumpers connect the Guard signal
paths of the card to the guard backplane terminals of the
Model 707. Adjacent to each HI jumper (identified by the
even circuit designations) are holes in the PC-board to ac-

2-15

SECTTON 2

Oaeration

commodate a jumper. By moving the guard jumpers to
these locations, the matrix card guard paths will connect
to tbe low backplane terminals of the Model 707.

WARNING

Internal modifications to the matrix card

should only be performed by qualified stxv-

ROW0 H

Model 7076

ROWE ;

G

ice personnel who are familiar with standard
safety precautions.

CAUTION
Solder operations require that the pc-board
be cleaned as explained in paragraph 4.2.

0

H

L To three-pole

general pllrpose
backplane of

;

Model 707

figure 2-14. Schematic

2-16

Drawing of BackplaneJumper Configuration (Factory Default)

SECTION 2

Operation

2.7.2

An example of a narrow matrix
This 4 x 72 matrix is configured by simply installing three

“as shipped” Model 7076s in the Model 707 mainframe.
Rows A, B, C and D are connected to rows E, F, G and H
externally. These connections can be made at the instru­mentation as shown in the illustration, or with custom

built cable that shorts rows A to E, B to F, C to G, and D to

H. This example assumes that the mainframe backplane
jumpers are installed. Every additional Model 7076 in­stalled in the mainframe would add 24 columns to the
matrix. For example, four Model 7076s installed in the
mainframe would result in a 4 x 96 matrix. Table 2-7 sum­marizes the narrow (four rows) matrix possibilities for a
single Model 707 mainframe.

Model 7076 matrix cards installed in slots 1,2 and 3 of the
Model 707 can be electrically isolated from slots 4,5 and 6

Narrow Matrix Expansion

is

shown in Figure 2-15.

1

COL 12

ROWS Connscb?d
together at

Instruments

Model 7076 Backplane Jumpers Installed

Mainframe Backplane Jumpers installed

Figure 2-15. Narrow

Matrix Example f4 x 72)

” ‘m

7076
slot 1

Table 2-7.

Installed Matrix Card 1

1 Card
2 Cards
3 Cards

4 Cards

5 Cards
6 Cards

‘Mainframe backplane row jumpers between slots 3

frame must

by removing the mainframe backplane row jumpers.
With the jumpers removed, the Model 707canaccommo­date two complete, separate matrices using Model 7076

matrix cards (see Figure Z-16).

be

installed

13

ttltl ttlfl i-l

Narrow Matrix Expansion*

Resultiw Matrix

for a

matrix

larger than 72 columns.

COL 24

25

Hltl l-t ItI t-i,

4x24
4x48
4 x 72

4x96
4 x 120
4x144

and 4 of main-

CCL 36

I

I

----I I
I
+-I-

I
I
I

I

2-17

SECTION 2
Operation

Figure Z-16. Dual 4 x 72 Matrices

2.7.3

Wide Matrix Expansion

By installing the cohmn jumpers of the Model 7076, the
card becomes configured a.5 an 8 x 12 matrix (see para­graph 2.42). Assuming that the backplane jumpers of the
Model 707 and 7076s are installed, each 8 x 12 matrix card
installed in the mainframe extends the matrix by 12 col­1111~1s. For example, three Model 7076s konfigured as 8 x

12 matrices) installed in the Model 707will result in an 8 x
36 malxix. An example of an 8 x 36 matrix is shown in

1

Row

L

Column
Jumpers

Model 7076 Backplane Jumpers Installed
Mainframe Backplane Jumpers installed

Cd 12 13 Cd 24

.co~. .ri, ra .cdr. .24’

7076

SIC4 1

Figure 2-17. Wide Matrix Example (8 x 36)

Figure Z-17. Table 2-8 summarizes the wide (eight rows)
matrix possibilities for a single Model 707 mainframe.

With the column jumpers installed, column 1 is con-

netted to column l’, column 2 is connected to column 2
and so on. Thus, when connecting DUT or instmmenta­tion to the columns of the matrix, it is recommended that
only one column’s receptacle be used.

Cd 36

7076
Slot 6

7076

S&x2

25

25 Cd 36

Note :

With column jumpers

Installed, COL lines

are connected to COL’

lines.

2-18

SECTION 2

Table 2-8. Wide Ma&ix Expansion*

Installed Matrix Card Resulting Matrix

1 Card

2 Cards 8x24
3 Cards 8x36
4 Cards 8x48
5 Cards 8X60
6 Cards 8 x 72

*Mainframe backplane row jumpers between slots 3 and 4 of main­frame must be installed for a matrix larger than 36 columns.

8x12

2.7.4 Partial Matrix Implementation

A fully implemented matrix provides a relay at each po­tential crosspoint. For example, a fully implemented 8 x
36 matrix utilizing three 8 x 12 matrix cards contains 288
crosspoints. A partially implemented 8 x 36 matrix
would contain fewer crosspoints. An example of a par­tially implemented 8 x 36 matrix is shown in Figure 2-18.
The partial matrix is still 8 x 36, but contains only 192
crosspoints using two matrix cards. Model 7076 #l is con­figured as a 4 x 24 matrix. Notice in Figure 2-18A that the
Model 7076 backplane jumpers for rows E through H are
cut. These jumpers must be cut in order to isolate Model

7076 #l from rows E through H of the other
the mainframe (see Figure 2-188).

An obvious advantage of a partial matrix is that fewer

matrix cards are needed. Another reason to use a partial

matrix is to keep certain devices from being connected di­rectly to other certain devices. For example, a source in
Figure 2-18B cannot be connected to a column of Model

7076 #l with one “accidental” crosspoint closure. Three
specific crosspoints must be closed in order to connect a
source to a Model 7076 #1 column.

2.7.5

Matrices using up to 30 matrix cards are possible by
daisy-chaining five Model 707 mainframes together. Us­ing 30 Model 7076 matrix cards provides 2880
crosspoints.

In general, assuming all backplane jumpers are installed,
connecting the rows of a card in one mainframe to the
rows of a card in a second mainframe increases the col­umn numbers of the matrix. For example, if the rows of a
4 x 120 matrix in one mainframe are connected to the
rows of a 4 x 72 matrix in a second mainframe, the result­ing matrix would be 4 x 192. See the Model 707 Instruc­tion Manual for detailed information on daisy-chaining
Model 707 mainframes.

Mainframe Matrix Expansion

matrix

card in

2-19

SECTION 2
Operation

together at

instrumentation

I -

Jumpers

A) Matrix Configuration

---_--_-----__
12

Ygure 2-18.

r1------

B) Equivalent Circuit

PartiaJMatrixExpansion(8~36)

#I

7076

2.8 TYPICAL CONNECTION SCHEMES

The following information provides some typical con-

nection schemes for single card, multiple card and multi-

ple mainframe system configurations. Also, a system us­ing the matrix card with a multiplexer card (Keithley
Model 7075) is shown to demonstrate versatility and
compatibility. AU of the examples use Model 7076s con­figured as 4 x 24 matrices.

Also, the examples show Model 7075 cables, or Model
7076CMTC and Model 7076~WC cables. In many in­stances, these cables are best utilized by cutting them in
half. Cutting them provides twice as many cables and al-

7076 #2

1’ 12.1 L--------l 24

lows direct connection to insmentation and DUT. Ca­bles could just as well be custom built to better suit a par­ticular application.

2.8.1

Figure 2-19 shows how external connections for a single
card system might by made. Instrumentation is con­nected to matrix card rows using a standard cable (Model
7075~MTC) for general purpose testing, or a high isola­tion cable (Model 7076-RMTC) for critical tests that re­quire optimum isolation. In a similar manner, DUT is
connected to the matrix card using a standard cables or
the Model 7076~CMTC high isolation column cables. No-

Single Card System

2-20

7076

n

SECTION2

Operation

1 2 3 4

Equivalent Circuit

‘igure 2-19. Single Card System Example

tice that cutting one of these cables in half will provide
two column cables that will connect directly to DUT.

2.8.2

Figure Z-209 shows a system using two matrix cards. In
this configuration, both instrumentation and DUT are
connected to the columns of the matrix. In this example,
the inshuments are connected to the columns because
they require six pathways. The matrix, as configured, has
only four rows.

Multiple Card System

5 6 7 8 9 10 11 12

7 z 3’

Notice that the row jumper connections required to con­figure the four row matrix are done at a 25-pin D-sub

plug.

2.8.3

Figure 2-21 shows a system using seven matrix cards, re­quiring two Model 707s daisy-chained together. In this

configuration DUTs are connected to mati card col­umns. A single cable is used to connect the rows of the
master mainframe to the rows of the slave mainframe.
Note that if path resistance is a critical factor, use a modi-

fied (or custom) cable that is as short as possible.

c 5’ 6 T B 9 10’ 11’12

Multiple Mainframe System

Z-21

SECTION 2

Operation

7075

7076

Model 707

Simplified Equivalent Circuit

%mre 2-20. Multi& Card Sustem Examule

2.8.4

Figure 2-22 shows an example of how the Model 7076 can
be used along with a multiplexer card (Keithley Model

7075) in the same test system. In this example, the Model
7076 is configured as a4 x24 matrix and the Model 7075 is
configured as a quad 1 x 24 multiplexer. In this test sys­tem, the matrix card provides 24 columns for DUT or ad­ditional instrumentation. By using the multiplexer card
in the system, 96 additional test lines are made available.

2-22

Matrix/Multiplexer System

Different bank jumper/backplane jumper combinations
on the Model 7075 can provide different pin outs for the
same quad 1 x 24 multiplexer configuration. Also, differ­ent multiplexer configurations are easily accomplished.
For example (refer to Figure 2-22), removing backplane
jumpers for rows C and F, and installing bank jumpers B
to C and F to G will configure the card as a dual 1 x 48
multiplt?xer.

Rows shorting plug

RowAtoRowE
RowBtoRowF

SECTION 2

Operation

Instrument

-

\

//

I I

Math Cables :

Columns : 7075.MTC Cables or

7076imTc cables

Row : 7075MTC Cables or

7076RMTC Cables

Figure 2-21.

Simplified Equivalent Circuit

Multiple Mainframe Example

2-23

SECTION 2
Operation

r ,$ --------- -----_

‘igure 2-22. Matrix/Multiplexer System

2-24

2.9 BANDWIDTH AND CROSSTALK

Figure%23 through Figure 2-26 show typical AC re-

sponse curves for -3dB bandwidth and crosstalk. Meas­urements for the four plots were performed using the HP
8752A Network Analyzer under the following condi­tions:

1. The Model 7076 backplane jumpers are installed and
configured per factory default.

2. The Model 7076 is configured as dual 4 x 12
matricies.

3. The Model 7076 is installed in slot #l of the Model
707 mainframe. The other mainframe slots are

empty.

4. 501;2 source (Rs) and a 50 load (RL).

Bandwidth

Figure2-23 shows the -3dB bandwidth with matrix
crosspoint Al closed. The 5OQ source is connected to
ROW A and the 50&2 load is connected to COLUMN 1.
Figure 2-24 shows the -3dB bandwidth with crosspoint
HI2 closed. The 5OQ source is connected to ROW H and
the 5OQ load is connected to COLUMN 12’.

Figure 2-23. -3dB Bandwidth (Crosspoint AI closed,

Rs=Rr=50G

Crosstalk

Figure 2-25 and Figure 2-26 show typical crosstalk for ad-

jacent pathways. For Figure 2-25, crosspoints All and

B12 are closed. The 5OQ source is connected to ROW A

and the 501;L load is connected to COLUMN 11. Measure-

ments are made at ROW B. For Figure 2-26, crosspoints

Gl and H2 are closed. The 5OQ source is connected to

ROW G and the 5OQ load is connected to COLUMN 1’.
Measurements are made at ROW H.

Figure 2-24. -3db Bandwidth (Crosspoint HI2 closed,

Rs=Ra=5’JC&

2-25

SECTION 2
Operation

Tgure 2-25.

CrosstaNc (Crosspoints Gl and H2 closed,
50RsourceonROWG,50~loadonCOL-

UMNl’,MeasurementsatROWH~

Figure2-26. Crosstalk (Crosspoints All and B12

closed, .5OQ sowce on ROW A, 5OQ load
onCOLUMNl1,MeasuremmtsntROW

B)

2-26

SECTION 3

Amlications

3.1 INTRODUCTION

General applications to test thick film resistor networks
and transistors are provided in this section. These appli­cations are intended to demonstrate the versatility of us­ing the matrix card in test systems.

The first application (Thick Film Testing) uses the Model

7076 as a 4 x 24 matrix and the second application (Tran­sistor Testing) uses the card as an 8 x 12 matrix.

3.2 THICK FILM RESISTOR NETWORK TESTING

A dedicated matrix system for testing thick film resistor
networks is shown in Figure 3-l. This particular system
provides two different methods to check thick films;
four-wire resistance measurements, and voltage meaa­urements using an applied voltage. The Model 7076 used
in this system is configured as a 4 x 24 matrix.

The system shown in Figure 3-11 tests six 3-element thick
films, but can be expanded to test more by simply using
additional Model 7076 matrix cards. The Model 707 will
accommodate six
Model 707s expands the system to 30 maixix cards allow­ing 180 three-element thick films to be tested.

matrix

cards. Daisy-chaining five

3-l

SECTION 3

Measure V or

4.terminal R

source v

Model 7076 (4X24 Matrix)

?,qurre 3-1.

Thick Film Resistor Network Testing

3-2

SECTION 3
Applications

3.2.1

Four-terminal Ohms Measure­ments

For general purpose testing, the Keithley Model 196 can
be used to make four-temoiml resistance measurements
of each thick film. As shown in Figure 3-2, OHMS HI and
OHMS SENSE HI are connected to one matrix row, and
OHMS LO and OHMS SENSE LO are connected to an­other matrix row. With this configuration, the resistance
of each resistor element and/or combined elements can
be measured by closing the appropriate crosspoints. In

Figure 3-2, crosspoints Al (row A, column 1) and B3 are

closed to measure the combined resistance of Rl and R2.

The effects of thermal EMFs generated by relay contacts

and connections can be canceled by using the offset com­pensated ohms feature of the Model 196. To compensate
for thermal EhGs, close two crosspoints (such as Al and

Bl)

that will short the input of the Model 196, enable zero
to cancel internal offset, and then enable offset compen­sated ohms.

Thick Film

Figure 3-2.

Model 196

Model 7076

196

Equivalent Circuit

4-Terminal Ohms Measurements

3-3

SECTION 3
Applications

3.2.2 Voltage Divider Checks

For thick film resistor networks that are going to be used
as voltage dividers, it may be desirable to test them using
voltages that simulate actual operating conditions. This
isaparticularlyuseful testforresistornetworksthat have
a voltage coefficient specification. The test system in
Figure 3-l uses a Keithley Model 230 to source voltage
and the Model 196 to measure voltage.

A consideration in these checks is the affect of the Model
196 input impedance on voltage measurements. The in­put impedance is shunted across the resistor being meas­ured. The resultant divider resistance is the parallel com­bination of the resistor under test and the input imped­ance. As long as the input impedance is much larger than
the resistor being tested, the error introduced into the
measurement will be
ance requirements are, of course, determined by the ac­curacy needed in the measurement. The input imped­ances of the Model 196 are as follows: 3OOmV and 3V
ranges, 1GQ; 30V range, 1lM.Q; 300V range, 1O.lM.Q. For

better input impedance requirements, the Keithley

minimal. Minimum input imped-

Model 617 Electrometer can be incorporated into the test
system to measure voltage.

Another factor to be considered when checking low volt­age dividers is thermal EMFs generated by the matrix
card. Amattixcard crosspoint can generateup to +5pVof
thermal EMF. Thus, when making low voltage measure­ments be sure to account for this additional error.

Even though four-terminal connections are made at the

Model 196 and the resistor networks, the sense leads are

internally disconnected from the input of the DMM
when the volts function is selected. The simplified test
system is shown in Figure 3-3.

The thick film is tested by applying a voltage across the
resistor network and measuring the voltage across each

resistor element and/or across combined elements. In

Figure 3-3, crosspoints Cl and D4 are closed to apply
voltage across the network, and crosspoints A3 and B4
are closed to measure the voltage drop across R3.

3-4

SECTION 3

Applications

Model 196

Measure V

r­I

-------1
Ri

Thick Film

R2 R3

Model 7076

I
I

Figure 3-3.

. . - - -. -- -

Source v

Voltage Divider Checks

A

8 +- 1
230

Equivalent Circuit

196

35

SECTION 3

3.3 TRANSISTOR TESTING

Amatrixsystemfortestingdcparametersof transistorsis
showninFigure3-4.TheMode17076isconfigured asan
x 12 matrix. This system uses a current source (Keithley
Model 224), a voltage source (Keithley Model 230) and a
DMh4 (Keitbley Model 196) to measure current and/or
voltage. This system tests three transistors, but can be ex-

panded to test more by simply wing additional Model
7076 matrix cards. The Model 707 will accommodate six
matrix cards. Daisy-chaining five Model 707s expands
the system to 30 matrix cards allowing 90 transistors to be

tested.

NOTE
To check FETs or transistors that have high
gain or low power, equipment that has lower
offset current and higher impedance must be
used. To check these devices, the Keithley

Model 7072 Semiconductor Matrix Card and

the Keithley Model 617 Electrometer can be

used.

3.3.1 Current Gain Checks

The dc current gain of a general purpose transistor can be
checked by configuring the transistor as a common-emit­ter amplifier. Figure3-5 shows which crosspoints to close
to configure the amplifier circuit. In this circuit, gain is
calculated bv dividing collector current (measured bv the
Model 196) iy base &rent (sourced by&eModel22&. A
profile of the transistor operating characteristics can be
obtained by measuring the collector current over a speci­fied voltage range (V) for different base bias currents. For

example, Figure 3-6 shows the characteristics of a typical
NPN silicon transistor at base bias currents (I) of 201x4,
4OmA, 6OmA and 8OmA.

‘igure 3-4.

3-6

Model 230

Model 224

Transistor Testing

I

Model 7076 Matrix Card

SECTION 3

Applications

Equivaknt Circuit

----

A---L_s--

!!!!I!!!

MadeI 7076

Figure 3-5.

um.lluI ’

Note : Installed column jumpers between

rows D and E (shown in Figure 3-4)
are not shown in this illustration.

Model 224

Transistor Current Gain Checks

3-7

SECTION 3
Applications

0 1

Figure 3-6.

3.3.2

The versatility of using a matrix is demonstrated in
Figure 3-7 and Figure 3-8. The transistor is still cotig­ured as a common-emitter amplifier, but theMode 196 is
removed from the collector circuit and used to measure

Common Emitter Characteristics

IE and VBE Measurements

of

2 3 4

VCE I volts

an NPN Silicon Transistor

5

emitter current and base-tb-emitter voltage. Notice that

external connection changes are not required. All connec-

tion changes are accomplished by control of matrix
crosspoints. In this situation, care must be taken to pre­vent crosspoints of rows B and D from being closed at the
same time.

3-6

Model 196

Volts HI

l.

AmpsHI ia

SECTlON 3
Applications

H*C

Figure 3-7.

Model 230

Transistor IE Measurements

AmpsLO IG

I

I

H.D

Model 7076

3-9

SECTION 3
App,lications

Model230

Model224

Ywre 3-8. Transistor V~‘~~Measurments

I

output

I -

II II II

Model7076

1

Note : installed column jumpers between

rows D and E (shown in Figure 34)

are not shown in this illustration.

3-10

SECTION 4

Service Information

4.1 INTRODUCTION

This section contairs information necessary to service the
Model 7076 and is arranged as follows:

4.2 Handling and Cleaning Precautions: Discusses han­dling procedures and cleaning methods for the matrix
card.

4.3 Relay Test Program: Explains how to connect the ma­trix card to the Model 707 maintixme for the relay test
p*0pIll.

4.4 Performance Verification: Covers the procedures
necessary to determine if the card is operating properly.

4.5 Principles of Operation: Briefly discusses circuit op­eration.

4.6 Special Handling of Static-Sensitive Devices: Re­views precautions necessary wlien handling static-sensi­tive devices.

4.7 Troubleshooting: Presents some troubleshooting
tips for the matrix card.

If making solder repairs on the circuit board, use a flux
that is rosin RMA based. Remove the flux from these ar­eas when the repair is complete. Use Freon@ TMS or TE,
or the equivalent along with plenty of clean cotton swabs
to remove the flux. Take care not to spread the flux to
other areas of the circuit board. Once the flu has been re­moved, swab only the repaired area with methanol, then
blow dry the board with dry nitrogen gas.

After cleaning, the card should be placed in a 5O’C low
humidity environment for several hours.

4.3 RELAY TEST PROGRAM SET-UP

The Model 707 comes equipped with a test program on
diskthatwilltesttherelaysof allModel7076sinstalledin
the mainframe. The test program will flag any relay that
fails to close when energized or open when de-energized.
Instructions for using the test program with an IBM PC or
XT, or HP 200 or 300 series computer are contained in the
Model 707 Instruction Manual.

Perform the following steps to configure the Model 7076
for relay testing:

4.2 HANDLING AND CLEANING

PRECAUTIONS

Because of the high impedance circuits on the Model
7076, care should be taken when handling or servicing
the card to prevent possible contamination, which could
degrade performance. The following precautions should
be taken when handling the matrix card.

Do not store or operate the card in an environment where

dust could settle on the circuit board. Use dry nitrogen
gas to clean dust off the card if necessary.

Handle the card only by the handle and side edges. Do
not touch any board surfaces, components, or edge con­nectors. Do not touch areas adjacent to electrical contacts.
When servicing the card, wear clean, cotton gloves.

1. Remove the relay test terminal block from the rear
panel of the Model 707. This is a quick-disconnect
terminal block and simply pulls off the rear panel
terminal strip.

2. Connect the relay test terminal block to rows A and B

of any Model 7076 card installed in the mainframe as

shown in Figure 4-1. Note that terminals 5 and 6 of

the relay test terminal block must be shorted to­gether. Terminals H and G of row B of the Model
7076

must also

A convenient method to make connections to
the matrix card is by hard-wiring a 25-pin D­sub plug and then mating it to the ROWS re­ceptacle of the card. Table 2-3 lists the Keithley
part number for the D-sub plug. Pm identifi-

cation for the plug is provided by Figure 2-13.

be shorted together.

NOTE

4-l

SECTION 4

Service Information

123456

‘ipre 4-1. Relay Test Setup

3. Re-install the relay test terminal block into the rear
panel of the Model 707 mainframe and refer to the
Model 707 Instruction Manual to run the test pro-

gram.

4.4 PERFORMANCE VERIFICATION

The following paragraphs discuss performance verifica­tion procedures for the Model 7076, including path resis­tance, offset current, contact potential, and isolation.

The procedures in this section are rather lengthy due to
the large number of row and column combinations that
are checked. As an alternative to this extensive testing, it
may be desirable to check only those paths that are going
to be used, or those that are suspected of being faulty.

CAUTION
Contamination will degrade the perform­ance of the matrix card.

tion, always grasp the card by

side edges.

Do not touch the edge connectors

To avoid contamina-

the handle and

of the card, and do not touch the board SW­faces

or components. On plugs and recepta-

cles, do not touch areas adjacent to the elec­trical contacts.

NOTE
Failure of any performance verification test
may indicate that the matrix card is contti­nated. See paragraph 4.2 to clean the card. If
the test still fails after cleaning, then try clean­ing the backplane (see the Model 707 Instruc­tion Manual).

With the Model 7076’s backplane jumpers installed, the
performance verification procedures must be performed
with only one matrix card (the one being checked) in­stalled in the Model 707 mainframe. Also, the Model 707
must not be daisy-chained to another Model 707. These

conditions do not apply if the jumpers are already re-

moved.

4-2

4.4.1 Environmental Conditions

All verification measurements should be made at an am­bient temperature between 18’ and 28’C, and at a relative
humidity of less than 70%.

SECTION 4

Service Information

4.4.2

Table 4-1 summarizes the equipment necessary for per­formance verification, along with an application for each
unit.

4.4.3

A convenient method to

nections to the matrix card is by hard-wiring 25-pin D-

Sub plugs and then mating it to the appropriate recepta-

cle of the card. Row and column shorting connections can
also be done at D-sub plugs. Table 2-3 lists the Keithley
part number for the D-sub plug. Pi identification for the
plug is provided by Figure 2-13.

Before pm-wiring any D-sub plugs, study the following

test procedures to fully understand the connection re­quirements.

4.4.4

Referring to Figure 4-2, perform the following steps to
verify that each contact of every relay is closing properly
and that the resistance is within specification.

1. Turn the Model 707 off if it is on.

Recommended Equipment

NOTE
Do not use the Model 7070 Universal Adapter
Card as an extender card to verify perform­ance of the Model 7076. The Model 7076 must

be installed in the Model 707 mainframe.

Matrix Card Connections

make

instrument and DUT con-

Path Resistance Tests

2. Remove the matrix card column jumpers if they are
installed.

3. Install the Model 7076 in slot 1 of the Model 707.

4. As shown in Figure 4-2, connect all terminals of
trix columns 1-12 together to form one common ter­minal.

5. Set the Model 196 to the 300mV range and connect
four test leads to the OHMS and OHMS SENSE in­put.

6. Short the four test leads together and zero the Model

196. Leave zero enabled for the entire test.

7. Connect OHMS HI and OHMS SENSE HI of the
Model 196 to the common terminal. It is recom­mended that the physical connections be made at
columns 1 and 12 as shown in the illustration.

8. Connect OHMS LO and OHMS SENSE LO to the
high (H) terminal of ROW A.

9. Turn on the Model 707 and program it to close
crosspoint Al (ROW A, COLUMN 0, and verify that
the resistance of this path is c1.5.Q.

10. Open crosspoint Al, and close A2. Verify that the re­sistance of this path is <1.5R.

11. Open crosspoint A2, and close A3. Verify that the re­sistance of this path is <1.50.

12. Repeat the basic procedure of opening and closing
crosspoints to check the resistance of ROW A high
(H) terminal paths for COLUMNS 4 through 12
(crosspoints A4 through A12).

13. Connect the OHMS LO and OHMS SENSE LO test
leads of the Model 196 DMM to the guard (G) termi­nal of ROW A.

14. Repeat steps 9 through 12 to check the guard (G) ter-

minal paths of ROW A.

15. Repeat the basic procedure in steps 8 through 14 for

ROWS 8, C and D.

16. Connect all terminals of matrix columns l’-12’ to-

gether to form one common terminal.

17. Connect OHMS HI and OHMS SENSE HI of the

Model 196 to the common terminal. It is recom-

ma-

1 Description

DMM
Electrometer w/voltage source

Nanovoltmeter
Triax cable (unterminated)
Low thermal cable

(unterminated)

Table 41.

Verification Equipment

1 Model or Part

Keithley Model 196
Keithley Model 617

Keithley Model 181
Keithley Model 7025
Keithey Model 1484

Specifications Applications

3ooC2; 0.01% Path resistance
XpA, lOOpA; 1.6% 1OOV source; 0.2%

2mV; 0.015%

-

Offset current,
path isolation
Contact potential
Offset current
Contact potential

I

4-3

SECTION 4
Semite

information

Model 7076

Figure 4-2.

mended that the physical connections be made at
columns 1’ and 12’.

18. Connect OHMS LO and OHMS SENSE LO to the
high (H) terminal of ROW E.

19. Repeat the basic procedure of steps 9 through 15 to

test the paths of rows E, F, G and H.

4.4.5 Offset Current Tests

These testscheckleakagecurrent fromhigh toguard

(G) (differential), and from high (HI) and guard (G) to

chassis (common mode) for each pathway. In general,

these tests are performed by simply measuring the leak­age current with an electrometer. In the following proce­dure, the Model 617 is used to measure leakage current.

Referring to Figure 4.3, perform the following procedure

to check offset current:

1. Turn the Model 707 off if it is on.

2. On the matrix card, remove the column jumpers if
they are installed. peat steps 5 through 12.

PathResistanceTestingg

3. Install the matrix card in slot 1 of the Model 707.

4. Connect theModel617electrometertoROW Aofthe
matrix card as shown in Figure 4-3.

5. On the Model 617, select the 2OOpA range, and en­able zero check and zero correct in that order. Leave
zero correct enabled for the entire procedure.

6. Turn on the Model 707

7. Program the Model 707 to close crosspoint Al.

8. On the Model 617, disable zero check and verify that
it is clOOpA.T%is measurement is the leakage cur­rent of the pathway.

9. On the Model 617, enable zero check and on the
Model 707, open crosspoint Al.

10. Repeat the basic procedure in steps 7 through 9 to
check the rest of the pathways (crosspoints A2
through A12) of the row.

11. Connect the Model 617 to ROW B and repeat theba­sic procedure in steps 7 through 10 to check
crosspoints Bl through 812.

12. Repeat thebasic procedure in step 11 to check ROWS
C, D, E, F and G.

13. To check differential offset current, connect the
Model 617 to ROW A as shown in Figure 4-4 and re-

4-4

Service

--coIYnl”
Jumpers
RmloVed

I
I

I

SECTION 4

Information

?gure 4-3.

Model 7076

Common Mode Offset Current T&ins

4-5

SECTION 4
Service Information

?gure 4-4. Differential Offset Current Testing

4.4.6 Contact Potential Tests

These tests check the EMF generated by each relay con-

tact pair (H and G) for each pathway. The tests simply
consist of using a nanovoltmeter (Model 181) to measure
the contact potential.

Perform the following procedure to check contact poten­tial of each path:

1. Turn the Model 707 off if it is on.

2. On the matrix card, remove the column jumpers if
they are installed.

3. Install the matrix card in slot 1 of the Model 707.

4. As shown in Figure 4-5, short high (H) to guard (G)
of columns 1 through 12.

5. Set the Model 181 to the 2mV range, short the input
leads and press ZERO to null out internal offset.
Leave zero enabled for the entire procedure.

Model 7076

6. Connect the Model 181 to a ROW A as shown in the
illustration.

7. Turn on the Model 707

8. Program the Model 707 to close crosspoint Al.

9. Verify that the reading on the Model 181 is <5wV.
This measurement is the contact potential of the
pathway.

10. From the Model 707, open crosspoint Al.

11. Repeat the basic procedure in steps 8 through 10 to
check the rest of the pathways (crosspoints A2

through A12) of the row.

12. Connect the Model 181 to ROW B and repeat the ba­sic procedure in steps 8 through 11 to check
crosspoints Bl through B12.

13. Repeat thebasic procedure in step 12 for the remain­ing rows (ROWS C and D).

14. Short high (HI) to guard (G) of columns 1’ through

.n,

IL.

15. Connect the Model 181 to Row E.

16. Repeat the basic procedure in steps 8 through 13 to
test ROWS E through H.

4-6

SECTION 4

Service Information

Zgure 4-5.

4.4.7

These tests check the leakage resistance (isolation) be­tween adjacent paths. A path is defined as the high (H)
and guard (G) circuit from a row to a column that results
by closing a particular crosspoint. In general, the test is
performed by applying a voltage (+lOOV) across two ad­jacent paths and then measuring the leakage current
across the paths. The isolation resistance is then calcu­lated as R = V/I. In the following procedure, the Model
617functionsasbothavoltagesourceandanamrneter.In
the V/I function, the Model 617 internally calculates the
resistance from the known voltage and current levels and

displays the resistance value.

Refer to Figure 4-6 for the following proce­dure.

1. Turn the Model 707 off if it is on.

2. Remove the matrix card column jumpers if installed.

3. Install the Model 7076 in slot 1 of the Model 707.

Contact Potential Testing

Path Isolation Tests

NOTE

Model 7076

4. Connect the Model 617 to ROWS A and B as shown
in Figure 4-6. Make sure The voltage source is in

standby. Also, make sure there are no other connec­tions to the card.

WARNING

The following steps use high voltage (1OOV).

Be

sure to remove power from the circuit be-

fore making connection changes.

5. On the Model 617, select the 2pA range, and enable
zero check and zero correct in that order. Leave zero

correct enabled for the entire procedure.

6. On the Model 617, select the 20pA range and release

zero check.

7. On the Model 617, press suppress to cancel offset
current and then enable zero check.

8. On the Model 617, set the voltage source for +lOOV,
and select the 20nA current range. Make sure the
voltage source is in standby.

9. Place the Model 617 in the V/I measurement func­tion by pressing SHIFI’ OHMS.

10. Turn on the Model 707, and program it to close
crosspoints Al (ROW A, COLUMN 1) and 82 (ROW
8, COLUMN 2).

4-7

SECTION 4
SmiceInfomation

Qure 4-6. Path Isolation Testing (Guarded)

11. On the Model 617, disable zero check and press OP­ERATE to source +lOOV.

12. AfterallowingthereadingontheModel617tosettle,
verify that it is >lOGQ. This measurement is theleak­age resistance (isolation) between ROW A, COL­UMN 1 and ROW B, COLUMN 2.

13. Place the Model 617 in standby and enable zero

check.

14. Turn off the Model 707.

15. Disconnect the Model 617 from ROWS A and B, and,
in a similar manner, reconnect it to ROWS B and C

(picoammeter high and voltage source low to ROW

B, and voltage source high and low to ROW Cl.

16. Turn on the Model 707 and program it to close
crosspoints 82 and C3.

17. On the Model 617, disable zero check and press OP-

ERATE to source +loOV.

18. AfterallowingthereadingontheModel617tosettle,

verify that it is >lOGR.

19. Using Table 4-2 as a guide, repeat the basic proce-

dure of steps 13 through 18 for the rest of the path
pairs (starting with test #3).

4-8

Table 4-2. Path Isolation Tests

SECTION 4

Seruice Informtim

-r

rest
No.

Path Isolation

1

Row A, Co1 1 to Row B, Co1 2

2

Row 8, Co1 2 to Row C, Co1 3

3

Row C, Co1 3 to Row D, Co1 4

4

Row C, Co1 4 to Row D, Co1 5
Row C, Co1 5 to Row D, Co1 6

ii

Row C, Co1 6 to Row D, Co1 7

7

Row C, Co1 7 to Row D, Co1 8

8

Row C, Co1 8 to Row D, Co1 9

9

Row C, Co1 9 to Row D, Co1 10

10

Row C, Co1 10 to Row D, Co1 11

11

Row C, Co1 11 to Row D, Co1 12

12

Row D to Row E

13

Row E, Co1 1’ to Row F, Co1 2

14

Row F, Co1 2’ to Row G, Co1 3

15

Row G, Co1 3’ to Row H, Co1 4

16

Row G, Co1 4’ to Row H, Co1 5

17

Row G, Co1 ‘5 to Row H, Co1 6

18

Row G, Co1 6’ to Row H, Co1 7

19

Row G, Co1 7’ to Row H, Co1 8

20

Row G, Co1 8’ to Row H, Co1 9

21

Row G, Co1 9’ to Row H, Co1 10’

22

Row G; Co1 IO’ to Row I?, Co1 11’

23

Row G, Co1 11’ to Row H, Co1 12

-

Test Equipment Crosspoints
Locations Closed

Row A and Row B
Row B and Row C
Row C and Row D
Row C and Row D
Row C and Row D
Row C and Row D
Row C and Row D
Row C and Row D

Row C and Row D
Row C and Row D
Row C and Row D

Row D and Row E

Row E and Row F

Row F

Row G and Row H

Row G and Row H
Row G and Row H
Row G and Row H

Row G and Row H

Row G and Row H

Row G and Row H

Row G and Row H
Row G and Row H

and

Row G

T

Al and B2
B2 and C3
C3 and D4

C4 and D5

C5 and D6
C6 and D7
C7 and D8

C8 and D9
C9 and D10
Cl0 and Dll
Cl1 and D12
None

El and FZ

F2 and G3
G3 and H4
G4 and H5
G5 and H6
G6 and H7

G7 and H8

G8 and H9
G9 and HlO
G10 and Hll
Gil and H12

4.4.8

Differential and Common Mode
Isolation Tests

These tests check the leakage resistance (isolation) be­tween high (H) and guard (G) (differential), and from
high and guard to chassis (common mode) of every row
and column. In general, the test is performed by applying
a voltage UOOV) across the terminals and then measuring
theleakagecurrent. Theisolationresistanceisthencalcw
lated as R = V/I. In the following procedure, the Model
617 functions as a voltage source and an ammeter. In the
V/I function, the Model 617 internally calculates there­sistance from the known voltage and current levels and
displays the resistance value.

1. Turn the Model 707 off if it is on.

2. Remove thematrix card column jumpers if installed.

3. Install the Model 7076 in slot 1 of the Model 707.

4. ConnecttheModel617toROW AasshowninFigure
4-7 to measure differential isolation. Make sure The
voltage source is in standby. Also, make sure there
are no other connections to the card.

WARNING
The following steps use high voltage (1OOV).
Be sure to remove power from the circuit be­fore making connection changes.

5. On the Model 617, select the 2pA range, and enable
zero check and zero correct in that order. Leave zero

correct enabled for the entire procedure.

6. On the Model 617, set the voltage source for +lOOV,

and select
voltage source is still in standby.

7. Place the Model 617 in the V/I measurement func­tion by pressing SHIFT OHMS.

8. Turn on the Model 707, but do not program any
crosspoints to close. All crosspoints must be open.

9. On the Model 617, disable zero check and press OP-

ERATE to source 1OOV.

10. AfterallowingthereadingontheModel617tosettle,
verify that it is >lGQ. Thismeasurement is theleak­age resistance (isolation) of ROW A.

11. Place the Model 617 in standby and enable zero
check.

12. Program the Model 707 to close crosspoint Al.

13. On the Model 617, disable zero check and press OP­ERATE to source +lOOV.

the

200nA

current

range. Make sure the

4-9

SECTION4

Service Information

14. AfterallowingthereadingontheModel617tosettle,
verify that it is also zlG0. This measurement checks
the isolation of COLUMN 1.

15. Using Table 4-3 as a guide, repeat the basic proce­dure of steps 11 through 14 for the rest of the col­urmw and rows (test numbers 3 through 32 of the ta­ble). Note that starting with test #17, the Model 617

Table 4-3. Differential and Common Mode Isolation Test

Differential or
rest
No.

-

common Mode

1
2
3
4

5

6

8’

9

10
11

:z
14
15
16
17
18
19

20

21
22
23

;t
26
27
28

ii
31
32

COLUMN 10
COLUMN 11’
COLUMN 12

Test

ROW A

COLUMN 1

COLUMN 2
COLUMN 3
COLUMN 4
COLUMN 5
COLUMN 6
COLUMN 7
COLUMN 8

COLUMN 9
COLUMN 10
COLUMN 11
COLtiN 12

ROW B
ROW C
ROW D

ROWE

COLUMN 1’
COLUMN 2
COLUMN 3
COLUMN 4
COLUMN 5
COLUMN 6
COLUMN 7
COLUMN 8
COLUMN 9

ROW F
ROW G
ROW H

must be connected to ROW E.

16. Place the Model 617 in standby and turn the Model
707 off.

17. ConnecttheModel617toROWAasshowninFigure
4-8. and repeat steps 8 through 16 to check common

mode isolation.

Crosspoints

Closed

None

Al
A2
A3
A4
AS

A6

A7
A8
A9

A10

All
Al2

Al and Bl
Al and Cl
Al and Dl

None

El
E2
E3

E8

E9
El0
El1
El2

El and Fl
El and Gl
El and Hl

4-10

SECTION 4

Service Information

Cigure 4-7.

Model 7076

Differential Isolation Testing

Figure 4-8.

Common Mode Zsolntion Testing

411

SECnON 4
Service Information

4.5 PRINCIPLES OF OPERATION

The paragraphs below discuss the basic operating princi­ples for the Model 7076 and can be used as an aid in
troubleshooting the matrix card. The schematic drawing
of thematrixcardisshownondrawingnmber7076-106,
located at the end of Section 5.

4.5.1 Card Identification

Identification coding and a matrix configuration table are
stored in an erasable programmable read-only memory

(EPROM). This information is sent to the Model 707 so
that it “knows” which type of matrix card is installed in
that particular mainframe slot. This enables the Model
707 to send valid configuration data to the matrix card.

On power up, control line CARDSEL goes low turning on

the EPROM (IJ128). That control line, as well as the other

control lines from the

Lines CLK, NEXT ADDR and CLR ADDR along with

counter U126 control the task of loading data from the

EPROM into the parallel to serial shift register W127).

Data sent from U130 to the Model 707 via the IDDATA

line is strobed by the CLK control line. The timing dia-

gram in Figure 4-9 shows the first byte of identification

data during the transfer sequence. For subsequent bytes,

the CLRADDR line stays low.

Model 707, are buffered by LJ130.

4.5.2

Matrix configuration data is sent from the Model 707 via
the RELAY DATA control line and is serially loaded into
the 12 shift registers (U114 through U125). The matrix
card relays configure accordingly when the registers re­ceive the STROBE signal from the Model 707. A relay is
energized when a relay driver output WOO through
U113) is low (connected to digital common). A driver
output is low when a “high” data bit is clocked into it (i.e.
inverting drivers).

4.5.3

To prevent relays from inadvertently energizing and

causing possible damage during power up, a safeguard
circuit has been incorporated into the design. The protec­tion circuit is comprised of a dual NAND gate W129)
configured as a SET/RESET flip-flop and an RC network
(R102, Cl22 and CRlOl). The time constant of the RC net­work keeps the output of the NAND gate low during the
power up sequence. This low signal is applied to the OE
input of the shift registers keeping the relays de-ener­gized. After the capacitor of the RC network charges, a
STROBE signal will then force the output of the NAND
gate high allowing configured relays to energize.

Switching Circuitry

Power Up Safeguard

Figure 4-9.

4-12

CARDSEL 1

CLRADDR

NEXTADDR

CLK

IDDATA

ID Data Timing Diagram

r-l

u

SECTION 4

Service Information

4.6 SPECIAL HANDLING OF STATIC­SENSITIVE DEVICES

CMOS and other high-impedance devices are subject to
possible static discharge damage because of the high-im­pedance levels involved. The following precautions per-

tain specifically to static-sensitive devices. However,

since many devices in the Model 7076 are static-sensitive,

it is recommended that they all be treated as static-sensi­tive.

1. Such devices should be wansported and handled
only in containers specially designed to prevent or
dissipate static build-up. Typically, these devices
will be received in anti-static containers made of

plastic or foam. Keep these parts in their original
containers until ready for installation.

2. Remove the devices from their protective containers

only at a properly grounded workstation. Also
ground yourself with a suitable wrist strap while
working with these devices.

3. Handle the devices only by the body; do not touch

the pins.

4. Any printed circuit board into which the device is to
be inserted must firstbegrounded to the benchor ta­ble.

5. Use only anti-static type de-soldering tools and
grounded-tip soldering irons.

4.7 TROUBLESHOOTING

The Keithley Model 7070 Universal Adapter Card is an
extender card that allows access to circuit componentsof
the Model 7076 during troubleshooting. Also, Figure4-9,
which provides receptacle contact identification, is in­cluded as a troubleshooting aid.

4.7.1

Table 4-4 summarizes the equipment necessary for gen­eral troubleshooting.

Recommended Equipment

Table 4-4. Recommended Troubleshooting

Equipment

1 Description

4.7.2

In order to service the
remove the bottom shield. The bottom shield is secured
to the matrix card by eight screws. Simply remove these
screws and separate the shield from the PC-board. When
reinstalling the shield make sure the shield is oriented
such that the standoffs (staked onto the shield) are posi­tioned between the pc-board and the shield.

Table 4-5 outlines troubleshooting procedure for the ma­trix card.

Troubleshooting Procedure

matrix

1 Application

card, it may be necessary to

CAUTION

Contamination will degrade the perform­ance of the matrix card. To avoid contamina-

tion, always grasp the card by the handle and
side edges. Do not touch the edge connectors
of the card, and do not touch the board SUP
faces or components. On connectors, do not
touch areas adjacent to the electzical con­tacts.

CAUTION
If removing relays from the PC-board, care
must be taken to prevent traces from being
ripped off the board. Using a solder sucker,
make sure all solder is removed. Each relay
pin must move freely in the feed-through

hole. Also, make sore there are no burrs on
the ends of the relay pins.

4-13

SECTION 4

service lnfornlation

Cd 1 Gd 0 ,;
Col2Gd 0
Col3Gd “& ‘,;

24 0

N/C

Cd 1 HI

Co1 2

HI

Cal 3

HI

Cal 4

HI
Co15 HI
Cal 6 HI

Cal 7

HI

Co16 HI
Cal 9 HI
Col 10 HI
Co111 HI
Col 12 HI

-

Columnr

(A-D)

ROWS

Ii

il

I

Columns

(E W

II

-

View of receptacles

looking at Rear Panel

Row AGd 240

RowEHI

RowCGd

RowCGd

RowDHI *‘o y
RowEGd “0 ;
RowfGd

Row F HI

Row G Gd
Row G Gd

Row H HI

23

0

22

0 g

2’o :

180 2

y,

0

6

N/C

Row A HI

Row B Gd
Row B Gd
Row C HI
Row D Gd
Row D Gd
Row E HI
Row F Gd
Row F Gd

Row G HI
Row H Gd
Row H Gd

A) COLUMNS Receptacle

(1 of 2)

Fimre 4-10. D-sub Receatacle Contact Assimments

Table 4-5. Troubleshooting Summary*

;tep

Items/Component** Comment

­1

W152

2

w155
w150

3
4

w151

5

w149

6

w154

7

W156

8

w157

9

W158

10

UlOO through U113
pins 10 through 16

‘All measurements referenced to digital c~n,m~n (w153)
‘*W149 through WI58 are jumpers lacated on the pc-bard. See Component Location drawing (at end of Section 5) for jumper locations
‘*‘See Figure 48.

+6V supply +6V dc
+5v supply
CLR ADDR line***

NEXT ADDR line I**
Clk line 1.79MHz clock
ID Data line***
Power up safeguard
RELAY DATA line
STROBE line
Relay drivers

HI = High

Gd = Guard

N/C = No connection

Required Condition

+5V dc
High logic pulse at beginning of each card identification
byte transfer sequence (upon power up).
Low logic pulse before each byte transfer.

Card identification logic pulse train (on power up).
Remains low during power up.
Logic pulse train to load relay configuration registers.
High logic pulse to strobe relay configuration registers.

+6V for open crosspoints = OV for closed crosspoints. Note
that pin 10 on UlOO and U107 is not connected.

B) ROWS Receptacle

4-14

5.1 INTRODUCTION

SECTION 5

Replaceable Parts

l

Keithley Part number

This section contains a list of replaceable parts for the
Model 7076, as well as a component layout drawing and
schematic diagram of the matrix card..

5.2 PARTS LIST

Replaceable parts are listed in the Model 7076, Parts List.
Electrical parts are listed in order of circuit designation.

5.3 ORDERING INFORMATION

Toplaceanorder,or to obtaininformationconcemingre­placement parts, contact your Keithley representative or
the factory (see inside front cover for addresses). When
ordering parts, be sure to include the following informa­tion:

l

Matrix card model number (7076)

l

Card serial number

l

Part description

l

Circuit description, if applicable

5.4 FACTORY SERVICE

If the matrix card is to be returned to Keithley Instrument
for repair, perform the following:

1. Complete the service format the back of this manual
and include it with the card.

2. Carefully pack the card in the original packing car­ton

._...

3. Write ATTENTION REPAIR DEPARTMENT on the
shipping label.

NOTE
It is not necessary to return the matrix main­frame with the card.

5.5 COMPONENT LAYOUT AND SCHEMATIC DIAGRAM

The component layout and schematic diagram of the
Model 7076 follows the parts list.

5-1

MODEL 7076, PARTS LIST

CIRCUIT
DESIG.

C100..116
C117,118
Cl19
c120,121
Cl22
C123.124
CRldO
CR101
CR102

JlOOl..lOO3

DESCRIPTION

REAR PANEL ASSEMBLY
CHASSIS ASSEMBLY
CHIPLOC BAG
LABEL, CAUTION
CONN,BERG
INSTRUCTION MANUAL
PEM NUTS
HOLE SIZE
SOCKET,LC. 28 PIN
SHIELD, BOTTOM
HANDLE

CAP..lUF.20%.50V.CERAMIC
CAP;.OlUF,20%,50V,CERAMIC
CAP,.OlUF,lO%,l000V,CERAMIC
CAI’,270I’F,20%,100V,CERAMIC/FERRITE
CAP, 47UF,10%,16V,ALUM ELEC
CAP, lOUF,-20+100%,25V,ALUM ELEC
DIODE
DIODE,SILICON,IN4148 (DO-351
DIODE,SCHOTTKY, IN5711
SCREWLOCK, FEMALE, CS-721-1 TO PANEL

CONNECTOR, RIGHT ANGLE D-SUB SOCKET

KEITHLEY
PART NO.

7076-303A

7076-MECH-2
PO-14-6
MC-487

cs-339

7076-901-OlA
FA-135
7076-102B
SO-69

7075.306A
HH-33-1

C-365-.1
C-237-.01
c-64-.01
C-386-270P
C-321-47
c-314-10
RF-34
RF-28
RF-69
CS-725

CS-721-1A
K100..195
RllXl

RlOl
R102
R103
R104
R105

u100..113
U114..125
U126
U127
U128
u129
u130

WlOO
W101..124
W125..140,149..158

*ORDER FIRMWARE REVISION LEVEL INDICATED ON IC PACKAGE.

RELAY, ULTRA-SMALL POLARIZED TQ2E-5V
RES,lOK,5%,l/4W,COMPOSITION OR FILM

RES,2CD,5%,1/4W,COMPOSITION OR FILM
RES,47K,5%,1/4W,COMPOSITION OR FILM
RES.1lK.5%.1/4W.COMPOSITION OR FILM
RES;5.lK;5%,i/4ti,COMPOSITION GR FILM
RES,120K,5%,1/4W,COMPOSITION OR FILM

IC,DARLINGTON ARRAY,2003
IC, 8 BIT SHIFT LAT REG,74HC4094
IC, 12 STAGE BINARY COUNTER,74HCT4040
IC,8-BIT PARALLEL TO SERIAL,74HCT165
PROGRAMMED EPROM
IC, QUAD 2 INPUT NAND, 74HCTOO
IC, OCTAL BUFFER/LINE DRIVER, 74HC244

STIFFENER, BOARD
CONN,BERG,2 PIN
JUMPER

SUPPLIED ACCESSORY

CONNECTOR, JUMPER
POUCH

RL-136

R-76-10K

R-76-200

R-76-47K

R-76-1lK

R-76-5.1K

R-76-120K

IC-206

IC-713

IC-545

IC-548

7076-800-*

IC-399

IC-489

J-16

cs-339-2

J-15

CS-476

PO-1

Service Form

Model No.

Serial No. Date
Name and Telephone No.
Company

List all control settings, describe problem and check boxes that apply to problem.

0 Intermittent
0 IEEE failure

0 Front panel operational
Display or output (check one)

0 Drifts
0 Unstable
0 Overload

0 Calibration only
0 Data required
(attach any additional sheets as necessary)

Show a black diagram of your measurement system including all instruments connected (whether power is turned on or not).
Also, describe signal source.

0 Analog output follows display
a Obvious problem on power-up

0 All ranges or functions are bad

0 Unable to zero
0 Will not read applied input

0 Certificate of calibration required

0 Particular range or function bad; specify
0 Batteries and fuses are OK

0 Checked all cables

Where is the measurement being performed? (factory, controlled laboratory, out-of-doors, etc.)

What power line voltage is used?
Relative humidity?
Any additional information. (If special modifications have been made by the u6er, please describe.)

Other?

Ambient temperature?