Page 1
Intel® Storage System
SSR212CC
Technical Product Specification
Revision 1.2
Storage Group Technical Marketing
Page 2
Revision History Intel® Storage System SSR212CC TPS
Revision History
Date Revision
Number
May 16, 2006 1.0 Release copy.
July 11, 2006 1.1 Added RoHS statement, section 6.2.
December 06,
2007
1.2 DDR2 pin number correction
Modifications
ii Revision 1.2
Page 3
Intel® Storage System SSR212CC TPS Disclaimers
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions
marked "reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Storage System SSR212CC may contain design defects or errors known as errata
that may cause the product to deviate from published specifications. Current characterized
errata are available on request.
Intel system boards contain a number of high-density VLSI and power delivery components that
need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the
intended thermal requirements of these components when the fully integrated system is used. It
is the responsibility of the system integrator that chooses not to use Intel developed system
building blocks to consult vendor datasheets and operating parameters to determine the
amount of air flow required for their specific application and environmental conditions. Intel
Corporation cannot be held responsible if components fail or the system board does not
operate correctly when used outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2003 - 2006.
Revision 1.2 iii
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Table of Contents Intel® Storage System SSR212CC TPS
Table of Contents
1. Feature Summary ...............................................................................................................1
1.1
1.2
1.3
1.4
1.5
1.5.1
1.5.2
1.5.3
1.5.4
1.6
1.7
1.8
1.8.1
1.9
1.10 Rack and Cabinet Mounting Options..............................................................................15
System Components..............................................................................................5
System Board Feature Set .....................................................................................7
Serial ATA (SATA) Host Bus Adapter ....................................................................9
SATA Hot Swap Backplane....................................................................................9
Enclosure Management .......................................................................................11
Fan Control ..........................................................................................................11
Miscellaneous Functions ......................................................................................11
I2C Serial Bus Interface ........................................................................................11
Hard Disk Drive LEDs ..........................................................................................12
Chassis Dimensions and Weight..........................................................................12
Back Panel I/O Ports and Features ......................................................................13
Front Panel and HDD Bays ..................................................................................14
Front/Rear Panel Controls and Indicators ............................................................15
Fan Monitoring .....................................................................................................15
2. Power Sub-System ...........................................................................................................17
2.1
2.1.1
2.1.2
2.2
2.3
2.3.1
2.4
2.5
2.5.1
2.5.2
2.5.3
3. System Cooling Module ...................................................................................................23
3.1
4. Chassis Bays ....................................................................................................................24
Power Supply Enclosure ......................................................................................17
Hot Swapping Power Modules .............................................................................18
Power Supply Outputs..........................................................................................18
Output Power/Currents ........................................................................................19
Voltage Regulation...............................................................................................19
Dynamic Loading .................................................................................................20
Capacitive Loading...............................................................................................20
Protection Circuits ................................................................................................20
Over-Current Protection (OCP) ............................................................................20
Over Voltage Protection (OVP) ............................................................................22
Over Temperature Protection (OTP) ....................................................................22
Fan Control ..........................................................................................................23
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Intel® Storage System SSR212CC TPS Table of Contents
4.1
4.1.1
Hard Disk Drive Bays ...........................................................................................25
Hard Disk Drive Carrier ........................................................................................26
5. System Interconnection ...................................................................................................28
5.1
5.2
5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
6. Regulatory Information ....................................................................................................32
6.1 Product Regulation Requirements ...................................................................................32
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
Chassis Internal Cables and Connector ...............................................................28
I/O Panel Connectors...........................................................................................28
SATA HSBP Connectors......................................................................................29
SATA 4-Lane Connector ......................................................................................29
Interposer Connector ...........................................................................................30
Power Connector .................................................................................................30
Front Panel Connector .........................................................................................31
SATA Host I2C Header.........................................................................................31
Product Safety Compliance..................................................................................32
Product EMC Compliance – Class A Compliance ................................................32
Certifications / Registrations / Declarations ..........................................................33
Component Regulation Requirement Need to Support System Level Certifications33
Product Ecology Requirements ............................................................................34
6.2
7. Environmental Limits .......................................................................................................35
7.1
7.2
7.3
8. Serviceability and Availability .........................................................................................37
9. Calculated MTBF ..............................................................................................................38
Glossary .....................................................................................................................................I
Restriction of Hazardous Substances (RoHS)......................................................34
System Office Environment..................................................................................35
System Environmental Testing.............................................................................35
Environmental Limits............................................................................................36
Revision 1.2 v
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List of Figures Intel® Storage System SSR212CC TPS
List of Figures
Figure 1. Intel® Storage System SSR212CC...............................................................................1
Figure 2. Intel® Storage System SSR212CC Block Diagram .......................................................5
Figure 3. System Components....................................................................................................6
Figure 4. SATA HSBP Block Diagram.......................................................................................10
Figure 5. SATA HSBP I2C Bus Connection Diagram.................................................................12
Figure 6. Chassis Rear .............................................................................................................13
Figure 7. Chassis Front and Rear .............................................................................................14
Figure 8. Front Panel ................................................................................................................15
Figure 9. Rack Mounting ...........................................................................................................16
Figure 10. Power Supply Enclosure ..........................................................................................17
Figure 11. Cooling Module .......................................................................................................23
Figure 12. Drive Bay Removal ..................................................................................................24
Figure 13. Hard Disk Drive Bays ...............................................................................................26
Figure 14. Hard Drive Carrier Assembly....................................................................................27
vi Revision 1.2
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Intel® Storage System SSR212CC TPS List of Tables
List of Tables
Table 1. HDD LED Function......................................................................................................12
Table 2. Chassis Dimensions and Weight.................................................................................12
Table 3. Rear Control Button Functions ....................................................................................15
Table 4. Front LED Indicator Status ..........................................................................................15
Table 5. Enclosure & Module Output Summary (500W 10 second peak ratings) .....................18
Table 6. LED Indicators ............................................................................................................18
Table 7. Load Ratings...............................................................................................................19
Table 8. Voltage Regulation Limits............................................................................................19
Table 9. Transient Load Requirements .....................................................................................20
Table 10. Capacitive Loading Conditions ..................................................................................20
Table 11. Over Current Protection Limits ..................................................................................21
Table 12. Over Voltage Protection (OVP) Limits .......................................................................22
Table 13. SATA 4-Lane Connector Pin-out ...............................................................................29
Table 14. Interposer Connector ................................................................................................30
Table 15. Power Connector Pin-out ..........................................................................................30
Table 16. Front Panel Power Connector ...................................................................................31
Table 17. SATA Host I2C Header Pin-out..................................................................................31
Table 18. Intel® Storage System SSR212CC System Office Environment Summary ................35
Table 19. Intel® Storage System SSR212CC Operating and Non-Operating Environmental
Limits..................................................................................................................................36
Table 20. Intel® Storage System SSR212CC Component MTBF Numbers...............................38
Revision 1.2 vii
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List of Tables Intel® Storage System SSR212CC TPS
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viii Revision 1.2
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Intel® Storage System SSR212CC Feature Summary
1. Feature Summary
This Technical Product Specification provides detailed information about the hardware
components of the Intel® Storage System SSR212CC.
The Intel® Storage System SSR212CC includes a 2U chassis, Intel® Server Board SE7520JR2
with a single Low Voltage Intel® Xeon® processor, an Intel® Management Module (IMM),
twelve Serial ATA hard disk drive carriers, two Intel® RAID Controller SRCS28X’s, dual Intel®
PRO/1000 Network connections, and a single 500 W power supply (dual redundant 1+1
capable). Intel®-based system boards and chassis have feature sets designed to support the
high-density storage market.
Figure 1. Intel® Storage System SSR212CC
Revision 1.2 1
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Feature Summary Intel® Storage System SSR212CC
Intel® Storage System SSR212CC Hardware Feature Summary
Storage Capacity
Drive Bays
Hard Disk Drive
Supported
Processor
Memory Capacity
Memory Type
DIMM Slots
Enclosure Controller
Expandable to 3.0 TB – using twelve 250 GB drives.
Expandable to 4.8 TB – using twelve 400 GB drives.
Expandable to 6.0 TB – using twelve 500 GB drives.
12 Serial ATA (SATA) Hot Pluggable.
3.5 inch SATA I & SATA II.
NOTE: For specific drive family and capacities supported, please refer to the
SSR212CC Tested Hardware and OS List (THOL).
A single Low Voltage Intel® Xeon® processor 2.8 GHz with 800
MHz system bus and 1MB L2 cache.
Expandable to 12 GB maximum, using DDR2-400 memory.
Synchronous Dynamic Random Access Memory (SDRAM),
DDR2-400, Registered, ECC.
Six 240-pin DIMM sockets.
On-board Vitesse* VSC055 micro-controller.
Temperature Sensor
SATA Compliance
Connectivity
Front Panel
Two temperature sensors are located on the backplane that allows drive
cage temperature monitoring by enclosure management.
SATA 1.5, 3.0.
Internet Protocol Small Computer System Interface (iSCSI) or Microsoft*
Windows* Common Internet File System (CIFS), via Dual GB Ethernet.
LEDs
Hard Disk Drive Carrier
LEDs
Back Panel
Buttons and Switches
I/O Connectors
Power Receptacle
Chassis
Form Factor
Height
Width
Depth
Weight
Color
Rack Support
3x: Fault, ID, Power.
2x: Activity, Fault.
Power button, Reset button.
1x RJ-45 COMB Serial port, 2x RJ-45 Ethernet ports, 1x DB-15
Video connector, 1x 2.0 USB port, 1x Stacked PS/2
Mouse/Keyboard connector.
1x IEC AC per installed power supply module.
2U rack-mount chassis
86.7 mm, 3.41 in
447 mm, 17.6 in
631 mm, 24.8 in
As shipped (zero drives): approximately 19.1 kg, 42 pounds
Fully configured (twelve drives): approximately 30.4 kg, 67 pounds
Shipping container: 3.2 kg, 7 pounds
Black
Rail mount, compatible with four-post rack mount only, and
compliant to the SSI Server Rack specification and EIA 310-D.
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Intel® Storage System SSR212CC Feature Summary
System Cooling
Fans
Power
Configuration
Max AC input current
(PS Module)
Max +3.3 V output
(PS Enclosure)
Max +5 V output
(PS Enclosure)
Max +12 V output1
current
(PS Module)
Max +12 V output2
current
(PS Module)
Max +12 V output3
current
(PS Module)
Max -12 V output
current
(PS Module)
Max +5V Standby
output current
(PS Module)
Environment
Chassis includes three dual rotor and two single rotor 40 mm hotswappable redundant system fans for cooling the hard drives,
baseboard and SATA Host Bus Adapter (HBA) cards.
The Power supply enclosure contains one 60mm fan.
500 W continuous, 1+1 redundant power supplies. Intel Storage
System SSR212CC ships with one 500W power supply
7.2 Amperes at 110 Vrms, 3.5 A at 220 Vrms (each power supply
module)
20.0 A
(total combined power for the+ 3.3 V and +5 V outputs should not
exceed 120 W).
20.0 A
(total combined power for the+ 3.3 V and +5 V outputs should not
exceed 120 W).
18.0 A
(total combined power for the +12 V outputs should not exceed
360 W).
18.0 A
(total combined power for the +12 V outputs should not exceed
360 W).
18.0 A
(total combined power for the +12 V outputs should not exceed
360 W).
0.5 A (each power supply module)
2.0 A (each power supply module)
Ambient Temperature
Relative Humidity
Acoustics
Electrostatic
Discharge
Safety Compliance
Argentina
Canada
China
Revision 1.2 3
Operating (system): 10 degrees Celsius to +35 degrees Celsius,
with maximum change not to exceed 10 degrees Celsius per hour;
non-operating (system): -40 degrees Celsius to +70 degrees
Celsius.
Non-operating: 90% @ 35 degrees Celsius non-condensing
< 7.0 BA (rack-mount) in an idle state in an normal office
environment (23 degrees Celsius)
15 KV per Intel test specification
IRAM
UL60950 – CSA (60950 (UL and cUL)
GB4943- CNCA Certification
Page 12
Feature Summary Intel® Storage System SSR212CC
Europe, CE Mark
Germany
International
Nordic Countries
Russia
United States
EN60950 (complies with73/23/EEC)
GS License
IEC60950 (CB Report and Certificate)
EMKO-TSE (74-SEC) 207/94
GOST 50377-92
UL– 60950 – CSA 60950 (UL and cUL)
Electromagnetic Capability (Class A) (EMC)
Australia/New Zealand
Canada
China
AS/NZS 3548 (based on CISPR 22)
ICES-003
GB 9254 - CNCA Certification
GB 17625 - (Harmonics) CNCA Certification
Europe, CE Mark
EN55022; EN55024 & EN61000-3-2;-3-3 (complies with
89/336/EEC)
International
Japan
Korea
Russia
Taiwan
United States
CISPR 22
VCCI
RRL, MIC 1997-41 & 1997-42
GOST 29216-91 & 50628-95
CNS13438
FCC, Part 15
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Intel® Storage System SSR212CC Feature Summary
1.1 System Components
A block diagram of the storage system functional components is shown below.
Figure 2. Intel® Storage System SSR212CC Block Diagram
Revision 1.2 5
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Feature Summary Intel® Storage System SSR212CC
The components included with this storage system are diagrammed below.
Figure 3. System Components
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Intel® Storage System SSR212CC Feature Summary
1.2 System Board Feature Set
The Intel® Server Board SE7520JR2 provides the following feature set, as implemented in the
Intel Storage System SSR212CC:
Feature Description
Processors Dual 604-pin Socket Support for FC-mPGA2P Low Voltage Intel® Xeon® processors
with 800 MHz systen bus speed.
NOTE: Intel® Storage System SSR212CC only supports a single Low Voltage
Intel® Xeon® processor 2.8 GHz with 800 MHz system bus and 1MB L2 cache.
Memory Six 240-pin DDR2-400 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for up to 12 GB Registered Error Correcting Code (ECC) system
memory , using DDR2-400 DIMMs.
Support for single-sided or double-sided DIMMs (DDR2-400)
SDRAM
Parts/SDRAM
Technology
used
X8 single row 128MB 256MB 512MB 1GB
X8 double row 256MB 512MB 1GB 2GB
X4 single row 256MB 512MB 1GB 2GB
X4 stacked
double row
Chipset Intel® E7520 chipset, consisting of:
Intel® E7520 Memory Controller Hub (MCH)
Intel® 6700 PCI-X Controller Hub (PXH)
Intel® ICH5-R I/O Controller Hub (ICH)
Intel® 8 Mb (1 MB) Firmware Hub (FWH)
128Mb 256Mb 512Mb 1Gb
512MB 1GB 2GB
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Feature Summary Intel® Storage System SSR212CC
Feature Description
Peripheral
Interfaces
LAN Intel® 82546GB Dual 10/100/1000 Megabits per second (Mb/s) Ethernet Local Area
Fans Support for four system fans (not implemented on SSR212CC).
BIOS AMI* BIOS with support for:
SSI interface
support
Four separate and independent PCI buses using Intel® Adaptive Slot Technology for
high throughput of data via an active 2U riser board:
• Segment 1 (from baseboard): 64-bit, 133 MHz, 3.3 V, supporting the following
configuration:
o One 64-bit/133 MHz PCI-X component
Intel® 82546GB Dual 10/100/1000
• Segment 2 (from baseboard): 64-bit, 133 MHz, 3.3 V, Full-length PCI supporting
the following configuration:
o One riser slot 64-bit/133 MHz PCI-X
Slot 1 SATA HBA #1.
• Segment 3 (from riser): 64-bit, 133 MHz, 3.3 V, Full-length PCI supporting the
following configuration:
o one slot: 64-bit/133 MHz PCI-X
Slot 2 SATA HBA #2.
• Segment 4 (from riser): 64-bit, 133 MHz, 3.3 V, Full-length PCI supporting the
following configuration:
o one slot: 64-bit/133 MHz PCI-X
Slot 3 used for expanded connectivity.
One RJ-45 serial port.
IDE interface for optional Disk On Module (DOM) support.
Network (LAN) Controller. Can be configured for failover or port aggregation.
Advanced Configuration and Power Interface (ACPI)
8 megabit symmetrical flash memory
Support for System Management Basic Input/Output System (SMBIOS)
Server System Infrastructure (SSI)-compliant connectors for SSI interface support:
front panel, power connector (not implemented on Intel® Storage System
SSR212CC).
Please refer to the Intel® Server Board SE7520JR2 Technical Product
Specification available at http://support.intel.com for more information on the
Storage System SSR212CC’s server board.
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Intel® Storage System SSR212CC Feature Summary
1.3 Serial ATA (SATA) Host Bus Adapter
The Intel® Storage System SSR212CC ships with two 8 port PCI-X to SATA Host Bus Adapters
(HBA). Each SATA HBA board provides the following feature set:
Feature Description
Number of ports
Serial ATA Bus Speed 1.5 and 3.0 Gb/s
Serial ATA Data Transfer rate 150 MB/s and 300 MB/s
PCI Bus width and speed 64-bit, 133 MHz
PCI Data transfer rate 1066 MB/s
RAID Levels 0, 1, 5, 10, 50
SDRAM Support 128 MB ECC DDR333 SDRAM
Cache function Write-back, Write-through, Adaptive Read Ahead, Non-Read Ahead, Read
Hot Spare Pool Yes
Hot Swap Yes
Enclosure Management Support Yes
Basic Input-Output (BIOS) RAID
Management Tools
RAID Management Tools Yes, via Intel® Storage Control Console (SCC)
Battery Back Up option Yes, with 72 hour minimum hold up time
8, using a single Marvell* 88SX6081 controller
are utilized per HBA on the Intel® Storage System SSR212CC.
Ahead, Cache I/O, Direct I/O
Yes, via BIOS RAID Management Tools
NOTE: Only 6 of the 8 ports
Please refer to the Intel® RAID Controller SRCS28X Hardware Users Guide
available at http://support.intel.com for more information.
1.4 SATA Hot Swap Backplane
The SATA Hot Swap backplane board provides the following feature set:
Feature Description
Supports up to 12
drives.
Enclosure
Management
Controller
FRU/Configuration
SEEPROM
Drive Status LEDs Support for separate drive status LEDs that are visible at the front of each drive
Audible Alarm A piezo-electric buzzer on the backplane provides an audible alarm (disabled on
Revision 1.2 9
Slots provided for docking up to twelve 1.5 or 3.0 Gigabits per second (Gb/s)
Serial ATA hot swap hard drives
• On-board Vitesse* VSC055 micro-controller with 256Kbit external SRAM
memory2 SATA Host Controller I2C Interfaces
• SATA and SATA-II extension compatibility
• Hot swap support for up to 12 SATA Drives
A Vitesse* VSC055* provides a serial EEPROM memory for storage of
configuration and product FRU information.
carrier. These LED’s indicate the following:
• Green LED –
o ON, Activity.
• Amber LED –
o ON, drive fault.
the Intel® Storage System SSR212CC).
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Feature Summary Intel® Storage System SSR212CC
The following figure shows the functional blocks of the SATA Hot Swap Backplane.
SATA 4-Lane Cable
SATA 4-Lane Cable
OPS Panel
SATA 4-Lane Cable
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
Serial ATA
(Data)
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
SATA Drive
Drive Status - GPIO
(Presence & Fault)
Alarm
Intrusion
Switch
4 lanes 4 lanes 4 lanes
RS232
4
Ops
Panel
I2C
2
OUT
3
GPIO
VSC055
Enclosure
Controller
GPIO
CPLD
12
Drive
Activity
FFC
2 x 12
Ops
Panel
IN
EEPROM
Temp
Trip
Sensor
Temp
Trip
Sensor
PSU_FAIL
POWER_OK
MUTE
BACKPLANE
+12V
+5V
+3.3V
Status
RS232
I2C
8 x TACHO
2 x PWM
FAN POWER
Interposer
Fan Tray
2x PCI-X SRCS28 8
port RAID adapter
SE7520JR2
500W PSU x 2
RESE
T
10 Revision 1.2
Figure 4. SATA HSBP Block Diagram
Page 19
Intel® Storage System SSR212CC Feature Summary
1.5 Enclosure Management
The enclosure management controller monitors various aspects of a storage enclosure.
Note: Enclosure Management Software is available from Intel for the Red Hat*
Enterprise Linux* AS 4, update 2 operating system. Intel® Server Management Software
is also available for Microsoft* Windows* Storage Server 2003 R2 and Microsoft*
Windows* Server 2003 Enterprise Edition SP1 operating systems. However, limited
enclosure management (no hard disk drive, fan or power supply monitoring) is provided
via Intel® Server Management software on the Intel Storage Server SSR212CC.
The enclosure management controller is comprised of the following elements and supports
associated features:
• Vitesse* VSC055 (Enhanced Two-Wire Serial controller)
o Drive fault LED
o Drive presence detection
o I2C link to Intel® Server Board SE7520JR2
o 8× fan speed (tacho) input
o 2× PWM output
o 3 I/O signals to operator panel capable of driving LED’s
• CPLD (Altera* EPM3128ATC100-10)
o Alarm output
o Alarm event monitor (enclosure, disk drive and PSU status)
o Cooling module fault LED mounted to rear of backplane
o Software override capability through I2C
1.5.1 Fan Control
• PWM high-side drive configuration
• Fan tach filtering
• Protective diodes on all hot-swappable signal lines
1.5.2 Miscellaneous Functions
• I2C EEPROM for FRU data
1.5.3 I2C Serial Bus Interface
The enclosure management controller supports four independent I2C interface ports with bus
speeds of up to 400 Kb/s.
The figure below provides a block diagram of I2C bus connection implemented on the Storage
System SSR212CC SATA Hot Swap Backplane (HSBP).
Revision 1.2 11
Page 20
Feature Summary Intel® Storage System SSR212CC
TY
7
6
2
+5V
R147
R148
2K7
2K7
1%
3
I2C_SDA_BP
5
I2C_SCL_B
I2C_SDA_OP
I2C_SCL_OP
1%
I2C_SDA_
I2C_SCL_A
I2C_SDA_B
I2C_SCL_B
R81 0R
5%
R76 0R
5%
NO FIT
R8
5%
NO FIT
R8
5
NO FIT
R77 0R
5%
0R
0R0
NO FIT
R80 0R0
R88 0R0
R85 0R0
I2C Buffer for Backplane
+5
U7
8
I2C_SDA_A_BUF
I2C_SCL_A_BUF
I2C Buffer for Ops Panel
5%
5%
5%
I2C_SDA_B_BUF
I2C_SCL_B_BU
+5
U
8
Vdd
1
7
3
SDA
T
2
SCL
R
5
6
Vss
RY
4
P82B96TD
Vdd
1
SDA
TX
SCL
RX
TY
Vss
RY
4
P82B96TD
+5
R95
R9
2K
2K
1%
1%
Figure 5. SATA HSBP I2C Bus Connection Diagram
1.5.4 Hard Disk Drive LEDs
The Intel® Storage System SSR212CC SATA HSBP contains two LEDs for each of the twelve
drive slots.
Table 1. HDD LED Function
Activity Light States
Drive Status LED
Idle Both Off
Access in Progress Green Blinking
Fault Amber On
1.6 Chassis Dimensions and Weight
Table 2. Chassis Dimensions and Weight
Height 86.7 mm 3.41 inches
Width 447 mm 17.6 inches
Depth 631 mm 24.8 inches
Weight
Chassis - as shipped (0 drives)
Chassis - fully configured (12 drives)
Shipping container
19.1 kilogram
30.4 kilogram
3.2 kilogram
42 pounds
67 pounds
7 pounds
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Intel® Storage System SSR212CC Feature Summary
1.7 Back Panel I/O Ports and Features
At the rear of the chassis is a serial management port and two 10/100/1000 Network Interface
Card (NIC) connectors. The Input/Output (I/O) connectors are integrated to the back panel. The
figure below shows the rear of the storage system.
Figure 6. Chassis Rear
Revision 1.2 13
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Feature Summary Intel® Storage System SSR212CC
1.8 Front Panel and HDD Bays
Figure 7. Chassis Front and Rear
14 Revision 1.2
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Intel® Storage System SSR212CC Feature Summary
1.8.1 Front/Rear Panel Controls and Indicators
The front/rear panel controls and indicators are defined below:
Table 3. Rear Control Button Functions
Power button Toggles the system power on/off.
Reset button Reboots the system.
Table 4. Front LED Indicator Status
Power On Continuous green light indicates the system has power applied to it.
No light indicates the system does not have power applied to it (other than 5 V
standby power).
Fault Continuous amber light indicates fault present.
Enclosure ID The blue system identification LED is used to help identify a system for
servicing. This is especially useful when the system is installed within a high
density rack or cabinet that is populated with several similar systems.
1.9 Fan Monitoring
The fans provided in the Storage System SSR212CC contain a tachometer signal that can be
monitored by enclosure management software.
1.10 Rack and Cabinet Mounting Options
The chassis was designed to support cabinets that are 19 in (483 mm) wide by up to 36 in (914
mm) deep, and are compliant to the SSI Server Rack specification and EIA 310-D. A set of
Rack Mounting Rails are provided and will accommodate either square or round hole rack
mounting methods.
Revision 1.2 15
Figure 8. Front Panel
Page 24
Feature Summary Intel® Storage System SSR212CC
When mounting the system into a cabinet, the front mount brackets are attached to the front of
the chassis, and a set of rear support brackets are attached to the back of the cabinet. This
allows the weight of the system to be as evenly distributed as possible.
Figure 9. Rack Mounting
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Intel® Storage System SSR212CC Power Sub-System
2. Power Sub-System
This section provides an overview of the Storage System SSR212CC power supply subsystem; the power supply enclosure and the power supply module.
SSR212CC ships with one 500 Watt power supply module.
2.1 Power Supply Enclosure
The Storage System SSR212CC accommodates one or two 500 Watt (W) redundant power
supply modules.
PARAMETER MIN RATED MAX Max Input
Voltage (low-line) 90 V
Voltage (high-line)
180 V
Frequency 47 Hz 63 Hz
The system can operate with one failed module without loss of performance until the failed
module is replaced. The modules can be replaced without powering down or disturbing system
operation. The power supply is designed to minimize EMI.
100-127 V
rms
rms
200-240 V
140 V
rms
264 V
rms
NOTE: The Storage System
Current
7.2 A
rms
3.5 A
rms
rms
rms
Figure 10. Power Supply Enclosure
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Power Sub-System Intel® Storage System SSR212CC
2.1.1 Hot Swapping Power Modules
The Storage System SSR212CC power supply assembly is capable of supporting hot swapping
of power supply modules in a 1+1 configuration.
2.1.2 Power Supply Outputs
The Storage System SSR212CC power system supports one or two 500 W Power Supply
module’s in a 1+1 redundant configuration. The power supply module provides five DC output
rails; +12V1, +12V2, +12V3, -12V, +5VSB, while the Power Supply Enclosure provides two DC
output rails: +3.3V and +5V.
Table 5. Enclosure & Module Output Summary (500W 10 second peak ratings)
+3.3V +5V +12V1 +12V2 +12V3 -12V 5VSB
20A 20A 18A 18A 18A 0.5A 2.5A
NOTE: The total combined power for +3.3V & +5V should not exceed 120W. The total combined power for +12V, 12V, 5VSB should not exceed 360W.
The module provides a handle to assist in insertion and extraction and can be inserted and
extracted without the assistance of tools.
2.1.2.1 Power Supply LED Indicator
The power supply module provides a single external bi-color LED to indicate the status of the
power supply. When AC is applied to the Power Supply Unit (PSU) and standby voltages are
available, the LED will blink green. The LED will be solid on green to indicate that all the power
outputs are available. The LED will be solid on amber to indicate that the power supply has
failed, shutdown due to over current, shutdown due to over temperature, or is indicating a
predictive failure. Refer to the following table for conditions of the LED.
Table 6. LED Indicators
POWER SUPPLY CONDITION Power Supply LED
No AC power to all PSU OFF
No AC power to this PSU only AMBER
AC present / Only Standby Outputs
BLINK GREEN
On
Power supply Direct Current (DC)
GREEN
outputs ON and OK
Power supply failure (includes over
AMBER
voltage, over temperature)
Voltage Regulator Module (VRM)
BLINK GREEN
failure (cage related)
240VA limit (cage related) BLINK GREEN
Current limit AMBER
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Intel® Storage System SSR212CC Power Sub-System
2.2 Output Power/Currents
The following table defines power and current ratings for this 500 Watt continuous (606 Watts
peak) power supply in 1+0 or 1+1 redundant configuration. The combined output power of both
outputs shall not exceed the rated output power. The power supply must meet both static and
dynamic voltage regulation requirements for the minimum loading conditions. Also, the power
supply shall be able to supply the listed peak currents and power for a minimum of 10 seconds.
Outputs are not required to be peak loaded simultaneously.
Table 7. Load Ratings
+3.3V +5V +12V1 +12V2 +12V3 -12V 5VSB
MAX 20A 20A 18A 18A 18A 0.5A 2.0A
MIN STATIC 0.5A 0.5A 1.5A 1.5A 0.5A 0A 0A
MIN DYNAMIC 2A 2A 1.5A 1.5A 1.5A 0A 0A
NOTE: The total combined power for +3.3V & +5V should not exceed 120W. The total combined power for +12V, 12V, 5VSB should not exceed 360W.
2.3 Voltage Regulation
The power supply output voltages must stay within the following voltage limits when operating
at steady state and dynamic loading conditions. All outputs are measured with reference to the
return remote sense signal (ReturnS).
Table 8. Voltage Regulation Limits
PARAMETER
+3.3V +3.25 +3.30 +3.35 V
+5V +4.90 +5.00 +5.10 V
+12V1 +11.76 +12.00 +12.24 V
+12V2 +11.76 +12.00 +12.24 V
+12V3 +11.76 +12.00 +12.24 V
-12V -11.40 -12.20 -13.08 V
+5VSB +4.85 +5.00 +5.20 V
MIN NOM MAX UNITS TOLERANCE
+1.5/-1.5%
rms
+2/-2%
rms
+2/-2%
rms
+2/-2%
rms
+2/-2%
rms
+9/-5%
rms
+4/-3%
rms
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Power Sub-System Intel® Storage System SSR212CC
2.3.1 Dynamic Loading
The output voltages shall remain within limits specified in Table 9 for the step loading and
capacitive loading specified in Table 10, below. The load transient repetition rate shall be
tested between 50 Hz and 5 KHz at duty cycles ranging from 10%-90%. The load transient
repetition rate is only a test specification. The ∆ step load may occur anywhere within the MIN
load to the MAX load shown in Table 10.
Table 9. Transient Load Requirements
Output
∆∆∆∆ Step Load
Size
+3.3V 6A
+5V 6A
+12V1 13A
+12V2 5A
+12V3 5A
+5VSB 1A
Load Slew Rate
Capacitive
Load
0.5 A/µsec 5,600 µF
0.5 A/µsec 1,000 µF
0.5 A/µsec 1,000 µF
0.5 A/µsec 1,000 µF
0.5 A/µsec 1,000 µF
0.5 A/µsec 0 µF
2.4 Capacitive Loading
The power supply shall be stable and meet all requirements with the following capacitive
loading ranges. Min capacitive loading applies to static load only.
Table 10. Capacitive Loading Conditions
Output Minimum
Turn-on
Capacitance
+3.3V 10 68,000
+5V 10 24,000
+12V1 10 11,000
+12V2 10 11,000
+12V3 10 11,000
-12V 1 350
+5VSB 1
Maximum
Dynamic
Capacitance
350
Units
µF
µF
µF
µF
µF
µF
µF
2.5 Protection Circuits
Protection circuits inside the power supply shall cause only the power supply’s main outputs to
shutdown. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF
for 15 sec and a PSON# cycle HIGH for 1sec shall be able to reset the power supply.
2.5.1 Over-Current Protection (OCP)
The power supply shall have current limit to prevent the +12 V and 5Vsb outputs from
exceeding the values shown below. If the current limits are exceeded the power supply shall
shutdown and latch off. The latch will be cleared by toggling the PSON# signal or by an AC
power interruption. The power supply shall not be damaged from repeated power cycling in this
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Intel® Storage System SSR212CC Power Sub-System
condition. 5Vsb shall be protected under over-current or shorted conditions, so that no
damage can occur to the power supply.
Table 11. Over Current Protection Limits
VOLTAGE OVER CURRENT LIMIT
(Iout limit)
+3.3V <30A
+5V <30A
+12V1 18.2A
+12V2 18.2A
+12V3 18.2A
-12V Short Circuit
5VSB Short Circuit
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Power Sub-System Intel® Storage System SSR212CC
2.5.2 Over Voltage Protection (OVP)
The power supply over voltage protection shall be locally sensed. The power supply shall
shutdown and latch off after an over voltage condition occurs. This latch shall be cleared by
toggling the PSON# signal or by an AC power interruption. Table 13 contains the over voltage
limits. The values are measured at the output of the power supply’s connectors. The voltage
shall never exceed the maximum levels when measured at the power pins of the power supply
connector during any single point of fail. The voltage shall never trip any lower than the
minimum levels when measured at the power pins of the power supply connector.
Table 12. Over Voltage Protection (OVP) Limits
Output Voltage MIN (V) MAX (V)
+3.3V 3.8 4.3
+5V 5.7 6.5
+12V1 13.5 15.0
+12V2 13.5 15.0
+12V3 13.5 15.0
-12V -13.3 -14.5
+5VSB 5.7 6.5
2.5.3 Over Temperature Protection (OTP)
The power supply will be protected against over temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the PSU will shutdown. When
the power supply temperature drops to within specified limits, the power supply shall restore
power automatically. The OTP circuit must have built in hysteresis such that the power supply
will not oscillate on and off due to temperature recovering condition. The power supply shall
alert the system of the OTP condition via the power supply FAIL signal and the amber LED.
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Intel® Storage System SSR212CC System Cooling Module
TP01780
3. System Cooling Module
The Storage System SSR212CC includes a cooling module that has three dual rotor 40 mm
fans and two single rotor 40 mm fans, mounted in a common frame for ease of maintenance.
The fans are mounted in a single fan tray located in the center of the chassis. The Power
Supply enclosure contains one 60 mm fan for cooling the power supply modules.
3.1 Fan Control
Each fan within the module is capable of supporting multiple speeds. At normal room ambient
of 23 degrees Celsius (C), the fans will run at slow speed for best acoustic performance. If the
external temperature of the system increases, the backplane fan control circuitry will increase
fan speed to compensate for the increased ambient.
Revision 1.2 23
Figure 11. Cooling Module
Page 32
Chassis Bays Intel® Storage System SSR212CC
4. Chassis Bays
The Storage System SSR212CC chassis provides twelve hard drive bays at the front of the
chassis. All hard drive bays may be populated with a carrier-mounted 3.5 inch SATA hard disk
drive.
Figure 12. Drive Bay Removal
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Intel® Storage System SSR212CC Chassis Bays
4.1 Hard Disk Drive Bays
The Storage System SSR212CC chassis can support up to twelve carrier-mounted SATA, 3.5
inch x 1 inch, hard disk drives. The SATA drives may be “electrically” hot-swapped while the
system power is applied, i.e., before or during POST.
NOTE:
1) Drive bays 1 thru 6 are controlled by a single Intel® RAID Controller SRCS28X, while drive bays 7
thru 12 are controlled by a second Intel® RAID Controller SRCS28X.
2) To correspond with cable connection across both SRCS28X SATA HBAs, all drives must be
populated in order, from left to right, top to bottom, in drive bay 1 thru drive bay 12, sequentially
distributed across both SRCS28X SATA HBA’s. For example, if only 8 drives are installed, 6
drives should be inserted into bays 1 thru 6, and two drives inserted into bays 7 and 8.
1 2 3 4
5 6 7 8
9 10 11 12
3) HDD labels are provided in your Storage System SSR212CC shipping container to number the
drives 1 thru 12.
4)
If a failed drive needs replacing, it should be replaced with the exact same manufacturer, model,
and size.
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Chassis Bays Intel® Storage System SSR212CC
Figure 13. Hard Disk Drive Bays
4.1.1 Hard Disk Drive Carrier
Each hard drive used in the system must be mounted to a drive carrier, making insertion and
extraction of the drive from the chassis very simple. Each drive tray has its own dual purpose
latching mechanism that is used to both insert/extract drives from the chassis and lock the
carrier in place, and also has a safety locking mechanism to aid in the prevention of accidental
removal of a drive. After the drive is inserted and latched, the locking feature is enabled by
rotating the locking mechanism using the provided Torx* or “star” bit tool, such that the latch
can not be depressed to remove the drive. To remove the drive, turn the locking mechanism
until the latch can be depressed to remove the drive. Each drive carrier also supports a light
pipe providing a drive status indicator, located on the backplane, to be viewable from the front
of the chassis.
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Intel® Storage System SSR212CC Chassis Bays
Figure 14. Hard Drive Carrier Assembly
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System Interconnection Intel® Storage System SSR212CC
5. System Interconnection
5.1 Chassis Internal Cables and Connector
The following cables and connectors are provided:
•
Three SFF-8484 vertical four lane Serial ATA (SATA) cables ship with the Storage
System SSR212CC. These cables support the twelve expansion drives and provide
interconnect between the backplane and the two SATA HBA’s.
5.2 I/O Panel Connectors
The Storage System SSR212CC provides an aperture for the rear I/O ports. The following are
the I/O ports available:
• Two RJ-45 LAN connectors
• One RJ-45 Serial B Port
• One Stacked PS2 port for keyboard & mouse
• One DB15 video connector
• One USB 2.0 port
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Intel® Storage System SSR212CC System Interconnection
5.3 SATA HSBP Connectors
5.3.1 SATA 4-Lane Connector
The following table defines the pin-outs of the three SATA 4-Lane Drive Connectors. The first
connector carries signals from drive 1 to 4, the second connector is connected to drives 5 to 8
and the third connector connects to drives 9 to 12.
Table 13. SATA 4-Lane Connector Pin-out
Pin Signal Name Pin Signal Name
1 GND 17 HBA_ACT7
2 DRIVE4_PORT3 18 NC.
3 DRIVE4_PORT2 19 NC.
4 GND 20 GND
5 DRIVE4_PORT1 21 DRIVE6_PORT3
6 DRIVE4_PORT0 22 DRIVE6_PORT2
7 GND 23 GND
8 DRIVE5_PORT3 24 DRIVE6_PORT1
9 DRIVE5_PORT2 25 DRIVE6_PORT0
10 GND 26 GND
11 DRIVE5_PORT1 27 DRIVE7_PORT3
12 DRIVE5_PORT0 28 DRIVE7_PORT2
13 GND 29 GND
14 HBA_ACT4 30 DRIVE7_PORT1
15 HBA_ACT5 31 DRIVE7_PORT0
16 HBA_ACT6 32 GND
16 HBA_ACT2 32 GND
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System Interconnection Intel® Storage System SSR212CC
5.3.2 Interposer Connector
The following table defines the pin-outs of the Interposer Connector.
Table 14. Interposer Connector
Pin Signal Name Pin Signal Name
1 POWER_SW ITCH 2 GND
3 GND 4 GND
5 FAN_PWR_BANK2 6 GND
7 FAN_PWR_BANK2 8 GND
9 FAN_PWR_BANK2 10 GND
11 I2C_SCL_A 12 FAN_TACHO0
13 I2C_SDA_A 14 FAN_TACHO1
15 I2C_SCL_B 16 FAN_TACHO2
17 I2C_SDA_B 18 FAN_TACHO3
19 COM_TX 20 FAN_TACHO4
21 COM_CTS 22 FAN_TACHO5
23 COM_RX 24 FAN_TACHO6
25 COM_RTS 26 FAN_TACHO7
27 FAN_PW R_BANK1 28 GND
29 FAN_PW R_BANK1 30 GND
31 FAN_PW R_BANK1 32 GND
33 GND 34 GND
35 GND 36 GND
5.3.3 Power Connector
The following table defines the pin-outs of the 2x12 Power Connectors.
Table 15. Power Connector Pin-out
Pin Signal Name Pin Signal Name
1 +12V 13 GND
2 +12V 14 GND
3 +12V 15 GND
4 +12V 16 GND
5 +12V 17 GND
6 +5V 18 GND
7 +5V 19 GND
8 +5V 20 GND
9 +3.3V 21 GND
10 +3.3V 22 GND
11 MUTE_L 23 PSU_FAIL_L
12 POWER_SWITCH 24 PSU_POK
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Intel® Storage System SSR212CC System Interconnection
5.3.4 Front Panel Connector
The following table defines the pin-outs of the 1x14 Front Panel connector.
Table 16. Front Panel Power Connector
Pin Signal Name
1 GND
2 COM_CTS
3 COM_RX
4 COM_TX
5 COM_RTS
6 GND
7 +5V_OPS
8 +5V_OPS
9 I2C_SDA_OPS
10 I2C_SCL_OPS
11 LED1_OPS/SPARE1 (power)
12 LED2_OPS/SPARE2 (fault)
13 LED3_OPS/SPARE3 (ID)
14 GND
5.3.5 SATA Host I2C Header
The following table defines the pin-outs of the two 3-pin SATA Host I2C Headers.
Table 17. SATA Host I2C Header Pin-out
Pin Signal Name
1 I2C_SCL_A
2 GND
3 I2C_SDA_A
Pin Signal Name
1 I2C_SCL_B
2 GND
3 I2C_SDA_B
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Regulatory Information Intel® Storage System SSR212CC
6. Regulatory Information
6.1 Product Regulation Requirements
Intended Application –
(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type
locations. The suitability of this product for other product categories and environments (such as:
medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment,
etc.), other than an ITE application, may require further evaluation.
6.1.1 Product Safety Compliance
UL60950 – CSA 60950(USA / Canada)
EN60950 (Europe)
IEC60950 (International)
CB Certificate & Report, IEC60950 (report to include all country national deviations)
GS License (Germany)
GOST R 50377-92 - License (Russia)
Belarus License (Belarus)
Ukraine License (Ukraine)
CE - Low Voltage Directive 73/23/EEE (Europe)
IRAM Certification (Argentina)
GB4943- CNCA Certification (China)
This product was evaluated as Information Technology Equipment
6.1.2 Product EMC Compliance – Class A Compliance
Note: Legally the product is required to comply with Class A emission requirements as it
is intended for a commercial type market place. Intel targets 10db margin to Class A
Limits
FCC /ICES-003 - Emissions (USA/Canada) Verification
CISPR 22 – Emissions (International)
EN55022 - Emissions (Europe)
EN55024 - Immunity (Europe)
EN61000-3-2 - Harmonics (Europe)
EN61000-3-3 - Voltage Flicker (Europe)
CE – EMC Directive 89/336/EEC (Europe)
VCCI Emissions (Japan)
AS/NZS 3548 Emissions (Australia / New Zealand)
BSMI CNS13438 Emissions (Taiwan)
GOST R 29216-91 Emissions (Russia)
GOST R 50628-95 Immunity (Russia)
Belarus License (Belarus)
Ukraine License (Ukraine)
RRL MIC Notice No. 1997-41 (EMC) & 1997-42 (EMI) (Korea)
GB 9254 - CNCA Certification (China)
GB 17625 - (Harmonics) CNCA Certification (China)
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Intel® Storage System SSR212CC Regulatory Information
6.1.3 Certifications / Registrations / Declarations
UL Certification (US/Canada)
CE Declaration of Conformity (CENELEC Europe)
FCC/ICES-003 Class A Attestation (USA/Canada)
VCCI Certification (Japan)
C-Tick Declaration of Conformity (Australia)
MED Declaration of Conformity (New Zealand)
BSMI Certification (Taiwan)
GOST R Certification / License (Russia)
Belarus Certification / License (Belarus)
RRL Certification (Korea)
IRAM Certification (Argentina)
Ecology Declaration (International)
GB4943- CNCA Certification (China)
6.1.4 Component Regulation Requirement Need to Support System Level Certifications
Component Power Supplies must have the following certifications:
UL, cUL
German Bauart
CNCA China Certification
Ctick DOC
BSMI DOC
RRL License
CE DOC
CB Report (including all national deviations).
All peripheral devices, such as CD ROMS, Disk drives, Tape drives shall have the following
certifications: UL or CSA NRTL, CSA or cUL, and TUV or VDE and SEMKO or NEMKO or
DEMKO or FIMKO, CE, and FCC.
All Fans shall have the minimum certifications: UL and TUV or VDE
All current limiting devices shall have UL and TUV or VDE certifications and shall be suitable
rated for the application where the device in its application complies with IEC60950.
All lithium batteries shall be UL recognized and battery circuits are to have suitable reverse bias
current protection for the application it is used in.
All printed wiring boards shall be rated UL94V-0 and be sourced from a UL approved printed
wiring board manufacturer.
All connectors shall be UL recognized and have a UL flame rating of UL94V-0.
All wiring harnesses shall be sourced from a UL approved wiring harness manufacturer. SELV
Cable to be rated minimum 80 V.
All plastics used must be made of a UL recognized material, and have the appropriate flame
ratings mandated by IEC60950 per system level requirements. All plastics parts shall be
manufactured by an UL approved fabricator and the parts shall be marked with the appropriate
UL traceability markings. Markings to include:
Plastic Fabricators name and/or UL Fabricator ID
Material Name (for example GE, C2800)
Date Code
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Regulatory Information Intel® Storage System SSR212CC
Product safety label must be printed on UL approved label stock and printer ribbon.
Alternatively labels can be purchased from a UL approved label manufacturer.
The product must be marked with the correct regulatory markings to support the certifications
that are specified.
Product documentation shall incorporate all safety required information to conform to certifiers
and regulators and the certifications issued for the product.
6.1.5 Product Ecology Requirements
All materials, parts and subassemblies must not contain restricted materials as defined in Intel’s
Environmental Product Content Specification of Suppliers and Outsourced Manufacturers –
http://supplier.intel.com/ehs/environmental.htm.
All plastic parts shall not use brominated flame retardant or any other halogenated retardants
that are not accepted by environmental programs such as Blue Angels, Nordic White Swan,
and Swedish TCO.
All plastic parts that weigh >25gm shall be marked with the ISO11469 requirements for
recycling. Example >PC/ABS< .
Packaging materials may not contain more than 100 ppm (total) of lead, cadmium, chromium or
mercury.
If sold as a retail product, packaging materials must be marked with applicable recycling logos
for Europe (green dot) and Japan (Eco-marks).
Product documentation shall incorporate all safety required information to conform to certifiers
and regulators and the certifications issued for the product.
All cords and cables shall contain < 100 ppm of cadmium.
6.2 Restriction of Hazardous Substances (RoHS)
Intel has a system in place to restrict the use of banned substances in accordance with the
European Directive 2002/95/EC. Compliance is based on declaration that materials banned in
the RoHS Directive are either (1) below all applicable substance threshold limits or (2) an
approved/pending RoHS exemption applies.
Note: RoHS implementing details are not fully defined and may change.
Threshold limits and banned substances are noted below.
Quantity limit of 0.1% by mass (1000 PPM) for:
o Lead
o Mercury
o Hexavalent Chromium
o Polybrominated Biphenyls Diphenyl Ethers (PBDE)
Quantity limit of 0.01% by mass (100 PPM) for:
o Cadmium
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Intel® Storage System SSR212CC Environmental Limits
7. Environmental Limits
7.1 System Office Environment
Table 18. Intel® Storage System SSR212CC System Office Environment Summary
Parameter Limits
Operating Temperature 10 degrees celcius to +35 degrees celcius with the maximum rate of
change not to exceed 10 degrees celcius per hour.
Non-Operating Temperature -40 degrees celcius to +70 degrees celcius
Non-Operating Humidity 95%, non-condensing at 35 degrees celcius
Acoustic noise 7.0 BA (Rackmount) in an idle state at typical office ambient
temperature. (23 ± degrees celcius)
Operating Shock No errors with a half sine wave shock of 2 Giga (1.024 x 109) (G) (with
11 millisecond duration)
Package Shock Operational after a 30 inch free fall, although cosmetic damage may be
present (chassis weight 30 lbs)
Electrostatic Discharge (ESD) ±15 Kilovolt (KV) per Intel® Environmental test specification
System Cooling Requirement
in British Thermal Units (BTU)
per Hour
2275 BTU/hour
7.2 System Environmental Testing
The system has been tested per the Intel® Environmental Standards Handbook, Intel document
number 662394-03. These tests include:
•
Temperature Operating and Non-Operating
•
Humidity Non-Operating
•
Packaged and Unpackaged Shock
•
Packaged and Unpackaged Vibration
•
AC Voltage, Frequency and Source Interrupt
•
AC Surge
•
Acoustics
•
ESD
•
EMC Radiated Investigation
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Environmental Limits Intel® Storage System SSR212CC
7.3 Environmental Limits
The following table summarizes environmental limits, both operating and non-operating.
Table 19. Intel® Storage System SSR212CC Operating and Non-Operating Environmental Limits
Temperature Specification
Non-operating -40 degrees celcius to 70 degrees celcius
Operating Temperature 10 degrees celcius to 35 degrees celcius
Thermal Map Must not exceed maximum Integrated Circuit (IC) junction temperature as specified
in the component data sheets (CPDs).
Thermal Shock Specification
Non-operating -40 degrees celcius to 70 degrees celcius
Humidity Specification
Non-operating 92% Relative Humidity (RH) at +50 degrees celcius
Vibration Specification
Non-Operating:
Shock Specification
Non-operating 25 G, 11 millisecond (msec)
ESD Specification
Operating Test (air) to 15 KV and (contact) to 2-8KV with limited errors.
EMI Specification
Operating Required to meet EMI emission requirements, tested as part of system.
2.2 Grms 5-500Hz for the unpackaged and 1.09 Grms 5-500Hz for the
packaged.
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Intel® Storage System SSR212CC Serviceability and Availability
8. Serviceability and Availability
The system is designed to be serviced by qualified technical personnel only.
The desired Mean Time To Repair (MTTR) of the system is TBD minutes, including diagnosis
of the system problem. To meet this goal, the system enclosure and hardware have been
designed to minimize the MTTR.
Below are the maximum times that a trained field service technician should take to perform the
listed system maintenance procedures, after diagnosis of the system, and with the system
powered down and unplugged.
•
Remove top cover 0.5 minutes
•
Remove and replace a hard disk drive 0.5 minutes
•
Remove and replace power supply 0.5 minutes
•
Remove and replace fan assembly 1 minute
•
Remove and replace SATA add-in cards 5 minutes
•
Remove and replace baseboard 10 minutes
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Calculated MTBF Intel® Storage System SSR212CC
9. Calculated MTBF
The Mean Time Between Failures (MTBF) for the Storage System SSR212CC is calculated at
27,196 hours operating at 40 degrees C. The following table shows the MTBF numbers for
individual components within the chassis, and does not include hard disk drives.
Table 20. Intel® Storage System SSR212CC Component MTBF Numbers
Subassembly
(System in 40 oC ambient air)
System Board (SE7520JR2) 215,000
500 W Power Supply 126,710
Hot Swap SATA Backplane 1,126,100
Fan Tray & Interposer 35,143,386
Fans (5x) 236,340
Front Panel Ops board 53,037,303
SRCS28X SATA Eight Channel RAID adapter 470,000
Battery Backup Unit for SRCS28X SATA Eight Channel RAID adapter 1,800,000
MTBF (hours)
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Intel® Storage System SSR212CC Glossary
Glossary
Word / Acronym Definition
A Ampere
AC Alternating Current
ACA Australian Communication Authority
ACPI Advanced Configuration and Power Interface
ANSI American National Standards Institute
ATA AT Attachment
BA Decibel Average
BMC Baseboard Management Controller
BTU British Thermal Units
C Celsius
CF Compact Flash®
CMOS Complementary Metal Oxide Silicon
CPD Component Data Sheet
D2D DC-to-DC
dBA Decibel Average
DDR Double Data Rate
DIMM Dual Inline Memory Module
DMA Direct Memory Access
DOM Disk On Module
ECC Error Correcting Code
EEB Entry-Level Electronics Bay
EEPROM Electrical Erasable Programmable Read-Only Memory
EMC Electro Magnetic Compatibility
EMP Emergency Management Port
ESD Electrostatic Discharge
FC Fibre Channel
FP Front Panel
FRB Fault Resilient Boot
FRU Field Replaceable Unit
FW Firmware
FWH Firmware Hub
G Giga (1.024 x 109)
GB Gigabyte
Gb/s Gigabits per Second
GHz Gigahertz
HBA Host Bus Adapter
HDD Hard Disk Drive
HSBP Hot Swap Backplane
Hz Hertz
IBL Intel Business Link
IC Integrated Circuit
Revision 1.2 I
Page 48
Glossary Intel® Storage System SSR212CC
ICH I/O Controller Hub
IDC Internet Database Connector
IDE Integrated Drive Electronics
IMM Intel® Management Module
I/O Input/Output
iSCSI Internet Protocol Small Computer System Interface
ITE Information Technology Equipment
K Kilo (1.024 x 103)
KB Kilobyte
KV Kilovolt
KHz Kilohertz
LAN Local Area Network
LED Light-Emitting Diode
LPC Low-Pin Count
MB Megabyte
Mb/s Megabits per second
MCH Memory Controller Hub
MHz Megahertz
mm Millimeter
msec Millisecond
MTBF Mean Time Between Failure
MTTR Mean Time to Repair
NIC Network Interface Card
OTP Over-Temperature Protection
OVP Over-Voltage Protection
PCI Peripheral Component Interconnect
PDB Power Distribution Board
PFC Power Factor Correction
PIO Programmed Input/Output
PLD Programmable Logic Device
PSON Power Supply On
PSU Power Supply Unit
PWT Processor Wind Tunnel
RAID Redundant Array of Inexpensive Disks
RH Relative Humidity
RI Ring Indicate
SAN Storage Area Network
SATA Serial AT Attachment (aka., Serial ATA)
SCA Single Connector Attachment
SCC Storage Control Console
SDR Sensor Data Record
SDRAM Synchronous Dynamic Random Access Memory
SE Single-Ended
SMBIOS System Management Basic Input/Output System
SOIC Small Outline Integrated Circuit
SRAM Static Random Access Memory
II Revision 1.2
Page 49
Intel® Storage System SSR212CC Glossary
SSI Server System Infrastructure
TQFP Thin Quad Flat Pack
TB Terabyte
UART Universal Asynchronous Receiver Transmitter
µF
µS
USB Universal Serial Bus
V Volt
VA Volt-Amp
VCCI Voluntary Control Council for Interference
VQFP Very Thin Quad Flat Pack
VRM Voltage Regulator Module
W Watt
Micro Farad (1 x 10-6 Farads)
Micro Second (1 x 10-6 Second)
Revision 1.2 III
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