intersil X9C303 User Manual

®
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Logarithmic Digitally Controlled Potentiometer (XDCP™)
Data Sheet January 24, 2007
Terminal Voltage ±5V, 100 T aps, Log Taper Description
The Intersil X9C303 is a digitally controlled potentiometer (XDCP). The device consists of a resistor array, wiper switches, a control section, and nonvolatile memory. The wiper position is controlled by a three-wire interface.
The resistor array is composed of 99 resistive elements. Between each element and at either end are tap points accessible to the wiper terminal. The position of the wiper element is controlled by the CS position of the wiper can be stored in nonvolatile memory and then be recalled upon a subsequent power-up operation.
The device can be used as a three-terminal potentio-meter or as a two-terminal variable resistor in a wide variety of applications ranging from control, to signal processing, to parameter adjustment. Digitally provide three powerful application advantages; (1) the variability and reliability of a solid-state potentiometer, (2) the flexibility of computer-based digital controls, and (3) the use of nonvolatile memory for potentiometer settings retention.
, U/D, and INC inputs. The
-
controlled potentiometers
Features
• Solid-state potentiometer
• Three-wire serial interface
• 100 wiper tap points
- Wiper position stored in nonvolatile memory and recalled on power-up
• 99 resistive elements, log taper
- Temperature compensated
- End to end resistance, 32kΩ ±15%
- Terminal voltages, ±5V
• Low power CMOS = 5V
-V
CC
- Active current, 3mA max.
- Standby current, 750µA max.
• High reliability
- Endurance, 100,000 data changes per bit
- Register data retention, 100 years
• Packages
- 8 Ld TSSOP
- 8 Ld SOIC
- 8 Ld PDIP
FN8223.1
Block Diagram
U/D INC
CS
V
CC
V
SS
7-Bit
Up/Down
Counter
7-Bit
Nonvolatile
Memory
Store and
Recall
Control
Circuitry
One
of
One­Hundred Decoder
99
98
97
96
RH/V
H
Transfer
Gates
2
1
0
Resistor
Array
RL/V
RW/V
L
W
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005, 2007. All Rights Reserved
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
X9C303
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Ordering Information
PART NUMBER PART MARKING TEMPERATURE RANGE (°C) PACKAGE PKG. DWG. #
X9C303P X9C303P 0 to +70 8 Ld PDIP MDP0031 X9C303PI X9C303P I -40 to +85 8 Ld PDIP MDP0031 X9C303PIZ (Note) X9C303P ZI -40 to +85 8 Ld PDIP (300 mil) (Pb-free) MDP0031 X9C303PZ (Note) X9C303P Z 0 to +70 8 Ld PDIP (300 mil) (Pb-free) MDP0031 X9C303S8* X9C303S 0 to +70 8 Ld SOIC (150 mil) MDP0027 X9C303S8I* X9C303S I -40 to +85 8 Ld SOIC (150 mil) MDP0027 X9C303S8IZ* (Note) X9C303S ZI -40 to +85 8 Ld SOIC (150 mil) (Pb-free) MDP0027 X9C303S8Z* (Note) X9C303S Z 0 to +70 8 Ld SOIC (150 mil) (Pb-free) MDP0027 X9C303V8* 9C303 0 to +70 8 Ld TSSOP (4.4mm) M8.173 X9C303V8I* C303 I -40 to +85 8 Ld TSSOP (4.4mm) M8.173 X9C303V8IZ* (Note) C303 IZ -40 to +85 8 Ld TSSOP (4.4mm) (Pb-free) M8.173 X9C303V8Z* (Note) 9CC303 Z 0 to +70 8 Ld TSSOP (4.4mm) (Pb-free) M8.173 X9C303S8I-2.7 X9C303S G -40 to +85 8 Ld SOIC (150 mil) MDP0027 X9C303S8IZ-2.7 (Note) X9C303S ZG -40 to +85 8 Ld SOIC (150 mil) (Pb-free) MDP0027
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
*Add "T1" suffix for tape and reel.
Pin Descriptions
VH and V
The high (VH) and low (VL) terminals of the device are equivalent to the fixed terminals of a mechanical potentiometer. The minimum voltage is –5V and the maximum is +5V. It should be noted that the terminology of V
and VH references the relative position of the terminal in
L
relation to wiper movement direction selected by the U/D input and not the voltage potential on the terminal.
V
W
VW is the wiper terminal, equivalent to the movable terminal of a mechanical potentiometer. The position of the wiper within the array is determined by the control inputs. The wiper terminal series resistance is typically 40Ω.
Up/Down (U/D)
The U/D input controls the direction of the wiper movement and whether the counter is incriminated or decremented.
Increment (INC)
The INC input is negative-edge triggered. Toggling INC will move the wiper and either increment or decrement the counter in the direction indicated by the logic level on the U/D
Chip Select (CS)
The device is selected when the CS input is LOW. The current counter value is stored in nonvolatile memory when CS the store operation is complete the device will be placed in the low power standby mode until the device is selected once again.
L
input.
is returned HIGH while the INC input is also HIGH. After
Pinout
X9C303
(8 LD SOIC, 8 LD TSSOP, 8 LD PDIP)
INC
(CS)
(V
)
U/D
CC
)
(INC
V
H
(U/D
)
V
SS
TOP VIEW
1
2
X9C303
3
4
Pin Names
SYMBOL DESCRIPTION
V
H
V
W
V
L
V
SS
V
CC
U/D INC
CS NC No Connection
High Terminal (Potentiometer) Wiper Terminal (Potentiometer) Low Terminal (Potentiometer) Ground Supply Voltage Up/Down Control Input Increment Control Input Chip Select Control Input
8
7
6
5
CS
V
V
CC
L
W
L
(V
)
W
)
(V
SS
(V
)
H
(V
)
V
2
FN8223.1
January 24, 2007
X9C303
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Potentiometer Relationships
S100
V
H
(VS)
R99
R98
R2
R1
V
L
Gi20Log
R1R2. . . R
(Refer Test Circuit 1)
R1R2. . . R
-------------------------------------------------
+++ R
S99
S98
S3
S2
S1
+++
R
TOTAL
=
99
TOTAL
V
W
V
i
W
--------- VL0V=()== V
S
Principles of Operation
There are three sections of the X9C303: the input control, counter and decode section; the nonvolatile memory; and the resistor array. The input control section operates just like an up/down counter. The output of this counter is decoded to turn on a single electronic switch connecting a point on the resistor array to the wiper output. Under the proper conditions the contents of the counter can be stored in nonvolatile memory and retained for future use. The resistor array is comprised of 99 individual resistors connected in series. At either end of the array and between each resistor is an electronic switch that transfers the potential at that point to the wiper.
The wiper, when at either fixed terminal, acts like its mechanical equivalent and does not move beyond the last position. That is, the counter does not wrap around when clocked to either extreme.
The electronic switches on the device operate in a “make before break” mode when the wiper changes tap positions. If the wiper is moved several positions, multiple taps are connected to the wiper for t R
value for the device can temporarily be reduced by a
TOTAL
significant amount if the wiper is moved several positions.
(INC to VW change). The
IW
Instructions and Programming
The INC, U/D and CS inputs control the movement of the wiper along the resistor array. With CS selected and enabled to respond to the U/D HIGH to LOW transitions on INC (depending on the state of the U/D
set LOW the device is
and INC inputs.
will increment or decrement
input) a seven-bit counter. The output of this counter is decoded to select one of one­hundred wiper positions along the resistive array.
The value of the counter is stored in nonvolatile memory whenever CS
transitions HIGH while the INC input is also
HIGH. The system may select the X9C303, move the wiper, and
deselect the device without having to store the latest wiper position in nonvolatile memory. The wiper movement is performed as described above; once the new position is reached, the system would the keep INC CS
HIGH. The new wiper position would be maintained until
LOW while taking
changed by the system or until a power-down/up cycle recalled the previously stored data.
This would allow the system to always power-up to a preset value stored in nonvolatile memory; then during system operation minor adjustments could be made. The adjustments might be based on user preference: system parameter changes due to temperature drift, etc...
The state of U/D
may be changed while CS remains LOW. This allows the host system to enable the device and then move the wiper up and down until the proper trim is attained.
Mode Selection
CS INC U/D MODE
L H Wiper Up L L Wiper Down
H X Store Wiper Position
H X X Standby Current
L X No Store, Return to Standby L H Wiper Up (not recommended) L L Wiper Down (not recommended)
When the device is powered-down, the last counter position stored will be maintained in the nonvolatile memory. When power is restored, the contents of the memory are recalled and the counter is reset to the value last stored.
3
FN8223.1
January 24, 2007
Symbol Table
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WAVEFORM INPUTS OUTPUTS
X9C303
Must be steady
May change from Low to High
May change from High to Low
Don’t Care: Changes Allowed
N/A Center Line
Typical Electrical Taper
100.0%
90.0%
80.0%
70.0%
60.0%
50.0%
Will be steady
Will change from Low to High
Will change from High to Low
Changing: State Not Known
is High Impedance
40.0%
30.0%
% TOTAL RESISTANCE
20.0%
10.0%
0.0%
R(VH - VW) R(V
W
0
- VL)
Test Circuit #1
V
S
3
6
9
1215182124273033363942
Test Circuit #2
V
H
Test Point
V
W
V
L
V
V
4851545760636669727578818487909396
45
TAP
Circuit #3 SPICE Macro Model
H
R
Test Point
V
W
Force
L
Current
H
C
10pF
R
H
TOTAL
R
99
R
L
C
C
W
25pF
W
L
10pF
4
FN8223.1
January 24, 2007
X9C303
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Absolute Maximum Ratings Recommended Operating Conditions
Temperature Under Bias . . . . . . . . . . . . . . . . . . . . .-65°C to +135°C
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage on CS Voltage on V ΔV = |V
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . .+300°C
Wiper Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1mA
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
, INC, U/D and VCC with Respect to VSS . -1V to +7V
and VL Referenced to VSS . . . . . . . . . . . . -8V to +8V
H
- VL| X9C303 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10V
H
Analog Specifications Over recommended operating conditions unless otherwise specified.
SYMBOL PARAMETER TEST CONDITIONS
R
TOTAL
V
V
R
C
H/CL/CW
(Note 3)
H
L
W
End-to-End Resistance 32 κΩ End-to-End Resistance Tolerance -15 +15 %
Terminal Voltage -5 +5 V
V
H
Terminal Voltage -5 +5 V
V
L
Wiper Resistance Max Wiper Current ±1mA 40 100 Ω Tap position relative step size error Error = log (Vw(n)) - log (Vw(n - 1))
for tap n = 2 - 99, V
Resistor Noise At 1kHz 23 nV(RMS)/
Charge Pump Noise At 2.5MHz 20 mV(RMS) End-to-End Resistance
Temperature Coefficient Ratiometric Temperature Coefficient Tap position 84 ±20 ppm/°C Potentiometer Capacitance See Circuit 3 10/10/25 pF
T = -40°C to +85°C ±400 ppm/°C
Commercial Temperature Range. . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +85°C
Military Temperature Range. . . . . . . . . . . . . . . . . . .-55°C to +125°C
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
Power Rating at +25°C X9C303 . . . . . . . . . . . . . . . . . . . . . . .10mW
Physical Characteristics
Marking Includes Manufacturer’s Trademark Resistance Value or Code Date Code
LIMITS
TYP
H-VL
= 10V
(NOTE 1)
0.005 0.115 dB
MAX
UNITMIN
Hz
DC Electrical Specifications Over recommended operating conditions unless otherwise specified.
SYMBOL PARAMETER TEST CONDITIONS
I
CC
I
SB
I
LI
V
IH
V
IL
C
(Note 3) CS
IN
Vcc Active Current CS
Standby Supply Current CS
, INC, U/D Input Leakage Current VIN = VSS to V
CS
, INC, U/D Input HIGH Voltage 2 V
CS
, INC, U/D Input LOW voltage 0.8 V
CS
, INC, U/D Input Capacitance VCC = 5V, VIN = VSS,
= VIL, U/D = VIL or VIH and
= 0.4V to 2.4V @ Max t
INC
= VCC - 0.3V , U/D and INC =VSS or
VCC - 0.3V
CC
TA = +25°C, f = 1MHz
CYC
5
LIMITS
TYP
(NOTE 1)
13mA
200 750 µA
-10 +10 µA
10 pF
MAX
UNITMIN
FN8223.1
January 24, 2007
X9C303
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DC Electrical Specifications Over recommended operating conditions unless otherwise specified. (Continued)
LIMITS
TYP
SYMBOL PARAMETER TEST CONDITIONS
EEPROM SPECS
EEPROM Endurance Wiper storage operations over
recommended operation conditions
EEPROM Retention At +55°C 100 Years
100,000 Cycles
Standard Parts
PART NUMBER MAXIMUM RESISTANCE WIPER INCREMENTS MINIMUM RESISTANCE
X9C303 32kΩ Log Taper 40Ω Typical
NOTES:
1. Typical values are for T
= +25°C and nominal supply voltage.
A
A.C. Conditions of Test
Input pulse levels 0V to 3V Input rise and fall times 10ns Input reference levels 1.5V
(NOTE 1)
MAX
UNITMIN
AC Electrical Specifications Over recommended operating conditions unless otherwise specified.
LIMITS
SYMBOL PARAMETER
t
Cl
t
lD
t
DI
t
lL
t
lH
t
lC
t
CPH
t
(Note 3) INC
IW
t
CYC
t
(Note 3) INC
R, tF
t
(Note 3) Power-up to Wiper Stable 500 µs
PU
tR V
CC
(Note 3) V
to INC Set-up 100 ns
CS
HIGH to U/D Change 100 ns
INC U/D to INC Set-up 2.9 µs
LOW Period 1 µs
INC
HIGH Period 1 µs
INC INC Inactive to CS Inactive 1 µs
Deselect Time 20 ms
CS
to VW Change 100 µs Cycle Time 2 µs
INC
Input Rise and Fall Time 500 ns
Power-up Rate 0.2 50 mV/µs
CC
UNITMIN TYP (Note 2) MAX
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FN8223.1
January 24, 2007
A.C. Timing
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CS
INC
X9C303
t
CYC
t
CI
t
IL
t
IH
t
IC
t
CPH
90% 90%
10%
U/D
V
t
ID
t
IW
W
t
DI
(Note 4)
MI
NOTES:
2. Typical values are for T
= +25°C and nominal supply voltage.
A
3. This parameter is not 100% tested.
4. MI in the A.C. timing diagram refers to the minimum incremental change in the V
t
F
output due to a change in the wiper position.
W
t
R
7
FN8223.1
January 24, 2007
X9C303
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Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX AREA
123
0.05(0.002)
-A­D
e
b
0.10(0.004) C AM BS
NOTES:
1. These package dimensions are within allowable dimensions of JEDEC MO-153-AC, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen­sion at maximum material condition. Minimum space between protru­sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
E1
-B-
SEATING PLANE
A
-C-
M
0.25(0.010) BM M
E
α
A1
0.10(0.004)
GAUGE PLANE
0.25
0.010
A2
L
c
M8.173
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.047 - 1.20 -
A1 0.002 0.006 0.05 0.15 -
A2 0.031 0.051 0.80 1.05 -
b 0.0075 0.0118 0.19 0.30 9
c 0.0035 0.0079 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.169 0.177 4.30 4.50 4
e 0.026 BSC 0.65 BSC -
E 0.246 0.256 6.25 6.50 -
L 0.0177 0.0295 0.45 0.75 6
N8 87
o
α
0
o
8
o
0
o
8
Rev. 1 12/00
NOTESMIN MAX MIN MAX
-
8
FN8223.1
January 24, 2007
Small Outline Package Family (SO)
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A
D
NN
(N/2)+1
X9C303
h X 45°
PIN #1
E
C
SEATING PLANE
0.004 C
E1
B
0.010 BM CA
I.D. MARK
1
e
0.010 BM CA
(N/2)
c
SEE DETAIL “X”
L1
H
A2
GAUGE PLANE
A1
b
DETAIL X
L
4° ±4°
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
SYMBOL SO-8 SO-14
A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX -
A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 ±0.003 ­A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 ±0.002 -
b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 ±0.003 -
c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 ±0.001 ­D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 ±0.004 1, 3 E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 ±0.008 -
E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 ±0.004 2, 3
e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic ­L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 ±0.009 -
L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic -
h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference -
N 8 14 16 16 20 24 28 Reference -
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
SO16
(0.150”)
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28) TOLERANCE NOTES
A
0.010
Rev. L 2/01
9
FN8223.1
January 24, 2007
Plastic Dual-In-Line Packages (PDIP)
www.BDTIC.com/Intersil
X9C303
SEATING PLANE
D
A2
A
L
L
e
b
A1
NOTE 5
c
E
eA
eB
N
PIN #1
E1
INDEX
12 N/2
b2
MDP0031
PLASTIC DUAL-IN-LINE PACKAGE
SYMBOL PDIP8 PDIP14 PDIP16 PDIP18 PDIP20 TOLERANCE NOTES
A 0.210 0.210 0.210 0.210 0.210 MAX
A1 0.015 0.015 0.015 0.015 0.015 MIN
A2 0.130 0.130 0.130 0.130 0.130 ±0.005
b 0.018 0.018 0.018 0.018 0.018 ±0.002
b2 0.060 0.060 0.060 0.060 0.060 +0.010/-0.015
c 0.010 0.010 0.010 0.010 0.010 +0.004/-0.002
D 0.375 0.750 0.750 0.890 1.020 ±0.010 1
E 0.310 0.310 0.310 0.310 0.310 +0.015/-0.010
E1 0.250 0.250 0.250 0.250 0.250 ±0.005 2
e 0.100 0.100 0.100 0.100 0.100 Basic
eA 0.300 0.300 0.300 0.300 0.300 Basic
eB 0.345 0.345 0.345 0.345 0.345 ±0.025
L 0.125 0.125 0.125 0.125 0.125 ±0.010
N 8 14 16 18 20 Reference
NOTES:
1. Plastic or metal protrusions of 0.010” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions E and eA are measured with the leads constrained perpendicular to the seating plane.
4. Dimension eB is measured with the lead tips unconstrained.
5. 8 and 16 lead packages have half end-leads as shown.
Rev. B 2/99
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implic atio n or other wise u nde r any p a tent or patent rights of Intersil or its subsidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
FN8223.1
January 24, 2007
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