Jetway Computer JBC231C9P User Manual

TECHNICAL MANUAL

Intel Cedar Trail-D & ICH10R Chipset

Based

Mini-ITX M/B for ATOM Processor

NO.

G03-NC9P-F

Revision: 1.0

Release date: December 31, 2012

Trademark:

* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation use only , and ar e

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................10

2-2-1 CONNECTORS .............................................................................................10

2-2-2 HEADERS .....................................................................................................12

TABLE OF CONTENT

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERNING SETUP...................................................................................................18

3-2 BIOS MENU SCREEN ................................................................................................19

3-3 FUNCTION KEYS .......................................................................................................19

3-4 GETTING HELP ..........................................................................................................20

3-5 MENU BAR..................................................................................................................20

3-6 MAIN MENU................................................................................................................21

3-7 ADVANCED MENU.....................................................................................................22

3-8 CHIPSET MENU..........................................................................................................27

3-9 BOOT MENU...............................................................................................................29

3-10 SECURITY MENU.......................................................................................................30

3-11 SAVE & EXIT MENU...................................................................................................31

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iii

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERI ES AN D WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition December 31, 2012

Item Checklist

Motherboard

User’s Manual

DVD for motherboard utilities

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Intel® Cedar Trail-D + ICH10R chipset + NVIDIA® N13M-GE1-B GPU

Support 2* DDRIII 800/1066MHz Single Channel up to 4GB

Support 5* Serial ATAII (3Gb/s) ports with RAID 0, 1, 5 & 10 function

Integrated Realtek ALC887 7.1-CH HD audio CODEC

Support HDMI, DP & DVI-I (Dual Link) Display output

Supports 1 * Realtek RT8111F Gigabit LAN

Support Watchdog function

Supports ACPI S3 Function

Support CPU Smart Fan function

Compliance with ErP standard

1-2 Specification

Spec Description

Design z

Embedded CPU

Chipset

GPU

Memory Slot

Storage

Ethernet LAN Chip

Audio Chip BIOS

Multi I/O

Mini-ITX form factor; PCB size: 17.0x17.0cm Intel® Cedar Trail-D Processor

Intel® ICH10R Express chipset

nVidia N13M-GE1-B

DDRIII SO-DIMM slot x 2

Support two DDRIII 800/1066 MHz Single Channel SO-DIMM

with memory capacity expandable to 4GB

5*Serial ATAII 3Gb/s with RAID 0, 1, 5 & 10

1*mSATA slot (Selectable with Mini PCI-E)

Integrated with Intel Realtek 8111F PCI-E Gigabit LAN chip

Support Fast Ethernet LAN function of providing

10/100/1000Mbps Ethernet data transfer rate

Realtek ALC887 7.1-channel Audio Codec integrated

Audio driver and utility included

AMI 16MB DIP Flash ROM

Rear Panel I/O:

HDMI port x1

DVI-I(Dual Link) port x1

DP port x1

Rear panel serial port x2 (COM2 for RS232/+12V/+5V)

RJ-45 LAN connector x1

Rear panel USB 2.0 port x4

Audio(7.1-CH) connector x1

DC 12V power in jack x1

Internal I/O Connectors& Headers

ATX 12V power connector x1

SATA power-out connector x1

Front panel audio header x1

9-pin USB 2.0 header x2(support 4USB 2.0 expansion ports)

JW Front panel x 1

z z z z z

1-3 Layout Diagram

Rear IO Diagram

USB 2.0 Ports

HDMI Port

PWRLED header x1 Speaker header x1 GPIO header x1 CIR header x 1 NICLED activity header x1

RJ-45 LAN Port

DVI-I Port

Display Port

COM1

USB 2.0 Ports

COM2

RS-OUT

Line-IN/SS-OUT

CS-OUT

Line-OUT

12V DC

Power-in Jack

MIC-IN

Optical S/PDIF-OUT

Motherboard Internal Diagram

play

SYSFAN2 Connector

USB 2.0 Ports over

HDMI Port

SYSFAN1 Connector

CPUFAN Header

DVI-I Port over

Dis

Port

Serial Ports

RJ-45 LAN Port over

USB 2.0 Ports

Audio

Connectors

12V DC

Power-in Jack

ATX12V Power Connector

NV 610 M

NIC LED Header

GPIO Heade

Front Panel Audio Header

GPU

MSATA Slot

Intel ICH10R Chipset

CIR Heade

TPM Heade

SODIMM1 Slot

Intel CPU

SATAII Ports

(SATA1/2/3/4/5)

SATA Power Out

USB 2.0 Headers

SODIMM2 Slot

Connector

Speaker Header Power

LED Header

Front Panel Header

Notice!

When installing only one SODIMM to the board, please always install it

in SODIMM2 slot, otherwise system won’t start.

Motherboard Jumper Position

JP1

JBAT

ASE_OPE

Jumper

Jumper Name Description

JBAT CMOS RAM Clear Function Setting 3-Pin Block JP1 COM2 Port Pin9 Function Select 6-Pin Block JP2 MINIPCIE Power 3.3V/ 3VSB Select 3-Pin Block CASE_OPEN Case Open Message Display Function 2-Pin Block

Connectors

Connector Name

HDMI High-Definition Multimedia Interface Port DP Display Port Connector DVI DVI-I(Dual Link) Port Connector COM1/COM2 Serial Port Connector x 2 USB1/UL1(Middle & Bottom) USB 2.0 Port Connector x 4 UL1 (Top) RJ-45 LAN Connector AUDIO RS-OUT /CS-OUT/Optical SPDIF OUT/

Line-in(SS-OUT)/Line-OUT/MIC DC12V-IN DC 12V Power in Connector ATX12V ATX Power Connector PWR SATA Port Power Out Connector SATA1/2/3/4/5 SATAII Port Connector x 5 MSATA Mini-SATA Port Slot (Selectable with Mini-PCIE Slot)

+ 25 hidden pages

Jetway Computer JBC231C9P User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual