intersil HA-5101-883 DATA SHEET

®

www.BDTIC.com/Intersil

HA-5101/883

Data Sheet August 17, 2005 FN3931.1

Low Noise, High Performance Operational
Amplifier

The HA-5101/883 is a dielectrically isolated operational
amplifier featuring low noise and high performance. This
amplifier has an excellent noise voltage density of

4.5nV/√Hz
HA-5101/883 yields a 10MHz unity gain bandwidth and a
6V/µs slew rate.

DC characteristics of the HA-5101/883 assure accurate
performance. The 3mV (max) offset voltage is externally
adjustable and offset voltage drift is just 3µV/°C. Low bias
currents (200nA max) reduce input current errors and the
high open loop voltage gain of 100kV/V, over temperature,
increases the loop gain for low distortion amplification.

The HA-5101/883 is ideal for audio applications, especially
low-level signal amplifiers such as microphone, tape head
and preamplifiers. Additionally, it is well suited for low
distortion oscillators, low noise function generators and high
Q filters.

(max) at 1kHz. The unity gain stable

Features

• This Circuit is Processed in Accordance to MIL-STD-883
and is Fully Conformant Under the Provisions of
Paragraph 1.2.1.

• Low Noise Voltage @ 1kHz . . . . . . . . . . . 4.5nV/√Hz

• Low Noise Current @ 1kHz . . . . . . . . . . . . . 3pA/√Hz

Max

Max

• Wide Unity Gain Bandwidth . . . . . . . . . . . . . . .10MHz Min

• High Gain (Full Temp) . . . . . . . . . . . . . . . . . .100kV/V Min

(Room Temp) . . . . . . . . . . . . . . . . . 1MV/V Typ

• Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V/µs Min

• High CMRR/PSRR (Full Temp) . . . . . . . . . . . . . 80dB Min

• High Output Drive Capability (Full Temp). . . . . . . . . 25mA

Applications

• High Quality Audio Preamplifiers

• High Q Active Filters

• Low Noise Function Generators

• Low Distortion Oscillators

• Low Noise Comparators

Pinouts

BAL

-IN

+IN

HA7-5101/883 (CERDIP)

TOP VIEW

1

2

3

4

V-

Ordering Information

TEMP.

PART NUMBER

HA7-5101/883 -55 to 125 8 Ld CerDIP F8.3A

5962-89636012A -55 to 125 20 Ld Ceramic LCC J20.A

8NC

NC

V+

-

+

7

OUT

6

5

BAL

-IN

NC

+IN

NC

RANGE (°C) PACKAGE

5962-896360 (CLCC)

TOP VIEW

NC

BAL

NC

NC

3212019

4

5

6

7

8

NC

-

+

10 11 12 139

V-

NC

BAL

NC

NC

NC

18

V+

17

NC

16

OUT

15

NC

14

PKG.

DWG. #

1

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

| Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

Copyright © Intersil Americas Inc. 1994, 2005. All Rights Reserved

HA-5101/883

www.BDTIC.com/Intersil

Absolute Maximum Ratings Thermal Information

Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 40V

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V

Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . V+ to V-

Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25mA

Output Short Circuit Duration. . . . . . . . . . . . . . . . . . . . . . . Indefinite

Junction Temperature (T

Storage Temperature Range. . . . . . . . . . . . . . . . . .-65°C to +150°C

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .<2000V

Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . .+300°C

). . . . . . . . . . . . . . . . . . . . . . . . . . .+175°C

J

Thermal Resistance θ

Ceramic DIP Package . . . . . . . . . . . . . 120 30

Ceramic LCC Package. . . . . . . . . . . . . 86 26

Package Power Dissipation Limit at +75°C for T

Ceramic DIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.22W

Ceramic LCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.35W

Package Power Dissipation Derating Factor Above +75°C

Ceramic DIP Package . . . . . . . . . . . . . . . . . . . . . . . . .12.2mW/°C

Ceramic LCC Package. . . . . . . . . . . . . . . . . . . . . . . . .13.5mW/°C

Operating Conditions

Operating Temperature Range . . . . . . . . . . . . . . . -55°C to +125°C

Operating Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . ±5V to ±15V

≤ 1/2 (V+ - V-)

V

INcm

≥ 500Ω

R

L

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

TABLE 1. D.C. ELECTRICAL PERFORMANCE CHARACTERISTICS

Device Tested at: V

PARAMETER SYMBOL TEST CONDITIONS

Input Offset Voltage V

Input Bias Current +I

Input Offset Current I

Common Mode Range +CMR V+ = 3V

Large Signal Voltage Gain +A

Common Mode Rejection Ratio +CMRR ∆V

= ±15V, RS = 100Ω, RL = 500kΩ, V

S

VCM = 0V 1 +25 -3 3 mV

IO

VCM = 0V

B

-I

B

IO

-CMR V+ = 27V

VOL

-A

VOL

-CMRR ∆V

= 100kΩ

+R

S

-RS = 100Ω

VCM = 0V
+R

= 100Ω

S

-RS = 100kΩ

VCM = 0V

= 100kΩ

+R

S

-RS = 100kΩ

V- = -27V

V- = -3V

V

= 0V and +10V

OUT

= 2kΩ

R

L

V

= 0V and −10V

OUT

= 2kΩ

R

L

CM

V+ =+5V
V- = -25V

= -10V

V

OUT

CM

V+ = +25V
V- = -5V

= +10V

V

OUT

= +10V

= -10V

= 0V, Unless Otherwise Specified

OUT

GROUP A

SUBGROUP TEMP (°C)

2, 3 +125, -55 -4 4 mV

1 [phone] nA

2, 3 +125, -55 -325 325 nA

1 [phone] nA

2, 3 +125, -55 -325 325 nA

1+25-7575nA

2, 3 +125, -55 -125 125 nA

1 +25 12 - V

2, 3 +125, -55 12 - V

1 +25 - -12 V

2, 3 +125, -55 - -12 V

4 +25 100 - kV/V

5, 6 +125, -55 100 - kV/V

4 +25 100 - kV/V

5, 6 +125, -55 100 - kV/V

1 +25 80 - dB

2, 3 +125, -55 80 - dB

1 +25 80 - dB

2, 3 +125, -55 80 - dB

(°C/W) θJC (°C/W)

JA

≤ +175°C

J

LIMITS

UNITSMIN MAX

2

FN3931.1

August 17, 2005

TABLE 1. D.C. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)

www.BDTIC.com/Intersil

Device Tested at: V

= ±15V, RS = 100Ω, RL = 500kΩ, V

S

PARAMETER SYMBOL TEST CONDITIONS

Output Voltage Swing +V

Output Current +I

OUT1RL

-V

OUT1RL

+V

OUT2VS

-V

OUT2VS

OUT

-I

OUT

R

R

V
V

V
V

Quiescent Power Supply Current +I

-I

CC

CC

V
I

OUT

V
I

OUT

Power Supply Rejection Ratio +PSRR ∆V

V+ = +10V, V- = -15V
V+ = +20V, V- = -15V

-PSRR ∆V

V+ = +15V, V- = -10V
V+ = +15V, V- = -20V

Offset Voltage Adjustment +V

Adj Note 4

IO

R
A

Adj 1 +25 VIO+1 - mV

-V

IO

HA-5101/883

= 0V, Unless Otherwise Specified

OUT

GROUP A

SUBGROUP TEMP (°C)

= 2kΩ 1 +25 12 - V

2, 3 +125, -55 12 - V

= 2kΩ 1 +25 - -12 V

2, 3 +125, -55 - -12 V

= ±18V
= 600Ω

L

= ±18V
= 600Ω

L

= -15V

OUT

= ±18V

S

= +15V

OUT

= ±18V

S

= 0V

OUT

= 0mA

= 0V

OUT

= 0mA

= 10V

S

1 +25 15 - V

2, 3 +125, -55 15 - V

1 +25 - -15 V

2, 3 +125, -55 - -15 V

1 +25 25 - mA

2, 3 +125, -55 25 - mA

1 +25 - -25 mA

2, 3 +125, -55 - -25 mA

1+25-6mA

2, 3 +125, -55 - 6 mA

1+25-6-mA

2, 3 +125, -55 -6 - mA

1 +25 80 - dB

2, 3 +125, -55 80 - dB

= 10V

S

1 +25 80 - dB

2, 3 +125, -55 80 - dB

1+25V

= 2kΩ, CL = 50pF

L

= +1V/V

V

2, 3 +125, -55 V

2, 3 +125, -55 V

LIMITS

-1 - mV

IO

-1 - mV

IO

+1 - mV

IO

UNITSMIN MAX

TABLE 2. A.C. ELECTRICAL PERFORMANCE CHARACTERISTICS

Device Tested at: V

= ±15V, RS = 50Ω, RL = 2kΩ, CL = 50pF, A

S

= +1V/V, Unless Otherwise Specified

VCL

GROUP A

PARAMETER SYMBOL TEST CONDITIONS

Slew Rate +SR V

-SR V

Rise and Fall Time t

R

t

F

Overshoot +OS V

= -3V to +3V 4+256-V/µs

OUT

= +3V to -3V 4+256-V/µs

OUT

V

= 0V to +200mV

OUT

10% ≤ t

V
10% ≤ t

≤ 90%

R

= 0V to -200mV

OUT

≤ 90%

F

= 0V to +200mV 4+25-35%

OUT

SUBGROUP TEMP (°C)

4 +25 - 200 ns

5, 6 +125, -55 - 400 ns

4 +25 - 200 ns

5, 6 +125, -55 - 400 ns

5, 6 +125, -55 - 35 %

-OS V

= 0V to -200mV 4+25-35%

OUT

5, 6 +125, -55 - 35 %

3

LIMITS

UNITSMIN MAX

FN3931.1

August 17, 2005

HA-5101/883

www.BDTIC.com/Intersil

Device Characterized at: V

PARAMETER SYMBOL TEST CONDITIONS NOTES TEMP (°C)

Differential Input Resistance R

Low Frequency Peak-to-Peak Noise E

Input Noise Voltage Density E

Input Noise Current Density I
Unity Gain Bandwidth UGBW VO = 100mV 1 +25 10 - MHz
Full Power Bandwidth FPBW V

Minimum Closed Loop Stable Gain CLSG 1 -55 to +125 +1 - V/V

Output Resistance R

Quiescent Power Consumption PC V

NOTES:

1. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These parameters
are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by characterization based upon
data from multiple production runs which reflect lot to lot and within lot variation.

2. Full Power Bandwidth guarantee based on Slew Rate measurement using FPBW = Slew Rate/(2πV

3. Quiescent Power Consumption based upon Quiescent Supply Current test maximum. (No load on outputs.)

4. Offset adjustment range is [V

TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS

IN

nP-P

n

OUT

IO (Measured)

= ±15V, RL = 2kΩ, CL = 50pF, AV = +1, Unless Otherwise Specified

S

VCM = 0V 1 +25 250 - kΩ

0.1Hz to 10Hz 1+25-0.2µV
RS = 20Ω, fo = 1000Hz 1 +25 - 4.5 nV/√Hz

n

RS = 2MΩ, fo = 1000Hz 1 +25 - 3 pA/√Hz

= 10V 1, 2 +25 95 - kHz

PEAK

Open Loop 1 +25 - 150 Ω

= 0V, I

OUT

±1mV] minimum referred to output. This test is for functionality only to assure adjustment through 0V.

= 0mA 1, 3 -55 to +125 - 180 mW

OUT

PEAK

LIMITS

UNITSMIN MAX

).

P-P

TABLE 4. ELECTRICAL TEST REQUIREMENTS

MIL-STD-883 TEST REQUIREMENTS SUBGROUPS (SEE TABLES 1 & 2)

Interim Electrical Parameters (Pre Burn-in) 1

Final Electrical Test Parameters 1*, 2, 3, 4, 5, 6

Group A Test Requirements 1, 2, 3, 4, 5, 6

Groups C & D Endpoints 1

*PDA applies to Subgroup 1 only.

4

FN3931.1

August 17, 2005

HA-5101/883

www.BDTIC.com/Intersil

t

R

5

t

F

t

R

t

F

FN3931.1

August 17, 2005

Burn-in Circuits

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HA-5101/883

CERAMIC MINI-DIP

1

2

3

V-

D2C2R

4

1

-

+

CERAMIC LCC

8

7

6

5

C

C

3

1

V+

D

1

NOTES:

= 1MΩ, ±5%, 1/4W (Min)

R

1

C

= C2 = 0.01µF/Socket (Min) or 0.1µF/Row, (Min)

1

= 0.01µF/Socket, 10%

C

3

= D2 = 1N4002 or Equivalent/Board

D

1

(V+) - (V-) = 30V

6

FN3931.1

August 17, 2005

Schematic

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HA-5101/883

-IN
D

D

2

1

+IN

V+

R

19A

R

R

36

Q

36

22

Q

22

Q

19B

R

24

Q

24

R

35

R

37

Q

37

Q

35

Q

21

R

20

Q

20

Q

R

19A

R

25

19B

R

23

Q

23

Q

25

Q

L41

Q

45

Q

L2

Q2AQ2BQ

10

R

10

Q

Q33Q

Q

12

46

32

R

12

Q

31

Q

Q

3

27

R

27

Q

44

Q

41

Q

Q

11

R

11

BAL

30

R

3A

3.65K

R

38

830

R

26

Q

26

Q

R

34

Q

43

Q

29

Q

38

L1

Q

1B

Q

1A

R

60

Q

47

Q

C

Q

5

Q

9

Q

34

R

4A

Q

3.65K

39

R

4B

830

Q

6

Q

4

Q

Q

Q

49

50

Q

1

7

C

2

R

58

Q

Q

48

51

R

28

Q

28

Q

16

Q

Q

14

15

8

R

15

OUTPUT

8

Q

42

Q

8

R

13

18

17A

Q

17

R

18

V-

BAL

7

FN3931.1

August 17, 2005

Die Characteristics

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DIE DIMENSIONS

70 X 70 X 19 mils ±1mil
1790 x 1780 x 483µm ±25.4µm

METALLIZATION

Type: AI, 1% Cu
Thickness: 16k

GLASSIVATION

Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12k
Nitride Thickness: 3.5kÅ ±1.5kÅ

WORST CASE CURRENT DENSITY:

1.38 x 105A/cm

SUBSTRATE POTENTIAL (Powered Up): V­TRANSISTOR COUNT: 54
PROCESS: Bipolar Dielectric Isolation

Å ±2kÅ

Å ±2kÅ

2

Metallization Mask Layout

BAL NC

HA-5101/883

HA-5101/883

-IN

+IN

V+

OUT

BALV-

8

FN3931.1

August 17, 2005

HA-5101/883

www.BDTIC.com/Intersil

Ceramic Dual-In-Line Frit Seal Packages (CERDIP)

c1

LEAD FINISH

-A-

-B-

bbb C A - B

S

BASE

PLANE

SEATING

PLANE

S1

b2

b

ccc C A - BMD

D

A

A

e

S

S

NOTES:

1. Index area: A notch or a pin one identification mark shall be
located adjacent to pin one and shall be located within the
shaded area shown. The manufacturer’s identification shall not
be used as a pin one identification mark.

2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.

3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.

4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.

5. This dimension allows for off-center lid, meniscus, and glass
overrun.

6. Dimension Q shall be measured from the seating plane to the
base plane.

7. Measure dimension S1 at all four corners.

8. N is the maximum number of terminal positions.

9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

10. Controlling dimension: INCH

-D-

BASE

E

D

S

S

Q

A

-C-

L

METAL

b1

M

(b)

SECTION A-A

α

(c)

M

eA

eA/2

aaa CA - B

M

c

D

S

S

F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A)

8 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE

INCHES MILLIMETERS

SYMBOL

A-0.200 - 5.08 -

b 0.014 0.026 0.36 0.66 2
b1 0.014 0.023 0.36 0.58 3
b2 0.045 0.065 1.14 1.65 ­b3 0.023 0.045 0.58 1.14 4

c 0.008 0.018 0.20 0.46 2
c1 0.008 0.015 0.20 0.38 3

D-0.405 - 10.29 5

E 0.220 0.310 5.59 7.87 5

e 0.100 BSC 2.54 BSC -

eA 0.300 BSC 7.62 BSC -

eA/2 0.150 BSC 3.81 BSC -

L 0.125 0.200 3.18 5.08 -

Q 0.015 0.060 0.38 1.52 6

S1 0.005 - 0.13 -7

o

α

90

105

o

90

o

105

aaa - 0.015 - 0.38 ­bbb - 0.030 - 0.76 -

ccc - 0.010 - 0.25 -

M-0.0015 - 0.038 2, 3

N8 88

NOTESMIN MAX MIN MAX

o

Rev. 0 4/94

-

9

FN3931.1

August 17, 2005

HA-5101/883

www.BDTIC.com/Intersil

Ceramic Leadless Chip Carrier Packages (CLCC)

j x 45

E1

o

B

h x 45

-E-

E2

e1

o

A

-F-

0.010 EHS S

L

D

D3

0.007 EFM S HS

B1

L2

D1

-H-

D2

B2

J20.A MIL-STD-1835 CQCC1-N20 (C-2)

20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE

INCHES MILLIMETERS

SYMBOL

A 0.060 0.100 1.52 2.54 6, 7

A1 0.050 0.088 1.27 2.23 -

B-----

B1 0.022 0.028 0.56 0.71 2, 4

E

E3

S

0.010 EF

A1

PLANE 2

PLANE 1

e

L3

B3

L1

S

B2 0.072 REF 1.83 REF ­B3 0.006 0.022 0.15 0.56 -

D 0.342 0.358 8.69 9.09 -

D1 0.200 BSC 5.08 BSC ­D2 0.100 BSC 2.54 BSC ­D3 - 0.358 - 9.09 2

E 0.342 0.358 8.69 9.09 -

E1 0.200 BSC 5.08 BSC ­E2 0.100 BSC 2.54 BSC ­E3 - 0.358 - 9.09 2

e 0.050 BSC 1.27 BSC -

e1 0.015 - 0.38 -2

h 0.040 REF 1.02 REF 5

j 0.020 REF 0.51 REF 5

L 0.045 0.055 1.14 1.40 -

L1 0.045 0.055 1.14 1.40 ­L2 0.075 0.095 1.91 2.41 ­L3 0.003 0.015 0.08 0.38 -

ND 5 5 3

NE 5 5 3

N20 203

NOTES:

1. Metallized castellations shall be connected to plane 1 terminals
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.

2. Unless otherwise specified, a minimum clearance of 0.015 inch
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)

3. Symbol “N” is the maximum number of terminals. Symbols “ND”
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.

4. The required plane 1 terminals and optional plane 2 terminals (if
used) shall be electrically connected.

5. The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing.

6. Chip carriers shall be constructed of a minimum of two ceramic
layers.

7. Dimension “A” controls the overall package thickness. The
maximum “A” dimension is package height before being solder
dipped.

8. Dimensioning and tolerancing per ANSI Y14.5M-1982.

9. Controlling dimension: INCH.

NOTESMIN MAX MIN MAX

Rev. 0 5/18/94

10

FN3931.1

August 17, 2005

®

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HA-5101

DESIGN INFORMATION

Data Sheet August 17, 2005 FN3931.1

The information contained on the following pages has been developed through characterization by Intersil Semiconductor and is
for use as application and design information only. No guarantee is implied.

Typical Performance Curves Unless Otherwise Specified: V

8

7

Hz)

√

6

5

4

3

2

INPUT NOISE VOLTAGE (nV/

1

0

10 100 1K 10K 100K

VOLTAGE

CURRENT

FREQUENCY (Hz)

FIGURE 1. NOISE SPECTRUM

Hz)

√

INPUT NOISE CURRENT (pA/

= ±15V, TA = +25°C

S

1500

V)

µ

1000

500

OFFSET VOLTAGE (

0

TEMPERATURE (°C)

FIGURE 2. OFFSET VOLTAGE vs TEMPERATURE

1251007550250-25-50

= 25,000, VS = ±15V (12.89mV

A

A

= 25,000, VS = ±15V (0.09nV

V

PEAK-TO-PEAK NOISE 0.1Hz TO 10Hz

P-P

RTI)

V

PEAK-TO-PEAK TOTAL NOISE 0.1Hz TO 1MHz

11

RTO or 0.52µV

P-P

P-P

RTI)

SLEW

RATE

(NORMALIZED)

HA-5101

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Typical Performance Curves Unless Otherwise Specified: V

20

0

-20

-40

INPUT OFFSET CURRENT (nA)

-60

-55 -25 0 25 50 75 100 125

TEMPERATURE (°C)

FIGURE 3. INPUT OFFSET CURRENT vs TEMPERATURE

30

20

10

0

-10

OFFSET CHANGE (µV)

-20

= ±15V, TA = +25°C (Continued)

S

250

200

150

100

BIAS CURRENT (nA)

50

0

-55 -25 0 25 50 75 100 125

TEMPERATURE (°C)

FIGURE 4. INPUT BIAS CURRENT vs TEMPERATURE

5

MAXIMUM

4

3

2

SUPPLY CURRENT (mA)

1

TYPICAL

MINIMUM

-30

TIME (s)

400350300250200150100500

FIGURE 5. INPUT OFFSET WARMUP DRIFT vs TIME

450 500

0

SUPPLY VOLTAGE (±V)

181614121086420

FIGURE 6. SUPPLY CURRENT vs SUPPLY VOLTAGE

20

(NORMALIZED TO ZERO FINAL VALUE)
(SIX REPRESENTATIVE UNITS)

1.1

RISE TIME

1.0

SLEW RATE

0.9

0.8

0.7

RL = 2K, CL = 50pF

0.6

-60 -40 0 20 60 80 100 120

TEMPERATURE (°C)

FIGURE 7. SLEW RATE/RISE TIME vs TEMPERATURE FIGURE 8. SHORT CIRCUIT CURRENT vs TIME

40-20

1.1

1.0

0.9

0.8

0.7

0.6

RISE TIME (NORMALIZED)

60

D

50

B

40

30

20

OUTPUT CURRENT (mA)

A+15mV ±15V
B-15mV ±15V

10

C+15mV 0V
D -15mV 0V

0

C

A

V

V

IN

OUT

160140120100806040200

TIME (s)

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HA-5101

www.BDTIC.com/Intersil

Typical Performance Curves Unless Otherwise Specified: V

10M

(140)

1M

(120)

100K
(100)

OPEN LOOP VOLTAGE GAIN V/V(dB)

10K
(80)

SUPPLY VOLTAGE (±V)

FIGURE 9. DC OPEN-LOOP VOLTAGE GAIN vs SUPPLY

VO LTAGE

6

3

0

-3

-6

-9

-12

PHASE

AV = 1V/V

CLOSED LOOP VOLTAGE GAIN (dB)

= 2K, CL = 50pF

R

L

FREQUENCY (Hz)

FIGURE 11. CLOSED LOOP GAIN AND PHASE AT HIGH AND

LOW TEMPERATURES

125°C

1510 185

125°C

GAIN

10M1M100K10K

-55°C
GAIN

-55°C
PHASE

100M

0

-45

-90

-135

-180

-225

PHASE SHIFT (DEGREES)

= ±15V, TA = +25°C (Continued)

S

V

ERROR

1mV

2.65µs

TIME (1.5µs/DIV)

FIGURE 10. SETTLING WAVEFORM

40

30

20

10

GAIN (dB)

0

-10

-20

RL = 2K, CL = 50pF

AV = 100

AV = 10

AV = 1

10M1M100K10K

FREQUENCY (Hz)

FIGURE 12. CLOSED-LOOP VOLTAGE GAIN vs FREQUENCY

AT DIFFERENT CLOSED LOOP GAINS

100M

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HA-5101

www.BDTIC.com/Intersil

Typical Performance Curves Unless Otherwise Specified: V

140

120

100

80

GAIN

FREQUENCY (Hz)

0

45

90

PHASE SHIFT (DEGREES)

135

180

100M

10M1M100K10K1K10010

VOLTAGE GAIN (dB)

60

40

20

0

PHASE

= ±15V, TA = +25°C (Continued)

S

-40

-60

-80

-100

REJECTION RATIO (dB)

-120

100 1K 10K 100K 1M

FREQUENCY (Hz)

-PSRR/CMRR

+PSRR

FIGURE 13. OPEN-LOOP GAIN/PHASE vs FREQUENCY FIGURE 14. REJECTION RATIOS vs FREQUENCY

VIN = V
Timescale = 500ns/Div., Scale: Input = 5V/Div, Output = 2V/Div

= ±3V, AV = +1, RL = 2kΩ, CL = 50pF

OUT

FIGURE 15. SLEW RATE WAVEFORM

Rise Time and Overshoot

VIN = V
Timescale = 20ns/Div.

= 0V to +200mV, AV = +1, RL = 2K, CL = 50pF

OUT

FIGURE 16. SMALL SIGNAL WAVEFORM

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HA-5101

www.BDTIC.com/Intersil

Applications Information

Operation At ±5V Supply

The HA-5101 performs well at VS = ±5V exhibiting typical
characteristics as listed below:

ICC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5mV

V

IO

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 56nA

I

BIAS

A

(VO = ±3V). . . . . . . . . . . . . . . . . . 106kV/V

VOL

. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7V

V

OUT

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13mA

I

OUT

CMRR (∆V
PSRR (∆V

Unity Gain Bandwidth . . . . . . . . . . . . . . 10MHz

Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . 7V/µs

Input Protection

The HA-5101 has built-in back-to-back protection diodes
which will limit the differential input voltage to approximately
7V. If the HA-5101 will be used in conditions where that volt­age may be exceeded, then current limiting resistors must
be used. No more than 25mA should be allowed to flow in
the HA-5101’s input.

Output Saturation

When an op amp is overdriven, output devices can saturate
and sometimes take a long time to recover. Saturation can
be avoided (sometimes) by using circuits such as:

= ±2.5V) . . . . . . . . . . . . . 90dB

CM

= 0.5V). . . . . . . . . . . . . . . 90dB

CC

V+

R

1

Offset Adjustment

The following is the recommended VIO adjust configuration:

+15V

7

3

+

2

-

4

(NOTE)

-15V

NOTE: Proper decoupling is always recommended, 0.1µF high quality
capacitor should be at or very near the device’s supply pins.

(NOTE)

5

1

R

P

RP = 100kΩ

6

Comparator Circuit

V+

7

-

+

4

V-

∆VINMAX 7V–()

---------------------------------------------- -

25m A

6

≤

2R

LIM

∆V

IN

Choose R

R

LIM

R

LIM

Such That:

LIM

2

3

R

2

+

-

R

3

V

SOURCE

R

4

V-

If saturation cannot be avoided the HA-5101 recovers from a
25% overdrive in about 6.5µs (see photo).

IN

OUT

Output is overdriven negative and recovers in 6µs.

Bottom: Output, 5V/Div., 2µs/Div.

Top: Input

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HA-5101

www.BDTIC.com/Intersil

TABLE 1. TYPICAL PERFORMANCE CHARACTERISTICS

Device Characterized At: V

PARAMETER TEST CONDITIONS TEMP (°C) TYP DESIGN LIMITS UNITS

Offset Voltage V

Offset Voltage Average Drift Versus Temperature -55 to +125 3 7 µV/°C

Offset Current Average Drift Versus Temperature -55 to [phone] pA/°C

Input Bias Current V

Input Offset Current V

Differential Input Resistance VCM = 0V +25 500 Table 3 kΩ
Input Noise Voltage Density f

Input Noise Current Density fo = 10Hz +25 6 20 pA/√Hz

Large Signal Voltage Gain V

Slew Rate V

Full Power Bandwidth V
Rise and Fall Times V
Overshoot V
Settling Time To 0.1% for 10V Step +25 4.5 6 µs

Output Short Circuit Current t < 10s, V

Output Resistance Open Loop +25 110 Table 3 Ω

Supply Current No Load +25 4.3 Table 1 mA
Minimum Supply Voltage Functional Operation Only,

= ±15V, RL = 2kΩ, CL = 50pF, A

S

= 0V +25 0.8 Table 1 mV

CM

= 0V +25 65 Table 1 nA

CM

= 0V +25 35 Table 1 nA

CM

= 10Hz +25 5.4 9 nV/√Hz

o

fo = 100Hz +25 3.4 5.5 nV/√Hz
fo = 1kHz +25 3.2 Table 3 nV/√Hz

fo = 100Hz +25 1.5 5 pA/√Hz
fo = 1kHz +25 0.52 Table 3 pA/√Hz

= ±10V -55 400K Table 1 V/V

OUT

= ±3V -55 to +125 10 5.4 V/µs

OUT

= 10V, (Note 2) -55 to [phone] kHz

PEAK

= ±200mV -55 to +125 50 Table 2 ns

OUT

= ±200mV -55 to +125 20 35 %

OUT

To 0.01% for 10V Step +25 6 10 µs

= ±15V +25 ±35 ±50 mA

OUT

Other Parameters Will Vary

= +1V/V, Unless Otherwise Specified

VCL

+25 1M Table 1 V/V

+125 1M Table 1 V/V

+25 ±4 ±5 V

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

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