Jetway Computer NAF92-Q67 User Manual

USER'S MANUAL

Intel Q67 Express Chipset

Based

M/B for LGA 1155 Quad Core Ready

Intel Core Processor

No. G03-NAF92-F

Rev: 3.0

Release date: May 14

Trademark:

* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation use only , and ar e

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

, 2013

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

ENVIRONMENTAL PROTECTION ANNOUCEMENT..............................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 SPECIFICATION.........................................................................................................1

1-2 LAYOUT DIAGRAM....................................................................................................2

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................5

2-2 CONNECTORS AND HEADERS................................................................................11

2-2-1 REAR I/O BACK PANEL CONNECTORS....................................................11

2-2-2 MOTHERBOARD INTERNAL CONNECTORS............................................12

2-2-3 HEADER PIN DEFINITION ...........................................................................14

TABLE OF CONTENT

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERNING SETUP...................................................................................................18

3-2 BIOS MENU SCREEN ................................................................................................18

3-3 FUNCTION KEYS .......................................................................................................19

3-4 GETTING HELP ..........................................................................................................19

3-5 MENU BAR..................................................................................................................20

3-6 MAIN MENU................................................................................................................20

3-7 ADVANCED MENU.....................................................................................................21

3-8 CHIPSET MENU..........................................................................................................27

3-9 BOOT MENU...............................................................................................................29

3-10 SECURITY MENU.......................................................................................................30

3-11 SAVE & EXIT MENU...................................................................................................31

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

iii

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

3.0 Third Edition May 14th, 2013

Item Checklist

Motherboard

User’s Manual

DVD for motherboard utilities

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Specification

Spec Description Design Chipset

CPU Socket

(LGA1155 )

Memory Slot

Expansion Slots

Storage

Dual LAN Chip

z ATX form factor 4 layers; z Intel Q67 Express Chipset

z Intel® LGA1155 Socket

* For detailed CPU support information please visit our website

z DDRIII RAM module socket x 4 supporting four DDRIII

1333/1066MHz RAM Module expandable to 32 GB (Maximum)

z Support dual-channel function z 4 pcs *32-bit PCI slot z 1 pcs* PCI-Express 2.0 x16 slot z 1 pcs* PCI-Express 2.0 x4 slot z 1 pcs* PCI-Express 2.0 x1 slot z 1 pcs*Mini-PCI-E x 1 z Support four serial ATA2 ports z Support two serial ATA3 ports

Integrated Intel 82574L and 82579LM Gigabit Ethernet

LAN chip that supports Fast Ethernet LAN function of providing 10Mb/100Mb/1000Mb Ethernet data transfer rate

HD Audio Chip BIOS

Multi I/O

VIA VT 1705CE 6-channel HD Audio Codec integrated

z Audio driver and utility included z 64MB SMT Flash ROM

z PS/2 keyboard x1 z DVI Connector x1 z D-Sub 15-pin VGA Connector x1 z USB 2.0 connector x 6 z USB 2.0 headers x3 z RJ-45 LAN connector x2 z Serial port connector x1 z Audio connector x1 z Front panel header x1 z POWER LED header x1 z Speaker header x1 z Front panel audio header x1 z CDIN header x1 z GPIO header x1 z TPM 1.2 header x1 z CIR header x1 z HDMI-SPDIF header x1 z Parallel header x1 z TX-RX COM1 header x 1 z COM port header x 9

1-2 Layout Diagram

Rear IO Diagram

PS/2 KB/MS

Port

Serial Port

DVI Port

RJ-45 LAN Ports

Line-IN/ Optical SPDIF OUT

Line-OUT

MIC-IN

USB Ports

VGA Port

HDMI Port

USB Ports

Motherboard Internal Diagram

PS2 KB/MS Port

over

USB Ports

Serial Port over

HDMI port

SYS FAN1

ATX 12V Power

Connector

DDRIII DIMMx4

DVI port over

VGA Port

RJ-45 Over USB Ports

6-CH

Audio Connector

PCI Ex16 Slot

32-bit PCI Slots

HDMI S/PDIF Header

Front Panel

Audio Heade

PCIE x 4 Slots

PCIE x1 Slot

Parallel Header

CDIN Header

CPU Socket LGA1155

MINI PCIE

Slot

CASE OPEN

COM 2

TX-RX COM

Header

GPIO Heade

Intel Q67

Chipset

MSATA

Connector

USB1, USB2, USB3 Headers

TPM Header

ATX Powe

Connector

SATA1_2 Connectors

SATA3_4 Connectors

SATA5 Connecto

Speaker /PWR LED Headers

Front Panel Header COM3/COM5/COM7/COM9 (from left to right)

SYS FAN2

COM4/COM6/COM8/COM10

CIR Heade

JP9 J

Motherboard Jumper Position

P10

JP5

JBAT

P20

COPEN

P11

P13 JP15

P19

P18

Jumper

Jumper Name Description

JBAT CMOS RAM Clear Function Setting 3-pin Block JP3 USB Header Power On Function Setting 3-pin Block JP5 USB Port Power On Function Setting 3-pin Block JP8 COM1 Port Pin9 Function Selecting 6-pin Block JP9 COM2 RS232/485/422 Function Selecting 6-pin Block JP10 KB/MS/USB Power-On Function Setting 3-pin Block JP11 COM2 Header Pin9 Function Selecting 6-pin Block JP12 COM3 Header Pin9 Function Selecting 6-pin Block JP13 COM4 Header Pin9 Function Selecting 6-pin Block JP14 COM5 Header Pin9 Function Selecting 6-pin Block JP15 COM6 Header Pin9 Function Selecting 6-pin Block JP16 COM7 Header Pin9 Function Selecting 6-pin Block JP17 COM9 Header Pin9 Function Selecting 6-pin Block

P12

JP18 COM10 Header Pin9 Function Selecting 6-pin Block JP19 COM8 Header Pin9 Function Selecting 6-pin Block JP20 Mini PCI-E Power VCC3.3V/3.3V SB 3-pin Block Case_open Case Open Message Display Function Selecting 2pin Block

Connectors

Connector Name Description

KB/MS from UK1 PS2 Keyboard/Mouse Connector 6-pin Female VGA1 Video Graphic Attach Connector 15-pin Female DVI1 DVI Port Connector 24-pin Connector USB from UL1/UL2 USB Port Connectors 4-pin Connectors LAN from UL1/UL2 RJ-45 LAN Connectors 8-pin Connectors COM1 Serial Port COM Connector 9-pin Connector AUDIO Audio Connector 3-phone Jack ATXPWR ATX Power Connector 24-pin Block ATX12V1 ATX 12V Power Connector 8-pin Block SATA3_4/SATA5 SATAII Connectors 7-pin Connector

SATA1_2 SATAIII Connector 7-pin Connector

USB from UK1 USB Port Connectors 4-pin Connectors

HDMI High-Definition Multimedia Interface 19-pin Connector

Headers

Header Name Description

FP_AUDIO Front panel audio Headers 9-pin block CDIN CD Audio-In Header 4-pin Block SPEAK Speaker Header 4-pin Block PWRLED Power LED 3-pin Block JW_FP

(Front Panel Header)

PWR LED/ HD LED/ /Power Button /Reset 9-pin Block

USB1 USB1 Header 9-pin Block USB2 USB2 Header 9-pin Block CPUFAN,SYSFAN2 FAN Speed Headers 4-pin Block SYSFAN1 FAN Speed Header 3-pin Block GPIO_CON GPIO Header 10-pin Block COM2/3/4/5/6/7/8/9/10 Serial Port Headers 9-pin Block TX-RXCOM1 RS 232/422/485 port headers 4-pin block CIR CIR infrared module Headers 4-pin Block HDMI_SPDIF SPDIF Out header 2-pin Block TPM TPM Header 19-pin Block USB3 USB Header 9-pin Block CASE_OPEN Case Open Message Display Function 2-pin Block

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JBAT (3-pin): Clear CMOS

1 1 1

3 3

JBAT

1-2 Short： Normal

2-3 Short： Clear CMOS

CMOS Cl ear Setting

(2) JP3 (3-pin): USB Header Power On Function Setting

JP3

1-2 closed : USB Header POWER-ON Disabled(default)

JP3

2-3 closed: USB Header POWER-ON Enabled

*JP3 is for user to set USB1/USB2/USB3 header power on function.

(3) JP5 (3-pin): USB Port Power On Function Setting

JP5

1-2 closed : USB Port POWER-ON Disabled(default)

JP5

2-3 closed: USB Port P OW ER-ON Enabled

*JP5 is for user to set rear IO panel USB port (from UK1/UL1/UL2) power on function.

(4) JP8 (6-pin): COM1 Port Pin9 Function Selecting

JP8

1-2 closed: RS232

3-4 closed : +12V

5-6 closed : +5V

(5) JP9 (6-pin): COM2 Header RS232/485/422 Function Select

JP9

1-2 closed: RS232

3-4 closed : RS485

5-6 closed : RS422

(6)JP10 (6-pin): KB/MS/USB Power-On Function Setting

JP10

1-2 cl osed : KB/MS /U SB POWER-ON Disabled(defaul t)

JP10

2-3 closed: KB/MS/ USB POWER-ON Enabled

(7) JP11 (6-pin): COM2 Header Pin9 function select

JP11

1-2 closed: RS232

3-4 closed : +12V

(8) JP12 (6-pin): COM3 Header Pin9 function select

JP12

1-2 closed: RS232

3-4 closed : +12V

(9) JP13 (6-pin): COM4 Header Pin9 function select

5-6 closed : +5V

JP13

1-2 closed: RS232

3-4 closed : +12V

5-6 closed : +5V

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