SSDSCKGW080A401
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Intel® Solid-State Drive 530 Series (M.2)
Intel® Solid-State Drive 530 Series (M.2)
Product Specification
Capacities: 80 GB, 120 GB, 180 GB, 360 GB
Components:
− Intel
®
20 nm NAND Flash Memory
− Multi-Level Cell (MLC)
Form Factors: M.2 80 mm (single- and double-
sided)
− 2280-S2-B-M (80 GB and 180 GB)
− 2280-D2-B-M (120 GB and 360 GB)
Thickness: up to 3.58 mm
Weight: < 10 grams
SATA 6 Gb/s Bandwidth Performance
1
(Iometer* Queue Depth 32)
− Sustained Sequential Read: up to 540 MB/s
− Sustained Sequential Write: up to 490
MB/s
Read and W rite IOPS
1
(Iometer Queue Depth 32)
− Random 4 KB Reads: up to 41,000 IOPS
− Random 4 KB Writes: up to 80,000 IOPS
Data Compression
AES 256-bit Encryption
End-to-End Data Protection
Compatibility
− Intel
®
SSD Toolbox with Intel® SSD
2
Optimizer
− Intel® Data Migration Software
®
− Intel
Rapid Storage Te c hnology
− SATA Revision 3.0
− ACS-2 (ATA/ATAPI Command Set 2)
− SSD Enhanced SMART ATA feature set
Power Management
− 3.3 V SATA Supply Rail
− SATA Link Power Management (LPM)
− Device Sleep (DevSleep)
Power
− Active (BAPCo MobileMark* 2007
Workload): 140 mW
3
− Idle
: 55 mW
− DevSleep: 200 µW
Temperature
− Operating
− Non-Operating: -55
Reliability
— Uncorrectable Bit Error Rate (UBER):
<1 sector per 10
4
: 0o C to 70o C
o
C to 95
16
bits read
— Mean Time Between Failure (MTBF):
1,200,000 hours
— Shock (operating and non-operating):
Vibration
1,000 G/0.5 msec
— Operating: 2.17 G
(5-700 Hz)
RMS
— Non-operating: 3.13 G
Certifications and Declarations:
− UL*
− CE*
− C-Tick*
− BSMI*
− KCC*
− Microsoft* WHCK
− VCCI*
− SATA-IO*
Product Ecological Compliance
− RoHS*
o
C
(5-800 Hz)
RMS
NOTES:
1. Performance values vary by capacity.
2. Random 4 KB writes measured using out-of-box SSD.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attr ib ute BEh. Active airflow is recommended within the
system for maintaining proper device ope r a ting tempe r a tur es on heavier workloads.
September 2013 Product Specification
Order Number: 329213-002US 1
Intel® Solid-State Drive 530 Series (M.2)
Ordering Information
Contact your local Intel sales repres e ntative for ordering information.
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definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
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Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2013 Intel Corporation. All rights reserved.
Product Specification September 2013
2 Order Number: 329213-002US
Intel® Solid-State Drive 530 Series (M.2)
Contents
Revision Histor y .................................................................................................................... 4
1 Introduction ............................................................................................................... 5
1.1 Terminology ................................................................................................................. 6
1.2 Reference Documents .................................................................................................... 7
2 Product Specifications ................................................................................................ 8
2.1 Capacity ...................................................................................................................... 8
2.2 Performance ................................................................................................................. 8
2.3 Electrical Char a cteristics ................................................................................................ 9
2.4 Environmenta l Conditions ............................................................................................. 10
2.4.1 Temperature, Shock, Vibration ........................................................................ 10
2.4.2 Altitude ......................................................................................................... 10
2.5 Product Regulatory Complianc e ..................................................................................... 11
2.6 Reliability ................................................................................................................... 12
3 Mechanical Inf ormation ........................................................................................... 13
4 Pin and Signal Descriptions ...................................................................................... 15
4.1 Pin Locations .............................................................................................................. 15
4.2 Signal Descriptions ...................................................................................................... 16
4.3 Device Sleep Feature ................................................................................................... 17
5 Supported Command Sets ........................................................................................ 18
5.1 ATA General Feature C ommand Set ............................................................................... 18
5.2 Power Management ..................................................................................................... 19
5.3 Security Mode Feature Set ........................................................................................... 19
5.4 SMART Command Set .................................................................................................. 20
5.4.1 SMART Attributes ........................................................................................... 20
5.4.2 SMART Logs .................................................................................................. 23
5.5 Device Statistics ......................................................................................................... 23
5.6 SMART Command Transport ......................................................................................... 24
5.7 Data Set Management Comma nd Set ............................................................................ 24
5.8 Host Protected Area Comm a nd Set ................................................................................ 24
5.9 48-Bit Address Command Set ....................................................................................... 24
5.10 General Purpose Log Comma nd Set ............................................................................... 24
5.11 Native Command Queuing ............................................................................................ 24
5.12 Software Settings Preservation ..................................................................................... 25
5.13 SATA Link Power Management (LPM) ............................................................................. 25
6 Certifications and Declarations ................................................................................ 26
7 Appendix .................................................................................................................. 27
September 2013 Product Specification
Order Number: 329213-002US 3
Revision History
Document
Number
Revision
Number
Intel® Solid-State Drive 530 Series (M.2)
Description Revision Date
329213 001US
329213 002US
Initial release
Added 120GB capacity
July 2013
September 2013
Product Specification September 2013
4 Order Number: 329213-002US
Intel® Solid-State Drive 530 Series (M.2)
1 Introduction
This document describes the specifications and c a p abilities of the In tel® Solid-State Drive 530 Ser ies
(Intel® SSD 530 Series).
The Intel® SSD 530 Series is a case-less, M.2, next generation storage solutio n designed for
Ultrabook™. T he new M.2 form factor allows ultra-compact solutions which d eliver leading
performance for Serial Advanced Technology Attachment (SATA)-based computers in capacities
ranging up to 360 GB.
The latest featur e addition is the DevSleep function a lity, a low power drive s ta te controlled by the host
via the DevSleep pin. The drive w ill con s ume a mere 200 µW while in this state.
As compared to standard SATA HDDs, Intel SSD 530 Series of fers these key features:
• High I/O and throughput performance
• Low power consumption
• Increased system responsiveness
• High reliability
• Enhanced ruggedness
• Small form-factor
• Minimum weight
The Intel SSD 530 Series also offers additional key features such as:
• Advanced Encryption Standard (AES) 256-bit Encryption
AES 256-bit encryption is a n industry standa r d in data security, providing a hardware -based
mechanism for encryption and decryption of user data. Utilizing a 256-bit en cryption key, AES
encryption—when combined with an ATA drive pa s sword—helps protect user data.
• End-to-End Data Protection
End-to-end data protection helps pr otect data from being corrupted acr os s th e da ta pa th by using
cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from
the host interfac e to the NAND, and back .
• Data Compression
Data compression helps improve performance and endurance by automatically compressing
information sen t to the SSD so that less data has to be processed and stored on the NAND. The
amount of data that can be compress ed depends on the type of data.
September 2013 Product Specification
Order Number: 329213-002US 5
1.1 Terminology
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep, a new addition to the SATA specificatio n
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
EXT
Extended
FPDMA
First Party Direct Memory Access
Gigabyte (1,000,000,000 bytes)
management and maintenance purpose s .
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
RDT
Reliability Demonstration Te s t
RMS
Root Mean Squared
SATA
Serial Advanced Technology Attachment
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid-State Drive
TYP
Typical
UBER
Uncorrectable Bit Error Rate
Table 1: Terminology
Term Description
Intel® Solid-State Drive 530 Series (M.2)
GB
PIO Programmed Input/Output
Note: The total usable capacity of the SSD may be less than the total physi c al
capacity because a small portion of the capacity is used for NAND f la s h
Product Specification September 2013
6 Order Number: 329213-002US
(Modified)
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
http://qdms.intel.com/
for material description datashee t
IEC 55024 Information Technology Equip m e nt —
measurement CISPR24:2010
Solid-State Drive (SSD) Requirements and
Endurance Test Method (JESD218)
http://www.jedec.org/standardsdocuments/docs/jesd218/
Intel® Solid-State Drive 530 Series (M.2)
1.2 Reference Documents
Table 2: Standard R e ferences
Date or Rev. # Title Location
IEC 55022 Information Technology Equip m e nt —
Sept 2008
Radio disturbance Characteristics— Limits and
methods of measurement CISPR22:2008
http://www.iec.ch/
June 2009 RoHS
June 2009 Serial ATA Revisio n 3.0 http://www.sata-io.org/
August 2009 ACS-2- Specification http://www.t13.org/
August 2010
Sept 2010
Oct 2010
Immunity characteristics— Limits and methods of
TPR053v11_SATA31_M.2_Card_Format_for_SSDs
Click Search MDDS Database and search
http://www.iec.ch/
http://www.sata-io.org/
September 2013 Product Specification
Order Number: 329213-002US 7
Intel® Solid-State Drive 530 Series (M.2)
80 GB
156,301,488
120 GB
234,441,648
180 GB
351,651,888
360 GB
703,282,608
Random 4 KB Read (up to)1
IOPS
24,000
24,000
41,000
41,000
Random 4 KB Write (up to)2
IOPS
80,000
80,000
80,000
37,000
Random 4 KB Write (TYP) 1
IOPS
33,000
37,500
49,000
29,500
Sequential 128 KB Read
Sequential 128 KB Write
Random 4 KB Read (up to)1
IOPS
20,500
18,000
37,500
37,500
Random 4 KB Write (up to) 1
IOPS
9,200
15,000
17,000
10,000
Sequential 128 KB Rea d
(SATA 6 Gb/s) 1
Sequential 128 KB Write
(SATA 6 Gb/s) 1
2 Product Spe c i f i c a ti o ns
2.1 Capacity
Table 3: User Addre ssable Sectors
Intel® SSD 530 Series Unformatted Capacity (Total User Addressable Sectors in LBA mode)
2.2 Performance
Table 4: Compressible Performance
Specification Unit Intel® SSD 530 Series
80 GB 120 GB 180 GB 360 GB
(SATA 6 Gb/s) 1
(SATA 6 Gb/s) 1
Note:
1. Performance measured using Iometer* with Q ue ue Depth 32. Measurements are performed on 8 GB of
Logical Block Address (LBA) range on a full SSD
2. Random 4 KB writes measured using out-of-box SSD.
MB/s 540 540 540 540
MB/s 480 480 490 490
Table 5: Incompre ssible Performanc e
Specification Unit Intel® SSD 530 Series
80 GB 120 GB 180 GB 360 GB
Note:
Product Specification September 2013
8 Order Number: 329213-002US
MB/s 430 450 470 525
MB/s 100 130 170 240
Read1
80 µs (TYP)
Write1
85 µs (TYP)
Power On To Ready2
1 s (TYP)
Electrical Characteristics
Value
Operating Voltage for 3.3 V (±5%)
Min Off Time1
1 s
Power Consumption (TYP)
DevSleep4
200 µW
Thermal Power5
2.7 W
3.1 W
3.8 W
4.5 W
Regulator Power6
3 W
3.4 W
4.1 W
5.5 W
Intel® Solid-State Drive 530 Series (M.2)
1. Performance measured using Iometer* with Q ue ue Depth 32
Table 6: Latency
Specification Intel® SSD 530 Series
80 GB 120 GB 180 GB 360 GB
Note:
1. Based on sequential 4 KB using Iometer with Queue Depth 1 workload with compr e s s ible (non-random)
data pattern. Write Cache enabled.
2. Power On To Ready time assumes proper shutdown
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
80 GB 120 GB 180 GB 360 GB
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Active2
Idle
Note:
3
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied to
drive.
2. Active power measured during executio n of Mobile Mark * 20 07 with SA TA Link Powe r Manageme nt (LPM)
enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128 KB sequential writes with Queue Dep th 32 work lo ad us ing 100 ms sample
period. This represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128 KB sequential writes with Queue Dep th 32 work lo ad us ing 500 µs sample
period. This represents power that system powe r supp ly would hav e to regulate fo r proper device
operation.
50 mV pp (10 Hz – 30 MHz)
3.14 V
3.47 V
100 ms / 0.1 ms
5 s / 1 ms
140 mW
55 mW
September 2013 Product Specification
Order Number: 329213-002US 9
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