Datasheet IRS2127 Datasheet (International Rrectifier)

Data Sheet No. PD60299
IRS212(7, 71, 8, 81)(S)PbF
CURRENT SENSING SINGLE CHANNEL DRIVER
Features
Product Summary
Floating channel designed for bootstrap operation
Fully operational to +600 V Tolerant to negative transient voltage dV/dt immune
Application-specific gate drive range:
Motor Drive: 12 V to 20 V (IRS2127/IRS2128) Automotive: 9 V to 20 V (IRS21271/IRS21281)
Undervoltage lockout
IO+/- 200 mA / 420 mA
V
V
OFFSET
12 V - 20V 9 V - 20 V
OUT
600 V max.
(IRS2127/IR2128) (IRS21271/IR21281)
FAULT lead indicates shutdown has occured
Output in phase with input (IRS2127/IRS21271)
V
CSth
250 mV or 1.8 V
Output out of phase with input (IRS2128/IRS21281)
RoHS compliant
t
on/off
(typ.) 150 ns & 150 ns
Description
The IRS2127/IRS2128/IRS21271/IRS21281 are high voltage, high speed power MOSFET and IGBT drivers. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construc­tion. The logic input is compatible with standard CMOS or LSTTL outputs, down to 3.3 V. The protec­tion circuity detects over-current in the driven power transistor and terminates the gate drive voltage. An open drain
FAULT
signal is provided to indicate that an over-current shutdown has occurred. The output driver features a high pulse current buffer stage designed for minimum cross-conduction. The floating chan­nel can be used to drive an N-channel power MOSFET or IGBT in the high-side or low-side configuration which operates up to 600 V.
Packages
8-Lead PDIP 8-Lead SOIC
Typical Connection
V
CC
IN
FAULT
(Refer to Lead Assignments for correct pin configuration). These diagrams show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.
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V
CC
IN FAULT COM
HO
V
B
CS
V
S
IRS2127/IRS21271
FAULT
V
CC
IN
V
CC
IN FAULT COM
HO
V
B
CS
V
S
IRS2128/IRS21281
IRS212(7, 71, 8, 81)(S)PbF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param­eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
IN
V
FLT
V
CS
dVs/dt Allowable offset supply voltage transient 50 V/ns
P
D
Rth
JA
T
J
T
S
T
L
High-side floating supply voltage -0.3 625 High-side floating offset voltage VB - 25 VB + 0.3 High-side floating output voltage VS - 0.3 V
+ 0.3
B
Logic supply voltage -0.3 25 V Logic input voltage -0.3 V
FAULT output voltage -0.3 V
Current sense voltage VS - 0.3 V
Package power dissipation @ TA +25 °C
Thermal resistance, junction to ambient
8-Lead DIP 1.0 8-Lead SOIC 0.625 8-Lead DIP 125 8-Lead SOIC 200
CC CC
B
+ 0.3 + 0.3
+ 0.3
W
°C/W
Junction temperature 150 Storage temperature -55 150
°C
Lead temperature (soldering, 10 seconds) 300
Recommended Operating Conditions
The input/output logic timing diagram is shown in Fig. 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at 15 V differential.
Symbol Definition Min. Max. Units
V
B
V
S
V
HO
V
CC
V
IN
V
FLT
V
CS
T
A
High-side floating supply voltage
(IRS21271/IRS21281) VS + 9 VS + 20 High-side floating offset voltage Note 1 600 High-side floating output voltage V Logic supply voltage 10 20 Logic input voltage 0 V
FAULT output voltage 0 V
Current sense signal voltage V Ambient temperature -40 125 °C
Note 1: Logic operational for VS of -5 V to +600 V. Logic state held for VS of -5 V to -VBS. (Please refer to the Design Tip DT97-3 for more details).
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(IRS2127/IRS2128) VS + 12 VS + 20
S
S
V
B
CC CC
V
+ 5
S
V
IRS212(7, 71, 8, 81)(S)PbF
Dynamic Electrical Characteristics
V
(VCC, VBS) = 15 V, CL = 1000 pF and TA = 25 °C unless otherwise specified. The dynamic electrical characteristics
BIAS
are measured using the test circuit shown in Fig. 3.
Symbol Definition Min. Typ.Max.Units Test Conditions
t
on
t
off
t t
t
bl
t
cs
t
flt
Turn-on propagation delay 150 200 V Turn-off propagation delay 150 200 V Turn-on rise time 80 130
r
Turn-off fall time 40 65 ns
f
Start-up blanking time 550 750 950 CS shutdown propagation delay 65 360 CS to FAULT pull-up propagation delay 270 510
= 0 V
S
= 600 V
S
Static Electrical Characteristics
V
BIAS (VCC
COM. The VO and IO parameters are referenced to VS.
Symbol Definition Min. Typ.Max.Units Test Conditions
V
V
V
R
, VBS) = 15 V and TA = 25 °C unless otherwise specified. The VIN, V
V
V
CSTH+
V
OH
V
OL
I
LK
I
QBS
I
QCC
I
IN+
I
IN-
I
CS+
I
CS-
BSUV+
BSUV-
I
O+
I
O-
on,FLT
Logic “1” input voltage (IRS2127/IRS21271)
IH
Logic “0” input voltage (IRS2128/IRS21281) Logic “0” input voltage (IRS2127/IRS21271)
IL
Logic “1” input voltage (IRS2128/IRS21281) CS input positive (IRS2127/IRS2128) 180 250 320 mV going threshold High level output voltage, V Low level output voltage, V
(IRS21271/IRS21281)
- V
BIAS
O
O
Offset supply leakage current — 50 VB = VS = 600 V Quiescent V
supply current 300 800
BS
Quiescent VCC supply current 60 120 Logic “1” input bias current 7.0 15 Logic “0” input bias current — 5.0 V “High” CS bias current — 5.0 V “High” CS bias current — 5.0 V V
supply undervoltage (IRS2127/IRS2128) 8.8 10.3 11.8
BS
positive going threshold (IRS21271/IRS21281) 6.3 7.2 8.2 V
supply undervoltage
BS
negative going
threshold
(IRS2127/IRS2128) (IRS21271/IRS21281) 6.0 6.8 7.7
Output high short circuit pulsed current 200 290 —
Output low short circuit pulsed current 420 600
FAULT - low on resistance 125
2.5
1.5 1.8 2.1 0.05 0.2 — 0.02 0.1
7.5 9.0 10.6
TH,
— — 0.8
and IIN parameters are referenced to
V
VCC = 10 V to 20 V
V
IO = 2 mA
VIN = 0 V or 5 V
µA
VIN = 5 V
= 0 V
IN
= 3 V
CS
= 0 V
CS
V
VO = 0 V, V
mA
VO = 15 V, V
IN
PW10 µs
IN
PW10 µs
= 5 V
= 0 V
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Functional Block Diagram IRS2127/IRS21271
IRS212(7, 71, 8, 81)(S)PbF
V
CC
HV
UP SHIFTERS
LEVEL SHIFT
UV
DETECT
PULSE
FILTER
IN
FAULT
Q R
PULSE
GEN
PULSE
FILTER
DOWN SHIFTER
V
B
S
COM
Functional Block Diagram IRS2128/IRS21281
V
FAULT
COM
CC
5V
UP SHIFTERS
HV LEVEL SHIFT
IN
PULSE
GEN
PULSE
Q
R
FILTER
S
DETECT
PULSE
FILTER
DOWN SHIFTER
UV
V
B
R Q R
S
PULSE
GEN
R Q R
S
PULSE
GEN
Q R
Q
V
B
BUFFER
HO
V
S
DELAY
S
-
+
BUFFER
V
HO
V
CS
B
S
DELAY
R
S
-
CS
+
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Lead Definitions
Symbol Description
V
CC
IN
FAULT
Logic and gate drive supply Logic input for gate driver output (HO), in phase with HO (IRS2127/IRS21271) out of phase with HO (IRS2128/IRS21281)
Indicates over-current shutdown has occurred, negative logic COM Logic ground V HO V CS
High-side floating supply
B
High-side gate drive output
High-side floating supply return
S
Current sense input to current sense comparator
Lead Assignments
IRS212(7, 71, 8, 81)(S)PbF
1
V
CC
2
I N
3
FAULT
4
COM
V
HO
C V
1
8
B
7 6
S
5
S
V
CC
2
I N
3
FAULT
4
COM
HO
V
8
B
7
C
6
S
V
5
S
8 Lead PDIP 8 Lead SOIC
IRS2127/IRS21271 IRS2127S/IRS21271S
1
V
CC
2
I N
3
FAULT
4
COM
V
HO
C V
8
B
7 6
S
5
S
1 2 3 4
8 Lead PDIP 8 Lead SOIC
V
CC
I N FAULT COM
V
HO
C V
8
B
7 6
S
5
S
IRS2128/IRS21281 IRS2128S/IRS21281S
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IRS212(7, 71, 8, 81)(S)PbF
IN (IRS2128/ IRS21281)
IN
(IRS2127/ IRS21271)
CS
FAULT
HO
Figure 1. Input/Output Timing Diagram
IN (IRS2128/ IRS21281)
IN
(IRS2127/ IRS21271)
CS
HO
50%
50%
t
bl
IN
(IRS2128/
50% 50%
IRS21281)
50%
IN
(IRS2127/ IRS21271)
HO
t
t
r
on
10% 10%
Figure 2. Switching Time Waveform Definition
90%
50%
t
off
90% 90%
t
f
FAULT
Figure 3. Start-Up Blanking Time Waveform
Definitions
V
CSTH
CS
t
cs
HO
90%
Figure 4. CS Shutdown Waveform Definitions
CS
FAULT
Figure 5. CS to
V
CSTH
t
flt
90%
Waveform Definitions
FAULT
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IRS212(7, 71, 8, 81)(S)PbF
Turn-Off Delay Ti me (ns)
T ur n- On D elay T ime ( ns )
T ur n- On D elay T ime ( ns )
Turn-Off Delay Ti me (ns)
Temperature
Temperature
300 250 200 150 100
50
300 250 200 150 100
Max Typ
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 6A. Turn-On Delay Time vs.
Max Typ
50
300 250
Max
200
Typ
150 100
50
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 6B. Turn-On Delay Time vs. Voltage
250
Max
200
Typ
150
100
50
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 7A. Turn-Off Delay Time vs.
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 7B. Turn-Off Delay Time vs. Voltage
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IRS212(7, 71, 8, 81)(S)PbF
Temperature
Turn- Off Fall T ime (n s)
Turn- Off Fall T ime (n s)
Temperature
Temperature
180 160
140 120 100
80 60 40
20
90 80
70 60 50 40 30 20 10
0
Max
Typ
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 8A. Turn-On Rise Time vs.
Max
Typ
-50 -25 0 25 50 75 100 125 Temperature (°C)
180
Max
160 140 120
Typ
100
80 60 40
20
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 8B. Turn-On Rise Time vs. Voltage
80
Max
70 60 50
Typ
40 30 20 10
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 9A. Turn-Off Fall Time vs.
Figure 9B. Turn-Off Fall Time vs. Voltage
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IRS212(7, 71, 8, 81)(S)PbF
CS S hutdow n Prop. D elay (ns )
CS S hutdow n Prop. D elay (ns )
Temperature
Temperature
Voltage
1200 1000
800 600 400
200
500 450 400 350 300 250 200 150 100
50
0
Max Typ Min
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 10A. Start-Up Blanking Time vs.
Max
Typ
-50 -25 0 25 50 75 100 125 Temperature (°C)
1200 1000
Figure 10B. Start-Up Blanking Time vs. Voltage
400 350 300 250 200 150 100
Max
Typ
800
Min
600 400
200
0
10 12 14 16 18 20
Supply Voltage (V)
Max
Typ
50
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 11A. CS Shutdown Prop. Delay vs.
Figure 11B. CS Shutdown Prop. Delay vs.
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IRS212(7, 71, 8, 81)(S)PbF
C S t o F A U L T P u l l - U p P r o p . D e l a y ( n s )
Threshold
L o g i c " 1 " ( " 0 " f o r 2 1 2 8 ) V
T hreshold (V)
Threshold vs.
C S t o F A U L T P u l l - U p P r o p . D e l a y ( n s )
800 700 600 500 400
Max
300 200
Typ
100
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 12A. CS to FAULT Pull-Up Prop. Delay
vs. Temperature
3
2.5
Min
600
Max
500 400 300
Typ
200
100
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 12B. CS to FAULT Pull-Up Prop. Delay
vs. Voltage
3
Min
2.5
2
I H
1.5 1
0.5 0
-50 -25 0 25 50 75 100 125
L o g i c " 1 " ( " 0 " f o r 2 1 2 8 ) V Threshold (V)
Temperature (°C)
Figure 13A. Logic "1" ("0" for 2128) V
IH
2
I H
1.5 1
0.5 0
10 12 14 16 18 20
Supply Voltage (V)
Figure 13B. Logic "1" ("0" for 2128) V
IH
Voltagevs. Temperature
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IRS212(7, 71, 8, 81)(S)PbF
T hres hold (V)
Thre shold (V)
CS Input Positive Go ing Voltage (V)
Figure 15A. CS Input Positive Going Voltage
Figure 15B. CS Input Positive Going Voltage vs.
CS Input Positive Go ing Voltage (V)
Threshold
Threshold vs.
0.9
0.8
Max
0.7
0.6
IL
0.5
0.4
0.3
0.2
0.1 0
-50 -25 0 25 50 75 100 125
Logic "0" ("1" for 212 8) V
Temperature (°C)
Figure 14A. Logic "0" ("1" for 2128) V
0.35
0.3
0.25
Max
Typ
0.2 Min
0.15
0.9 Max
0.8
0.7
0.6
IL
0.5
0.4
0.3
0.2
0.1
0
10 12 14 16 18 20
Logic "0" ("1" for 2128) V
Supply Voltage (V)
IL
Figure 14B. Logic "0" ("1" for 2128) V
IL
Voltagevs. Temperature
0.35
Max
0.3 Typ
0.25
0.2 Min
0.15
0.1
0.05 0
-50 -25 0 25 50 75 100 125 Temperature (°C)
vs. Temperature
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0.1
0.05 0
10 12 14 16 18 20
Supply Voltage (V)
Voltage
IRS212(7, 71, 8, 81)(S)PbF
0.3
0.25
= 2 m A ) ( V)
0.2
O
0.15
Max
0.1
0.05
H i g h L e v e l O u t p u t ( I
Typ
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 16A. High Level Output (IO = 2 mA)
vs. Temperature
0.16
0.14
0.12
= 2 m A ) ( V )
0.1
O
0.08
Max
0.06
0.04
0.02
Low Level Output (I
Typ
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
0.25
Max
0.2
= 2 m A) (V)
O
0.15
0.1
Typ
0.05
High Level Output (I
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 16B. High Level Output (IO = 2 mA) vs.
Voltage
0.12 Max
0.1
= 2 m A) (V)
0.08
O
0.06
0.04
Typ
0.02
Low L evel Output (I
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 17A. Low Level Output (IO = 2 mA)
vs. Temperature
Figure 17B. Low Level Output (IO = 2 mA) vs.
Voltage
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IRS212(7, 71, 8, 81)(S)PbF
Current vs. Temperature
Supply Current (µA)
Supply Leakage vs. Voltage
Supply Current (µA)
Supply Current (µA)
Temperature
100
90 80 70 60 50 40 30 20 10
Max
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 18A. Offset Supply Leakage
600 500
Max
400 300
Typ
200
B S
100
V
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
60
Max
50
40
30 20
BS
10
V
0
0 100 200 300 400 500 600
Supply Voltage (V)
Figure 18B. High-Side Floating Well Offset
700 600 500
Max
400 300
Typ
200
BS
V
100
0
10 12 14 16 18 20
Supply Voltage (V)
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Figure 19A. VBS Supply Current vs.
Figure 19B. VBS Supply Current vs. Voltage
IRS212(7, 71, 8, 81)(S)PbF
Supp ly Current (µA)
Supp ly Current (µA)
Logic "1" Input Bias C urrent (µA)
Figure 21A. Logic "1" Input Bias Current vs.
Temperature
Temperature
160 140 120 100
80 60 40
CC
V
20
20 18 16 14 12 10
8 6 4 2 0
Max
Typ
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 20A. VCC Supply Current vs.
Max
Typ
-50 -25 0 25 50 75 100 125 Temperature (°C)
180 160
140 120 100
Max
80 60
Typ
40
CC
V
20
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 20B. VCC Supply Current vs. Voltage
16
Max
14 12 10
8
Typ
6 4 2 0
10 12 14 16 18 20
Supply Voltage (V)
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Figure 21B. Logic "1" Input Bias Current vs.
Voltage
IRS212(7, 71, 8, 81)(S)PbF
Logic "0" Input Bias C urrent (µA)
Figure 22A. Logic "0" Input Bias Current vs.
Logic "1" CS Bias Current (µA)
Logic "0" Input Bias C urrent (µA)
Temperature
Temperature
6
Max
5 4 3 2
1 0
-50 -25 0 25 50 75 100 125 Temperature (°C)
6
Max
5
6
Max
5 4 3 2
1 0
10 12 14 16 18 20
Supply Voltage (V)
Figure 22B. Logic "0" Input Bias Current vs.
Voltage
6
Max
5 4 3 2
1 0
-50 -25 0 25 50 75 100 125
Figure 23A. Logic "1" CS Bias Current vs.
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Temperature (°C)
4
3
2
1
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 23B. Logic "1" CS Bias Current vs.
Voltage
IRS212(7, 71, 8, 81)(S)PbF
Logic "0" CS Bias Current (µA)
UV Thres hold (+) (V)
UV Threshold (+) (V)
Temperature
Temperature
6 5
Max
4 3 2
1 0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 24A. Logic "0" CS Bias Current vs.
14 12 10
Max Typ Min
8
6
Max
5 4 3 2
1 0
10 12 14 16 18 20
Supply Voltage (V)
Figure 24B. Logic "0" CS Bias Current vs.
Voltage
14 12
Max Typ
10
Min
8 6 4
BS
2
V
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 25A. VBS UV Threshold (+) vs.
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6 4
BS
2
V
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 25B. VBS UV Threshold (+) vs. Voltage
IRS212(7, 71, 8, 81)(S)PbF
UV Threshold (-) (V)
Temperature
UV Threshold (-) (V)
Temperature
Ou tput Sou rc e Cur re nt (A)
12 10
Max Typ
8
Min
6 4
BS
2
V
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 26A. VBS UV Threshold (-) vs.
0.4
0.35
Typ
0.3
0.25
Min
0.2
0.15
0.1
0.05
O u t p u t S ou r c e C u r r e nt ( A )
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 27A. Output Source Current vs.
12
Max
10
Typ
8
Min
6 4
BS
2
V
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 26B. V
UV Threshold (-) vs. Voltage
BS
0.5
0.45
0.4
0.35
0.3
0.25
0.2
Typ
0.15 Min
0.1
0.05
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 27B. Output Source Current vs.
Voltage
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IRS212(7, 71, 8, 81)(S)PbF
Temperature
Output Sink Current (A)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
O u t p u t S in k C ur r e n t ( A )
Typ
Min
0
-50 -25 0 25 50 75 100 125 Temperature (°C)
Figure 28A. Output Sink Current vs.
1
0.9
0.8
0.7
0.6
0.5
0.4 Typ
0.3
0.2
Min
0.1
0
10 12 14 16 18 20
Supply Voltage (V)
Figure 28B. Output Sink Current vs. Voltage
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Case outlines
4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.
IRS212(7, 71, 8, 81)(S)PbF
A
8 756 5
6
E
e
6X
8X b
0.25 [.010] CAB
NOTES:
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.
D B
431 2
e1
A1
H
0.25 [.010]
A
C
A
0.10 [.004]
8-Lead SOIC
8-Lead PDIP
6.46 [.255]
3X 1.27 [.050]
y
01-3003 01 (MS-001AB)
DIM
FOOTPRINT
8X 0.72 [.028]
8X 1.78 [.070]
MIN MAX
A
.0532 A1 b c .0075 .0098 0.19 0.25 D E e
e1
H K L y
.0688
.0040
.0098
.013
.020
.189
.1968
.1497
.1574 .050 BASIC .025 BASIC 0.635 BASIC .2284
.2440 .0099
.0196 .016
.050
K x 45°
8X L
8X c
7
5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE.
01-0021 11 (MS-012AA)
01-6014
MILLIMETERSINCHES
MIN MAX
1.35
1.75
0.10
0.25
0.33
0.51
4.80
5.00
3.80
4.00
1.27 BASIC
5.80
6.20
0.25
0.50
0.40
1.27
01-6027
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E
Tape & Reel 8-lead SOIC
IRS212(7, 71, 8, 81)(S)PbF
LOADED TAPE FEED DIRECTION
B
F
CARRIER TAPE DIMENSION FOR 8SOICN
Code Min Max Min Max A 7.90 8.10 0.311 0.318 B 3.90 4.10 0.153 0.161 C 11.70 12.30 0.46 0.484 D 5.45 5.55 0.214 0.218 E 6.30 6.50 0.248 0.255 F 5.10 5.30 0.200 0.208 G 1.50 n/a 0.059 n/a H 1.50 1.60 0.059 0.062
F
G
H
REEL DIMENSIONS FOR 8SOICN
Code Min Max Min Max A 329.60 330.25 12.976 13.001 B 20.95 21.45 0.824 0.844 C 12.80 13.20 0.503 0.519 D 1.95 2.45 0.767 0.096 E 98.00 102.00 3.858 4.015 F n/a 18.40 n/a 0.724 G 14.50 17.10 0.570 0.673 H 12.40 14.40 0.488 0.566
Metric Imperial
C
Metric Imperial
A
A
E
G
B
D
H
D
C
A
www.irf.com 20
IRS212(7, 71, 8, 81)(S)PbF
LEADFREE PART MARKING INFORMATION
Part number
Date code
Pin 1 Identifier
?
MARKING CODE
Lead Free Released
P
Non-Lead Free Released
IRxxxxxx
S
YWW?
ORDER INFORMATION
8-Lead PDIP IRS2127PbF
8-Lead PDIP IRS21271PbF
8-Lead SOIC IRS2127SPbF
8-Lead SOIC IRS21271SPbF
8-Lead SOIC Tape & Reel IRS2127STRPbF
8-Lead SOIC Tape & Reel IRS21271STRPbF
IR logo
?XXXX
Lot Code
(Prod mode - 4 digit SPN code)
Assembly site code Per SCOP 200-002
8-Lead PDIP IRS2128PbF
8-Lead PDIP IRS21281PbF
8-Lead SOIC IRS2128SPbF
8-Lead SOIC IRS21281SPbF
8-Lead SOIC Tape & Reel IRS2128STRPbF
8-Lead SOIC Tape & Reel IRS21281STRPbF
This product has been designed and qualified for the industrial level.
Qualification standards can be found at www.irf.com
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105
Data and specifications subject to change without notice. 6/27/2007
The SOIC-8 is MSL2 qualified.
www.irf.com 21
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