SECTION 4
CHARTS AND DIAGRAMS
SCHEMATIC DIAGRAM NOTES
• Schematic safety precaution
! Parts are safety related parts.
When replacing them, be sure to use the specified parts.
• Voltage and waveform measurements
Voltage: Measured with digital voltmeter in DC range;
iris closed in REC mode.
Value in ( ) is indicated only in the case PB
voltage is different from that in REC mode.
Waveform: Gray scale illuminated at more than 2000 lux at
3200K lighting.
• Unit of value
Unless otherwise specified
1) Resistance is in Ω (1/6 W)
2) Capacitance is in µF
3) Inductance is in µH
• Expression of wiring
As the following circuit diagram is divided to print on some
sheets, such an indication as the following is found in the case
the wiring extends over two or more divided sections.
1) Circuit diagram divided into two or more sections:
• Wiring of connector
(Example)
16
To
DV MDA
CN5506
Page 4-30
CAM SW3
CAM SW2
In the above example, CN2 is connected with CN5506 on
CN2
20
19
16 DV MDA board.
• Signal flow on the diagram
The following allow marks indicate the specified signal
paths respectively.
: Recording or EE signal path
: Playback signal ptah
: Recording and Playback signal path
Board Board Name
02
03
A)
In the above case, the end of the wiring is connected to
the “HID 3” on the “sheet 2” section of the diagram.
MAIN
A/L/S
This indication that wiring extends to
“sheet 2” of the diagram.
Pg2
HID3
Signal name
Number of
divided sections
1/11 – 11/11
1/4 –4/4
• Others
In regard of a board assembly whose circuit is composed of
multilayered board patterns such 4- or 6-layered patterns, board
patterns of the inner layers are omitted in this section.
Note: For detail of each electrical part, refer to Section 6
“ELECTRICAL PARTS LIST” by it symbol number.
4-1
REPLACING SURFACE MOUNT “CHIP” COMPONENTS
• Some resistors, shorting jumpers (0 resistance), ceramic
capacitors, transistors, and diodes are chip parts. These chip
parts cannot be reused after they are once removed.
• Chip resistors used in some circuits are of high precision
type having little error in resistance.
To demonstrate the full capacity of this set, place an order
for proper parts referring to the diagrams and parts lists in
the section 5.
• Soldering cautions:
1) Do not apply heat for more than 3 seconds.
2) Avoid using a rubbing stroke when soldering.
3) Discard removed chips; do not reuse them.
4) Supplementary cementing is not required.
5) Use care not to scratch or otherwise damage the chips.
[2] Chip transistors and chip F.E.T.s
2SA
2SB
C
BE
2SC
2SD
(Top view) (Top view)
2SJ2SK
G
C
BE
G
CHIP PARTS PIN ARRANGEMENT
[1] Digital transistors
DTC 1
1 2 3
C
R1
R2
BE
DTA 1
DTB 1
1 2 3
C
R1
R2
BE
(Top view) (Top view)
Two digits show resistance of R1 in abbreviation.
1
43 : 4.7 kΩ
14 : 10 kΩ
24 : 22 kΩ
44 : 47 kΩ
Roman letter show the resistive ratio between R1 and R2
2
in abbreviation.
E : R2/R1 = 1/1
Y : R2/R1 = 5/1
W : R2/R1 = 2/1
X : R2/R1 = 1/2
T : R2 is opened.
Symbol the shape of resistor in abbreviation.
3
SD
SD
(Top view) (Top view)
[3] Chip diodes
MA143A/MA742 MA142WA MA142A
(Top view)(Top view) (Top view)
4-2
4.1 BOARD LOCATIONS
01 IS
20 IRIS
10 FOCUS
02 MAIN
RIGHT SIDE
06 REG03 A/L/S
15 JOG
07 SWR
04
MONITOR BL
11 M RELAY
06 REG
15 JOG
07 SWR
14 PON
22 LOCK 05 INPUT1
12 TALLY
19 EJECT2
09 ZOOM
18
EJECT1
17
17
REC TRG
REC TRG
18 EJECT1
REAR SIDE LEFT SIDE
13 CONNECT
21 TEMP
16 DV MDA
19 EJECT2
09 ZOOM
Board
No.
–
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
Board Name
OVERALL
IS
MAIN
A/L/S
MONITOR BL
INPUT1
REG
SWR
TOP ZOOM
ZOOM
FOCUS
M RELAY
TALLY
CONNECT
P ON
JOG
DV MDA
REC TRG
EJECT1
EJECT2
IRIS
TEMP
LOCK
Block diagram
–
4-36
4-36, 38
4-37,38
–
–
–
–
–
–
–
–
–
–
–
–
4-38
–
–
–
–
–
–
Page of diagram
Schematic diagram
4-4
4-24
4-5 to 4-15
4-18 to 4-21
4-33
4-32
4-28
4-32
4-32
4-4
4-4
4-33
4-4
4-27
4-4
4-4
4-30
4-4
4-4
4-4
4-4
4-4
4-4
Circuit board
–
4-25, 26
4-16, 17
4-22, 23
4-35
4-35
4-29
4-34
4-34
4-34
4-35
4-35
4-34
4-34
4-27
4-34
4-35
4-31
4-35
4-35
4-35
4-35
4-35
08 TOP ZOOM
TOP SIDE
4-3 4-3
4.3 MAIN BOARD SCHEMATIC DIAGRAM
1/11 (PRE/REC
)
FROM/TO ROTALY TRANS
OF DRUM ASSEMBLY
4-5 4-5
SC92711-1
MAIN BOARD SCHEMATIC DIAGRAM 2/11 (MSD
)
To
DV MDA
CN5506
Page 4-30
MSD CPU
IC3
PLSC1404
OPEN
FROM/TO
DV MECHANISM
ASSEMBLY
Q1
TO DEW SENSOR
4-6 4-6
SC92711-2
MAIN BOARD SCHEMATIC DIAGRAM 3/11 (DV MAIN
)
Pg 4, 6, 8, 10, 11
SC92711-3
4-7 4-7
MAIN BOARD SCHEMATIC DIAGRAM 4/11 (CAM CPU
NETWORK
PACK
)
IC402
PLSC1402
4-8 4-8
SC92711-4
MAIN BOARD SCHEMATIC DIAGRAM 5/11 (AFE
SUB2
To
IS CN1 Page 4-24
)
SUB3
SC92711-5
4-9 4-9
MAIN BOARD SCHEMATIC DIAGRAM 6/11 (PLD
IC562
)
Factory Use Only
RA563
NRZ0015-331
RA562
NRZ0015-331
RA561
NRZ0015-331
4-10 4-10
C592
0.1
R758
OPEN
R765
33
SC92711-6
MAIN BOARD SCHEMATIC DIAGRAM 7/11 (DBE
)
C669
C670
12p
12p
4-11 4-11
SC92711-7
MAIN BOARD SCHEMATIC DIAGRAM 8/11 (AF/LENS
)
IC905
4-12 4-12
SC92711-8