Intel SSDSCKKF240H6X1 User Manual

Capacities: 120, 180, 240, 360, 480, 1000 GB Form Factors:

 80mm (single-sided) 2280-S3-B-M

(120, 180, 240, 360, 480 GB)

 80mm (double-sided) 2280-D3-B-M (1000 GB)

 Thickness:

 S3 – up to 2.38 mm  D3 – up to 3.73mm

Weight: <7 grams

SATA 6Gb/s Bandwidth Performance

1,2

(IOMeter* Queue Depth 32)

 Sequential Read: up to 560MB/s  Sequential Write: up to 480MB/s

Read and Write IOPS

1,2

(IOMeter Queue Depth 32)

 Random 4KB Reads: up to 84,000 IOPS  Random 4KB Writes: up to 85,000 IOPS

Intel

Stable Image Platform Program (SIPP)

Security and Manageability Compatibility

 Intel® Core® vPro® Processor  Intel® Setup and Configuration Software

(Intel® SCS)

 AES 256-bit Encryption  Trusted Computing Group* (TCG*) Opal Security

Subsystem Class (SSC) Specification Version 2.0 features

 Windows eDrive*

Additional Compatibility

 Intel® SSD Toolbox with Intel® SSD Optimizer  Intel® Data Migration Software  Intel® Rapid Storage Technology  SATA Revision 3.2  ACS-3 (ATA/ATAPI Command Set 3)  SSD Enhanced SMART ATA feature set

Power Management

 3.3 V SATA Supply Rail  SATA Link Power Management (LPM)  Device Sleep (DevSleep)  Advanced Power Management (APM)

Power

 Active (BAPCo MobileMark* 2012 Workload):

80 mW

 Idle

: 40 mW

 DevSleep: 3 mW

Temperature

 Operating

: 0° C to 70° C

 Non-Operating: -55° C to 95° C

Reliability

 Uncorrectable Bit Error Rate (UBER):

<1 sector per 1016 bits read

 Mean Time Between Failure (MTBF):

1.6 million hours

 Shock (non-operating):

1,000 G/0.5 ms

Vibration

 Operating: 2.17 GRMS (5-700Hz)  Non-operating: 3.13 GRMS (5-800Hz)

Certifications and Declarations:

 UL*  CE*  RCM*  BSMI*  KCC*  Microsoft* WHCK/WHLK  VCCI*  SATA-IO*

Product Ecological Compliance

 RoHS*

Intel® Solid State Drive Pro 5400s Series (M.2)

Product Specification

1. IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard,

Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DDR3-1555, Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.

2. Performance values vary by capacity.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the system for maintaining proper

device operating temperatures on heavier workloads.

Order Number: 334045-003US

Ordering Information

Revision Number

Description

Revision Date

001

 Initial release

March 2016

002

 Improved mechanical drawing resolution

April 2016

003

 Corrected MTBF to 1.6 million hours on Page 1

April 2016

Contact your local Intel sales representative for ordering information.

Revision History

Intel® Solid State Drive Pro 5400s Series (M.2)

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

For more complete information about performance and benchmark results, visit http://www.intel.com/performance.

IOMeter Test and System Configurations: Intel® Core™ i7-4790 (8MB L3 Cache, 3.60GHz), ASUS* Deluxe Z97I-PLUS motherboard, Intel® HD Graphics 4600 driver 10.18.10.3920, BIOS: AMI* 2605 5/19/2015, Chipset: Intel® INF 10.0.16.0, Memory: 8GB (2X4GB) Kingston DDR3-1555, Intel® RST driver 13.5, Microsoft* Windows 7 Enterprise 64-bit with SP1.

All documented test results are obtained by Intel in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Intel, Intel Core i7-4790, Intel HD Graphics 4600 Driver, Intel INF, Intel RST and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Product Specification April 2016 2 334045-003US

Intel® Solid State Drive Pro 5400s Series (M.2)

Contents

1 Introduction ............................................................................................................................................................................................................. 5

1.1 Terminology ................................................................................................................................................................................................. 5

1.2 Reference Documents .............................................................................................................................................................................. 6

2 Product Specifications ....................................................................................................................................................................................... 7

2.1 Capacity .......................................................................................................................................................................................................... 7

2.2 Performance ................................................................................................................................................................................................. 7

2.3 Electrical Characteristics ......................................................................................................................................................................... 9

2.4 Environmental Conditions ................................................................................................................................................................... 10

2.4.1 Temperature, Shock, Vibration ......................................................................................................................................... 10

2.4.2 Altitude ......................................................................................................................................................................................... 10

2.5 Product Regulatory Compliance ....................................................................................................................................................... 10

2.6 Reliability ...................................................................................................................................................................................................... 11

3 Mechanical Information .................................................................................................................................................................................. 12

4 Pin and Signal Descriptions .......................................................................................................................................................................... 14

4.1 Pin Locations .............................................................................................................................................................................................. 14

4.2 Signal Descriptions .................................................................................................................................................................................. 15

5 Supported Command and Feature Sets ................................................................................................................................................. 17

5.1 Supported ATA General Feature Command Set........................................................................................................................ 17

5.2 Security Features ...................................................................................................................................................................................... 19

5.2.1 Sanitization Methods ............................................................................................................................................................. 19

5.2.2 TCG Opal SSC Support.......................................................................................................................................................... 20

5.2.3 Windows eDrive* ...................................................................................................................................................................... 20

5.3 DevSleep ...................................................................................................................................................................................................... 20

5.4 SMART Attributes ..................................................................................................................................................................................... 21

6 Certifications and Declarations ................................................................................................................................................................... 25

7 Appendix ................................................................................................................................................................................................................. 26

7.1 Identify Device ........................................................................................................................................................................................... 26

7.2 Models ........................................................................................................................................................................................................... 29

April 2016 Product Specification 334045-003US 3

Intel® Solid State Drive Pro 5400s Series (M.2)

Tables

Table 1: Terminology ............................................................................................................................................................................................. 5

Table 2: Standard References ............................................................................................................................................................................ 6

Table 3: User Addressable Sectors ................................................................................................................................................................. 7

Table 4: Compressible Performance .............................................................................................................................................................. 7

Table 5: Incompressible Performance ........................................................................................................................................................... 8

Table 6: Latency ....................................................................................................................................................................................................... 8

Table 7: Operating Voltage and Power Consumption ............................................................................................................................ 9

Table 8: Temperature, Shock, Vibration ..................................................................................................................................................... 10

Table 9: Reliability Specifications .................................................................................................................................................................. 11

Table 10: M.2 Serial ATA Power Pin Definitions ........................................................................................................................................ 15

Table 11: Supported ATA Commands and Feature Sets ....................................................................................................................... 17

Table 12: Supported Secure Erase Modes and Definitions .................................................................................................................. 19

Table 13: Supported Sanitize Device Modes and Definitions ............................................................................................................. 19

Table 14: ID Device Changes with Opal Activation ................................................................................................................................... 20

Table 15: DevSleep Control Parameters ....................................................................................................................................................... 21

Table 16: SMART Attributes ................................................................................................................................................................................ 21

Table 17: SMART Attribute Status Flags ....................................................................................................................................................... 24

Table 18: Device Certifications and Declarations ...................................................................................................................................... 25

Table 19: Identify Device Returned Sector Data ........................................................................................................................................ 26

Table 20: Available Models .................................................................................................................................................................................. 29

Figures

Figure 1: Dimensions for Full Size M.2 Drives............................................................................................................................................ 12

Figure 2: Layout of Signal and Power Segment Pins .............................................................................................................................. 14

Product Specification April 2016 4 334045-003US

Term

Description

AHCI*

Advanced Host Controller Interface

ATA

Advanced Technology Attachment

DAS

Device Activity Signal

DevSleep

Device Sleep

DIPM

Device Initiated Power Management

DMA

Direct Memory Access

DPTF

Dynamic Platform Thermal Framework

eDrive

Microsoft* specification for a drive that complies to the TCG Opal 2.0 and IEEE 1667* standards

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte (1,000,000,000 bytes) Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

HDD

Hard Disk Drive

HIPM

Host Initiated Power Management

I/O

Input/Output

IOPS

Input/Output Operations Per Second

Kilobyte (1,024 bytes)

LBA

Logical Block Address

Locking SP

Locking Security Provider

LPM

Link Power Management

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NCQ

Native Command Queuing

NOP

No Operation

Opal

A Trusted Computing Group (TCG) standard that defines an interface for managing a Self-Encrypting Drive (SED).

PIO

Programmed Input/Output

Intel® Solid State Drive Pro 5400s Series (M.2)

1 Introduction

This document describes the specifications and capabilities of the Intel® Solid State Drive Pro 5400s Series (Intel® SSD Pro 5400s Series).

1.1 Terminology

Table 1: Terminology

April 2016 Product Specification 334045-003US 5

Term

Description

PSID

Physical presence Security ID

RDT

Reliability Demonstration Test

RMS

Root Mean Squared

SLC

Single-level Cell

SATA

Serial Advanced Technology Attachment

SED

Self-Encrypting Drive

SMART

Self-Monitoring, Analysis and Reporting Technology

SSD

Solid State Drive

TCG

Trusted Computing Group

TYP

Typical

UBER

Uncorrectable Bit Error Rate

1.2 Reference Documents

Date or Rev. #

Title

Location

Sept 2008

IEC 55022 Information Technology Equipment — Radio disturbance Characteristics— Limits and methods of measurement CISPR22:2008 (Modified)

http://www.iec.ch/ Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/ Click Search MDDS Database and search for material description datasheet

August 2010

IEC 55024 Information Technology Equipment — Immunity characteristics— Limits and methods of measurement CISPR24:2010

http://www.iec.ch/ Sept 2010

Solid State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standardsdocuments/docs/jesd218/

February 2012

TCG Opal Specification Version 2.0 rev 1.0

http://www.trustedcomputinggroup.com/

August 2013

Serial ATA Revision 3.2

http://www.sata-io.org/ October 2013

ACS-3 Specification

http://www.t13.org/

Intel® Solid State Drive Pro 5400s Series (M.2)

Table 2: Standard References

Product Specification April 2016 6 334045-003US

Capacity

Unformatted Capacity (Total User Addressable Sectors in LBA mode)

120GB

234,441,648

180GB

351,651,888

240GB

468,862,128

360GB

703,282,608

480GB

937,703,088

1000GB

1,953,525,168

Capacity

Random

4KB Read

(up to)1

Random

4KB Write

(up to)1

Sequential

128KB Read1

Sequential

128KB Write1

IOPS

MB/s

120GB

60,000

50,000

560

400

180GB

71,000

85,000

560

475

240GB

74,000

85,000

560

480

360GB

74,000

85,000

560

480

480GB

78,000

85,000

560

480

1000GB

78,000

85,000

560

480

Intel® Solid State Drive Pro 5400s Series (M.2)

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

2.2 Performance

Table 4: Burst Performance

1. Performance measured within the SLC cache buffer using IOMeter * with Queue Depth 32.

April 2016 Product Specification 334045-003US 7

Intel® Solid State Drive Pro 5400s Series (M.2)

Capacity

Specification

Random

4KB Read

(up to)1

Random

4KB Write

(up to)1

Sequential

128KB Read1

Sequential

128KB Write1

IOPS

MB/s

120GB

55,000

13,500

560

180GB

65,000

22,000

560

240GB

70,000

29,000

560

100

360GB

70,000

29,000

560

100

480GB

72,000

36,000

560

125

1000GB

72,000

36,000

560

125

Specification

Intel® SSD Pro 5400s Series Type 2280

50 µs (TYP)

60 µs (TYP)

500 ms (TYP)

< 10 sec

Write1

Power On To Ready2

Max Power On To Ready3

Table 5: Sustained Performance

Note: Performance measured using IOMeter * with Queue Depth 32. Measurements are performed on 8GB of Logical

Block Address (LBA) range on a full SSD.

Table 6: Latency

1. Based on sequential 4KB using IOMeter with Queue Depth 1 workload with compressible (non-random) data

pattern. Write Cache enabled.

2. Power On To Ready time assumes safe shutdown

3. Max Power On To Ready time assumes unsafe shutdown. Based on statistical measurement of 95% quality of

service.

Product Specification April 2016 8 334045-003US

Electrical Characteristics

Intel® SSD Pro 5400s Series Type 2280

120GB

180GB

240GB

360GB

480GB

1000GB

Operating Voltage for 3.3 V (±5%) Min Max Rise Time (Max/Min) Fall Time (Max/Min) Noise Tolerance Min Off Time1

3.14 V

3.47 V

100 ms / 0.1 ms

5 s / 1 ms

70 mV pp (10 Hz – 30 MHz)

1 s

Power Consumption (TYP) Active2 Idle3 DevSleep4

80 mW 40 mW

3 mW

Thermal Power5

2.3

2.5

2.8

3.1

3.4

Regulator Power6

2.6

2.8

3.4

3.6

4.4

4.7

Intel® Solid State Drive Pro 5400s Series (M.2)

2.3 Electrical Characteristics

Table 7: Operating Voltage and Power Consumption

1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to drive.

2. Active power measured during execution of MobileMark* 2012 with SATA Link Power Management (LPM) enabled.

3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.

4. Power consumption during DevSleep state.

5. Power measured during 128kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This

represents power that would be thermal load on system during heavy workloads.

6. Power measured during 128kB sequential writes with Queue Depth 32 workload using 500 us sample period. This

represents power that system power supply would have to regulate for proper device operation.

April 2016 Product Specification 334045-003US 9

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