Jetway Computer JBC381F39 User Manual

Technical Manual

Intel Celeron 1047UE/847 CPU

& Intel HM65 Chipset

Based

3.5’’ SBC

NO.G03-NF39-F

Revision: 1.0

Release date: June 7, 2013

Trademark:

* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation use only , and ar e

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

TABLE OF CONTENT

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv

USER’S NOTICE .......................................................................................................................v

MANUAL REVISION INFORMATION.......................................................................................v

ITEM CHECKLIST.....................................................................................................................v

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................9

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................15

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................22

3-2 BIOS MENU SCREEN ................................................................................................23

3-3 FUNCTION KEYS .......................................................................................................23

3-4 GETTING HELP ..........................................................................................................24

3-5 MEMU BARS...............................................................................................................24

3-6 MAIN MENU................................................................................................................25

3-7 ADVANCED MENU.....................................................................................................26

3-8 CHIPSET MENU..........................................................................................................34

3-9 BOOT MENU...............................................................................................................37

3-10 SECURITY MENU.......................................................................................................39

3-11 SAVE & EXIT MENU...................................................................................................40

iii

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition June 7, 2013

Item Checklist

Motherboard

User’s Manual

CD for motherboard utilities

Cable(s)

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Onboard Intel® Celeron Processor + Intel® HM65 Chipset, with low power



consumption never denies high performance

Support single channel DDRIII 1066/1333/1600 SODIMM, up to 8GB



Support 1 * SATAIII device



Onboard one CFast card slot



Onboard one full-size mSATA/ Mini-PCIE slot



Onboard 2 * RJ-45 gigabit Ethernet LAN ports



Integrated with 1 * 18-bit single channel LVDS header



Support USB 2.0 data transport demands



Support CPU Smart FAN



Compliance with ErP standard



Support Watchdog function



1-2 Specification

Spec

Design Chipset Embedded CPU

Memory Slot

Expansion Slots

LAN Chip

BIOS

Rear I/O

Description

3.5”SBC; 6 layers; PCB size: 14.8x 10.2 cm

Intel® HM65 Express chipset

Intel® Celeron 1047UE/847 CPU

1 * DDRIII SODIMM Slot for un-buffered Single Channel DDRIII

1066/1333/1600 MHz SDRAM, expandable to 8GB

CFAST card slot x1

Full-size Mini-PCIE/mSATA slot x1

Integrated with dual Realtek RTL8111F PCI-E Gigabit LAN chips

Support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

AMI 32MB Flash ROM

DC12V power-in connector x1

USB 2.0 port x 4

DVI-I port x1

RJ-45 LAN port x2

Audio Line Out port x1

SATAIII 6Gb/s port x1

SATA Power connector x1

CPU FAN header x1

LVDS inverter x1

Internal I/O

Front panel audio header x1

SPDIF Out header x1

Serial port header x4

GPIO header x1

9-pin USB 2.0 header x1 (Expansible to 2* USB 2.0 ports)

4-pin USB 2.0 header x1 (Expansible to 1* USB 2.0 port)

SM_BUS header x1

Front panel header x1

CIR header x1

LANLED header x2

LVDS header x1

1-3 Layout Diagram

Rear IO Panel Diagram:

RJ-45 LAN Ports

DVI-I Port

Line-Out Port

USB 2.0 Ports

DC12V

Power-in

Connector

USB 2.0 Ports

Internal Diagram-Front Side:

SPDIF Header

Line-Out Port

USB 2.0 Ports

DVI-I Port

LANLED Headers

RJ-45 LAN Port

USB 2.0 Ports

INVERTER

Mini-PCIE/mSATA Slot

Serial port Header

(COM1/2/3/4)

GPIO Header

Front Panel Audio Header

USB 2.0 Heade

CFast Slot

LVDS Header

SODIMM Slot

USB 2.0 Heade

SATA

Power Connector

SATA III Port

CIR Header

CPUFAN Header

Front Panel Heade

Power Switch Button

DC 12V Power-in

Connector

SM_BUS

Header

Reset Button

Internal Diagram-Back Side:

Intel CPU

Intel HM65 Chipset

JBAT

JP3J

Jumper Position:

COMP2

COMP1

COMP4

COMP3

Jumper

Jumper Name Description

JP1 INVERTER VCC 12V/5V Select 3-Pin Block JP3 LVDS PVCC 5V/3.3V Select 3-Pin Block JBAT1 CMOS RAM Clear Function Setting 3-Pin Block JCOMP1 COM1 Header Pin9 Function Select 6-Pin Block JCOMP2 COM2 Header Pin9 Function Select 6-Pin Block JCOMP3 COM3 Header Pin9 Function Select 6-Pin Block JCOMP4 COM4 Header Pin9 Function Select 6-Pin Block COPEN1 Case Open Message Display Function 2-pin Block

Connectors

Connector Name

DC12V1 DC 12V Power–in Connector USB1/2 USB 2.0 Port Connectors LAN1/2 RJ-45 LAN Port Connectors DVI1 DVI-I Port Connector AUDIO2 Audio Line Out Connector SATA1 SATAIII Port Connector PWOUT1 SATA Power out Connector CPUFAN1 CPUFAN Connector INVERTER LVDS Inverter Connector

Headers

Header Name Description

AUDIO1 SPDIF COM1/2/3/4 GPIO1 USB3 USB 2.0 header 9-pin block

Front Panel Audio Header 9-pin block

SPDIF Out Serial Port GPIO

Header 2-pin block

Headers

Header

9-pin block 10-pin block

USB4 USB 2.0 Header 4-pin block SM_BUS SM_BUS Header 4-pin Block JW_FP1

Front Panel Header(PWR LED/ HDD

LED/ /Power Button /Reset)

8-pin Block

CIR

LAN1_LED/LAN2_LED LAN Activity LED Headers 2-pin Block

LVDS1 24-bit LVDS Header 30-pin Block

CIR

Header

4-pin block

;

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JP1 (3-pin): INVERTER VCC 12V/5V Select

JP1

113

1-2 Cl osed:Inverter 12V Se lected

2-3 Closed :Inverter 5V Se lected

(2) JP3 (3-pin): LVDS PVCC 5V/3.3V Function Select

JP3

1-2 Closed: LVDS PVCC= 5V;

2-3 Closed : LVDS PVCC= 3.3V

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