Keithley 7072 Datasheet
7072 Semiconductor Matrix Card
8×12
The Model 7072 Semiconductor Matrix Card is designed specifically to handle
low-level and high- impedance measurements encountered in semiconductor
parametric tests on wafers and devices. This unique design provides two lowcurrent circuits with specified 1pA maximum offset current for sensitive subpicoamp measurement resolution, and two C-V paths for measurement of
Capacitance Voltage characteristics from DC to 1MHz. Four additional highquality signal paths with <20pA offset current provide for general-purpose
signal switching up to 100nA or 200V.
Connections are 3-lug triax with the outer shell connected to chassis for safety
and noise shielding. The center conductor is fully surrounded by the inner
conducting shield, so that fully guarded measurements can be made to
achieve higher isolation and to improve measurement speed and accuracy.
Isolation relays on the low-current and C-V paths automatically disconnect
unused circuits to achieve minimum interference and peak performance. The
707A or 708A mainframe allows each row (signal path) to be programmed for
Break-Before-Make or Make-Before-Break operation.
• Two sub-picoamp current paths
• Two DC to 1MHz C-V paths
• Four high isolation signal paths
• 3-lug triaxial connection
For applications requir-
ing connections to a
large number of devices or test points, the 7072
matrix can be expanded with additional cards. The
low-current and C-V rows can be extended to
other cards with coaxial jumpers. The other four
high-quality signal paths connect directly to the
707A backplane for expansion.
ACCESSORIES AVAILABLE
237-TRX-T 3-Lug Triax Tee Adapter
7078-TRX-BNC 3-Lug Triax to BNC Adapter
7078-TRX-3 3-Lug Triax Cable, 0.9m (3 ft)
7078-TRX-10 3-Lug Triax Cable, 3m (10 ft)
7078-TBC 3-Lug Female Triax Bulkhead Connector with Cap
Ordering Information
7072 8x12 Semiconductor
Extended warranty, service, and
Use with Model 707A and 708A switching matrix mainframes
calibration contracts are available
Accessories Supplied
Instruction manual and four
SMB expansion cables (CA-54-1)
HGC HGC HGC HGC HGC HG C HGC HGC HGC HGC HGC HG C
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Matrix Card
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CROSSPOINT CONFIGURATION: 2-pole Form A 2-pole Form A 1-pole Form A, Common Guard
OFFSET CURRENT: <1 pA <20 pA <20 pA
PATH ISOLATION: Resistance: >10
.
Capacitance (nominal): 0.4 pF 1 pF 0.6 pF
CROSSTALK
1 MHz, 50Ω load (typical): <–50 dB <–40 dB <–50 dB
3dB BANDWIDTH (typical),
50Ω Load: 15 MHz 8 MHz 5 MHz
RELAY DRIVE CURRENT (per crosspoint): 40 mA 60 mA 80 mA
User
connections
and backplane
expansion
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H
G
C
Low I
Paths
H
G
C
H
G
C
H
G
General
C
Purpose
H
Paths
G
C
H
G
C
H
G
C
C-V
H
Paths
G
C
LOW-CURRENT GENERAL-PURPOSE C-V
(ROWS A - B) (ROWS C - F) (ROWS G - H)
13
Ω >1012Ω >1012Ω
MATRIX CONFIGURATION: 8 rows by 12 columns.
CONNECTOR TYPE: 3-lug triaxial (Signal, Guard, Chassis).
MAXIMUM SIGNAL LEVEL: 200V, 1A carry/0.5A switched, 10VA peak (resistive load).
COMMON MODE VOLTAGE: 200V maximum between any
2 pins or chassis.
CONTACT LIFE:
Cold Switching: 10
At Maximum Signal Level: 10
PATH RESISTANCE (per conductor): <1Ω initial, <3.5Ω at end of contact life.
CONTACT POTENTIAL: <40µV per crosspoint (Signal to Guard).
RELAY SETTLING TIME: <15ms.
INSERTION LOSS (1MHz, 50Ω source, 50Ω load): 0.1dB typical.
EMC: Conforms to European Union Directive 89/336/EEC.
SAFETY: Conforms to European Union Directive 73/23/EEC (meets EN61010-1/IEC 1010).
ENVIRONMENT:
OFFSET CURRENT and PATH ISOLATION Specifications: 23°C, <60% R.H.
Operating: 0° to 50°C, up to 35°C at 70% R.H.
Storage: –25° to +65°C.
7
closures.
5
closures.
1.888.KEITHLEY (U.S. only)
SWITCHING & CONTROL
www.keithley.com
A GREATER MEASURE OF CONFIDENCE
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